HMC606LC5

GaAs, InGaP, HBT, MMIC, Ultralow Phase Noise, Distributed Amplifier, 2 GHz to 18 GHz HMC606LC5 Data Sheet Radars, electronic warfare (EW), and electronic counter measures (ECMs) Microwave radios Test instrumentation Military and space Fiber optic systems 32 31 30 29 28 27 26 25 NC VCC1 NC GND RFIN GND NC NC 1 2 3 4 5 6 7 8 HMC606LC5 24 23 22 21 20 19 18 17 NC NC GND RFOUT GND NC NC NC PACKAGE BASE GND 14968-001 APPLICATIONS NC NC NC NC NC NC NC NC FUNCTIONAL BLOCK DIAGRAM Ultralow phase noise: −160 dBc/Hz typical at 10 kHz Output power for 1 dB compression (P1dB): 15 dBm typical at 2 GHz to 12 GHz frequency range Gain: 13.5 dB typical at 2 GHz to 12 GHz frequency range Output third-order intercept (IP3): 27 dBm typical at 2 GHz to 12 GHz frequency range Supply voltage: 5.0 V at 64 mA typical 50 Ω matched input/output 32-terminal, ceramic, leadless chip carrier (LCC) NC 9 NC 10 NC 11 NC 12 NC 13 NC 14 NC 15 VCC2 16 FEATURES Figure 1. GENERAL DESCRIPTION The HMC606LC5 is a gallium arsenide (GaAs), indium gallium phosphide (InGaP), heterojunction bipolar transistor (HBT), monolithic microwave integrated circuit (MMIC) distributed amplifier housed in a 32-terminal, ceramic, leadless chip carrier (LCC) package that operates from 2 GHz to 18 GHz. With an input signal of 12 GHz, the amplifier provides ultralow phase noise performance of −160 dBc/Hz at a 10 kHz offset, representing a significant improvement over field effect transistor (FET)based distributed amplifiers. Rev. J The HMC606LC5 provides 13.5 dB of small signal gain, 27 dBm output IP3, and 15 dBm of output power for 1 dB compression while requiring 64 mA from a 5.0 V supply. The input and output of the HMC606LC5 amplifier are internally matched to 50 Ω and are internally dc blocked. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2017–2020 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC606LC5 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions .............................5 Applications ...................................................................................... 1 Interface Schematics .....................................................................5 Functional Block Diagram .............................................................. 1 Typical Performance Characteristics .............................................6 General Description ......................................................................... 1 Applications Information ................................................................8 Revision History ............................................................................... 2 Evaluation Printed Circuit Board (PCB) ...................................8 Specifications .................................................................................... 3 Outline Dimensions ..........................................................................9 Electrical Specifications ............................................................... 3 Ordering Guide .............................................................................9 Absolute Maximum Ratings ........................................................... 4 ESD Caution.................................................................................. 4 REVISION HISTORY 3/2020—Rev. I to Rev. J Deleted Figure 16, Figure 17, and Figure 18; Renumbered Sequentially ....................................................................................... 8 1/2018—Rev. H to Rev. I Changes to Figure 16, Figure 16 Caption, Figure 17, Figure 17 Caption, Figure 18, Figure 18 Caption, and Figure 19 ................ 8 Changes to Ordering Guide .......................................................... 10 10/2017—Rev. G to Rev. H Changes to Typical Performance Characteristics Section .......... 7 Added Figure 19; Renumbered Sequentially ................................ 9 Updated Outline Dimensions ...................................................... 