2.5 GHz to 8.5 GHz, I/Q Mixer
HMC8193
Data Sheet
19 NIC
20 NIC
21 NIC
22 NIC
HMC8193
18
NIC
NIC 2
17
NIC
GND 3
16
GND
13
NIC
GND 12
NIC 6
IF2 11
GND
NIC 10
LO
14
IF1 9
15
NIC 8
RF 4
GND 5
PACKAGE
BASE
GND
14353-001
NIC 1
23 NIC
24 NIC
FUNCTIONAL BLOCK DIAGRAM
Passive I/Q mixer
RF and LO range: 2.5 GHz to 8.5 GHz
Wide IF range: dc to 4 GHz
Single-ended RF, LO, and IF
Conversion loss (downconverter): 9 dB (typical)
Image rejection (downconverter): 25 dBc (typical)
SSB noise figure (downconverter): 11.5 dB (typical)
Input IP3 (downconverter): 20 dBm (typical)
Input P1dB compression point (downconverter): 13 dBm
(typical)
Input IP2 (downconverter): 58 dBm (typical)
RF to IF isolation (downconverter): 22 dB (typical)
LO to RF isolation (downconverter): 48 dB (typical)
LO to IF isolation (downconverter): 38 dB (typical)
Amplitude balance (downconverter): ±0.5 dB (typical)
Phase balance (downconverter): ±5° (typical)
RF return loss: 13 dB (typical)
LO return loss 13 dB (typical)
IF return loss: 17 dB (typical)
Exposed pad, 4 mm × 4 mm, 24-terminal, ceramic
LCC package
NIC 7
FEATURES
Figure 1.
APPLICATIONS
Test and measurement instrumentation
Military, aerospace, and radar
Direct conversion receivers
GENERAL DESCRIPTION
The HMC8193 is a passive, in phase/quadrature (I/Q), monolithic
microwave integrated circuit (MMIC) mixer that can be used
either as an image rejection mixer for receiver operations, or as
a single-sideband upconverter for transmitter operations from
2.5 GHz to 8.5 GHz. The inherent I/Q architecture of the
HMC8193 offers excellent image rejection and thereby eliminates
the need for expensive filtering of unwanted sidebands. The
mixer also provides excellent local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF) isolation
and reduces the effect of LO leakage to ensure signal integrity.
Rev. B
Being the HMC8913 is a passive mixer, it does not require any
dc power sources. The device offers a lower noise figure than an
active mixer, ensuring superior dynamic range for high
performance and precision applications.
The HMC8193 is fabricated on a gallium arsenide (GaAs),
metal semiconductor field effect transistor (MESFET) process
and uses Analog Devices, Inc., mixer cells and a 90° hybrid. It is
available in a compact, 4 mm × 4 mm, 24-lead LCC package
and operates over the −40°C to +85°C temperature range. An
evaluation board for this device is also available.
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Tel: 781.329.4700 ©2017–2018 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
HMC8193
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Upconverter Performance ......................................................... 18
Applications ....................................................................................... 1
Isolation and Return Loss ......................................................... 24
Functional Block Diagram .............................................................. 1
IF Bandwidth .............................................................................. 26
General Description ......................................................................... 1
Amplitude and Phase Imbalance ............................................. 27
Revision History ............................................................................... 2
Spurious and Harmonics Performance ................................... 29
Specifications..................................................................................... 3
Theory of Operation ...................................................................... 32
Absolute Maximum Ratings ............................................................ 4
Applications Information .............................................................. 33
Thermal Resistance ...................................................................... 4
Soldering Information and Recommended Land Pattern .... 34
ESD Caution .................................................................................. 4
Evaluation Board Information.................................................. 35
Pin Configuration and Function Descriptions ............................. 5
Outline Dimensions ....................................................................... 36
Interface Schematics..................................................................... 5
Ordering Guide .......................................................................... 36
Typical Performance Characteristics ............................................. 6
Downconverter Performance...................................................... 6
REVISION HISTORY
5/2018—Rev. A to Rev. B
Changes to Applications Information Section............................ 33
1/2018—Rev. 0 to Rev. A
Changes to Features.......................................................................... 1
Changed Single-Sideband (SSB) Noise Figure Parameter from
15 dB Typical to 11.5 dB Typical, Table 1 ...................................... 3
Changes to Ordering Guide .......................................................... 36
8/2017—Revision 0: Initial Version
Rev. B | Page 2 of 36
Data Sheet
HMC8193
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, and LO drive = 18 dBm; all measurements performed as downconverter with lower sideband selected, unless
otherwise noted.
Table 1.
Parameter
RADIO FREQUENCY
LOCAL OSCILLATOR
Frequency
Drive Level
INTERMEDIATE FREQUENCY
RF PERFORMANCE AS DOWNCONVERTER
Conversion Loss
Image Rejection
Single-Sideband (SSB) Noise Figure
Input Third-Order Intercept
Input 1 dB Compression Point
Input Second-Order Intercept
Isolation
RF to IF
LO to RF
LO to IF
Amplitude Balance
Phase Balance
RF PERFORMANCE AS UPCONVERTER
Conversion Loss
Sideband Rejection
Input Third-Order Intercept
RETURN LOSS PERFORMANCE
RF
LO
IFx
Symbol
RF
LO
Min
2.5
Typ
2.5
Max
8.5
Unit
GHz
8.5
GHz
dBm
GHz
18
IF
DC
23
IP3
P1dB
IP2
16
13
37
30
IP3
Rev. B | Page 3 of 36
4
9
25
11.5
20
13
58
11
dB
dBc
dB
dBm
dBm
dBm
22
48
38
±0.5
±5
dB
dB
dB
dB
Degrees
8.5
23
21
dB
dBc
dBm
13
13
17
dB
dB
dB
HMC8193
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 12.44 mW/°C Above 85°C)
Maximum Junction Temperature
Maximum Peak Reflow Temperature (MSL3)
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model (FICDM)
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Rating
21 dBm
25 dBm
21 dBm
6 mA
1120 mW
Table 3. Thermal Resistance
Package Type
E-24-11
175°C
260°C
−40°C to +85°C
−65°C to +150°C
1
θJA
120
θJC
80
Unit
°C/W
Thermal impedance simulated values are based on a JEDEC 2S2P test board
with 4 × 4 thermal vias. See JEDEC JESD51-12 for additional information.
