6 GHz to 14 GHz, GaAs, MMIC,
Double-Balanced Mixer
HMC553ALC3B
Data Sheet
FUNCTIONAL BLOCK DIAGRAM
NIC
HMC553ALC3B
NIC
Passive: no dc bias required
Conversion loss: 7 dB typical at 6 GHz to 11 GHz
Input IP3: 18 dBm typical at 6 GHz to 11 GHz
LO to RF isolation: 36 dB typical
Wide IF bandwidth: dc to 5 GHz
RoHS compliant, 12-terminal, 2.90 mm × 2.90 mm LCC package
NIC
FEATURES
12
11
10
GND 1
9
GND
LO 2
8
RF
GND 3
7
GND
6
PACKAGE
BASE
GND
16420-001
5
GND
4
GND
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Point to point radios
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
IF
APPLICATIONS
Figure 1.
GENERAL DESCRIPTION
The HMC553ALC3B is a general-purpose, double-balanced,
gallium arsenide (GaAs), monolithic microwave integrated
circuit (MMIC) mixer housed in a leadless Pb-free, RoHS
compliant LCC package. The HMC553ALC3B can be used as an
upconverter or downconverter between 6 GHz and 14 GHz.
This mixer requires no external components or matching
circuitry.
Rev. B
The HMC553ALC3B provides local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF) suppression
due to optimized balun structures. The mixer operates with LO
drive levels from 9 dBm to 15 dBm. The HMC553ALC3B
eliminates the need for wire bonding, allowing use of surfacemount manufacturing techniques.
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HMC553ALC3B
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Upconverter Performance ......................................................... 14
Applications ....................................................................................... 1
Isolation and Return Loss ......................................................... 18
Functional Block Diagram .............................................................. 1
IF Bandwidth—Downconverter, Upper Sideband................. 20
General Description ......................................................................... 1
IF Bandwidth—Downconverter, Lower Sideband ................. 21
Revision History ............................................................................... 2
Spurious and Harmonics Performance ................................... 22
Specifications..................................................................................... 3
Theory of Operation ...................................................................... 23
Absolute Maximum Ratings............................................................ 4
Applications Information .............................................................. 24
Thermal Resistance ...................................................................... 4
Typical Application Circuit ....................................................... 24
ESD Caution .................................................................................. 4
Evaluation PCB Information .................................................... 24
Pin Configuration and Function Descriptions ............................. 5
Outline Dimensions ....................................................................... 25
Interface Schematics..................................................................... 5
Ordering Guide .......................................................................... 25
Typical Performance Characteristics ............................................. 6
Downconverter Performance...................................................... 6
REVISION HISTORY
3/2019—Rev.A to Rev. B
Change to Table 5 ........................................................................... 22
Changes to Downconversion, Upper Sideband Section,
Downconversion, Lower Sideband Section, Upconversion, Upper
Sideband Section, and Upconversion, Lower Sideband Section ... 22
2/2018—Revision 0: Initial Version
6/2018—Rev.0 to Rev. A
Added 6 GHz to 11 GHz Downconverter Performance, Noise
Figure Parameter and 11 GHz to 14 GHz Downconverter
Performance, Noise Figure Parameter, Table 1 ............................. 3
Rev. B | Page 2 of 25
Data Sheet
HMC553ALC3B
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, RF = −10 dBm, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless
otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter
FREQUENCY RANGE
RF
LO Input
IF
LO DRIVE LEVELS
6 GHz to 11 GHz PERFORMANCE
