LT8606/LT8606B
42V, 350mA Synchronous
Step-Down Regulator with
2.5µA Quiescent Current
FEATURES
DESCRIPTION
Wide Input Voltage Range: 3.0V to 42V
n Ultralow Quiescent Current Burst Mode® Operation:
n 0.5),
a minimum inductance is required to avoid sub-harmonic
oscillation. See Analog Devices Application Note 19.
Input Capacitor
Bypass the input of the LT8606 circuit with a ceramic
capacitor of X7R or X5R type. Y5V types have poor performance over temperature and applied voltage, and should
not be used. A 4.7μF to 10μF ceramic capacitor is adequate to bypass the LT8606 and will easily handle the ripple current. Note that larger input capacitance is required
when a lower switching frequency is used. If the input
power source has high impedance, or there is significant
Rev. D
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LT8606/LT8606B
APPLICATIONS INFORMATION
inductance due to long wires or cables, additional bulk
capacitance may be necessary. This can be provided with
a low performance electrolytic capacitor.
Step-down regulators draw current from the input supply in pulses with very fast rise and fall times. The input
capacitor is required to reduce the resulting voltage ripple at the LT8606 and to force this very high frequency
switching current into a tight local loop, minimizing EMI.
A 4.7μF capacitor is capable of this task, but only if it is
placed close to the LT8606 (see the PCB Layout section).
A second precaution regarding the ceramic input capacitor concerns the maximum input voltage rating of the
LT8606. A ceramic input capacitor combined with trace
or cable inductance forms a high quality (under damped)
tank circuit. If the LT8606 circuit is plugged into a live
supply, the input voltage can ring to twice its nominal
value, possibly exceeding the LT8606’s voltage rating.
This situation is easily avoided (see Analog Devices
Application Note 88).
Output Capacitor and Output Ripple
The output capacitor has two essential functions. Along
with the inductor, it filters the square wave generated
by the LT8606 to produce the DC output. In this role it
determines the output ripple, thus low impedance at the
switching frequency is important. The second function is
to store energy in order to satisfy transient loads and stabilize the LT8606’s control loop. Ceramic capacitors have
very low equivalent series resistance (ESR) and provide
the best ripple performance. A good starting value is:
C OUT =
100
VOUT • fSW
can be used to save space and cost but transient performance will suffer and may cause loop instability. See
the Typical Applications in this data sheet for suggested
capacitor values.
When choosing a capacitor, special attention should be
given to the data sheet to calculate the effective capacitance under the relevant operating conditions of voltage
bias and temperature. A physically larger capacitor or one
with a higher voltage rating may be required.
Ceramic Capacitors
Ceramic capacitors are small, robust and have very low
ESR. However, ceramic capacitors can cause problems
when used with the LT8606 due to their piezoelectric
nature. When in Burst Mode operation, the LT8606’s
switching frequency depends on the load current, and at
very light loads the LT8606 can excite the ceramic capacitor
at audio frequencies, generating audible noise. Since the
LT8606 operates at a lower current limit during Burst Mode
operation, the noise is typically very quiet to a casual ear.
If this is unacceptable, use a high performance tantalum
or electrolytic capacitor at the output.
A final precaution regarding ceramic capacitors concerns
the maximum input voltage rating of the LT8606. As previously mentioned, a ceramic input capacitor combined
with trace or cable inductance forms a high quality (under
damped) tank circuit. If the LT8606 circuit is plugged into
a live supply, the input voltage can ring to twice its nominal value, possibly exceeding the LT8606’s rating. This
situation is easily avoided (see Analog Devices Application
Note 88).
Enable Pin
where fSW is in MHz, and COUT is the recommended
output capacitance in μF. Use X5R or X7R types. This
choice will provide low output ripple and good transient response. Transient performance can be improved
with a higher value output capacitor and the addition of
a feedforward capacitor placed between VOUT and FB.
Increasing the output capacitance will also decrease the
output voltage ripple. A lower value of output capacitor
The LT8606 is in shutdown when the EN pin is low and
active when the pin is high. The rising threshold of the EN
comparator is 1.05V, with 50mV of hysteresis. The EN pin
can be tied to VIN if the shutdown feature is not used, or
tied to a logic level if shutdown control is required.
