LTC1090
Single Chip 10-Bit Data
Acquisition System
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FEATURES
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DESCRIPTIO
Software Programmable Features:
Unipolar/Bipolar Conversions
4 Differential/8 Single Ended Inputs
MSB or LSB First Data Sequence
Variable Data Word Length
Built-In Sample and Hold
Single Supply 5V, 10V or ±5V Operation
Direct 4 Wire Interface to Most MPU Serial Ports and
All MPU Parallel Ports
30kHz Maximum Throughput Rate
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KEY SPECIFICATIO S
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Resolution: 10 Bits
Total Unadjusted Error (LTC1090A): ±1/2LSB Max
Conversion Time: 22µs
Supply Current: 2.5mA Max, 1.0mA Typ
, LTC and LT are registered trademarks of Linear Technology Corporation.
LTCMOS is a trademark of Linear Technology Corp.
The LTC®1090 is a data acquisition component which
contains a serial I/O successive approximation A/D converter. It uses LTCMOSTM switched capacitor technology
to perform either 10-bit unipolar, or 9-bit plus sign bipolar
A/D conversions. The 8-channel input multiplexer can be
configured for either single ended or differential inputs (or
combinations thereof). An on-chip sample and hold is
included for all single ended input channels.
The serial I/O is designed to be compatible with industry
standard full duplex serial interfaces. It allows either
MSB or LSB first data and automatically provides 2’s
complement output coding in the bipolar mode. The
output data word can be programmed for a length of 8, 10,
12 or 16 bits. This allows easy interface to shift registers
and a variety of processors.
The LTC1090A is specified with total unadjusted error
(including the effects of offset, linearity and gain errors)
less than ±0.5LSB.
The LTC1090 is specified with offset and linearity less than
±0.5LSB but with a gain error limit of ±2LSB for
applications where gain is adjustable or less critical.
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TYPICAL APPLICATIO
FOR 8051 CODE SEE
APPLICATIONS INFORMATION
SECTION
LTC1090
MPU
(e.g., 8051)
Linearity Plot
DIFFERENTIAL
INPUT
1.0
5V
BIPOLAR INPUT
0.5
ERROR (LSBs)
5V
–5V
T
UNIPOLAR
INPUTS
DOUT
P1.1
DIN
P1.2
SCLK
P1.3
CS
P1.4
0.0
– 0.5
SERIAL DATA
LINK
–1.0
0
512
1024
OUTPUT CODE
LTC1090 • TA02
(+)
(–)
– UNIPOLAR
INPUT
LTC1090 • TA01
–5V
1090fc
1
LTC1090
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PACKAGE/ORDER I FOR ATIO
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ABSOLUTE
RATI GS
(Notes 1 and 2)
Supply Voltage (VCC) to GND or V – ................................ 12V
Negative Supply Voltage (V –) ..................... – 6V to GND
Voltage:
Analog and Reference
Inputs .................................... (V –) –0.3V to VCC 0.3V
Digital Inputs ......................................... –0.3V to 12V
Digital Outputs .............................. – 0.3V to VCC 0.3V
Power Dissipation .............................................. 500mW
Operating Temperature Range
LTC1090AC/LTC1090C ........................–40°C to 85°C
LTC1090AM/LTC1090M (OBSOLETE) ...... –55°C to 125°C
Storage Temperature Range ................. – 65°C to 150°C
Lead Temperature (Soldering, 10 sec).................. 300°C
TOP VIEW
CH0
1
20 VCC
CH1
2
19 ACLK
CH2
3
18 SCLK
CH3
4
17 DIN
CH4
5
16 DOUT
CH5
6
15 CS
CH6
7
14 REF +
CH7
8
13 REF –
COM
9
12 V –
DGND 10
ORDER PART
NUMBER
LTC1090ACN
LTC1090CN
LTC1090CSW
11 AGND
SW PACKAGE
20-LEAD PLASTIC SO WIDE
N PACKAGE
20-LEAD PDIP
TJMAX = 150°C, θJA = 70°C/W
TJMAX = 110°C, θJA = 90°C/W
J PACKAGE
20-LEAD CERDIP
TJMAX = 150°C θJA = 70° C/W
LTC1090AMJ
LTC1090MJ
LTC1090ACJ
LTC1090CJ
OBSOLETE PACKAGE
Consider the SW or N Package for Alternate Source
LTC1090 • POI01
Consult LTC Marketing for parts specified with wider operating temperature
ranges.
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RECO
E DED OPERATI G CO DITIO S
LTC1090/LTC1090A
MIN
MAX
SYMBOL
PARAMETER
CONDITIONS
VCC
Positive Supply Voltage
V – = 0V
4.5
10
V
V–
Negative Supply Voltage
VCC = 5V
– 5.5
0
V
fSCLK
Shift Clock Frequency
VCC = 5V
fACLK
A/D Clock Frequency
VCC = 5V
tCYC
Total Cycle Time
See Operating Sequence
thCS
Hold Time, CS Low After Last SCLK↓
VCC = 5V
thDI
Hold Time, DIN After SCLK↑
tsuCS
Setup Time CS↓ Before Clocking in First Address Bit (Note 9)
tsuDI
tWHACLK
25°C
85°C
125°C
UNITS
0
1.0
MHz
0.01
0.05
0.25
2.0
2.0
2.0
MHz
10 SCLK +
48 ACLK
Cycles
0
ns
VCC = 5V
150
ns
VCC = 5V
2 ACLK Cycles
1µs
Setup Time, DIN Stable Before SCLK↑
VCC = 5V
400
ns
ACLK High Time
VCC = 5V
127
ns
tWLACLK
ACLK Low Time
VCC = 5V
200
ns
tWHCS
CS High Time During Conversion
VCC = 5V
44
ACLK
Cycles
1090fc
2
LTC1090
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CO VERTER A D
ULTIPLEXER CHARACTERISTICS
The ● denotes specifications which
apply over the full operating temperature range, otherwise specifications are TA = 25°C. (Note 3)
MIN
LTC1090A
TYP
CONDITIONS
MAX
UNITS
Offset Error
(Note 4)
●
±0.5
±0.5
LSB
Linearity Error
(Notes 4 and 5)
●
±0.5
±0.5
LSB
Gain Error
(Note 4)
●
±1.0
±2.0
LSB
Total Unadjusted Error
VREF = 5.000V
(Notes 4 and 6)
●
±1.0
Reference Input Resistance
MAX
LTC1090
TYP
PARAMETER
MIN
LSB
10
10
kΩ
(V –) – 0.05V to VCC 0.05V
Analog and REF Input Range
(Note 7)
On Channel Leakage Current
(Note 8)
On Channel = 5V
Off Channel = 0V
●
1
1
µA
On Channel = 0V
Off Channel = 5V
●
–1
–1
µA
On Channel = 5V
Off Channel = 0V
●
–1
–1
µA
On Channel = 0V
Off Channel = 5V
●
1
1
µA
Off Channel Leakage Current
(Note 8)
V
AC ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply over the full operating
temperature range, otherwise specification are TA = 25°C. (Note 3)
MIN
LTC1090/LTC1090A
TYP
MAX
SYMBOL
PARAMETER
CONDITIONS
tACC
Delay Time From CS↓ to DOUT Data Valid
(Note 9)
2
ACLK Cycles
tSMPL
Analog Input Sample Time
See Operating Sequence
5
SCLK Cycles
tCONV
Conversion Time
See Operating Sequence
tdDO
See Test Circuits
●
tdis
Delay Time, SCLK↓ to DOUT Data Valid
Delay Time, CS↑ to DOUT Hi-Z
See Test Circuits
●
ten
Delay Time, 2nd CLK↓ to DOUT Enabled
See Test Circuits
●
thDO
Time Output Data Remains Valid After SCLK↓
tf
DOUT Fall Time
See Test Circuits
●
90
300
ns
ns
tr
DOUT Rise Time
See Test Circuits
●
60
300
ns
ns
CIN
Input Capacitance
Analog Inputs
44
ACLK Cycles
250
450
ns
140
300
ns
ns
150
400
ns
ns
50
Digital Inputs
On Channel
Off Channel
UNITS
65
5
5
ns
pF
pF
pF
1090fc
3
LTC1090
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DIGITAL A D DC ELECTRICAL CHARACTERISTICS
The ● denotes specifications which apply
over the full operating temperature range, otherwise specification are TA = 25°C. (Note 3)
MIN
LTC1090/LTC1090A
TYP
MAX
SYMBOL
PARAMETER
CONDITIONS
VIH
High Level lnput Voltage
VCC = 5.25V
●
VIL
Low Level Input Voltage
VCC = 4.75V
●
IIH
High Level lnput Current
VIN = VCC
●
2.5
µA
IIL
Low Level Input Current
VIN = 0V
●
–2.5
µA
VOH
High Level Output Voltage
VCC = 4.75V, lO = 10µA
VCC = 4.75V, lO = 360µA
●
2.0
V
0.8
2.4
UNITS
4.7
4.0
V
V
V
VOL
Low Level Output Voltage
VCC = 4.75V, lO = 1.6mA
●
0.4
V
IOZ
Hi-Z Output Leakage
VOUT = VCC, CS High
VOUT = 0V, CS High
●
●
3
–3
µA
µA
ISOURCE
Output Source Current
VOUT = 0V
–10
mA
ISINK
Output Sink Current
VOUT = VCC
10
mA
ICC
Positive Supply Current
CS High, REF + Open
●
1.0
2.5
mA
IREF
Reference Current
VREF = 5V
●
0.5
1.0
mA
I–
Negative Supply Current
CS High, V – = – 5V
●
1
50
µA
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: All voltage values are with respect to ground with DGND, AGND
and REF – wired together (unless otherwise noted).