ESD CAUTION
2000 V
1250 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. B | Page 4 of 36
Data Sheet
HMC8193
20 NIC
19 NIC
22 NIC
21 NIC
23 NIC
24 NIC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC 1
18 NIC
NIC 2
17 NIC
GND 3
HMC8193
16 GND
RF 4
TOP VIEW
(Not to Scale)
15 LO
NOTES
1. NOT INTERNALLY CONNECTED. NO CONNECTION IS
REQUIRED. THESE PINS CAN BE CONNECTED TO
RF/DC GROUND WITHOUT AFFECTING PERFORMANCE.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
14353-002
GND 12
IF1 9
NIC 10
IF2 11
13 NIC
NIC 8
14 GND
NIC 6
NIC 7
GND 5
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
1, 2, 6 to 8, 10, 13, 17 to 24
Mnemonic
NIC
3, 5, 12, 14, 16
GND
4
RF
9
IF1
11
IF2
15
LO
EPAD
Description
Not Internally Connected. No connection is required. These pins can be connected to RF/dc
ground without affecting performance.
Ground Connect. These pins and package bottom must be connected to RF/dc ground. See Figure 3
for the interface schematic.
Radio Frequency. This pin is ac-coupled and matched to 50 Ω. See Figure 5 for the interface
schematic.
First and Quadrature Intermediate Frequency. This pin is dc-coupled. For applications not
requiring operation to dc, dc block this port externally using a series capacitor with a value
selected to pass the necessary IF frequency range. For operation to dc, this pin must not source or
sink more than 6 mA of current; otherwise, the device does not function and may fail. See Figure 4
for the interface schematic.
Second Quadrature Intermediate Frequency. This pin is dc-coupled. For applications not
requiring operation to dc, dc block this port externally using a series capacitor with a value
selected to pass the necessary IF frequency range. For operation to dc, this pin must not source or
sink more than 6 mA of current; otherwise, the device does not function and may fail. See Figure 4 for
the interface schematic.
Local Oscillator. This pin is ac-coupled and matched to 50 Ω. See Figure 6 for the interface
schematic.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
14353-005
RF
Figure 5. RF Interface Schematic
Figure 3. GND Interface Schematic
14353-004
IF1, IF2
LO
14353-006
GND
14353-003
INTERFACE SCHEMATICS
Figure 6. LO Interface Schematic
Figure 4. IF1, IF2 Interface Schematic
Rev. B | Page 5 of 36
HMC8193
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter Performance at IF = 100 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
20dBm
18dBm
16dBm
14dBm
–10
–15
–20
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
–15
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 10. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
IMAGE REJECTION (dBc)
25
20
15
10
30
25
20
15
10
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-008
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-011
5
5
Figure 11. Image Rejection vs. RF Frequency at Various LO Drives
Figure 8. Image Rejection vs. RF Frequency at Various Temperatures
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
9
14353-009
10
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 12. Input IP3 vs. RF Frequency at Various LO Drives
Figure 9. Input IP3 vs. RF Frequency at Various Temperatures
Rev. B | Page 6 of 36
9
14353-012
IMAGE REJECTION (dBc)
–10
–20
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
–5
14353-010
CONVERSION GAIN (dB)
–5
14353-007
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
100
+85°C
+25°C
–40°C
80
70
70
INPUT IP2 (dBm)
80
60
50
40
60
50
40
30
30
20
20
10
10
0
2
3
20dBm
18dBm
16dBm
14dBm
90
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-013
2
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 13. Input IP2 vs. RF Frequency at Various Temperatures
Figure 15. Input IP2 vs. RF Frequency at Various LO Drives
25
25
18dBm
16dBm
14dBm
+85°C
+25°C
–40°C
20
NOISE FIGURE (dB)
20
15
10
15
10
5
5
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-014
INPUT P1dB (dBm)
3
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 16. Noise Figure vs. RF Frequency at Various LO Drives
Figure 14. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 7 of 36
14353-016
INPUT IP2 (dBm)
90
14353-015
100
HMC8193
Data Sheet
Downconverter Performance at IF = 1000 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
20dBm
18dBm
16dBm
14dBm
–10
–15
–20
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
–15
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 20. Conversion Gain vs. RF Frequency at Various LO Drives
70
70
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
60
IMAGE REJECTION (dBc)
60
50
40
30
20
50
40
30
20
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-018
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-021
10
10
Figure 21. Image Rejection vs. RF Frequency at Various LO Drives
Figure 18. Image Rejection vs. RF Frequency at Various Temperatures
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-019
10
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 22. Input IP3 vs. RF Frequency at Various LO Drives
Figure 19. Input IP3 vs. RF Frequency at Various Temperatures
Rev. B | Page 8 of 36
9
14353-022
IMAGE REJECTION (dBc)
–10
–20
Figure 17. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
–5
14353-020
CONVERSION GAIN (dB)
–5
14353-017
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
100
+85°C
+25°C
–40°C
80
70
70
INPUT IP2 (dBm)
80
60
50
40
50
40
30
20
20
10
10
0
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 23. Input IP2 vs. RF Frequency at Various Temperatures
+85°C
+25°C
–40°C
20
15
10
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-024
5
0
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 25. Input IP2 vs. RF Frequency at Various LO Drives
25
INPUT P1dB (dBm)
60
30
2
20dBm
18dBm
16dBm
14dBm
90
14353-023
INPUT IP2 (dBm)
90
Figure 24. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 9 of 36
9
14353-025
100
HMC8193
Data Sheet
