LTC3126
42V, 2.5A Synchronous
Step-Down Regulator with
No-Loss Input PowerPath
Description
Features
Seamless, Automatic Transition Between Two Input
Power Sources
n Wide Input Voltage Range: 2.4V to 42V
n Wide Output Voltage Range: 0.818V to V
IN
n Up to 2.5A Continuous Output Current
n Pin-Selectable Priority and Ideal Diode-OR Modes
n Burst Mode® Operation, I = 2µA
Q
n 95% Efficiency at 1A, V = 12V, V
IN
OUT = 5V
n 1µA Current in Shutdown
n Programmable Input UVLO Thresholds
n Input Valid, Priority Channel and PGOOD Indicators
n 200kHz to 2.2MHz Fixed Frequency PWM
n Synchronizable to an External Clock
n Current Mode Control with 60ns Minimum On-Time
n Minimal External Components
n Thermally Enhanced 28-Lead 4mm × 5mm QFN and
28-Lead TSSOP Packages
n
Applications
n
n
n
n
Portable Industrial/Communications Test Equipment
Battery and Supercapacitor Backup Power
Automotive Power with Battery Backup
Uninterruptible Power Supplies
The LTC®3126 is a high efficiency synchronous buck
converter with an internal no-loss PowerPath™ supporting
seamless operation from two separate input power sources.
Pin-selectable ideal diode-OR and priority input modes
with user programmable undervoltage lockout thresholds
provide full control over the transition between the input
power sources. The fast, automatic switchover provided
by the internal PowerPath eliminates the need for hold-up
capacitors and minimizes disturbances on the output rail.
An active input channel indicator and independent input
and output power good signals provide complete feedback
of the power system status.
A wide 2.4V to 42V input voltage range, 2.5A output current capability and 2µA Burst Mode operation quiescent
current facilitate use of the LTC3126 with a wide variety
of power sources including supercapacitors, automotive batteries, unregulated wall adapters and single to
multicell stacks of most battery chemistries. Additional
features include 1µA current in shutdown, internal softstart and thermal protection. The LTC3126 is available
in thermally enhanced 28-lead 4mm × 5mm QFN and
28-lead TSSOP packages.
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks
and PowerPath is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners.
Typical Application
2MHz, 3.3V/2.5A Supply from Automotive and Battery Inputs
0.1µF
AUTOMOTIVE
10V TO 24V
42V TRANSIENT
15µF
+
BATTERY
4.2V TO 24V +
4.7µF
4.7µF
499k
249k
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
ENA
VREF
PRIORITY
VALID1
VSET1
VALID2
PGOOD
2.2µH
10pF
VOUT
3.3V
47µF 2.5A
1.13M
374k
Switchover to Battery Power, 2.5A Load
VIN1 5V/DIV
VIN2 5V/DIV
AUTOMOTIVE
INPUT UNPLUGGED
VOUT 200mV/DIV
INDUCTOR CURRENT 2A/DIV
PRIORITY 5V/DIV
VSET2
249k
PWM/SYNC
DIODE
GND
50µs/DIV
PGND
RT
3126 TA01b
16.5k
3126 TA01a
3126f
For more information www.linear.com/LTC3126
1
LTC3126
Absolute Maximum Ratings
(Note 1)
PVIN1, PVIN2, VIN1, VIN2..............................................42V
EXTVCC......................................................................42V
VCC, PVCC.....................................................................6V
VREF, VSET1, VSET2, FB, RT...........................................6V
PWM/SYNC, DIODE, ENA............................................6V
VALID1, VALID2, PGOOD, PRIORITY.............................6V
BST1 Pin Above COM1................................................6V
BST2 Pin Above COM2................................................6V
Operating Junction Temperature Range
