LTC2226HLX#PBF

LTC2226H 12-Bit, 25Msps 125°C ADC in LQFP FEATURES DESCRIPTION Sample Rate: 25Msps –40°C to 125°C Operation Single 3V Supply (2.8V to 3.5V) Low Power: 75mW 71.4dB SNR 90dB SFDR No Missing Codes Flexible Input: 1VP-P to 2VP-P Range 575MHz Full Power Bandwidth S/H Clock Duty Cycle Stabilizer Shutdown and Nap Modes Pin Compatible Family n LTC2246H (14-Bit), LTC2226H (12-Bit) n 48-Pin (7mm × 7mm) LQFP Package The LTC®2226H is a 12-bit 25Msps, low power 3V A/D converter designed for digitizing high frequency, wide dynamic range signals. The LTC2226H is perfect for demanding imaging and communications applications with AC performance that includes 71.4dB SNR and 90dB SFDR. n n n n n n n n n n n n DC specs include ±0.3LSB INL (typ), ±0.3LSB DNL (typ) and no missing codes over temperature. The transition noise is a low 0.25LSBRMS. A single 3V supply allows low power operation. A separate output supply allows the outputs to drive 0.5V to 3.6V logic. APPLICATIONS Automotive Industrial n Wireless and Wired Broadband Communication n n A single-ended CLK input controls converter operation. An optional clock duty cycle stabilizer allows high performance at full speed for a wide range of clock duty cycles. L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATION Typical INL, 2V Range 1.00 REFL FLEXIBLE REFERENCE 0.75 OVDD ANALOG INPUT + – INPUT S/H 12-BIT PIPELINED ADC CORE CORRECTION LOGIC D11 • • • D0 OUTPUT DRIVERS OGND 0.50 INL ERROR (LSB) REFH 0.25 0 –0.25 –0.50 –0.75 CLOCK/DUTY CYCLE CONTROL CLK –1.00 2226 TA01 0 1024 2048 CODE 3072 4096 2226 TA01b 2226hfc 1 LTC2226H PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS OVDD = VDD (Notes 1, 2) 48 47 46 45 44 43 42 41 40 39 38 37 GND VDD VDD VCM VCM SENSE MODE OF D11 D10 D9 GND TOP VIEW GND 1 AIN+ 2 AIN– 3 GND 4 REFH 5 REFH 6 REFL 7 REFL 8 GND 9 VDD 10 VDD 11 VDD 12 36 35 34 33 32 31 30 29 28 27 26 25 GND D8 D7 D6 GND OVDD OGND GND D5 D4 D3 GND GND 13 CLK 14 GND 15 SHDN 16 OE 17 GND 18 NC 19 NC 20 D0 21 D1 22 D2 23 GND 24 Supply Voltage (VDD)...................................................4V Digital Output Ground Voltage (OGND)......... –0.3V to 1V Analog Input Voltage (Note 3)........–0.3V to (VDD + 0.3V) Digital Input Voltage.......................–0.3V to (VDD + 0.3V) Digital Output Voltage................. –0.3V to (OVDD + 0.3V) Power Dissipation..............................................1500mW Operating Temperature Range................ –40°C to 125°C Storage Temperature Range.................... –65°C to 150°C LX PACKAGE 48-LEAD (7mm × 7mm) PLASTIC LQFP TJMAX = 150°C, θJA = 53°C/W ORDER INFORMATION LEAD FREE FINISH PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2226HLX#PBF LTC2226LX 48-Lead (7mm × 7mm) Plastic LQFP –40°C to 125°C LEAD BASED FINISH PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2226HLX LTC2226LX 48-Lead (7mm × 7mm) Plastic LQFP –40°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ CONVERTER CHARACTERISTICS l denotes the specifications which apply over the full operating The temperature range, otherwise specifications are at TA = 25°C. (Note 4) PARAMETER CONDITIONS MIN TYP MAX UNITS l 12 Integral Linearity Error Differential Analog Input (Note 5) l –1.5 ±0.3 1.5 LSB Differential Linearity Error Differential Analog Input l –0.8 ±0.15 0.8 LSB Offset Error (Note 6) l –15 ±2 15 mV Gain Error External Reference l –3 ±0.5 3 %FS Resolution (No Missing Codes) Offset Drift Full-Scale Drift Transition Noise Bits ±10 µV/°C Internal Reference ±30 ppm/°C External Reference ±5 ppm/°C 0.25 LSBRMS SENSE = 1V 2226hfc 2 