LTC2246H
14-Bit, 25Msps
125°C ADC In LQFP
FEATURES
DESCRIPTION
n
The LTC®2246H is a 14-bit 25Msps, low power 3V A/D
converter designed for digitizing high frequency, wide
dynamic range signals. The LTC2246H is perfect for
demanding imaging and communications applications
with AC performance that includes 74.5dB SNR and 90dB
SFDR.
n
n
n
n
n
n
n
n
n
n
n
n
Sample Rate: 25Msps
–40°C to 125°C Operation
Single 3V Supply (2.8V to 3.5V)
Low Power: 75mW
74.5dB SNR
90dB SFDR
No Missing Codes
Flexible Input: 1VP-P to 2VP-P Range
575MHz Full Power Bandwidth S/H
Clock Duty Cycle Stabilizer
Shutdown and Nap Modes
Pin Compatible Family
LTC2246H (14-Bit), LTC2226H (12-Bit)
48-Pin (7mm × 7mm) LQFP Package
DC specs include ±1LSB INL (typ), ±0.5LSB DNL (typ)
and no missing codes over temperature. The transition
noise is a low 1LSBRMS.
A single 3V supply allows low power operation. A separate
output supply allows the outputs to drive 0.5V to 3.6V
logic.
A single-ended CLK input controls converter operation. An
optional clock duty cycle stabilizer allows high performance
at full speed for a wide range of clock duty cycles.
APPLICATIONS
n
n
n
Automotive
Industrial
Wireless and Wired Broadband Communication
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
Typical INL, 2V Range
REFH
REFL
2.0
FLEXIBLE
REFERENCE
1.5
OVDD
INPUT
S/H
–
14-BIT
PIPELINED
ADC CORE
CORRECTION
LOGIC
D13
•
•
•
D0
OUTPUT
DRIVERS
OGND
0.5
0
–0.5
–1.0
–1.5
CLOCK/DUTY
CYCLE
CONTROL
–2.0
0
2246H TA01
CLK
INL ERROR (LSB)
+
ANALOG
INPUT
1.0
4096
8192
CODE
12288
16384
2246H TA01b
2246hfb
1
LTC2246H
ABSOLUTE MAXIMUM RATINGS
PACKAGE/ORDER INFORMATION
OVDD = VDD (Notes 1, 2)
48
47
46
45
44
43
42
41
40
39
38
37
GND
VDD
VDD
VCM
VCM
SENSE
MODE
OF
D13
D12
D11
GND
TOP VIEW
GND 1
AIN+ 2
AIN– 3
GND 4
REFH 5
REFH 6
REFL 7
REFL 8
GND 9
VDD 10
VDD 11
VDD 12
36
35
34
33
32
31
30
29
28
27
26
25
GND
D10
D9
D8
GND
OVDD
OGND
GND
D7
D6
D5
GND
GND 13
CLK 14
GND 15
SHDN 16
OE 17
GND 18
D0 19
D1 20
D2 21
D3 22
D4 23
GND 24
Supply Voltage (VDD) ..................................................4V
Digital Output Ground Voltage (OGND) ........ –0.3V to 1V
Analog Input Voltage (Note 3) .......–0.3V to (VDD + 0.3V)
Digital Input Voltage......................–0.3V to (VDD + 0.3V)
Digital Output Voltage ................ –0.3V to (OVDD + 0.3V)
Power Dissipation .............................................1500mW
Operating Temperature Range................ –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
LX PACKAGE
48-LEAD (7mm s 7mm) PLASTIC LQFP
TJMAX = 150°C, θJA = 53°C/W
ORDER INFORMATION
LEAD FREE FINISH
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2246HLX#PBF
LTC2246LX
48-Lead (7mm × 7mm) Plastic LQFP
–40°C to 125°C
LEAD BASED FINISH
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2246HLX
LTC2246LX
48-Lead (7mm × 7mm) Plastic LQFP
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
This product is only offered in trays. For more information go to: http://www.linear.com/packaging/
CONVERTER CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
PARAMETER
CONDITIONS
Resolution
(No Missing Codes)
MIN
l
14
TYP
MAX
UNITS
Bits
Integral Linearity Error
Differential Analog Input (Note 5)
l
–6
±1
6
LSB
Differential Linearity Error
Differential Analog Input
l
–1
±0.5
1
LSB
Offset Error
(Note 6)
l
–15
±2
15
mV
Gain Error
External Reference
l
–3
±0.5
3
%FS
Offset Drift
Full-Scale Drift
Transition Noise
±10
μV/°C
Internal Reference
±30
ppm/°C
External Reference
±5
ppm/°C
SENSE = 1V
1
LSBRMS
2246hfb
2
LTC2246H
ANALOG INPUT
The l denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
VIN
Analog Input Range (AIN+ – AIN–)
MIN
TYP
MAX
UNITS
2.8V < VDD < 3.5V (Note 7)
l
VIN, CM
Analog Input Common Mode (AIN+ + AIN–)/2
Differential Input (Note 7)
Single Ended Input (Note 7)
l
l
1
0.5
IIN
Analog Input Leakage Current