Note 3: VCC = 5V, VREF + = 5V, VREF – = 0V, V – = 0V for unipolar mode and
–5V for bipolar mode, ACLK = 2.0MHz, SCLK = 0.5MHz unless otherwise
specified.
Note 4: These specs apply for both unipolar and bipolar modes. In bipolar
mode, one LSB is equal to the bipolar input span (2VREF) divided by 1024.
For example, when VREF = 5V, 1LSB (bipolar) = 2(5V)/1024 = 9.77mV.
Note 5: Linearity error is specified between the actual end points of the
A/D transfer curve.
Note 6: Total unadjusted error includes offset, gain, linearity, multiplexer
and hold step errors.
Note 7: Two on-chip diodes are tied to each reference and analog input
which will conduct for reference or analog input voltages one diode drop
below V – or one diode drop above VCC. Be careful during testing at low
VCC levels (4.5V), as high level reference or analog inputs (5V) can cause
this input diode to conduct, especially at elevated temperatures, and cause
errors for inputs near full-scale. This spec allows 50mV forward bias of
either diode. This means that as long as the reference or analog input does
not exceed the supply voltage by more than 50mV, the output code will be
correct. To achieve an absolute 0V to 5V input voltage range will therefore
require a minimum supply voltage of 4.950V over initial tolerance,
temperature variations and loading.
Note 8: Channel leakage current is measured after the channel selection.
Note 9: To minimize errors caused by noise at the chip select input, the
internal circuitry waits for two ACLK falling edges after a chip select falling
edge is detected before responding to control input signals. Therefore, no
attempt should be made to clock an address in or data out until the
minimum chip select setup time has elapsed.
1090fc
4
LTC1090
TEST CIRCUITS
On and Off Channel Leakage Current
Voltage Waveforms for DOUT Delay Time, tdDO
SCLK
5V
0.8V
ION
tdDO
A
ON CHANNELS
2.4V
0.4V
DOUT
IOFF
A
Voltage Waveforms for DOUT Rise and Fall Times, tr, tf
OFF
CHANNELS
POLARITY
2.4V
0.4V
DOUT
LTC1090 • TC01
tf
tr
LTC1090 • TC02
Voltage Waveforms for ten and tdis
1
2
ACLK
2.0V
CS
DOUT
WAVEFORM 1
(SEE NOTE 1)
90%
2.4V
ten
DOUT
WAVEFORM 2
(SEE NOTE 2)
tdis
0.4V
10%
NOTE 1: WAVEFORM 1 IS FOR AN OUTPUT WITH INTERNAL CONDITIONS SUCH THAT THE OUTPUT
IS HIGH UNLESS DISABLED BY THE OUTPUT CONTROL
NOTE 2: WAVEFORM 2 IS FOR AN OUTPUT WITH INTERNAL CONDITIONS SUCH THAT THE OUTPUT
IS LOW UNLESS DISABLED BY THE OUTPUT CONTROL
LTC1090 • TC03
Load Circuit for tdis and ten
1.4V
TEST
POINT
DOUT
Load Circuit for tdDO, tr, and tf
3k
100pF
5V
WAVEFORM 2
WAVEFORM 1
3k
DOUT
TEST POINT
100pF
LTC1090 • TC04
LTC1090 • TC05
1090fc
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LTC1090
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PI FU CTIO S
#
PIN
FUNCTION
DESCRIPTION
1-8
9
CH0 to CH7
COM
Analog Inputs
Common
10
11
12
13,14
15
16
17
18
19
20
DGND
AGND
V–
REF –, REF+
CS
DOUT
DIN
SCLK
ACLK
VCC
Digital Ground
Analog Ground
Negative Supply
Reference Inputs
Chip Select Input
Digital Data Output
Data Input
Shift Clock
A/D Conversion Clock
Positive Supply
The analog inputs must be free of noise with respect to AGND.
The common pin defines the zero reference point for all single ended inputs. It must be free
of noise and is usually tied to the analog ground plane.
This is the ground for the internal logic. Tie to the ground plane.
AGND should be tied directly to the analog ground plane.
Tie V – to most negative potential in the circuit. (Ground in single supply applications.)
The reference inputs must be kept free of noise with respect to AGND.
A logic low on this input enables data transfer.
The A/D conversion result is shifted out of this output.
The A/D configuration word is shifted into this input.
This clock synchronizes the serial data transfer.
This clock controls the A/D conversion process.
This supply must be kept free of noise and ripple by bypassing directly to the analog ground
plane.
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BLOCK DIAGRA
VCC
DIN
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
COM
18
20
17
OUTPUT
SHIFT
REGISTER
INPUT SHIFT
REGISTER
1
2
3
4
5
6
7
8
9
SAMPLE
AND HOLD
16
SCLK
DOUT
COMP
10-BIT
SAR
ANALOG
INPUT
MUX
10-BIT
CAPACITIVE
DAC
19
10
11
DGND
AGND
12
V–
13
REF –
14
REF+
CONTROL
AND
TIMING
15
ACLK
CS
LTC1090 • BD01
1090fc
6
LTC1090
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TYPICAL PERFOR A CE CHARACTERISTICS
Supply Current vs Supply Voltage
Supply Current vs Temperature
4
3
2
1.2
1.0
0.8
0.6
1
0
0.6
REF +OPEN
ACLK = 2MHz
CS = 5V
VCC = 5V
0.4
4
5
9
6
7
8
SUPPLY VOLTAGE, VCC (V)
0.2
50
100
–50 –25
25
75
0
AMBIENT TEMPERATURE, TA (°C)
10
LTC1090 • TPC01
OFFSET ERROR (LSBs =
6
8
7
VOS = 1mV
4
3
VOS = 0.5mV
0
0.5
LTC1090 • TPC03
1
3
4
2
REFERENCE VOLTAGE, VREF (V)
0
5
0.5
0
0
0.5
0.25
VREF = 4V
ACLK = 2MHz
CHANGE IN GAIN ERROR (LSBs)
LINEARITY ERROR (LSBs)
0.5
1.0
0.75
0.5
0.25
9
6
7
8
SUPPLY VOLTAGE, VCC (V)
10
LTC1090 • TPC07
0
5
Change in Gain Error vs Supply
Voltage
VREF = 4V
ACLK = 2MHz
0.75
1
3
4
2
REFERENCE VOLTAGE, VREF (V)
LTC1090 • TPC06
1.25
5
1.0
Linearity Error vs Supply Voltage
VREF = 4V
ACLK = 2MHz
VOS = 1.25mV AT VCC = 5V
4
VCC = 5V
LTC1090 • TPC05
1.25
125
0.25
Offset Error vs Supply Voltage
OFFSET ERROR (LSBs)
0
50
100
–50 –25
25
75
0
AMBIENT TEMPERATURE, TA (°C)
0.75
LTC1090 • TPC04
0
0.1
1.25
VCC = 5V
1.0
0
0.2
1.0
5.0
REFERENCE VOLTAGE, VREF (V)
1.0
0.2
Change in Gain Error vs
Reference Voltage
0.25
2
1
0.3
125
0.75
5
0.4
CHANGE IN GAIN ERROR (LSBs = 1 • VREF)
1024
1.25
LINEARITY ERROR (LSBs = 1 • VREF)
1024
1 •V )
1024 REF
9
0.5
Linearity Error vs Reference
Voltage
VCC = 5V
VREF = 5V
LTC1090 • TPC02
Unadjusted Offset Error vs
Reference Voltage
10
REFERENCE CURRENT, IREF (mA)
REF +OPEN
ACLK = 2MHz
CS = VCC
TA = 25°C
5
Reference Current vs Temperature
1.4
SUPPLY CURRENT, ICC (mA)
SUPPLY CURRENT, ICC (mA)
6
4