Adding a resistor divider from VIN to EN programs the
LT8606 to regulate the output only when VIN is above
a desired voltage (see Block Diagram). Typically, this
threshold, VIN(EN), is used in situations where the input
Rev. D
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15
LT8606/LT8606B
APPLICATIONS INFORMATION
supply is current limited, or has a relatively high source
resistance. A switching regulator draws constant power
from the source, so source current increases as source
voltage drops. This looks like a negative resistance load
to the source and can cause the source to current limit or
latch low under low source voltage conditions. The VIN(EN)
threshold prevents the regulator from operating at source
voltages where the problems might occur. This threshold
can be adjusted by setting the values R3 and R4 such that
they satisfy the following equation:
⎛ R3 ⎞
VIN(EN) = ⎜ +1⎟ •1V
⎝ R4 ⎠
where the LT8606 will remain off until VIN is above VIN(EN).
Due to the comparator’s hysteresis, switching will not
stop until the input falls slightly below VIN(EN).
When in Burst Mode operation for light-load currents, the
current through the VIN(EN) resistor network can easily be
greater than the supply current consumed by the LT8606.
Therefore, the VIN(EN) resistors should be large to minimize their effect on efficiency at low loads.
INTVCC Regulator
An internal low dropout (LDO) regulator produces the 3.5V
supply from VIN that powers the drivers and the internal
bias circuitry. The INTVCC can supply enough current for
the LT8606’s circuitry and must be bypassed to ground
with a minimum of 1μF ceramic capacitor. Good bypassing is necessary to supply the high transient currents
required by the power MOSFET gate drivers. Applications
with high input voltage and high switching frequency will
increase die temperature because of the higher power
dissipation across the LDO. Do not connect an external
load to the INTVCC pin.
Output Voltage Tracking and Soft-Start (MSOP ONLY)
The LT8606 allows the user to program its output voltage
ramp rate by means of the TR/SS pin. An internal 2μA
pulls up the TR/SS pin to INTVCC. Putting an external
capacitor on TR/SS enables soft-starting the output to
prevent current surge on the input supply. During the softstart ramp the output voltage will proportionally track the
16
TR/SS pin voltage. For output tracking applications, TR/
SS can be externally driven by another voltage source.
From 0V to 0.778V, the TR/SS voltage will override the
internal 0.778V reference input to the error amplifier, thus
regulating the FB pin voltage to that of TR/SS pin. When
TR/SS is above 0.778V, tracking is disabled and the feedback voltage will regulate to the internal reference voltage.
An active pull-down circuit is connected to the TR/SS pin
which will discharge the external soft-start capacitor in
the case of fault conditions and restart the ramp when the
faults are cleared. Fault conditions that clear the soft-start
capacitor are the EN/UV pin transitioning low, VIN voltage
falling too low, or thermal shutdown. The LT8606 and
LT8606B DFN does not have TR/SS pin or functionality.
Output Power Good
When the LT8606’s output voltage is within the ±8.5%
window of the regulation point, which is a VFB voltage in
the range of 0.716V to 0.849V (typical), the output voltage
is considered good and the open-drain PG pin goes high
impedance and is typically pulled high with an external
resistor. Otherwise, the internal drain pull-down device
will pull the PG pin low. To prevent glitching both the
upper and lower thresholds include 0.5% of hysteresis.
The PG pin is also actively pulled low during several fault
conditions: EN/UV pin is below 1V, INTVCC has fallen too
low, VIN is too low, or thermal shutdown.
Synchronization (MSOP ONLY)
To select low ripple Burst Mode operation, tie the SYNC
pin below 0.4V (this can be ground or a logic low output). To synchronize the LT8606 oscillator to an external
frequency connect a square wave (with 20% to 80% duty
cycle) to the SYNC pin. The square wave amplitude should
have valleys that are below 0.9V and peaks above 2.7V
(up to 5V).