Downconverter Performance at IF = 3500 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
20dBm
18dBm
16dBm
14dBm
–10
–15
–20
2
3
4
5
6
7
RF FREQUENCY (GHz)
–15
2
3
4
5
6
7
RF FREQUENCY (GHz)
Figure 29. Conversion Gain vs. RF Frequency at Various LO Drives
70
70
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
60
IMAGE REJECTION (dBc)
60
50
40
30
20
10
50
40
30
20
2
3
4
5
6
7
RF FREQUENCY (GHz)
0
14353-027
0
2
3
4
5
6
7
RF FREQUENCY (GHz)
Figure 27. Image Rejection vs. RF Frequency at Various Temperatures
14353-030
10
Figure 30. Image Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
2
3
4
5
6
7
RF FREQUENCY (GHz)
14353-028
10
Figure 28. Input IP3 vs. RF Frequency at Various Temperatures
0
2
3
4
5
6
RF FREQUENCY (GHz)
Figure 31. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 10 of 36
7
14353-031
IMAGE REJECTION (dBc)
–10
–20
Figure 26. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
–5
14353-029
CONVERSION GAIN (dB)
–5
14353-026
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
100
+85°C
+25°C
–40°C
80
70
70
INPUT IP2 (dBm)
80
60
50
40
50
40
30
20
20
10
10
0
3
4
5
6
7
RF FREQUENCY (GHz)
Figure 32. Input IP2 vs. RF Frequency at Various Temperatures
+85°C
+25°C
–40°C
20
15
10
3.5
4.5
5.5
6.5
7.5
RF FREQUENCY (GHz)
14353-033
5
0
2.5
0
2
3
4
5
6
RF FREQUENCY (GHz)
Figure 34. Input IP2 vs. RF Frequency at Various LO Drives
25
INPUT P1dB (dBm)
60
30
2
20dBm
18dBm
16dBm
14dBm
90
14353-032
INPUT IP2 (dBm)
90
Figure 33. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 11 of 36
7
14353-034
100
HMC8193
Data Sheet
Downconverter Performance at IF = 100 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
20dBm
18dBm
16dBm
14dBm
–10
–15
–20
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
–15
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 38. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
IMAGE REJECTION (dBc)
25
20
15
10
25
20
15
10
5
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-036
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 36. Image Rejection vs. RF Frequency at Various Temperatures
14353-039
5
30
Figure 39. Image Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-037
10
Figure 37. Input IP3 vs. RF Frequency at Various Temperatures
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 40. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 12 of 36
9
14353-040
IMAGE REJECTION (dBc)
–10
–20
Figure 35. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
–5
14353-038
CONVERSION GAIN (dB)
–5
14353-035
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
100
+85°C
+25°C
–40°C
80
70
70
INPUT IP2 (dBm)
80
60
50
40
50
40
30
20
20
10
10
0
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 41. Input IP2 vs. RF Frequency at Various Temperatures
+85°C
+25°C
–40°C
20
15
10
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-042
5
0
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 43. Input IP2 vs. RF Frequency at Various LO Drives
25
INPUT P1dB (dBm)
60
30
2
20dBm
18dBm
16dBm
14dBm
90
14353-041
INPUT IP2 (dBm)
90
Figure 42. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 13 of 36
9
14353-043
100
HMC8193
Data Sheet
Downconverter Performance at IF = 1000 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
20dBm
18dBm
16dBm
14dBm
–10
–15
–20
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
–15
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 47. Conversion Gain vs. RF Frequency at Various LO Drives
50
50
+85°C
+25°C
–40°C
40
IMAGE REJECTION (dBc)
40
45
35
30
25
20
15
35
30
25
20
15
10
10
5
5
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-045
0
20dBm
18dBm
16dBm
14dBm
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 45. Image Rejection vs. RF Frequency at Various Temperatures
14353-048
45
Figure 48. Image Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-046
10
Figure 46. Input IP3 vs. RF Frequency at Various Temperatures
0
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 49. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 14 of 36
9
14353-049
IMAGE REJECTION (dBc)
–10
–20
Figure 44. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
–5
14353-047
CONVERSION GAIN (dB)
–5
14353-044
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
100
100
+85°C
+25°C
–40°C
90
80
80
60
50
40
60
50
40
30
30
20
20
10
10
0
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 50. Input IP2 vs. RF Frequency at Various Temperatures
+85°C
+25°C
–40°C
20
15
10
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
14353-051
5
3.5
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 52. Input IP2 vs. RF Frequency at Various LO Drives
25
0
2.5
0
Figure 51. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 15 of 36
9
14353-052
INPUT IP2 (dBm)
70
14353-050
INPUT IP2 (dBm)
70
INPUT P1dB (dBm)
20dBm
18dBm
16dBm
14dBm
90
HMC8193
Data Sheet
Downconverter Performance at IF = 3500 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–15
–20
5
6
7
8
9
RF FREQUENCY (GHz)
–10
–15
–20
5
7
8
9
RF FREQUENCY (GHz)
Figure 55. Conversion Gain vs. RF Frequency at Various LO Drives
Figure 53. Conversion Gain vs. RF Frequency at Various Temperatures
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
10
5
5
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-055
0
5
6
7
8
RF FREQUENCY (GHz)
Figure 56. Input IP3 vs. RF Frequency at Various LO Drives
Figure 54. Input IP3 vs. RF Frequency at Various Temperatures
Rev. B | Page 16 of 36
9
14353-058
40
INPUT IP3 (dBm)
6
14353-056
–10
20dBm
18dBm
16dBm
14dBm
–5
CONVERSION GAIN (dB)
–5
14353-053
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
100
100
+85°C
+25°C
–40°C
90
80
90
80
70
50
40
50
40
30
30
20
20
10
10
0
5
6
7
8
9
RF FREQUENCY (GHz)
5
20
15
10
6
7
8
9
RF FREQUENCY (GHz)
14353-060
5
5
7
8
Figure 59. Input IP2 vs. RF Frequency at Various LO Drives
+85°C
+25°C
–40°C
4
6
RF FREQUENCY (GHz)
25
0
20dBm
18dBm
16dBm
14dBm
0
