HMC463LH250TR

HMC463LH250 v06.1217 AMPLIFIERS - LOW NOISE - SMT GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz Typical Applications Features The HMC463LH250 is ideal for: 50 Ohm Matched Input/Output • Telecom Infrastructure Hermetic SMT Package • Microwave Radio & VSAT Gain: 14 dB • Military EW, ECM & C I Noise Figure: 2.5 dB @ Mid-Band • Test Instrumentation P1dB Output Power: +18 dBm @ Mid-Band • Fiber Optics Supply Voltage: +5V @ 60mA 3 Screening to MIL-PRF-38535 (Class B or S) Available Functional Diagram General Description The HMC463LH250 is a GaAs MMIC pHEMT Low Noise AGC Distributed Amplifier packaged in a hermetic surface mount package which operates between 2 and 20 GHz. The amplifier provides 13 dB of gain, 3 dB noise figure and 18 dBm of output power at 1 dB gain compression while requiring only 60 mA from a +5V supply. An optional gate bias (Vgg2) is provided to allow Adjustable Gain Control (AGC) of 8 dB typical. Gain flatness is excellent at ±0.5 dB from 2 - 14 GHz making the HMC463LH250 ideal for EW, ECM RADAR, test equipment and High-Reliability applications. The HMC463LH250 LNA I/Os are internally matched to 50 Ohms and are internally DC blocked. Electrical Specifications, TA = +25° C, Vdd= 5V, Vgg2= Open, Idd= 60 mA* Parameter Min. Frequency Range Gain Typ. Max. Min. 2.0 - 6.0 11.5 ±0.25 Gain Variation Over Temperature 0.010 Max. Min. 6.0 - 16.0 14.5 Gain Flatness Typ. 9 12 8 ±0.5 0.010 16.0 - 20.0 GHz 11 dB ±0.9 dB 0.010 15 15 9 dB Output Return Loss 11 15 7 dB 13 dBm 19 dBm Output Third Order Intercept (IP3) 29 27 24 dBm Supply Current (Idd) (Vdd= 5V, Vgg1= -0.9V Typ.) 60 60 10 dB 20.5 80 18 5.5 21.5 Saturated Output Power (Psat) 13 4 dB/ °C Input Return Loss 19 4.5 Units 3.5 16 2.5 Max. Noise Figure Output Power for 1 dB Compression (P1dB) 5.5 Typ. 80 60 80 mA * Adjust Vgg1 between -2 to -0V to achieve Idd= 60 mA typical. 1 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D HMC463LH250 v06.1217 GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz 20 15 18 10 16 5 14 S21 S11 S22 0 -5 -10 12 10 8 -15 6 -20 4 -25 2 +25C +85C -40C 0 -30 0 2 4 6 8 10 12 14 16 18 20 0 22 2 4 6 Input Return Loss vs. Temperature 10 12 14 16 18 20 22 Output Return Loss vs. Temperature 0 0 -5 -10 +25C +85C -40C -5 +25C +85C -40C RETURN LOSS (dB) RETURN LOSS (dB) 8 FREQUENCY (GHz) FREQUENCY (GHz) -15 -20 -10 -15 AMPLIFIERS - LOW NOISE - SMT Gain vs. Temperature 20 GAIN (dB) RESPONSE (dB) Gain & Return Loss -20 -25 -30 -25 0 2 4 6 8 10 12 14 16 18 20 22 0 2 4 6 FREQUENCY (GHz) 8 10 12 14 16 18 20 22 18 20 22 FREQUENCY (GHz) Reverse Isolation vs. Temperature Noise Figure vs. Temperature 0 10 8 NOISE FIGURE (dB) REVERSE ISOLATION (dB) 9 -10 +25C +85C -40C -20 -30 -40 +25C +85C -40C 7 6 5 4 3 2 -50 1 0 -60 0 2 4 6 8 10 12 14 FREQUENCY (GHz) 16 18 20 22 0 2 4 6 8 10 12 14 16 FREQUENCY (GHz) For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D 2 HMC463LH250 v06.1217 GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz 26 22 22 Psat (dBm) P1dB (dBm) Psat vs. Temperature 26 18 14 +25C +85C -40C 10 18 +25C +85C -40C 14 10 6 6 2 4 6 8 10 12 14 16 18 20 22 2 4 6 FREQUENCY (GHz) GAIN (dB), P1dB (dBm), Psat (dBm) 30 28 IP3 (dBm) 26 24 22 +25C +85C -40C 16 14 16 18 20 22 24 4.5 22 4 20 3.5 18 3 16 2.5 14 2 12 1.5 10 1 GAIN P1dB Psat 8 4 6 8 10 12 14 16 18 20 22 0.5 NF 0 4.5 5 FREQUENCY (GHz) 5.5 Vdd (V) Gain, P1dB & Output IP3 vs. Control Voltage @ 10 GHz Noise Figure & Supply Current vs. Control Voltage @ 10 GHz 32 80 6 70 5 60 4 50 3 40 2 28 24 Idd (mA) 20 16 12 8 GAIN