Downconverter
Conversion Loss
Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
Conversion Loss
Input Third-Order Intercept
Input 1 dB Compression Point
Isolation
RF to IF
LO to RF
LO to IF
11 GHz to 14 GHz PERFORMANCE
Downconverter
Conversion Loss
Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Upconverter
Conversion Loss
Input Third-Order Intercept
Input 1 dB Compression Point
Isolation
RF to IF
LO to RF
LO to IF
Symbol
Test Conditions/Comments
Min
6
6
DC
9
IP3
P1dB
IP2
IFIN
15
Unit
13
14
14
5
15
GHz
GHz
GHz
dBm
9
dB
dB
dBm
dBm
dBm
7
8.5
18
9.5
40
dB
dBm
dBm
18
30
28
32
36
32
dB
dB
dB
18
9
10
22
11.5
45
IP3
P1dB
25
30
28
Rev. B | Page 3 of 25
Max
7
19
8
IP3
P1dB
IP3
P1dB
IP2
IFIN
Typ
10
dB
dB
dBm
dBm
dBm
8
19
8
dB
dBm
dBm
29
37
33
dB
dB
dB
HMC553ALC3B
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Reflow Temperature
Maximum Junction Temperature
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 4.6 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
Rating
25 dBm
25 dBm
25 dBm
3 mA
260°C
175°C
414 mW
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
Table 3. Thermal Resistance
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
Package Type
E-12-41
1
θJC
175
Unit
°C/W
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
1000 V
1250 V
θJA
120
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. B | Page 4 of 25
Data Sheet
HMC553ALC3B
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC553ALC3B
NIC
NIC
12
11
10
RF
GND 3
7
GND
4
5
6
GND
GND
8
IF
9
LO 2
GND
GND 1
PACKAGE
BASE
GND
NOTES
1. NOT INTERNALLY CONNECTED. THESE PINS
CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
16420-002
NIC
TOP VIEW
(Not to Scale)
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
1, 3, 4, 6, 7, 9
2
5
Mnemonic
GND
LO
IF
8
10, 11, 12
RF
NIC
EPAD
Description
Ground. These pins and package bottom must be connected to RF/dc ground.
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block
this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible
die failure may result.
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
IF
16420-005
16420-003
GND
Figure 5. IF Interface Schematic
Figure 3. GND Interface Schematic
RF
16420-004
16420-006
LO
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. B | Page 5 of 25
HMC553ALC3B
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
0
–5
–5
–10
TA = –40°C
TA = +25°C
TA = +85°C
–15
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
5
= 9dBm
= 11dBm
= 13dBm
= 15dBm
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 9. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
25
20
20
INPUT IP3 (dBm)
30
15
TA = –40°C
TA = +25°C
TA = +85°C
10
LO
LO
LO
LO
–15
–20
5
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
15
10
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 10. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Rev. B | Page 6 of 25
16420-011
5
16420-008
INPUT IP3 (dBm)
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–10
16420-010
CONVERSION GAIN (dB)
0
16420-007
CONVERSION GAIN (dB)
IF = 100 MHz, Upper Sideband (Low-Side LO)
Data Sheet
HMC553ALC3B
20
15
15
10
TA = –40°C
TA = +25°C
TA = +85°C
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 13. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
50
50
40
40
INPUT IP2 (dBm)
60
30
TA = –40°C
TA = +25°C
TA = +85°C
30
LO
LO
LO
LO
20
= 9dBm
= 11dBm
= 13dBm
= 15dBm
10
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 12. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 14. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 7 of 25
16420-016
10
16420-014
INPUT IP2 (dBm)
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
Figure 11. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
20
LO
LO
LO
LO
5
0
5
10
16420-015
INPUT P1dB (dBm)
20
16420-013
INPUT P1dB (dBm)
Downconverter P1dB and IP2, IF = 100 MHz, Upper Sideband (Low-Side LO)
HMC553ALC3B
Data Sheet
0
0
–5
–5
CONVERSION GAIN (dB)
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
5
30
25
25
20
20
15
TA = –40°C
TA = +25°C
TA = +85°C
6
7
8
9
10
11
12
13
14
15
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
15
10
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-018
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 16. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
16420-021
5
5
