LT8390
60V Synchronous 4-Switch
Buck-Boost Controller
with Spread Spectrum
DESCRIPTION
FEATURES
4-Switch Single Inductor Architecture Allows VIN
Above, Below or Equal to VOUT
n Synchronous Switching: Up to 98% Efficiency
n Proprietary Peak-Buck Peak-Boost Current Mode
n Wide V Range: 4V to 60V
IN
n ±1.5% Output Voltage Accuracy: 1V ≤ V
OUT ≤ 60V
n ±3% Input or Output Current Accuracy with Monitor
n Spread Spectrum Frequency Modulation for Low EMI
n High Side PMOS Load Switch Driver
n Integrated Bootstrap Diodes
n No Top MOSFET Refresh Noise in Buck or Boost
n Adjustable and Synchronizable: 150kHz to 650kHz
n V
OUT Disconnected from VIN During Shutdown
n Available in 28-Lead TSSOP with Exposed Pad and
28-Lead QFN (4mm × 5mm)
n AEC-Q100 Qualified for Automotive Applications
n
APPLICATIONS
The LT®8390 is a synchronous 4-switch buck-boost DC/DC
controller that regulates output voltage, input or output
current from an input voltage above, below, or equal to
the output voltage. The proprietary peak-buck/peak-boost
current mode control scheme allows adjustable and synchronizable 150kHz to 650kHz fixed frequency operation,
or internal ±15% triangle spread spectrum frequency
modulation for low EMI. With a 4V to 60V input voltage
range, 0V to 60V output voltage capability, and seamless low
noise transitions between operation regions, the LT8390
is ideal for voltage regulator, battery and supercapacitor
charger applications in automotive, industrial, telecom,
and even battery-powered systems.
The LT8390 provides input or output current monitor and
power good flag. Fault protection is also provided to detect
output short-circuit condition, during which the LT8390
retries, latches off, or keeps running.
All registered trademarks and trademarks are the property of their respective owners.
Automotive, Industrial, Telecom Systems
n High Power Battery-Powered System
n
TYPICAL APPLICATION
98% Efficient 48W (12V 4A) Miniature Buck-Boost Voltage Regulator
VIN
4V TO 56V
6uH
4mΩ
22µF
63V
×2
4.7µF
100V
×2
0.1µF
SW1 LSP
BST1
LSN
VOUT
12V
4A
120µF
16V
15mΩ
BG1
10µF
25V
×2
0.1µF
SW2
BST2
120µF
16V
Efficiency vs VIN
BG2
100
GND
383k
1µF
165k
ISMON
VIN
TG2
LT8390
EN/UVLO
ISP
LOADTG
ISN
TEST
IOUT LIMIT 6.7A
98
VOUT
100k
FB
ISMON
SSFM OFF
SYNC/SPRD
CTRL
INTVCC
SSFM ON
4.7µF
LOADEN
0.47µF
VREF
SS
0.1µF
PGOOD
RT
VC
100pF
96
1µF
100k
PGOOD
8390 TA01a
9.09k
EFFICIENCY (%)
TG1
94
92
90
88
86
IOUT = 4A
0
10
20
30
40
INPUT VOLTAGE (V)
50
60
8390 TA01b
100k
400kHz
27k
4.7nF
Rev. C
Document Feedback
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1
LT8390
ABSOLUTE MAXIMUM RATINGS
(Note 1)
VIN, EN/UVLO, VOUT, ISP, ISN.....................................60V FB, LOADEN, SYNC/SPRD, CTRL, PGOOD....................6V
(ISP-ISN)...........................................................–1V to 1V Operating Junction Temperature Range (Notes 2, 3)
BST1, BST2.................................................................66V
LT8390E.............................................. –40°C to 125°C
LT8390I............................................... –40°C to 125°C
SW1, SW2, LSP, LSN...................................... –6V to 60V
LT8390J, LT8390H.............................. –40°C to 150°C
INTVCC, (BST1-SW1), (BST2-SW2)...............................6V
(BST1-LSP), (BST1-LSN)..............................................6V Storage Temperature Range.................... –65°C to 150°C
PIN CONFIGURATION
TOP VIEW
TOP VIEW
26 SW2
TG1
4
25 TG2
TG1 1
22 TG2
LSP
5
24 VOUT
LSP 2
21 VOUT
23 LOADTG
LSN 3
20 LOADTG
8
EN/UVLO
21 RT
INTVCC 5
9
20 VC
EN/UVLO 6
TEST 10
19 FB
LOADEN 11
18 SS
17 PGOOD
CTRL 13
16 ISMON
ISP 14
18 RT
17 VC
TEST 7
16 FB
LOADEN 8
15 SS
9 10 11 12 13 14
VREF
VREF 12
19 SYNC/SPRD
29
GND
15 ISN
FE PACKAGE
28-LEAD PLASTIC TSSOP
θJA = 30°C/W, θJC = 5°C/W
EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
PGOOD
INTVCC
22 SYNC/SPRD
ISMON
7
VIN 4
ISN
VIN
29
GND
ISP
6
28 27 26 25 24 23
CTRL
LSN
SW2
27 BST2
3
BST2
2
SW1
BG2
BST1
BG1
28 BG2
BST1
1
SW1
BG1
UFD PACKAGE
28-LEAD (4mm × 5mm) PLASTIC QFN
θJA = 43°C/W, θJC = 3.4°C/W
EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT8390EFE#PBF
LT8390EFE#TRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 125°C
LT8390IFE#PBF
LT8390IFE#TRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 125°C
LT8390JFE#PBF
LT8390JFE#TRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 150°C
LT8390HFE#PBF
LT8390HFE#TRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 150°C
LT8390EUFD#PBF
LT8390EUFD#TRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 125°C
LT8390IUFD#PBF
LT8390IUFD#TRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 125°C
LT8390JUFD#PBF
LT8390JUFD#TRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 150°C
LT8390HUFD#PBF
LT8390HUFD#TRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 150°C
2
Rev. C
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LT8390
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT8390EFE#WPBF
LT8390EFE#WTRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 125°C
LT8390IFE#WPBF
LT8390IFE#WTRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 125°C
LT8390JFE#WPBF
LT8390JFE#WTRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 150°C
LT8390HFE#WPBF
LT8390HFE#WTRPBF
LT8390FE
28-Lead Plastic TSSOP
–40°C to 150°C
LT8390EUFD#WPBF
LT8390EUFD#WTRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 125°C
LT8390IUFD#WPBF
LT8390IUFD#WTRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 125°C
LT8390JUFD#WPBF
LT8390JUFD#WTRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 150°C
LT8390HUFD#WPBF
LT8390HUFD#WTRPBF
8390
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 150°C
AUTOMOTIVE PRODUCTS**
Contact the factory for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
**Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These
models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your
local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for
these models.
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VEN/UVLO = 1.5V unless otherwise noted.
PARAMETER
Supply
VIN Operating Voltage Range
VIN Quiescent Current
VOUT Voltage Range
VOUT Quiescent Current
Linear Regulators
INTVCC Regulation Voltage
INTVCC Load Regulation
INTVCC Line Regulation
INTVCC Current Limit
INTVCC Dropout Voltage (VIN – INTVCC)
INTVCC Undervoltage Lockout Threshold
INTVCC Undervoltage Lockout Hysteresis
VREF Regulation Voltage
VREF Load Regulation
VREF Line Regulation
VREF Current Limit
VREF Undervoltage Lockout Threshold
VREF Undervoltage Lockout Hysteresis
CONDITIONS
MIN
l
4
VEN/UVLO = 0.3V
VEN/UVLO = 1.1V
Not Switching
1
270
2.1
l
VEN/UVLO = 0.3V, VOUT = 12V
VEN/UVLO = 1.1V, VOUT = 12V
Not Switching, VOUT = 12V
0
20
IINTVCC = 20mA
IINTVCC = 0mA to 80mA
IINTVCC = 20mA, VIN = 6V to 60V
VINTVCC = 4.5V
IINTVCC = 20mA, VIN = 4V
Falling
IVREF = 100µA
IVREF = 0mA to 1mA
IVREF = 100µA, VIN = 4V to 60V
VREF = 1.8V
Falling
TYP
4.85
80
3.44
l
1.97
2
1.78
0.1
0.1
40
5.0
1
1
110
160
3.54
0.24
2.00
0.4
0.1
2.5
1.84
50
MAX
60
2
2.8
60
0.5
0.5
60
5.15
4
4
160
3.64
2.03
1
0.2
3.2
1.90
UNITS
V
µA
µA
mA
V
µA
µA
µA
V
%
%
mA
mV
V
V
V
%
%
mA
V
mV
Rev. C
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3
LT8390
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VEN/UVLO = 1.5V unless otherwise noted.
