HMC553ALC3BTR

6 GHz to 14 GHz, GaAs, MMIC, Double-Balanced Mixer HMC553ALC3B Data Sheet FUNCTIONAL BLOCK DIAGRAM NIC HMC553ALC3B NIC Passive: no dc bias required Conversion loss: 7 dB typical at 6 GHz to 11 GHz Input IP3: 18 dBm typical at 6 GHz to 11 GHz LO to RF isolation: 36 dB typical Wide IF bandwidth: dc to 5 GHz RoHS compliant, 12-terminal, 2.90 mm × 2.90 mm LCC package NIC FEATURES 12 11 10 GND 1 9 GND LO 2 8 RF GND 3 7 GND 6 PACKAGE BASE GND 16420-001 5 GND 4 GND Microwave and very small aperture terminal (VSAT) radios Test equipment Point to point radios Military electronic warfare (EW); electronic countermeasure (ECM); and command, control, communications and intelligence (C3I) IF APPLICATIONS Figure 1. GENERAL DESCRIPTION The HMC553ALC3B is a general-purpose, double-balanced, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC) mixer housed in a leadless Pb-free, RoHS compliant LCC package. The HMC553ALC3B can be used as an upconverter or downconverter between 6 GHz and 14 GHz. This mixer requires no external components or matching circuitry. Rev. B The HMC553ALC3B provides local oscillator (LO) to radio frequency (RF) and LO to intermediate frequency (IF) suppression due to optimized balun structures. The mixer operates with LO drive levels from 9 dBm to 15 dBm. The HMC553ALC3B eliminates the need for wire bonding, allowing use of surfacemount manufacturing techniques. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018–2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC553ALC3B Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Upconverter Performance ......................................................... 14 Applications ....................................................................................... 1 Isolation and Return Loss ......................................................... 18 Functional Block Diagram .............................................................. 1 IF Bandwidth—Downconverter, Upper Sideband................. 20 General Description ......................................................................... 1 IF Bandwidth—Downconverter, Lower Sideband ................. 21 Revision History ............................................................................... 2 Spurious and Harmonics Performance ................................... 22 Specifications..................................................................................... 3 Theory of Operation ...................................................................... 23 Absolute Maximum Ratings............................................................ 4 Applications Information .............................................................. 24 Thermal Resistance ...................................................................... 4 Typical Application Circuit ....................................................... 24 ESD Caution .................................................................................. 4 Evaluation PCB Information .................................................... 24 Pin Configuration and Function Descriptions ............................. 5 Outline Dimensions ....................................................................... 25 Interface Schematics..................................................................... 5 Ordering Guide .......................................................................... 25 Typical Performance Characteristics ............................................. 6 Downconverter Performance...................................................... 