5
9
6
7
8
SUPPLY VOLTAGE, VCC (V)
10
LTC1090 • TPC08
0.25
0
– 0.25
– 0.5
4
5
9
6
7
8
SUPPLY VOLTAGE, VCC (V)
10
LTC1090 • TPC09
1090fc
7
LTC1090
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0.6
VCC = 5V
VREF = 5V
ACLK = 2MHz
0.5
0.4
0.3
0.2
0.1
0
50
100
–50 –25
25
75
0
AMBIENT TEMPERATURE, TA (°C)
125
0.6
VCC = 5V
VREF = 5V
ACLK = 2MHz
0.5
0.4
0.3
0.2
0.1
0
50
100
–50 –25
25
75
0
AMBIENT TEMPERATURE, TA (°C)
Maximum Conversion Clock Rate
vs Temperature
3
2
1
VCC = 5V
VREF = 5V
0
50
100
–50 –25
25
75
0
AMBIENT TEMPERATURE, TA (°C)
4
3
2
1
0
125
–INPUT
RFILTER
+
CFILTER ≥ 1µF
10k
_
1k
100
RSOURCE–
10
0
100
1k
5
4
3
2
1
4
5
10k
RSOURCE – (Ω)
5
8
7
9
6
SUPPLY VOLTAGE, VCC (V)
10
LTC1090 • TPC15
Sample-and-Hold Acquisition
Time vs Source Resistance
S & H ACQUISITION TIME TO 0.1% (µs)
+INPUT
2
VREF = 4V
TA = 25°C
6
10
VIN
MAXIMUM RFILTER** (Ω)
3
125
0
1
3
4
2
REFERENCE VOLTAGE, VREF (V)
0
100k
VCC = 5V
VREF = 5V
TA = 25°C
10
0
50
100
–50 –25
25
75
0
AMBIENT TEMPERATURE, TA (°C)
Maximum Filter Resistor vs Cycle
Time
5
1
0.1
LTC1090 • TPC14
Maximum Conversion Clock Rate
vs Source Resistance
VIN
0.2
7
VCC = 5V
TA = 25°C
LTC1090 • TPC13
4
0.3
Maximum Conversion Clock Rate
vs Supply Voltage
MAXIMUM ACLK FREQUENCY* (MHz)
MAXIMUM ACLK FREQUENCY* (MHz)
MAXIMUM ACLK FREQUENCY* (MHz)
4
0.4
LTC1090 • TPC12
5
5
VCC = 5V
VREF = 5V
ACLK = 2MHz
0.5
Maximum Conversion Clock Rate
vs Reference Voltage
6
MAXIMUM ACLK FREQUENCY* (MHz)
125
0.6
LTC1090 • TPC11
LTC1090 • TPC10
10
100
1000
CYCLE TIME, tCYC (µs)
LTC1090 • TPC16
*MAXIMUM ACLK FREQUENCY REPRESENTS THE ACLK FREQUENCY AT WHICH A 0.1LSB
SHIFT IN THE ERROR AT ANY CODE TRANSITION FROM ITS 2MHz VALVE IS FIRST DETECTED.
8
Change in Gain Error
vs Temperature
Change in Linearity Error
vs Temperature
MAGNITUDE OF GAIN CHANGE, ∆GAIN (LSBs)
Change in Offset Error
vs Temperature
MAGNITUDE OF LINEARITY CHANGE, ∆LINEARITY (LSBs)
MAGNITUDE OF OFFSET CHANGE, ∆OFFSET (LSBs)
TYPICAL PERFOR A CE CHARACTERISTICS
10k
LTC1090 • TPC17
VREF = 5V
VCC = 5V
TA = 25°C
0 TO 5V INPUT STEP
1
RSOURCE+
VIN
+
_
0.1
100
1k
RSOURCE+ (Ω)
10k
LTC1090 • TPC18
**MAXIMUM RFILTER REPRESENTS THE FILTER RESISTOR VALVE AT WHICH A 0.1LSB SHIFT
CHANGE IN FULL SCALE ERROR FROM ITS VALUE AT RFILTER = 0 IS FIRST DETECTED.
1090fc
LTC1090
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TYPICAL PERFOR A CE CHARACTERISTICS
Digital Input Logic Threshold vs
Supply Voltage
Input Channel Leakage Current
vs Temperature
1000
INPUT CHANNEL LEAKAGE CURRENT (nA)
TA = 25°C
3
2
1
5
6
7
8
9
SUPPLY VOLTAGE, VCC (V)
GUARANTEED
800
700
600
500
400
ON CHANNEL
300
200
OFF CHANNELS
100
0
4
LTC1090 NOISE = 200µV PEAK-TO-PEAK
900
PEAK-TO-PEAK NOISE ERROR (LSBs)
4
LOGIC THRESHOLD (V)
Noise Error vs Reference Voltage
2.0
50
25
–50 –25
0
75 100
AMBIENT TEMPERATURE, TA (°C)
10
1.75
1.5
1.25
1.0
0.75
0.5
0.25
1
5
0.2
REFERENCE VOLTAGE, VREF (V)
125
LTC1090 • TPC21
LTC1090 • TPC20
LTC1090 • TPC19
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APPLICATIO S I FOR ATIO
The LTC1090 is a data acquisition component which
contains the following functional blocks:
1. 10-bit successive approximation capacitive
A/D converter
DIGITAL CONSIDERATIONS
1. Serial Interface
The LTC1090 communicates with microprocessors and
other external circuitry via a synchronous, full duplex,
four wire serial interface (see Operating Sequence). The
shift clock (SCLK) synchronizes the data transfer with
each bit being transmitted on the falling SCLK edge
and captured on the rising SCLK edge in both transmitting and receiving systems. The data is transmitted and
received simultaneously (full duplex).
2. Analog multiplexer (MUX)
3. Sample and hold (S/H)
4. Synchronous, full duplex serial interface
5. Control and timing logic
Operating Sequence
(Example: Differential Inputs (CH3 to CH2), Bipolar, MSB First and 10-Bit Word Length)
tCYC
1
5
8
SCLK
10
DON’T CARE
tSMPL
tCONV
CS
DIN
SGL/
DIFF ODD/ SEL1 SEL0 UNI MSBF WL1 WL0
SIGN
DOUT
DON’T CARE
B9
(SB)
SHIFT CONFIGURATION
WORD IN
B8
B7
B6
B5
B4
B3
B2
SHIFT A/D RESULT OUT AND
NEW CONFIGURATION WORD IN
B1
B0
LTC1090 • AI01
1090fc
9
LTC1090
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APPLICATIO S I FOR ATIO
Data transfer is initiated by a falling chip select (CS) signal.
After the falling CS is recognized, an 8-bit input word
is shifted into the DIN input which configures the LTC1090
for the next conversion. Simultaneously, the result of the
previous conversion is output on the DOUT line. At the end
of the data exchange the requested conversion begins and
CS should be brought high. After tCONV, the conversion is
complete and the results will be available on the next data
transfer cycle. As shown below, the result of a conversion
is delayed by one CS cycle from the input word requesting
it.
DIN
DIN Word 1
DIN Word 2
DIN Word 3
DOUT
DOUT Word 0
DOUT Word 1
DOUT Word 2
Data
Transfer
tCONV
A/D
Conversion
tCONV
A/D
Conversion
Data
Transfer
LTC1090 • AI02
2. Input Data Word
The LTC1090 8-bit input data word is clocked into the DIN
input on the first eight rising SCLK edges after chip select
is recognized. Further inputs on the DIN pin are then
ignored until the next CS cycle. The eight bits of the input
word are defined as follows:
Unipolar/
Bipolar
Data Input (DIN) Word:
SGL/
DIFF
ODD/
SIGN
SELECT
1
MUX Address
SELECT
0
UNI
Multiplexer (MLIX) Address
The first four bits of the input word assign the MUX
configuration for the requested conversion. For a given
channel selection, the converter will measure the voltage
between the two channels indicated by the + and – signs
in the selected row of Table 1. Note that in differential
mode (SGL/DIFF = O) measurements are limited to four
adjacent input pairs with either polarity. In single ended
mode, all input channels are measured with respect to
COM. Figure 1 shows some examples of multiplexer
assignments.