PARAMETER
Control Inputs/Outputs
EN/UVLO Shutdown Threshold
EN/UVLO Enable Threshold
EN/UVLO Enable Hysteresis
EN/UVLO Hysteresis Current
CTRL Input Bias Current
CTRL Latch-Off Threshold
CTRL Latch-Off Hysteresis
Load Switch Driver
LOADEN Threshold
LOADEN Hysteresis
Minimum VOUT for LOADTG to be On
LOADTG On Voltage V(VOUT-LOADTG)
LOADTG Off Voltage V(VOUT-LOADTG)
LOADEN to LOADTG Turn On Propagation Delay
LOADEN to LOADTG Turn Off Propagation Delay
LOADTG Turn On Fall Time
LOADTG Turn Off Rise Time
Error Amplifier
Full Scale Current Regulation V(ISP-ISN)
1/10th Current Regulation V(ISP-ISN)
ISMON Monitor Output VISMON
ISP/ISN Input Common Mode Range
ISP/ISN Low Side to High Side Switchover Voltage
ISP/ISN High Side to Low Side Switchover Voltage
ISP Input Bias Current
ISN Input Bias Current
ISP/ISN Current Regulation Amplifier gm
FB Regulation Voltage
FB Line Regulation
FB Load Regulation
FB Voltage Regulation Amplifier gm
FB Input Bias Current
VC Output Impedance
VC Standby Leakage Current
4
CONDITIONS
MIN
TYP
MAX
UNITS
l
0.3
1.196
1.0
1.244
VEN/UVLO = 0.3V
VEN/UVLO = 1.1V
VEN/UVLO = 1.3V
VCTRL = 0.75V, Current Out of Pin
Falling
l
–0.1
2.2
–0.1
0
285
0.6
1.220
13
0
2.5
0
20
300
25
V
V
mV
µA
µA
µA
nA
mV
mV
Rising
l
1.3
1.4
220
2.4
5
0
90
40
300
10
1.5
100
100
10
10
1.25
0.35
0.25
103
103
12
12
1.30
0.40
0.30
60
l
Falling
VLOADEN = 5V
VOUT = 12V
VOUT = 12V
CLOADTG = 3.3nF to VOUT, 50% to 50%
CLOADTG = 3.3nF to VOUT, 50% to 50%
CLOADTG = 3.3nF to VOUT, 10% to 90%
CLOADTG = 3.3nF to VOUT, 90% to 10%
VCTRL = 2V, VISP = 12V
VCTRL = 2V, VISP = 0V
VCTRL = 0.35V, VISP = 12V
VCTRL = 0.35V, VISP = 0V
V(ISP-ISN) = 100mV, VISP = 12V/0V
V(ISP-ISN) = 10mV, VISP = 12V/0V
V(ISP-ISN) = 0mV, VISP = 12V/0V
4.6
–0.1
l
l
l
l
l
l
l
l
97
97
8
8
1.20
0.30
0.20
0
VISP = VISN
VISP = VISN
VLOADEN = 5V, VISP = VISN = 12V
VLOADEN = 5V, VISP = VISN = 0V
VEN/UVLO = 0V, VISP = VISN = 12V or 0V
VLOADEN = 5V, VISP = VISN = 12V
VLOADEN = 5V, VISP = VISN = 0V
VEN/UVLO = 0V, VISP = VISN = 12V or 0V
VC = 1.2V
VIN = 4V to 60V
l
0.985
FB in Regulation, Current Out of Pin
VC = 1.2V, VLOADEN = 0V
–10
1.8
1.7
23
–10
0
23
–10
0
2000
1.00
0.2
0.2
660
10
10
0
0.1
2.8
0.1
50
315
3
5.4
0.1
1.015
0.5
0.8
40
10
V
mV
V
V
V
ns
ns
ns
ns
mV
mV
mV
mV
V
V
V
V
V
V
µA
µA
µA
µA
µA
µA
µs
V
%
%
µS
nA
MΩ
nA
Rev. C
For more information www.analog.com
LT8390
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VEN/UVLO = 1.5V unless otherwise noted.
PARAMETER
Current Comparator
Maximum Current Sense Threshold V(LSP-LSN)
Reverse Current Sense Threshold V(LSP-LSN)
LSP Pin Bias Current
LSN Pin Bias Current
Fault
FB Overvoltage Threshold (VFB)
FB Overvoltage Hysteresis
FB Short Threshold (VFB)
FB Short Hysteresis
ISP/ISN Over Current Threshold V(ISP-ISN)
PGOOD Upper Threshold Offset from VFB
PGOOD Lower Threshold Offset from VFB
PGOOD Pull-Down Resistance
SS Hard Pull-Down Resistance
SS Pull-Up Current
SS Pull-Down Current
SS Fault Latch-Off Threshold
SS Fault Reset Threshold
Oscillator
RT Pin Voltage
Switching Frequency
SYNC Frequency
SYNC/SPRD Input Bias Current
SYNC/SPRD Threshold Voltage
Highest Spread Spectrum Above Oscillator Frequency
Lowest Spread Spectrum Below Oscillator Frequency
Region Transition
Buck-Boost to Boost (VIN /VOUT)
Boost to Buck-Boost (VIN /VOUT)
Buck to Buck-Boost (VIN /VOUT)
Buck-Boost to Buck (VIN /VOUT)
Peak-Buck to Peak-Boost (VIN /VOUT)
Peak-Boost to Peak-Buck (VIN /VOUT)
CONDITIONS
MIN
TYP
MAX
UNITS
Buck, VFB = 0.8V
Boost, VFB = 0.8V
Buck, VFB = 0.8V
Boost, VFB = 0.8V
VLSP = VLSN = 12V
VLSP = VLSN = 12V
l
l
35
40
50
50
1
1
60
60
65
60
mV
mV
mV
mV
µA
µA
Rising
l
1.08
35
0.24
35
1.1
50
0.25
50
750
10
–10
100
100
12.5
1.25
1.7
0.2
1.12
65
0.26
65
V
mV
V
mV
mV
%
%
Ω
Ω
µA
µA
V
V
l
Falling
Hysteresis
VISP = 12V
Rising
Falling
l
l
l
l
VEN/UVLO = 1.1V
VFB = 0.4V, VSS = 0V
VFB = 0.1V, VSS = 2V
RT = 100kΩ
VSYNC/SPRD = 0V, RT = 226kΩ
VSYNC/SPRD = 0V, RT = 100kΩ
VSYNC/SPRD = 0V, RT = 59.0kΩ
VSYNC/SPRD = 5V
VSYNC/SPRD = 5V
VSYNC/SPRD = 5V
8
–12
10.5
1.05
l
l
l
1.00
200
400
600
12
–8
200
200
14.5
1.45
190
380
570
150
–0.1
0.4
12.5
–17.7
14.5
–15.7
210
420
630
650
0.1
1.5
16.5
–13.7
0.73
0.83
1.16
1.31
0.96
1.00
0.75
0.85
1.18
1.33
0.98
1.02
0.77
0.87
1.20
1.35
1.00
1.04
0
V
kHz
kHz
kHz
kHz
µA
V
%
%
Rev. C
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5
LT8390
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VEN/UVLO = 1.5V unless otherwise noted.
PARAMETER
NMOS Drivers
TG1, TG2 Gate Driver On-Resistance
Gate Pull-Up
Gate Pull-Down
BG1, BG2 Gate Driver On-Resistance
Gate Pull-Up
Gate Pull-Down
TG1, TG2 Rise Time
TG1, TG2 Fall Time
BG1, BG2 Rise Time
BG1, BG2 Fall Time
TG Off to BG On Delay
BG Off to TG On Delay
TG1 Minimum Duty Cycle in Buck Region
TG1 Maximum Duty Cycle in Buck Region
TG1 Fixed Duty Cycle in Buck-Boost Region
BG2 Fixed Duty Cycle in Buck-Boost Region
BG2 Minimum Duty Cycle in Boost Region
BG2 Maximum Duty Cycle in Boost Region
CONDITIONS
MIN
V(BST-SW) = 5V
VINTVCC = 5V
CL = 3.3nF, 10% to 90%
CL = 3.3nF, 90% to 10%
CL = 3.3nF, 10% to 90%
CL = 3.3nF, 90% to 10%
CL = 3.3nF
CL = 3.3nF
Peak-Buck Current Mode
Peak-Buck Current Mode
Peak-Boost Current Mode
Peak-Buck Current Mode
Peak-Boost Current Mode
Peak-Boost Current Mode
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LT8390E is guaranteed to meet performance specifications
from 0°C to 125°C operating junction temperature. Specifications over
the –40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LT8390I is guaranteed over the –40°C to 125°C operating junction
Efficiency vs Load Current
(Buck Region)
90
90
80
80
80
40
0
0.5
1
1.5 2 2.5 3
LOAD CURRENT (A)
70
60
50
3.5
4
8390 G01
6
EFFICIENCY (%)
90
EFFICIENCY (%)
100
EFFICIENCY (%)
100
FRONT PAGE APPLICATION
VIN = 24V, VOUT = 12V, fSW = 400kHz
40
0.5
1
Ω
Ω
3.2
1.2
25
20
25
20
60
60
10
95
85
15
10
95
Ω
Ω
ns
ns
ns
ns
ns
ns
%
%
%
%
%
%
1.5 2 2.5 3
LOAD CURRENT (A)
70
60
50
FRONT PAGE APPLICATION
VIN = 12V, VOUT = 12V, fSW = 400kHz
0
2.6
1.4
Efficiency vs Load Current
(Boost Region)
100
60
UNITS
TA = 25°C, unless otherwise noted.