0V < AIN+, AIN– < VDD
l
ISENSE
SENSE Input Leakage
0V < SENSE < 1V
IMODE
MODE Pin Leakage
tAP
Sample-and-Hold Acquisition Delay Time
tJITTER
Sample-and-Hold Acquisition Delay Time Jitter
0.2
psRMS
CMRR
Analog Input Common Mode Rejection Ratio
80
dB
±0.5V to
±1V
1.5
1.5
V
1.9
2
V
V
–10
10
μA
l
–10
10
μA
l
–10
10
μA
0
ns
DYNAMIC ACCURACY The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
SNR
Signal-to-Noise Ratio
5MHz Input
12.5MHz Input
70MHz Input
Spurious Free Dynamic Range
2nd or 3rd Harmonic
SFDR
SFDR
S/(N+D)
IMD
MIN
TYP
l
72
74.5
74.2
73.4
dB
dB
dB
5MHz Input
12.5MHz Input
70MHz Input
l
74
90
90
85
dB
dB
dB
Spurious Free Dynamic Range
4th Harmonic or Higher
5MHz Input
12.5MHz Input
70MHz Input
l
78
90
90
90
dB
dB
dB
Signal-to-Noise Plus Distortion Ratio
5MHz Input
12.5MHz Input
70MHz Input
l
71.5
74.5
74.2
73.4
dB
dB
dB
90
dB
Intermodulation Distortion
fIN1 = 4.3MHz, fIN2 = 4.6MHz
MAX
UNITS
INTERNAL REFERENCE CHARACTERISTICS TA = 25°C. (Note 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VCM Output Voltage
IOUT = 0
1.475
1.500
1.525
V
VCM Output Tempco
±25
ppm/°C
VCM Line Regulation
2.8V < VDD < 3.5V
3
mV/V
VCM Output Regulation
–1mA < IOUT < 1mA
4
Ω
DIGITAL INPUTS AND DIGITAL OUTPUTS
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC INPUTS (CLK, OE, SHDN)
VIH
High Level Input Voltage
VDD = 3V
l
VIL
Low Level Input Voltage
VDD = 3V
l
IIN
Input Current
VIN = 0V to VDD
l
CIN
Input Capacitance
(Note 7)
2
V
–10
3
0.8
V
10
μA
pF
2246hfb
3
LTC2246H
DIGITAL INPUTS AND DIGITAL OUTPUTS
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC OUTPUTS
OVDD = 3V
COZ
Hi-Z Output Capacitance
OE = High (Note 7)
3
pF
ISOURCE
Output Source Current
VOUT = 0V
50
mA
ISINK
Output Sink Current
VOUT = 3V
50
mA
VOH
High Level Output Voltage
IO = –10μA
IO = –200μA
l
IO = 10μA
IO = 1.6mA
l
VOL
Low Level Output Voltage
2.7
2.995
2.99
0.005
0.09
V
V
V
V
0.4
OVDD = 2.5V
VOH
High Level Output Voltage
IO = –200μA
2.49
V
VOL
Low Level Output Voltage
IO = 1.6mA
0.09
V
VOH
High Level Output Voltage
IO = –200μA
1.79
V
VOL
Low Level Output Voltage
IO = 1.6mA
0.09
V
OVDD = 1.8V
POWER REQUIREMENTS
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 8)
SYMBOL
PARAMETER
CONDITIONS
VDD
Analog Supply Voltage
(Note 9)
OVDD
Output Supply Voltage
(Note 9)
MIN
TYP
MAX
UNITS
l
2.8
3
3.5
V
l
0.5
V
3
3.6
25
30
mA
75
90
mW
IVDD
Supply Current
l
PDISS
Power Dissipation
l
PSHDN
Shutdown Power
SHDN = H, OE = H, No CLK
2
mW
PNAP
Nap Mode Power
SHDN = H, OE = L, No CLK
15
mW
TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
MIN
fS
Sampling Frequency
(Note 9)
l
1
tL
CLK Low Time
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
(Note 7)
l
l
18.9
5
tH
CLK High Time
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
(Note 7)
l
l
18.9
5
tAP
Sample-and-Hold Aperture Delay
tD
CLK to DATA Delay
TYP
MAX
UNITS
25
MHz
20
20
500
500
ns
ns
20
20
500
500
ns
ns
0
ns
CL = 5pF (Note 7)
l
2.7
6
ns
Data Access Time After OE↓
CL = 5pF (Note 7)
l
4.3
12
ns
BUS Relinquish Time
(Note 7)
l
3.3
10
ns
Pipeline Latency
1.4
5
Cycles
2246hfb
4
LTC2246H
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to ground with GND and OGND
wired together (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above VDD, they
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above VDD without latchup.
Note 4: VDD = 3V, fSAMPLE = 25MHz, input range = 2VP-P with differential
drive, unless otherwise noted.
Note 5: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 6: Offset error is the offset voltage measured from –0.5 LSB when
the output code flickers between 00 0000 0000 0000 and
11 1111 1111 1111.
Note 7: Guaranteed by design, not subject to test.
Note 8: VDD = 3V, fSAMPLE = 25MHz, input range = 1VP-P with
differential drive.
Note 9: Recommended operating conditions.