(Notes 2, 4)............................................. –40°C to 150°C
Storage Temperature.............................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
TSSOP............................................................... 300°C
Pin Configuration
TOP VIEW
VIN2
1
28 VIN1
PWM/SYNC
2
27 PVIN1
VALID1
3
26 DIODE
VALID2
4
25 BST1
VCC
5
24 COM1
PVCC
6
23 SW
19 PGND
EXTVCC
7
18 PGND
VSET1
8
17 SW
VSET2
9
DIODE
PVIN1
VIN1
VIN2
PWM/SYNC
VALID1
TOP VIEW
28 27 26 25 24 23
VALID2 1
22 BST1
VCC 2
21 COM1
PVCC 3
20 SW
EXTVCC 4
29
PGND
VSET1 5
VSET2 6
29
PGND
22 PGND
21 PGND
20 SW
VREF 7
16 COM2
VREF 10
19 COM2
GND 8
15 BST2
GND 11
18 BST2
ENA
PVIN2
PRIORITY
PGOOD
FB
RT
9 10 11 12 13 14
17 ENA
16 PVIN2
PGOOD 14
UFD PACKAGE
28-LEAD (4mm × 5mm) PLASTIC QFN
TJMAX = 150°C, θJA = 34°C/W
EXPOSED PAD (PIN 29) IS PGND, MUST BE SOLDERED TO PCB
Order Information
FB 12
RT 13
15 PRIORITY
FE PACKAGE
28-LEAD PLASTIC TSSOP
TJMAX = 150°C, θJA = 30°C/W
EXPOSED PAD (PIN 29) IS PGND, MUST BE SOLDERED TO PCB
http://www.linear.com/product/LTC3126#orderinfo
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3126EUFD#PBF
LTC3126EUFD#TRPBF
3126
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 125°C
LTC3126IUFD#PBF
LTC3126IUFD#TRPBF
3126
28-Lead (4mm × 5mm) Plastic QFN
–40°C to 125°C
LTC3126EFE#PBF
LTC3126EFE#TRPBF
LTC3126FE
28-Lead Plastic TSSOP (4.4mm)
–40°C to 125°C
LTC3126IFE#PBF
LTC3126IFE#TRPBF
LTC3126FE
28-Lead Plastic TSSOP (4.4mm)
–40°C to 125°C
LTC3126HFE#PBF
LTC3126HFE#TRPBF
LTC3126FE
28-Lead Plastic TSSOP (4.4mm)
–40°C to 150°C
LTC3126MPFE#PBF
LTC3126MPFE#TRPBF
LTC3126FE
28-Lead Plastic TSSOP (4.4mm)
–55°C to 150°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through
designated sales channels with #TRMPBF suffix.
3126f
2
For more information www.linear.com/LTC3126
LTC3126
Electrical Characteristics
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). PVIN1 = VIN1 = 24V, PVIN2 = VIN2 = 12V,
VSET1 = VSET2 = GND, unless otherwise noted.
PARAMETER
CONDITIONS
Input Operating Voltage
After Start-Up
l
MIN
VIN1, VIN2 UVLO Threshold
VIN1/VIN2 Rising
VIN1/VIN2 Falling
l
l
VCC UVLO Threshold
VCC Rising
VCC Falling
l
VIN1 Current in Disable
ENA Low, VIN1 = 24V, VIN2 = 12V
ENA Low, VIN1 = 12V, VIN2 = 24V
1.35
0.55
µA
µA
VIN2 Current in Disable
ENA Low, VIN2 = 24V, VIN1 = 12V
ENA Low, VIN2 = 12V, VIN1 = 24V
1.35
0.55
µA
µA
VIN1 Current in Standby
ENA High, Buck in UVLO, VIN1 = 24V, VIN2 = 12V
ENA High, Buck in UVLO, VIN1 = 12V, VIN2 = 24V
1.65
0.55
µA
µA
VIN2 Current in Standby
ENA High, Buck in UVLO, VIN2 = 24V, VIN1 = 12V
ENA High, Buck in UVLO, VIN2 = 12V, VIN1 = 24V
1.65
0.55
µA
µA
VIN1 Current, Operating from VIN2
ENA High, Buck Operating, VIN1 = 24V, VIN2 = 27V
1.2
µA
VIN2 Current, Operating from VIN1
ENA High, Buck Operating, VIN2 = 24V, VIN1 = 27V
1.2
µA
Burst Mode Operation Quiescent Current from VIN Not Switching, VFB = 0.850V
Oscillator Frequency
Programmable Frequency
RT Resistor = 33.2k
PWM/SYNC Applied Clock Frequency
200
900
l
200
PWM/SYNC Low Pulse Width
UNITS
42
V
2.50
2.34
2.6
2.4
V
V
2.3
2.2
2.4
2.3
V
V
1000
µA
2200
1100
kHz
kHz
2200
kHz
100
ns
150
Logic Input Threshold (ENA, DIODE, PWM/SYNC)
ns
l
0.3
0.8
1.1
V
l
812
804
818
818
824
832
mV
mV
Feedback Voltage
VIN1, VIN2 = 2.4V to 42V
0.2
Feedback Pin Current
Feedback Pin Overvoltage Comparator Threshold
MAX
5.5
l
l
PWM/SYNC High Pulse Width
Feedback Voltage Line Regulation
TYP
2.4
FB Rising, as a Percentage of the Feedback Voltage