Efficiency vs Load Current
(Buck-Boost Region)
70
MAX
temperature range. The LT8390J and LT8390H are guaranteed over the
–40°C to 150°C operating junction temperature range. High junction
temperatures degrade operating lifetimes. Operating lifetime is derated at
junction temperatures greater than 125°C.
Note 3: The LT8390 includes overtemperature protection that is intended
to protect the device during momentary overload conditions. Junction
temperature will exceed 150°C when overtemperature protection is active.
Continuous operation above the specified absolute maximum operating
junction temperature may impair device reliability.
TYPICAL PERFORMANCE CHARACTERISTICS
50
TYP
3.5
4
8390 G02
40
FRONT PAGE APPLICATION
VIN = 5V, VOUT = 12V, fSW = 400kHz
0
0.5
1
1.5 2 2.5 3
LOAD CURRENT (A)
3.5
4
8390 G03
Rev. C
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LT8390
TYPICAL PERFORMANCE CHARACTERISTICS
Switching Waveforms
(Buck Region)
TA = 25°C, unless otherwise noted.
Switching Waveforms
(Buck-Boost Region)
Switching Waveforms
(Boost Region)
VSW1
10V/DIV
VSW1
10V/DIV
VSW1
10V/DIV
VSW2
10V/DIV
VSW2
10V/DIV
VSW2
10V/DIV
IL
2A/DIV
IL
2A/DIV
IL
2A/DIV
VOUT
500mV/DIV
VOUT
500mV/DIV
VOUT
500mV/DIV
8390 G04
1µs/DIV
FRONT PAGE APPLICATION
VIN = 18V, IOUT = 3A
VOUT vs IOUT (CV/CC)
VIN Shutdown Current
10
3.0
2.8
2.5
2.6
2.0
8
IQ (µA)
OUTPUT VOLTAGE (V)
12
6
VIN = 60V
1.5
VIN = 12V
1.0
4
0
1
2
3
4
LOAD CURRENT (A)
5
VIN Quiescent Current
VIN = 60V
2.4
VIN = 12V
2.2
2.0
VIN = 4V
0.0
–50 –25
6
8390 G07
0
1.8
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G09
8390 G08
INTVCC Voltage vs Temperature
INTVCC Voltage vs VIN
5.15
5.15
5.10
5.10
5.05
5.05
INTVCC UVLO Threshold
4.0
3.9
5.00
IINTVCC = 80mA
IINTVCC = 20mA
VINTVCC (V)
VINTVCC (V)
VINTVCC (V )
3.8
IINTVCC = 0mA
5.00
4.95
4.95
4.90
4.90
8390 G06
VIN = 4V
0.5
2
0
1µs/DIV
FRONT PAGE APPLICATION
VIN = 8V, IOUT = 3A
IQ (mA)
14
8390 G05
1µs/DIV
FRONT PAGE APPLICATION
VIN = 12V, IOUT = 3A
RISING
3.7
3.6
FALLING
3.5
3.4
4.85
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
4.85
3.3
0
10
20
30
VIN (V)
40
50
60
8390 G11
8390 G10
3.2
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G12
Rev. C
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7
LT8390
TYPICAL PERFORMANCE CHARACTERISTICS
2.03
2.03
2.02
2.02
2.01
2.01
IVREF = 0mA
2.00
VREF Voltage vs VIN
2.00
IVREF = 100µA
2.00
1.99
1.99
IVREF = 1mA
1.98
RISING
1.85
FALLING
1.80
1.75
1.97
0
1.90
1.98
1.97
1.96
–50 –25
VREF UVLO Threshold
1.95
VREF (V)
2.04
VREF (V)
VREF (V)
VREF Voltage vs Temperature
2.04
TA = 25°C, unless otherwise noted.
1.96
25 50 75 100 125 150
TEMPERATURE (°C)
0
10
20
30
VIN (V)
40
50
1.70
–50 –25
60
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G14
8390 G13
EN/UVLO Enable Threshold
8390 G15
EN/UVLO Hysteresis Current
1.240
CTRL Latch-Off Threshold
0.40
3.0
1.235
2.8
1.230
0.35
RISING
RISING
1.220
FALLING
1.215
1.210
2.6
VCTRL (V)
IHYS (µA)
VEN/UVLO (V)
1.225
2.4
0.30
FALLING
0.25
2.2
1.205
1.200
–50 –25
0
2.0
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
0
0.20
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G18
8390 G16
8390 G17
V(ISP-ISN) Regulation vs VCTRL
V(ISP-ISN) (mV)
V(ISP-ISN) (mV)
100
75
50
25
106
106
104
104
102
102
V(ISP-ISN) (mV)
125
0
V(ISP-ISN) Regulation
vs Temperature
V(ISP-ISN) Regulation vs VISP
100
98
96
0
0.25 0.50 0.75 1 1.25 1.50 1.75
VCTRL (V)
2
8390 G19
94
98
ISP = 0V
ISP = 12V
ISP = 60V
96
0
10
20
30
VISP (V)
40
50
60
8390 G20
8
100
94
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G21
Rev. C
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LT8390
TYPICAL PERFORMANCE CHARACTERISTICS
1.03
100
1.02
80
1.01
60
65
1.00
40
0.99
20
0.98
0
0.96 0.97 0.98 0.99 1.00 1.01 1.02 1.03 1.04
VFB (V)
70
CURRENT LIMIT (mV)
120
0.97
–50 –25
VIN = 4V
VIN = 12V
VIN = 60V
0
1.15
0.35
40
RISING
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G24
PGOOD Thresholds
15
0.30
FALLING
BUCK
BOOST
20
RISING
VFB (V)
VFB (V)
45
FB Short Threshold
0.40
FALLING
0.25
0.20
1.00
0.15
0.95
0
50
30
–50 –25
THRESHOLD OFFSET (%)
FB Overvoltage Threshold
0.90
–50 –25
55
8390 G23
1.20
1.05
60
35
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G22
1.10
Maximum Current Sense
vs Temperature
FB Regulation vs Temperature
VFB (V)
V(ISP-ISN) (mV)
V(ISP-ISN) Regulation vs VFB
TA = 25°C, unless otherwise noted.
UPPER FALLING
5
0
–5
LOWER RISING
–10
LOWER FALLING
–15
0.10
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
UPPER RISING
10
0
–20
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G25
8390 G27
8390 G26
Oscillator Frequency
vs Temperature
SS Current vs Temperature
15.0
700
1.25
12.5
600
1.00
10.0
0.75
5.0
0.25
2.5
0
20
40
60
V(ISP-ISN) (mV)
80
100
PULL-UP
7.5
0.50
0
SWITCHING FREQUENCY (kHz)
RT = 59.0k
ISS (µA)
VISMON (V)
1.50
ISMON Voltage vs V(ISP-ISN)
0.0
–50 –25
PULL-DOWN
0
25 50 75 100 125 150
TEMPERATURE (°C)
500
RT = 100k
400
300
RT = 226k
200
100
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
8390 G28
8390 G29
8390 G30
Rev. C
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9
LT8390
PIN FUNCTIONS
BG1: Buck Side Bottom Gate Drive. Drives the gate of buck
side bottom N-channel MOSFET with a voltage swing from
ground to INTVCC.
BST1: Buck Side Bootstrap Floating Driver Supply. The
BST1 pin has an integrated bootstrap Schottky diode from
the INTVCC pin and requires an external bootstrap capacitor
to the SW1 pin. The BST1 pin swings from a diode voltage
drop below INTVCC to (VIN + INTVCC).
SW1: Buck Side Switch Node. The SW1 pin swings from
a Schottky diode voltage drop below ground up to VIN.
LOADEN: Load Switch Enable Input. The LOADEN pin is
used to control the ON/OFF of the high side PMOS load
switch. If the load switch control is not used, tie this pin
to VREF or INTVCC. Forcing the pin low turns off TG1 and
TG2, turns on BG1 and BG2, disconnects the VC pin from
all internal loads, and turns off LOADTG.
VREF: Voltage Reference Output. The VREF pin provides an
accurate 2V reference capable of supplying 1mA current.
Locally bypass this pin to ground with a 0.47µF ceramic
capacitor.
TG1: Buck Side Top Gate Drive. Drives the gate of buck
side top N-channel MOSFET with a voltage swing from
SW1 to BST1.
CTRL: Control Input for ISP/ISN Current Sense Threshold.