TYPICAL PERFORMANCE CHARACTERISTICS
Typical INL, 2V Range, 25Msps
1.00
0.75
1.0
0.50
0.5
0
–0.5
0
–10
–20
–30
AMPLITUDE (dB)
1.5
DNL ERROR (LSB)
INL ERROR (LSB)
2.0
0.25
0
–0.25
–0.50
–1.0
–1.5
–0.75
–2.0
–1.00
4096
0
8192
CODE
12288
16384
–40
–50
–60
–70
–80
–90
–100
–110
–120
4096
0
8192
CODE
12288
2246H G01
16384
0
–10
–20
–20
–20
–30
–30
–30
–70
–80
AMPLITUDE (dB)
0
–10
AMPLITUDE (dB)
0
–60
–40
–50
–60
–70
–80
–40
–50
–60
–70
–80
–90
–90
–90
–100
–100
–100
–110
–110
–110
–120
–120
0
2
4
6
8
10
FREQUENCY (MHz)
12
2246H G04
0
2
4
6
8
10
FREQUENCY (MHz)
12
4
6
8
10
FREQUENCY (MHz)
8192 Point FFT, fIN = 140MHz,
–1dB, 2V Range, 25Msps
–10
–50
2
2246H G03
8192 Point FFT, fIN = 70MHz,
–1dB, 2V Range, 25Msps
–40
0
2246H G02
8192 Point FFT, fIN = 30MHz,
–1dB, 2V Range, 25Msps
AMPLITUDE (dB)
8192 Point FFT, fIN = 5MHz, –1dB,
2V Range, 25Msps
Typical DNL, 2V Range, 25Msps
12
2246H G05
–120
0
2
4
6
8
10
FREQUENCY (MHz)
12
2246H G06
2246hfb
5
LTC2246H
TYPICAL PERFORMANCE CHARACTERISTICS
8192 Point 2-Tone FFT,
fIN = 10.9MHz and 13.8MHz,
–1dB, 2V Range, 25Msps
Grounded Input Histogram,
25Msps
25000
0
75
–10
22016
–20
20000
–30
AMPLITUDE (dB)
SNR vs Input Frequency, –1dB,
2V Range, 25Msps
74
18803
COUNT
–50
–60
–70
15000
SNR (dBFS)
–40
13373
10000
–80
73
72
6919
–90
5000
–100
–110
–120
0
2
4
6
8
10
FREQUENCY (MHz)
0
12
2246H G07
SFDR vs Input Frequency, –1dB,
2V Range, 25Msps
71
3227
43
853
278
70
8179 8180 8181 8182 8183 8184 8185 8186
2246H G08
CODE
SNR and SFDR vs Sample Rate,
2V Range, fIN = 5MHz, –1dB
100
80
110
dBFS
70
85
80
75
SFDR
SNR (dBc AND dBFS)
SNR AND SFDR (dBFS)
100
90
200
2246H G09
SNR vs Input Level, fIN = 5MHz,
2V Range, –1dB
95
SFDR (dBFS)
100
50
150
INPUT FREQUENCY (MHz)
0
90
80
SNR
60
50
dBc
40
30
20
70
70
10
65
50
100
150
INPUT FREQUENCY (MHz)
0
60
200
10
0
2246H G10
SFDR vs Input Level, fIN = 5MHz,
2V Range, 25Msps
20
30
40
SAMPLE RATE (Msps)
0
–60
50
2246H G11
IVDD vs Sample Rate, 5MHz Sine
Wave Input, –1dB
–30
–40
–20
INPUT LEVEL (dBFS)
–10
0
2246H G12
IOVDD vs Sample Rate, 5MHz Sine
Wave Input, –1dB, OVDD = 1.8V
35
120
–50
3
110
dBFS
30
90
dBc
70
90dBc SFDR
REFERENCE LINE
60
IOVDD (mA)
2
80
IVDD (mA)
SFDR (dBc AND dBFS)
100
2V RANGE
25
1V RANGE
1
50
20
40
30
20
–60
–50
–40
–30
–20
INPUT LEVEL (dBFS)
–10
15
0
2246H G13
0
5
25
20
15
10
SAMPLE RATE (Msps)
30
35
2246H G14
0
0
5
25
20
15
10
SAMPLE RATE (Msps)
30
35
2246H G15
2246hfb
6
LTC2246H
PIN FUNCTIONS
GND (Pins 1, 4, 9, 13, 15, 18, 24, 25, 29, 32, 36, 37,
48): ADC Power Ground.
OE (Pin 17): Output Enable Pin. Refer to SHDN pin
function.
AIN+ (Pin 2): Positive Differential Analog Input.
D0-D13 (Pins 19-23, 26-28, 33-35, 38-40): Digital Outputs. D13 is the MSB.
AIN– (Pin 3): Negative Differential Analog Input.
REFH (Pins 5, 6): ADC High Reference. Bypass to Pins 7,
8 with a 0.1μF ceramic chip capacitor as close to the pin
as possible. Also bypass to Pins 7, 8 with an additional
2.2μF ceramic chip capacitor and to ground with a 1μF
ceramic chip capacitor.
REFL (Pins 7, 8): ADC Low Reference. Bypass to Pins 5, 6
with a 0.1μF ceramic chip capacitor as close to the pin
as possible. Also bypass to Pins 5, 6 with an additional
2.2μF ceramic chip capacitor and to ground with a 1μF
ceramic chip capacitor.
VDD (Pins 10, 11, 12, 46, 47): 3V Supply. Bypass to GND
with 0.1μF ceramic chip capacitors.
CLK (Pin 14): Clock Input. The input sample starts on the
positive edge.
SHDN (Pin 16): Shutdown Mode Selection Pin. Connecting
SHDN to GND and OE to GND results in normal operation
with the outputs enabled. Connecting SHDN to GND and
OE to VDD results in normal operation with the outputs at
high impedance. Connecting SHDN to VDD and OE to GND
results in nap mode with the outputs at high impedance.
Connecting SHDN to VDD and OE to VDD results in sleep
mode with the outputs at high impedance.