Figure 19. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
15
15
TA = –40°C
TA = +25°C
TA = +85°C
NOISE FIGURE (dB)
NOISE FIGURE (dB)
9dBm
11dBm
13dBm
15dBm
Figure 18. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
10
=
=
=
=
RF FREQUENCY (GHz)
INPUT IP3 (dBm)
INPUT IP3 (dBm)
Figure 15. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
LO
LO
LO
LO
–15
–20
16420-017
TA = –40°C
TA = +25°C
TA = +85°C
–15
–10
16420-020
–10
10
5
10
LO
LO
LO
LO
5
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-019
0
= 9dBm
= 11dBm
= 13dBm
= 15dBm
5
6
7
8
9
10
11
12
RF FREQUENCY (GHz)
Figure 17. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
13
14
15
16420-022
CONVERSION GAIN (dB)
IF = 100 MHz, Lower Sideband (High-Side LO)
Figure 20. Noise Figure vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 8 of 25
Data Sheet
HMC553ALC3B
20
15
15
10
TA = –40°C
TA = +25°C
TA = +85°C
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 23. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
80
70
70
60
60
INPUT IP2 (dBm)
80
50
40
30
TA = –40°C
TA = +25°C
TA = +85°C
50
40
30
20
10
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
8
9
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
5
6
7
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 22. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 24. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 9 of 25
16420-026
10
16420-024
INPUT IP2 (dBm)
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
Figure 21. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
20
LO
LO
LO
LO
5
0
5
10
16420-025
INPUT P1dB (dBm)
20
16420-023
INPUT P1dB (dBm)
Downconverter P1dB and IP2, IF = 100 MHz, Lower Sideband (High-Side LO)
HMC553ALC3B
Data Sheet
IF = 4000 MHz, Upper Sideband (Low-Side LO)
0
CONVERSION GAIN (dB)
–10
–15
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
5
8
9
10
11
12
13
14
15
Figure 27. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
25
INPUT IP3 (dBm)
10
6
RF FREQUENCY (GHz)
25
15
7
–15
30
20
= 9dBm
= 11dBm
= 13dBm
= 15dBm
–10
30
TA = –40°C
TA = +25°C
TA = +85°C
LO
LO
LO
LO
–20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
20
15
10
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 26. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 28. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 10 of 25
16420-030
5
5
16420-028
INPUT IP3 (dBm)
Figure 25. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–5
16420-029
TA = –40°C
TA = +25°C
TA = +85°C
–5
16420-027
CONVERSION GAIN (dB)
0
Data Sheet
HMC553ALC3B
20
20
15
15
INPUT P1dB (dBm)
TA = –40°C
TA = +25°C
TA = +85°C
10
10
5
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-031
0
5
7
8
9
10
11
12
13
14
15
Figure 31. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
80
70
70
60
60
INPUT IP2 (dBm)
80
50
40
30
TA = –40°C
TA = +25°C
TA = +85°C
20
6
RF FREQUENCY (GHz)
Figure 29. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
50
40
LO
LO
LO
LO
30
20
= 9dBm
= 11dBm
= 13dBm
= 15dBm
10
10
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
16420-032
INPUT IP2 (dBm)
= 9dBm
= 11dBm
= 13dBm
= 15dBm
16420-033
5
LO
LO
LO
LO
Figure 30. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 32. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 11 of 25
16420-034
INPUT P1dB (dBm)
Downconverter P1dB and IP2, IF = 40000 MHz, Upper Sideband (Low-Side LO)
HMC553ALC3B
Data Sheet
0
–5
–5
–10
TA = –40°C
TA = +25°C
TA = +85°C
–15
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
5
25
20
20
INPUT IP3 (dBm)
25
10
9dBm
11dBm
13dBm
15dBm
6
7
8
9
10
11
12
13
14
15
Figure 35. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
TA = –40°C
TA = +25°C
TA = +85°C
=
=
=
=
RF FREQUENCY (GHz)
30
15
LO
LO
LO
LO
–15
–20
5
15
LO
LO
LO
LO
10
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 34. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 36. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 12 of 25
16420-038
5
16420-036
INPUT IP3 (dBm)
Figure 33. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
–10
16420-037
CONVERSION GAIN (dB)
0
16420-035
CONVERSION GAIN (dB)
IF = 4000 MHz, Lower Sideband (High-Side LO)
Data Sheet
HMC553ALC3B
20
20
15
15
INPUT P1dB (dBm)
10
TA = –40°C
TA = +25°C
TA = +85°C
= 9dBm
= 11dBm
= 13dBm
= 15dBm
10
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-039