The CTRL pin is used to program the ISP/ISN current limit:
LSP: Positive Terminal of the Buck Side Inductor Current
Sense Resistor (RSENSE). Ensure accurate current sense
with Kelvin connection.
LSN: Negative Terminal of the Buck Side Inductor Current
Sense Resistor (RSENSE). Ensure accurate current sense
with Kelvin connection.
VIN: Input Supply. The VIN pin must be tied to the power
input to determine the buck, buck-boost, or boost operation
regions. Locally bypass this pin to ground with a minimum
1µF ceramic capacitor.
INTVCC: Internal 5V Linear Regulator Output. The INTVCC
linear regulator is supplied from the VIN pin, and powers the
internal control circuitry and gate drivers. Locally bypass
this pin to ground with a minimum 4.7µF ceramic capacitor.
EN/UVLO: Enable and Undervoltage Lockout. Force the pin
below 0.3V to shut down the part and reduce VIN quiescent
current below 2µA. Force the pin above 1.233V for normal
operation. The accurate 1.220V falling threshold can be used
to program an undervoltage lockout (UVLO) threshold with
a resistor divider from VIN to ground. An accurate 2.5µA
pull-down current allows the programming of VIN UVLO hysteresis. If neither function is used, tie this pin directly to VIN.
TEST: Factory Test. This pin is used for testing purpose
only and must be directly connected to ground for the
part to operate properly.
10
IIS(MAX) =
Min ( VCTRL – 0.25V,1V )
10 • RIS
The VCTRL can be set by an external voltage reference or
a resistor divider from VREF to ground. For 0.3V ≤ VCTRL
≤ 1.15V, the current sense threshold linearly goes up
from 5mV to 90mV. For VCTRL ≥ 1.35V, the current sense
threshold is constant at 100mV full scale value. For 1.15V
≤ VCTRL ≤ 1.35V, the current sense threshold smoothly
transitions from the linear function of VCTRL to the 100mV
constant value. Tie CTRL to VREF for the 100mV full scale
threshold. Force the pin below 0.3V to stop switching.
ISP: Positive Terminal of the ISP/ISN Current Sense Resistor (RIS). Ensure accurate current sense with Kelvin
connection.
ISN: Negative Terminal of the ISP/ISN Current Sense
Resistor (RIS). Ensure accurate current sense with Kelvin
connection.
ISMON: ISP/ISN Current Sense Monitor Output. The ISMON
pin generates a voltage that is equal to ten times V(ISP-ISN)
plus 0.25V offset voltage. For parallel applications, tie the
master LT8390 ISMON pin to the slave LT8390 CTRL pin.
PGOOD: Power Good Open Drain Output. The PGOOD
pin is pulled low when the FB pin is within ±10% of the
final regulation voltage. To function, the pin requires an
external pull-up resistor.
Rev. C
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LT8390
PIN FUNCTIONS
SS: Soft-Start Timer Setting. The SS pin is used to set
soft-start timer by connecting a capacitor to ground. An
internal 12.5µA pull-up current charging the external SS
capacitor gradually ramps up FB regulation voltage. A
0.1µF capacitor is recommended on this pin. Any UVLO or
thermal shutdown immediately pulls SS pin to ground and
stops switching. Using a single resistor from SS to VREF,
the LT8390 can be set in three different fault protection
modes during output short-circuit condition: hiccup (no
resistor), latch-off (499kΩ), and keep-running (100kΩ).
See more details in the Application Information section.
FB: Voltage Loop Feedback Input. The FB pin is used for
constant-voltage regulation and output fault protection.
The internal error amplifier with its output VC regulates
VFB to 1.00V through the DC/DC converter. During output
short-circuit (VFB < 0.25V) condition, the part gets into one
fault mode per customer setting. During an overvoltage
(VFB > 1.1V) condition, the part turns off all TG1, BG1,
TG2, BG2, and LOADTG.
VC: Error Amplifier Output to Set Inductor Current Comparator Threshold. The VC pin is used to compensate the
control loop with an external RC network. During LOADEN
low state, the VC pin is disconnected from all internal loads
to store its voltage information.
RT: Switching Frequency Setting. Connect a resistor from
this pin to ground to set the internal oscillator frequency
from 150kHz to 650kHz.
SYNC/SPRD: Switching Frequency Synchronization or
Spread Spectrum. Ground this pin for switching at inter-
nal oscillator frequency. Apply a clock signal for external
frequency synchronization. Tie to INTVCC for ±15% triangle
spread spectrum around internal oscillator frequency.
LOADTG: High Side PMOS Load Switch Top Gate Drive. A
buffered and inverted version of the LOADEN input signal, the
LOADTG pin drives an external high side PMOS load switch
with a voltage swing from the higher voltage of (VOUT-5V)
and 1.2V to VOUT. Leave this pin unconnected if not used.
VOUT: Output Supply. The VOUT pin must be tied to the
power output to determine the buck, buck-boost, or boost
operation regions. The VOUT pin also serves as positive rail
for the LOADTG drive. Locally bypass this pin to ground
with a minimum 1µF ceramic capacitor.
TG2: Boost Side Top Gate Drive. Drives the gate of boost
side top N-Channel MOSFET with a voltage swing from
SW2 to BST2.
SW2: Boost Side Switch Node. The SW2 pin swings from
a Schottky diode voltage drop below ground to VOUT.
BST2: Boost Side Bootstrap Floating Driver Supply. The
BST2 pin has an integrated bootstrap Schottky diode from
the INTVCC pin and requires an external bootstrap capacitor
to the SW2 pin. The BST2 pin swings from a diode voltage
drop below INTVCC to (VOUT + INTVCC).
BG2: Boost Side Bottom Gate Drive. Drives the gate of
boost side bottom N-channel MOSFET with a voltage
swing from ground to INTVCC.
GND (Exposed Pad): Ground. Solder the exposed pad
directly to the ground plane.
Rev. C
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11
LT8390
BLOCK DIAGRAM
LSN
VIN
INTVCC
LSP
INTVCC
+
5V LDO
A1
–
VREF
D1
+
–
2V REF
BST1
A3
TG1
PEAK_BUCK
SW1
BUCK
LOGIC
INTVCC
LOADON
RT
OSC
SYNC/SPRD
+
–
0.3V
CTRL
ISMON
BG1
VOS
1X
EN/UVLO
1.220V
+
–
FBOV
VIS
VOUT/BST2
VIN/BST1
CHARGE
CONTROL
FB
1.1V
INHIBIT
SWITCH
–
+
BG2
+
–
ISOC
2.5µA
LOADON
VISP-ISN
0.75V
PEAK_BOOST
BOOST
LOGIC
INTVCC
SW2
TG2
+
–
LOADEN
BST2
D2
TEST
VOUT
A4
LOADON
+
–
0.25V
FB
SHORT
VREF
12.5µA
LOADTG
PGOOD
VOUT –5V
+
–
1.1V
+
–
FB
FAULT
LOGIC
FB
EA2
1.25µA
0.9V
1V
+
+
FB
CTRL
1.25V
–
LOADON
SS
INTVCC
+
EA1 +
–
VC
GND
+
VIS
+
A2=10
–
ISP
ISN
0.25V
8391 BD
12
Rev. C
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LT8390
OPERATION
The LT8390 is a current mode DC/DC controller that can
regulate output voltage, input or output current from input voltage above, below, or equal to the output voltage.
The ADI proprietary peak-buck peak-boost current mode
control scheme uses a single inductor current sense resistor and provides smooth transition between buck region,
buck-boost region, and boost region. Its operation is best
understood by referring to the Block Diagram.
VIN
VOUT
A
TG1
SW1
RSENSE
D
L
B
BG1
TG2
SW2
C
BG2
8390 F01
Figure 1. Simplified Diagram of the Power Switches
Power Switch Control
Figure 1 shows a simplified diagram of how the four power
switches A, B, C, and D are connected to the inductor L,
the current sense resistor RSENSE, power input VIN, power
output VOUT, and ground. The current sense resistor RSENSE
connected to the LSP and LSN pins provides inductor
current information for both peak current mode control
and reverse current detection in buck region, buck-boost
region, and boost region. Figure 2 shows the current mode
control as a function of VIN/VOUT ratio and Figure 3 shows
the operation region as a function of VIN/VOUT ratio. The
power switches are properly controlled to smoothly transition between modes and regions. Hysteresis is added to
prevent chattering between modes and regions.
There are total four states: (1) peak-buck current mode
control in buck region, (2) peak-buck current mode control in buck-boost region, (3) peak-boost current mode
control in buck-boost region, and (4) peak-boost current
mode control in boost region. The following sections give
detailed description for each state with waveforms, in
which the shoot-through protection dead time between
switches A and B, between switches C and D are ignored
for simplification.