10 Changes to Ordering Guide .......................................................... 10 8/2017—Rev. F to Rev. G Changes to Continuous Power Dissipation, PDISS Parameter, Table 4 .................................................................................................4 This Hittite Microwave Products data sheet has been reformatted to meet the styles and standards of Analog Devices, Inc. 2/2017—Rev. 05.0514 to Rev. F Updated Format .................................................................Universal Changes to Features Section and General Description Section ....... 1 Changes to Table 4 ............................................................................4 Updated Outline Dimensions .........................................................9 Changes to Ordering Guide .............................................................9 Rev. J | Page 2 of 9 Data Sheet HMC606LC5 SPECIFICATIONS ELECTRICAL SPECIFICATIONS TA = 25°C, VCC1 = VCC2 = 5 V, unless otherwise noted. Table 1. Parameter FREQUENCY RANGE GAIN Flatness Variation Over Temperature NOISE FIGURE INPUT RETURN LOSS OUTPUT Return Loss Power for 1 dB Compression (P1dB) Saturated Power (PSAT) Third-Order Intercept (IP3) PHASE NOISE At 100 Hz At 1 kHz At 10 kHz At 1 MHz SUPPLY CURRENT Min 2 10.5 12 Typ Max 12 13.5 ±1.0 0.021 5 20 Unit GHz dB dB dB/°C dB dB 15 15 17 27 dB dBm dBm dBm −140 −150 −160 −170 64 dBc/Hz dBc/Hz dBc/Hz dBc/Hz mA 95 Table 2. Parameter FREQUENCY RANGE GAIN Flatness Variation Over Temperature NOISE FIGURE INPUT RETURN LOSS OUTPUT Return Loss Power for 1 dB Compression (P1dB) Saturated Power (PSAT) Third-Order Intercept (IP3) PHASE NOISE At 100 Hz At 1 kHz At 10 kHz At 1 MHz SUPPLY CURRENT Min 2 9.5 10 Table 3. VCC1, VCC2 vs. Typical Supply Current VCC1, VCC2 (V) 4.5 5.0 5.5 ICC1 + ICC2 (mA) 53 64 71 Rev. J | Page 3 of 9 Typ Max 18 12.5 ±1.0 0.024 7 18 Unit GHz dB dB dB/°C dB dB 15 13 15 22 dB dBm dBm dBm −140 −150 −160 −170 64 dBc/Hz dBc/Hz dBc/Hz dBc/Hz mA 95 HMC606LC5 Data Sheet ABSOLUTE MAXIMUM RATINGS Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Table 4. Parameter VCC1 = VCC2 RF Input Power (RFIN) Channel Temperature Continuous Power Dissipation, PDISS (TA = 85°C, Derate 10.9 mW/°C Above 85°C) Maximum Peak Reflow Temperature (MSL3)1 Thermal Resistance (Channel to Ground Paddle) Storage Temperature Range Operating Temperature Range ESD Sensitivity (Human Body Model, HBM) 1 Rating 7V 15 dBm 175°C 0.978 W ESD CAUTION 260°C 92°C/W −65°C to +150°C −40°C to +85°C Class 0, Pass 100 V See the Ordering Guide section. Rev. J | Page 4 of 9 Data Sheet HMC606LC5 32 31 30 29 28 27 26 25 NC NC NC NC NC NC NC NC PIN CONFIGURATION AND FUNCTION DESCRIPTIONS HMC606LC5 TOP VIEW (Not to Scale) 24 23 22 21 20 19 18 17 NC NC GND RFOUT GND NC NC NC PACKAGE BASE GND NOTES 1. NC = NO CONNECT. THESE PINS MAY BE CONNECTED TO RF GROUND. PERFORMANCE WILL NOT BE AFFECTED. 2. THE EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND. 14968-020 1 2 3 4 5 6 7 8 NC 9 NC 10 NC 11 NC 12 NC 13 NC 14 NC 15 VCC2 16 NC VCC1 NC GND RFIN GND NC NC Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1, 3, 7 to 15, 17 to 19, 23 to 32 2, 16 4, 6, 20, 22 Mnemonic NC VCC1, VCC2 GND 5 RFIN 21 RFOUT EPAD Description No Connect. These pins may be connected to RF ground. Performance will not be affected. Power Supply Voltages for the Amplifier. See Figure 3 for the interface schematic. Ground. These pins must be connected to RF/dc ground. See Figure 4 for the interface schematic. RF Input. This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic. RF Output. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface schematic. Exposed Pad. The exposed pad must be connected to RF/dc ground. 