0
5
70
70
60
60
INPUT IP2 (dBm)
80
50
TA = –40°C
TA = +25°C
TA = +85°C
30
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
16420-040
10
8
Figure 38. Input IP2 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
LO
LO
LO
LO
30
10
7
10
11
12
13
14
15
40
20
6
9
50
20
5
8
Figure 39. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
80
0
7
RF FREQUENCY (GHz)
Figure 37. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
40
6
16420-041
5
5
INPUT IP2 (dBm)
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 40. Input IP2 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 13 of 25
16420-042
INPUT P1dB (dBm)
Downconverter P1dB and IP2, IF = 4000 MHz, Lower Sideband (High-Side LO)
HMC553ALC3B
Data Sheet
UPCONVERTER PERFORMANCE
0
–5
–5
CONVERSION GAIN (dB)
0
TA = –40°C
TA = +25°C
TA = +85°C
–15
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 41. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
LO
LO
LO
LO
5
25
20
20
8
9
10
11
12
13
14
15
15
LO
LO
LO
LO
10
= 9dBm
= 11dBm
= 13dBm
= 15dBm
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-044
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 42. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
16420-047
5
5
Figure 45. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
15
LO
LO
LO
LO
15
INPUT P1dB (dBm)
TA = –40°C
TA = +25°C
TA = +85°C
10
5
= 9dBm
= 11dBm
= 13dBm
= 15dBm
10
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 43. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
6
7
8
9
10
11
12
RF FREQUENCY (GHz)
13
14
15
16420-048
5
16420-045
INPUT P1dB (dBm)
7
Figure 44. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
25
TA = –40°C
TA = +25°C
TA = +85°C
6
RF FREQUENCY (GHz)
30
10
9dBm
11dBm
13dBm
15dBm
–20
30
15
=
=
=
=
–15
INPUT IP3 (dBm)
INPUT IP3 (dBm)
–10
16420-046
–10
16420-043
CONVERSION GAIN (dB)
IFIN = 100 MHz, Upper sideband (Low-Side LO)
Figure 46. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 14 of 25
Data Sheet
HMC553ALC3B
0
–5
–5
CONVERSION GAIN (dB)
0
TA = –40°C
TA = +25°C
TA = +85°C
–15
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 47. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
5
6
7
8
9
10
11
12
13
14
15
Figure 50. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
25
25
20
20
TA = –40°C
TA = +25°C
TA = +85°C
9dBm
11dBm
13dBm
15dBm
RF FREQUENCY (GHz)
30
10
=
=
=
=
–20
30
15
LO
LO
LO
LO
–15
INPUT IP3 (dBm)
15
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
10
5
5
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-050
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 48. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
16420-053
INPUT IP3 (dBm)
–10
16420-052
–10
16420-049
CONVERSION GAIN (dB)
IFIN = 100 MHz, Lower Sideband (High-Side LO)
Figure 51. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
15
TA = –40°C
TA = +25°C
TA = +85°C
5
6
7
8
5
LO
LO
LO
LO
0
5
10
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 49. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
5
6
7
8
9
10
11
12
RF FREQUENCY (GHz)
13
14
15
16420-054
INPUT P1dB (dBm)
10
16420-051
INPUT P1dB (dBm)
15
Figure 52. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 15 of 25
HMC553ALC3B
Data Sheet
0
–5
–5
CONVERSION GAIN (dB)
0
–15
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
5
25
20
20
5
7
8
9
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
11
12
13
14
15
10
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
16420-056
5
10
15
5
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Figure 57. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
20
20
TA = –40°C
TA = +25°C
TA = +85°C
LO
LO
LO
LO
15
INPUT P1dB (dBm)
15
10
5
= 9dBm
= 11dBm
= 13dBm
= 15dBm
10
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 55. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
5
6
7
8
9
10
11
12
RF FREQUENCY (GHz)
13
14
15
16420-060
5
16420-057
INPUT P1dB (dBm)
6
Figure 56. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
25
TA = –40°C
TA = +25°C
TA = +85°C
9dBm
11dBm
13dBm
15dBm
RF FREQUENCY (GHz)
30
10
=
=
=
=
–20
30
15
LO
LO
LO
LO
–15
INPUT IP3 (dBm)
INPUT IP3 (dBm)
–10
16420-058
TA = –40°C
TA = +25°C
TA = +85°C
16420-059
–10
16420-055
CONVERSION GAIN (dB)
IFIN = 4000 MHz, Upper Sideband (Low-Side LO)
Figure 58. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 16 of 25