%
–20
1
20
nA
7.4
9.8
12
%
Feedback Pin Overvoltage Comparator Hysteresis
1.1
%
Soft-Start Duration
7.5
ms
PGOOD Threshold
FB Falling, as a Percentage of the Feedback Voltage
l
–10.7
PGOOD Threshold Hysteresis
PGOOD Delay
FB Falling
VREF Voltage
l
0.995
0.982
–8.7
1
%
µs
1.000
1.000
1.005
1.018
1
VREF Current Limit
13
VIN1 Rising, VIN2 = 24V
VIN1 Falling, VIN2 = 24V
280
VBEST Comparator Delay
VIN1 Falling, VIN2 = 24V
VIN2 Falling, VIN1 = 24V
VIN1, VIN2 Input Valid Threshold, Rising
VSET1 = VSET2 = 1000mV
VSET1 = VSET2 = 500mV
VSET1 = VSET2 = 250mV
VSET1 = VSET2 = 150mV
365
19.8
9.9
4.9
2.91
20.0
10.0
5.0
3.0
mA
V
V
450
11
40
l
l
l
l
V
V
mA
24.18
23.83
VBEST Comparator Hysteresis
%
200
VREF Output Current
VBEST Comparator Threshold
–6.6
mV
µs
µs
20.2
10.1
5.1
3.09
V
V
V
V
3126f
For more information www.linear.com/LTC3126
3
LTC3126
Electrical Characteristics
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). PVIN1, = VIN1 = 24V, PVIN2 = VIN2 = 12V,
VSET1 = VSET2 = GND, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VIN1, VIN2 Input Valid Threshold, Falling
VSET1 = VSET2 = 1000mV
VSET1 = VSET2 = 500mV
VSET1 = VSET2 = 250mV
VSET1 = VSET2 = 150mV
17.57
8.77
4.34
2.57
17.75
8.86
4.43
2.65
17.93
8.95
4.52
2.73
V
V
V
V
VIN1, VIN2 Input Valid Threshold Hysteresis
As a Percentage of the Rising Threshold
11
%
VIN1, VIN2 Input Valid Comparator Delay
VIN1/VIN2 Falling, 2V/µs, VSET1/VSET2 = 1V
VIN1/VIN2 Rising, 2V/µs, VSET1/VSET2 = 1V
60
120
µs
µs
Open-Drain Output Voltage
PGOOD, PRIORITY, VALID1, VALID2
Open-Drain Pull-Down Resistance
PGOOD, PRIORITY, VALID1, VALID2
Open-Drain Leakage
PGOOD, PRIORITY, VALID1, VALID2
5.5
70
High Side Switch Resistance
Dropout Voltage
Ω
1
Low Side Switch Resistance
1A Load, VOUT = 3.3V
V
µA
70
mΩ
200
mΩ
310
mV
High Side Switch Current Limit
(Note 3)
3.0
3.9
4.8
A
Low Side Switch Current Limit
(Note 3)
3.8
5.2
6.8
A
Zero Cross Threshold
PWM/SYNC = Low (Note 3)
PWM/SYNC = High or Clocked (Note 3)
220
0
–3
mA
mA
SW Leakage Current
VIN1 = VIN2 = PVIN1 = PVIN2 = 42V, VSW = 0V, 42V
VCC Voltage
IVCC = 1mA
4.12
VCC Current Limit
VCC = 3.5V
35
67
mA
VCC Drop-Out Voltage
Powered from VIN1 or VIN2, VIN = 2.4V, ILOAD = 5mA
Powered from EXTVCC, VEXTVCC = 3.3V, ILOAD = 5mA
70
100
mV
mV
VCC Load Regulation
ILOAD = 1mA to 15mA
1.1
%
EXTVCC Applied Voltage
4.22
3.15
EXTVCC Valid, Rising Threshold
l
EXTVCC Valid, Hysteresis
2.95
3
µA
4.32
V
42
3.05
167
3.15
V
V
mV
EXTVCC Current in Shutdown
EXTVCC = 3.3V, ENA = Low
0.2
µA
EXTVCC Current
Switching, fSW = 1MHz
8.8
mA
200
mV
46
ns
100
ns
Frequency Foldback Threshold on FB
SW Minimum On-Time
VIN = 24V, 1A Load, EXTVCC = OPEN
SW Minimum Low-Time
SW Frequency Foldback Factor
VFB < 0.2V
16
SW Frequency Divider in Drop-Out
8
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTC3126 is tested under pulsed load conditions such that
TJ ≈ TA. The LTC3126E is guaranteed to meet specifications from
0°C to 85°C junction temperature. Specification over the –40°C to
125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3126I specifications are guaranteed over the –40°C to 125°C operating
junction temperature range. The LTC3126H specifications are guaranteed
over the –40°C to 150°C operating junction temperature range. The
LTC3126MP specifications are guaranteed and tested over the –55°C to
150°C operating junction temperature range. High temperatures degrade
operating lifetimes; operating lifetime is derated for junction temperatures
greater than 125°C.