The LT8606 will not enter Burst Mode operation at low
output loads while synchronized to an external clock, but
instead will pulse skip to maintain regulation. The LT8606
may be synchronized over a 200kHz to 2.2MHz range. The
RT resistor should be chosen to set the LT8606 switching
frequency equal to or below the lowest synchronization
Rev. D
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LT8606/LT8606B
APPLICATIONS INFORMATION
input. For example, if the synchronization signal will be
500kHz and higher, the RT should be selected for 500kHz.
The slope compensation is set by the RT value, while the
minimum slope compensation required to avoid subharmonic oscillations is established by the inductor size,
input voltage, and output voltage. Since the synchronization frequency will not change the slopes of the inductor
current waveform, if the inductor is large enough to avoid
subharmonic oscillations at the frequency set by RT, then
the slope compensation will be sufficient for all synchronization frequencies.
For some applications it is desirable for the LT8606 to
operate in pulse-skipping mode, offering two major differences from Burst Mode operation. First is the clock stays
awake at all times and all switching cycles are aligned
to the clock. Second is that full switching frequency is
reached at lower output load than in Burst Mode operation
as shown in Figure 2. Full Switching Frequency Minimum
Load vs VIN in Pulse Skipping Mode (MSOP ONLY) in an
earlier section. These two differences come at the expense
of increased quiescent current. To enable pulse-skipping
mode the SYNC pin is floated.
For some applications, reduced EMI operation may be
desirable, which can be achieved through spread spectrum modulation. This mode operates similar to pulse
skipping mode operation, with the key difference that the
switching frequency is modulated up and down by a 3kHz
triangle wave. The modulation has the frequency set by RT
as the low frequency, and modulates up to approximately
20% higher than the frequency set by RT. To enable spread
spectrum mode, tie SYNC to INTVCC or drive to a voltage
between 3.2V and 5V.
The LT8606 does not operate in forced continuous mode
regardless of SYNC signal. The LT8606 DFN is always
programmed for Burst Mode operation and cannot enter
pulse-skipping mode. The LT8606B DFN is programmed
for pulse-skipping mode and cannot enter Burst Mode
operation.
will be folded back while the output is lower than the set
point to maintain inductor current control. Second, the
bottom switch current is monitored such that if inductor
current is beyond safe levels switching of the top switch
will be delayed until such time as the inductor current
falls to safe levels. This allows for tailoring the LT8606
to individual applications and limiting thermal dissipation
during short circuit conditions.
Frequency foldback behavior depends on the state of the
SYNC pin: If the SYNC pin is low, the switching frequency
will slow while the output voltage is lower than the programmed level. If the SYNC pin is connected to a clock
source, tied high or floated, the LT8606 will stay at the
programmed frequency without foldback and only slow
switching if the inductor current exceeds safe levels.
There is another situation to consider in systems where
the output will be held high when the input to the LT8606
is absent. This may occur in battery charging applications
or in battery backup systems where a battery or some
other supply is diode ORed with the LT8606’s output.
If the VIN pin is allowed to float and the EN pin is held
high (either by a logic signal or because it is tied to VIN),
then the LT8606’s internal circuitry will pull its quiescent
current through its SW pin. This is acceptable if the system can tolerate several μA in this state. If the EN pin is
grounded the SW pin current will drop to near 0.7µA.
However, if the VIN pin is grounded while the output is
held high, regardless of EN, parasitic body diodes inside
the LT8606 can pull current from the output through the
SW pin and the VIN pin. Figure 4 shows a connection of
the VIN and EN/UV pins that will allow the LT8606 to run
only when the input voltage is present and that protects
against a shorted or reversed input.
