LTC2629CGN#PBF

LTC2609/LTC2619/LTC2629 Quad 16-/14-/12-Bit Rail-to-Rail DACs with I2C Interface Description Features Smallest Pin-Compatible Quad DACs: LTC2609: 16 Bits LTC2619: 14 Bits LTC2629: 12 Bits n Guaranteed Monotonic Over Temperature n Separate Reference Inputs n 27 Selectable Addresses n 400kHz I2C™ Interface n Wide 2.7V to 5.5V Supply Range n Low Power Operation: 250µA per DAC at 3V n Individual Channel Power Down to 1µA (Max) n High Rail-to-Rail Output Drive (±15mA, Min) n Ultralow Crosstalk Between DACs (5µV) n LTC2609/LTC2619/LTC2629: Power-On Reset to Zero-Scale n LTC2609-1/LTC2619-1/LTC2629-1: Power-On Reset to Mid-Scale n Tiny 16-Lead Narrow SSOP Package The LTC®2609/LTC2619/LTC2629 are quad 16-, 14- and 12bit, 2.7V to 5.5V rail-to-rail voltage output DACs in a 16‑lead SSOP package. They have built-in high performance output buffers and are guaranteed monotonic. n These parts establish new board-density benchmarks for 16- and 14-bit DACs and advance performance standards for output drive and load regulation in single-supply, voltage-output DACs. The parts use a 2-wire, I2C compatible serial interface. The LTC2609/LTC2619/LTC2629 operate in both the standard mode (clock rate of 100kHz) and the fast mode (clock rate of 400kHz). The LTC2609/LTC2619/LTC2629 incorporate a power-on reset circuit. During power-up, the voltage outputs rise less than 10mV above zero-scale; after power-up, they stay at zero-scale until a valid write and update take place. The power-on reset circuit resets the LTC2609-1/LTC2619‑1/ LTC2629-1 to mid-scale. The voltage outputs stay at midscale until a valid write and update take place. Applications L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 5396245. Patent pending. Mobile Communications n Process Control and Industrial Automation n Automatic Test Equipment and Instrumentation n Block Diagram REFLO REFA 2 GND 1 VCC 16 REFD 15 VOUTD DAC REGISTER INPUT REGISTER DAC REGISTER INPUT REGISTER INPUT REGISTER DAC B REFB DAC D Differential Nonlinearity (LTC2609) 14 1.0 VOUTB 5 INPUT REGISTER DAC A DAC REGISTER VOUTA 4 DAC REGISTER 3 VOUTC DAC C 13 0.6 REFC 12 0.4 DNL (LSB) 6 VCC = 5V VREF = 4.096V 0.8 CONTROL LOGIC 0.2 0 –0.2 –0.4 32-BIT SHIFT REGISTER CA0 11 SCL 8 SDA 9 I2C INTERFACE ADDRESS DECODE LOGIC CA1 10 CA2 7 –0.6 –0.8 –1.0 0 16384 32768 CODE 49152 65535 2609 G02 2609 BD 26091929fb  LTC2609/LTC2619/LTC2629 Absolute Maximum Ratings (Note 1) Any Pin to GND............................................. –0.3V to 6V Any Pin to VCC ............................................ –6V to 0.3V Maximum Junction Temperature........................... 125°C Storage Temperature Range................... –65°C to 125°C Lead Temperature (Soldering, 10 sec)................... 300°C Operating Temperature Range: LTC2609C/LTC2619C/LTC2629C LTC2609C-1/LTC2619C-1/LTC2629C-1..... 0°C to 70°C LTC2609I/LTC2619I/LTC2629I LTC2609I-1/LTC2619I-1/LTC2629I-1.....–40°C to 85°C TOP VIEW GND 1 16 VCC REFLO 2 15 REFD REFA 3 14 VOUTD VOUTA 4 13 VOUTC VOUTB 5 12 REFC REFB 6 11 CA0 CA2 7 10 CA1 SCL 8 9 SDA GN PACKAGE 16-LEAD PLASTIC SSOP TJMAX = 135°C, θJA = 150°C/W Order Information LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2609CGN#PBF LTC2609CGN#TRPBF 2609 16-Lead Plastic SSOP 0°C to 70°C LTC2609CGN-1#PBF LTC2609CGN-1#TRPBF 26091 16-Lead Plastic SSOP 0°C to 70°C LTC2609IGN#PBF LTC2609IGN#TRPBF 2609I 16-Lead Plastic SSOP –40°C to 85°C LTC2609IGN-1#PBF LTC2609IGN-1#TRPBF 2619I1 16-Lead Plastic SSOP –40°C to 85°C LTC2619CGN#PBF LTC2619CGN#TRPBF 2619 16-Lead Plastic SSOP 0°C to 70°C LTC2619CGN-1#PBF LTC2619CGN-1#TRPBF 26191 16-Lead Plastic SSOP 0°C to 70°C LTC2619IGN#PBF LTC2619IGN#TRPBF 2619I 16-Lead Plastic SSOP –40°C to 85°C LTC2619IGN-1#PBF LTC2619IGN-1#TRPBF 2619I1 16-Lead Plastic SSOP –40°C to 85°C LTC2629CGN#PBF LTC2629CGN#TRPBF 2629 16-Lead Plastic SSOP 0°C to 70°C LTC2629CGN-1#PBF LTC2629CGN-1#TRPBF 26291 16-Lead Plastic SSOP 0°C to 70°C LTC2629IGN#PBF LTC2629IGN#TRPBF 2629I 16-Lead Plastic SSOP –40°C to 85°C LTC2629IGN-1#PBF LTC2629IGN-1#TRPBF 2629I1 16-Lead Plastic SSOP –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 26091929fb  LTC2609/LTC2619/LTC2629 Electrical Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. REFA = REFB = REFC = REFD = 4.096V (VCC = 5V), REFA = REFB = REFC = REFD = 2.048V (VCC = 2.7V). REFLO = 0V, VOUT = unloaded, unless otherwise noted. SYMBOL PARAMETER DC Performance Resolution Monotonicity DNL Differential Nonlinearity INL Integral Nonlinearity Load Regulation ZSE VOS GE Zero-Scale Error Offset Error VOS