OGND (Pin 30): Output Driver Ground.
OVDD (Pin 31): Positive Supply for the Output Drivers.
Bypass to ground with 0.1μF ceramic chip capacitor.
OF (Pin 41): Over/Under Flow Output. High when an over
or under flow has occurred.
MODE (Pin 42): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to GND selects
offset binary output format and turns the clock duty cycle
stabilizer off. 1/3 VDD selects offset binary output format
and turns the clock duty cycle stabilizer on. 2/3 VDD selects
2’s complement output format and turns the clock duty
cycle stabilizer on. VDD selects 2’s complement output
format and turns the clock duty cycle stabilizer off.
SENSE (Pin 43): Reference Programming Pin. Connecting
SENSE to VCM selects the internal reference and a ±0.5V
input range. VDD selects the internal reference and a ±1V
input range. An external reference greater than 0.5V and
less than 1V applied to SENSE selects an input range of
±VSENSE. ±1V is the largest valid input range.
VCM (Pin 44, 45): 1.5V Output and Input Common
Mode Bias. Bypass to ground with 2.2μF ceramic chip
capacitor.
If the clock duty cycle stabilizer is used, a >1μs high pulse
should be applied to the SHDN pin once the power supplies
are stable at power up.
2246hfb
7
LTC2246H
FUNCTIONAL BLOCK DIAGRAM
AIN+
AIN–
VCM
INPUT
S/H
FIRST PIPELINED
ADC STAGE
SECOND PIPELINED
ADC STAGE
THIRD PIPELINED
ADC STAGE
FOURTH PIPELINED
ADC STAGE
FIFTH PIPELINED
ADC STAGE
1.5V
REFERENCE
SIXTH PIPELINED
ADC STAGE
SHIFT REGISTER
AND CORRECTION
2.2μF
RANGE
SELECT
REFH
SENSE
REFL
INTERNAL CLOCK SIGNALS
OVDD
REF
BUF
OF
D13
CLOCK/DUTY
CYCLE
CONTROL
DIFF
REF
AMP
REFH
0.1μF
CONTROL
LOGIC
OUTPUT
DRIVERS
•
•
•
D0
2246H F01
REFL
OGND
CLK
MODE
SHDN
OE
2.2μF
1μF
1μF
Figure 1. Functional Block Diagram
2246hfb
8
LTC2246H
TIMING DIAGRAM
tAP
ANALOG
INPUT
N+4
N+2
N
N+3
tH
N+5
N+1
tL
CLK
tD
D0-D13, OF
N–5
N–4
N–3
N–2
N–1
N
2246H TD01
2246hfb
9
LTC2246H
APPLICATIONS INFORMATION
DYNAMIC PERFORMANCE
is defined as the ratio of the RMS value of either input tone
to the RMS value of the largest 3rd order intermodulation
product.
Signal-to-Noise Plus Distortion Ratio
The signal-to-noise plus distortion ratio [S/(N + D)] is
the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other
frequency components at the ADC output. The output is
band limited to frequencies above DC to below half the
sampling frequency.
Spurious Free Dynamic Range (SFDR)
Spurious free dynamic range is the peak harmonic or spurious noise that is the largest spectral component excluding
the input signal and DC. This value is expressed in decibels
relative to the RMS value of a full scale input signal.
Signal-to-Noise Ratio
Input Bandwidth
The signal-to-noise ratio (SNR) is the ratio between the
RMS amplitude of the fundamental input frequency and
the RMS amplitude of all other frequency components
except the first five harmonics and DC.
The input bandwidth is that input frequency at which the
amplitude of the reconstructed fundamental is reduced
by 3dB for a full scale input signal.
Aperture Delay Time
Total Harmonic Distortion
Total harmonic distortion is the ratio of the RMS sum
of all harmonics of the input signal to the fundamental
itself. The out-of-band harmonics alias into the frequency
band between DC and half the sampling frequency. THD
is expressed as:
THD = 20Log
( ( V2 + V3 + V4 + ...Vn )/ V1)
2
2
2
2
where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the second
through nth harmonics. The THD calculated in this data
sheet uses all the harmonics up to the fifth.
Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD. IMD is the change in one sinusoidal input caused
by the presence of another sinusoidal input at a different
frequency.
If two pure sine waves of frequencies fa and fb are applied
to the ADC input, nonlinearities in the ADC transfer function
can create distortion products at the sum and difference
frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc.
The 3rd order intermodulation products are 2fa + fb, 2fb
+ fa, 2fa – fb and 2fb – fa. The intermodulation distortion
The time from when CLK reaches mid-supply to the
instant that the input signal is held by the sample and
hold circuit.
Aperture Delay Jitter
The variation in the aperture delay time from conversion
to conversion. This random variation will result in noise
when sampling an AC input. The signal to noise ratio due
to the jitter alone will be:
SNRJITTER = –20log (2π • fIN • tJITTER)
CONVERTER OPERATION
As shown in Figure 1, the LTC2246H is a CMOS pipelined
multistep converter. The converter has six pipelined ADC
stages; a sampled analog input will result in a digitized
value five cycles later (see the Timing Diagram section).
For optimal AC performance the analog inputs should be
driven differentially. For cost sensitive applications, the
analog inputs can be driven single-ended with slightly
worse harmonic distortion. The CLK input is single-ended.
The LTC2246H has two phases of operation, determined
by the state of the CLK input pin.
Each pipelined stage shown in Figure 1 contains an ADC,
a reconstruction DAC and an interstage residue amplifier.