D1
VIN
VIN
LT8606
EN/UV
GND
Shorted and Reversed Input Protection
8606 F04
The LT8606 will tolerate a shorted output. Several features
are used for protection during output short-circuit and
brownout conditions. The first is the switching frequency
Figure 4. Reverse VIN Protection
Rev. D
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17
LT8606/LT8606B
APPLICATIONS INFORMATION
PCB Layout
For proper operation and minimum EMI, care must be
taken during printed circuit board layout. Note that large,
switched currents flow in the LT8606’s VIN pins, GND
pins, and the input capacitor (CIN). The loop formed
by the input capacitor should be as small as possible
by placing the capacitor adjacent to the VIN and GND
pins. When using a physically large input capacitor the
resulting loop may become too large in which case using
a small case/value capacitor placed close to the VIN and
GND pins plus a larger capacitor further away is preferred. These components, along with the inductor and
output capacitor, should be placed on the same side of
the circuit board, and their connections should be made
on that layer. Place a local, unbroken ground plane under
the application circuit on the layer closest to the surface
layer. The SW and BOOST nodes should be as small as
possible. Finally, keep the FB and RT nodes small so
that the ground traces will shield them from the SW and
BOOST nodes. The exposed pad on the bottom of the
package must be soldered to ground so that the pad is
connected to ground electrically and also acts as a heat
sink thermally. To keep thermal resistance low, extend
the ground plane as much as possible, and add thermal
vias under and near the LT8606 to additional ground
planes within the circuit board and on the bottom side.
Thermal Considerations
For higher ambient temperatures, care should be taken in
the layout of the PCB to ensure good heat sinking of the
LT8606. Figure 5 shows the recommended component
placement with trace, ground plane and via locations.
The exposed pad on the bottom of the package must be
soldered to a ground plane. This ground should be tied
to large copper layers below with thermal vias; these layers will spread heat dissipated by the LT8606. Placing
additional vias can reduce thermal resistance further. The
maximum load current should be derated as the ambient
temperature approaches the maximum junction rating.
Power dissipation within the LT8606 can be estimated
by calculating the total power loss from an efficiency
measurement and subtracting the inductor loss. The
die temperature is calculated by multiplying the LT8606
power dissipation by the thermal resistance from junction
to ambient. The LT8606 will stop switching and indicate
a fault condition if safe junction temperature is exceeded.
GROUND PLANE ON LAYER 2
COUT
L
CIN
CBST
CVCC
1
CIN(OPT)
RT
RPG
R4
R3
R1
CFF
GND VIA
VIN VIA
VOUT VIA
EN/UV VIA
R2
CSS
OTHER SIGNAL VIA
8606 F05
Figure 5. PCB Layout
18
Rev. D
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LT8606/LT8606B
TYPICAL APPLICATIONS
5V 2MHz Step Down
VIN
5.5V TO 42V
VIN
EN/UV
SYNC
C2
1µF
X7R
0805
INTVCC
C3
1µF
C6
10nF
BST
C1
0.1µF
SW
LT8606
R4
100k
PG
C5
10pF
TR/SS
RT
R1
18.2k
GND
FB
fSW = 2MHz
L1
10µH
R3
187k
R2
1M
L1 = XFL3010-103ME
8606 TA02
VOUT
5V
350mA
POWER GOOD
C4
10µF
X7R
0805
3.3V 2MHz Step Down
VIN
3.8V TO 42V
VIN
EN/UV
SYNC