P1dB IP3 4 1 30 0 -4 -1.2 Idd Noise Figure 0 20 -1 -0.8 -0.6 -0.4 -0.2 0 Vgg2 (V) 0.2 0.4 0.6 0.8 1 -1.4 -1.2 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 Vgg2 (V) For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D NOISE FIGURE (dB) GAIN (dB), P1dB (dBm), IP3 (dBm) 14 6 2 3 12 Gain, Power & Noise Figure vs. Supply Voltage @ 10 GHz, Fixed Vgg1 32 18 10 FREQUENCY (GHz) Output IP3 vs. Temperature 20 8 NOISE FIGURE (dB) AMPLIFIERS - LOW NOISE - SMT P1dB vs. Temperature HMC463LH250 v06.1217 GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz GAIN (dB) 18 Drain Bias Voltage (Vdd) +9 V 14 Gate Bias Voltage (Vgg1) -2 to 0 Vdc 10 Gate Bias Current (Igg1) 2.5 mA Gate Bias Voltage (Vgg2)(AGC) (Vdd -9) Vdc to +2 Vdc RF Input Power (RFIN)(Vdd = +5 V) +18 dBm Channel Temperature 175 °C Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C ESD Sensitivity (HBM) Class 0B - Passed 150V 6 2 -2 -6 Vgg2=-1.3 V Vgg2=-1.2 V Vgg2=-1.1 V Vgg2=-1.0 V Vgg2=-0.9 V -10 Vgg2=-0.8 V Vgg2=-0.6 V Vgg2=-0.4 V Vgg2=-0.2 V Vgg2=0 V -14 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) Typical Supply Current vs. Vdd ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Vdd (V) Idd (mA) +4.5 58 +5.0 60 12-Terminal Ceramic Leadless Chip Carrier [LCC] +5.5 (E-12-2) Dimensions shown in millimeters. Outline Drawing 6.48 6.35 SQ 6.22 PIN 1 INDICATOR 2.54 BSC 1.90 BSC 10 1.27 BSC 62 PIN 1 INDICATOR 12 1 9 AMPLIFIERS - LOW NOISE - SMT Absolute Maximum Ratings Gain @ Several Control Voltages 0.41 BSC EXPOSED PAD 3 7 6 R 0.15 PKG-000000 1.27 MAX SIDE VIEW SEATING PLANE 1.27 BSC 4 0.97 BSC BOTTOM VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 12-19-2016-A TOP VIEW 12-Terminal Ceramic Leadless Chip Carrier [LCC] (E-12-2) Dimensions shown in millimeters. Package Information Part Number Package Body Material Lead Finish HMC463LH250 Ceramic & Kovar Au MSL Rating MSL1 [1] Package Marking [2] H463 XXXX [1] Max peak reflow temperature of 250 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D 4 HMC463LH250 v06.1217 GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz AMPLIFIERS - LOW NOISE - SMT Pin Descriptions 5 Pin Number Function Description 1, 2, 4, 5, 7, 8, 10 GND Ground paddle must be connected to RF/DC ground. 3 RFIN This pad is AC coupled and matched to 50 Ohms. 6 Vgg1 Gate control for amplifier. Adjust to achieve Idd= 60 mA. 9 RFOUT This pad is AC coupled and matched to 50 Ohms. 11 Vdd Power supply voltage for the amplifier. External bypass capacitors are required 12 Vgg2 Optional gate control if AGC is required. Leave Vgg2 open circuited if AGC is not required. Interface Schematic For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D HMC463LH250 v06.1217 GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz AMPLIFIERS - LOW NOISE - SMT Evaluation PCB List of Materials for Evaluation PCB 111709 Item Description J1 - J2 SRI K Connector J3 - J4 2 mm Molex Header C1 - C3 100 pF Capacitor, 0402 Pkg. C4 - C6 1000 pF Capacitor, 0603 Pkg. C7 - C9 4.7 µF Capacitor, Tantalum U1 HMC463LH250 PCB [2] 111707 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 [1] The circuit board used in the application should use RF circuit design techniques. Signal lines should have 50 Ohm impedance while the package ground leads and package bottom should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation board should be mounted to an appropriate heat sink. The evaluation circuit board shown is available from Analog Devices upon request. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D 6