Figure 57. Input IP2 vs. RF Frequency at Various Temperatures
INPUT P1dB (dBm)
60
Figure 58. Input P1dB vs. RF Frequency at Various Temperatures
Rev. B | Page 17 of 36
9
14353-061
INPUT IP2 (dBm)
60
14353-059
INPUT IP2 (dBm)
70
HMC8193
Data Sheet
UPCONVERTER PERFORMANCE
Upconverter Performance at IF = 100 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
CONVERSION GAIN (dB)
–5
–10
–15
–20
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
–10
–15
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 63. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
35
SIDEBAND REJECTION (dBc)
35
30
25
20
15
10
30
25
20
15
10
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-063
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 61. Sideband Rejection vs. RF Frequency at Various Temperatures
14353-066
5
5
Figure 64. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-064
10
Figure 62. Input IP3 vs. RF Frequency at Various Temperatures
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 65. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 18 of 36
9
14353-067
SIDEBAND REJECTION (dBc)
–5
2
Figure 60. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
20dBm
18dBm
16dBm
14dBm
–20
14353-062
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
14353-065
0
Data Sheet
HMC8193
Upconverter Performance at IF = 1000 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–10
–15
–20
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
20dBm
18dBm
16dBm
14dBm
–15
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 69. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
35
SIDEBAND REJECTION (dBc)
35
30
25
20
15
10
5
30
25
20
15
10
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-069
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 67. Sideband Rejection vs. RF Frequency at Various Temperatures
14353-072
5
Figure 70. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-070
10
Figure 68. Input IP3 vs. RF Frequency at Various Temperatures
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 71. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 19 of 36
9
14353-073
SIDEBAND REJECTION (dBc)
–10
–20
Figure 66. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
–5
14353-071
CONVERSION GAIN (dB)
–5
14353-068
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
HMC8193
Data Sheet
Upconverter Performance at IF = 3500 MHz, Lower Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
0
–10
–15
–20
2
3
4
5
6
7
RF FREQUENCY (GHz)
20dBm
18dBm
16dBm
14dBm
–15
2
3
4
5
6
7
RF FREQUENCY (GHz)
Figure 75. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
35
SIDEBAND REJECTION (dBc)
35
30
25
20
15
10
25
20
15
10
5
2
3
4
5
6
7
RF FREQUENCY (GHz)
0
14353-075
0
2
3
4
5
6
7
RF FREQUENCY (GHz)
14353-078
5
30
Figure 76. Sideband Rejection vs. RF Frequency at Various LO Drives
Figure 73. Sideband Rejection vs. RF Frequency at Various Temperatures
35
35
+85°C
+25°C
–40°C
30
20dBm
18dBm
16dBm
14dBm
30
25
INPUT IP3 (dBm)
25
20
15
20
15
10
5
5
0
2
3
4
5
6
7
RF FREQUENCY (GHz)
14353-076
10
Figure 74. Input IP3 vs. RF Frequency at Various Temperatures
0
2
3
4
5
6
RF FREQUENCY (GHz)
Figure 77. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 20 of 36
7
14353-079
SIDEBAND REJECTION (dBc)
–10
–20
Figure 72. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
–5
14353-077
CONVERSION GAIN (dB)
–5
14353-074
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
Upconverter Performance at IF = 100 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
CONVERSION GAIN (dB)
–5
–10
–15
–20
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
20dBm
18dBm
16dBm
14dBm
–5
–10
–15
–20
14353-080
2
3
4
5
6
7
Figure 78. Conversion Gain vs. RF Frequency at Various Temperatures
40
30
20
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
30
20
10
0
14353-081
10
20dBm
18dBm
16dBm
14dBm
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 79. Sideband Rejection vs. RF Frequency at Various Temperatures
14353-084
SIDEBAND REJECTION (dBc)
+85°C
+25°C
–40°C
SIDEBAND REJECTION (dBc)
9
Figure 81. Conversion Gain vs. RF Frequency at Various LO Drives
40
Figure 82. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
20dBm
18dBm
16dBm
14dBm
30
INPUT IP3 (dBm)
30
20
10
20
10
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-082
INPUT IP3 (dBm)
8
RF FREQUENCY (GHz)
Figure 80. Input IP3 vs. RF Frequency at Various Temperatures
0
2
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 83. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 21 of 36
9
14353-085
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
14353-083
0
HMC8193
Data Sheet
Upconverter Performance at IF = 1000 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
CONVERSION GAIN (dB)
–5
–10
–15
–20
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
–10
–15
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 87. Conversion Gain vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
SIDEBAND REJECTION (dBc)
35
30
25
20
15
10
30
25
20
15
20dBm
18dBm
16dBm
14dBm
10
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
0
14353-087
0
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 85. Sideband Rejection vs. RF Frequency at Various Temperatures
14353-090
5
5
Figure 88. Sideband Rejection vs. RF Frequency at Various LO Drives
40
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
14353-088
10
Figure 86. Input IP3 vs. RF Frequency at Various Temperatures
0
3
4
5
6
7
8
RF FREQUENCY (GHz)
Figure 89. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 22 of 36
9
14353-091
SIDEBAND REJECTION (dBc)
–5
3
Figure 84. Conversion Gain vs. RF Frequency at Various Temperatures
INPUT IP3 (dBm)
20dBm
18dBm
16dBm
14dBm
–20
14353-086
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
14353-089
0
Data Sheet
HMC8193
Upconverter Performance at IF = 3500 MHz, Upper Sideband
Data taken at LO drive = 18 dBm and TA = 25°C, unless otherwise noted.