LTC2226H ANALOG INPUT l denotes the specifications which apply over the full operating temperature range, otherwise The specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS VIN Analog Input Range (AIN+ – AIN–) MIN 2.8V < VDD < 3.5V (Note 7) l VIN, CM Analog Input Common Mode (AIN+ + AIN–)/2 Differential Input (Note 7) Single Ended Input (Note 7) l l 1 0.5 IIN Analog Input Leakage Current 0V < AIN+, AIN– < VDD l ISENSE SENSE Input Leakage 0V < SENSE < 1V l IMODE MODE Pin Leakage l TYP MAX UNITS ±0.5V to ±1V 1.5 1.5 V 1.9 2 V V –10 10 µA –10 10 µA –10 10 µA tAP Sample-and-Hold Acquisition Delay Time tJITTER Sample-and-Hold Acquisition Delay Time Jitter 0.2 0 psRMS ns CMRR Analog Input Common Mode Rejection Ratio 80 dB DYNAMIC ACCURACY l denotes the specifications which apply over the full operating temperature range, The otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4) SYMBOL PARAMETER CONDITIONS SNR Signal-to-Noise Ratio 5MHz Input 12.5MHz Input 70MHz Input Spurious Free Dynamic Range 2nd or 3rd Harmonic SFDR SFDR S/(N+D) IMD MIN TYP l 69.6 71.4 71.2 70.9 dB dB dB 5MHz Input 12.5MHz Input 70MHz Input l 74 90 90 85 dB dB dB Spurious Free Dynamic Range 4th Harmonic or Higher 5MHz Input 12.5MHz Input 70MHz Input l 78 90 90 90 dB dB dB Signal-to-Noise Plus Distortion Ratio 5MHz Input 12.5MHz Input 70MHz Input l 69.1 71.4 71.2 70.8 dB dB dB 90 dB Intermodulation Distortion fIN1 = 4.3MHz, fIN2 = 4.6MHz MAX UNITS INTERNAL REFERENCE CHARACTERISTICS A = 25°C. (Note 4) T PARAMETER CONDITIONS MIN TYP MAX UNITS VCM Output Voltage IOUT = 0 1.475 1.500 1.525 V VCM Output Tempco ±25 ppm/°C VCM Line Regulation 2.8V < VDD < 3.5V 3 mV/V VCM Output Regulation –1mA < IOUT < 1mA 4 W DIGITAL INPUTS AND DIGITAL OUTPUTS l denotes the specifications which apply over the full The operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS LOGIC INPUTS (CLK, OE, SHDN) VIH High Level Input Voltage VDD = 3V l VIL Low Level Input Voltage VDD = 3V l IIN Input Current VIN = 0V to VDD l CIN Input Capacitance (Note 7) 2 V –10 3 0.8 V 10 µA pF 2226hfc 3 LTC2226H DIGITAL INPUTS AND DIGITAL OUTPUTS l denotes the specifications which apply over the full The operating temperature range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS LOGIC OUTPUTS OVDD = 3V COZ Hi-Z Output Capacitance OE = High (Note 7) 3 pF ISOURCE Output Source Current VOUT = 0V 50 mA ISINK Output Sink Current VOUT = 3V 50 mA VOH High Level Output Voltage IO = –10µA IO = –200µA l IO = 10µA IO = 1.6mA l VOL Low Level Output Voltage 2.7 2.995 2.99 0.005 0.09 V V V V 0.4 OVDD = 2.5V VOH High Level Output Voltage IO = –200µA 2.49 V VOL Low Level Output Voltage IO = 1.6mA 0.09 V VOH High Level Output Voltage IO = –200µA 1.79 V VOL Low Level Output Voltage IO = 1.6mA 0.09 V OVDD = 1.8V POWER REQUIREMENTS l denotes the specifications which apply over the full operating temperature The range, otherwise specifications are at TA = 25°C. (Note 8) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VDD Analog Supply Voltage (Note 9) l 2.8 3 3.5 V OVDD Output Supply Voltage (Note 9) l 0.5 3 3.6 V IVDD Supply Current l 25 30 mA l PDISS Power Dissipation PSHDN Shutdown Power SHDN = H, OE = H, No CLK 75 2 90 mW PNAP Nap Mode Power SHDN = H, OE = L, No CLK 15 mW mW TIMING CHARACTERISTICS l denotes the specifications which apply over the full operating temperature The range, otherwise specifications are at TA = 25°C. (Note 4) SYMBOL PARAMETER CONDITIONS fS Sampling Frequency (Note 9) l 1 tL CLK Low Time Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 7) l l 18.9 5 tH CLK High