GaAs, MMIC, Fundamental Mixer,
3 GHz to 10 GHz
HMC787A
Data Sheet
NIC
NIC
12
11
10
HMC787A
RF
GND 3
7
GND
4
5
6
GND
GND
8
IF
9
LO 2
GND 1
PACKAGE
BASE
13608-001
NIC
FUNCTIONAL BLOCK DIAGRAM
Conversion loss: 9 dB typical at 3 GHz to 9 GHz
Local oscillator (LO) to radio frequency (IF) isolation:
43 dB typical at 3 GHz to 9 GHz
RF to intermediate frequency (IF) isolation: 26 dB typical at
3 GHz to 9 GHz
Input third-order intercept (IP3): 24 dBm typical at
3 GHz to 9 GHz
Input 1 dB compression point (P1dB): 17 dBm typical at
3 GHz to 9 GHz
Input second-order intercept (IP2): 67 dBm typical at
3 GHz to 9 GHz
Passive double-balanced topology
Wide IF frequency range: dc to 4 GHz
12-terminal, ceramic, leadless chip carrier (LCC) package
GND
FEATURES
Figure 1.
APPLICATIONS
Microwave radio
Industrial, scientific, and medical (ISM) band and ultrawide
band (UWB) radio
Test equipment and sensors
Military end use
GENERAL DESCRIPTION
The HMC787A is a general-purpose, double balanced mixer in
a 12-terminal, RoHS compliant, ceramic leadless chip carrier
(LCC) package that can be used as an upconverter or downconverter from 3 GHz to 10 GHz. This mixer is fabricated in a
gallium arsenide (GaAs), metal semiconductor field effect
transistor (MESFET) process and requires no external components
or matching circuitry.
Rev. C
The HMC787A provides excellent local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF) isolation
due to optimized balun structures and operates with a LO drive
level of 17 dBm. The ceramic LCC package eliminates the need
for wire bonding and is compatible with high volume, surfacemount manufacturing techniques.
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HMC787A
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Downconverter Performance ......................................................6
Applications ....................................................................................... 1
Upconverter Performance ......................................................... 10
Functional Block Diagram .............................................................. 1
Isolation and Return Loss Performance .................................. 12
General Description ......................................................................... 1
Spurious and Harmonics Performance ................................... 14
Revision History ............................................................................... 2
Theory of Operation ...................................................................... 15
Specifications..................................................................................... 3
Applications Information .............................................................. 16
Absolute Maximum Ratings ............................................................ 4
Typical Application Circuit ....................................................... 16
Thermal Resistance ...................................................................... 4
Evaluation PCB Information .................................................... 16
ESD Caution .................................................................................. 4
Outline Dimensions ....................................................................... 17
Pin Configuration and Function Descriptions ............................. 5
Ordering Guide .......................................................................... 17
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
REVISION HISTORY
9/2017—Rev. B to Rev. C
Changes to Table 4 ............................................................................ 5
5/2017—Rev. A to Rev. B
Changed E-12-1 to E-12-4............................................ Throughout
Change to Figure 1 ........................................................................... 1
Change to Figure 2 ........................................................................... 5
Updated Outline Dimensions ....................................................... 17
Changes to Ordering Guide .......................................................... 17
2/2017—Rev. 0 to Rev. A
Changes to Storage Temperature Range Parameter, Table 2....... 4
10/2016—Revision 0: Initial Version
Rev. C | Page 2 of 17
Data Sheet
HMC787A
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, LO = 17 dBm, and all measurements performed as downconverter, unless otherwise noted.
Table 1.