Temperature Coefficient Gain Error Gain Temperature Coefficient LTC2629/LTC2629-1 LTC2619/LTC2619-1 LTC2609/LTC2609-1 MIN TYP MAX MIN TYP MAX MIN TYP MAX CONDITIONS l (Note 2) (Note 2) (Note 2) VREF = VCC = 5V, Mid-Scale IOUT = 0mA to 15mA Sourcing IOUT = 0mA to 15mA Sinking VREF = VCC = 2.7V, Mid-Scale IOUT = 0mA to 7.5mA Sourcing IOUT = 0mA to 7.5mA Sinking Code = 0 (Note 4) l 12 12 14 14 16 16 UNITS Bits Bits LSB LSB ±0.5 ±4 ±4 ±1 ±16 ±16 ±1 ±64 l l 0.02 0.125 0.02 0.125 0.1 0.1 0.5 0.5 0.3 0.4 2 2 LSB/mA LSB/mA l l 0.04 0.05 1.5 ±1 ±6 0.25 0.25 9 ±9 0.2 0.2 1.5 ±1 ±6 1 1 9 ±9 0.7 0.8 1.5 ±1 ±6 4 4 9 ±9 LSB/mA LSB/mA mV mV µV/°C ±0.1 ±3 ±0.7 ±0.1 ±3 ±0.7 ±0.1 ±3 ±0.7 %FSR ppm/°C l l l l l ±1 The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. REFA = REFB = REFC = REFD = 4.096V (VCC = 5V), REFA = REFB = REFC = REFD = 2.048V (VCC = 2.7V). REFLO = 0V, VOUT = unloaded, unless otherwise noted. (Note 9) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS PSR Power Supply Rejection VCC ±10% ROUT DC Output Impedance VREF = VCC = 5V, Mid-Scale; –15mA ≤ IOUT ≤ 15mA VREF = VCC = 2.7V, Mid-Scale; –7.5mA ≤ IOUT ≤ 7.5mA DC Crosstalk (Note 10) Due to Full-Scale Output Change (Note 11) Due to Load Current Change Due to Powering Down (Per Channel) Short-Circuit Output Current VCC = 5.5V, VREF = 5.5V Code: Zero-Scale; Forcing Output to VCC Code: Full-Scale; Forcing Output to GND l l 15 15 36 36 60 60 mA mA VCC = 2.7V, VREF = 2.7V Code: Zero-Scale; Forcing Output to VCC Code: Full-Scale; Forcing Output to GND l l 7.5 7.5 22 30 50 50 mA mA l 0 VCC V l 88 160 kΩ ISC –80 0.030 0.035 l l dB 0.15 0.15 ±5 ±4 ±4 Ω Ω µV µV/mA µV Reference Input Input Voltage Range Resistance Normal Mode Capacitance IREF Reference Current, Power Down Mode 125 14 DAC Powered Down l 0.001 pF 1 µA Power Supply VCC Positive Supply Voltage For Specified Performance l ICC Supply Current VCC = 5V (Note 3) VCC = 3V (Note 3) DAC Powered Down (Note 3) VCC = 5V DAC Powered Down (Note 3) VCC = 3V l l l l 2.7 1.25 1 0.35 0.15 5.5 V 2 1.6 1 1 mA mA µA µA 26091929fb  LTC2609/LTC2619/LTC2629 Electrical Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. REFA = REFB = REFC = REFD = 4.096V (VCC = 5V), REFA = REFB = REFC = REFD = 2.048V (VCC = 2.7V). REFLO = 0V, VOUT = unloaded, unless otherwise noted. (Note 9) Digital I/O (Note 9) VIL Low Level Input Voltage (SDA and SCL) l VIH High Level Input Voltage (SDA and SCL) l VIL(CAn) Low Level Input Voltage on CAn (n = 0, 1, 2) See Test Circuit 1 l VIH(CAn) High Level Input Voltage on CAn (n = 0, 1, 2) See Test Circuit 1 l RINH Resistance from CAn (n = 0, 1, 2) to VCC to Set CAn = VCC See Test Circuit 2 l 10 kΩ RINL Resistance from CAn (n = 0, 1, 2) to GND to Set CAn = GND See Test Circuit 2 l 10 kΩ RINF Resistance from CAn (n = 0, 1, 2) to VCC or GND to Set CAn = Float See Test Circuit 2 l VOL Low Level Output Voltage Sink Current = 3mA l 0 0.4 V tOF Output Fall Time VO = VIH(MIN) to VO = VIL(MAX), CB = 10pF to 400pF (Note 7) l 20 + 0.1CB 250 ns tSP Pulse Width of Spikes Suppressed by Input Filter l 0 50 ns IIN Input Leakage 0.1VCC ≤ VIN ≤ 0.9VCC l 1 µA CIN I/O Pin Capacitance (Note 12) l 10 pF CB Capacitive Load for Each Bus Line l 400 pF CCAX External Capacitive Load on Address Pins CAn (n = 0, 1, 2) l 10 pF 0.3VCC V 0.7VCC V 0.15VCC V 0.85VCC V 2 MΩ The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. REFA = REFB = REFC = REFD = 4.096V (VCC = 5V), REFA = REFB = REFC = REFD = 2.048V (VCC = 2.7V). REFLO = 0V, VOUT = unloaded, unless otherwise noted. SYMBOL PARAMETER AC Performance Settling Time (Note 5) tS Settling Time for 1LSB Step (Note 6) en Voltage Output Slew Rate Capacitive Load Driving Glitch Impulse Multiplying Bandwidth Output Voltage Noise Density Output Voltage Noise CONDITIONS ±0.024% (±1LSB at 12 Bits) ±0.006% (±1LSB at 14 Bits) ±0.0015% (±1LSB at 16 Bits) ±0.024% (±1LSB at 12 Bits) ±0.006% (±1LSB at 14 Bits) ±0.0015% (±1LSB at 16 Bits) At Mid-Scale Transition At f = 1kHz At f = 10kHz 0.1Hz to 10Hz LTC2629/LTC2629-1 LTC2619/LTC2619-1 LTC2609/LTC2609-1 MIN TYP MAX MIN TYP MAX MIN TYP MAX 7 7 9 2.7 2.7 4.8 0.7 1000 12 180 120 100 15 0.7 1000 12 180 120 100 15 7 9 10 2.7 4.8 5.2 0.7 1000 12 180 120 100 15 UNITS µs µs µs µs µs µs V/µs pF nV • s kHz nV/√Hz nV/√Hz µVP-P 26091929fb  LTC2609/LTC2619/LTC2629 Timing Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (See Figure 1) (Notes 8, 9) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 400 kHz VCC = 2.7V to 5.5V fSCL SCL Clock Frequency l 0 tHD(STA) Hold Time (Repeated) Start Condition l 0.6 µs tLOW