Table 1. Multiplexer Channel Selection
MUX ADDRESS
SGL/
DIFF
ODD
SIGN
0
0
1
0
0
0
+
–
0
0
0
1
0
0
1
0
0
0
1
1
0
1
0
0
0
1
0
1
0
1
1
0
0
1
1
1
Word Length
MSBF
MSB First/
LSB First
WL1
WL0
LTC1090• AI03
DIFFERENTIAL CHANNEL SELECTION
SELECT
1
0
–
3
+
–
4
5
+
–
6
7
+
–
–
+
+
–
+
–
MUX ADDRESS
SGL/ ODD/
DIFF SIGN
2
+
SINGLE ENDED CHANNEL SELECTION
SELECT
1
0
0
+
1
0
0
0
1
0
0
1
1
0
1
0
1
0
1
1
1
1
0
0
1
1
0
1
1
1
1
0
1
1
1
1
1
2
3
4
5
6
7 COM
–
+
–
+
–
+
–
+
–
+
–
+
–
+
–
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4 Differential
8 Single Ended
CHANNEL
0
1
2
3
4
5
6
7
CHANNEL
0,1
+( – )
–( + )
2,3
+( – )
–( + )
4,5
+( – )
–( + )
6,7
+( – )
–( + )
Combinations of Differential and Single Ended
CHANNEL
+
+
+
+
+
+
+
+
0,1
+
–
2,3
–
+
4
5
6
7
COM ( – )
+
+
+
+
COM ( – )
LTC1090 • AI04B
LTC1090 • AI04A
LTC1090 • AI04C
Changing the MUX Assignment “On the Fly”
4,5
+
–
6,7
+
–
–
+
5,4
6
7
+
+
COM ( – )
COM (UNUSED)
2ND CONVERSION
1ST CONVERSION
LTC1090 • AI04E
LTC1090 • AI04D
Figure 1. Examples of Multiplexer Options on the LTC1090
Unipolar/Bipolar (UNI)
The fifth input bit (UNI) determines whether the conversion will be unipolar or bipolar. When UNI is a logical one,
a unipolar conversion will be performed on the selected
input voltage. When UNI is a logical zero, a bipolar conversion will result. The input span and code assignment for
each conversion type are shown in the figures below.
Unipolar Transfer Curve (UNI = 1)
1111111111
1111111110
0000000001
0000000000
OV
VREF – 2LSB
1LSB
VREF
VREF – 1LSB
VIN
LTC1090 • AI05
Bipolar Transfer Curve (UNI = 0)
0111111111
0111111110
–VREF +1LSB
–VREF
0000000001
0000000000
1LSB
VIN
–1LSB
1111111111
1111111110
VREF – 2LSB
VREF
VREF – 1LSB
–2LSB
1000000001
1000000000
LTC1090 • AI06
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Unipolar Output Code (UNI = 1)
OUTPUT CODE
INPUT VOLTAGE
INPUT VOLTAGE
(VREF = 5V)
1111111111
1111111110
•
•
•
0000000001
0000000000
VREF – 1LSB
VREF – 2LSB
•
•
•
1LSB
0V
4.9951V
4.9902V
•
•
•
0.0049V
0V
control the length of the present, not the next, DOUT word.
WL1 and WL0 are never “don’t cares” and must be set for
the correct DOUT word length even when a “dummy” DIN
word is sent. On any transfer cycle, the word length should
be made equal to the number of SCLK cycles sent by the
MPU.
Bipolar Output Code (UNI = 0)
OUTPUT CODE
INPUT VOLTAGE
INPUT VOLTAGE
(VREF = 5V)
0111111111
0111111110
•
•
•
0000000001
0000000000
1111111111
1111111110
•
•
•
1000000001
1000000000
VREF – 1LSB
VREF – 2LSB
•
•
•
1LSB
0V
–1LSB
–2LSB
•
•
•
– (VREF) + 1LSB
– (VREF)
4.9902V
4.9805V
•
•
•
0.0098V
0V
–0.0098V
–0.0195V
•
•
•
–4.9902V
–5.000V
MSB First/LSB First Format (MSBF)
The output data of the LTC1090 is programmed for MSB
first or LSB first sequence using the MSBF bit. For MSB
first output data the input word clocked to the LTC1090
should always contain a logical one in the sixth bit location
(MSBF bit). Likewise for LSB first output data, the input
word clocked to the LTC1090 should always contain a zero
in the MSBF bit location. The MSBF bit in a given DIN word
will control the order of the next DOUT word. The MSBF bit
affects only the order of the output data word. The order
of the input word is unaffected by this bit.
MSBF
OUTPUT FORMAT
0
1
LSB First
MSB First
Word Length (WL1, WL0)
The last two bits of the input word (WL1 and WL0) program
the output data word length of the LTC1090. Word lengths
of 8, 10, 12 or 16 bits can be selected according to the
following table. The WL1 and WL0 bits in a given DIN word
WL1
WL0
OUTPUT WORD LENGTH
0
0
1
1
0
1
0
1
8 Bits
10 Bits
12 Bits
16 Bits
Figure 2 shows how the data output (DOUT) timing can be
controlled with word length selection and MSB/LSB first
format selection.
3. Deglitcher
A deglitching circuit has been added to the Chip Select
input of the LTC1090 to minimize the effects of errors
caused by noise on that input. This circuit ignores changes
in state on the CS input that are shorter in duration than 1
ACLK cycle. After a change of state on the CS input, the
LTC1090 waits for two falling edges of the ACLK before
recognizing a valid chip select. One indication of CS low
recognition is the DOUT line becoming active (leaving the
Hi-Z state). Note that the deglitching applies to both the
rising and falling CS edges.
ACLK
CS
DOUT
HIGH Z
VALID OUTPUT
LOW CS RECOGNIZED
INTERNALLY
ACLK
CS
DOUT
HIGH Z
HIGH CS RECOGNIZED
INTERNALLY
LTC1090 • AI07
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8-Bit Word Length
t SMPL
t CONV
CS
SCLK
1
8
(SB)
DOUT
MSB FIRST
B9
B8
B7
B6
B5
B4
B3
B2
DOUT
LSB FIRST
B0
B1
B2
B3
B4
B5
B6
B7
THE LAST TWO BITS
ARE TRUNCATED
LTC1090 • AI08A
10-Bit Word Length
t SMPL
t CONV
CS
SCLK
10
1
(SB)
DOUT
MSB FIRST
B9
B8
B7
B6
B5
B4
B3
B2
B1
DOUT
LSB FIRST
B0
B1
B2
B3
B4
B5
B6
B7
B8
B0
(SB)
B9
LTC1090 • AI08B
12-Bit Word Length
t CONV
t SMPL
CS
SCLK
10
1
12
(SB)
DOUT
MSB FIRST
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
FILL
ZEROES
(SB)
DOUT
LSB FIRST
B0
B1
B2
B3
B4
B5
B6
B7
B8
B9
*
*
LTC1090 • AI08C
16-Bit Word Length
t SMPL
t CONV
CS
SCLK
1
16
10
(SB)
DOUT
MSB FIRST
B9
B8
B7
B6
B5
B4
B3
B2
B1
DOUT
LSB FIRST
B0
B1
B2
B3
B4
B5
B6
B7
B8
FILL
ZEROES
B0
(SB)
B9
*
*
*
*
*
*IN UNIPOLAR MODE, THESE BITS ARE FILLED WITH ZEROES.
IN BIPOLAR MODE, THE SIGN BIT IS EXTENDED INTO THESE LOCATIONS
*
LTC1090 • AI08D
Figure 2. Data Output (DOUT) Timing with Different Word Lengths
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4. CS Low During Conversion
In the normal mode of operation, CS is brought high
during the conversion time (see Figure 3). The serial port
ignores any SCLK activity while CS is high. The LTC1090
will also operate with CS low during the conversion. In this
mode, SCLK must remain low during the conversion as
shown in Figure 4. After the conversion is complete, the
tSMPL
SAMPLE
ANALOG
INPUT
SHIFT
MUX
ADDRESS
IN
DOUT line will become active with the first output bit. Then
the data transfer can begin as normal.
5. Microprocessor Interfaces
The LTC1090 can interface directly (without external hardware) to most popular microprocessor (MPU) synchronous
SHIFT RESULT OUT
AND NEW ADDRESS IN
40 TO 44 ACLK CYCLES
CS
SCLK
DIN
DOUT
SEL SEL
SGL/
ODD/
0 UNI MSBF WL1 WL0
1
DIFF
SIGN
B9
B8
B7
B6
B5
B4
B3
B2
SEL
SGL/
ODD/
1 SEL
DIFF
SIGN
0
DON’T CARE
B1
B0
B9
B8
B7
B6
UNI MSBF WL1 WL0
B5
B4
B3
B2
B1
B0
LTC1090 • AI09
Figure 3. CS High During Conversion
tSMPL
SAMPLE
ANALOG
INPUT
SHIFT
MUX
ADDRESS
IN
SHIFT RESULT OUT
AND NEW ADDRESS IN
40 TO 44 ACLK CYCLES
CS
SCLK
DIN
SCLK MUST REMAIN LOW
SEL SEL
SGL/
ODD/
0 UNI MSBF WL1 WL0
1
DIFF
SIGN
DOUT
B9
B8
B7
B6
B5
B4
B3
B2
SEL
SGL/
ODD/
1 SEL
DIFF
SIGN
0
DON’T CARE
B1
B0
B9
B8
B7
B6
UNI MSBF WL1 WL0
B5
B4
B3
B2
B1
B0
LTC1090 • AI10
Figure 4. CS Low During Conversion
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serial formats (see Table 2). If an MPU without a serial
interface is used, then 4 of the MPU’s parallel port lines can
be programmed to form the serial link to the LTC1090.