6 REVISION HISTORY 3/2019—Rev.A to Rev. B Change to Table 5 ........................................................................... 22 Changes to Downconversion, Upper Sideband Section, Downconversion, Lower Sideband Section, Upconversion, Upper Sideband Section, and Upconversion, Lower Sideband Section ... 22 2/2018—Revision 0: Initial Version 6/2018—Rev.0 to Rev. A Added 6 GHz to 11 GHz Downconverter Performance, Noise Figure Parameter and 11 GHz to 14 GHz Downconverter Performance, Noise Figure Parameter, Table 1 ............................. 3 Rev. B | Page 2 of 25 Data Sheet HMC553ALC3B SPECIFICATIONS TA = 25°C, IF = 100 MHz, RF = −10 dBm, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless otherwise noted, on the evaluation printed circuit board (PCB). Table 1. Parameter FREQUENCY RANGE RF LO Input IF LO DRIVE LEVELS 6 GHz to 11 GHz PERFORMANCE Downconverter Conversion Loss Noise Figure Input Third-Order Intercept Input 1 dB Compression Point Input Second-Order Intercept Upconverter Conversion Loss Input Third-Order Intercept Input 1 dB Compression Point Isolation RF to IF LO to RF LO to IF 11 GHz to 14 GHz PERFORMANCE Downconverter Conversion Loss Noise Figure Input Third-Order Intercept Input 1 dB Compression Point Input Second-Order Intercept Upconverter Conversion Loss Input Third-Order Intercept Input 1 dB Compression Point Isolation RF to IF LO to RF LO to IF Symbol Test Conditions/Comments Min 6 6 DC 9 IP3 P1dB IP2 IFIN 15 Unit 13 14 14 5 15 GHz GHz GHz dBm 9 dB dB dBm dBm dBm 7 8.5 18 9.5 40 dB dBm dBm 18 30 28 32 36 32 dB dB dB 18 9 10 22 11.5 45 IP3 P1dB 25 30 28 Rev. B | Page 3 of 25 Max 7 19 8 IP3 P1dB IP3 P1dB IP2 IFIN Typ 10 dB dB dBm dBm dBm 8 19 8 dB dBm dBm 29 37 33 dB dB dB HMC553ALC3B Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter RF Input Power LO Input Power IF Input Power IF Source/Sink Current Reflow Temperature Maximum Junction Temperature Continuous Power Dissipation, PDISS (TA = 85°C, Derate 4.6 mW/°C Above 85°C) Operating Temperature Range Storage Temperature Range Lead Temperature Range Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Field Induced Charged Device Model (FICDM) Thermal performance is directly linked to PCB design and operating environment. Careful attention to PCB thermal design is required. Rating 25 dBm 25 dBm 25 dBm 3 mA 260°C 175°C 414 mW θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 3. Thermal Resistance −40°C to +85°C −65°C to +150°C −65°C to +150°C Package Type E-12-41 1 θJC 175 Unit °C/W See JEDEC standard JESD51-2 for additional information on optimizing the thermal impedance (PCB with 3 × 3 vias). ESD CAUTION 1000 V 1250 V θJA 120 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 25 Data Sheet HMC553ALC3B PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC553ALC3B NIC NIC 12 11 10 RF GND 3 7 GND 4 5 6 GND GND 8 IF 9 LO 2 GND GND 1 PACKAGE BASE GND NOTES 1. NOT INTERNALLY CONNECTED. THESE PINS CAN BE CONNECTED TO RF/DC GROUND. PERFORMANCE IS NOT AFFECTED. 2. EXPOSED PAD. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND. 16420-002 NIC TOP VIEW (Not to Scale) Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1, 3, 4, 6, 7, 9 2 5 Mnemonic GND LO IF 8 10, 11, 12 RF NIC EPAD Description Ground. These pins and package bottom must be connected to RF/dc ground. Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible die failure may result. Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω. Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected. Exposed Pad. The exposed pad must be connected to RF/dc ground. INTERFACE SCHEMATICS IF 16420-005 16420-003 GND Figure 5. IF Interface Schematic Figure 3. GND Interface Schematic RF 16420-004 16420-006 LO Figure 4. LO Interface Schematic Figure 6. RF Interface Schematic Rev. B | Page 5 of 25 HMC553ALC3B Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS DOWNCONVERTER PERFORMANCE 0 –5 –5 –10 TA = –40°C TA = +25°C TA = +85°C –15 –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 5 = 9dBm = 11dBm = 13dBm = 15dBm 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 9. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 30 25 25 20 20 INPUT IP3 (dBm) 30 15 TA = –40°C TA = +25°C TA = +85°C 10 LO LO LO LO –15 –20 5 LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 15 10 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 10. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C Figure 8. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm Rev. B | Page 6 of 25 16420-011 5 16420-008 INPUT IP3 (dBm) Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm –10 16420-010 CONVERSION GAIN (dB) 0 16420-007 CONVERSION GAIN (dB) IF = 100 MHz, Upper Sideband (Low-Side LO) Data Sheet HMC553ALC3B 20 15 15 10 TA = –40°C TA = +25°C TA = +85°C 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 13. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C 60 50 50 40 40 INPUT IP2 (dBm) 60 30 TA = –40°C TA = +25°C TA = +85°C 30 LO LO LO LO 20 = 9dBm = 11dBm = 13dBm = 15dBm 10 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 12. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm Figure 14. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 7 of 25 16420-016 10 16420-014 INPUT IP2 (dBm) = 9dBm = 11dBm = 13dBm = 15dBm 0 Figure 11. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 20 LO LO LO LO 5 0 5 10 16420-015 INPUT P1dB (dBm) 20 16420-013 INPUT P1dB (dBm) Downconverter P1dB and IP2, IF = 100 MHz, Upper Sideband (Low-Side LO) HMC553ALC3B Data Sheet 0 0 –5 –5 CONVERSION GAIN (dB) –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 5 30 25 25 20 20 15 TA = –40°C TA = +25°C TA = +85°C 6 7 8 9 10 11 12 13 14 15 LO = 9dBm LO = 11dBm LO = 13dBm LO = 15dBm 15 10 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-018 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 16. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 16420-021 5 5 Figure 19. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C 20 20 15 15 TA = –40°C TA = +25°C TA = +85°C NOISE FIGURE (dB) NOISE FIGURE (dB) 9dBm 11dBm 13dBm 15dBm Figure 18. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 30 10 = = = = RF FREQUENCY (GHz) INPUT IP3 (dBm) INPUT IP3 (dBm) Figure 15. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm LO LO LO LO –15 –20 16420-017 TA = –40°C TA = +25°C TA = +85°C –15 –10 16420-020 –10 10 5 10 LO LO LO LO 5 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-019 0 = 9dBm = 11dBm = 13dBm = 15dBm 5 6 7 8 9 10 11 12 RF FREQUENCY (GHz) Figure 17. Noise Figure vs. RF Frequency at Various Temperatures, LO = 13 dBm 13 14 15 16420-022 CONVERSION GAIN (dB) IF = 100 MHz, Lower Sideband (High-Side LO) Figure 20. Noise Figure vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 8 of 25 Data Sheet HMC553ALC3B 20 15 15 10 TA = –40°C TA = +25°C TA = +85°C 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 23. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C 80 70 70 60 60 INPUT IP2 (dBm) 80 50 40 30 TA = –40°C TA = +25°C TA = +85°C 50 40 30 20 10 LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 8 9 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 5 6 7 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 22. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm Figure 24. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 9 of 25 16420-026 10 16420-024 INPUT IP2 (dBm) = 9dBm = 11dBm = 13dBm = 15dBm 0 Figure 21. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 20 LO LO LO LO 5 0 5 10 16420-025 INPUT P1dB (dBm) 20 16420-023 INPUT P1dB (dBm) Downconverter P1dB and IP2, IF = 100 MHz, Lower Sideband (High-Side LO) HMC553ALC3B Data Sheet IF = 4000 MHz, Upper Sideband (Low-Side LO) 0 CONVERSION GAIN (dB) –10 –15 –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 5 8 9 10 11 12 13 14 15 Figure 27. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 25 INPUT IP3 (dBm) 10 6 RF FREQUENCY (GHz) 25 15 7 –15 30 20 = 9dBm = 11dBm = 13dBm = 15dBm –10 30 TA = –40°C TA = +25°C TA = +85°C LO LO LO LO –20 LO = 9dBm LO = 11dBm LO = 13dBm LO = 15dBm 20 15 10 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 26. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 28. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 10 of 25 16420-030 5 5 16420-028 INPUT IP3 (dBm) Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm –5 16420-029 TA = –40°C TA = +25°C TA = +85°C –5 16420-027 CONVERSION GAIN (dB) 0 Data Sheet HMC553ALC3B 20 20 15 15 INPUT P1dB (dBm) TA = –40°C TA = +25°C TA = +85°C 10 10 5 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-031 0 5 7 8 9 10 11 12 13 14 15 Figure 31. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C 80 70 70 60 60 INPUT IP2 (dBm) 80 50 40 30 TA = –40°C TA = +25°C TA = +85°C 20 6 RF FREQUENCY (GHz) Figure 29. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 50 40 LO LO LO LO 30 20 = 9dBm = 11dBm = 13dBm = 15dBm 10 10 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 16420-032 INPUT IP2 (dBm) = 9dBm = 11dBm = 13dBm = 15dBm 16420-033 5 LO LO LO LO Figure 30. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 32. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 11 of 25 16420-034 INPUT P1dB (dBm) Downconverter P1dB and IP2, IF = 40000 MHz, Upper Sideband (Low-Side LO) HMC553ALC3B Data Sheet 0 –5 –5 –10 TA = –40°C TA = +25°C TA = +85°C –15 –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 5 25 20 20 INPUT IP3 (dBm) 25 10 9dBm 11dBm 13dBm 15dBm 6 7 8 9 10 11 12 13 14 15 Figure 35. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 30 TA = –40°C TA = +25°C TA = +85°C = = = = RF FREQUENCY (GHz) 30 15 LO LO LO LO –15 –20 5 15 LO LO LO LO 10 = 9dBm = 11dBm = 13dBm = 15dBm 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 34. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 36. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 12 of 25 16420-038 5 16420-036 INPUT IP3 (dBm) Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm –10 16420-037 CONVERSION GAIN (dB) 0 16420-035 CONVERSION GAIN (dB) IF = 4000 MHz, Lower Sideband (High-Side LO) Data Sheet HMC553ALC3B 20 20 15 15 INPUT P1dB (dBm) 10 TA = –40°C TA = +25°C TA = +85°C = 9dBm = 11dBm = 13dBm = 15dBm 10 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-039 0 5 70 70 60 60 INPUT IP2 (dBm) 80 50 TA = –40°C TA = +25°C TA = +85°C 30 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 16420-040 10 8 Figure 38. Input IP2 vs. RF Frequency at Various Temperatures, LO = 13 dBm LO LO LO LO 30 10 7 10 11 12 13 14 15 40 20 6 9 50 20 5 8 Figure 39. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C 80 0 7 RF FREQUENCY (GHz) Figure 37. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 40 6 16420-041 5 5 INPUT IP2 (dBm) LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 40. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 13 of 25 16420-042 INPUT P1dB (dBm) Downconverter P1dB and IP2, IF = 4000 MHz, Lower Sideband (High-Side LO) HMC553ALC3B Data Sheet UPCONVERTER PERFORMANCE 0 –5 –5 CONVERSION GAIN (dB) 0 TA = –40°C TA = +25°C TA = +85°C –15 –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 41. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm LO LO LO LO 5 25 20 20 8 9 10 11 12 13 14 15 15 LO LO LO LO 10 = 9dBm = 11dBm = 13dBm = 15dBm 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-044 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 42. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 16420-047 5 5 Figure 45. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C 20 20 15 LO LO LO LO 15 INPUT P1dB (dBm) TA = –40°C TA = +25°C TA = +85°C 10 5 = 9dBm = 11dBm = 13dBm = 15dBm 10 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 43. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 5 6 7 8 9 10 11 12 RF FREQUENCY (GHz) 13 14 15 16420-048 5 16420-045 INPUT P1dB (dBm) 7 Figure 44. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 25 TA = –40°C TA = +25°C TA = +85°C 6 RF FREQUENCY (GHz) 30 10 9dBm 11dBm 13dBm 15dBm –20 30 15 = = = = –15 INPUT IP3 (dBm) INPUT IP3 (dBm) –10 16420-046 –10 16420-043 CONVERSION GAIN (dB) IFIN = 100 MHz, Upper sideband (Low-Side LO) Figure 46. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 14 of 25 Data Sheet HMC553ALC3B 0 –5 –5 CONVERSION GAIN (dB) 0 TA = –40°C TA = +25°C TA = +85°C –15 –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm 5 6 7 8 9 10 11 12 13 14 15 Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 25 25 20 20 TA = –40°C TA = +25°C TA = +85°C 9dBm 11dBm 13dBm 15dBm RF FREQUENCY (GHz) 30 10 = = = = –20 30 15 LO LO LO LO –15 INPUT IP3 (dBm) 15 LO = 9dBm LO = 11dBm LO = 13dBm LO = 15dBm 10 5 5 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-050 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 48. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 16420-053 INPUT IP3 (dBm) –10 16420-052 –10 16420-049 CONVERSION GAIN (dB) IFIN = 100 MHz, Lower Sideband (High-Side LO) Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C 20 15 TA = –40°C TA = +25°C TA = +85°C 5 6 7 8 5 LO LO LO LO 0 5 10 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 49. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm = 9dBm = 11dBm = 13dBm = 15dBm 0 5 6 7 8 9 10 11 12 RF FREQUENCY (GHz) 13 14 15 16420-054 INPUT P1dB (dBm) 10 16420-051 INPUT P1dB (dBm) 15 Figure 52. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 15 of 25 HMC553ALC3B Data Sheet 0 –5 –5 CONVERSION GAIN (dB) 0 –15 –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm 5 25 20 20 5 7 8 9 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 11 12 13 14 15 10 LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 0 16420-056 5 10 15 5 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 54. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm Figure 57. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C 20 20 TA = –40°C TA = +25°C TA = +85°C LO LO LO LO 15 INPUT P1dB (dBm) 15 10 5 = 9dBm = 11dBm = 13dBm = 15dBm 10 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 55. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm 0 5 6 7 8 9 10 11 12 RF FREQUENCY (GHz) 13 14 15 16420-060 5 16420-057 INPUT P1dB (dBm) 6 Figure 56. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 25 TA = –40°C TA = +25°C TA = +85°C 9dBm 11dBm 13dBm 15dBm RF FREQUENCY (GHz) 30 10 = = = = –20 30 15 LO LO LO LO –15 INPUT IP3 (dBm) INPUT IP3 (dBm) –10 16420-058 TA = –40°C TA = +25°C TA = +85°C 16420-059 –10 16420-055 CONVERSION GAIN (dB) IFIN = 4000 MHz, Upper Sideband (Low-Side LO) Figure 58. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 16 of 25 Data Sheet HMC553ALC3B 0 –5 –5 CONVERSION GAIN (dB) 0 TA = –40°C TA = +25°C TA = +85°C –15 –20 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 59. Conversion Gain vs. RF Frequency at Various Temperatures, LO = 13 dBm 5 7 8 9 10 11 12 13 14 15 Figure 62. Conversion Gain vs. RF Frequency at Various LO Power Levels, TA = 25°C 25 25 20 20 TA = –40°C TA = +25°C TA = +85°C 6 RF FREQUENCY (GHz) 30 10 = 9dBm = 11dBm = 13dBm = 15dBm –20 30 15 LO LO LO LO –15 INPUT IP3 (dBm) 5 15 LO LO LO LO 10 = 9dBm = 11dBm = 13dBm = 15dBm 5 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-062 0 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) Figure 60. Input IP3 vs. RF Frequency at Various Temperatures, LO = 13 dBm 16420-065 INPUT IP3 (dBm) –10 16420-064 –10 16420-061 CONVERSION GAIN (dB) IFIN = 4000 MHz, Lower Sideband (High-Side LO) Figure 63. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C 15 20 TA = –40°C TA = +25°C TA = +85°C 5 6 7 8 5 LO LO LO LO 0 5 10 9 10 11 12 13 14 15 RF FREQUENCY (GHz) = 9dBm = 11dBm = 13dBm = 15dBm 0 5 6 7 8 9 10 11 12 RF FREQUENCY (GHz) 13 14 15 16420-066 INPUT P1dB (dBm) 10 16420-063 INPUT P1dB (dBm) 15 Figure 64. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C Figure 61. Input P1dB vs. RF Frequency at Various Temperatures, LO = 13 dBm Rev. B | Page 17 of 25 HMC553ALC3B Data Sheet ISOLATION AND RETURN LOSS 60 60 50 50 LO TO RF ISOLATION (dB) 40 30 TA = –40°C TA = +25°C TA = +85°C 20 20 LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 8 9 0 Figure 65. LO to RF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 5 50 LO TO IF ISOLATION (dB) 50 TA = –40°C TA = +25°C TA = +85°C 20 10 11 12 13 14 15 Figure 68. LO to RF Isolation vs. RF Frequency at Various LO Power Levels, TA = 25°C 60 30 7 RF FREQUENCY (GHz) 60 40 6 16420-070 5 16420-067 0 40 30 20 LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 8 9 10 10 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 0 16420-068 0 Figure 66. LO to IF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 5 50 RF TO IF ISOLATION (dB) 50 TA = –40°C TA = +25°C TA = +85°C 20 10 11 12 13 14 15 Figure 69. LO to IF Isolation vs. RF Frequency at Various LO Power Levels, TA = 25°C 60 30 7 RF FREQUENCY (GHz) 60 40 6 16420-071 LO TO IF ISOLATION (dB) 30 10 10 RF TO IF ISOLATION (dB) 40 40 30 20 LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 8 9 10 10 5 6 7 8 9 10 11 12 RF FREQUENCY (GHz) 13 14 15 0 16420-069 0 Figure 67. RF to IF Isolation vs. RF Frequency at Various Temperatures, LO = 13 dBm 5 6 7 10 11 12 RF FREQUENCY (GHz) 13 14 15 16420-072 LO TO RF ISOLATION (dB) Downconverter performance at IF = 100 MHz, upper sideband (low-side LO). Figure 70. RF to IF Isolation vs. RF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 18 of 25 Data Sheet HMC553ALC3B 0 0 –5 IF RETURN LOSS (dB) LO RETURN LOSS (dB) –5 –10 –10 LO LO LO LO –15 = 9dBm = 11dBm = 13dBm = 15dBm –15 5 6 7 8 9 10 11 12 13 14 15 LO FREQUENCY (GHz) 0 –10 –15 –20 LO = 9dBm LO = 11dBm LO = 13dBm LO = 15dBm –35 –40 –45 5 6 7 8 9 10 11 12 13 14 15 RF FREQUENCY (GHz) 16420-074 RF RETURN LOSS (dB) –5 –30 1.01 2.01 3.01 4.01 5.01 IF FREQUENCY (GHz) 6.01 7.01 8.01 Figure 73. IF Return Loss vs. IF Frequency at LO Power Levels, TA = 25°C, LO = 10 GHz Figure 71. LO Return Loss vs. LO Frequency at LO = 13 dBm, TA = 25°C –25 –25 0.01 Figure 72. RF Return Loss vs. RF Frequency at LO Power Levels, TA = 25°C, LO = 10 GHz Rev. B | Page 19 of 25 16420-075 –20 16420-073 –20 HMC553ALC3B Data Sheet IF BANDWIDTH—DOWNCONVERTER, UPPER SIDEBAND 0 –5 –5 –10 TA = –40°C