Low Period of the SCL Clock Pin l 1.3 µs tHIGH High Period of the SCL Clock Pin l 0.6 µs tSU(STA) Set-Up Time for a Repeated Start Condition l 0.6 µs tHD(DAT) Data Hold Time l 0 tSU(DAT) Data Set-Up Time l 100 tr Rise Time of Both SDA and SCL Signals (Note 7) l 20 + 0.1CB 300 tf Fall Time of Both SDA and SCL Signals (Note 7) l 20 + 0.1CB 300 tSU(STO) Set-Up Time for Stop Condition l 0.6 µs tBUF Bus Free Time Between a Stop and Start Condition l 1.3 µs t1 Falling Edge of 9th Clock of the 3rd Input Byte to LDAC High or Low Transition l 400 ns t2 LDAC Low Pulse Width l 20 ns Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: Linearity and monotonicity are defined from code kL to code 2N – 1, where N is the resolution and kL is given by kL = 0.016(2N/VREF), rounded to the nearest whole code. For VREF = 4.096V and N = 16, kL = 256 and linearity is defined from code 256 to code 65,535. Note 3: SDA, SCL at 0V or VCC, CA0, CA1 and CA2 floating. Note 4: Inferred from measurement at code kL (see Note 2) and at full-Scale. Note 5: VCC = 5V, VREF = 4.096V. DAC is stepped 1/4 scale to 3/4 scale and 3/4 scale to 1/4 scale. Load is 2k in parallel with 200pF to GND. 0.9 µs ns ns ns Note 6: VCC = 5V, VREF = 4.096V. DAC is stepped ±1LSB between half scale and half scale – 1. Load is 2k in parallel with 200pF to GND. Note 7: CB = capacitance of one bus line in pF. Note 8: All values refer to VIH(MIN) and VIL(MAX) levels. Note 9: These specifications apply to LTC2609/LTC2609-1, LTC2619/LTC2619-1, LTC2629/LTC2629-1. Note 10: DC crosstalk is measured with VCC = 5V, REFA = REFB = REFC = REFD = 4.096V, with the measured DAC at mid-scale, unless otherwise noted. Note 11: RL = 2kΩ to GND or VCC. Note 12: Guaranteed by design and not production tested. 26091929fb  LTC2609/LTC2619/LTC2629 Typical Performance Characteristics LTC2609 Integral Nonlinearity (INL) 32 Differential Nonlinearity (DNL) 1.0 VCC = 5V VREF = 4.096V 24 16 0.4 –8 0.2 INL (LSB) DNL (LSB) 0 0 –0.2 –0.4 –16 16384 32768 CODE 49152 –1.0 65535 0 16384 32768 CODE 49152 2609 G01 –10 10 30 50 TEMPERATURE (°C) 70 90 DNL vs VREF 1.5 VCC = 5.5V 24 0.6 VCC = 5.5V 1.0 16 0.4 DNL (POS) 0.2 INL (LSB) DNL (LSB) –30 2609 G03 INL vs VREF 32 VCC = 5V VREF = 4.096V 0 –0.2 DNL (NEG) –0.4 0.5 INL (POS) 8 0 –8 INL (NEG) DNL (POS) 0 DNL (NEG) –0.5 –16 –0.6 –1.0 –24 –0.8 –1.0 –50 INL (NEG) –32 –50 65535 DNL (LSB) 0.8 –8 2609 G02 DNL vs Temperature 1.0 0 –24 –0.8 0 INL (POS) 8 –16 –0.6 –24 VCC = 5V VREF = 4.096V 24 0.6 8 INL (LSB) VCC = 5V VREF = 4.096V 0.8 16 –32 INL vs Temperature 32 –30 –10 10 30 50 TEMPERATURE (°C) 70 90 –32 0 2609 G04 1 2 3 VREF (V) 4 5 VOUT 100µV/DIV 2µs/DIV VCC = 5V, VREF = 4.096V 1/4 SCALE TO 3/4 SCALE STEP RL = 2k, CL = 200pF AVERAGE OF 2048 EVENTS 2 3 VREF (V) 4 5 2609 G06 Settling of Full-Scale Step VOUT 100µV/DIV SCL 2V/DIV 1 0 2609 G05 Settling to ±1LSB 9TH CLOCK OF 3RD DATA BYTE –1.5 9.7µs SCR 2V/DIV 2609 G07 12.3µs 9TH CLOCK OF 3RD DATA BYTE 5µs/DIV 2609 G08 SETTLING TO ±1LSB VCC = 5V, VREF = 4.096V CODE 512 TO 65535 STEP AVERAGE OF 2048 EVENTS 26091929fb  LTC2609/LTC2619/LTC2629 Typical Performance Characteristics LTC2619 Integral Nonlinearity (INL) 8 Differential Nonlinearity (DNL) 1.0 VCC = 5V VREF = 4.096V 6 0.6 0.4 2 DNL (LSB) INL (LSB) VCC = 5V VREF = 4.096V 0.8 4 0 –2 VOUT 100µV/DIV 0.2 0 SCL 2V/DIV –0.2 –0.4 –4 –0.6 –6 –8 Settling to ±1LSB 4096 8192 CODE 12288 –1.0 16383 8.9µs 2µs/DIV –0.8 0 9TH CLOCK OF 3RD DATA BYTE 0 4096 8192 CODE 12288 2609 G09 2609 G11 VCC = 5V, VREF = 4.096V 1/4 SCALE TO 3/4 SCALE STEP RL = 2k, CL = 200pF AVERAGE OF 2048 EVENTS 16383 2609 G10 LTC2629 Integral Nonlinearity (INL) 2.0 Differential Nonlinearity (DNL) 1.0 VCC = 5V VREF = 4.096V 1.5 VCC = 5V VREF = 4.096V 0.8 0.6 1.0 0.4 0.5 DNL (LSB) INL (LSB) Settling to ±1LSB 0 –0.5 0.2 0 SCL 2V/DIV –0.2 –0.4 –1.0 –0.6 –1.5 –0.8 –2.0 –1.0 0 1024 2048 CODE 3072 4095 2609 G12 6.8µs VOUT 1mV/DIV 9TH CLOCK OF 3RD DATA BYTE 2µs/DIV 0 1024 2048 CODE 3072 4095 2609 G14 VCC = 5V, VREF = 4.096V 1/4 SCALE TO 3/4 SCALE STEP RL = 2k, CL = 200pF AVERAGE OF 2048 EVENTS 2609 G13 26091929fb  LTC2609/LTC2619/LTC2629 Typical Performance Characteristics LTC2609/LTC2619/LTC2629 Current Limiting 0.08 CODE = MID-SCALE 0.8 VREF = VCC = 5V 0.06 ΔVOUT (mV) 0 VREF = VCC = 3V –0.04 2 0.2 0 –0.2 VREF = VCC = 5V –0.4 VREF = VCC = 5V –0.06 CODE = MID-SCALE 0.4 0.02 –0.02 Offset Error vs Temperature 3 0.6 VREF = VCC = 3V 0.04 ΔVOUT (V) Load Regulation 1.0 VREF = VCC = 3V –0.6 –0.08 OFFSET ERROR (mV) 0.10 20 30 –1.0 –35 40 –25 –15 –5 5 IOUT (mA) 15 25 2609 G15 Zero-Scale