Included here are three serial interface examples and one
example showing a parallel port programmed to form the
serial interface.
Table 2. Microprocessors with Hardware Serial Interfaces
Compatible with the LTC1090**
PART NUMBER
Motorola
MC6805S2, S3
MC68HC11
MC68HC05
RCA
CDP68HC05
Hitachi
HD6305
HD63705
HD6301
HD63701
HD6303
National Semiconductor
COP400 Family
COP800 Family
NS8050U
HPC16000 Family
Texas Instruments
TMS7002
TMS7042
TMS70C02
TMS70C42
TMS32011*
TMS32020*
TYPE OF INTERFACE
National MICROWIRE (COP420)
The COP420 transfers data MSB first and in 4-bit increments (nibbles). This is easily accommodated by setting
the LTC1090 to MSB first format and 12-bit word length.
The data output word is then received by the COP420 in
three 4-bit blocks with the final two unused bits filled with
zeroes by the LTC1090.
Hardware and Software Interface to National Semiconductor
COP420 Processor
SPI
SPI
SPI
ANALOG
INPUTS
SPI
SCI Synchronous
SCI Synchronous
SCI Synchronous
SCI Synchronous
SCI Synchronous
MICROWIRE†
MICROWIRE/PLUS†
MICROWIRE/PLUS
MICROWIRE/PLUS
Serial Port
Serial Port
Serial Port
Serial Port
Serial Port
Serial Port
*Requires external hardware
**Contact LTC Marketing for interface information for processors not on
this list
†MICROWIRE and MlCROWIRE/PLUS are trademarks of National
Semiconductor Corp.
Serial Port Microprocessors
Most synchronous serial formats contain a shift clock
(SCLK) and two data lines, one for transmitting and one for
receiving. In most cases data bits are transmitted on the
falling edge of the clock (SCLK) and captured on the rising
edge. However, serial port formats vary among MPU
manufacturers as to the smallest number of bits that can
be sent in one group (e.g., 4-bit, 8-bit or 16-bit transfers).
They also vary as to the order in which the bits are
transmitted (LSB or MSB first). The following examples
show how the LTC1090 accommodates these differences.
COP420
LTC1090
CS
GO
SCLK
SK
DIN
SO
DOUT
SI
DOUT from LTC1090 stored in COP420 RAM
Location A
MSB*
B9 B8 B7 B6
first 4 bits
Location A + 1
B5 B4 B3 B2
second 4 bits
LSB
Location A + 2
B1 B0 B0 B0
third 4 bits
LTC1090 • AI11
*B9 is MSB in unipolar or sign bit in bipolar
MNEMONIC
LEI
SC
OGI
LDD
XAS
LDD
NOP
XAS
XIS
NOP
XAS
XIS
RC
NOP
XAS
XIS
OGI
LEI
DESCRIPTION
Enable SlO
Set Carry flag
G0 is set to (CS goes low)
Load first 4 bits of DIN to ACC
Swap ACC with SIO reg. Starts SK Clk
Load 2nd 4 bits of DIN to ACC
Timing
Swap first 4 bits from A/D with ACC. SK continues.
Put first 4 bits in RAM (location A)
Timing
Swap 2nd 4 bits from A/D with ACC. SK continues.
Put 2nd 4 bits in RAM (location A + 1)
Clear Carry
Timing
Swap 3rd 4 bits from A/D with ACC. SK off
Put 3rd 4 bits in RAM (location A + 2)
G0 is set to 1 (CS goes high)
Disable SlO
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Motorola SPI (MC68HC05C4)
Hitachi Synchronous SCI (HD63705)
The MC68HC05C4 transfers data MSB first and in 8-bit
increments. Programming the LTC1090 for MSB first
format and 16-bit word length allows the 10-bit data
output to be received by the MPU as two 8-bit bytes with
the final 6 unused bits filled with zeroes by the LTC1090.
The HD63705 transfers serial data in 8-bit increments,
LSB first. To accommodate this, the LTC1090 is
programmed for 16-bit word length and LSB first format.
The 10-bit output data is received by the processor as two
8-bit bytes, LSB first. The LTC1090 fills the final 6 unused
bits (after the MSB) with zeroes in unipolar mode and with
the sign bit in bipolar mode.
Hardware and Software Interface to Motorola MC68HC05C4
Processor
Hardware and Software Interface to Hitachi HD63705 Processor
LTC1090
MC68HCO5C4
CO
CS
ANALOG
INPUTS
LTC1090
SCK
SCLK
DIN
MOSI
DOUT
MISO
ANALOG
INPUTS
DOUT from LTC1090 stored in MC68HCO5C4 RAM
B9 B8 B7 B6 B5 B4 B3 B2
B1 B0
C0
SCLK
CK
DIN
TX
DOUT
RX
LSB
byte 1
B7 B6 B5 B4 B3 B2 B1 B0
Location A
LSB
Location A + 1
CS
DOUT from LTC1090 stored in HD63705 RAM
MSB*
Location A
HD63705
0
0
0
0
0
0
*B9 is MSB in unipolar or sign bit in bipolar
byte 1
Sign
byte 2
Location A + 1
B9 B9 B9 B9 B9 B9 B9 B8
byte 2
LTC1090 • AI12
Bipolar
LSB
MNEMONIC
BCLR n
LDA
STA
↑
NOP
↓
LDA
LDA
STA
STA
↑
NOP
↓
BSET n
LDA
LDA
STA
DESCRIPTION
C0 is cleared (CS goes Low)
Load DIN for LTC1090 into ACC
Load DIN from ACC to SPI data reg. Start SCK
B7 B6 B5 B4 B3 B2 B1 B0
Location A
Location A + 1
0
0 0
Unipolar
8 NOPs for timing
Load contents of SPI status reg. into ACC
Load LTC1090 DOUT from SPI data reg. into ACC (byte 1)
Load LTC1090 DOUT into RAM (location A)
Start next SPl cycle
MNEMONIC
6 NOPs for timing
↑
NOP
↓
LDA
C0 is set (CS goes high)
Load contents of SPI status reg. into ACC
Load LTC1090 DOUT from SPI data reg. into ACC (byte 2)
Load LTC1090 DOUT into RAM (location A + 1)
MSB
0 0 0 B9 B8
LDA
BCLR n
STA
STA
NOP
BSET n
LDA
STA
byte 1
byte 2
LTC1090 • AI13
DESCRIPTION
Load DIN word for LTC1090 into ACC from RAM
C0 cleared (CS goes low)
Load DIN word for LTC1090 into SCI data reg. from ACC
and start clocking data (LSB first)
6 NOPs for timing
Load contents of SCI data reg. into ACC (byte 1)
Start next SCI cycle
Load LTC1090 DOUT word into RAM (Location A)
Timing
C0 set (CS goes high)
Load contents of SCI data reg. into ACC (byte 2)
Load LTC1090 DOUT word into RAM (Location A + 1)
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8051 Code
Parallel Port Microprocessors
When interfacing the LTC1090 to an MPU which has a
parallel port, the serial signals are created on the port with
software. Three MPU port lines are programmed to create
the CS, SCLK and DIN signals for the LTC1090. A fourth
port line reads the DOUT line. An example is made of the
Intel 8051/8052/80C252 family.
LOOP:
Hardware and Software Interface to Intel 8051 Processor
LTC1090
ANALOG
INPUTS
8051
DOUT
P1.1
DIN
P1.2
SCLK
P1.3
CS
P1.4
ACLK
ALE
DOUT from LTC1090 stored in 8051 RAM
DELAY:
MSB*
R2
DESCRIPTION
MOV PI,#02H
Initialize port 1 (bit 1 is made
an input)
SCLK goes low
CS goes high
DIN word for the LTC1090 is
placed in ACC.
CS goes low
Load counter
Delay for deglitcher
Read data bit into carry
Rotate data bit into ACC
Output DIN bit to LTC1090
SCLK goes high
SCLK goes low
Next bit
Store MSBs in R2
Read data bit into carry
CIear ACC
Rotate data bit into ACC
SCLK goes high
SCLK goes low
Read data bit into carry
Rotate right into ACC
Rotate right into ACC
Store LSBs in R3
SCLK goes high
SCLK goes low
CS goes high
Load counter
Delay for LTC1090 to perform
conversion
Repeat program
CLR P1.3
SETB P1.4
CONTINUE: MOV A,#0DH
Intel 8051
To interface to the 8051, the LTC1090 is programmed for
MSB first format and 10-bit word length. The 8051 generates CS, SCLK and DIN on three port lines and reads DOUT
on the fourth.