Time Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 7) l l tAP Sample-and-Hold Aperture Delay tD CLK to DATA Delay CL = 5pF (Note 7) l Data Access Time After OE↓ CL = 5pF (Note 7) BUS Relinquish Time (Note 7) Pipeline Latency MIN TYP MAX UNITS 25 MHz 20 20 500 500 ns ns 18.9 5 20 20 500 500 ns ns 1.4 2.7 6 ns l 4.3 12 ns l 3.3 10 ns 0 5 ns Cycles 2226hfc 4 LTC2226H ELECTRICAL CHARACTERISTICS Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to ground with GND and OGND wired together (unless otherwise noted). Note 3: When these pin voltages are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup. Note 4: VDD = 3V, fSAMPLE = 25MHz, input range = 2VP-P with differential drive, unless otherwise noted. Note 5: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. Note 6: Offset error is the offset voltage measured from –0.5 LSB when the output code flickers between 0000 0000 0000 and 1111 1111 1111. Note 7: Guaranteed by design, not subject to test. Note 8: VDD = 3V, fSAMPLE = 25MHz, input range = 1VP-P with differential drive. Note 9: Recommended operating conditions. TYPICAL PERFORMANCE CHARACTERISTICS Typical INL, 2V Range, 25Msps 0 1.00 0.75 0.50 0.50 0.25 0 –0.25 –0.50 –10 –20 –30 AMPLITUDE (dB) 0.75 DNL ERROR (LSB) INL ERROR (LSB) 1.00 0.25 0 –0.25 –0.50 –0.75 –0.75 –1.00 –1.00 1024 0 2048 CODE 3072 4096 –40 –50 –60 –70 –80 –90 –100 –110 1024 0 2048 CODE 3072 2226H G01 –120 4096 0 –10 –20 –20 –20 –30 –30 –30 –40 –40 –40 –80 AMPLITUDE (dB) 0 –10 AMPLITUDE (dB) 0 –70 –50 –60 –70 –80 –60 –70 –80 –90 –90 –100 –100 –100 –110 –110 –110 –120 –120 2 4 6 8 FREQUENCY (MHz) 10 12 2226H G04 0 2 4 6 8 FREQUENCY (MHz) 10 12 10 –50 –90 0 4 6 8 FREQUENCY (MHz) 8192 Point FFT, fIN = 140MHz, –1dB, 2V Range, 25Msps –10 –60 2 2226H G03 8192 Point FFT, fIN = 70MHz, –1dB, 2V Range, 25Msps –50 0 2226H G02 8192 Point FFT, fIN = 30MHz, –1dB, 2V Range, 25Msps AMPLITUDE (dB) 8192 Point FFT, fIN = 5MHz, –1dB, 2V Range, 25Msps Typical DNL, 2V Range, 25Msps 12 2226H G05 –120 0 2 4 6 8 FREQUENCY (MHz) 10 12 2226H G06 2226hfc 5 LTC2226H TYPICAL PERFORMANCE CHARACTERISTICS 8192 Point 2-Tone FFT, fIN = 10.9MHz and 13.8MHz, –1dB, 2V Range, 25Msps Grounded Input Histogram, 25Msps 0 72 70000 61758 –10 60000 –20 –30 –60 –70 –80 SNR (dBFS) COUNT –50 40000 30000 20000 –90 –100 69 10000 –110 0 2 4 6 8 FREQUENCY (MHz) 2155 0 12 10 2048 1607 2049 CODE 110 95 80 85 80 75 90 80 SNR 70 70 dBFS 70 SFDR 100 SNR AND SFDR (dBFS) SFDR (dBFS) SNR vs Input Level, fIN = 5MHz, 2V Range, –1dB SNR (dBc AND dBFS) 100 200 2226H G09 SNR and SFDR vs Sample Rate, 2V Range, fIN = 5MHz, –1dB 90 100 150 50 INPUT FREQUENCY (MHz) 0 2226H G08 SFDR vs Input Frequency, –1dB, 2V Range, 25Msps 60 50 dBc 40 30 20 10 50 100 60 200 150 INPUT FREQUENCY (MHz) 0 10 0 30 40 20 SAMPLE RATE (Msps) 2226H G10 0 –60 50 –50 –40 –30 –20 INPUT LEVEL (dBFS) IVDD vs Sample Rate, 5MHz Sine Wave Input, –1dB 120 –10 0 2227H G12 2226H G11 SFDR vs Input Level, fIN = 5MHz, 2V Range, 25Msps 35 3 IOVDD vs Sample Rate, 5MHz Sine Wave Input, –1dB, OVDD = 1.8V dBFS 110 100 30 90 2 2V RANGE 80 IVDD (mA) SFDR (dBc AND dBFS) 68 2050 2226H G07 65 70 dBc 70 60 90dBc SFDR REFERENCE LINE 50 IOVDD (mA) AMPLITUDE (dB) 71 50000 –40 –120 SNR vs Input Frequency, –1dB, 2V Range, 25Msps 25 1V RANGE 1 20 40 30 20 –60 –50 –40 –30 –20 INPUT LEVEL (dBFS) –10 0 2226H G13 15 0 5 10 15 20 25 SAMPLE RATE (Msps) 30 35 2226 G14 0 0 5 10 15 25 20 SAMPLE RATE (Msps) 30 35 2226H G15 2226hfc 6 LTC2226H PIN FUNCTIONS GND (Pins 1, 4, 9, 13, 15, 18, 24, 25, 29, 32, 36, 37, 48): ADC Power Ground. OE (Pin 17): Output Enable Pin. Refer