Error vs Temperature 1.5 1.0 0.5 0.1 0 –0.1 –0.2 –30 –10 10 30 50 TEMPERATURE (°C) 70 2609 G18 –1 –3 2.5 90 3 3.5 4 VCC (V) 4.5 5 5.5 2609 G20 ICC Shutdown vs VCC 450 0.3 400 0.2 350 0.1 300 ICC (nA) GAIN ERROR (%FSR) 0 2609 G19 Gain Error vs VCC 0 –0.1 250 200 150 –0.2 100 –0.3 –0.4 2.5 1 –2 –0.4 –50 90 90 2 0.2 –0.3 0.4 70 Offset Error vs VCC OFFSET ERROR (mV) GAIN ERROR (%FSR) 2.0 70 –10 10 30 50 TEMPERATURE (°C) 3 0.3 –10 10 30 50 TEMPERATURE (°C) –30 2609 G17 Gain Error vs Temperature 2.5 ZERO-SCALE ERROR (mV) –3 –50 35 0.4 –30 –1 2609 G16 3 0 –50 0 –2 –0.8 –0.10 10 –40 –30 –20 –10 0 IOUT (mA) 1 50 3 3.5 4 VCC (V) 4.5 5 5.5 2609 G21 0 2.5 3 3.5 4 VCC (V) 4.5 5 5.5 2609 G22 26091929fb  LTC2609/LTC2619/LTC2629 Typical Performance Characteristics LTC2609/LTC2619/LTC2629 Large-Signal Response Mid-Scale Glitch Impulse Power-On Reset Glitch TRANSITION FROM MS-1 TO MS VOUT 10mV/DIV VOUT 0.5V/DIV SCL 2V/DIV VREF = VCC = 5V 1/4 SCALE TO 3/4 SCALE 2609 G23 2.5µs/DIV TRANSITION FROM MS TO MS-1 2.5µs/DIV Headroom at Rails vs Output Current 4mV PEAK VOUT 10mV/DIV 2609 G24 250µs/DIV Power-On Reset to Mid-Scale 5.0 1.7 2.5 ICC (mA) VOUT (V) 1.6 3V SOURCING 3.0 1V/DIV 2.0 1.5 1.4 1.3 1.5 1.0 5V SINKING 0.5 0 VCC = 5V SWEEP SCL AND SDA 0V TO VCC AND VCC TO 0V 1.8 4.0 3.5 2609 G25 Supply Current vs Logic Voltage 1.9 VREF = VCC 5V SOURCING 4.5 9TH CLOCK OF 3RD DATA BYTE VCC 1V/DIV 3V SINKING 0 1 2 3 4 5 6 IOUT (mA) 7 8 9 10 2609 G26 VCC 1.2 VOUT 1.1 500µs/DIV 2606 G27 1.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 LOGIC VOLTAGE (V) 5 2609 G28 26091929fb  LTC2609/LTC2619/LTC2629 Typical Performance Characteristics LTC2609/LTC2619/LTC2629 Output Voltage Noise, 0.1Hz to 10Hz Multiplying Bandwidth 0 –3 –6 –9 –12 VOUT 10µV/DIV dB –15 –18 –21 –24 –27 VCC = 5V VREF (DC) = 2V VREF (AC) = 0.2VP-P CODE = FULL SCALE –30 –33 –36 0 2 3 4 5 6 SECONDS 7 8 9 10 2609 G30 1M 10k 100k FREQUENCY (Hz) 1k 1 2609 G29 Short-Circuit Output Current vs VOUT (Sinking) 50 0 VCC = 5.5V VREF = 5.6V CODE = 0 VOUT SWEPT 0V TO VCC 40 30 20 10 0 VCC = 5.5V VREF = 5.6V CODE = FULL-SCALE VOUT SWEPT VCC TO 0V –10 10mA/DIV 10mA/DIV Short-Circuit Output Current vs VOUT (Sourcing) –20 –30 –40 0 1 2 3 1V/DIV 4 5 6 2609 G31 –50 0 1 2 3 1V/DIV 4 5 6 2609 G32 26091929fb 10 LTC2609/LTC2619/LTC2629 Pin Functions GND (Pin 1): Analog Ground. REFLO (Pin 2): Reference Low. The voltage at this pin sets the zero-scale (ZS) voltage of all DACs. This pin can be raised up to 1V above ground at VCC = 5V or 100mV above ground at VCC = 3V. REFA to REFD (Pins 3, 6, 12, 15): Reference Voltage Inputs for each DAC. REFx sets the full-scale voltage of the DACs. REFLO ≤ REFx ≤ VCC . VOUTA to VOUTD (Pins 4, 5, 13, 14): DAC Analog Voltage Outputs. The output range is from REFLO to REFx. CA2 (Pin 7): Chip Address Bit 2. Tie this pin to VCC , GND or leave it floating to select an I2C slave address for the part (Table 1). SDA (Pin 9): Serial Data Bidirectional Pin. Data is shifted into the SDA pin and acknowledged by the SDA pin. This pin is high impedance pin while data is shifted in and is an open-drain N-channel output during acknowledgment. SDA requires a pull-up resistor or current source to VCC . CA1 (Pin 10): Chip Address Bit 1. Tie this pin to VCC, GND or leave it floating to select an I2C slave address for the part (Table 1). CA0 (Pin 11): Chip Address Bit 0. Tie this pin to VCC , GND or leave it floating to select an I2C slave address for the part (Table 1). VCC (Pin 16): Supply Voltage Input. 2.7V ≤ VCC ≤ 5.5V. SCL (Pin 8): Serial Clock Input Pin. Data is shifted into the SDA pin at the rising edges of the clock. This high impedance pin requires a pull-up resistor or current source to VCC. 26091929fb 11 LTC2609/LTC2619/LTC2629 Block Diagram REFLO REFA 2 GND 1 VCC 16 REFD 15 VOUTD DAC A DAC REGISTER INPUT REGISTER INPUT REGISTER DAC REGISTER DAC D DAC B INPUT REGISTER INPUT REGISTER DAC REGISTER VOUTA 4 DAC REGISTER 3 DAC C VOUTB 5 REFB 14 VOUTC 13 REFC 12 6 CONTROL LOGIC 32-BIT SHIFT REGISTER CA0 11 SCL 8 SDA 9 I2C INTERFACE ADDRESS DECODE LOGIC CA1 10 CA2 7 2609 BD 26091929fb 12 LTC2609/LTC2619/LTC2629 Test Circuits Test Circuit 1 Test Circuit 2 VDD 100Ω RINH/RINL/RINF CAn CAn VIH(CAn)/VIL(CAn) GND 2609 TC Timing Diagram SDA tf tLOW tSU(DAT) tr tf tHD(STA) tSP tr tBUF SCL S tHD(STA) tHD(DAT) tHIGH tSU(STA) S tSU(STO) P S 2609 F01 ALL VOLTAGE LEVELS REFER TO VIH(MIN) AND VIL(MAX) LEVELS Figure 1 26091929fb 13 LTC2609/LTC2619/LTC2629 Operation Power-On Reset The LTC2609/LTC2619/LTC2629 clear the outputs to zero-scale when power is