PEAK-BUCK
PEAK-BOOST
0.98 1.00 1.02
VIN/VOUT
8390 F02
Figure 2. Current Mode vs VIN/VOUT Ratio
(1)
BUCK
(3)
(2)
BUCK-BOOST
(2)
BOOST
(4)
0.75
0.85
1.00
VIN/VOUT
1.18
1.33
8390 F03
Figure 3. Operation Region vs VIN/VOUT Ratio
Rev. C
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13
LT8390
OPERATION
(1) Peak-Buck in Buck Region (VIN >> VOUT)
(2) Peak-Buck in Buck-Boost Region (VIN ~> VOUT)
When VIN is much higher than VOUT, the LT8390 uses
peak-buck current mode control in buck region (Figure 4).
Switch C is always off and switch D is always on. At the
beginning of every cycle, switch A is turned on and the
inductor current ramps up. When the inductor current hits
the peak buck current threshold commanded by VC voltage
at buck current comparator A3 during (A+D) phase, switch
A is turned off and switch B is turned on for the rest of
the cycle. Switches A and B will alternate, behaving like a
typical synchronous buck regulator.
When VIN is slightly higher than VOUT, the LT8390 uses
peak-buck current mode control in buck-boost region
(Figure 5). Switch C is always turned on for the beginning
15% cycle and switch D is always turned on for the remaining 85% cycle. At the beginning of every cycle, switches
A and C are turned on and the inductor current ramps
up. After 15% cycle, switch C is turned off and switch D
is turned on, and the inductor keeps ramping up. When
the inductor current hits the peak buck current threshold
commanded by VC voltage at buck current comparator A3
during (A+D) phase, switch A is turned off and switch B
is turned on for the rest of the cycle.
A
A
B
B
C
100% OFF
C
D
100% ON
D
15%
85%
IL
IL
A+D
B+D
B+D
A+D
14
85%
A+D
A+C
A+D
B+D
A+C
B+D
8390 F05
8390 F04
Figure 4. Peak-Buck in Buck Region (VIN >> VOUT)
15%
Figure 5. Peak-Buck in Buck-Boost Region (VIN ~> VOUT)
Rev. C
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LT8390
OPERATION
(3) Peak-Boost in Buck-Boost Region (VIN
)
(
VIN(MIN)2 • VOUT – VIN(MIN)
f •IOUT(MAX) • ΔIL % • VOUT
)
2
Slope compensation provides stability in constant frequency current mode control by preventing subharmonic
oscillations at certain duty cycles. The minimum inductance
required for stability when duty cycles are larger than 50%
can be calculated as:
L>
10 • VOUT • RSENSE
f
For high efficiency, choose an inductor with low core loss,
such as ferrite. Also, the inductor should have low DC
resistance to reduce the I2R losses, and must be able to
handle the peak inductor current without saturating. To
minimize radiated noise, use a shielded inductor.
RSENSE Selection and Maximum Output Current
RSENSE is chosen based on the required output current.
The duty cycle independent maximum current sense
thresholds (50mV in peak-buck and 50mV in peak-boost)
set the maximum inductor peak current in buck region,
buck-boost region, and boost region.
In boost region, the lowest maximum average load current
happens at VIN(MIN) and can be calculated as:
⎛ 50mV ΔIL(BOOST) ⎞ VIN(MIN)
IOUT(MAX _BOOST) = ⎜
–
⎟⎠ • V
2
⎝ RSENSE
OUT
where ∆IL(BOOST) is peak-to-peak inductor ripple current
in boost region and can be calculated as:
where:
ΔIL % =
ΔIL
IL(AVG)
f is switching frequency
ΔIL(BOOST) =
(
VIN(MIN) • VOUT − VIN(MIN)
f • L • VOUT
)
In buck region, the lowest maximum average load current
happens at VIN(MAX) and can be calculated as:
VIN(MIN) is minimum input voltage
⎛ 50mV ΔIL(BUCK) ⎞
IOUT(MAX _BUCK) = ⎜
−
⎟⎠
2
⎝ RSENSE
VIN(MAX) is maximum input voltage
VOUT is output voltage
where ∆IL(BUCK) is peak-to-peak inductor ripple current in
buck region and can be calculated as:
IOUT(MAX) is maximum output current
ΔIL(BUCK) =
(
VOUT • VIN(MAX) − VOUT
f • L • VIN(MAX)
)
Rev. C
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19
LT8390
APPLICATIONS INFORMATION
The maximum current sense RSENSE in boost region is:
2 • 50mV • VIN(MIN)
ρT NORMALIZED ON-RESISTANCE (Ω)
RSENSE(BOOST) =
2.0
2 •IOUT(MAX) • VOUT + ΔIL(BOOST) • VIN(MIN)
The maximum current sense RSENSE in buck region is
RSENSE(BUCK) =
2 • 50mV
2 •IOUT(MAX) + ΔIL(BUCK)
The final RSENSE value should be lower than the calculated
RSENSE in both buck and boost regions. A 20% to 30%
margin is usually recommended. Always choose a low
ESL current sense resistor.
Power MOSFET Selection
The LT8390 requires four external N-channel power MOSFETs, two for the top switches (switches A and D shown
in Figure 1) and two for the bottom switches (switches B
and C shown in Figure 1). Important parameters for the
power MOSFETs are the breakdown voltage VBR(DSS),
threshold voltage VGS(TH), on-resistance RDS(ON), reverse
transfer capacitance CRSS and maximum current IDS(MAX).
The drive voltage is set by the 5V INTVCC supply. Consequently, logic-level threshold MOSFETs must be used in
LT8390 applications.
In order to select the power MOSFETs, the power dissipated by the device must be known. For switch A, the
maximum power dissipation happens in boost region, when
it remains on all the time. Its maximum power dissipation
at maximum output current is given by:
2
⎛ IOUT(MAX) • VOUT ⎞
PA(BOOST) = ⎜
⎟⎠ • ρT • RDS(ON)
V
⎝
IN
where ρT is a normalization factor (unity at 25°C) accounting for the significant variation in on-resistance with
temperature, typically 0.4%/°C as shown in Figure 11. For
a maximum junction temperature of 125°C, using a value
of ρT = 1.5 is reasonable.
1.5
1.0
0.5
0
–50
50
100
0
JUNCTION TEMPERATURE (°C)
150
8390 F11
Figure 11. Normalized RDS(ON) vs Temperature
Switch B operates in buck region as the synchronous
rectifier. Its power dissipation at maximum output current is given by:
PB(BUCK) =
VIN − VOUT
•IOUT(MAX)2 • ρT • RDS(ON)
VIN
Switch C operates in boost region as the control switch.
Its power dissipation at maximum current is given by:
PC(BOOST) =
( VOUT − VIN ) • VOUT •I
VIN
2
• RDS(ON) + k • VOUT3 •
2
OUT(MAX)
IOUT(MAX)
VIN
• ρT
• CRSS • f
where CRSS is usually specified by the MOSFET manufacturers. The constant k, which accounts for the loss caused
by reverse recovery current, is inversely proportional to
the gate drive current and has an empirical value of 1.7.
For switch D, the maximum power dissipation happens in
boost region, when its duty cycle is higher than 50%. Its
maximum power dissipation at maximum output current
is given by:
PD(BOOST) =
VOUT
•IOUT(MAX) 2 • ρT • RDS(ON)
VIN
For the same output voltage and current, switch A has the
highest power dissipation and switch B has the lowest
power dissipation unless a short occurs at the output.
20
Rev. C
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LT8390
APPLICATIONS INFORMATION
From a known power dissipated in the power MOSFET, its
junction temperature can be obtained using the following
formula:
TJ = TA + P • RTH(JA)
The junction-to-ambient thermal resistance RTH(JA) includes the junction-to-case thermal resistance RTH(JC)
and the case-to-ambient thermal resistance RTH(CA). This
value of TJ can then be compared to the original, assumed
value used in the iterative calculation process.
the higher ESR bulk capacitors. X5R or X7R dielectrics are
preferred, as these materials retain their capacitance over
wide voltage and temperature ranges. Many ceramic capacitors, particularly 0805 or 0603 case sizes, have greatly
reduced capacitance at the desired operating voltage.
Input Capacitance CIN: Discontinuous input current is
highest in the buck region due to the switch A toggling
on and off. Make sure that the CIN capacitor network has
low enough ESR and is sized to handle the maximum RMS
current. In buck region, the input RMS current is given by:
Optional Schottky Diode (DB, DD) Selection
The optional Schottky diodes DB (in parallel with switch
B) and DD (in parallel with switch D) conduct during the
dead time between the conduction of the power MOSFET
switches. They are intended to prevent the body diode of
synchronous switches B and D from turning on and storing
charge during the dead time. In particular, DB significantly
reduces reverse recovery current between switch B turnoff and switch A turn-on, and DD significantly reduces
reverse recovery current between switch D turn-off and
switch C turn-on. They improve converter efficiency and
reduce switch voltage stress. In order for the diode to be
effective, the inductance between it and the synchronous
switch must be as small as possible, mandating that these
components be placed adjacently.