In operation, the ADC quantizes the input to the stage and
the quantized value is subtracted from the input by the
2246hfb
10
LTC2246H
APPLICATIONS INFORMATION
DAC to produce a residue. The residue is amplified and
output by the residue amplifier. Successive stages operate
out of phase so that when the odd stages are outputting
their residue, the even stages are acquiring that residue
and vice versa.
When CLK is low, the analog input is sampled differentially
directly onto the input sample-and-hold capacitors, inside
the “Input S/H” shown in the block diagram. At the instant
that CLK transitions from low to high, the sampled input is
held. While CLK is high, the held input voltage is buffered
by the S/H amplifier which drives the first pipelined ADC
stage. The first stage acquires the output of the S/H during this high phase of CLK. When CLK goes back low, the
first stage produces its residue which is acquired by the
second stage. At the same time, the input S/H goes back to
acquiring the analog input. When CLK goes back high, the
second stage produces its residue which is acquired by the
third stage. An identical process is repeated for the third,
fourth and fifth stages, resulting in a fifth stage residue
that is sent to the sixth stage ADC for final evaluation.
Each ADC stage following the first has additional range to
accommodate flash and amplifier offset errors. Results
from all of the ADC stages are digitally synchronized such
that the results can be properly combined in the correction
logic before being sent to the output buffer.
SAMPLE/HOLD OPERATION AND INPUT DRIVE
Sample/Hold Operation
Figure 2 shows an equivalent circuit for the LTC2246H
CMOS differential sample-and-hold. The analog inputs are
connected to the sampling capacitors (CSAMPLE) through
NMOS transistors. The capacitors shown attached to
each input (CPARASITIC) are the summation of all other
capacitance associated with each input.
During the sample phase when CLK is low, the transistors
connect the analog inputs to the sampling capacitors and
they charge to and track the differential input voltage. When
CLK transitions from low to high, the sampled input voltage
is held on the sampling capacitors. During the hold phase
when CLK is high, the sampling capacitors are disconnected
from the input and the held voltage is passed to the ADC
core for processing. As CLK transitions from high to low,
LTC2246H
VDD
AIN+
CSAMPLE
4pF
15Ω
VDD
AIN–
CPARASITIC
1pF
CSAMPLE
4pF
15Ω
CPARASITIC
1pF
CLK
2246H F02
Figure 2. Equivalent Input Circuit
the inputs are reconnected to the sampling capacitors to
acquire a new sample. Since the sampling capacitors still
hold the previous sample, a charging glitch proportional
to the change in voltage between samples will be seen
at this time. If the change between the last sample and
the new sample is small, the charging glitch seen at the
input will be small. If the input change is large, such as
the change seen with input frequencies near Nyquist, then
a larger charging glitch will be seen.
Single-Ended Input
For cost sensitive applications, the analog inputs can be
driven single-ended. With a single-ended input the harmonic distortion and INL will degrade, but the SNR and
DNL will remain unchanged. For a single-ended input, AIN+
should be driven with the input signal and AIN– should
be connected to VCM or a low noise reference voltage
between 1V and 1.5V.
Common Mode Bias
For optimal performance the analog inputs should be driven
differentially. Each input should swing ±0.5V for the 2V
range or ±0.25V for the 1V range, around a common mode
voltage of 1.5V. The VCM output pins (Pins 44, 45) may be
used to provide the common mode bias level. VCM can be
tied directly to the center tap of a transformer to set the DC
input level or as a reference level to an op amp differential
driver circuit. The VCM pins must be bypassed to ground
close to the ADC with a 2.2μF or greater capacitor.
2246hfb
11
LTC2246H
APPLICATIONS INFORMATION
Input Drive Impedance
As with all high performance, high speed ADCs, the dynamic performance of the LTC2246H can be influenced by
the input drive circuitry, particularly the second and third
harmonics. Source impedance and reactance can influence
SFDR. At the falling edge of CLK, the sample-and-hold
circuit will connect the 4pF sampling capacitor to the input
pin and start the sampling period. The sampling period
ends when CLK rises, holding the sampled input on the
sampling capacitor. Ideally the input circuitry should be
fast enough to fully charge the sampling capacitor during
the sampling period 1/(2FENCODE); however, this is not
always possible and the incomplete settling may degrade
the SFDR. The sampling glitch has been designed to be
as linear as possible to minimize the effects of incomplete
settling.
For the best performance, it is recommended to have a
source impedance of 100Ω or less for each input. The
source impedance should be matched for the differential
inputs. Poor matching will result in higher even order
harmonics, especially the second.
hold. Figure 3 shows a 1:1 turns ratio transformer. Other
turns ratios can be used if the source impedance seen
by the ADC does not exceed 100Ω for each ADC input.
A disadvantage of using a transformer is the loss of low
frequency response. Most small RF transformers have
poor performance at frequencies below 1MHz.
Figure 4 demonstrates the use of a differential amplifier to
convert a single ended input signal into a differential input
signal. The advantage of this method is that it provides
low frequency input response; however, the limited gain
bandwidth of most op amps will limit the SFDR at high
input frequencies.
Figure 5 shows a single-ended input circuit. The impedance
seen by the analog inputs should be matched. This circuit
is not recommended if low distortion is required.
The 25Ω resistors and 12pF capacitor on the analog
inputs serve two purposes: isolating the drive circuitry
from the sample-and-hold charging glitches and limiting
the wideband noise at the converter input.