to SHDN pin function. AIN+ (Pin 2): Positive Differential Analog Input. NC (Pins 19, 20): Do not connect these pins. AIN- (Pin 3): Negative Differential Analog Input. D0–D11 (Pins 21-23, 26-28, 33-35, 38-40): Digital Outputs. D11 is the MSB. REFH (Pins 5, 6): ADC High Reference. Bypass to Pins 7, 8 with a 0.1µF ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 7, 8 with an additional 2.2µF ceramic chip capacitor and to GND with a 1µF ceramic chip capacitor. REFL (Pin 7, 8): ADC Low Reference. Bypass to Pins 5, 6 with a 0.1µF ceramic chip capacitor as close to the pin as possible. Also bypass to Pin 5, 6 with an additional 2.2µF ceramic chip capacitor and to ground with a 1µF ceramic chip capacitor. VDD (Pins 10, 11, 12, 46, 47): 3V Supply. Bypass to GND with 0.1µF ceramic chip capacitors. CLK (Pin 14): Clock Input. The input sample starts on the positive edge. SHDN (Pin 16): Shutdown Mode Selection Pin. Connecting SHDN to GND and OE to GND results in normal operation with the outputs enabled. Connecting SHDN to GND and OE to VDD results in normal operation with the outputs at high impedance. Connecting SHDN to VDD and OE to GND results in nap mode with the outputs at high impedance. Connecting SHDN to VDD and OE to VDD results in sleep mode with the outputs at high impedance. If the clock duty cycle stabilizer is used, a >1µs high pulse should be applied to the SHDN pin once the power supplies are stable at power up. OGND (Pin 30): Output Driver Ground. OVDD (Pin 31): Positive Supply for the Output Drivers. Bypass to ground with 0.1µF ceramic chip capacitor. OF (Pin 41): Over/Under Flow Output. High when an over or under flow has occurred. MODE (Pin 42): Output Format and Clock Duty Cycle Stabilizer Selection Pin. Connecting MODE to GND selects offset binary output format and turns the clock duty cycle stabilizer off. 1/3 VDD selects offset binary output format and turns the clock duty cycle stabilizer on. 2/3 VDD selects 2’s complement output format and turns the clock duty cycle stabilizer on. VDD selects 2’s complement output format and turns the clock duty cycle stabilizer off. SENSE (Pin 43): Reference Programming Pin. Connecting SENSE to VCM selects the internal reference and a ±0.5V input range. VDD selects the internal reference and a ±1V input range. An external reference greater than 0.5V and less than 1V applied to SENSE selects an input range of ±VSENSE. ±1V is the largest valid input range. VCM (Pins 44, 45): 1.5V Output and Input Common Mode Bias. Bypass to ground with 2.2µF ceramic chip capacitor. 2226hfc 7 LTC2226H FUNCTIONAL BLOCK DIAGRAM AIN+ AIN– VCM 2.2µF INPUT S/H FIRST PIPELINED ADC STAGE SECOND PIPELINED ADC STAGE THIRD PIPELINED ADC STAGE FOURTH PIPELINED ADC STAGE FIFTH PIPELINED ADC STAGE SIXTH PIPELINED ADC STAGE 1.5V REFERENCE SHIFT REGISTER AND CORRECTION RANGE SELECT REFH SENSE REFL INTERNAL CLOCK SIGNALS OVDD REF BUF OF D11 CLOCK/DUTY CYCLE CONTROL DIFF REF AMP REFH 0.1µF CONTROL LOGIC OUTPUT DRIVERS REFL OGND MODE CLK SHDN • • • D0 2226H F01 OE 2.2µF 1µF 1µF Figure 1. Functional Block Diagram TIMING DIAGRAM tAP ANALOG INPUT N+4 N+2 N N+3 tH tL N+5 N+1 CLK tD D0-D11, OF N–5 N–4 N–3 N–2 N–1 N 2226H TD01 2226hfc 8 LTC2226H APPLICATIONS INFORMATION DYNAMIC PERFORMANCE is defined as the ratio of the RMS value of either input tone to the RMS value of the largest 3rd order intermodulation product. Signal-to-Noise Plus Distortion Ratio The signal-to-noise plus distortion ratio [S/(N + D)] is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the ADC output. The output is band limited