HMC260ALC3B

10 GHz to 26 GHz, GaAs, MMIC, Double Balanced Mixer HMC260ALC3B Data Sheet NIC NIC NIC FUNCTIONAL BLOCK DIAGRAM 12 11 10 HMC260ALC3B GND 1 9 GND LO 2 8 RF GND 3 7 GND 6 PACKAGE BASE 13884-001 5 GND 4 IF Passive; no dc bias required Conversion loss 8 dB typical for 10 GHz to 18 GHz 9 dB typical for 18 GHz to 26 GHz LO to RF isolation: 40 dB Input IP3: 19 dBm typical for 18 GHz to 26 GHz Wide IF bandwidth: dc to 8 GHz RoHS compliant, 12-terminal, 3 mm × 3 mm, ceramic LCC package: 9 mm2 GND FEATURES Figure 1. APPLICATIONS Point to point radios Point to multipoint radios and very small aperture terminals (VSATs) Test equipment and sensors Military end use GENERAL DESCRIPTION The HMC260ALC3B is a general-purpose, double balanced, monolithic microwave integrated circuit (MMIC) mixer housed in a leadless, Pb-free, RoHS compliant LCC package. The device can be used as an upconverter or downconverter in the 10 GHz to 26 GHz frequency range. The HMC260ALC3B mixer requires no external components or matching circuitry. Rev. 0 The HMC260ALC3B provides local oscillator (LO) to radio frequency (RF) and LO to intermediate frequency (IF) suppression due to optimized balun structures. The mixer operates with LO amplitude levels between 9 dBm and 15 dBm. The HMC260ALC3B eliminates the need for wire bonding, allowing the use of surface-mount manufacturing techniques. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC260ALC3B Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1  Upconverter Performance ............................................................8  Applications ....................................................................................... 1  Isolation and Return Loss ............................................................9  Functional Block Diagram .............................................................. 1  IF Bandwidth—Downconverter ............................................... 11  General Description ......................................................................... 1  IF Bandwidth—Upconverter .................................................... 12  Revision History ............................................................................... 2  Spurious and Harmonics Performance ................................... 13  Specifications..................................................................................... 3  Theory of Operation ...................................................................... 14  Absolute Maximum Ratings............................................................ 4  Applications Information .............................................................. 15  Thermal Resistance ...................................................................... 4  Typical Application Circuit ....................................................... 15  ESD Caution .................................................................................. 4  Evaluation PCB Information .................................................... 15  Pin Configuration and Function Descriptions ............................. 5  Outline Dimensions ....................................................................... 16  Interface Schematics..................................................................... 5  Ordering Guide .......................................................................... 16  Typical Performance Characteristics ............................................. 6  Downconverter Performance...................................................... 