13 Gbps, Fast Rise Time XOR/XNOR Gate with
Programmable Output Voltage and Positive Supply
HMC745
Data Sheet
13 VCC
15 VR
VCC
VCC
GND 1
12 GND
50Ω
50Ω
AN 2
11 DP
AP 3
10 DN
50Ω
50Ω
50Ω
GND 4
50Ω
GND 8
BN 7
BP 6
GND 5
RF automatic test equipment (ATE) applications
Broadband test and measurement
Serial data transmission up to 13 Gbps
Digital logic systems up to 13 GHz
9
GND
VCC
VCC
PACKAGE
BASE
14819-001
APPLICATIONS
14 GND
FUNCTIONAL BLOCK DIAGRAM
Inputs terminated internally at 50 Ω
Differential and single-ended operation
Fast rise and fall times: 21 ps and 19 ps
Low power consumption: 240 mW (typical)
Programmable differential
Output voltage swing: 600 mV to 1200 mV
Propagation delay: 95 ps
Single supply: 3.3 V
16-terminal, ceramic 3 mm × 3 mm LCC package
16 VCC
FEATURES
Figure 1.
GENERAL DESCRIPTION
The HMC745 is a XOR/XNOR gate function designed to
support data transmission rates of up to 13 Gbps, and clock
frequencies as high as 13 GHz. The HMC745 also features an
output level control pin, VR, which permits loss compensation
or signal level optimization.
Inputs or outputs can be connected directly to a 50 Ω VCC
terminated system, while dc blocking capacitors may be used
if the terminating system is 50 Ω to ground. The HMC745
operates from a single 3.3 V dc supply, and is available in a
ceramic, RoHS compliant, 3 mm × 3 mm LCC package.
All input and output signals to the HMC745 are terminated
with 50 Ω to VCC on-chip, and can be either ac-coupled or
dc-coupled.
Rev. D
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©2018 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC745
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Applications ....................................................................................... 1
Interface Schematics .....................................................................5
Functional Block Diagram .............................................................. 1
Typical Performance Characteristics ..............................................6
General Description ......................................................................... 1
Theory of Operation .........................................................................8
Revision History ............................................................................... 2
Applications Information .................................................................9
Specifications..................................................................................... 3
Evaluation Printed Circuit Board (PCB)....................................9
Electrical Specifications ............................................................... 3
Outline Dimensions ....................................................................... 11
Absolute Maximum Ratings ............................................................ 4
Ordering Guide .......................................................................... 11
ESD Caution .................................................................................. 4
REVISION HISTORY
6/2018—Rev. C to Rev. D
Changes to Power Supply Voltage Parameter, Table 1 ................. 3
Changes to Input Signals Parameter and Output Signals
Parameter, Table 2............................................................................. 4
Changes to Pin 14, Pin No. Column, Table 3................................ 5
Change to Figure 19 ....................................................................... 10
Changes to Ordering Guide .......................................................... 11
10/2017—Rev. 02.0514 to Rev. C
This Hittite Microwave Products data sheet has been reformatted to
meet the styles and standards of Analog Devices, Inc.
Updated Format .................................................................. Universal
Change to Features Section, General Description Section, and
Figure 1 Caption..................................................................................1
Changes to Table 2.............................................................................4
Changes to Figure 2 Caption............................................................5
Deleted Figure 7; Renumbered Sequentially .................................5
Changes to Theory of Operation Section.......................................8
Changes to Evaluation Printed Circuit Board (PCB) Section .....9
Changes to Figure 18 Caption ...................................................... 10
Changes to Figure 19 Caption ...................................................... 11
Updated Outline Dimensions ....................................................... 12
Changes to Ordering Guide .......................................................... 12
Rev. D | Page 2 of 11
Data Sheet
HMC745
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
TA = 25°C and VCC = 3.3 V, unless otherwise noted.
Table 1.
Parameter
POWER SUPPLY VOLTAGE
Voltage
Current
MAXIMUM DATA RATE
MAXIMUM CLOCK RATE
INPUT VOLTAGE
High
Low
INPUT RETURN LOSS
OUTPUT AMPLITUDE
Single-Ended
Differential
OUTPUT VOLTAGE
High
Low
OUTPUT
Rise Time
Fall Time
OUTPUT RETURN LOSS
SMALL SIGNAL GAIN
JITTER
Random, JR
Deterministic, JD
PROPAGATION DELAY, tD
1
Test Conditions/Comments
Min
Typ
Max
Unit
3.0
3.3
72
13
13
3.6
V
mA
Gbps
GHz
3.8
3.3
10
V
V
dB
550
1100
mV p-p
mV p-p
3.25
2
V
V
21
19
10
27
ps
ps
dB
dB
2.8
2.1
Frequency < 13 GHz
Differential, 20 % to 80 %
Frequency < 13 GHz
0.2
215 − 1 PRBS input 1
2
95
ps, rms
ps p-p
ps
Deterministic jitter is calculated by simultaneously measuring the jitter of a 300 mV input, 13 GHz input, a 215 − 1 PRBS input, and a single-ended output.