Ceramic capacitors should be placed near the regula-tor
input and output to suppress high frequency switching
spikes. Ceramic capacitors, of at least 1µF, should also
be placed from VIN to GND and VOUT to GND as close to
the LT8390 pins as possible. Due to their excellent low
ESR characteristics, ceramic capacitors can significantly
reduce input ripple voltage and help reduce power loss in
VOUT
VIN
•
–1
VIN
VOUT
The formula has a maximum at VIN = 2VOUT, where IRMS
= IOUT(MAX) /2. This simple worst-case condition is commonly used for design because even significant deviations
do not offer much relief.
Output Capacitance COUT: Discontinuous current shifts
from the input to the output in the boost region. Make sure
that the COUT capacitor network is capable of reducing
the output voltage ripple. The effects of ESR and the bulk
capacitance must be considered when choosing the right
capacitor for a given output ripple voltage. The maximum
steady state ripple due to charging and discharging the
bulk capacitance is given by:
CIN and COUT Selection
Input and output capacitance is necessary to suppress
voltage ripple caused by discontinuous current moving
in and out the regulator. A parallel combination of capacitors is typically used to achieve high capacitance and low
equivalent series resistance (ESR). Dry tantalum, special
polymer, aluminum electrolytic and ceramic capacitors are
all available in surface mount packages. Capacitors with
low ESR and high ripple current ratings, such as OS-CON
and POSCAP are also available.
IRMS ≈ IOUT(MAX) •
ΔVCAP(BOOST) =
ΔVCAP(BUCK) =
(
IOUT(MAX) • VOUT − VIN(MIN)
COUT • VOUT • f
)
⎛
⎞
V
VOUT • ⎜ 1− OUT ⎟
⎝ VIN(MAX) ⎠
8 • L • f2 • COUT
The maximum steady ripple due to the voltage drop across
the ESR is given by:
ΔVESR(BOOST) =
VOUT •IOUT(MAX)
VIN(MIN)
• ESR
⎛
⎞
V
VOUT • ⎜ 1− OUT ⎟
⎝ VIN(MAX) ⎠
• ESR
ΔVESR(BUCK) =
L•f
For more information www.analog.com
Rev. C
21
LT8390
APPLICATIONS INFORMATION
INTVCC Regulator
Programming VIN UVLO
An internal P-channel low dropout regulator produces
5V at the INTVCC pin from the VIN supply pin. The INTVCC
powers internal circuitry and gate drivers in the LT8390.
The INTVCC regulator can supply a peak current of 110mA
and must be bypassed to ground with a minimum of
4.7µF ceramic capacitor. Good local bypass is necessary
to supply the high transient current required by MOSFET
gate drivers.
A resistor divider from VIN to the EN/UVLO pin implements
VIN undervoltage lockout (UVLO). The EN/UVLO enable
falling threshold is set at 1.220V with 13mV hysteresis. In
addition, the EN/UVLO pin sinks 2.5µA when the voltage
on the pin is below 1.220V. This current provides user
programmable hysteresis based on the value of R1. The
programmable UVLO thresholds are:
Higher input voltage applications with large MOSFETs
being driven at higher switching frequencies may cause
the maximum junction temperature rating for the LT8390
to be exceeded. The system supply current is normally
dominated by the gate charge current. Additional external
loading of the INTVCC also needs to be taken into account
for the power dissipation calculation. The total LT8390
power dissipation in this case is VIN • IINTVCC, and overall
efficiency is lowered. The junction temperature can be
estimated by using the equation:
R1+ R2
+ 2.5µA • R1
R2
R1+ R2
VIN(UVLO–) = 1.220V •
R2
VIN(UVLO+) = 1.233V •
Figure 12 shows the implementation of external shut-down
control while still using the UVLO function. The NMOS
grounds the EN/UVLO pin when turned on, and puts the
LT8390 in shutdown with quiescent current less than 2µA.
VIN
TJ = TA + PD • θJA
R1
EN/UVLO
where θJA (in °C/W) is the package thermal resistance.
LT8390
To prevent maximum junction temperature from being
exceeded, the input supply current must be checked operating in continuous mode at maximum VIN.
8390 F12
Figure 12. VIN Undervoltage Lockout (UVLO)
Programming Input or Output Current Limit
The input or output current limit can be programmed by
placing an appropriate value current sense resistor, RIS, in
the input or output power path. The voltage drop across
RIS is (Kelvin) sensed by the ISP and ISN pins. The CTRL
pin should be tied to a voltage higher than 1.35V to get
the full-scale 100mV (typical) threshold across the sense
resistor. The CTRL pin can be used to reduce the current
threshold to zero, although relative accuracy decreases
with the decreasing sense threshold. When the CTRL pin
voltage is between 0.3V and 1.15V, the current limit is:
22
RUN/STOP
CONTROL
(OPTIONAL)
GND
Top Gate MOSFET Driver Supply (CBST1, CBST2)
The top MOSFET drivers, TG1 and TG2, are driven between
their respective SW and BST pin voltages. The boost
voltages are biased from floating bootstrap capacitors
CBST1 and CBST2, which are normally re-charged through
internal bootstrap diodes D1 and D2 when the respective
top MOSFET is turned off. Both capacitors are charged
to the same voltage as the INTVCC voltage. The bootstrap
capacitors CBST1 and CBST2, need to store about 100 times
the gate charge required by the top switches A and D. In
most applications, a 0.1µF to 0.47µF, X5R or X7R dielectric
capacitor is adequate.
R2
IIS(MAX) =
VCTRL – 0.25V
10 • RIS
Rev. C
For more information www.analog.com
LT8390
APPLICATIONS INFORMATION
When VCTRL is between 1.15V and 1.35V the current limit
varies with VCTRL, but departs from the equation above
by an increasing amount as VCTRL increases. Ultimately,
when VCTRL is larger than 1.35V, the current limit no longer
varies. The typical V(ISP-ISN) threshold vs VCTRL is listed
in Table 2.
RIS
FROM POWER
INPUT
ISN
ISP
LT8390
Table 2. V(ISP-ISN) Threshold vs VCTRL
8390 F13a
VCTRL (V)
V(ISP-ISN) (mV)
1.15
90
1.20
94.5
1.25
98
1.30
99.5
1.35
100
(13a)
FROM POWER
INPUT
RIS
+
RF
TO DRAIN OF
SWITCH A
RF
CF
ISN
ISP
LT8390
When VCTRL is larger than 1.35V, the current threshold
is regulated to:
IIS(MAX) =
TO DRAIN OF
SWITCH A
+
8390 F13b
(13b)
100mV
RIS
Figure 13. Programming Input Current Limit
The CTRL pin should not be left open (tie to VREF if not
used). The CTRL pin can also be used in conjunction with
a thermistor to provide overtemperature protection for
the output load, or with a resistor divider to VIN to reduce
output power and switching current when VIN is low.
The presence of a time varying differential voltage ripple
signal across the ISP and ISN pins at the switching
frequency is expected. If the current sense resistor RIS
is placed between power input and input bulk capacitor
(Figure 13a), or between output bulk capacitor and system
output (Figure 14a), a filter is typically not necessary. If
the RIS is placed between input bulk capacitor and input
decoupling capacitor (Figure 13b), or between output decoupling capacitor and output bulk capacitor (Figure 14b),
a low pass filter formed by RF and CF is recommended
to reduce the current ripple and stabilize the current
loop. Since the bias currents of the ISP and ISN pins are
matched, no offset is introduced by RF. If input or output
current limit is not used, the ISP and ISN pins should be
shorted to VIN, VOUT, or ground.
FROM DRAIN OF
SWITCH D
RIS
TO SYSTEM
OUTPUT
+
ISN
ISP
LT8390
8390 F14a
(14a)
RIS
FROM DRAIN OF
SWITCH D
RF
CF
RF
+
TO SYSTEM
OUTPUT
ISN
ISP
LT8390
8390 F14b
(14b)
Figure 14. Programming Output Current Limit
Rev. C
For more information www.analog.com
23
LT8390
APPLICATIONS INFORMATION
ISMON Current Monitor
VOUT
The ISMON pin provides a buffered monitor output of the
current flowing through the ISP/ISN current sense resistor,
RIS. The VISMON voltage is calculated as V(ISP-ISN) • 10 +
0.25V. Since the ISMON pin has the same 0.25V offset
as the CTRL pin, the master LT8390 ISMON pin can be
directly tied to the slave LT8390 CTRL pin for equal current
sharing in parallel applications.
Load Switch Control
The LOADEN and LOADTG pins provide high side PMOS
load switch control. The LOADEN pin accepts a logic level
ON/OFF signal and then drives the LOADTG pin to turn on
or off the high side PMOS load switch, thereby connecting or disconnecting the LT8390 power output from the
system output. When the LOADEN pin is forced low, the
LT8390 turns off TG1 and TG2, turns on BG1 and BG2,
disconnects the VC pin from all internal loads, and turns
off LOADTG. The LOADEN pin should not be left open (tie
to INTVCC or VREF if not used).