MNEMONIC
CLR P1.4
MOV R4,#08
NOP
MOV C, P1.1
RLC A
MOV P1.2, C
SETB P1.3
CLR P1.3
DJNZ R4, LOOP
MOV R2, A
MOV C, P1.1
CLR A
RLC A
SETB P1.3
CLR P1.3
MOV C, P1.1
RRC A
RRC A
MOV R3, A
SETB P1.3
CLR P1.3
SETB P1.4
MOV R5,#07H
DJNZ R5, DELAY
AJMP CONTINUE
B9 B8 B7 B6 B5 B4 B3 B2
LSB
R3
B1 B0
0
0
0
0
0
0
*B9 is MSB in unipolar or sign bit in bipolar
2 1 0
OUTPUT PORT
SERIAL DATA
MPU
3-WIRE SERIAL
INTERFACE TO OTHER
PERIPHERALS OR LTC1090s
3
3
3
LTC1090
8 CHANNELS
CS
3
LTC1090
8 CHANNELS
CS
CS
LTC1090
8 CHANNELS
LTC1090 • AI14
Figure 5. Several LTC1090’s Sharing One 3-Wire Serial Interface
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6. Sharing the Serial Interface
The LTC1090 can share the same 3-wire serial interface
with other peripheral components or other LTC1090s (see
Figure 5). In this case, the CS signals decide which
LTC1090 is being addressed by the MPU.
VCC
4.7µF TANTALUM
1
20
ANALOG CONSIDERATIONS
1. Grounding
The LTC1090 should be used with an analog ground plane
and single point grounding techniques.
Pin 11 (AGND) should be tied directly to this ground plane.
Pin 20 (VCC) should be bypassed to the ground plane with
a 4.7µF tantalum with leads as short as possible. Pin 12
(V –) should be bypassed with a 0.1µF ceramic disk. For
single supply applications, V – can be tied to the ground
plane.
It is also recommended that pin 13 (REF –) and pin 9 (COM)
be tied directly to the ground plane. All analog inputs
should be referenced directly to the single point ground.
Digital inputs and outputs should be shielded from and/or
routed away from the reference and analog circuitry.
Figure 6 shows an example of an ideal ground plane design
for a two sided board. Of course this much ground plane
will not always be possible, but users should strive to get
as close to this ideal as possible.
V–
ANALOG
GROUND
PLANE
10
11
0.1µF CERAMIC DISK
LTC1090 • AI15
Figure 6. Example Ground Plane for the LTC1090
VERTICAL: 0.5mV/DIV
Pin 10 (DGND) can also be tied directly to this ground
plane because minimal digital noise is generated within
the chip itself.
HORIZONTAL: 10µs/DIV
Figure 7. Poor VCC Bypassing. Noise and Ripple
can Cause A/D Errors
For good performance, VCC must be free of noise and
ripple. Any changes in the VCC voltage with respect to
analog ground during a conversion cycle can induce
errors or noise in the output code. VCC noise and ripple can
be kept below 1mV by bypassing the VCC pin directly to the
analog ground plane with a 4.7µF tantalum with leads as
short as possible. Figures 7 and 8 show the effects of good
and poor VCC bypassing.
VERTICAL: 0.5mV/DIV
2. Bypassing
HORIZONTAL: 10µs/DIV
Figure 8. Good VCC Bypassing Keeps Noise and Ripple
on VCC Below 1mV
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3. Analog Inputs
“+” Input Settling
Because of the capacitive redistribution A/D conversion
techniques used, the analog inputs of the LTC1090 have
capacitive switching input current spikes. These current
spikes settle quickly and do not cause a problem.
This input capacitor is switched onto the “+” input during
the sample phase (tSMPL, see Figure 10). The sample
phase starts at the 4th SCLK cycle and lasts until the falling
edge of the last SCLK (the 8th, 10th, 12th or 16th SCLK
cycle depending on the selected word length). The voltage
on the “+” input must settle completely within this sample
time. Minimizing RSOURCE+ and C1 will improve the input
settling time. If large “+” input source resistance must be
used, the sample time can be increased by using a slower
SCLK frequency or selecting a longer word length. With
the minimum possible sample time of 4µs, RSOURCE+ < 2k
and C1 < 20pF will provide adequate settling.
However, if large source resistances are used or if slow
settling op amps drive the inputs, care must be taken to
insure that the transients caused by the current spikes
settle completely before the conversion begins.
Source Resistance
The analog inputs of the LTC1090 look like a 60pF capacitor (CIN) in series with a 500Ω resistor (RON) as shown in
Figure 9. CIN gets switched between the selected “+” and
“–” inputs once during each conversion cycle. Large
external source resistors and capacitances will slow the
settling of the inputs. It is important that the overall RC
time constants be short enough to allow the analog inputs
to completely settle within the allowed time.
VIN+
RSOURCE+
“+”
INPUT
4TH SCLK
RON = 500Ω
C1
VIN–
RSOURCE–
“–”
INPUT
CIN = 60pF
LAST SCLK
LTC1090
C2
LTC1090 • AI16
“–” Input Settling
At the end of the sample phase the input capacitor switches
to the “–” input and the conversion starts (see Figure 10).
During the conversion, the “+” input voltage is effectively
“held” by the sample and hold and will not affect the
conversion result. However, it is critical that the “–” input
voltage be free of noise and settle completely during the
first four ACLK cycles of the conversion time. Minimizing
RSOURCE– and C2 will improve settling time. If large
“–” input source resistance must be used, the time allowed
for settling can be extended by using a slower ACLK
frequency. At the maximum ACLK rate of 2MHz, RSOURCE–
< 1kΩ and C2 < 20pF will provide adequate settling.
Figure 9. Analog Input Equivalent Circuit
SAMPLE
MUX ADDRESS
SHIFTED IN
HOLD
“ + ” INPUT MUST
SETTLE DURING THIS TIME
t SMPL
CS
SCLK
ACLK
1
2
3
4
LAST SCLK (8TH, 10TH, 12TH OR 16TH DEPENDING ON WORK LENGTH)
1
2
3
4
1ST BIT
TEST
“ – ” INPUT MUST SETTLE
DURING THIS TIME
“ + ” INPUT
“ – ” INPUT
LTC1090 • AI17
Figure 10. “+” and “–” Input Settling Windows
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APPLICATIO S I FOR ATIO
Input Op Amps
When driving the analog inputs with an op amp it is
important that the op amp settle within the allowed time
(see Figure 10). Again, the “+” and “–” input sampling
times can be extended as described above to accommodate slower op amps. Most op amps including the LT1006
and LT1013 single supply op amps can be made to settle
well even with the minimum settling windows of 4µs (“+”
input) and 2µs (“–” input) which occur at the maximum
clock rates (ACLK = 2MHz and SCLK = 1MHz). Figures 11
and 12 show examples of adequate and poor op amp
settling.
eliminated by increasing the cycle time as shown in the
typical curve of Maximum Filter Resistor vs Cycle Time.
VIN
RFILTER
IDC
“+”
CFILTER
LTC1090
“–”
LTC1090 • AI18
Figure 13. RC Input Filtering
VERTICAL: 5mV/DIV
Input Leakage Current
HORIZONTAL: 1µs/DIV
Figure 11. Adequate Settling of Op Amp Driving Analog Input
Input leakage currents can also create errors if the source
resistance gets too large. For instance, the maximum input
leakage specification of 1µA (at 125°C) flowing through a
source resistance of 1kΩ will cause a voltage drop of 1mV
or 0.2LSB. This error will be much reduced at lower
temperatures because leakage drops rapidly (see typical
curve of Input Channel Leakage Current vs Temperature).
VERTICAL: 5mV/DIV
Noise Coupling into Inputs
HORIZONTAL: 20µs/DIV
Figure 12. Poor Op Amp Settling can Cause A/D Errors
RC Input Filtering
It is possible to filter the inputs with an RC network as
shown in Figure 13. For large values of CF (e.g., 1µF), the
capacitive input switching currents are averaged into a net
DC current. Therefore, a filter should be chosen with a
small resistor and large capacitor to prevent DC drops
across the resistor. The magnitude of the DC current is
approximately lDC = 60pF x VIN/tCYC and is roughly proportional to VIN. When running at the minimum cycle time of
33µs, the input current equals 9µA at VIN = 5V. In this case,
a filter resistor of 50Ω will cause 0.1LSB of full-scale error.