to frequencies above DC to below half the sampling frequency. Spurious Free Dynamic Range (SFDR) Spurious free dynamic range is the peak harmonic or spurious noise that is the largest spectral component excluding the input signal and DC. This value is expressed in decibels relative to the RMS value of a full scale input signal. Signal-to-Noise Ratio Input Bandwidth The signal-to-noise ratio (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components except the first five harmonics and DC. The input bandwidth is that input frequency at which the amplitude of the reconstructed fundamental is reduced by 3dB for a full scale input signal. Total Harmonic Distortion Total harmonic distortion is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is expressed as: THD = 20Log ( ( V2 + V3 + V4 + ...Vn )/ V1) 2 2 2 2 where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the second through nth harmonics. The THD calculated in this data sheet uses all the harmonics up to the fifth. Intermodulation Distortion If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency. If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc. The 3rd order intermodulation products are 2fa + fb, 2fb + fa, 2fa – fb and 2fb – fa. The intermodulation distortion Aperture Delay Time The time from when CLK reaches mid-supply to the instant that the input signal is held by the sample and hold circuit. Aperture Delay Jitter The variation in the aperture delay time from conversion to conversion. This random variation will result in noise when sampling an AC input. The signal to noise ratio due to the jitter alone will be: SNRJITTER = –20log (2π • fIN • tJITTER) CONVERTER OPERATION As shown in Figure 1, the LTC2226H is a CMOS pipelined multistep converter. The converter has six pipelined ADC stages; a sampled analog input will result in a digitized value five cycles later (see the Timing Diagram section). For optimal AC performance the analog inputs should be driven differentially. For cost sensitive applications, the analog inputs can be driven single-ended with slightly worse harmonic distortion. The CLK input is single-ended. The LTC2226H has two phases of operation, determined by the state of the CLK input pin. Each pipelined stage shown in Figure 1 contains an ADC, a reconstruction DAC and an interstage residue amplifier. In operation, the ADC quantizes the input to the stage and the quantized value is subtracted from the input by the 2226hfc 9 LTC2226H APPLICATIONS INFORMATION DAC to produce a residue. The residue is amplified and output by the residue amplifier. Successive stages operate out of phase so that when the odd stages are outputting their residue, the even stages are acquiring that residue and vice versa. When CLK is low, the analog input is sampled differentially directly onto the input sample-and-hold capacitors, inside the “Input S/H” shown in the block diagram. At the instant that CLK transitions from low to high, the sampled input is held. While CLK is high, the held input voltage is buffered by the S/H amplifier which drives the first pipelined ADC stage. The first stage acquires the output of the S/H during this high phase of CLK. When CLK goes back low, the first stage produces its residue which is acquired by the second stage. At the same time, the input S/H goes back to acquiring the analog input. When CLK goes back high, the second stage produces its residue which is acquired by the third stage. An identical process is repeated for the third, fourth and fifth stages, resulting in a fifth stage residue that is sent