Data Sheet
HMC553ALC3B
0
–5
–5
CONVERSION GAIN (dB)
0
TA = –40°C
TA = +25°C
TA = +85°C
–15
–20
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 59. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
5
7
8
9
10
11
12
13
14
15
Figure 62. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
25
25
20
20
TA = –40°C
TA = +25°C
TA = +85°C
6
RF FREQUENCY (GHz)
30
10
= 9dBm
= 11dBm
= 13dBm
= 15dBm
–20
30
15
LO
LO
LO
LO
–15
INPUT IP3 (dBm)
5
15
LO
LO
LO
LO
10
= 9dBm
= 11dBm
= 13dBm
= 15dBm
5
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-062
0
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
Figure 60. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
16420-065
INPUT IP3 (dBm)
–10
16420-064
–10
16420-061
CONVERSION GAIN (dB)
IFIN = 4000 MHz, Lower Sideband (High-Side LO)
Figure 63. Input IP3 vs. RF Frequency at Various LO Power Levels,
TA = 25°C
15
20
TA = –40°C
TA = +25°C
TA = +85°C
5
6
7
8
5
LO
LO
LO
LO
0
5
10
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
5
6
7
8
9
10
11
12
RF FREQUENCY (GHz)
13
14
15
16420-066
INPUT P1dB (dBm)
10
16420-063
INPUT P1dB (dBm)
15
Figure 64. Input P1dB vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Figure 61. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 13 dBm
Rev. B | Page 17 of 25
HMC553ALC3B
Data Sheet
ISOLATION AND RETURN LOSS
60
60
50
50
LO TO RF ISOLATION (dB)
40
30
TA = –40°C
TA = +25°C
TA = +85°C
20
20
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
8
9
0
Figure 65. LO to RF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
5
50
LO TO IF ISOLATION (dB)
50
TA = –40°C
TA = +25°C
TA = +85°C
20
10
11
12
13
14
15
Figure 68. LO to RF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
30
7
RF FREQUENCY (GHz)
60
40
6
16420-070
5
16420-067
0
40
30
20
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
8
9
10
10
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
0
16420-068
0
Figure 66. LO to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
5
50
RF TO IF ISOLATION (dB)
50
TA = –40°C
TA = +25°C
TA = +85°C
20
10
11
12
13
14
15
Figure 69. LO to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
60
30
7
RF FREQUENCY (GHz)
60
40
6
16420-071
LO TO IF ISOLATION (dB)
30
10
10
RF TO IF ISOLATION (dB)
40
40
30
20
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
8
9
10
10
5
6
7
8
9
10
11
12
RF FREQUENCY (GHz)
13
14
15
0
16420-069
0
Figure 67. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 13 dBm
5
6
7
10
11
12
RF FREQUENCY (GHz)
13
14
15
16420-072
LO TO RF ISOLATION (dB)
Downconverter performance at IF = 100 MHz, upper sideband (low-side LO).
Figure 70. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 18 of 25
Data Sheet
HMC553ALC3B
0
0
–5
IF RETURN LOSS (dB)
LO RETURN LOSS (dB)
–5
–10
–10
LO
LO
LO
LO
–15
= 9dBm
= 11dBm
= 13dBm
= 15dBm
–15
5
6
7
8
9
10
11
12
13
14
15
LO FREQUENCY (GHz)
0
–10
–15
–20
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
–35
–40
–45
5
6
7
8
9
10
11
12
13
14
15
RF FREQUENCY (GHz)
16420-074
RF RETURN LOSS (dB)
–5
–30
1.01
2.01
3.01
4.01
5.01
IF FREQUENCY (GHz)
6.01
7.01
8.01
Figure 73. IF Return Loss vs. IF Frequency at LO Power Levels,
TA = 25°C, LO = 10 GHz
Figure 71. LO Return Loss vs. LO Frequency at LO = 13 dBm,
TA = 25°C
–25
–25
0.01
Figure 72. RF Return Loss vs. RF Frequency at LO Power Levels,
TA = 25°C, LO = 10 GHz
Rev. B | Page 19 of 25
16420-075
–20
16420-073
–20
HMC553ALC3B
Data Sheet
IF BANDWIDTH—DOWNCONVERTER, UPPER SIDEBAND
0
–5
–5
–10
TA = –40°C
TA = +25°C
TA = +85°C
–15
–20
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
–10
–15
–20
0.1
25
25
20
20
INPUT IP3 (dBm)
30
TA = –40°C
TA = +25°C
TA = +85°C
10
5
0
0.1
2.1
3.1
4.1
5.1
6.1
7.1
Figure 76. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
15
1.1
IF FREQUENCY (GHz)
LO
LO
LO
LO
= 9dBm
= 11dBm
= 13dBm
= 15dBm
15
10
5
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
16420-077
INPUT IP3 (dBm)
Figure 74. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
= 9dBm
= 11dBm
= 13dBm
= 15dBm
0
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
Figure 77. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Figure 75. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
Rev. B | Page 20 of 25
16420-079
0.1
LO
LO
LO
LO
16420-078
CONVERSION GAIN (dB)
0
16420-076
CONVERSION GAIN (dB)
LO frequency = 8 GHz.