C2
1µF
X7R
0805
INTVCC
C3
1µF
C6
10nF
BST
L1
C1
0.1µF 6.8µH
SW
LT8606
R4
100k
PG
C5
10pF
TR/SS
RT
R1
18.2k
GND
FB
fSW = 2MHz
R3
309k
R2
1M
L1 = XFL3010-682ME
8606 TA03
VOUT
3.3V
350mA
POWER GOOD
C4
10µF
X7R
0805
12V 1MHz Step Down
VIN
12.7V TO 42V
VIN
EN/UV
SYNC
C2
4.7µF
X7R
1206
INTVCC
C3
1µF
C6
10nF
fSW = 1MHz
BST
C1
0.1µF
SW
LT8606
R4
100k
PG
C5
100pF
TR/SS
RT
R1
40.2k
GND
L1
47µH
FB
R3
69.8k
R2
1M
L1 = MSS6132-473MLB
8606 TA04
VOUT
12V
350mA
POWER GOOD
C4
22µF
X7R
1210
Rev. D
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19
LT8606/LT8606B
TYPICAL APPLICATIONS
1.8V 2MHz Step Down
VIN
3.2V TO 20V
(42V TRANSIENT)
VIN
EN/UV
SYNC
C2
4.7µF
INTVCC
C3
1µF
C6
10nF
BST
L1
C1
0.1µF 3.3µH
SW
LT8606
R4
100k
PG
C5
10pF
TR/SS
RT
R1
18.2k
GND
FB
fSW = 2MHz
R3
768k
R2
1M
L1 = XFL3010-332ME
8606 TA05
VOUT
1.8V
350mA
POWER GOOD
C4
22µF
X7R
1206
Ultralow EMI 5V 1.5A Step Down
VIN
5.8 TO 40V
L2
BEAD
L3
4.7µH
C8
4.7µF
C7
4.7µF
C9
33µF
VIN
EN/UV
SYNC
C2
4.7µF
INTVCC
C3
1µF
C6
10nF
fSW = 700kHz
20
BST
C1
0.1µF
SW
LT8606
(MSOP)
PG
GND
FB
R4
100k
C5
47pF
TR/SS
RT
R1
60.4k
L1
27µH
R3
187k
R2
1M
C8, C7, C2: X7R 1206
C9: 63SXV33M
L1: MSS5121-273
L2: MPZ2012S221AT000
L3: XAL4030-472
8606 TA06
VOUT
5V
350mA
POWER GOOD
C4
22µF
X7R
1206
Rev. D
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LT8606/LT8606B
PACKAGE DESCRIPTION
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev I)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88 ±0.102
(.074 ±.004)
5.10
(.201)
MIN
1
0.889 ±0.127
(.035 ±.005)
1.68 ±0.102
(.066 ±.004)
0.05 REF
10
0.305 ± 0.038
(.0120 ±.0015)
TYP
RECOMMENDED SOLDER PAD LAYOUT
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
10 9 8 7 6
DETAIL “A”
0° – 6° TYP
1 2 3 4 5
GAUGE PLANE
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
0.18
(.007)
0.497 ±0.076
(.0196 ±.003)
REF
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
4.90 ±0.152
(.193 ±.006)
0.254
(.010)
0.29
REF
1.68
(.066)
3.20 – 3.45
(.126 – .136)
0.50
(.0197)
BSC
1.88
(.074)
SEATING
PLANE
0.86
(.034)
REF
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
0.1016 ±0.0508
(.004 ±.002)
MSOP (MSE) 0213 REV I
Rev. D
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21
LT8606/LT8606B
PACKAGE DESCRIPTION
DC8 Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1939 Rev Ø)
Exposed Pad Variation AA
1.8 REF
0.90
REF
0.23
REF
0.85 ±0.05
2.60 ±0.05
PACKAGE
OUTLINE
0.335 REF
0.25 ±0.05
0.45 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.00 ±0.05
(4 SIDES)
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
2.00 SQ ±0.05
1.8 REF
5
8
0.23
0.335 REF
REF
0.55 ±0.05
PIN 1 NOTCH
R = 0.15
(DC8MA) DFN 0113 REV Ø
4
0.200 REF
0.75 ±0.05
1
0.23 ±0.05
0.45 BSC
BOTTOM VIEW—EXPOSED PAD
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
22
Rev. D
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LT8606/LT8606B
REVISION HISTORY
REV
DATE
DESCRIPTION
A
06/17
Added DFN package option
1,2
Clarified electrical parameters for DFN package option
2,3
Clarified graphs for MSOP package option
6,7
Clarified Pin Functions for DFN package option
9
Clarified Operation section to include DFN option
11
Clarified Applications last paragraph and Figure 2 to include DFN option
12
Clarified Applications section to include DFN operation
B
11/17
07/18
22
Added H-grade option
2, 3
Clarified Oscillator Frequency RT conditions
3
Clarified efficiency graphs