Parameter
FREQUENCY RANGE
RF
LO
IF
LO DRIVE LEVEL
PERFORMANCE AT RF = 3 GHz to 9 GHz
Conversion Loss
Single Sideband (SSB) Noise Figure
Input Third-Order Intercept (IP3)
Input 1 dB Compression Point (P1dB)
Input Second-Order Intercept (IP2)
RF to IF Isolation
LO to RF Isolation
LO to IF Isolation
PERFORMANCE AT RF = 9 GHz to 10 GHz
Conversion Loss
SSB Noise Figure
Input IP3
Input P1dB
Input IP2
RF to IF Isolation
LO to RF Isolation
LO to IF Isolation
Min
Typ
Max
Unit
10
10
4
GHz
GHz
GHz
dBm
9
9
24
17
67
26
48
43
11
dB
dB
dBm
dBm
dB
dB
dB
dB
9
9
24
15
66
26
47
42
11
dB
dB
dBm
dBm
dB
dB
dB
dB
3
3
DC
17
15
15
35
15
15
25
Rev. C | Page 3 of 17
HMC787A
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
RF Input Power
LO Input Power
IF Input Power
IF Source and Sink Current
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 11.6 mW/°C Above 85°C)
Maximum Junction Temperature
Maximum Peak Reflow Temperature (MSL3)1
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
1
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Rating
28 dBm
28 dBm
28 dBm
12 mA
1044 mW
Table 3. Thermal Resistance
Package Type
E-12-41
175°C
260°C
−40°C to +85°C
−65°C to +150°C
1
θJA
120
θJC
86
Unit
°C/W
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
1500 V (Class 1C)
1000 V (Class C5)
See the Ordering Guide section.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. C | Page 4 of 17
Data Sheet
HMC787A
NIC
HMC787A
TOP VIEW
(Not to Scale)
4
5
6
9
GND
8
RF
7
GND
PACKAGE
BASE
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
2. EXPOSED PAD. EXPOSED PAD MUST
BE CONNECTED TO RF/DC GROUND.
13608-002
NIC
10
GND
GND 3
11
IF
LO 2
12
GND
GND 1
NIC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
1, 3, 4, 6, 7, 9
2
5
Mnemonic
GND
LO
IF
8
10 to 12
RF
NIC
EPAD
Description
Ground. Connect the package bottom to RF/dc ground. See Figure 3 for the GND interface schematic.
Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.
Intermediate Frequency. This pin is dc-coupled. For applications not requiring operation to dc, externally
block this pin using a series capacitor whose value is chosen to pass the necessary IF frequency range. For
operation to dc, this pin must not source or sink more than 12 mA of current or device nonfunction and
possible device failure results. See for Figure 5 the IF interface schematic.
Radio Frequency. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the RF interface schematic.
Not Internally Connected.
Exposed Pad. Exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
13608-005
IF
13608-003
GND
Figure 5. IF Interface Schematic
Figure 3. GND Interface Schematic
RF
13608-004
13608-006
LO
Figure 4. LO Interface Schematic
Figure 6. RF Interface Schematic
Rev. C | Page 5 of 17
HMC787A
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Data taken as downconverter, lower sideband (high-side LO), TA = 25°C, and LO drive level = 17 dBm, unless otherwise noted.