0
CONVERSION GAIN (dB)
–5
–10
–15
–20
5
6
7
8
9
RF FREQUENCY (GHz)
–5
–10
–15
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 90. Conversion Gain vs. RF Frequency at Various Temperatures
Figure 92. Conversion Gain vs. RF Frequency at Various LO Drives
40
+85°C
+25°C
–40°C
35
20dBm
18dBm
16dBm
14dBm
35
30
INPUT IP3 (dBm)
30
25
20
15
25
20
15
10
5
5
0
5
6
7
8
9
RF FREQUENCY (GHz)
14353-094
10
Figure 91. Input IP3 vs. RF Frequency at Various Temperatures
0
5
6
7
8
RF FREQUENCY (GHz)
Figure 93. Input IP3 vs. RF Frequency at Various LO Drives
Rev. B | Page 23 of 36
9
14353-097
40
INPUT IP3 (dBm)
20dBm
18dBm
16dBm
14dBm
–20
14353-092
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
14353-095
0
HMC8193
Data Sheet
ISOLATION AND RETURN LOSS
70
70
60
60
40
IF1, –40°C
IF1, +25°C
IF1, +85°C
IF2, –40°C
IF2, +25°C
IF2, +85°C
30
20
2
4
3
5
6
7
8
9
30
IF1, 14dBm
IF1, 16dBm
IF1, 18dBm
IF1, 20dBm
IF2, 14dBm
IF2, 16dBm
IF2, 18dBm
IF2, 20dBm
20
LO FREQUENCY (GHz)
0
14353-098
0
2
60
60
LO TO RF ISOLATION (dB)
70
50
40
30
+85°C
+25°C
–40°C
0
2
3
4
5
6
7
8
9
LO FREQUENCY (GHz)
5
6
7
8
9
50
40
30
20
20dBm
18dBm
16dBm
14dBm
10
0
14353-099
10
4
Figure 97. LO to IF Isolation vs. LO Frequency at Various LO Drives
70
20
3
LO FREQUENCY (GHz)
Figure 94. LO to IF Isolation vs. LO Frequency at Various Temperatures
2
3
4
5
6
7
8
9
LO FREQUENCY (GHz)
Figure 98. LO to RF Isolation vs. LO Frequency at Various LO Drives
Figure 95. LO to RF Isolation vs. LO Frequency at Various Temperatures
40
40
IF1, –40°C
IF1, +25°C
IF1, +85°C
IF2, –40°C
IF2, +25°C
IF2, +85°C
30
35
RF TO IF ISOLATION (dB)
35
25
20
15
10
30
25
20
IF1, 14dBm
IF1, 16dBm
IF1, 18dBm
IF1, 20dBm
IF2, 14dBm
IF2, 16dBm
IF2, 18dBm
IF2, 20dBm
15
10
5
0
2
3
4
5
6
RF FREQUENCY (GHz)
7
8
9
14353-100
5
Figure 96. RF to IF Isolation vs. RF Frequency at Various Temperatures
Rev. B | Page 24 of 36
0
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 99. RF to IF Isolation vs. RF Frequency at Various LO Drives
14353-103
LO TO RF ISOLATION (dB)
40
10
10
RF TO IF ISOLATION (dB)
50
14353-102
50
14353-101
LO TO IF ISOLATION (dB)
LO TO IF ISOLATION (dB)
Data taken at LO drive = 18 dBm, TA = 25°C, unless otherwise noted.
Data Sheet
HMC8193
0
0
20dBm
18dBm
16dBm
–5
LO RETURN LOSS (dB)
–10
–15
–5
–10
–15
3
4
5
6
7
8
9
–20
LO FREQUENCY (GHz)
2
4
5
6
7
8
9
LO FREQUENCY (GHz)
Figure 100. LO Return Loss vs. LO Frequency at Various Temperatures
Figure 103. LO Return Loss vs. LO Frequency at Various LO Drives
0
0
+85°C
+25°C
–40°C
–5
20dBm
18dBm
16dBm
–5
RF RETURN LOSS (dB)
RF RETURN LOSS (dB)
3
14353-119
2
14353-116
–20
–10
–15
–20
–10
–15
–20
2
3
4
5
6
7
8
14353-117
–25
9
RF FREQUENCY (GHz)
–25
2
3
4
5
6
7
8
14353-120
LO RETURN LOSS (dB)
+85°C
+25°C
–40°C
9
RF FREQUENCY (GHz)
Figure 104. RF Return Loss vs. RF Frequency at Various LO Drives
LO Frequency = 5.5 GHz
Figure 101. RF Return Loss vs. RF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
0
0
IF1,
IF1,
IF1,
IF2,
IF2,
IF2,
–5
–10
–15
20dBm
18dBm
16dBm
20dBm
18dBm
16dBm
–10
–15
–20
–25
0
0.5
1.0
1.5
2.0
2.5
IF FREQUENCY (GHz)
3.0
3.5
4.0
14353-118
–20
–25
0
0.5
1.0
1.5
2.0
2.5
IF FREQUENCY (GHz)
3.0
3.5
4.0
14353-121
IF RETURN LOSS (dB)
–5
+85°C
+25°C
–40°C
+85°C
+25°C
–40°C
IF RETURN LOSS (dB)
IF1,
IF1,
IF1,
IF2,
IF2,
IF2,
Figure 105. IF Return Loss vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
Figure 102. IF Return Loss vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
Rev. B | Page 25 of 36
HMC8193
Data Sheet
IF BANDWIDTH
Data taken as a downconverter, lower sideband, at LO drive = 18 dBm, TA = 25°C, unless otherwise noted.