4
Clarified Frequency Foldback graph
7
Clarified Switching Waveform graph
8
Clarified Block Diagram
10
Added Figure 5
18
All
Added table to clarify versions
1
Modified text in Description to add DFN functionality
1
Added B version to Order Information
2
Clarified Minimum On-Time Conditions
3
Clarified Efficiency graphs
4
Clarified No-Load Supply Current graphs
5
Clarified Burst Frequency vs Output Current graph
6
Clarified Frequency Foldback graph
7
Clarified Pin Functions on SYNC and TR/SS
9
Clarified Operation third paragraph
11
Clarified Applications Information to include DFN B version
11/20
20, 24
Added B version
Clarified last paragraph to include DFN B version
D
16,17
Added DFN Package Description
Clarified Typical Applications for MSOP package option
C
PAGE NUMBER
12
16, 17
Clarified Figure 5 PCB Layout
18
AEC-Q100 Qualified for Automotive Applications
1
Added J-Grade to Operating Junction
2
Updated suffix for DC package
2
#W Materials added on
2
Changed Minimum On-Time conditions in the Electrical Characteristics table
3
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For
is granted
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23
LT8606/LT8606B
TYPICAL APPLICATION
5V and 3.3V with Ratio Tracking
VIN
5.6V TO 42V
BST
VIN
EN/UV
SYNC
C2
1µF
INTVCC
C3
1µF
SW
LT8606
(MSOP)
C1
0.1µF
R1
18.2k
RT
GND
PG
FB
VOUT
5V
350mA
R4
100k
POWER GOOD
C5, 10pF
TR/SS
C6
10nF
L1
10µH
R3
187k
R2, 1M
C4
10µF
fSW = 2MHz
C8
1µF
R9
80.6k
C2, C4, C8, C10: X7R 0805
L1: XFL3010-103ME
L2: XFL3010-682ME
R10
22k
C12
1µF
R5
18.2k
VIN
EN/UV
SYNC
INTVCC
BST
SW
LT8606
(MSOP)
L2
C1
0.1µF 6.8µH
PG
GND
FB
POWER GOOD
C11, 10pF
TR/SS
RT
VOUT
3.3V
350mA
R8
100k
R7
309k
fSW = 2MHz
R6, 1M
C10
10µF
8606 TA07
RELATED PARTS
PART NUMBER
LT8607
LT8608
LT8609/LT8609A/
LT8609B
LT8609S
LT8610A/
LT8610AB/LT8610AC
LT8616
LT8620
LT8614
LT8612
LT8640
LT8640S
LT8645S
LT8602
24
DESCRIPTION
42V, 750mA, 92% Efficiency, 2.2MHz Synchronous MicroPower
Step-Down DC/DC Converter with IQ = 3µA
42V, 1.5A, 92% Efficiency, 2.2MHz Synchronous MicroPower
Step-Down DC/DC Converter with IQ = 2.5µA
42V, 2A/3A Peak, 93% Efficiency, 2.2MHz Synchronous MicroPower
Step-Down DC/DC Converter with IQ = 2.5µA
42V, 2A/3A Peak, 93% Efficiency, 2.2MHz Synchronous Silent Switcher 2
Step-Down DC/DC Converter with IQ = 2.5µA
42V, 3.5A, 96% Efficiency, 2.2MHz Synchronous MicroPower
Step-Down DC/DC Converter with IQ = 2.5µA
42V, Dual 2.5A + 1.5A, 95% Efficiency, 2.2MHz Synchronous
MicroPower Step-Down DC/DC Converter with IQ = 5µA
65V, 2.5A, 96% Efficiency, 2.2MHz Synchronous MicroPower
Step-Down DC/DC Converter with IQ = 2.5µA
42V, 4A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down
DC/DC Converter with IQ = 2.5µA
42V, 6A, 96% Efficiency, 2.2MHz Synchronous MicroPower Step-Down
DC/DC Converter with IQ = 2.5µA
42V, 5A, 96% Efficiency, 3MHz Synchronous MicroPower Step-Down
DC/DC Converter with IQ = 2.5µA
42V, 6A, 96% Efficiency, 3MHz Synchronous Silent Switcher 2
Step-Down DC/DC Converter with IQ = 2.5µA
65V, 8A, 96% Efficiency, 3MHz Synchronous Silent Switcher 2
Step-Down DC/DC Converter with IQ = 2.5µA
42V, Quad Output (2.5A+1.5A+1.5A+1.5A) 95% Efficiency, 2.2MHz
Synchronous MicroPower Step-Down DC/DC Converter with IQ = 25µA
COMMENTS
VIN = 3V to 42V, VOUT(MIN) = 0.778V, IQ = 3µA,
ISD
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