If a larger filter resistor must be used, errors can be
High source resistance input signals (>500Ω) are more
sensitive to coupling from external sources. It is preferable
to use channels near the center of the package (i.e., CH2 to
CH7) for signals which have the highest output resistance
because they are essentially shielded by the pins on the
package ends (DGND and CH0). Grounding any unused
inputs (especially the end pin, CH0) will also reduce
outside coupling into high source resistances.
4. Sample-and-Hold
Single Ended Inputs
The LTC1090 provides a built-in sample and hold (S&H)
function for all signals acquired in the single ended mode
(COM pin grounded). This sample and hold allows the
LTC1090 to convert rapidly varying signals (see typical
curve of S&H Acquisition Time vs Source Resistance). The
input voltage is sampled during the tSMPL time as shown
in Figure 10. The sampling interval begins after the fourth
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LTC1090
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APPLICATIO S I FOR ATIO
MUX address bit is shifted in and continues during the
remainder of the data transfer. On the falling edge of the
final SCLK, the S&H goes into hold mode and the conversion begins. The voltage will be held on either the 8th,
10th, 12th or 16th falling edge of the SCLK depending on
the word length selected.
When driving the reference inputs, three things should be
kept in mind:
Differential Inputs
2. Transients on the reference inputs caused by the
capacitive switching currents must settle completely
during each bit test (each 4 ACLK cycles). Figures 15
and 16 show examples of both adequate and poor
settling. Using a slower ACLK will allow more time for
the reference to settle. However, even at the maximum
ACLK rate of 2MHz most references and op amps can
be made to settle within the 2µs bit time.
With differential inputs or when the COM pin is not tied to
ground, the A/D no longer converts just a single voltage
but rather the difference between two voltages. In these
cases, the voltage on the selected “+” input is still sampled
and held and therefore may be rapidly time varying just as
in single ended mode. However, the voltage on the selected “–” input must remain constant and be free of noise
and ripple throughout the conversion time. Otherwise, the
differencing operation may not be performed accurately.
The conversion time is 44 ACLK cycles. Therefore, a
change in the “–” input voltage during this interval can
“–” input this error would be:
1. The source resistance (ROUT) driving the reference
inputs should be low (less than 1Ω) to prevent DC
drops caused by the 1mA maximum reference current
(IREF).
3. It is recommended that the REF – input be tied directly
to the analog ground plane. If REF – is biased at a voltage
other than ground, the voltage must not change during
a conversion cycle. This voltage must also be free of
noise and ripple with respect to analog ground.
VERROR (MAX) = VPEAK x 2 x π x f(“–”) x 44/fACLK
5. Reference Inputs
The voltage between the reference inputs of the LTC1090
defines the voltage span of the A/D converter. The reference inputs look primarily like a 10kΩ resistor but will
have transient capacitive switching currents due to the
switched capacitor conversion technique (see Figure 14).
During each bit test of the conversion (every 4 ACLK
cycles), a capacitive current spike will be generated on the
reference pins by the A/D. These current spikes settle
quickly and do not cause a problem. However, if slow
settling circuitry is used to drive the reference inputs, care
must be taken to insure that transients caused by these
current spikes settle completely during each bit test of the
conversion.
REF +
14
ROUT
VREF
10k
TYP
EVERY 4 ACLK CYCLES
RON
REF –
5pF – 30pF
13
LTC1090
LTC1090 • AI19
Figure 14. Reference Input Equivalent Circuit
VERTICAL: 0.5mV/DIV
Where f(“–”) is the frequency of the “–” input voltage,
VPEAK is its peak amplitude and fACLK is the frequency of
the ACLK. In most cases VERROR will not be significant. For
a 60Hz signal on the “–” input to generate a 1/4LSB error
(1.25mV) with the converter running at ACLK = 2MHz, its
peak value would have to be 150mV.
HORIZONTAL: 1µs/DIV
Figure 15. Adequate Reference Settling
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LTC1090
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VERTICAL: 0.5mV/DIV
APPLICATIO S I FOR ATIO
HORIZONTAL: 1µs/DIV
Figure 16. Poor Reference Settling Can Cause A/D Errors
6. Reduced Reference Operation
voltage. The offset (which is typically a fixed voltage)
becomes a larger fraction of an LSB as the size of the LSB
is reduced. The typical curve of Unadjusted Offset Error vs
Reference Voltage shows how offset in LSBs is related to
reference voltage for a typical value of VOS. For example,
a VOS of 0.5mV which is 0.1LSB with a 5V reference
becomes 0.5LSB with a 1V reference and 2.5LSBs with a
0.2V reference. If this offset is unacceptable, it can be
corrected digitally by the receiving system or by offsetting
the “–” input to the LTC1090.
The effective resolution of the LTC1090 can be increased
by reducing the input span of the converter. The LTC1090
exhibits good linearity and gain over a wide range of
reference voltages (see typical curves of Linearity and
Gain Error vs Reference Voltage). However, care must be
taken when operating at low values of VREF because of the
reduced LSB step size and the resulting higher accuracy
requirement placed on the converter. The following factors
must be considered when operating at low VREF values:
Noise with Reduced VREF
1. Conversion speed (ACLK frequency)
For operation with a 5V reference, the 200µV noise is only
0.04LSB peak-to-peak. In this case, the LTC1090 noise
will contribute virtually no uncertainty to the output code.
However, for reduced references, the noise may become
a significant fraction of an LSB and cause undesirable jitter
in the output code. For example, with a 1V reference, this
same 200µV noise is 0.2LSB peak-to-peak. This will
reduce the range of input voltages over which a stable
output code can be achieved by 0.2LSB. If the reference is
further reduced to 200mV, the 200µV noise becomes
equal to one LSB and a stable code may be difficult to
achieve. In this case averaging readings may be necessary.
2. Offset
3. Noise
Conversion Speed with Reduced VREF
With reduced reference voltages, the LSB step size is
reduced and the LTC1090 internal comparator overdrive is
reduced. With less overdrive, more time is required to
perform a conversion. Therefore, the maximum ACLK
frequency should be reduced when low values of VREF are
used. This is shown in the typical curve of Maximum
Conversion Clock Rate vs Reference Voltage.
Offset with Reduced VREF
The offset of the LTC1090 has a larger effect on the output
code when the A/D is operated with reduced reference
The total input referred noise of the LTC1090 can be
reduced to approximately 200µV peak-to-peak using a
ground plane, good bypassing, good layout techniques
and minimizing noise on the reference inputs. This noise
is insignificant with a 5V reference but will become a larger
fraction of an LSB as the size of the LSB is reduced. The
typical curve of Noise Error vs Reference Voltage shows
the LSB contribution of this 200µV of noise.
This noise data was taken in a very clean setup. Any setup
induced noise (noise or ripple on VCC, VREF, VIN or V –) will
add to the internal noise. The lower the reference voltage
to be used, the more critical it becomes to have a clean,
noise-free setup.
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22
LTC1090
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TYPICAL APPLICATIO
A “Quick Look” Circuit for the LTC1090
SNEAK-A-BITTM
Users can get a quick look at the function and timing of the
LTC1090 by using the following simple circuit. REF+ and
DIN are tied to VCC selecting a 5V input span, CH7 as a
single ended input, unipolar mode, MSB first format and
16-bit word length. ACLK and SCLK are tied together and
driven by an external clock. CS is driven at 1/64 the clock
rate by the CD4520 and DOUT outputs the data. All other
pins are tied to a ground plane. The output data from the
DOUT pin can be viewed on an oscilloscope which is set up
to trigger on the falling edge of CS.
The LTC1090’s unique ability to software select the polarity of the differential inputs and the output word length is
used to achieve one more bit of resolution. Using the
circuit below with two conversions and some software, a
2’s complement 10-bit + sign word is returned to memory
inside the MPU. The MC68HC05C4 was chosen as an
example; however, any processor could be used.
Two 10-bit unipolar conversions are performed: the first
over a 0 to 5V span and the second over a 0 to –5V span
(by reversing the polarity of the inputs). The sign of the
input is determined by which of the two spans contained
it. Then the resulting number (ranging from –1023 to 1023
decimal) is converted to 2’s complement notation and
stored in RAM.