R3
LT8390
FB
R4
8390 F15
Figure 15. Feedback Resistor Connection
capacitors, the output voltage may overshoot a lot during
load transient event. Once the FB pin hits its overvoltage
threshold 1.1V, the LT8390 stops switching by turning
off TG1, BG1, TG2, and BG2, and also turns off LOADTG
to disconnect the output load for protection. The output
overvoltage threshold can be set as:
VOUT(OVP) = 1.1V •
R3 + R4
R4
To provide the output short-circuit detection and protection, the output short threshold can be set as:
VOUT(SHORT) = 0.25V •
R3 + R4
R4
High Side PMOS Load Switch Selection
A high side PMOS load switch is recommended in some
LT8390 applications requiring load switch control. The high
side PMOS load switch is typically selected for drain-source
voltage VDS, gate-source threshold voltage VGS(TH), and
continuous drain current ID. For proper operations, VDS
rating should exceed the output regulation voltage set by
the FB pin, the absolute value of VGS(TH) should be less
than 3V, and ID rating should be above IOUT(MAX).
Power GOOD (PGOOD) Pin
Programming Output Voltage and Thresholds
The LT8390 has a voltage feedback pin FB that can be
used to program a constant-voltage output. The output
voltage can be set by selecting the values of R3 and R4
(Figure 15) according to the following equation:
VOUT = 1V •
R3 + R4
R4
In addition, the FB pin also sets output overvoltage
threshold, PGOOD upper and lower thresholds, and output short threshold. For an application with small output
24
The LT8390 provides an open-drain status pin, PGOOD,
which is pulled low when VFB is within ±10% of the 1.00V
regulation voltage. The PGOOD pin is allowed to be pulled
up by an external resistor to INTVCC or an external voltage
source of up to 6V.
Soft-Start and Short-Circuit Protection
As shown in Figure 8 and explained in the Operation section, the SS pin can be used to program the output voltage
soft-start by connecting an external capacitor from the SS
pin to ground. The internal 12.5µA pull-up current charges
up the capacitor, creating a voltage ramp on the SS pin.
As the SS pin voltage rises linearly from 0.25V to 1V (and
beyond), the output voltage rises smoothly into its final
voltage regulation. The soft-start time can be calculated as:
tSS = 1V •
CSS
12.5µA
Rev. C
For more information www.analog.com
LT8390
APPLICATIONS INFORMATION
Make sure the CSS is at least five to ten times larger than the
compensation capacitor on the VC pin for a well-controlled
output voltage soft-start. A 0.1µF ceramic capacitor is a
good starting point.
The SS pin is also used as a fault timer. Once an output
short-circuit fault is detected, a 1.25µA pull-down current
source is activated. Using a single resistor from the SS
pin to the VREF pin, the LT8390 can be set to three different fault protection modes: hiccup (no resistor), latch-off
(499kΩ), and keep-running (100kΩ).
With a 100kΩ resistor in keep-running mode, the LT8390
continues switching normally and regulates the current
into ground. With a 499kΩ resistor in latch-off mode, the
LT8390 stops switching until the EN/UVLO pin is pulled
low and high to restart. With no resistor in hiccup mode,
the LT8390 enters low duty cycle auto-retry operation. The
1.25µA pull-down current discharges the SS pin to 0.2V
and then 12.5µA pull-up current charges the SS pin up. If
the output short-circuit condition has not been removed
when the SS pin reaches 1.75V, the 1.25µA pull-down
current turns on again, initiating a new hiccup cycle. This
will continue until the fault is removed. Once the output
short-circuit condition is removed, the output will have a
smooth short-circuit recovery due to soft-start.
Loop Compensation
The LT8390 uses an internal transconductance error amplifier, the output of which, VC, compensates the control loop.
The external inductor, output capacitor, and the compensation resistor and capacitor determine the loop stability.
The inductor and output capacitor are chosen based on
performance, size and cost. The compensation resistor
and capacitor on the VC pin are set to optimize control
loop response and stability. For a typical voltage regulator
application, a 10nF compensation capacitor on the VC pin
is adequate, and a series resistor should always be used
to increase the slew rate on the VC pin to maintain tighter
output voltage regulation during fast transients on the
input supply of the converter.
Efficiency Considerations
The power efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Although all dissipative
elements in circuits produce losses, four main sources
account for most of the losses in LT8390 circuits:
1. DC I2R losses. These arise from the resistances of the
MOSFETs, sensing resistor, inductor and PC board
traces and cause the efficiency to drop at high output
currents.
2. Transition loss. This loss arises from the brief amount
of time switch A or switch C spends in the saturated
region during switch node transitions. It depends upon
the input voltage, load current, driver strength and
MOSFET capacitance, among other factors.
3. INTVCC current. This is the sum of the MOSFET driver
and control currents.
4. CIN and COUT loss. The input capacitor has the difficult job of filtering the large RMS input current to the
regulator in buck region. The output capacitor has the
difficult job of filtering the large RMS output current in
boost region. Both CIN and COUT are required to have
low ESR to minimize the AC I2R loss and sufficient
capacitance to prevent the RMS current from causing
additional upstream losses in fuses or batteries.
5. Other losses. Schottky diode DB and DD are responsible
for conduction losses during dead time and light load
conduction periods. Inductor core loss occurs predominately at light loads. Switch A causes reverse recovery
current loss in buck region, and switch C causes reverse
recovery current loss in boost region.
When making adjustments to improve efficiency, the
input current is the best indicator of changes in efficiency. If you make a change and the input current
decreases, then the efficiency has increased. If there is
no change in the input current, then there is no change
in efficiency.
Rev. C
For more information www.analog.com
25
LT8390
APPLICATIONS INFORMATION
PC Board Layout Checklist
The basic PC board layout requires a dedicated ground
plane layer. Also, for high current, a multilayer board
provides heat sinking for power components.
The ground plane layer should not have any traces and
it should be as close as possible to the layer with power
MOSFETs.
n
Place CIN, switch A, switch B and DB in one compact
area. Place COUT, switch C, switch D and DD in one
compact area.
n
Use immediate vias to connect the components to the
ground plane. Use several large vias for each power
component.
n
Use planes for VIN and VOUT to maintain good voltage
filtering and to keep power losses low.
n
Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
components. Connect the copper areas to any DC net
(VIN or GND).
n
Separate the signal and power grounds. All small-signal
components should return to the exposed GND pad
from the bottom, which is then tied to the power GND
close to the sources of switch B and switch C.
n
Place switch A and switch C as close to the controller as
possible, keeping the PGND, BG and SW traces short.
n
Keep the high dV/dT SW1, SW2, BST1, BST2, TG1 and
TG2 nodes away from sensitive small-signal nodes.
n
26
The path formed by switch A, switch B, DB and the
CIN capacitor should have short leads and PCB trace
lengths. The path formed by switch C, switch D, DD and
the COUT capacitor also should have short leads and
PCB trace lengths.
n
The output capacitor (–) terminals should be connected
as close as possible to the (–) terminals of the input
capacitor.
n
Connect the top driver boost capacitor CBST1 closely to
the BST1 and SW1 pins. Connect the top driver boost
capacitor CBST2 closely to the BST2 and SW2 pins.
n
Connect the input capacitors CIN and output capacitors
COUT closely to the power MOSFETs. These capacitors
carry the MOSFET AC current.
n
Route LSP and LSN traces together with minimum
PCB trace spacing. Avoid sense lines pass through
noisy areas, such as switch nodes. The filter capacitor
between LSP and LSN should be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connections at the RSENSE resistor. Low ESL sense
resistor is recommended.
n
Connect the VC pin compensation network close to the
IC, between VC and the signal ground. The capacitor
helps to filter the effects of PCB noise and output voltage ripple voltage from the compensation loop.
n
Connect the INTVCC bypass capacitor, CINTVCC, close to
the IC, between the INTVCC and the power ground. This
capacitor carries the MOSFET drivers’ current peaks.