Measurements taken with LO amplifier in line with lab bench LO source.
0
0
CONVERSION GAIN (dB)
–6
–8
–10
–12
–14
–12
–14
–18
–18
3
4
5
6
7
8
9
10
11
–20
5
6
7
8
9
10
11
50
45
+85°C
+25°C
–40°C
40
13dBm
15dBm
17dBm
19dBm
21dBm
40
35
INPUT IP3 (dBm)
35
30
25
20
30
25
20
15
15
10
10
5
5
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
0
13608-008
3
Figure 8. Input Third-Order Intercept (IP3) vs. RF Frequency for Various
Temperatures, IF = 100 MHz, LO Power = 17 dBm
3
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
13608-011
45
Figure 11. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO
Powers, IF = 100 MHz, Temperature = 25°C)
100
100
90
90
+85°C
+25°C
–40°C
80
80
70
60
40
60
50
40
30
30
20
20
10
10
4
5
6
7
8
RF FREQUENCY (GHz)
9
10
11
0
13608-009
3
Figure 9. Input Second-Order Intercept (IP2) vs. RF Frequency for Various
Temperatures, IF = 100 MHz, LO Power = 17 dBm
13dBm
15dBm
17dBm
19dBm
21dBm
3
4
5
6
7
8
RF FREQUENCY (GHz)
9
10
11
13608-012
INPUT IP2 (dBm)
70
50
0
4
Figure 10. Conversion Gain vs. RF Frequency for Various LO Powers,
IF = 100 MHz, Temperature = 25°C
50
0
3
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency for Various Temperatures,
IF = 100 MHz, LO Power = 17 dBm
INPUT IP3 (dBm)
–8
–10
–16
RF FREQUENCY (GHz)
INPUT IP2 (dBm)
–6
–16
–20
13dBm
15dBm
17dBm
19dBm
21dBm
–4
13608-007
CONVERSION GAIN (dB)
–2
+85°C
+25°C
–40°C
–4
13608-010
–2
Figure 12. Input Second-Order Intercept (IP2) vs. RF Frequency for Various LO
Powers, IF = 100 MHz, Temperature = 25°C
Rev. C | Page 6 of 17
Data Sheet
HMC787A
20
18
NOISE FIGURE (dB)
14
12
10
8
6
10
8
6
2
2
3.5
4.5
6.5
5.5
7.5
8.5
9.5
10.5
Figure 13. Single Sidband Noise Figure vs. RF Frequency for Various
Temperatures, IF = 100 MHz, LO Power = 17 dBm
0
2.5
5.5
6.5
7.5
8.5
9.5
10.5
0
–2
–10
–12
–14
–6
–8
–10
–12
–14
–16
–16
–18
–18
5
6
7
8
9
10
RF FREQUENCY (GHz)
–20
13608-014
4
3
4
5
6
7
8
9
10
RF FREQUENCY (GHz)
Figure 14. Conversion Gain vs. RF Frequency for Various Temperatures,
IF = 1100 MHz, LO Power = 17 dBm
13608-017
CONVERSION GAIN (dB)
–8
3
13dBm
15dBm
17dBm
19dBm
21dBm
–4
–6
Figure 17. Conversion Gain vs. RF Frequency for Various LO Powers,
IF = 1100 MHz, Temperature = 25°C
50
50
45
45
+85°C
+25°C
–40°C
40
40
35
25
20
30
25
20
15
15
10
10
5
5
4
5
6
7
RF FREQUENCY (GHz)
8
9
10
0
13608-015
3
Figure 15. Input Third-Order Intercept (IP3) vs. RF Frequency for Various
Temperatures, IF = 1100 MHz, LO Power = 17 dBm
13dBm
15dBm
17dBm
19dBm
21dBm
3
4
5
6
7
RF FREQUENCY (GHz)
8
9
10
13608-018
INPUT IP3 (dBm)
35
30
0
4.5
Figure 16. Single Sidband Noise Figure vs. RF Frequency for Various LO
Powers, IF = 100 MHz, Temperature = 25°C
+85°C
+25°C
–40°C
–4
–20
3.5
RF FREQUENCY (GHz)
0
–2
CONVERSION GAIN (dB)
12
4
RF FREQUENCY (GHz)
INPUT IP3 (dBm)
14
4
0
2.5
15dBm
17dBm
19dBm
16
13608-013
NOISE FIGURE (dB)
18
+85°C
+25°C
–40°C
16
13608-016
20
Figure 18. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO
Powers, IF = 1100 MHz, Temperature = 25°C
Rev. C | Page 7 of 17
HMC787A
Data Sheet
0
0
CONVERSION GAIN (dB)
–6
–8
–10
–12
–14
–12
–14
–18
–18
5
6
7
8
9
10
–20
7
8
9
10
50
45
13dBm
15dBm
17dBm
19dBm
21dBm
45
+85°C
+25°C
–40°C
40
40
35
25
20
30
25
20
15
15
10
10
5
5
6
7
8
9
10
RF FREQUENCY (GHz)
0
13608-020
5
Figure 20. Input Third-Order Intercept (IP3) vs. RF Frequency for Various
Temperatures, IF = 3000 MHz, LO Power = 17 dBm
5
6
7
8
9
10
RF FREQUENCY (GHz)
13608-023
INPUT IP3 (dBm)
35
30
Figure 23. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO
Powers, IF = 3000 MHz, Temperature = 25°C
100
100
90
90
+85°C
+25°C
–40°C
80
80
70
60
50
40
60
50
40
30
30
20
20
10
10
6
7
8
RF FREQUENCY (GHz)
9
10
0
13608-021
5
Figure 21. Input Second-Order Intercept (IP2) vs. RF Frequency at Various
Temperatures, IF = 3000 MHz, LO Power = 17 dBm
13dBm
15dBm
17dBm
19dBm
21dBm
5
6
7
8
RF FREQUENCY (GHz)
9
10
13608-024
INPUT IP2 (dBm)
70
0
6
Figure 22. Conversion Gain vs. RF Frequency for Various LO Powers,
IF = 3000 MHz, Temperature = 25°C
50
0
5
RF FREQUENCY (GHz)
Figure 19. Conversion Gain vs. RF Frequency for Various Temperatures,
IF = 3000 MHz, LO Power = 17 dBm
INPUT IP3 (dBm)
–8
–10
–16
RF FREQUENCY (GHz)
INPUT IP2 (dBm)
–6
–16
–20
13dBm
15dBm
17dBm
19dBm
21dBm
–4
13608-019
CONVERSION GAIN (dB)
–2
+85°C
+25°C
–40°C
–4
13608-022
–2
Figure 24. Input Second-Order Intercept (IP2) vs. RF Frequency for Various LO
Powers, IF = 3000 MHz, Temperature = 25°C
Rev. C | Page 8 of 17
Data Sheet
HMC787A
0
0
CONVERSION GAIN (dB)
–8
–10
–12
–14
–12
–14
–18
–18
0
1
2
3
4
5
–20
2
3
4
5
50
40
13dBm
15dBm
17dBm
19dBm
20dBm
45
+85°C
+25°C
–40°C
40
35
INPUT IP3 (dBm)
35
30
25
20
30
25
20
15
15
10
10
5
5
1
2
3
4
5
IF FREQUENCY (GHz)
0
13608-026
0
Figure 26. Input Third-Order Intercept (IP3) vs. IF Frequency for Various
Temperatures, LO = 9510 MHz, LO Power = 17 dBm
20
15
10
5
6
7
8
RF FREQUENCY (GHz)
9
10
11
13608-027
5
4
2
3
4
5
Figure 29. Input Third-Order Intercept (IP3) vs. IF Frequency for Various LO
Powers, LO = 9510 MHz, LO Power = 17 dBm
+85°C
+25°C
–40°C
3
1
IF FREQUENCY (GHz)
30
25
0
13608-029
45
0
1
Figure 28. Conversion Gain vs. IF Frequency for Various LO Powers,
LO = 9510 MHz, LO Power = 17 dBm
50
0
0
IF FREQUENCY (GHz)
Figure 25. Conversion Gain vs. IF Frequency for Various Temperatures,
LO = 9510 MHz, LO Power = 17 dBm
INPUT IP3 (dBm)
–8
–10
–16
IF FREQUENCY (GHz)
P1dB (dBm)
–6
–16
13608-025
CONVERSION GAIN (dB)
–4
–6
–20
13dBm
15dBm
17dBm
19dBm
20dBm
–2
+85°C
+25°C
–40°C
–4
13608-028
–2
Figure 27. Input 1 dB Gain Compression (P1dB) vs. RF Frequency for Various
Temperatures, IF = 100 MHz, LO = 17 dBm
Rev. C | Page 9 of 17
HMC787A
Data Sheet
UPCONVERTER PERFORMANCE
Data taken as upconverter, lower sideband (high-side LO), TA = 25°C, and LO drive level = 17 dBm, unless otherwise noted.
Measurements taken with LO amplifier in line with lab bench LO source.