to the sixth stage ADC for final evaluation. Each ADC stage following the first has additional range to accommodate flash and amplifier offset errors. Results from all of the ADC stages are digitally synchronized such that the results can be properly combined in the correction logic before being sent to the output buffer. SAMPLE/HOLD OPERATION AND INPUT DRIVE Sample/Hold Operation Figure 2 shows an equivalent circuit for the LTC2226H CMOS differential sample-and-hold. The analog inputs are connected to the sampling capacitors (CSAMPLE) through NMOS transistors. The capacitors shown attached to each input (CPARASITIC) are the summation of all other capacitance associated with each input. During the sample phase when CLK is low, the transistors connect the analog inputs to the sampling capacitors and they charge to and track the differential input voltage. When CLK transitions from low to high, the sampled input voltage is held on the sampling capacitors. During the hold phase when CLK is high, the sampling capacitors are disconnected from the input and the held voltage is passed to the ADC core for processing. As CLK transitions from high to low, 10 LTC2226H VDD AIN+ CSAMPLE 4pF 15Ω VDD AIN– CPARASITIC 1pF CSAMPLE 4pF 15Ω CPARASITIC 1pF CLK 2226H F02 Figure 2. Equivalent Input Circuit the inputs are reconnected to the sampling capacitors to acquire a new sample. Since the sampling capacitors still hold the previous sample, a charging glitch proportional to the change in voltage between samples will be seen at this time. If the change between the last sample and the new sample is small, the charging glitch seen at the input will be small. If the input change is large, such as the change seen with input frequencies near Nyquist, then a larger charging glitch will be seen. Single-Ended Input For cost sensitive applications, the analog inputs can be driven single-ended. With a single-ended input the harmonic distortion and INL will degrade, but the SNR and DNL will remain unchanged. For a single-ended input, AIN+ should be driven with the input signal and AIN– should be connected to VCM or a low noise reference voltage between 1V and 1.5V. Common Mode Bias For optimal performance the analog inputs should be driven differentially. Each input should swing ±0.5V for the 2V range or ±0.25V for the 1V range, around a common mode voltage of 1.5V. The VCM output pin (Pins 44, 45) may be used to provide the common mode bias level. VCM can be tied directly to the center tap of a transformer to set the DC input level or as a reference level to an op amp differential driver circuit. The VCM pins must be bypassed to ground close to the ADC with a 2.2µF or greater capacitor. 2226hfc LTC2226H APPLICATIONS INFORMATION Input Drive Impedance As with all high performance, high speed ADCs, the dynamic performance of the LTC2226H can be influenced by the input drive circuitry, particularly the second and third harmonics. Source impedance and reactance can influence SFDR. At the falling edge of CLK, the sample-and-hold circuit will connect the 4pF sampling capacitor to the input pin and start the sampling period. The sampling period ends when CLK rises, holding the sampled input on the sampling capacitor. Ideally the input circuitry should be fast enough to fully charge the sampling capacitor during the sampling period 1/(2FENCODE); however, this is not always possible and the incomplete settling may degrade the SFDR. The sampling glitch has been designed to be as linear as possible to minimize the effects of incomplete settling. For