0
0
20dBm
18dBm
16dBm
14dBm
–10
–15
–20
0
1
2
3
4
IF FREQUENCY (GHz)
–10
–15
–20
0
1
2
3
4
IF FREQUENCY (GHz)
Figure 106. Conversion Gain vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
Figure 108. Conversion Gain vs. IF Frequency at Various LO Drives
LO Frequency = 5.5 GHz
35
35
+85°C
+25°C
–40°C
30
30
25
20
15
20
15
10
10
5
5
0
0
1
2
3
4
IF FREQUENCY (GHz)
Figure 107. Input IP3 vs. IF Frequency at Various Temperatures
LO Frequency = 5.5 GHz
20dBm
18dBm
16dBm
14dBm
0
0
1
2
3
IF FREQUENCY (GHz)
Figure 109. Input IP3 vs. IF Frequency at Various LO Drives
LO Frequency = 5.5 GHz
Rev. B | Page 26 of 36
4
14353-125
INPUT IP3 (dBm)
25
14353-123
INPUT IP3 (dBm)
–5
14353-124
CONVERSION GAIN (dB)
–5
14353-122
CONVERSION GAIN (dB)
+85°C
+25°C
–40°C
Data Sheet
HMC8193
AMPLITUDE AND PHASE IMBALANCE
Downconverter Performance, Lower Sideband
4
2
1
0
–1
–2
–3
2
1
0
–1
–2
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
–4
2.5
Figure 110. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
3.5
4.5
5.5
6.5
10
5
0
3.5
4.5
5.5
6.5
RF FREQUENCY (GHz)
7.5
8.5
14353-127
–5
Figure 111. Phase Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
Rev. B | Page 27 of 36
20dBm
18dBm
16dBm
14dBm
5
0
–5
–10
2.5
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
Figure 113. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
14353-129
PHASE IMBALANCE (Degrees)
+85°C
+25°C
–40°C
PHASE IMBALANCE (Degrees)
8.5
Figure 112. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
10
–10
2.5
7.5
RF FREQUENCY (GHz)
14353-128
–3
14353-126
–4
2.5
20dBm
18dBm
16dBm
14dBm
3
AMPLITUDE IMBALANCE (dB)
AMPLITUDE IMBALANCE (dB)
3
4
+85°C
+25°C
–40°C
HMC8193
Data Sheet
Downconverter Performance, Upper Sideband
4
2
1
0
–1
–2
–3
2
1
0
–1
–2
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
–4
2.5
Figure 114. Amplitude Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
3.5
4.5
5.5
6.5
10
5
0
3.5
4.5
5.5
6.5
RF FREQUENCY (GHz)
7.5
8.5
14353-131
–5
Figure 115. Phase Imbalance vs. RF Frequency at Various Temperatures,
LO Drive = 18 dBm, IF = 100 MHz
Rev. B | Page 28 of 36
20dBm
18dBm
16dBm
14dBm
5
0
–5
–10
2.5
3.5
4.5
5.5
6.5
7.5
8.5
RF FREQUENCY (GHz)
Figure 117. Phase Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
14353-133
PHASE IMBALANCE (Degrees)
+85°C
+25°C
–40°C
PHASE IMBALANCE (Degrees)
8.5
Figure 116. Amplitude Imbalance vs. RF Frequency at Various LO Drives,
IF = 100 MHz, TA = 25°C
10
–10
2.5
7.5
RF FREQUENCY (GHz)
14353-132
–3
14353-130
–4
2.5
20dBm
18dBm
16dBm
14dBm
3
AMPLITUDE IMBALANCE (dB)
AMPLITUDE IMBALANCE (dB)
3
4
+85°C
+25°C
–40°C
Data Sheet
HMC8193
SPURIOUS AND HARMONICS PERFORMANCE
IF = 1000 MHz, RF = 5500 MHz, LO = 6500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
All M × N spur data captured with the 90° hybrid attached.
Downconverter M × N Spurious Outputs
Mixer spurious products are measured in dBc from the IF output
power level, unless otherwise specified. Spur values are (M × RF) −
(N × LO).
IF = 100 MHz, RF = 2500 MHz, LO = 2600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
0
1
2
3
4
0
Not applicable
22
84
84
82
N × LO
1
0
0
69
82
83
2
34
29
73
89
79
3
33
41
70
69
89
4
47
46
85
87
92
IF = 100 MHz, RF = 5500 MHz, LO = 5600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
0
1
2
3
4
0
Not applicable
23
81
80
77
N × LO
1
9
0
68
82
80
2
35
53
69
84
79
3
29
47
70
67
83
4
48
52
81
80
91
IF = 100 MHz, RF = 8500 MHz, LO = 8600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
0
1
2
3
4
0
Not applicable
15
76
70
67
N × LO
1
1
0
76
77
72
2
30
53
72
79
76
3
35
69
78
89
80
4
48
57
76
77
87
IF = 1000 MHz, RF = 2500 MHz, LO = 3500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
0
1
2
3
4
0
Not applicable
+11
+74
+73
+71
N × LO
1
2
−6
+22
+0
+32
+55
+77
+68
+65
+74
+59
3
+19
+36
+69
+59
+65
4
+33
+43
+72
+76
+68
M × RF
0
1
2
3
4
0
Not applicable
12
71
68
64
N × LO
1
2
0
61
70
68
2
19
31
65
76
69
3
13
38
64
67
77
4
35
40
70
71
73
IF = 1000 MHz, RF = 8500 MHz, LO = 9500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
0
1
2
3
4
0
Not applicable
+6
+66
+59
+59
N × LO
1
−3
+0
+69
+66
+60
2
+19
+35
+62
+70
+66
3
+12
+63
+67
+67
+70
4
+32
+51
+63
+66
+68
IF = 3500 MHz, RF = 2500 MHz, LO = 6000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
0
1
2
3
4
0
Not applicable
20
74
87
92
N × LO
1
4
0
61
78
94
2
36
49
80
87
97
3
13
60
87
91
92
4
52
44
81
88
88
IF = 3500 MHz, RF = 5500 MHz, LO = 9000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
0
1
2
3
4
0
Not applicable
14
85
88
87
N × LO
1
7
0
91
90
88
2
23
37
88
89
93
3
28
55
81
93
93
4
41
56
83
87
85
IF = 3500 MHz, RF = 8500 MHz, LO = 12,000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × RF
Rev. B | Page 29 of 36
0
1
2
3
4
0
Not applicable
−10
+60
+61
+54
N × LO
1
−20
+0
+69
+61
+63
2
+5
+38
+64
+70
+53
3
+7
+61
+64
+64
+34
4
+20
+54
+61
+63
+62
HMC8193
Data Sheet
Upconverter M × N Spurious Outputs
Mixer spurious products are measured in dBc from the RF output
power level, unless otherwise specified. Spur values are (M × IF) −
(N × LO).