first applied, making system initialization consistent and repeatable. The LTC2609-1/ LTC2619‑1/LTC2629-1 set the voltage outputs to mid-scale when power is first applied. For some applications, downstream circuits are active during DAC power-up and may be sensitive to nonzero outputs from the DAC during this time. The LTC2609/LTC2619/ LTC2629 contain circuitry to reduce the power-on glitch; furthermore, the glitch amplitude can be made arbitrarily small by reducing the ramp rate of the power supply. For example, if the power supply is ramped to 5V in 1ms, the analog outputs rise less than 10mV above ground (typ) during power-on. See Power-On Reset Glitch in the Typical Performance Characteristics section. Power Supply Sequencing The voltage at REFx (Pins 3, 6, 12 and 15) should be kept within the range –0.3V ≤ REFx ≤ VCC + 0.3V (see Absolute Maximum Ratings). Particular care should be taken to observe these limits during power supply turn-on and turn-off sequences, when the voltage at VCC (Pin 16) is in transition. The REFx pins can be clamped to stay below the maximum voltage by using Schottky diodes as shown in Figure 2, thereby easing sequencing constraints. VCC LTC2609/ LTC2619/ LTC2629 REFA REFB REFC REFD 16 3 6 12 15 VCC REFA REFB REFC REFD 2609 F02 Figure 2. Use of Schottky Diodes for Power Supply Sequencing Transfer Function The digital-to-analog transfer function is:  k  VOUT (IDEAL) =   [REFx – REFLO] + REFLO  2N  where k is the decimal equivalent of the binary DAC input code, N is the resolution and REFx is the voltage at REFA, REFB, REFC and REFD (Pins 3, 6, 12 and 15). Serial Digital Interface The LTC2609/LTC2619/LTC2629 communicate with a host using the standard 2-wire I2C interface. The Timing Diagram (Figure 1) shows the timing relationship of the signals on the bus. The two bus lines, SDA and SCL, must be high when the bus is not in use. External pull-up resistors or current sources are required on these lines. The value of these pull-up resistors is dependent on the power supply and can be obtained from the I2C specifications. For an I2C bus operating in the fast mode, an active pull-up will be necessary if the bus capacitance is greater than 200pF. The VCC power should not be removed from the LTC2609/LTC2619/LTC2629 when the I2C bus is active to avoid loading the I2C bus lines through the internal ESD protection diodes. The LTC2609/LTC2619/LTC2629 are receive-only (slave) devices. The master can write to the LTC2609/LTC2619/ LTC2629. The LTC2609/LTC2619/LTC2629 do not respond to a read from the master. The START (S) and STOP (P) Conditions When the bus is not in use, both SCL and SDA must be high. A bus master signals the beginning of a communication to a slave device by transmitting a START condition. A START condition is generated by transitioning SDA from high to low while SCL is high. When the master has finished communicating with the slave, it issues a STOP condition. A STOP condition is generated by transitioning SDA from low to high while SCL is high. The bus is then free for communication with another I2C device. Acknowledge The Acknowledge signal is used for handshaking between the master and the slave. An Acknowledge (active LOW) generated by the slave lets the master know that the latest byte of information was received. The Acknowledge related clock pulse is generated by the master. The master releases the SDA line (HIGH) during the Acknowledge clock pulse. The slave-receiver must pull down the SDA bus line 26091929fb 14 LTC2609/LTC2619/LTC2629 Operation during the Acknowledge clock pulse so that it remains a stable LOW during the HIGH period of this clock pulse. The LTC2609/LTC2619/LTC2629 respond to a write by a master in this manner. The LTC2609/LTC2619/LTC2629 do not acknowledge a read (retains SDA HIGH during the period of the Acknowledge clock pulse). Chip Address The state of CA0, CA1 and CA2 decides the slave address of the part. The pins CA0, CA1 and CA2 can be each set to any one of three states: VCC, GND or float. This results in 27 selectable addresses for the part. The slave address assignments are shown in Table 1. Table 1. Slave Address Map CA2 CA1 CA0 SA6 SA5 SA4 SA3 SA2 SA1 SA0 GND GND GND 0 0 1 0 0 0 0 GND GND FLOAT 0 0 1 0 0 0 1 GND GND VCC 0 0 1 0 0 1 0 GND FLOAT GND 0 0 1 0 0 1 1 GND FLOAT FLOAT 0 1 0 0 0 0 0 GND FLOAT VCC 0 1 0 0 0 0 1 GND VCC GND 0 1 0 0 0 1 0 GND VCC FLOAT 0 1 0 0 0 1 1 GND VCC VCC 0 1 1 0 0 0 0 FLOAT GND GND 0 1 1 0 0 0 1 FLOAT GND FLOAT 0 1 1 0 0 1 0 FLOAT GND VCC 0 1 1 0 0 1 1 FLOAT FLOAT