the best performance, it is recommended to have a source impedance of 100W or less for each input. The source impedance should be matched for the differential inputs. Poor matching will result in higher even order harmonics, especially the second. hold. Figure 3 shows a 1:1 turns ratio transformer. Other turns ratios can be used if the source impedance seen by the ADC does not exceed 100W for each ADC input. A disadvantage of using a transformer is the loss of low frequency response. Most small RF transformers have poor performance at frequencies below 1MHz. Figure 4 demonstrates the use of a differential amplifier to convert a single ended input signal into a differential input signal. The advantage of this method is that it provides low frequency input response; however, the limited gain bandwidth of most op amps will limit the SFDR at high input frequencies. Figure 5 shows a single-ended input circuit. The impedance seen by the analog inputs should be matched. This circuit is not recommended if low distortion is required. The 25Ω resistors and 12pF capacitor on the analog inputs serve two purposes: isolating the drive circuitry from the sample-and-hold charging glitches and limiting the wideband noise at the converter input. VCM Input Drive Circuits Figure 3 shows the LTC2226H being driven by an RF transformer with a center tapped secondary. The secondary center tap is DC biased with VCM, setting the ADC input signal at its optimum DC level. Terminating on the transformer secondary is desirable, as this provides a common mode path for charging glitches caused by the sample and HIGH SPEED DIFFERENTIAL 25Ω AMPLIFIER ANALOG INPUT + CM – 2.2µF AIN+ LTC2226H + 12pF – 25Ω AIN– 2226H F04 Figure 4. Differential Drive with an Amplifier VCM VCM 2.2µF 0.1µF ANALOG INPUT T1 1:1 25Ω 25Ω AIN+ LTC2226H 0.1µF 0.1µF ANALOG INPUT 1k 1k 2.2µF AIN+ 25Ω LTC2226H 12pF 25Ω 25Ω T1 = MA/COM ETC1-1T RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE 12pF AIN– 25Ω AIN– 2226H F03 Figure 3. Single-Ended to Differential Conversion Using a Transformer 0.1µF 2226H F05 Figure 5. Single-Ended Drive 2226hfc 11 LTC2226H APPLICATIONS INFORMATION Reference Operation Figure 6  shows the LTC2226H reference circuitry consisting of a 1.5V bandgap reference, a difference amplifier and switching and control circuit. The internal voltage reference can be configured for two pin selectable input ranges of 2V (±1V differential) or 1V (±0.5V differential). Tying the SENSE pin to VDD selects the 2V range; tying the SENSE pin to VCM selects the 1V range. The 1.5V bandgap reference serves two functions: its output provides a DC bias point for setting the common mode voltage of any external input circuitry; additionally, the reference is used with a difference amplifier to generate the differential reference levels needed by the internal ADC circuitry. An external bypass capacitor is required for the 1.5V reference output, VCM. This provides a high frequency low impedance path to ground for internal and external circuitry. The difference amplifier generates the high and low reference for the ADC. High speed switching circuits are connected to these outputs and they must be externally bypassed. Other voltage ranges in-between the pin selectable ranges can be programmed with two external resistors as shown in Figure 7. An external reference can be used by applying its output directly or through a resistor divider to SENSE. It is not recommended to drive the SENSE pin with a logic device. The SENSE pin should be tied to the appropriate level as close to the converter as possible. If the SENSE pin is driven externally, it should be bypassed to ground as close to the device as possible with a 1µF ceramic capacitor. 