IF = 100 MHz, RF = 2500 MHz, LO = 2600 MHz, RF power =
−10 dBm, and LO power = +18 dBm..
M × IF
0
1
2
3
4
0
Not applicable
27
75
79
93
N × LO
1
10
0
53
59
90
2
9
15
47
72
92
3
24
10
61
57
89
4
20
29
61
76
92
IF = 100 MHz, RF = 5500 MHz, LO = 5600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
0
1
2
3
4
0
Not applicable
25
75
89
94
N × LO
1
19
0
54
69
94
2
20
50
70
85
89
3
23
26
81
84
87
4
40
44
78
85
86
IF = 100 MHz, RF = 8500 MHz, LO = 8600 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
0
1
2
3
4
0
Not applicable
20
67
77
92
N × LO
1
−2
+0
+50
+70
+86
2
+16
+31
+55
+81
+81
3
+18
+35
+67
+79
+80
4
+19
+46
+75
+78
+74
IF = 1000 MHz, RF = 2500 MHz, LO = 3500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
0
1
2
3
4
0
Not applicable
13
57
83
77
N × LO
1
12
0
48
91
91
2
11
25
63
79
84
3
23
35
70
65
67
4
34
46
80
82
83
IF = 1000 MHz, RF = 5500 MHz, LO = 6500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
0
1
2
3
4
0
Not applicable
11
63
84
84
N × LO
1
13
0
40
68
89
2
25
44
69
80
82
3
33
31
64
78
79
4
41
39
75
75
76
IF = 1000 MHz, RF = 8500 MHz, LO = 9500 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
0
1
2
3
4
0
Not applicable
+8
+58
+70
+80
N × LO
1
−3
0
+37
+70
+80
2
+24
+45
+59
+75
+75
3
+21
+36
+63
+69
+70
4
+34
+36
+66
+65
+68
IF = 3500 MHz, RF = 2500 MHz, LO = 6000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
0
1
2
3
4
0
Not applicable
8
67
87
85
N × LO
1
20
0
71
79
91
2
25
33
62
80
95
3
22
43
75
79
97
4
29
41
70
88
92
IF = 3500 MHz, RF = 5500 MHz, LO = 9000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
0
1
2
3
4
0
Not applicable
+6
+62
+91
+86
N × LO
1
−5
0
+67
+82
+94
2
+17
+40
+67
+80
+94
3
+42
+37
+88
+79
+89
4
+19
+49
+73
+84
+88
IF = 3500 MHz, RF = 8500 MHz, LO = 12,000 MHz, RF power =
−10 dBm, and LO power = +18 dBm.
M × IF
Rev. B | Page 30 of 36
0
1
2
3
4
0
Not applicable
−4
+37
+53
+70
N × LO
1
−1
0
+44
+69
+79
2
+12
+29
+62
+72
+74
3
+5
+58
+71
+70
+72
4
+7
+59
+60
+58
+65
Data Sheet
HMC8193
LO Harmonics
LO drive = 18 dBm and all values in are in dBc below the input
LO level measured at the RF port.
Table 5. Harmonics of LO
LO Frequency (GHz)
2.5
3.5
4.5
5.5
6.5
7.5
8.5
1
50
47
50
52
50
49
40
N × LO Spur at RF Port
2
3
4
45
61
66
46
56
71
63
65
60
68
61
69
66
66
73
63
69
62
59
59
81
Rev. B | Page 31 of 36
HMC8193
Data Sheet
THEORY OF OPERATION
The HMC8193 is a passive, wideband, I/Q, MMIC mixer that
can be used as an image rejection mixer or as a single-sideband
upconverter for transmitter operations. With an RF and LO
range of 2.5 GHz to 8.5 GHz, as well as an IF bandwidth of dc to
4 GHz, the HMC8193 is ideal for applications requiring wide
frequency range, excellent RF performance, and a simple design
that includes a few components and a small PCB footprint. A single
HMC8193 can replace multiple narrow-band mixers in a design.
The inherent I/Q architecture of the HMC8193 offers excellent
image rejection and sideband rejection, thereby eliminating the
need for expensive filtering of unwanted sidebands. The double
balanced architecture of the mixer also provides excellent LO to
RF and LO to IF isolation and reduces the effect of LO leakage
to ensure signal integrity.
The HMC8193 does not require any dc power sources because
it is a passive mixer. The device offers a lower noise figure than
an active mixer, ensuring superior dynamic range for high
performance and precision applications.
The HMC8193 is fabricated on a GaAs MESFET process and
uses Analog Devices mixer cells and a 90° hybrid. The HMC8193 is
available in a compact, 4 mm × 4 mm, 24-terminal LCC package
and operates over a −40°C to +85°C temperature range. An
evaluation board for the HMC8193 is also available from
Analog Devices.
For both upconversion and downconversion, an external 90°
hybrid is required. See the Applications Information section for
information regarding interfacing with an external 90° hybrid
Rev. B | Page 32 of 36
Data Sheet
HMC8193
APPLICATIONS INFORMATION
Figure 118 shows the typical application circuit for the
HMC8193. To select the appropriate sideband, an external 90°
hybrid is required. For applications not requiring operation to
dc, use an off-chip dc blocking capacitor. For applications that
require the LO signal at the output to be suppressed, use a bias
tee/RF choke as shown in Figure 118. Ensure that the source/
sink current used for LO suppression is less than 6 mA for each
IF port; otherwise, device damage may occur. The commonmode voltage for each IF port is 0 V.