A “Quick Look” Circuit for the LTC1090
5V
4.7µF
f/64
CH0
VCC
CH1
ACLK
CH2
SCLK
EN
RESET
CH3
DIN
Q1
Q4
CH4
DOUT
Q2
CS
Q3
CH6
REF +
Q4
Q1
CH7
REF –
RESET
EN
CH5
VIN
LTC1090
COM
DGND
VDD
CLK
f
V–
Scope Trace of LTC1090 “Quick Look” Circuit
Showing A/D Output of 0101010101 (155HEX)
0.1
Q3
LTC1090
Q2
VSS
CS
CLK
DOUT
AGND
TO OSCILLOSCOPE
CLOCK IN
1MHz MAX
DEGLITCHER
TIME
LTC1090 • TA03
MSB
(B9)
LSB
(B0)
FILLS
ZERO
SNEAK-A-BIT Circuit
10µF
LT1021-5
9V
2MHz
CLOCK
OTHER CHANNELS
OR SNEAK-A-BIT
INPUTS
CH0
VCC
CH1
ACLK
CH2
SCLK
CH3
DIN
MOSI
CH4
DOUT
MISO
CH5
VIN
– 5V TO 5V
MC68HC05C4
SCK
LTC1090
CS
CH6
REF +
CH7
REF –
COM
V–
DGND
CO
AGND
0.1µF
–5V
SNEAK-A-BIT is a trademark of Linear Technology Corp.
LTC1090 • TA04
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23
LTC1090
U
TYPICAL APPLICATIO
Sneak-A-Bit Code for the LTC1090 Using the MC68HC05C4
SNEAK-A-BIT
VIN
5V
VIN
MNEMONIC
5V
( + ) CH6
1ST CONVERSION
1024 STEPS
( – ) CH7
SOFTWARE
1ST CONVERSION
VIN
0V
0V
2047 STEPS
0V
2ND CONVERSION
1024 STEPS
( – ) CH6
( + ) CH7
–5V
–5V
2ND CONVERSION
SNEAK-A-BIT Code
DOUT from LTC1090 in MC68HC05C4 RAM
Sign
Location $77
B10
B9
B8
B7
B6
B5
B4
B3
LSB
B2
Location $87
B1
B0
filled with 0s
DIN words for LTC1090
MSBF
MUX Addr.
UNI
Word
Length
(ODD/SIGN)
DIN 1
0
0
1
1
1
1
1
1
DIN 2
0
1
1
1
1
1
1
1
DIN 3
0
0
1
1
1
1
1
1
LTC1090 • TA05
Sneak-A-Bit Code for the LTC1090 Using the MC68HC05C4
MNEMONIC
LDA
STA
LDA
STA
BSET
JSR
#$50
$0A
#$FF
$06
0, $02
READ–/+
JSR
JSR
JSR
READ+/–
READ–/+
CHK SIGN
DESCRIPTION
Configuration data for SPCR
Load configuration data into $0A
Configuration data for port C DDR
Load configuration data into port C DDR
Make sure CS is high
Dummy read configures LTC1090 for next
read
Read CH6 with respect to CH7
Read CH7 with respect to CH6
Determines which reading has valid data,
converts to 2’s complement and stores in
RAM
READ–/+: LDA
JSR
LDA
STA
LDA
STA
RTS
READ+/–: LDA
JSR
LDA
STA
LDA
STA
RTS
TRANSFER: BCLR
STA
LOOP 1: TST
BPL
LDA
STA
STA
LOOP 2: TST
BPL
BSET
LDA
STA
RTS
CHK SIGN: LDA
ORA
BEQ
CLC
ROR
ROR
LDA
STA
LDA
STA
BRA
MINUS:
CLC
ROR
ROR
COM
COM
LDA
ADD
STA
CLRA
ADC
STA
STA
LDA
STA
END:
RTS
DESCRIPTION
#$3F
TRANSFER
$60
$71
$61
$72
Load DIN word for LTC1090 into ACC
Read LTC1090 routine
Load MSBs from LTC1090 into ACC
Store MSBs in $71
Load LSBs from LTC1090 into ACC
Store LSBs in $72
Return
#$7F
Load DIN word for LTC1090 into ACC
TRANSFER Read LTC1090 routine
$60
Load MSBs from LTC1090 into ACC
$73
Store MSBs in $73
$61
Load LSBs from LTC1090 into ACC
$74
Store LSBs in $74
Return
0, $02
CS goes low
$0C
Load DIN into SPI. Start transfer
$0B
Test status of SPlF
LOOP 1
Loop to previous instruction if not done
$0C
Load contents of SPI data reg into ACC
$0C
Start next cycle
$60
Store MSBs in $60
$0B
Test status of SPlF
LOOP 2
Loop to previous instruction if not done
0, $02
CS goes high
$0C
Load contents of SPI data reg into ACC
$61
Store LSBs in $61
Return
$73
Load MSBs of +/– read into ACC
$74
Or ACC (MSBs) with LSBs of +/– read
MINUS
If result is 0 goto minus
Clear carry
$73
Rotate right $73 through carry
$74
Rotate right $74 through carry
$73
Load MSBs of +/– read into ACC
$77
Store MSBs in RAM location $77
$74
Load LSBs of +/– read into ACC
$87
Store LSBs in RAM location $87
END
Goto end of routine
Clear carry
$71
Shift MSBs of – /+ read right
$72
Shift LSBs of – /+ read right
$71
1’s complement of MSBs
$72
1’s complement of LSBs
$72
Load LSBs into ACC
#$01
Add 1 to LSBs
$72
Store ACC in $72
Clear ACC
$71
Add with carry to MSBs. Result in ACC
$71
Store ACC in $71
$77
Store MSBs in RAM location $77
$72
Load LSBs in ACC
$87
Store LSBs in RAM location $87
Return
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24
LTC1090
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PACKAGE DESCRIPTIO
J Package
20-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110)
1.060
(26.924)
MAX
CORNER LEADS OPTION
(4 PLCS)
20
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
19
18
17
16
15
14
13
12
11
2
3
4
5
6
7
8
9
10
0.220 – 0.310 0.025
(5.588 – 7.874) (0.635)
RAD TYP
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
1
0.005
(0.127)
MIN
0.300 BSC
(0.762 BSC)
0.200
(5.080)
MAX
0.015 – 0.060
(0.381 – 1.524)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.125
(3.175)
MIN
0.045 – 0.065
(1.143 – 1.651)
0.014 – 0.026
(0.356 – 0.660)
0.100
(2.54)
BSC
J20 1298
OBSOLETE PACKAGE
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25
LTC1090
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PACKAGE DESCRIPTIO
N Package
20-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
1.040*
(26.416)
MAX
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
0.255 ± 0.015*
(6.477 ± 0.381)
0.130 ± 0.005
(3.302 ± 0.127)
0.300 – 0.325
(7.620 – 8.255)
0.009 – 0.015
(0.229 – 0.381)
(
+0.035
0.325 –0.015
+0.889
8.255
–0.381
)
0.045 – 0.065
(1.143 – 1.651)
0.020
(0.508)
MIN
0.065
(1.651)
TYP
0.125
(3.175)
MIN
0.005
(0.127)
MIN
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.100
(2.54)
BSC
0.018 ± 0.003
(0.457 ± 0.076)
N20 1098
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26
LTC1090
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PACKAGE DESCRIPTIO
SW Package
20-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
0.496 – 0.512*
(12.598 – 13.005)
20
19
18
17
16
15
14
13
12
11
0.394 – 0.419
(10.007 – 10.643)
NOTE 1
0.291 – 0.299**
(7.391 – 7.595)
0.010 – 0.029 × 45°
(0.254 – 0.737)
1
2
3
4
5
6
7
8
9
0.093 – 0.104
(2.362 – 2.642)
10
0.037 – 0.045
(0.940 – 1.143)
0° – 8° TYP
0.009 – 0.013
(0.229 – 0.330)
NOTE 1
0.016 – 0.050
(0.406 – 1.270)
0.050
(1.270)
BSC
0.014 – 0.019
(0.356 – 0.482)
TYP
0.004 – 0.012
(0.102 – 0.305)
S20 (WIDE) 1098
NOTE:
1. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
1090fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
27
LTC1090
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC1290
8-Channel Configurable, 5V, 12-Bit ADC
Pin-Compatible with LTC1090
LTC1391
Serial-Controlled 8-to-1 Analog Multiplexer
Low RON, Low Power, 16-Pin SO and SSOP Package
LTC1594L/LTC1598L
4-/8-Channel, 3V Micropower 12-Bit ADC
Low Power, Small Size
LTC1850/LTC1851
10-Bit/12-Bit, 8-Channel, 1.25Msps ADCs
5V, Programmable MUX and Sequencer
LTC1852/LTC1853
10-Bit/12-Bit, 8-Channel, 400ksps ADCs
3V or 5V, Programmable MUX and Sequencer
LTC2404/LTC2408
24-Bit, 4-/8-Channel, No Latency ∆ΣTM ADC
4ppm INL, 10ppm Total Unadjusted Error, 200µA
LTC2424/LTC2428
20-Bit, 4-/8-Channel, No Latency ∆Σ ADC
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2404/LTC2408
No Latency ∆Σ is a trademark of Linear Technology Corporation.
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28
Linear Technology Corporation
LW/TP 0902 1K REV C • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
LINEAR TECHNOLOGY CORPORATION 1990