TA = +25°C TA = +85°C –15 –20 1.1 2.1 3.1 4.1 5.1 6.1 7.1 IF FREQUENCY (GHz) –10 –15 –20 0.1 25 25 20 20 INPUT IP3 (dBm) 30 TA = –40°C TA = +25°C TA = +85°C 10 5 0 0.1 2.1 3.1 4.1 5.1 6.1 7.1 Figure 76. Conversion Gain vs. IF Frequency at Various LO Power Levels, TA = 25°C 30 15 1.1 IF FREQUENCY (GHz) LO LO LO LO = 9dBm = 11dBm = 13dBm = 15dBm 15 10 5 1.1 2.1 3.1 4.1 5.1 6.1 7.1 IF FREQUENCY (GHz) 16420-077 INPUT IP3 (dBm) Figure 74. Conversion Gain vs. IF Frequency at Various Temperatures, LO = 13 dBm = 9dBm = 11dBm = 13dBm = 15dBm 0 0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1 IF FREQUENCY (GHz) Figure 77. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25°C Figure 75. Input IP3 vs. IF Frequency at Various Temperatures, LO = 13 dBm Rev. B | Page 20 of 25 16420-079 0.1 LO LO LO LO 16420-078 CONVERSION GAIN (dB) 0 16420-076 CONVERSION GAIN (dB) LO frequency = 8 GHz. Data Sheet HMC553ALC3B IF BANDWIDTH—DOWNCONVERTER, LOWER SIDEBAND LO frequency = 13 GHz. 0 –5 –10 –15 1.1 2.1 3.1 4.1 5.1 6.1 7.1 IF FREQUENCY (GHz) –10 –15 0.1 25 20 20 INPUT IP3 (dBm) 25 10 5 0 0.1 2.1 3.1 4.1 5.1 6.1 7.1 Figure 80. Conversion Gain vs. IF Frequency at Various LO Power Levels, TA = 25°C 30 TA = –40°C TA = +25°C TA = +85°C 1.1 IF FREQUENCY (GHz) 30 15 9dBm 11dBm 13dBm 15dBm –20 15 LO LO LO LO 10 = 9dBm = 11dBm = 13dBm = 15dBm 5 1.1 2.1 3.1 4.1 5.1 6.1 7.1 IF FREQUENCY (GHz) 16420-081 INPUT IP3 (dBm) Figure 78. Conversion Gain vs. IF Frequency at Various Temperatures, LO = 13 dBm –5 = = = = Figure 79. Input IP3 vs. IF Frequency at Various Temperatures, LO = 13 dBm 0 0.1 1.1 2.1 3.1 4.1 5.1 6.1 7.1 IF FREQUENCY (GHz) Figure 81. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25°C Rev. B | Page 21 of 25 16420-083 0.1 16420-080 –20 LO LO LO LO 16420-082 TA = –40°C TA = +25°C TA = +85°C CONVERSION GAIN (dB) CONVERSION GAIN (dB) 0 HMC553ALC3B Data Sheet SPURIOUS AND HARMONICS PERFORMANCE Upconversion, Upper Sideband LO Harmonics Spur values are (M × IFIN) + (N × LO). IFIN = 0.1 GHz, LO = 10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer spurious products are measured in dBc from the RF output power level. N/A means not applicable. LO = 13 dBm, all values in dBc below input LO level and measured at RF port. N/A means not applicable. Table 5. LO Harmonics at RF LO Frequency (GHz) 6 8 9 10 12 14 N × LO Spur at RF Port (dBc) 2 3 4 21 51 53 41 43 64 46 49 70 45 58 82 50 45 105 50 71 N/A 1 37 38 38 37 37 39 M × IFIN LO = 13 dBm, all values in dBc below input LO level and measured at IF port. N/A means not applicable. Table 6. LO Harmonics at IF LO Frequency (GHz) 6 8 9 10 12 14 1 43 28 29 29 31 43 N × LO Spur at IF Port (dBc) 2 3 4 38 60 74 50 88 104 66 102 109 76 103 108 84 88 10 93 107 N/A M × RF 0 1 2 3 4 1 0.6 0 67 92 82 4 N/A 68 78 91 101 Downconversion, Lower Sideband Spur values are (M × RF) − (N × LO). RF = 14 GHz, LO = 14.1 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer spurious products are measured in dBc from the IF output power level. N/A means not applicable. M × RF 0 1 2 3 4 0 N/A 18 55 N/A N/A 1 3 0 72 57 N/A N × LO 2 26 40 70 93 58 3 N/A 65 77 74 95 3 64 62 75 72 22 27 20 68 76 84 84 4 61 61 61 59 43 19 N/A N/A N/A N/A N/A IFIN = 0.1 GHz, LO = 14.1 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer spurious products are measured in dBc from the RF output power level. N/A means not applicable. M × IFIN 3 25 70 70 71 98 N × LO 2 96 94 83 59 35 10 36 58 84 92 94 Spur values are (M × IFIN) + (N × LO). Spur values are (M × RF) − (N × LO). RF = 10.1 GHz, LO = 10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer spurious products are measured in dBc from the IF output power level. N/A means not applicable. 