Rev. D | Page 3 of 11
HMC745
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Power Supply Voltage (VCC)
Input Signals
Output Signals
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 17 mW/°C Above
85°C)
Thermal Resistance (RTH-JP), Worst Case
Junction to Package Pad
Maximum Junction Temperature
Storage Temperature Range
Operating Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Rating
VCC − 0.5 V to
3.75 V
VCC − 2 V to
VCC + 0.5 V
VCC − 1.5 V to
VCC + 0.5 V
0.68 W
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
59°C/W
125°C
−65°C to +150°C
−40°C to +85°C
Class 1C
Rev. D | Page 4 of 11
Data Sheet
HMC745
13 VCC
14 GND
16 VCC
15 VR
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND 1
12 GND
AN 2
HMC745
11 DP
AP 3
TOP VIEW
(Not to Scale)
10 DN
GND 4
NOTES
1. EXPOSED PAD. EXPOSED PAD MUST
BE CONNECTED TO GND.
14819-102
BN 7
GND
GND 8
BP 6
GND 5
9
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1, 4, 5, 8, 9, 12
2, 3
6, 7
10, 11
13, 16
14
15
Mnemonic
GND
AN, AP
BP, BN
DN, DP
VCC
GND
VR
EPAD
Description
Signal Ground.
Clock/Data Input A.
Clock/Data Input B.
Clock/Data Output.
Positive Supply.
Supply Ground.
Output Level Control. Output level can be adjusted by applying a voltage to VR per Figure 10.
Exposed Pad. Exposed pad must be connected to GND.
INTERFACE SCHEMATICS
VCC
14819-002
GND
50Ω
Figure 3. GND Interface Schematic
VR
14819-003
50Ω
Figure 4. AN, AP Interface Schematic
Figure 7. VR Interface Schematic
50Ω
14819-004
VCC
BP,
BN
14819-007
Figure 6. DN, DP Interface Schematic
VCC
AP,
AN
14819-005
DP,
DN
Figure 5. BP, BN Interface Schematic
Rev. D | Page 5 of 11
HMC745
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
90
1200
+85°C
+25°C
–40°C
75
70
65
60
1075
1050
3.3
3.4
3.5
3.6
3.7
1000
2.9
3.2
3.3
3.4
3.5
3.6
3.7
3.4
3.5
3.6
3.7
SUPPLY VOLTAGE (V)
1200
1000
800
600
400
14819-009
17
2
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
Figure 9. Rise/Fall Time vs. Supply Voltage, Frequency = 13 GHz
Figure 12. Output Voltage (VOUT) Differential vs. Frequency, VR = 3.3 V
1400
25
RISE TIME
FALL TIME
+85°C
+25°C
–40°C
1200
RISE/FALL TIME (ps)
23
1000
800
600
21
19
17
2.3
2.5
2.7
2.9
VR (V)
3.1
3.3
3.5
3.7
14819-012
VOUT DIFFERENTIAL (mV p-p)
3.3
Figure 11. Output Voltage (VOUT) Differential vs. Supply Voltage, VR = 3.3 V,
Frequency = 13 GHz
VOUT DIFFERENTIAL (mV p-p)
19
400
2.1
3.2
1400
21
3.1
3.1
SUPPLY VOLTAGE (V)
RISE TIME
FALL TIME
3.0
3.0
14819-010
3.2
23
RISE/FALL TIME (ps)
1100
14819-011
3.1
14819-008
3.0
Figure 8. DC Current vs. Supply Voltage, VR = 3.3 V, Frequency = 13 GHz
15
2.9
1125
1025
SUPPLY VOLTAGE (V)
25
1150
Figure 10. Output Voltage (VOUT) Differential vs. VR, Frequency = 13 GHz
Rev. D | Page 6 of 11
15
2.1
2.3
2.5
2.7
2.9
3.1
3.3
3.5
VR (V)
Figure 13. Rise/Fall Time vs. VR, Frequency = 13 GHz
3.7
14819-014
DC CURRENT (mA)
80
55
2.9
+85°C
+25°C
–40°C
1175
VOUT DIFFERENTIAL (mV p-p)
85
Data Sheet
HMC745
0
0
–5
RETURN LOSS (dB)
RETURN LOSS (dB)
–5
–10
–15
–20
–10
–15
–20
–25
–25
0
2
4
6
8
10
12
FREQUENCY (GHz)
14
0
2
4
6
8
10
12
FREQUENCY (GHz)
Figure 16. Output Return Loss vs. Frequency
14819-016
Figure 14. Input Return Loss vs. Frequency
–35
Figure 15. Eye Diagram, Waveform Generated with an Agilent N4903A J-Bert,
Rate = 13 Gbps, Eye Diagram Data Presented on a Tektronix CSA 8000,
Device is AC-Coupled to Scope
Rev. D | Page 7 of 11
14
14819-015
–30
14819-013
–30
HMC745
THEORY OF OPERATION
The HMC745 consists of an XOR/XNOR stage followed by
an output driver stage. The XOR/XNOR stage accepts two
differential input pairs; AN/AP and BN/BP, and gives one
differential output. The following output driving stage drives
Data Sheet
the line with a 50 Ω single-ended or 100 Ω differential. The
output stage has a tunable voltage swing feature that allows the
tune to swing between 600 mV p-p to 1200 mV p–p. All input
and output interfaces are referenced to 3.3 V with a 50 Ω resistor.