6  REVISION HISTORY 1/2018—Revision 0: Initial Version Rev. 0 | Page 2 of 16 Data Sheet HMC260ALC3B SPECIFICATIONS Ambient temperature (TA) = 25°C, IF = 1000 MHz, LO = 13 dBm, upper sideband. All measurements performed as a downconverter on the evaluation printed circuit board (PCB), unless otherwise noted. Table 1. Parameter FREQUENCY RANGE RF LO Input IF LO AMPLITUDE 10 GHz TO 18 GHz PERFORMANCE Downconverter Conversion Loss Single Sideband Noise Figure Input Third-Order Intercept Input 1 dB Compression Point Input Second-Order Intercept Upconverter Conversion Loss Input Third-Order Intercept Input 1 dB Compression Point Isolation RF to IF LO to RF LO to IF 18 GHz TO 26 GHz PERFORMANCE Downconverter Conversion Loss Single Sideband Noise Figure Input Third-Order Intercept Input 1 dB Compression Point Input Second-Order Intercept Upconverter Conversion Loss Input Third-Order Intercept Input 1 dB Compression Point Isolation RF to IF LO to RF LO to IF Symbol Min 10 10 dc 9 SSB NF IIP3 IP1dB IIP2 IFIN 13 Max Unit 13 26 26 8 15 GHz GHz GHz dBm 10 dB dB dBm dBm dBm 8 8 18 9.5 43 Test Conditions/Comments IFIN = 1000 MHz IIP3 IP1dB 14 25 SSB NF IIP3 IP1dB IIP2 IFIN Typ 18 7 18 7 dB dBm dBm 21 40 35 dB dB dB 9 10 23 13 46 12 dB dB dBm dBm dBm IFIN = 1000 MHz IIP3 IP1dB 25 30 8 19 8.5 dB dBm dBm 35 40 43 dB dB dB Rev. 0 | Page 3 of 16 HMC260ALC3B Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter RF Input Power LO Input Power IF Input Power IF Source/Sink Current Peak Reflow Temperature Continuous Power Dissipation, PDISS (TA = 85°C, Derate 5 mW/°C Above 85°C) Operating Temperature Range Storage Temperature Range Lead Temperature Range Electrostatic Discharge (ESD) Sensitivity Human Body Model Field Induced Charged Device Model Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Rating 25 dBm 27 dBm 25 dBm 3 mA 260°C 260 mW θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 3. Thermal Resistance −40°C to +85°C −65°C to +150°C −65°C to +150°C Package Type E-12-41 1 500 V 1000 V θJA 120 θJC 200 Unit °C/W See JEDEC standard JESD51-2 for additional information on optimizing the thermal impedance (PCB with 3 × 3 vias). ESD CAUTION Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 16 Data Sheet HMC260ALC3B PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC260ALC3B NIC NIC NIC TOP VIEW (Not to Scale) 12 11 10 9 GND GND 1 LO 2 8 RF GND 3 6 PACKAGE BASE NOTES 1. NIC = NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF/DC GROUND. PERFORMANCE IS NOT AFFECTED. 2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND. 13884-002 5 GND GND 4 IF 7 GND Figure 2. Table 4. Pin Function Descriptions Pin No. 1, 3, 4, 6, 7, 9 2 5 Mnemonic GND LO IF 8 10 to 12 RF NIC EPAD Description Ground. These pins and package bottoms connect to RF/dc ground. Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. Intermediate Frequency Port. This pin is dc-coupled. For applications, not requiring operation to dc, dc block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible die failure may result. See Figure 5 for the interface schematic. Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. Not Internally Connected. These pins can be connected to RF/dc ground. Device performance is not affected. Exposed Pad. The exposed pad must be connected to RF/dc ground. INTERFACE SCHEMATICS 13884-005 IF 13884-003 GND Figure 5. IF Interface Schematic Figure 3. GND Interface Schematic RF 13884-004 13884-006 LO Figure 6. RF Interface Schematic Figure 4. LO Interface Schematic Rev. 0 | Page 5 of 16 HMC260ALC3B Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS DOWNCONVERTER PERFORMANCE Downconverter performance at IF = 1000 MHz, upper sideband (low-side LO). 0 0 –5 CONVERSION GAIN (dB) –10 –15 –5 = 9dBm = 11dBm = 13dBm = 15dBm –10 –15 26.5 13884-010 25.5 24.5 23.5 RF FREQUENCY (GHz) Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 30 25 15 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 9.5 RF FREQUENCY (GHz) Figure 8. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 13884-011 RF FREQUENCY (GHz) 13884-008 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 0 11.5 0 9.5 5 10.5 5 17.5 10 16.5 10 20 15.5 15 = 9dBm = 11dBm = 13dBm = 15dBm 14.5 INPUT IP3 (dBm) 20 11.5 25 LO LO LO LO 13.5 TA = +85°C TA = +25°C TA = –40°C 12.5 30 Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C 15 26.5 25.5 24.