An additional 1µF ceramic capacitor placed immediately
next to the INTVCC pin and power ground can help
improve noise performance substantially.
n
Rev. C
For more information www.analog.com
LT8390
TYPICAL APPLICATIONS
98% Efficient 48W (12V 4A) Miniature Buck-Boost Voltage Regulator
VIN
4V TO 56V
22µF
63V
×2
4.7µF
100V
×2
L1
6µH
4mΩ
M1
0.1µF
SW1 LSP
BST1
LSN
SW2
BST2
BG1
M2
15mΩ
M4
10µF
25V
×2
0.1µF
BG2
120µF
16V
120µF
16V
VOUT
12V
4A
M3
GND
TG1
1µF
383k
TG2
VIN
165k
LT8390
VOUT
EN/UVLO
ISP
LOADTG
ISN
TEST
ISMON
INTVCC
VREF
SS
PGOOD
RT
VC
100pF
27k
9.09k
SSFM ON
4.7µF
LOADEN
0.1µF
SSFM OFF
SYNC/SPRD
CTRL
0.47µF
100k
FB
ISMON
IOUT LIMIT 6.7A
1µF
100k
PGOOD
L1: WURTH 7443551600 6µH
M1, M2: INFINEON BSZ100N06LS3
M3, M4: INFINEON BSZ033NE2LS5
100k
400kHz
4.7nF
8390 TA02a
Soft Start (VIN = 12V, IOUT = 3A)
Output Short Protection (VIN = 12V, IOUT = 3A)
VOUT
5V/DIV
VSS
1V/DIV
VSS
2V/DIV
VOUT
5V/DIV
IL
2A/DIV
IOUT
2A/DIV
2ms/DIV
8390 TA02b
100ms/DIV
8390 TA02c
Rev. C
For more information www.analog.com
27
LT8390
TYPICAL APPLICATIONS
98% Efficient 300W (12V 25A) Buck-Boost Voltage Regulator
2mΩ
×2
M1
M5
VIN
9V TO 36V
150µF
50V
×4
10µF
50V
×4
0.1µF
SW1 LSP
BST1
M2
L1
3.3µH
LSN
SW2
BST2
BG1
BG2
TG1
TG2
VIN
365k
56.2k
LT8390
VOUT
EN/UVLO
ISP
LOADTG
ISN
TEST
ISMON
M3
M6
IOUT LIMIT 33A
100pF
0.1µF
100k
PGOOD
RT
VC
15k
49.9k
SSFM ON
4.7µF
VREF
SS
0.47µF
SSFM OFF
INTVCC
LOADEN
560µF
16V
×2
549k
SYNC/SPRD
CTRL
560µF
16V
×2
VOUT
12V
25A
1µF
FB
ISMON
47µF
16V
×4
0.1µF
GND
1µF
6mΩ
×2
M4
PGOOD
309k
150kHz
L1: WURTH SER2915L-332 3.3µH
M1, M5: INFINEON BSC014N04LSI
M2: INFINEON BSC010N04LS
M3, M6: INFINEON BSC015NE2LS5I
M4: INFINEON BSC009NE2LS5I
15nF
8390 TA03a
Efficiency vs Load Current
Power Loss vs Load Current
100
12
98
10
94
8
92
PLOSS (W)
EFFICIENCY (%)
96
90
88
4
86
VIN = 9V
VIN = 12V
VIN = 24V
VIN = 36V
84
82
80
0
5
10
15
LOAD CURRENT (A)
20
VIN = 9V
VIN = 12V
VIN = 24V
VIN = 36V
2
0
25
8390 TA03b
28
6
0
5
10
15
LOAD CURRENT (A)
20
25
8390 TA03c
Rev. C
For more information www.analog.com
LT8390
PACKAGE DESCRIPTION
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev L)
Exposed Pad Variation EB
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
4.75
(.187)
28 27 26 2524 23 22 21 20 1918 17 16 15
6.60 ±0.10
4.50 ±0.10
2.74
(.108)
SEE NOTE 4
0.45 ±0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
6.40
2.74
(.252)
(.108)
BSC
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
1 2 3 4 5 6 7 8 9 10 11 12 13 14
0.25
REF
1.20
(.047)
MAX
0° – 8°
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE28 (EB) TSSOP REV L 0117
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
Rev. C
For more information www.analog.com
29
LT8390
PACKAGE DESCRIPTION
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev C)
0.70 ±0.05
4.50 ±0.05
3.10 ±0.05
2.50 REF
2.65 ±0.05
3.65 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
3.50 REF
4.10 ±0.05
5.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ±0.10
(2 SIDES)
R = 0.05
TYP
0.75 ±0.05
PIN 1 NOTCH
R = 0.20 OR 0.35
× 45° CHAMFER
2.50 REF
R = 0.115
TYP
27
28
0.40 ±0.10
PIN 1
TOP MARK
(NOTE 6)
1
2
5.00 ±0.10
(2 SIDES)
3.50 REF
3.65 ±0.10
2.65 ±0.10
(UFD28) QFN 0816 REV C
0.200 REF
0.00 – 0.05
0.25 ±0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGHD-3).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
30
Rev. C
For more information www.analog.com
LT8390
REVISION HISTORY
REV
DATE
DESCRIPTION
A
09/17
Added H-Grade Temperature Option.
2, 5
Clarified Block Diagram.
12
Clarified Figure 8.
17
Clarified Sense Resistors description in Route LSP and LSN traces bullet.
26
B
C
02/21
06/21
PAGE NUMBER
Clarified Place CIN bullet in Applications Information.
26
Added LT8390A in Related Parts table.
32
Add AEC-Q100 Qualification in Progress to features table.
1
Add J-Grade to both available packages.
2
Add automotive products table.
2
Added AEC-Q100 Qualified for Automotive Applications to Features section.
1
Added LT8390J to Operating Junction Temperature Range section.
2
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For
is granted
implication or
otherwise under any patent or patent rights of Analog Devices.
more by
information
www.analog.com
31
LT8390
TYPICAL APPLICATION
125W (25V 5A) Solar Panel to 12V Battery Charger
FROM SOLAR PANEL
VIN
0V TO 48V
15mΩ
47µF
80V
×2
47µF
80V
×2
L1
4.7µH
2.5mΩ
M1
4.7µF
100V
×3
0.1µF
SW1 LSP
BST1
LSN
SW2
BST2
BG1
M2
TO 12V BATTERY
M4
10µF
50V
×3
0.1µF
BG2
VOUT
82µF
50V
×4
M3
GND
TG1
10Ω
10Ω
2.2µF
475k
SYNC/SPRD
INTVCC
EN/UVLO
121k INPUT CURRENT CONTROL
0.25V TO 1V FOR 0A TO 5A
301k
0.47µF
TEST
PGOOD
LOADEN
VREF
100k
49.9k
4.7µF
CTRL
301k
750k
FB
VIN
6V VIN UVLO
1µF
LOADTG
ISP
1µF
TG2
VOUT
LT8390
ISN
SS
ISMON
VC
0.1µF
RT
27nF
174k
250kHz
ISMON
L1: WURTH 7443640470 4.7uH
M1: INFINEON BSC067N06LS3
M2: INFINEON BSC028N06LS3
M3, M4: INFINEON BSC010N04LS
8390 TA04a
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT8390A
60V 2MHz Synchronous 4-Switch Buck-Boost
Controller with Spread Spectrum
VIN: 4V to 60V, VOUT: 0V to 60V, ±1.5% Voltage Accuracy, ±3% Current
Accuracy, TSSOP-28 and 4mm × 5mm QFN-28
LT8391
60V Synchronous 4-Switch Buck-Boost LED
Controller with Spread Spectrum
VIN: 4V to 60V, VOUT: 0V to 60V, ±3% Current Accuracy, Internal and External
PWM Dimming, TSSOP-28 and 4mm × 5mm QFN-28
LT3790
60V Synchronous 4-Switch Buck-Boost Controller
VIN: 4.7V to 60V, VOUT: 1.2V to 60V, Regulates VOUT, IOUT, IIN, TSSOP-38
LT8705
80V VIN and VOUT Synchronous 4-Switch Buck-Boost VIN: 2.8V to 80V, VOUT: 1.3V to 80V, Regulates VOUT, IOUT, VIN, IIN,
DC/DC Controller
5mm × 7mm QFN-38 and Modified TSSOP-38 for High Voltage
LTC®3789
High Efficiency Synchronous 4-Switch Buck-Boost
Controller
VIN: 4V to 38V, VOUT: 0.8V to 38V, Regulates VOUT, IOUT or IIN, 5mm × 5mm
QFN-32 and SSOP-24
LTC3780
High Efficiency Synchronous 4-Switch Buck-Boost
Controller
VIN: 4V to 36V, VOUT: 0.8V to 30V, Regulates VOUT, 4mm × 5mm QFN-28 and
SSOP-28
LT3741/LT3741-1
High Power, Constant Current, Constant Voltage,
Step-Down Controller
VIN: 6V to 36V, 4mm × 4mm QFN-20 and TSSOP-20
LT3763
60V High Current Step-Down LED Driver Controller
VIN: 6V to 60V, 4mm × 4mm QFN-20 and TSSOP-20
LT3757/LT3757A
Boost, Flyback, SEPIC and Inverting Controller
VIN: 2.9V to 40V, Positive or Negative VOUT, 3mm × 3mm DFN-10, MSOP-10
LT3758
High Input Voltage, Boost, Flyback, SEPIC and
Inverting Controller
VIN: 5.5V to 100V, Positive or Negative VOUT, 3mm × 3mm DFN-10, MSOP-10
LT8710
Synchronous SEPIC/Inverting/Boost Controller with
Output Current Control
VIN: 4.5V to 80V, Rail-to-Rail Output Current Monitor and Control, TSSOP-28
32
Rev. C
06/21
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