GND 1 0 0 0 0 0 0 FLOAT FLOAT FLOAT 1 0 0 0 0 0 1 FLOAT FLOAT VCC 1 0 0 0 0 1 0 FLOAT VCC GND 1 0 0 0 0 1 1 FLOAT VCC FLOAT 1 0 1 0 0 0 0 FLOAT VCC VCC 1 0 1 0 0 0 1 VCC GND GND 1 0 1 0 0 1 0 VCC GND FLOAT 1 0 1 0 0 1 1 VCC GND VCC 1 1 0 0 0 0 0 VCC FLOAT GND 1 1 0 0 0 0 1 VCC FLOAT FLOAT 1 1 0 0 0 1 0 VCC FLOAT VCC 1 1 0 0 0 1 1 VCC VCC GND 1 1 1 0 0 0 0 VCC VCC FLOAT 1 1 1 0 0 0 1 VCC VCC VCC 1 1 1 0 0 1 0 1 1 1 0 0 1 1 GLOBAL ADDRESS In addition to the address selected by the address pins, the parts also respond to a global address. This address allows a common write to all LTC2609, LTC2619 and LTC2629 parts to be accomplished with one 3-byte write transaction on the I2C bus. The global address is a 7-bit on-chip hardwired address and is not selectable by CA0, CA1 and CA2. The addresses corresponding to the states of CA0, CA1 and CA2 and the global address are shown in Table 1. The maximum capacitive load allowed on the address pins (CA0, CA1 and CA2) is 10pF, as these pins are driven during address detection to determine if they are floating. Write Word Protocol The master initiates communication with the LTC2609/ LTC2619/LTC2629 with a START condition and a 7-bit slave address followed by the Write bit (W) = 0. The LTC2609/ LTC2619/LTC2629 acknowledges by pulling the SDA pin low at the 9th clock if the 7-bit slave address matches the address of the parts (set by CA0, CA1 and CA2) or the global address. The master then transmits three bytes of data. The LTC2609/LTC2619/LTC2629 acknowledges each byte of data by pulling the SDA line low at the 9th clock of each data byte transmission. After receiving three complete bytes of data, the LTC2609/LTC2619/LTC2629 executes the command specified in the 24-bit input word. If more than three data bytes are transmitted after a valid 7-bit slave address, the LTC2609/LTC2619/LTC2629 do not acknowledge the extra bytes of data (SDA is high during the 9th clock). The format of the three data bytes is shown in Figure 3. The first byte of the input word consists of the 4-bit command and 4-bit DAC address. The next two bytes consist of the 16-bit data word. The 16-bit data word consists of the 16-, 14- or 12-bit input code, MSB to LSB, followed by 0, 2 or 4 don’t care bits (LTC2609, LTC2619 and LTC2629 respectively). A typical LTC2609 write transaction is shown in Figure 4. The command (C3-C0) and address (A3-A0) assignments are shown in Table 2. The first four commands in the table consist of write and update operations. A write operation 26091929fb 15 LTC2609/LTC2619/LTC2629 Operation Write Word Protocol for LTC2609/LTC2619/LTC1629 S SLAVE ADDRESS W A 1ST DATA BYTE A 2ND DATA BYTE C2 C1 C0 A3 A2 3RD DATA BYTE A P INPUT WORD Input Word (LTC2609) C3 A A1 A0 D15 D14 D13 D12 D11 D10 D9 1ST DATA BYTE D8 D7 D6 D5 2ND DATA BYTE D4 D3 D2 D1 D0 3RD DATA BYTE Input Word (LTC2619) C3 C2 C1 C0 A3 A2 A1 A0 D13 D12 D11 D10 D9 1ST DATA BYTE D8 D7 D6 D5 D4 D3 2ND DATA BYTE D2 D1 D0 X X X X 3RD DATA BYTE Input Word (LTC2629) C3 C2 C1 C0 A3 A2 A1 A0 D11 D10 D9 1ST DATA BYTE D8 D7 D6 D5 D4 D3 D2 D1 2ND DATA BYTE D0 X X 3RD DATA BYTE 2609 F03 Figure 3 Power-Down Mode Table 2 COMMAND* C3 C2 C1 C0 0 0 0 0 Write to Input Register n 0 0 0 1 Update (Power Up) DAC Register n 0 0 1 0 Write to Input Register n, Update (Power Up) All n 0 0 1 1 Write to and Update (Power Up) n 0 1 0 0 Power Down n 1 1 1 1 No Operation ADDRESS (n)* A3 A2 A1 A0 0 0 0 0 DAC A 0 0 0 1 DAC B 0 0 1 0 DAC C 0 0 1 1 DAC D 1 1 1 1 All DACs *Command and address codes not shown are reserved and should not be used. loads a 16-bit data word from the 32-bit shift register into the input register of the selected DAC, n. An update operation copies the data word from the input register to the DAC register. Once copied into the DAC register, the data word becomes the active 16-, 14- or 12-bit input code, and is converted to an analog voltage at the DAC output. The update operation also powers up the selected DAC if it had been in power-down mode. The data path and registers are shown in the Block Diagram. For power-constrained applications, power-down mode can be used to reduce the supply current whenever less than four outputs are needed. When in power-down, the buffer amplifiers, bias circuits and reference inputs are disabled, and draw essentially zero current. The DAC outputs are put into a high impedance state, and the output pins are passively pulled to REFLO through individual 90k resistors. Input- and DAC-register contents are not disturbed during power down. Any channel or combination of