Rev. D | Page 8 of 11
Data Sheet
HMC745
APPLICATIONS INFORMATION
Table 4 is the truth table, and Figure 17 is the timing diagram.
Table 4. Truth Table
A
L
L
H
H
1
Input 1
B
L
H
L
H
Outputs1
D
L
H
H
L
A = AP – AN, B = BP – BN, D = DP – DN, H is the positive voltage level, and L is the negative voltage level.
AP
BP
td
td
80%
DP
tf
80%
20%
tr
14819-017
20%
Figure 17. Timing Diagram
EVALUATION PRINTED CIRCUIT BOARD (PCB)
The circuit board used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance
while the package ground leads must be connected directly to
the ground plane. The exposed package base must be connected
to GND. A sufficient number of via holes must be used to connect
the top and bottom ground planes. The evaluation circuit board
shown is available from Analog Devices, Inc., upon request.
Table 5. Connector Description
Item
J1
J2
J3
J4
J5
J6
J7
J8
J9
Description
AN
AP
BP
BN
DN
DP
GND
VR
VCC
Table 6. List of Materials for Evaluation PCB 1225171
Item
J1 to J6
J7 to J9
JP1
C1, C2
C3 to C5
R2
U1
PCB2
1
2
Description
PCB mount SMA RF connectors
DC pin
Shorting jumper
4.7 µF capacitor, tantalum
100 pF capacitor, 0402 package
10 Ω resistor, 0603 package
HMC745LC3, high speed logic, XOR/XNOR
122515 evaluation board
Reference this number when ordering complete evaluation PCB.
The circuit board material is Arlon 25FR.
Rev. D | Page 9 of 11
Data Sheet
14819-019
HMC745
Figure 18. Evaluation Board
J9
+
+
JP1
C3
100pF
C5
100pF
13
16
J2
1, 4, 5, 8
9, 12, 14
GND
DP 11
VR
2 AN
3 AP
DN 10
BP
6
C2
4.7µF
C4
100pF
15
VCC VCC
J1
R2
10Ω
J7
J6
J5
BN
7
J3 J4
Figure 19. Evaluation Board Schematic
Rev. D | Page 10 of 11
14819-018
C1
4.7µF
J8
Data Sheet
HMC745
OUTLINE DIMENSIONS
3.05
2.90 SQ
2.75
0.36
0.30
0.24
0.08
BSC
13
PIN 1
16
1
12
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
9
4
5
8
TOP VIEW
PKG-004838
0.90
0.80
0.70
0.32
BSC
BOTTOM VIEW
1.50
REF
2.10 BSC
SIDE VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
SEATING
PLANE
02-24-2017-C
PIN 1
INDICATOR
Figure 20. 16-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-16-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC745LC3
HMC745LC3TR
HMC745LC3TR-R5
122517-HMC745LC3
1
2
MSL Rating2
MSL3
MSL3
MSL3
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Terminal Ceramic Leadless Chip Carrier [LCC]
16-Terminal Ceramic Leadless Chip Carrier [LCC]
16-Terminal Ceramic Leadless Chip Carrier [LCC]
Evaluation Board
All models are RoHS compliant.
Maximum peak reflow temperature of 260°C.
©2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14819-0-6/18(D)
Rev. D | Page 11 of 11
Package Option
E-16-1
E-16-1
E-16-1