Data Sheet
HMC553ALC3B
IF BANDWIDTH—DOWNCONVERTER, LOWER SIDEBAND
LO frequency = 13 GHz.
0
–5
–10
–15
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
–10
–15
0.1
25
20
20
INPUT IP3 (dBm)
25
10
5
0
0.1
2.1
3.1
4.1
5.1
6.1
7.1
Figure 80. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
TA = –40°C
TA = +25°C
TA = +85°C
1.1
IF FREQUENCY (GHz)
30
15
9dBm
11dBm
13dBm
15dBm
–20
15
LO
LO
LO
LO
10
= 9dBm
= 11dBm
= 13dBm
= 15dBm
5
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
16420-081
INPUT IP3 (dBm)
Figure 78. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 13 dBm
–5
=
=
=
=
Figure 79. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 13 dBm
0
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
IF FREQUENCY (GHz)
Figure 81. Input IP3 vs. IF Frequency at Various LO Power Levels,
TA = 25°C
Rev. B | Page 21 of 25
16420-083
0.1
16420-080
–20
LO
LO
LO
LO
16420-082
TA = –40°C
TA = +25°C
TA = +85°C
CONVERSION GAIN (dB)
CONVERSION GAIN (dB)
0
HMC553ALC3B
Data Sheet
SPURIOUS AND HARMONICS PERFORMANCE
Upconversion, Upper Sideband
LO Harmonics
Spur values are (M × IFIN) + (N × LO). IFIN = 0.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the RF output power
level. N/A means not applicable.
LO = 13 dBm, all values in dBc below input LO level and
measured at RF port. N/A means not applicable.
Table 5. LO Harmonics at RF
LO Frequency (GHz)
6
8
9
10
12
14
N × LO Spur at RF Port (dBc)
2
3
4
21
51
53
41
43
64
46
49
70
45
58
82
50
45
105
50
71
N/A
1
37
38
38
37
37
39
M × IFIN
LO = 13 dBm, all values in dBc below input LO level and
measured at IF port. N/A means not applicable.
Table 6. LO Harmonics at IF
LO Frequency (GHz)
6
8
9
10
12
14
1
43
28
29
29
31
43
N × LO Spur at IF Port (dBc)
2
3
4
38
60
74
50
88
104
66
102
109
76
103
108
84
88
10
93
107
N/A
M × RF
0
1
2
3
4
1
0.6
0
67
92
82
4
N/A
68
78
91
101
Downconversion, Lower Sideband
Spur values are (M × RF) − (N × LO). RF = 14 GHz, LO =
14.1 GHz, RF power = −10 dBm, and LO power = 13 dBm.
Mixer spurious products are measured in dBc from the IF
output power level. N/A means not applicable.
M × RF
0
1
2
3
4
0
N/A
18
55
N/A
N/A
1
3
0
72
57
N/A
N × LO
2
26
40
70
93
58
3
N/A
65
77
74
95
3
64
62
75
72
22
27
20
68
76
84
84
4
61
61
61
59
43
19
N/A
N/A
N/A
N/A
N/A
IFIN = 0.1 GHz, LO = 14.1 GHz, RF power = −10 dBm, and
LO power = 13 dBm. Mixer spurious products are measured in
dBc from the RF output power level. N/A means not applicable.