channels can be put into power-down mode by using command 0100b in combination with the appropriate DAC address, (n). The 16-bit data word is ignored. The supply current is reduced by approximately 1/4 for each DAC powered down. The effective resistance at REFx (Pins 3, 6, 12 and 15) are at high impedance (typically > 1GΩ) when the corresponding DACs are powered down. Normal operation can be resumed by executing any command which includes a DAC update, as shown in Table 2. The selected DAC is powered up as its voltage output is updated. When a DAC which is in a powered-down state is powered up and updated, normal settling is delayed. If less than four DACs are in a powered-down state prior to the update command, the power-up delay time is 5µs. If on the other hand, all four DACs are powered down, then the 26091929fb 16 LTC2609/LTC2619/LTC2629 Operation main bias generation circuit block has been automatically shut down in addition to the individual DAC amplifiers and reference inputs. In this case, the power-up delay time is 12µs (for VCC = 5V) or 30µs (for VCC = 3V). Voltage Output The rail-to-rail amplifier has guaranteed load regulation when sourcing or sinking up to 15mA at 5V (7.5mA at 2.7V). Load regulation is a measure of the amplifier’s ability to maintain the rated voltage accuracy over a wide range of load conditions. The measured change in output voltage per milliampere of forced load current change is expressed in LSB/mA. DC output impedance is equivalent to load regulation, and may be derived from it by simply calculating a change in units from LSB/mA to Ohms. The amplifier’s DC output impedance is 0.035Ω when driving a load well away from the rails. When drawing a load current from either rail, the output voltage headroom with respect to that rail is limited by the 30Ω typical channel resistance of the output devices; e.g., when sinking 1mA, the minimum output voltage = 30Ω • 1mA = 30mV. See the graph Headroom at Rails vs Output Current in the Typical Performance Characteristics section. The amplifier is stable driving capacitive loads of up to 1000pF. Board Layout The excellent load regulation and DC crosstalk performance of these devices is achieved in part by keeping “signal” and “power” grounds separate. The PC board should have separate areas for the analog and digital sections of the circuit. This keeps digital signals away from sensitive analog signals and facilitates the use of separate digital and analog ground planes which have minimal capacitive and resistive interaction with each other. Digital and analog ground planes should be joined at only one point, establishing a system star ground as close to the device’s ground pin as possible. Ideally, the analog ground plane should be located on the component side of the board, and should be allowed to run under the part to shield it from noise. Analog ground should be a continuous and uninterrupted plane, except for necessary lead pads and vias, with signal traces on another layer. The GND pin functions as a return path for power supply currents in the device and should be connected to analog ground. Resistance from the GND pin to system star ground should be as low as possible. When a zero-scale DAC output voltage of zero is desired, REFLO (Pin 2) should be connected to system star ground. Rail-to-Rail Output Considerations In any rail-to-rail voltage output device, the output is limited to voltages within the supply range. Since the analog output of the device cannot go below ground, it may limit for the lowest codes as shown in Figure 4b. Similarly, limiting can occur near full-scale when the REF pins are tied to VCC. If REFx = VCC and the DAC full-scale error (FSE) is positive, the output for the highest codes limits at VCC as shown in Figure 4c. No full-scale limiting can occur if REFx is less than VCC – FSE. Offset and linearity are defined and tested over the region of the DAC transfer function where no output limiting can occur. 