0
–2
CONVERSION GAIN (dB)
–4
–6
–8
–10
–12
–14
–12
–14
–18
–18
3
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
–20
5
6
7
8
9
10
11
50
45
15dBm
17dBm
19dBm
21dBm
45
+85°C
+25°C
–40°C
40
40
35
25
20
30
25
20
15
15
10
10
5
5
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
0
13608-031
3
Figure 31. Input Third-Order Intercept (IP3) vs. RF Frequency for Various
Temperatures, IF = 100 MHz, LO Power = 17 dBm
3
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
13608-034
INPUT IP3 (dBm)
35
30
Figure 34. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO
Powers, IF = 100 MHz, Temperature = 25°C
0
0
–2
+85°C
+25°C
–40°C
–6
–8
–10
–12
–14
–6
–8
–10
–12
–14
–16
–18
–18
4
5
6
7
8
RF FREQUENCY (GHz)
9
10
11
13608-032
–16
3
13dBm
15dBm
17dBm
19dBm
21dBm
–4
CONVERSION GAIN (dB)
–4
Figure 32. Conversion Gain vs. RF Frequency for Various Temperatures,
IF = 1100 MHz, LO Power = 17 dBm
Rev. C | Page 10 of 17
–20
3
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 35. Conversion Gain vs. RF Frequency for Various LO Powers,
IF = 1100 MHz, Temperature = 25°C
13608-035
–2
–20
4
Figure 33. Conversion Gain vs. RF Frequency for Various LO Powers,
IF = 100 MHz, Temperature = 25°C
50
0
3
RF FREQUENCY (GHz)
Figure 30. Conversion Gain vs. RF Frequency for Various Temperatures,
IF = 100 MHz, LO Power = 17 dBm
INPUT IP3 (dBm)
–8
–10
–16
–20
CONVERSION GAIN (dB)
–6
–16
13608-030
CONVERSION GAIN (dB)
–4
15dBm
17dBm
19dBm
21dBm
–2
+85°C
+25°C
–40°C
13608-033
0
Data Sheet
HMC787A
50
50
45
+85°C
+25°C
–40°C
40
INPUT IP3 (dBm)
35
30
25
20
20
10
10
5
5
3
4
5
6
7
8
9
10
11
Figure 36. Input Third-Order Intercept (IP3) vs. RF Frequency for Various
Temperatures at IF = 1100 MHz, LO Power = 17 dBm
0
5
6
7
8
10
9
11
0
–2
–10
–12
–14
–6
–8
–10
–12
–14
–16
–16
–18
–18
8
9
10
RF FREQUENCY (GHz)
–20
35
INPUT IP3 (dBm)
35
30
25
20
20
15
10
5
5
10
0
13608-038
RF FREQUENCY (GHz)
9
Figure 38. Input Third-Order Intercept (IP3) vs. RF Frequency for Various
Temperatures at IF = 3000 MHz, LO Power = 17 dBm
13dBm
15dBm
17dBm
19dBm
21dBm
25
10
8
10
30
15
7
9
45
40
6
8
50
40
5
7
Figure 40. Conversion Gain vs. RF Frequency for Various LO Powers,
IF = 3000 MHz, Temperature = 25°C
+85°C
+25°C
–40°C
45
6
RF FREQUENCY (GHz)
Figure 37. Conversion Gain vs. RF Frequency for Various Temperatures,
IF = 3000 MHz, LO Power = 17 dBm
50
5
5
6
7
8
RF FREQUENCY (GHz)
9
10
13608-041
7
13608-037
6
13608-040
CONVERSION GAIN (dB)
–8
5
13dBm
15dBm
17dBm
19dBm
21dBm
–4
–6
0
4
Figure 39. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO
Powers at IF = 1100 MHz, Temperature = 25°C
+85°C
+25°C
–40°C
–4
–20
3
RF FREQUENCY (GHz)
0
–2
CONVERSION GAIN (dB)
25
15
RF FREQUENCY (GHz)
INPUT IP3 (dBm)
30
15
13608-036
INPUT IP3 (dBm)
35
0
13dBm
15dBm
17dBm
19dBm
21dBm
40
13608-039
45
Figure 41. Input Third-Order Intercept (IP3) vs. RF Frequency for Various LO
Powers at IF = 3000 MHz, Temperature = 25°C
Rev. C | Page 11 of 17
HMC787A
Data Sheet
ISOLATION AND RETURN LOSS PERFORMANCE
Data taken as downconverter, lower sideband (high-side LO), IF = 100 MHz, TA = 25°C, and LO drive level = 17 dBm, unless otherwise
noted. Measurements taken with LO amplifier in line with lab bench LO source.