1.5V LTC2226H 1.5V VCM 4Ω 2.2µF 12k 1.5V BANDGAP REFERENCE 1V TIE TO VDD FOR 2V RANGE; TIE TO VCM FOR 1V RANGE; RANGE = 2 • VSENSE FOR 0.5V < VSENSE < 1V 1µF 0.75V 12k 0.5V RANGE DETECT AND CONTROL VCM 2.2µF LTC2226H SENSE 1µF 2226H F07 Figure 7. 1.5V Range ADC SENSE CLEAN SUPPLY BUFFER 4.7µF INTERNAL ADC HIGH REFERENCE FERRITE BEAD REFH 0.1µF 2.2µF 1µF 0.1µF DIFF AMP CLK 100Ω LTC2226H REFL INTERNAL ADC LOW REFERENCE 2226H F08 2226H F06 Figure 6. Equivalent Reference Circuit IF LVDS USE FIN1002 OR FIN1018. FOR PECL, USE AZ1000ELT21 OR SIMILAR Figure 8. CLK Drive Using an LVDS or PECL to CMOS Converter 2226hfc 12 LTC2226H APPLICATIONS INFORMATION Input Range The input range can be set based on the application. The 2V input range will provide the best signal-to-noise performance while maintaining excellent SFDR. The 1V input range will have better SFDR performance, but the SNR will degrade by 3.8dB. Driving the Clock Input The CLK input can be driven directly with a CMOS or TTL level signal. A differential clock can also be used along with a low-jitter CMOS converter before the CLK pin (see Figure 8). The noise performance of the LTC2226H can depend on the clock signal quality as much as on the analog input. Any noise present on the clock signal will result in additional aperture jitter that will be RMS summed with the inherent ADC aperture jitter. Maximum and Minimum Conversion Rates The maximum conversion rate for the LTC2226H is 25Msps. For the ADC to operate properly, the CLK signal should have a 50% (±5%) duty cycle. Each half cycle must have at least 18.9ns for the ADC internal circuitry to have enough settling time for proper operation. An optional clock duty cycle stabilizer circuit can be used if the input clock has a non 50% duty cycle. This circuit uses the rising edge of the CLK pin to sample the analog input. The falling edge of CLK is ignored and the internal falling edge is generated by a phase-locked loop. The input clock duty cycle can vary and the clock duty cycle stabilizer will maintain a constant 50% internal duty cycle. If the clock is turned off for a long period of time, the duty cycle stabilizer circuit will require a hundred clock cycles for the PLL to lock onto the input clock. To use the clock duty cycle stabilizer, the MODE pin should be connected to 1/3VDD or 2/3VDD using external resistors. If the clock duty cycle stabilizer is used, a >1µs high pulse should be applied to the SHDN pin once the power supplies are stable at power up. The lower limit of the LTC2226H sample rate is determined by droop of the sample-and-hold circuits. The pipelined architecture of this ADC relies on storing analog signals on small valued capacitors. Junction leakage will discharge the capacitors. The specified minimum operating frequency for the LTC2226H is 1Msps. DIGITAL OUTPUTS Table 1 shows the relationship between the analog input voltage, the digital data bits, and the overflow bit. Digital Output Buffers Table 1. Output Codes vs Input Voltage AIN+ – AIN– (2V Range) OF D11 – D0 (Offset Binary) D11 – D0 (2’s Complement) >+1.000000V +0.999512V +0.999024V 1 0 0 11 11 1111 1111 11 11 1111 1111 11 11 1111 1110 0111 1111 1111 0111 1111 1111 0111 1111 1110 +0.000488V 0.000000V –0.000488V –0.000976V 0 0 0 0 10 00 0000 0001 10 00 0000 0000 01 11 1111 1111 01 11 1111 1110 00 00 0000 0001 00 00 0000 0000 11 11 1111 1111 11 11 1111 1110 –0.999512V –1.000000V