19
20
21
22
17
3
16
4
15
IF2
9
IF1
BIAS TEE/
DC FEED FOR IF1
12
13
11
14
6
10
5
LO
DC BLOCKING
CAPACITORS
BIAS TEE/
DC FEED FOR IF2
SUPPLY
FOR IF1
SUPPLY
FOR IF2
EXTERNAL
90° HYBRID
50Ω
IF
NOTES
1. DASHED SECTIONS ARE OPTIONAL AND MEANT FOR LO NULLING.
Rev. B | Page 33 of 36
Figure 118. Typical Application Circuit
14353-134
To select the upper sideband (low-side LO) when using as a
downconverter, connect the IF1 pin to the 0° port of the hybrid,
and connect the IF2 pin to the 90° port of the hybrid. To select
the lower sideband (high-side LO), connect the IF1 pin to the
90° port of the hybrid and IF2 to the 0° port of the hybrid. The
output is from the sum port of the hybrid, and the difference
port is 50 Ω terminated.
18
2
7
To select the upper sideband when using as an upconverter,
connect the IF1 pin to the 90° port of the hybrid, and connect
the IF2 pin to the 0° port of the hybrid. To select the lower
sideband, connect IF1 to the 0° port of the hybrid and IF2 to the
90° port of the hybrid. The input is from the sum port of the
hybrid and the difference port is 50 Ω terminated.
1
8
RF
23
24
HMC8193 EVALUATION BOARD
HMC8193
Data Sheet
SOLDERING INFORMATION AND RECOMMENDED
LAND PATTERN
Figure 119 and Figure 120 show the recommended land pattern
and solder stencil for the HMC8193, respectively. The HMC8193
is contained in a 4 mm × 4 mm, 24-terminal, ceramic, LCC
package, which has an exposed ground pad (EP). This pad is
internally connected to the ground of the chip. To minimize
thermal impedance and ensure electrical performance, solder
the pad to the low impedance ground plane on the PCB. To
further reduce thermal impedance, it is recommended that the
ground planes on all layers under the pad be stitched together
with vias.
The land pattern on the HMC8193 evaluation board provides a
simulated thermal resistance (θJA) of 120°C/W
.178" SQUARE
.004" MASK/METAL OVERLAP
.010" MIN MASK WIDTH
SOLDERMASK
GROUND PAD
PAD SIZE
.026" × .010"
PIN 1
.0197"
[0.50]
.116"
MASK
OPENING
.034"
TYPICAL
VIA
SPACING
.010" REF
.030"
MASK OPENING
.098" SQUARE MASK OPENING
.020 × 45" CHAMFER FOR PIN 1
.106" SQUARE
GROUND PAD
Figure 119. Evaluation Board Land Pattern for the HMC8193 Package
0.094
0.019
TYP
0.017
0.094
0.024
TYP
R0.004
TYP
0.008
TYP
0.176
SQUARE
14353-136
0.020
TYP
Figure 120. Solder Stencil for the HMC8193 Package on the HMC8193 Evaluation Board
Rev. B | Page 34 of 36
14353-135
ᶲ .010"
TYPICAL VIA
Data Sheet
HMC8193
EVALUATION BOARD INFORMATION
14353-137
The EV1HMC8193LC4 evaluation PCB used in the application
must use RF circuit design techniques. Signal lines must have
50 Ω impedance and connect the package ground leads and
exposed pad directly to the ground plane, similar to what is
shown in Figure 119. Use a sufficient number of via holes to
connect the top and bottom ground planes. The evaluation
circuit board shown in Figure 121 is available from Analog
Devices upon request.
Figure 121. EV1HMC8193LC4 Evaluation PCB, Top Layer
Table 6. Bill of Materials for the EV1HMC8193LC41 Evaluation PCB
Quantity
1
2
2
1
1
2
Reference Designator
Not applicable
J1, J2
J3, J4
U1
Description
PCB, EV1HMC8193LC42
PCB mount SMA RF connector
PCB mount SMA connector
Device under test (HMC8193)
Reference this number when ordering the evaluation PCB.
The circuit board material is Rogers 4350.
Rev. B | Page 35 of 36
Manufacturer
Analog Devices
SRI Connector Gage Co.
Johnson SMA Connector
Analog Devices
Part Number
109996-1
21-146-1000-01
142-0701-851
HMC8193
HMC8193
Data Sheet
OUTLINE DIMENSIONS
0.36
0.30
0.24
0.08
BSC
1
0.50
BSC
2.60
2.50 SQ
2.40
EXPOSED
PAD
13
6
12
0.32
BSC
TOP VIEW
1.00
0.90
0.80
PIN 1
24
19
18
7
BOTTOM VIEW
2.50 REF
3.10 BSC
SIDE VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PKG-004840
SEATING
PLANE
02-27-2017-B
PIN 1
INDICATOR
4.05
3.90 SQ
3.75
Figure 122. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC8193LC4
HMC8193LC4TR
HMC8193LC4TR-R5
EV1HMC8193LC4
1
2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Body
Material
Alumina Ceramic
Alumina Ceramic
Alumina Ceramic
Lead Finish
Gold over Nickel
Gold over Nickel
Gold over Nickel
The HMC8193LC4, the HMC8193LC4TR, and the HMC8193LC4TR-R5 are RoHS compliant parts.
See the Absolute Maximum Ratings section.
©2017–2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14353-0-5/18(B)
Rev. B | Page 36 of 36
Package Description
24-Terminal LCC
24-Terminal LCC
24-Terminal LCC
Evaluation PCB Assembly
MSL Rating2
MSL3
MSL3
MSL3
Package
Option
E-24-1
E-24-1
E-24-1
工商网监
湘ICP备2023018690号