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 9.5 RF FREQUENCY (GHz) 13884-012 RF FREQUENCY (GHz) 13884-009 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 0 11.5 0 9.5 5 10.5 5 Figure 9. Noise Figure vs. RF Frequency at Various Temperatures, LO = 13 dBm = 9dBm = 11dBm = 13dBm = 15dBm 10 11.5 10 10.5 NOISE FIGURE (dB) 15 LO LO LO LO 23.5 20 TA = +85°C TA = +25°C TA = –40°C 22.5 20 NOISE FIGURE (dB) 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 13884-007 25.5 26.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 10.5 RF FREQUENCY (GHz) Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm 10.5 –20 –20 INPUT IP3 (dBm) LO LO LO LO 10.5 CONVERSION GAIN (dB) TA = +85°C TA = +25°C TA = –40°C Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. 0 | Page 6 of 16 Data Sheet HMC260ALC3B Downconverter P1dB and IP2 IF = 1000 MHz, upper sideband (low-side LO). 20 LO LO LO LO TA = +85°C TA = +25°C TA = –40°C 15 50 50 40 40 20 TA = +85°C TA = +25°C TA = –40°C 26.5 13884-015 25.5 24.5 23.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 22.5 = 9dBm = 11dBm = 13dBm = 15dBm 26.5 25.5 24.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 10.5 RF FREQUENCY (GHz) Figure 16. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25°C Figure 14. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm Rev. 0 | Page 7 of 16 13884-016 RF FREQUENCY (GHz) LO LO LO LO 0 13884-014 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 20 10 0 11.5 30 23.5 30 22.5 INPUT IP2 (dBm) 60 9.5 14.5 Figure 15. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C 60 10.5 INPUT IP2 (dBm) 13.5 RF FREQUENCY (GHz) Figure 13. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 10 11.5 9.5 26.5 13884-013 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 0 12.5 0 11.5 5 9.5 5 RF FREQUENCY (GHz) = 9dBm = 11dBm = 13dBm = 15dBm 10 10.5 INPUT P1dB (dBm) 10 10.5 INPUT P1dB (dBm) 15 12.5 20 HMC260ALC3B Data Sheet UPCONVERTER PERFORMANCE Upconverter performance at input intermediate frequency (IFIN) = 1000 MHz, upper sideband (low-side LO). CONVERSION GAIN (dB) –10 –15 –15 30 25 25 20 20 10 5 26.5 13884-020 25.5 24.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 26.5 30 15 10.5 RFOUT FREQUENCY (GHz) Figure 20. Conversion Gain vs. RFOUT Frequency at Various LO Power Levels, TA = 25°C INPUT IP3 (dBm) 15 10 LO LO LO LO 5 TA = +85°C TA = +25°C TA = –40°C = 9dBm = 11dBm = 13dBm = 15dBm 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 RFOUT FREQUENCY (GHz) Figure 18. Input IP3 vs. RFOUT Frequency at Various Temperatures, LO = 13 dBm 13884-021 RFOUT FREQUENCY (GHz) 13884-018 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 0 10.5 0 Figure 21. Input IP3 vs. RFOUT Frequency at Various LO Power Levels, TA = 25°C 20 20 LO LO LO LO TA = +85°C TA = +25°C TA = –40°C = 9dBm = 11dBm = 13dBm = 15dBm 15 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 9.5 RFOUT FREQUENCY (GHz) 13884-022 RFOUT FREQUENCY (GHz) Figure 19. Input P1dB vs. RFOUT Frequency at Various Temperatures, LO = 13 dBm 13884-019 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 0 11.5 0 9.5 5 10.5 5 13.5 10 12.5 10 10.5 INPUT P1dB (dBm) 15 11.5 INPUT IP3 (dBm) –10 13884-017 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 RFOUT FREQUENCY (GHz) Figure 17. Conversion Gain vs. RF Output (RFOUT) Frequency at Various Temperatures, LO = 13 dBm INPUT P1dB (dBm) = 9dBm = 11dBm = 13dBm = 15dBm –20 10.5 –20 –5 10.5 CONVERSION GAIN (dB) –5 LO LO LO LO 23.5 0 TA = +85°C TA = +25°C TA = –40°C 22.5 0 Figure 22. Input P1dB vs. RFOUT Frequency at Various LO Power Levels, TA = 25°C Rev. 0 | Page 8 of 16 Data Sheet HMC260ALC3B ISOLATION AND RETURN LOSS Downconverter performance at IF = 1000 MHz, upper sideband. 