VCM
Input Drive Circuits
Figure 3 shows the LTC2246H being driven by an RF
transformer with a center tapped secondary. The secondary
center tap is DC biased with VCM, setting the ADC input
signal at its optimum DC level. Terminating on the transformer secondary is desirable, as this provides a common
mode path for charging glitches caused by the sample and
HIGH SPEED
DIFFERENTIAL
25Ω
AMPLIFIER
ANALOG
INPUT
+
AIN+
LTC2246H
+
CM
–
2.2μF
12pF
–
25Ω
AIN–
2246H F04
Figure 4. Differential Drive with an Amplifier
VCM
VCM
2.2μF
0.1μF
ANALOG
INPUT
T1
1:1
25Ω
25Ω
AIN+
0.1μF
25Ω
T1 = MA/COM ETC1-1T
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
0.1μF
ANALOG
INPUT
12pF
25Ω
1k
LTC2246H
1k
2.2μF
AIN+
25Ω
AIN–
LTC2246H
12pF
25Ω
2246H F03
Figure 3. Single-Ended to Differential Conversion
Using a Transformer
AIN–
0.1μF
2246H F05
Figure 5. Single-Ended Drive
2246hfb
12
LTC2246H
APPLICATIONS INFORMATION
Reference Operation
Figure 6 shows the LTC2246H reference circuitry consisting of a 1.5V bandgap reference, a difference amplifier and
switching and control circuit. The internal voltage reference
can be configured for two pin selectable input ranges of
2V (±1V differential) or 1V (±0.5V differential). Tying the
SENSE pin to VDD selects the 2V range; tying the SENSE
pin to VCM selects the 1V range.
The 1.5V bandgap reference serves two functions: its
output provides a DC bias point for setting the common
mode voltage of any external input circuitry; additionally,
the reference is used with a difference amplifier to generate the differential reference levels needed by the internal
ADC circuitry. An external bypass capacitor is required
for the 1.5V reference output, VCM. This provides a high
frequency low impedance path to ground for internal and
external circuitry.
The difference amplifier generates the high and low
reference for the ADC. High speed switching circuits are
connected to these outputs and they must be externally
bypassed.
Other voltage ranges in-between the pin selectable ranges
can be programmed with two external resistors as shown
in Figure 7. An external reference can be used by applying its output directly or through a resistor divider to
SENSE. It is not recommended to drive the SENSE pin
with a logic device. The SENSE pin should be tied to the
appropriate level as close to the converter as possible. If
the SENSE pin is driven externally, it should be bypassed
to ground as close to the device as possible with a 1μF
ceramic capacitor.
Input Range
The input range can be set based on the application.
The 2V input range will provide the best signal-to-noise
performance while maintaining excellent SFDR. The 1V
input range will have better SFDR performance, but the
SNR will degrade by 5.8dB.
1.5V
LTC2246H
1.5V
VCM
4Ω
VCM
2.2μF
12k
1.5V BANDGAP
REFERENCE
0.75V
LTC2246H
SENSE
2.2μF
1V
TIE TO VDD FOR 2V RANGE;
TIE TO VCM FOR 1V RANGE;
RANGE = 2 • VSENSE FOR
0.5V < VSENSE < 1V
0.5V
12k
RANGE
DETECT
AND
CONTROL
1μF
2246H F07
Figure 7. 1.5V Range ADC
SENSE
CLEAN
SUPPLY
BUFFER
INTERNAL ADC
HIGH REFERENCE
1μF
4.7μF
REFH
FERRITE
BEAD
0.1μF
2.2μF
0.1μF
DIFF AMP
CLK
1μF
100Ω
LTC2246H
REFL
INTERNAL ADC
LOW REFERENCE
2246H F08
2246H F06
Figure 6. Equivalent Reference Circuit
IF LVDS USE FIN1002 OR FIN1018.
FOR PECL, USE AZ1000ELT21 OR SIMILAR
Figure 8. CLK Drive Using an LVDS or PECL to CMOS Converter
2246hfb
13
LTC2246H
APPLICATIONS INFORMATION
Driving the Clock Input
The CLK input can be driven directly with a CMOS or TTL
level signal. A differential clock can also be used along
with a low-jitter CMOS converter before the CLK pin (see
Figure 8).
The noise performance of the LTC2246H can depend on the
clock signal quality as much as on the analog input. Any
noise present on the clock signal will result in additional
aperture jitter that will be RMS summed with the inherent
ADC aperture jitter.
Table 1. Output Codes vs Input Voltage
AIN+ – AIN–
(2V Range)
OF
>+1.000000V
+0.999878V
+0.999756V
1
0
0
11 1111 1111 1111 01 1111 1111 1111
11 1111 1111 1111 01 1111 1111 1111
11 1111 1111 1110 01 1111 1111 1110
+0.000122V
0.000000V
–0.000122V
–0.000244V
0
0
0
0
10 0000 0000 0001
10 0000 0000 0000
01 1111 1111 1111
01 1111 1111 1110
–0.999878V
–1.000000V
1μs high pulse
should be applied to the SHDN pin once the power supplies
are stable at power up.
The lower limit of the LTC2246H sample rate is determined
by droop of the sample-and-hold circuits. The pipelined
architecture of this ADC relies on storing analog signals on
small valued capacitors. Junction leakage will discharge
the capacitors. The specified minimum operating frequency
for the LTC2246H is 1Msps.