26091929fb 17 18 X = DON’T CARE 2 1 SCL 3 SA4 4 SA3 SA3 5 SA2 SA2 6 SA1 SA1 SLAVE ADDRESS SA4 7 SA0 SA0 8 WR 1 C3 2 C2 C2 3 C1 C1 4 C0 C0 5 A3 A3 COMMAND 6 A2 A2 7 A1 A1 8 A0 A0 9 ACK 1 D15 2 D14 3 D13 4 5 D11 MS DATA D12 6 D10 7 D9 8 D8 9 ACK 1 D7 2 D6 3 D5 Figure 4. Typical LTC2609 Input Waveform—Programming DAC Output for Full-Scale 9 ACK C3 4 5 D3 LS DATA D4 6 D2 7 D1 8 D0 9 ACK ZERO-SCALE VOLTAGE 2609 F04 FULL-SCALE VOLTAGE STOP Operation VOUT SA5 SA6 SA5 SDA START SA6 LTC2609/LTC2619/LTC2629 26091929fb NEGATIVE OFFSET 0V OUTPUT VOLTAGE 0 (5a) 32, 768 INPUT CODE 65, 535 (5c) INPUT CODE Figure 5. Effects of Rail-to-Rail Operation on a DAC Transfer Curve. (5a) Overall Transfer Function, (5b) Effect of Negative Offset for Codes Near Zero-Scale, (5c) Effect of Positive Full-Scale Error for Codes Near Full-Scale (5b) INPUT CODE OUTPUT VOLTAGE REFx = VCC REFx = VCC 2609 F05 OUTPUT VOLTAGE POSITIVE FSE LTC2609/LTC2619/LTC2629 Operation 26091929fb 19 LTC2609/LTC2619/LTC2629 Typical Application Demo Board Schematic—Onboard 20-Bit ADC Measures Key Performance Parameters REFA JP3 2 1 3 A B 4 5 C 6 1 C1 VCC 0.1µF REFB JP4 REFC JP5 2 1 3 A B 4 5 C 6 REFD JP6 2 1 3 A B 4 5 C 6 ADC REF JP7 2 1 3 A B 4 5 C 6 VREF 2 3 A B 5 C 6 4 VCC 5VREF 16 4.096VREF VCC 11 10 7 9 I2C 8 REFLO 2 4 C6 0.1µF 3 C8 0.1µF VIN VOUT NC NC 6 5 GND GND VIN C10 0.1µF E6 E7 E8 E9 VREF C4 0.1µF C3 100pF C7 1µF 6.3V 4.096VREF C9 1µF 6.3V VCC R5 7.5k LTC2428CG CH0 CH1 CH2 CH3 8-CHANNEL CH4 MUX CH5 CH6 CH7 ZSSET + – 20-BIT ADC GND GND GND GND GND GND GND 1 6 16 18 22 27 28 E11 C5 0.1µF R8 22Ω 2 8 7 4 3 MUXOUT ADCIN FSSET VCC VCC 9 10 11 12 13 14 15 17 5 E10 CSADC CSMUX SCK CLK DIN SD0 F0 VOUTA REFA VOUTB REFB VOUTC REFC VOUTD REFD GND GND JP2 VCC ON/OFF DISABLE ADC 23 20 25 19 21 24 R6 7.5k CS SCK MOSI MISO SPI BUS 26 R7 7.5k 2609 TA02 2 LT1790ACS6-2.048 6 4 VIN VOUT 3 5 NC NC GND GND 1 E5 1 2 LT1790ACS6-4.096 6 4 VIN VOUT 3 5 NC NC 1 E4 GND 5VREF GND GND VIN E3 GND LT1790ACS6-5 1 E2 JP1 REFLO EXT EXT REFLO REFLO VIN 2.048VREF LTC2609CGN 4 CA0 VOUTA 3 CA1 REFA 5 CA2 VOUTB 6 REFB 13 VOUTC 12 REFC 14 SDA VOUTD 15 SCL REFD 2.048VREF C11 1µF 6.3V 2 26091929fb 20 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. LTC2609/LTC2619/LTC2629 Revision History REV DATE DESCRIPTION A 11/09 Update Manufacturer’s Information on Typical Application 1 Revise Receiver Input Hysteresis Conditions 3 Revise Block Diagram 7 Revise Figure 1. 8 Update Manufacturer’s Information on Figure 10 10 Update Tables 1 and 3 12 Revised C- and I-Grade Temperature Ranges in Order Information Section 2 B 3/10 PAGE NUMBER 26091929fb 21 LTC2609/LTC2619/LTC2629 Package Description GN Package 16-Lead Plastic SSOP (Reference LTC DWG # 05-08-1641) .189 – .196* (4.801 – 4.978) .045 p.005 16 15 14 13 12 11 10 9 .254 MIN .009 (0.229) REF .150 – .165 .229 – .244 (5.817 – 6.198) .0165 p.0015 .150 – .157** (3.810 – 3.988) .0250 BSC RECOMMENDED SOLDER PAD LAYOUT 1 .015 p .004 s 45o (0.38 p 0.10) .007 – .0098 (0.178 – 0.249) 2 3 4 5 6 7 .0532 – .0688 (1.35 – 1.75) 8 .004 – .0098 (0.102 – 0.249) 0o – 8o TYP .016 – .050 (0.406 – 1.270) NOTE: 1. CONTROLLING DIMENSION: INCHES INCHES 2. DIMENSIONS ARE IN (MILLIMETERS) 3. DRAWING NOT TO SCALE .0250 (0.635) BSC .008 – .012 (0.203 – 0.305) TYP GN16 (SSOP) 0204 *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE Related Parts PART NUMBER DESCRIPTION COMMENTS LTC1458/LTC1458L Quad 12-Bit Rail-to-Rail Output DACs with Added Functionality LTC1458: VCC = 4.5V to 5.5V, VOUT = 0V to 4.096V LTC1458L: VCC = 2.7V to 5.5V, VOUT = 0V to 2.5V LTC1654 Dual 14-Bit Rail-to-Rail VOUT DAC Programmable Speed/Power, 3.5µs/750µA, 8µs/450µA LTC1655/LTC1655L Single 16-Bit VOUT DACs with Serial Interface in SO-8 VCC = 5V(3V), Low Power, Deglitched LTC1657/LTC1657L Parallel 5V/3V 16-Bit VOUT DACs Low Power, Deglitched, Rail-to-Rail VOUT LTC1660/LTC1665 Octal 10/8-Bit VOUT DACs in 16-Pin Narrow SSOP VCC = 2.7V to 5.5V, Micropower, Rail-to-Rail Output LTC1821 Parallel 16-Bit Voltage Output DAC Precision 16-Bit Settling in 2µs for 10V Step LTC2600/LTC2610 LTC2620 Octal 16-/14-/12-Bit VOUT DACs in 16-Lead SSOP 250µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output, SPI Serial Interface LTC2601/LTC2611 LTC2621 Single 16-/14-/12-Bit VOUT DACs in 10-Lead DFN 250µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output, SPI Serial Interface LTC2602/LTC2612 LTC2622 Dual 16-/14-/12-Bit VOUT DACs in 8-Lead MSOP 300µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output, SPI Serial Interface LTC2604/LTC2614 LTC2624 Quad 16-/14-/12-Bit VOUT DACs in 16-Lead SSOP 250µA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output, SPI Serial Interface LTC2605/LTC2615 LTC2625 Octal 16-/14-/12-Bit VOUT DACs with I2C Interface in 16-Lead SSOP 250µA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail Output LTC2606/LTC2616 LTC2626 Single 16-/14-/12-Bit VOUT DACs in 10-Lead DFN with I2C Interface 270µA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail Output 26091929fb 22 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LT 0310 REV B • PRINTED IN USA  LINEAR TECHNOLOGY CORPORATION 2005