60 60 50 LO TO RF ISOLATION (dB) 40 30 20 TA = +85°C TA = +25°C TA = –40°C 10 20 26.5 RF FREQUENCY (GHz) 13884-026 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 10.5 26.5 RF FREQUENCY (GHz) 13884-023 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 11.5 9.5 10.5 0 Figure 23. LO to RF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm Figure 26. LO to RF Isolation vs. RF Frequency at Various LO Power levels, TA = 25°C 60 50 Figure 24. LO to IF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 9.5 RF FREQUENCY (GHz) 13884-027 RF FREQUENCY (GHz) 13884-024 26.5 25.5 24.5 23.5 22.5 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 0 11.5 0 9.5 10 10.5 10 16.5 20 15.5 20 30 14.5 30 = 9dBm = 11dBm = 13dBm = 15dBm 40 11.5 40 10.5 LO TO IF ISOLATION (dB) 50 LO LO LO LO 13.5 TA = +85°C TA = +25°C TA = –40°C 12.5 60 Figure 27. LO to IF Isolation vs. RF Frequency at Various LO Power Levels, TA = 25°C 50 40 Figure 25. RF to IF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 26.5 25.5 24.5 23.5 22.5 13884-028 RF FREQUENCY (GHz) 21.5 20.5 19.5 18.5 9.5 26.5 25.5 24.5 23.5 22.5 13884-025 RF FREQUENCY (GHz) 21.5 20.5 19.5 18.5 17.5 16.5 15.5 14.5 13.5 12.5 0 11.5 0 9.5 10 10.5 10 17.5 20 16.5 20 30 15.5 30 = 9dBm = 11dBm = 13dBm = 15dBm 14.5 RF TO IF ISOLATION (dB) 40 LO LO LO LO 13.5 TA = +85°C TA = +25°C TA = –40°C 12.5 50 11.5 LO TO IF ISOLATION (dB) 30 10 0 RF TO IF ISOLATION (dB) = 9dBm = 11dBm = 13dBm = 15dBm 40 10.5 LO TO RF ISOLATION (dB) 50 LO LO LO LO Figure 28. RF to IF Isolation vs. RF Frequency at Various LO Power Levels, LO = 17 GHz, TA = 25°C Rev. 0 | Page 9 of 16 HMC260ALC3B Data Sheet 0 0 –5 IF RETURN LOSS (dB) LO RETURN LOSS (dB) LO = 9dBm LO = 11dBm LO = 13dBm LO = 15dBm –10 –20 –10 LO FREQUENCY (GHz) –20 0.1 13884-029 –30 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Figure 29. LO Return Loss vs. LO Frequency, TA = 25°C, LO = 13 dBm RF RETURN LOSS (dB) –10 –20 –30 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 10 11 13884-030 –40 RF FREQUENCY (GHz) 3.1 4.1 5.1 6.1 7.1 8.1 9.1 10.1 Figure 31. IF Return Loss vs. IF Frequency at Various LO Powers, LO = 17 GHz, TA = 25°C = 9dBm = 11dBm = 13dBm = 15dBm –50 2.1 IF FREQUENCY (GHz) 0 LO LO LO LO 1.1 13884-031 –15 Figure 30. RF Return Loss vs. RF Frequency at Various LO Powers, TA = 25°C Rev. 0 | Page 10 of 16 Data Sheet HMC260ALC3B IF BANDWIDTH—DOWNCONVERTER Upper sideband, RF = 20 GHz. 0 LO LO LO LO CONVERSION GAIN (dB) –5 –10 –15 1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 IF FREQUENCY (GHz) Figure 32. Conversion Gain vs. IF Frequency at Various Temperatures, LO = 13 dBm –10 –15 1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 IF FREQUENCY (GHz) Figure 34. Conversion Gain vs. IF Frequency at Various LO Power Levels, TA = 25°C 40 TA = +85°C TA = +25°C TA = –40°C 35 LO LO LO LO 35 = 9dBm = 11dBm = 13dBm = 15dBm 30 INPUT IP3 (dBm) 30 25 20 15 25 20 15 10 10 5 5 1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 IF FREQUENCY (GHz) 13884-033 INPUT IP3 (dBm) –5 –20 0.1 40 0 0.1 = 9dBm = 11dBm = 13dBm = 15dBm Figure 33. Input IP3 vs. IF Frequency at Various Temperatures, LO = 13 dBm 0 0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 IF FREQUENCY (GHz) Figure 35. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25°C Rev. 0 | Page 11 of 16 13884-035 –20 0.1 13884-032 CONVERSION GAIN (dB) TA = +85°C TA = +25°C TA = –40°C 13884-034 0 HMC260ALC3B Data Sheet IF BANDWIDTH—UPCONVERTER Upper sideband, RFOUT = 20 GHz. 0 LO LO LO LO CONVERSION GAIN (dB) –5 –10 –15 1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 IFIN FREQUENCY (GHz) Figure 36. Conversion Gain vs. IFIN Frequency at Various Temperatures, LO = 13 dBm –10 –15 2.1 3.1 4.1 5.1 6.1 7.1 8.1 Figure 38. Conversion Gain vs. IFIN Frequency at Various LO Power Levels, TA = 25°C 40 TA = +85°C TA = +25°C TA = –40°C LO LO LO LO 35 = 9dBm = 11dBm = 13dBm = 15dBm 30 INPUT IP3 (dBm) 25 20 15 25 20 15 10 5 5 1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 IFIN FREQUENCY (GHz) 13884-037 10 0 0.1 1.1 IFIN FREQUENCY (GHz) 30 INPUT IP3 (dBm) –5 –20 0.1 40 35 = 9dBm = 11dBm = 13dBm = 15dBm Figure 37. Input IP3 vs. IFIN Frequency at Various Temperatures, LO = 13 dBm 0 0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1 8.1 IFIN FREQUENCY (GHz) Figure 39. Input IP3 vs. IFIN Frequency at Various LO Power Levels, TA = 25°C Rev. 0 | Page 12 of 16 13884-039 –20 0.1 13884-036 CONVERSION GAIN (dB) TA = +85°C TA = +25°C TA = –40°C 13884-038 0 Data Sheet HMC260ALC3B SPURIOUS AND HARMONICS PERFORMANCE Upconverter M × N Spurious Outputs Mixer spurious products are measured in dBc from either the RF pin or IF pin output power level. N/A means not applicable. Spur values are (M × IFIN) + (N × LO). IFIN = 1000 MHz at −10 dBm, LO = 17 GHz at 13 dBm. Downconverter M × N Spurious Outputs Spur values are (M × RF) − (N × LO). RF = 18 GHz at −10 dBm, LO = 17 GHz at 13 dBm. M × RF 0 1 2 3 4 0 N/A 23 67 N/A N/A 1 7 0 71 63 N/A N × LO 2 19 34 66 72 64 3 N/A 42 71 84 74 4 N/A N/A 68 73 77 M × IFIN Rev. 0 | Page 13 of 16 −5 −4 −3 −2 −1 0 1 2 3 4 5 0 81 83 73 55 18 0 18 55 74 81 80 1 77 78 64 42 0 9.5 0 45 66 74 74 N × LO 2 73 71 72 66 28 17 40 67 64 66 68 3 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 4 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A HMC260ALC3B Data Sheet THEORY OF OPERATION The HMC260ALC3B is a general-purpose, double balanced mixer that can be used as an upconverter or a downconverter from 10 GHz to 26 GHz. When used a downconverter, the HMC260ALC3B downconverts RF between 10 GHz and 26 GHz to IF between dc and 8 GHz. The mixer performs well with LO drives of 9 dBm or greater, and it provides LO to RF and LO to IF suppression due to optimized balun structures. The ceramic LCC package eliminates the need for wire bonding and is compatible with high volume, surface-mount manufacturing techniques. When used as an upconverter, the mixer upconverts IF between dc and 8 GHz to RF between 10 GHz and 26 GHz. Rev. 0 | Page 14 of 16 Data Sheet HMC260ALC3B APPLICATIONS INFORMATION Use RF circuit design techniques for the circuit board. Ensure that signal lines have 50 Ω impedance. Connect the package ground leads and the exposed pad directly to the ground plane (see Figure 41). Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 41 is available from Analog Devices, Inc., upon request. NIC Figure 40 shows the typical application circuit for the HMC260ALC3B. The HMC260ALC3B is a passive device and does not require any external components. The LO ad RF pins are internally ac-coupled. The IF pin is internally dc-coupled. When IF operation to dc is not required, use of an external series capacitor of a value chosen to pass the necessary IF frequency range is recommended. When IF operation to dc is required, do not exceed the IF source and sink current rating specified in the Absolute Maximum Ratings section. NIC EVALUATION PCB INFORMATION NIC TYPICAL APPLICATION CIRCUIT 12 11 10 Table 5. Bill of Materials Item J1, J2 J3 U1 PCB1 HMC260ALC3B GND 1 9 2 8 GND 3 7 RF RF GND 1 117611 is the raw bare PCB identifier. Reference 109728 when ordering the complete evaluation PCB. 6 13884-041 5 GND GND 4 IF LO GND IF Figure 40. Typical Application Circuit LO RF 117611–1 J1 260A J2 IF U1 J3 Figure 41. Evaluation PCB Top Layer Rev. 0 | Page 15 of 16 13884-040 LO Description PCB mount SRI 2.92 mm connectors PCB mount Johnson SMA connector HMC260ALC3B 117611 evaluation board on Rogers 4350 HMC260ALC3B Data Sheet OUTLINE DIMENSIONS 0.36 0.30 0.24 0.08 BSC 10 0.50 BSC PIN 1 12 1 9 EXPOSED PAD 3 7 6 TOP VIEW 0.90 0.80 0.70 0.32 BSC 1.60 1.50 SQ 1.40 4 BOTTOM VIEW 1.00 REF 2.10 BSC SIDE VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. PKG-004837 SEATING PLANE 03-02-2017-A PIN 1 INDICATOR 3.05 2.90 SQ 2.75 Figure 42. 12-Terminal Ceramic Leadless Chip Carrier (LCC) (E-12-4) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC260ALC3B HMC260ALC3BTR HMC260ALC3BTR-R5 EV1HMC260ALC3B 1 2 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C MSL Rating2 MSL3 MSL3 MSL3 All models are RoHS compliant devices. The peak reflow temperature is 260°C. See Table 2 in the Absolute Maximum Ratings section. ©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13884-0-1/18(0) Rev. 0 | Page 16 of 16 Package Description 12-Terminal LCC 12-Terminal LCC 12-Terminal LCC Evaluation PCB Package Option E-12-4 E-12-4 E-12-4