14968-004 INTERFACE SCHEMATICS VCC1, VCC2 14968-002 RFIN Figure 3. VCC1, VCC2 Interface Schematic RFOUT 14968-005 14968-003 GND Figure 5. RFIN Interface Schematic Figure 6. RFOUT Interface Schematic Figure 4. GND Interface Schematic Rev. J | Page 5 of 9 HMC606LC5 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 S11 S21 S22 +85°C +25°C –40°C 10 16 0 12 GAIN (dB) –10 8 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) 0 14968-006 –30 2 4 6 8 10 12 14 Figure 7. Response (Gain and Return Loss) vs. Frequency 0 +85°C +25°C –40°C +85°C +25°C –40°C –5 OUTPUT RETURN LOSS (dB) –5 –10 –15 –20 –25 –10 –15 –20 –25 2 4 6 8 10 12 14 16 18 FREQUENCY (GHz) –30 14968-007 –30 2 4 6 8 10 12 14 16 18 FREQUENCY (GHz) Figure 8. Input Return Loss vs. Frequency for Various Temperatures 14968-010 INPUT RETURN LOSS (dB) 18 Figure 10. Gain vs. Frequency for Various Temperatures 0 Figure 11. Output Return Loss vs. Frequency for Various Temperatures 20 14 +85°C +25°C –40°C 12 15 NOISE FIGURE (dB) POUT (dBm), GAIN (dB). PAE (%) 16 FREQUENCY (GHz) 14968-009 4 –20 10 5 10 8 6 4 0 2 OUTPUT POWER GAIN PAE –10 –5 0 PIN (dBm) 5 10 0 14968-008 –5 –15 2 4 6 8 10 12 14 16 18 FREQUENCY (GHz) Figure 9. Output Power (POUT), Gain, and Power Added Efficiency (PAE) vs. Input Power (PIN) Rev. J | Page 6 of 9 Figure 12. Noise Figure vs. Frequency for Various Temperatures 14968-011 RESPONSE (dB) 20 Data Sheet HMC606LC5 20 25 +85°C +25°C –40°C +85°C +25°C –40°C 21 PSAT (dBm) 12 8 4 13 9 2 4 6 8 10 12 14 16 18 FREQUENCY (GHz) 5 14968-012 0 2 4 6 8 10 12 14 16 18 FREQUENCY (GHz) Figure 13. Power for 1 dB Compression (P1dB) vs. Frequency for Various Temperatures Figure 15. Saturated Power (PSAT) vs. Frequency for Various Temperatures 35 –80 +85°C +25°C –40°C –90 ADDITIVE PHASE NOISE (dBc/Hz) 30 OUTPUT IP3 (dBm) 17 14968-015 P1dB (dBm) 16 25 20 15 10 –100 –110 –120 –130 –140 –150 –160 4 6 8 10 12 FREQUENCY (GHz) 14 16 18 –180 100 14968-013 2 1k 10k 100k OFFSET FREQUENCY (Hz) Figure 14. Output Third-Order Intercept (IP3) vs. Frequency for Various Temperatures Figure 16. Additive Phase Noise vs. Offset Frequency, RF Frequency = 8 GHz, RF Input Power = 12 dBm (PSAT) Rev. J | Page 7 of 9 1M 14968-021 –170 5 HMC606LC5 Data Sheet APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) 14968-018 The circuit board used in the application must use RF circuit design techniques. Signal lines must have 50 Ω impedance, and the package ground leads and package bottom must be connected directly to the ground plane similar to that shown in Figure 17. Use a sufficient number of via holes to connect the top and bottom ground planes. Mount the evaluation PCB to an appropriate heat sink. The evaluation PCB shown in Figure 17 is available from Analog Devices, Inc., upon request. Figure 17. Evaluation PCB Table 6. List of Materials for Evaluation PCB (117156-HMC606LC51) Item J1, J2 J3, J4 C1, C2 C3, C4 C5, C6 U1 PCB 1 Description SRI K connectors 2 mm Molex headers 4.7 μF, tantalum capacitors 100 pF capacitors, 0402 package 1000 pF capacitors, 0603 package HMC606LC5 117325-1 evaluation PCB; circuit board material: Rogers 4350 Reference this number when ordering the complete evaluation PCB. Rev. J | Page 8 of 9 Data Sheet HMC606LC5 OUTLINE DIMENSIONS 5.05 4.90 SQ 4.75 PIN 1 INDICATOR 0.36 0.30 0.24 0.08 REF 1 0.50 BSC 3.60 3.50 SQ 3.40 EXPOSED PAD 17 0.38 0.32 0.26 TOP VIEW 1.10 1.00 0.90 PIN 1 32 25 24 8 16 9 BOTTOM VIEW 0.20 MIN 3.50 REF 4.10 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. PKG-004843 SEATING PLANE 04-24-2017-D SIDE VIEW Figure 18. 32-Terminal Ceramic Leadless Chip Carrier [LCC] (E-32-1) Dimensions shown in millimeters ORDERING GUIDE Model 1 HMC606LC5 HMC606LC5TR HMC606LC5TR-R5 117156-HMC606LC5 1 2 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C MSL Rating 2 MSL3 MSL3 MSL3 Package Description 32-Terminal Ceramic Leadless Chip Carrier [LCC] 32-Terminal Ceramic Leadless Chip Carrier [LCC] 32-Terminal Ceramic Leadless Chip Carrier [LCC] Evaluation Board All models are RoHS Compliant. See the Absolute Maximum Ratings section. ©2017–2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14968-3/20(J) Rev. J | Page 9 of 9 Package Option E-32-1 E-32-1 E-32-1