N-channel transistor in the output driver allows operation
down to low voltages. The internal resistor in series with
the output makes the output appear as 50Ω to external
circuitry and may eliminate the need for external damping
resistors.
As with all high speed/high resolution converters, the
digital output loading can affect the performance. The
digital outputs of the LTC2246H should drive a minimal
capacitive load to avoid possible interaction between the
digital outputs and sensitive input circuitry. The output
should be buffered with a device such as an ALVCH16373
CMOS latch. For full speed operation the capacitive load
should be kept under 10pF.
Lower OVDD voltages will also help reduce interference
from the digital outputs.
LTC2246H
OVDD
VDD
0.5V
TO 3.6V
VDD
0.1μF
OVDD
DATA
FROM
LATCH
PREDRIVER
LOGIC
43Ω
TYPICAL
DATA
OUTPUT
OE
OGND
DIGITAL OUTPUTS
Table 1 shows the relationship between the analog input
voltage, the digital data bits, and the overflow bit.
2246H F09
Figure 9. Digital Output Buffer
2246hfb
14
LTC2246H
APPLICATIONS INFORMATION
Data Format
Sleep and Nap Modes
Using the MODE pin, the LTC2246H parallel digital output
can be selected for offset binary or 2’s complement format.
Connecting MODE to GND or 1/3VDD selects offset binary
output format. Connecting MODE to 2/3VDD or VDD selects
2’s complement output format.
The converter may be placed in shutdown or nap modes
to conserve power. Connecting SHDN to GND results in
normal operation. Connecting SHDN to VDD and OE to VDD
results in sleep mode, which powers down all circuitry
including the reference and typically dissipates 1mW. When
exiting sleep mode it will take milliseconds for the output
data to become valid because the reference capacitors
have to recharge and stabilize. Connecting SHDN to VDD
and OE to GND results in nap mode, which typically dissipates 15mW. In nap mode, the on-chip reference circuit
is kept on, so that recovery from nap mode is faster than
that from sleep mode, typically taking 100 clock cycles. In
both sleep and nap modes, all digital outputs are disabled
and enter the Hi-Z state.
An external resistor divider can be used to set the 1/3VDD
or 2/3VDD logic values. Table 2 shows the logic states for
the MODE pin.
Table 2. MODE Pin Function
MODE PIN
OUTPUT FORMAT
CLOCK DUTY
CYCLE STABILIZER
0
Offset Binary
Off
1/3VDD
Offset Binary
On
2/3VDD
2’s Complement
On
VDD
2’s Complement
Off
Overflow Bit
When OF outputs a logic high the converter is either overranged or underranged.
Output Driver Power
Separate output power and ground pins allow the output
drivers to be isolated from the analog circuitry. The power
supply for the digital output buffers, OVDD, should be tied
to the same power supply as for the logic being driven.
For example if the converter is driving a DSP powered
by a 1.8V supply, then OVDD should be tied to that same
1.8V supply.
OVDD can be powered with any voltage from 500mV up to
3.6V. OGND can be powered with any voltage from GND
up to 1V and must be less than OVDD. The logic outputs
will swing between OGND and OVDD.
Output Enable
The outputs may be disabled with the output enable pin,
OE. OE high disables all data outputs including OF.
Grounding and Bypassing
The LTC2246H requires a printed circuit board with a clean,
unbroken ground plane. A multilayer board with an internal
ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capacitors must be located as close to the pins as possible. Of
particular importance is the 0.1μF capacitor between REFH
and REFL. This capacitor should be placed as close to the
device as possible (1.5mm or less). A size 0402 ceramic
capacitor is recommended. The large 2.2μF capacitor between REFH and REFL can be somewhat further away. The
traces connecting the pins and bypass capacitors must be
kept short and should be made as wide as possible.
The LTC2246H differential inputs should run parallel and
close to each other. The input traces should be as short
as possible to minimize capacitance and to minimize
noise pickup.