80
80
60
ISOLATION (dB)
LO TO RF
50
40
LO TO IF
30
10
3
4
5
6
7
8
9
10
11
Figure 42. LO to RF and LO to IF Isolation vs. RF Frequency for Various
Temperatures, LO Power = 17 dBm
0
5
6
7
8
9
10
11
Figure 45. LO to RF and LO to IF Isolation vs. RF Frequency for Various LO
Powers, Temperature = 25°C
+85°C
+25°C
–40°C
15dBm
17dBm
19dBm
70
60
50
40
30
50
40
30
20
20
10
10
3
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
0
3
4
5
6
7
8
9
10
11
RF FREQUENCY (GHz)
Figure 43. RF to IF Isolation vs. RF Frequency for Various Temperatures,
LO Frequency = 7000 MHz, LO Power = 17 dBm
13608-046
ISOLATION (dB)
60
13608-043
Figure 46. RF to IF Isolation vs. RF Frequency for Various LO Powers,
Temperature = 25°C, LO Frequency = 7000 MHz
10
5
+85°C
+25°C
–40°C
5
0
–5
RETURN LOSS (dB)
0
–5
–10
–15
–20
–10
–15
–20
–25
+85°C
+25°C
–40°C
–30
–25
3
4
5
6
7
8
LO FREQUENCY (GHz)
9
10
11
13608-044
–35
Figure 44. LO Return Loss vs. LO Frequency at Various Temperatures,
LO Power = 17 dBm
Rev. C | Page 12 of 17
–40
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
IF FREQUENCY (GHz)
Figure 47. IF Return Loss vs. IF Frequency at Various Temperatures,
LO Power = 17 dBm, LO Frequency = 6 GHz
13608-047
ISOLATION (dB)
4
80
70
–30
3
RF FREQUENCY (GHz)
80
0
LO TO IF
30
10
RF FREQUENCY (GHz)
LO RETURN LOSS (dB)
40
20
0
LO TO RF
50
20
13608-042
ISOLATION (dB)
60
19dBm
17dBm
15dBm
70
13608-045
+85°C
+25°C
–40°C
70
Data Sheet
HMC787A
5
0
–10
–15
–20
–25
+85°C
+25°C
–40°C
–30
–35
–40
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
13608-050
RF RETURN LOSS (dB)
–5
Figure 48. RF Return Loss vs. RF Frequency at Various Temperatures,
LO Power = 17 dBm, LO Frequency = 6 GHz
Rev. C | Page 13 of 17
HMC787A
Data Sheet
SPURIOUS AND HARMONICS PERFORMANCE
Mixer spurious products are measured in dBc from the IF output power level, unless otherwise noted. Spur values are (M × RF) − (N × LO).
LO Harmonics
M × N Spurious Outputs, IF = 3000 MHz
LO = 17 dBm, and all values in dBc below input LO level
measured at RF port.
RF = 3.1 GHz, LO = 6.1 GHz, RF power = −5 dBm, and
LO power = 17 dBm.
Table 5. Harmonics of LO
LO Frequency (GHz)
3
6
10
1
55
46
41
NLO Spur at RF Port
2
3
53
58
45
64
57
61
4
59
76
61
M × RF
0
1
2
3
4
0
Not applicable
13.6
90.7
91
90.2
N × LO
1
2
13
28
0
47
99
89
93
94
89
99
3
44
45
89
87
92
4
44
64
86
87
90
M × N Spurious Outputs, IF = 100 MHz
RF = 6.1 GHz, LO = 3.1 GHz, RF power = −5 dBm, and
LO power = 17 dBm.
RF = 3.1 GHz, LO = 3 GHz, RF power = −5 dBm, and
LO power = 17 dBm.
M × RF
0
1
2
3
4
0
Not applicable
12.3
90.1
91.1
89.1
N × LO
1
2
14
38
0
25
93
98
90
92
88
91
3
32
27
94
98
94
4
54
60
90
94
98
M × RF
0
1
2
3
4
0
Not applicable
16.3
89.1
86.2
83.1
3
42
35
90
95
90
4
42
50
88
87
96
M × RF
RF =10.1 GHz, LO = 10 GHz, RF power = −5 dBm, and
LO power = 17 dBm.
M × RF
0
1
2
3
4
0
Not applicable
19.9
84.3
78.4
72.4
N × LO
1
2
4
39
0
87
84
97
82
87
78
83
3
36
83
87
97
89
N × LO
1
2
13
39
0
24
88
89
86
89
86
85
3
28
18
92
87
87
4
50
90
97
89
89
RF = 10.1 GHz, LO = 7.1 GHz, RF power = −5 dBm, and
LO power = 17 dBm.
RF = 6.1 GHz, LO = 6 GHz, RF power = −5 dBm, and
LO power = 17 dBm.
