HMC364S8GE

Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK OBSOLETE PRODUCT HMC364S8G / 364S8GE v04.1109 FREQUENCY DIVIDERS & DETECTORS - SMT SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz Typical Applications Features Prescaler for DC to X Band PLL Applications: Ultra Low SSB Phase Noise: -145 dBc/Hz • Satellite Communication Systems Wide Bandwidth • Fiber Optic Output Power: 4 dBm • Point-to-Point and Point-to-Multi-Point Radios Single DC Supply: +5V • VSAT S8G SMT Package Functional Diagram General Description The HMC364S8G & HMC364S8GE are low noise Divide-by-2 Static Dividers with InGaP GaAs HBT technology in 8 lead surface mount plastic packages. This device operates from DC (with a square wave input) to 12.5 GHz input frequency with a single +5V DC supply. The low additive SSB phase noise of -145 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance. Electrical Specifications, TA = +25° C, 50 Ohm System, Vcc= 5V Parameter Conditions Min. Typ. 12.5 13.5 0.2 0.5 GHz Fin = 1 to 10 GHz -15 >-20 +10 dBm Fin = 10 to 12 GHz -10 >-15 +5 dBm Fin = 12 to 12.5 GHz -4 >-8 +2 dBm Fin = 6 GHz 2 5 Fin = 9 GHz -2 dBm Fin = 11 GHz -5 dBm Fin = 12.5 GHz -8 Maximum Input Frequency Minimum Input Frequency Input Power Range Output Power Reverse Leakage SSB Phase Noise (100 kHz offset) Output Transition Time Sine Wave Input. [1] Max. Units GHz dBm dBm Both RF Outputs Terminated 40 dB Pin = 0 dBm, Fin = 6 GHz -145 dBc/Hz Pin = 0 dBm, Fout = 882 MHz 100 ps 105 mA Supply Current (Icc) 1. Divider will operate down to DC for square-wave input signal. 1 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com OBSOLETE PRODUCT HMC364S8G / 364S8GE v04.1109 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz 20 10 10 Recommended Operating Window 0 -10 -20 -30 0 Min Pin +25 C Max Pin +25 C Min Pin +85 C Max Pin +85 C Min Pin -40 C Max Pin -40 C -10 -20 -30 0 3 6 9 12 15 0 3 6 INPUT FREQUENCY (GHz) 9 12 15 INPUT FREQUENCY (GHz) SSB Phase Noise Performance, Pin= 0 dBm, T= 25 °C Output Power vs. Temperature 10 0 SSB PHASE NOISE (dBc/Hz) OUTPUT POWER (dBm) -20 7 4 +25 C +85 C -40 C 1 -2 -5 0 3 6 9 12 -40 -60 -80 -100 -120 -140 -160 2 10 15 3 10 INPUT FREQUENCY (GHz) Output Harmonic Content, Pin= 0 dBm, T= 25 °C 5 10 6 10 7 10 Reverse Leakage, Pin= 0 dBm, T= 25 °C 0 0 Pfeedthru 3rd Harmonic -10 POWER LEVEL (dBm) -10 OUTPUT LEVEL (dBm) 4 10 OFFSET FREQUENCY (Hz) -20 -30 -40 -50 FREQUENCY DIVIDERS & DETECTORS - SMT Input Sensitivity Window vs. Temperature 20 INPUT POWER (dBm) INPUT POWER (dBm) Input Sensitivity Window, T= 25 °C Both Output Ports Terminated One Output Port Terminated -20 -30 -40 -50 0 3 6 9 INPUT FREQUENCY (GHz) 12 15 0 3 6 9 12 15 INPUT FREQUENCY (GHz) For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 2 OBSOLETE PRODUCT HMC364S8G / 364S8GE v04.1109 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz AMPLITUDE (mV) FREQUENCY DIVIDERS & DETECTORS - SMT Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings 700 RF Input (Vcc = +5V) -13 dBm 500 Vcc +5.5V VLogic Vcc -1.6V to Vcc -1.2V Thermal Resistance (RTH) (junction to ground paddle) 69.3 °C/W Storage Temperature -65 to -150 °C Operating Temperature -40 to +85 °C 300 100 -100 -300 Typical Supply Current vs. Vcc -500 -700 22.7 23.1 23.5 23.9 24.3 24.7 TIME (nS) Vcc (V) Icc (mA) 4.75 93 5.00 105 5.25 115 Note: Divider will operate over full voltage range shown above ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Package Body Material Lead Finish MSL Rating HMC364S8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] HMC364S8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] Package Marking [3] HMC364 XXXX HMC364 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX 3 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com OBSOLETE PRODUCT HMC364S8G / 364S8GE v04.1109 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz Pin Description Function Description 1 OUT Divided output 180° out of phase with pin 3. 2, 6 N/C No Connection 3 OUT Divided Output. 4 VCC Supply voltage 5V ± 0.25V. 5 IN RF Input must be DC blocked. 7 IN RF Input 180° out of phase with pin 5 for differential operation. A/C ground for single ended operation 8 GND Exposed paddle must be connected to RF/DC ground. Interface Schematic For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com FREQUENCY DIVIDERS & DETECTORS - SMT Pin Number 4 OBSOLETE PRODUCT HMC364S8G / 364S8GE v04.1109 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz FREQUENCY DIVIDERS & DETECTORS - SMT Evaluation PCB List of Materials for Evaluation PCB 104631 Item Description J1 - J3 PCB Mount SMA RF Connector C1 - C4 100 pF Capacitor, 0402 Pkg. C5 1000 pF Capacitor, 0603 Pkg. C6 10 µF Tantalum Capacitor U1 HMC364S8G / HMC364S8GE Divide-by-2 PCB [2] 104627 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 5 [1] The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads and backside ground slug should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. This evaluation board is designed for single ended input testing. J2 and J3 provide differential output signals. For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com OBSOLETE PRODUCT HMC364S8G / 364S8GE v04.1109 SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 12.5 GHz FREQUENCY DIVIDERS & DETECTORS - SMT Application Circuit For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or apps@hittite.com 6