0 N/A 22 71 84 N/A 1 99 86 81 51 0 6 0 50 63 85 100 Upconversion, Lower Sideband M × N Spurious Outputs Downconversion, Upper Sideband N × LO 2 26 44 58 93 93 −5 −4 −3 −2 −1 0 +1 +2 +3 +4 +5 0 N/A N/A N/A N/A N/A N/A 36 81 95 101 102 4 N/A N/A 56 89 101 Rev. B | Page 22 of 25 −5 −4 −3 −2 −1 0 +1 +2 +3 +4 +5 0 N/A N/A N/A N/A N/A N/A 34 79 96 100 100 1 96 85 71 52 0 8 0 50 63 86 95 N × LO 2 82 84 77 60 28 20 28 61 61 84 62 3 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A 4 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A Data Sheet HMC553ALC3B THEORY OF OPERATION The HMC553ALC3B is a general-purpose, double-balanced mixer that can be used as an upconverter or a downconverter from 6 GHz to 14 GHz. When used as an upconverter, the mixer upconverts intermediate frequencies between dc and 5 GHz to radio frequencies between 6 GHz and 14 GHz. When used a downconverter, the HMC553ALC3B downconverts radio frequencies (RF) between 6 GHz and 14 GHz to intermediate frequencies (IF) between dc and 5 GHz. Rev. B | Page 23 of 25 HMC553ALC3B Data Sheet APPLICATIONS INFORMATION Use RF circuit design techniques for the circuit board used in the application. Ensure that signal lines have 50 Ω impedance, and connect the package ground leads and the exposed pad directly to the ground plane (see Figure 83). Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 83 is available from Analog Devices, Inc., upon request. NIC Figure 82 shows the typical application circuit for the HMC553ALC3B. The HMC553ALC3B is a passive device and does not require any external components. The LO and RF pins are internally ac-coupled. The IF pin is internally dc-coupled. When IF operation to dc is not required, use of an external series capacitor is recommended, of a value chosen to pass the necessary IF frequency range. When IF operation to dc is required, do not exceed the IF source and sink current rating specified in the Absolute Maximum Ratings section. NIC EVALUATION PCB INFORMATION NIC TYPICAL APPLICATION CIRCUIT 12 11 10 Table 7. List of Materials for Evaluation PCB EV1HMC553ALC3B Item J1, J2 J3 U1 PCB1 HMC553ALC3B 1 9 GND 2 8 GND 3 7 5 RF RF GND 1 117611-7 is the raw bare PCB identifier. Reference EV1HMC553ALC3B when ordering the complete evaluation PCB. 6 GND GND 4 IF LO 16420-084 GND IF Figure 82. Typical Application Circuit LO RF 117611–7 J1 553A J2 IF U1 J3 Figure 83. Evaluation PCB Top Layer Rev. B | Page 24 of 25 16420-085 LO Description SRI 2.92 mm connector Johnson Surface-Mount Type A (SMA) connector HMC553ALC3B 117611-7 evaluation board Data Sheet HMC553ALC3B OUTLINE DIMENSIONS PIN 1 INDICATOR 0.36 0.30 0.24 0.08 BSC 10 0.50 BSC PIN 1 12 1 9 3 7 6 TOP VIEW 0.90 0.80 0.70 1.60 1.50 SQ 1.40 EXPOSED PAD 0.32 BSC 4 BOTTOM VIEW 1.00 REF 2.10 BSC SIDE VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. PKG-004837 SEATING PLANE 03-02-2017-A 3.05 2.90 SQ 2.75 Figure 84. 12-Terminal Ceramic Leadless Chip Carrier (LCC) (E-12-4) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC553ALC3B HMC553ALC3BTR HMC553ALC3BTR-R5 EV1HMC553ALC3B 1 2 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C Moisture Sensitivity Level (MSL) Rating2 MSL3 MSL3 MSL3 All models are RoHS compliant. The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2. ©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D16420-0-3/19(B) Rev. B | Page 25 of 25 Package Description 12-Terminal Ceramic LCC 12-Terminal Ceramic LCC 12-Terminal Ceramic LCC Evaluation PCB Assembly Package Option E-12-4 E-12-4 E-12-4