N × LO
1
2
12
26
0
36
91
97
88
88
87
89
M × RF
0
1
2
3
4
0
Not applicable
16
89
86
82
4
43
79
83
87
95
Rev. C | Page 14 of 17
0
1
2
3
4
0
Not applicable
17.7
82.9
75
68
N × LO
1
2
11
28
0
30
86
84
81
86
76
79
3
41
35
94
87
83
4
54
52
86
92
87
Data Sheet
HMC787A
THEORY OF OPERATION
The HMC787A is a general-purpose, double balanced mixer in
a 12-terminal, RoHS compliant, ceramic leadless chip carrier
(LCC) package that can be used as an upconverter or downconverter from 3 GHz to 10 GHz. This mixer is fabricated in a
gallium arsenide (GaAs), metal semiconductor field effect
transistor (MESFET) process and requires no external components
or matching circuitry. The HMC787A provides excellent local
oscillator (LO) to radio frequency (RF) and LO to intermediate
frequency (IF) isolation due to optimized balun structures and
operates with a LO drive level of 17 dBm. The ceramic LCC
package eliminates the need for wire bonding and is compatible
with high volume, surface-mount manufacturing techniques.
Rev. C | Page 15 of 17
HMC787A
Data Sheet
APPLICATIONS INFORMATION
The circuit board used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance, and
the package ground leads and exposed pad must be connected
directly to the ground plane similarly to that shown in Figure 50.
Use a sufficient number of via holes to connect the top and
bottom ground planes. The evaluation circuit board shown in
Figure 50 is available from Analog Devices, Inc., upon request.
8
3
7
RF
IF
13608-048
6
9
2
4
1
5
LO
11
Figure 49 shows the typical application circuit for the HMC787A.
The LO and RF pins are internally ac-coupled. When IF operation
is not required until dc, it is recommended to use an ac-coupled
capacitor at the IF port. When IF operation to dc is required,
do not exceed the IF source and sink currents specified in the
Absolute Maximum Ratings section.
10
EVALUATION PCB INFORMATION
12
TYPICAL APPLICATION CIRCUIT
13608-049
Figure 49. Typical Applications Circuit
Figure 50. Evaluation PCB Top Layer
Table 6. Bill of Materials for the EV1HMC787ALC3B Evaluation PCB
Quantity
1
2
1
1
Reference Designator
J1 to J2
J3
U1
Part Number
117611-1
104935
105192
HMC787ALCB
Rev. C | Page 16 of 17
Description
PCB, evaluation board
2.92 mm connectors, SRI
SMA connector, Johnson
Device under test (DUT)
Data Sheet
HMC787A
OUTLINE DIMENSIONS
0.36
0.30
0.24
0.08
BSC
0.50
BSC
PIN 1
12
10
1
9
3
7
0.90
0.80
0.70
6
0.32
BSC
TOP VIEW
1.60
1.50 SQ
1.40
EXPOSED
PAD
4
BOTTOM VIEW
1.00 REF
2.10 BSC
SIDE VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PKG-004837
SEATING
PLANE
03-02-2017-A
PIN 1
INDICATOR
3.05
2.90 SQ
2.75
Figure 51. 12-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
HMC787ALC3B
Temperature
Range
−40°C to +85°C
Package Body
Material
Alumina Ceramic
HMC787ALC3BTR
−40°C to +85°C
Alumina Ceramic
Gold over
Nickel
MSL3
HMC787ALC3BTR-R5
−40°C to +85°C
Alumina Ceramic
Gold over
Nickel
MSL3
Lead Finish
Gold over
Nickel
MSL
Rating 2
MSL3
EV1HMC787ALC3B
The HMC787ALC3B, the HMC787ALC3BTR, and the HMC787ALC3BTR-R5 are RoHS Compliant Parts.
See the Absolute Maximum Ratings section.
3
The HMC787ALC3B, the HMC787ALC3BTR, and the HMC787ALC3BTR-R5 have a four digit lot number.
1
2
©2016–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13608-0-9/17(C)
Rev. C | Page 17 of 17
Package
Description
12-Terminal
Ceramic Leadless
Chip Carrier [LCC]
12-Terminal
Ceramic Leadless
Chip Carrier [LCC]
12-Terminal
Ceramic Leadless
Chip Carrier [LCC]
Evaluation PCB
Assembly
Package
Option
E-12-4
Package
Marking 3
787A
XXXX
E-12-4
787A
XXXX
E-12-4
787A
XXXX
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