M × IFIN
3
25
70
70
71
98
N × LO
2
96
94
83
59
35
10
36
58
84
92
94
Spur values are (M × IFIN) + (N × LO).
Spur values are (M × RF) − (N × LO). RF = 10.1 GHz, LO =
10 GHz, RF power = −10 dBm, and LO power = 13 dBm. Mixer
spurious products are measured in dBc from the IF output power
level. N/A means not applicable.
0
N/A
22
71
84
N/A
1
99
86
81
51
0
6
0
50
63
85
100
Upconversion, Lower Sideband
M × N Spurious Outputs
Downconversion, Upper Sideband
N × LO
2
26
44
58
93
93
−5
−4
−3
−2
−1
0
+1
+2
+3
+4
+5
0
N/A
N/A
N/A
N/A
N/A
N/A
36
81
95
101
102
4
N/A
N/A
56
89
101
Rev. B | Page 22 of 25
−5
−4
−3
−2
−1
0
+1
+2
+3
+4
+5
0
N/A
N/A
N/A
N/A
N/A
N/A
34
79
96
100
100
1
96
85
71
52
0
8
0
50
63
86
95
N × LO
2
82
84
77
60
28
20
28
61
61
84
62
3
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
4
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Data Sheet
HMC553ALC3B
THEORY OF OPERATION
The HMC553ALC3B is a general-purpose, double-balanced
mixer that can be used as an upconverter or a downconverter
from 6 GHz to 14 GHz.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 5 GHz to radio frequencies between
6 GHz and 14 GHz.
When used a downconverter, the HMC553ALC3B downconverts
radio frequencies (RF) between 6 GHz and 14 GHz to intermediate
frequencies (IF) between dc and 5 GHz.
Rev. B | Page 23 of 25
HMC553ALC3B
Data Sheet
APPLICATIONS INFORMATION
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance,
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 83). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 83 is
available from Analog Devices, Inc., upon request.
NIC
Figure 82 shows the typical application circuit for the
HMC553ALC3B. The HMC553ALC3B is a passive device and
does not require any external components. The LO and RF pins
are internally ac-coupled. The IF pin is internally dc-coupled.
When IF operation to dc is not required, use of an external
series capacitor is recommended, of a value chosen to pass the
necessary IF frequency range. When IF operation to dc is
required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
NIC
EVALUATION PCB INFORMATION
NIC
TYPICAL APPLICATION CIRCUIT
12
11
10
Table 7. List of Materials for Evaluation PCB
EV1HMC553ALC3B
Item
J1, J2
J3
U1
PCB1
HMC553ALC3B
1
9 GND
2
8
GND 3
7
5
RF
RF
GND
1
117611-7 is the raw bare PCB identifier. Reference EV1HMC553ALC3B when
ordering the complete evaluation PCB.
6
GND
GND
4
IF
LO
16420-084
GND
IF
Figure 82. Typical Application Circuit
LO
RF
117611–7
J1
553A
J2
IF
U1
J3
Figure 83. Evaluation PCB Top Layer
Rev. B | Page 24 of 25
16420-085
LO
Description
SRI 2.92 mm connector
Johnson Surface-Mount Type A (SMA) connector
HMC553ALC3B
117611-7 evaluation board
Data Sheet
HMC553ALC3B
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.36
0.30
0.24
0.08
BSC
10
0.50
BSC
PIN 1
12
1
9
3
7
6
TOP VIEW
0.90
0.80
0.70
1.60
1.50 SQ
1.40
EXPOSED
PAD
0.32
BSC
4
BOTTOM VIEW
1.00 REF
2.10 BSC
SIDE VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PKG-004837
SEATING
PLANE
03-02-2017-A
3.05
2.90 SQ
2.75
Figure 84. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC553ALC3B
HMC553ALC3BTR
HMC553ALC3BTR-R5
EV1HMC553ALC3B
1
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Moisture Sensitivity Level (MSL) Rating2
MSL3
MSL3
MSL3
All models are RoHS compliant.
The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
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D16420-0-3/19(B)
Rev. B | Page 25 of 25
Package Description
12-Terminal Ceramic LCC
12-Terminal Ceramic LCC
12-Terminal Ceramic LCC
Evaluation PCB Assembly
Package Option
E-12-4
E-12-4
E-12-4
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