2246hfb
15
LTC2246H
PACKAGE DESCRIPTION
LX Package
48-Lead Plastic LQFP (7mm × 7mm)
(Reference LTC DWG # 05-08-1760 Rev Ø)
7.15 – 7.25
9.00 BSC
5.50 REF
7.00 BSC
48
0.50 BSC
1
2
48
SEE NOTE: 4
1
2
9.00 BSC
5.50 REF
7.00 BSC
7.15 – 7.25
0.20 – 0.30
A
A
PACKAGE OUTLINE
C0.30 – 0.50
1.30 MIN
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.60
1.35 – 1.45 MAX
11° – 13°
R0.08 – 0.20
GAUGE PLANE
0.25
0° – 7°
11° – 13°
0.09 – 0.20
1.00 REF
0.50
BSC
0.17 – 0.27
0.05 – 0.15
LX48 LQFP 0907 REVØ
0.45 – 0.75
SECTION A – A
NOTE:
1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE
2. DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT
4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER
5. DRAWING IS NOT TO SCALE
2246hfb
16
LTC2246H
REVISION HISTORY
(Revision history begins at Rev B)
REV
DATE
DESCRIPTION
PAGE NUMBER
B
02/11
Removed Tape and Reel information from Order Information
2
2246hfb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
17
LTC2246H
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC1748
14-Bit, 80Msps, 5V ADC
76.3dB SNR, 90dB SFDR, 48-Pin TSSOP Package
LTC1750
14-Bit, 80Msps, 5V Wideband ADC
Up to 500MHz IF Undersampling, 90dB SFDR
LT1993-2
High Speed Differential Op Amp
800MHz BW, –70dBc Distortion at 70MHz, 6dB Gain
LT1994
Low Noise, Low Distortion Fully Differential Input/Output
Amplifier/Driver
Low Distortion: –94dBc at 1MHz
LTC2202
16-Bit, 10Msps, 3.3V ADC, Lowest Noise
150mW, 81.6dB SNR, 100dB SFDR, 48-Pin QFN
LTC2208
16-Bit, 130Msps, 3.3V ADC, LVDS Outputs
1250mW, 78dB SNR, 100dB SFDR, 64-Pin QFN
LTC2220-1
12-Bit, 185Msps, 3.3V ADC, LVDS Outputs
910mW, 67.7dB SNR, 80dB SFDR, 64-Pin QFN
LTC2224
12-Bit, 135Msps, 3.3V ADC, High IF Sampling
630mW, 67.6dB SNR, 84dB SFDR, 48-Pin QFN
LTC2225
12-Bit, 10Msps, 3V ADC, Lowest Power
60mW, 71.3dB SNR, 90dB SFDR, 32-Pin QFN
LTC2226
12-Bit, 25Msps, 3V ADC, Lowest Power
75mW, 71.4dB SNR, 90dB SFDR, 32-Pin QFN
LTC2227
12-Bit, 40Msps, 3V ADC, Lowest Power
120mW, 71.4dB SNR, 90dB SFDR, 32-Pin QFN
LTC2228
12-Bit, 65Msps, 3V ADC, Lowest Power
205mW, 71.3dB SNR, 90dB SFDR, 32-Pin QFN
LTC2229
12-Bit, 80Msps, 3V ADC, Lowest Power
211mW, 70.6dB SNR, 90dB SFDR, 32-Pin QFN
LTC2236
10-Bit, 25Msps, 3V ADC, Lowest Power
75mW, 61.8dB SNR, 85dB SFDR, 32-Pin QFN
LTC2237
10-Bit, 40Msps, 3V ADC, Lowest Power
120mW, 61.8dB SNR, 85dB SFDR, 32-Pin QFN
LTC2238
10-Bit, 65Msps, 3V ADC, Lowest Power
205mW, 61.8dB SNR, 85dB SFDR, 32-Pin QFN
LTC2239
10-Bit, 80Msps, 3V ADC, Lowest Power
211mW, 61.6dB SNR, 85dB SFDR, 32-Pin QFN
LTC2245
14-Bit, 10Msps, 3V ADC, Lowest Power
60mW, 74.4dB SNR, 90dB SFDR, 32-Pin QFN
LTC2246
14-Bit, 25Msps, 3V ADC, Lowest Power
75mW, 74.5dB SNR, 90dB SFDR, 32-Pin QFN
LTC2247
14-Bit, 40Msps, 3V ADC, Lowest Power
120mW, 74.4dB SNR, 90dB SFDR, 32-Pin QFN
LTC2248
14-Bit, 65Msps, 3V ADC, Lowest Power
205mW, 74.3dB SNR, 90dB SFDR, 32-Pin QFN
LTC2249
14-Bit, 80Msps, 3V ADC, Lowest Power
222mW, 73dB SNR, 90dB SFDR, 32-Pin QFN
LTC2250
10-Bit, 105Msps, 3V ADC, Lowest Power
320mW, 61.6dB SNR, 85dB SFDR, 32-Pin QFN
LTC2251
10-Bit, 125Msps, 3V ADC, Lowest Power
395mW, 61.6dB SNR, 85dB SFDR, 32-Pin QFN
LTC2252
12-Bit, 105Msps, 3V ADC, Lowest Power
320mW, 70.2dB SNR, 88dB SFDR, 32-Pin QFN
LTC2253
12-Bit, 125Msps, 3V ADC, Lowest Power
395mW, 70.2dB SNR, 88dB SFDR, 32-Pin QFN
LTC2254
14-Bit, 105Msps, 3V ADC, Lowest Power
320mW, 72.4dB SNR, 88dB SFDR, 32-Pin QFN
LTC2255
14-Bit, 125Msps, 3V ADC, Lowest Power
395mW, 72.5dB SNR, 88dB SFDR, 32-Pin QFN
LTC2284
14-Bit, Dual, 105Msps, 3V ADC, Low Crosstalk
540mW, 72.4dB SNR, 88dB SFDR, 64-Pin QFN
LT5512
DC-3GHz High Signal Level Downconverting Mixer
DC to 3GHz, 21dBm IIP3, Integrated LO Buffer
LT5514
Ultralow Distortion IF Amplifier/ADC Driver
with Digitally Controlled Gain
450MHz to 1dB BW, 47dB OIP3, Digital Gain Control
10.5dB to 33dB in 1.5dB/Step
LT5515
1.5GHz to 2.5GHz Direct Conversion Quadrature Demodulator
High IIP3: 20dBm at 1.9GHz,
LT5516
800MHz to 1.5GHz Direct Conversion Quadrature Demodulator
High IIP3: 21.5dBm at 900MHz,
LT5517
40MHz to 900MHz Direct Conversion Quadrature Demodulator
High IIP3: 21dBm at 800MHz,
LT5522
600MHz to 2.7GHz High Linearity Downconverting Mixer
4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz,
NF = 12.5dB, 50Ω Single-Ended RF and LO Ports
2246hfb
18 Linear Technology Corporation
LT 0211 REV B • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2007
工商网监
湘ICP备2023018690号