Note 3: Current measurements are performed when the LTC3126 is
not switching. The current limit values measured in operation will be
somewhat higher due to the propagation delay of the comparators.
Note 4: This IC includes overtemperature protection that is intended to
protect the device during momentary overload conditions. The maximum
rated junction temperature will be exceeded when this protection is active.
Continuous operation above the specified absolute maximum operating
junction temperature may impair device reliability or permanently damage
the device.
3126f
4
For more information www.linear.com/LTC3126
LTC3126
Typical Performance Characteristics
Efficiency, VOUT = 3.3V,
fSW = 700KHz
Efficiency, VOUT = 5V,
fSW = 700KHz
95
90
85
80
0.5
1.0
1.5
LOAD CURRENT (A)
2.0
85
80
70
0.0
0.5
1.0
1.5
LOAD CURRENT (A)
2.0
L = 4.7µH
PWM/SYNC = LOW
50
0.0
2.5
Efficiency, VOUT = 3.3V,
fSW = 700KHz
100
90
90
80
80
80
70
70
40
30
L = 10µH
20
0
0.0001 0.001 0.01
0.1
LOAD CURRENT (A)
1
60
PWM
MODE
50
40
30
20
VIN = 12V
VIN = 24V
10
10
0
0.0001
4
0.001
0.01
0.1
LOAD CURRENT (A)
10
80
80
70
50
PWM
MODE
40
30
L = 2.2µH
20
0.001
0.01
0.1
LOAD CURRENT (A)
1
3126 G07
0.001
0.01
0.1
LOAD CURRENT (A)
1
60
90
Efficiency, VOUT = 1.8V,
fSW = 2MHz
70
Burst Mode
OPERATION
50
PWM
MODE
40
30
0
0.0001
4
L = 2.2µH
80 VIN = 12V
L = 2.2µH
0.001
0.01
0.1
LOAD CURRENT (A)
1
60
50
Burst Mode
OPERATION
40
30
PWM
MODE
20
VIN = 12V
VIN = 24V
10
4
VIN = 12V
VIN = 24V
3126 G06
Efficiency, VOUT = 3.3V,
fSW = 2MHz
20
VIN = 12V
VIN = 24V
10
0
0.0001
EFFICIENCY (%)
Burst Mode
OPERATION
L = 4.7µH
0
0.0001
EFFICIENCY (%)
90
90
60
30
VIN = 12V
VIN = 24V
4
PWM
MODE
40
20
1
Burst Mode
OPERATION
50
3126 G05
Efficiency, VOUT = 5V,
fSW = 2MHz
70
60
L = 10µH
3126 G04
100
2.5
70
Burst Mode
OPERATION
EFFICIENCY (%)
EFFICIENCY (%)
PWM
MODE
50
2.0
Efficiency, VOUT = 1.8V,
fSW = 700KHz
90
Burst Mode
OPERATION
1.0
1.5
LOAD CURRENT (A)
3126 G03
100
60
0.5
3126 G02
Efficiency, VOUT = 5V,
fSW = 700KHz
EFFICIENCY (%)
70
L = 10µH
PWM/SYNC = LOW
3126 G01
EFFICIENCY (%)
80
60
75
2.5
VIN = 12V
VIN = 24V
90
90
L = 10µH
PWM/SYNC = LOW
70
0.0
100
VIN = 12V
VIN = 24V
95
EFFICIENCY (%)
EFFICIENCY (%)
100
VIN = 12V
VIN = 24V
Efficiency, VOUT = 1.8V,
fSW = 700KHz
EFFICIENCY (%)
100
75
TA = 25°C, unless otherwise noted.
10
4
3126 G08
0
0.0001
0.001
0.01
0.1
LOAD CURRENT (A)
1
4
3126 G09
3126f
For more information www.linear.com/LTC3126
5
LTC3126
Typical Performance Characteristics
Efficiency vs Switching Frequency
VIN = 12V
VIN = 24V
92
90
88
86 VOUT = 5V
LOAD = 1A
L = 10µH
84
200
600
1000
1400
1800
SWITCHING FREQUENCY (kHz)
6
5
4
3
2
0
2200
20
VIN = 12V
VIN = 24V
0
5
10
15 20 25 30 35
INPUT VOLTAGE (V)
8
6
LOAD = 1A
VOUT = 5V
EXTVCC = VOUT
L = 10µH
0
200
600
1000
1400
1800
SWITCHING FREQUENCY (kHz)
1.2
0.8
0
45
fSW = 700kHz
fSW = 2MHz
8
0
0.2
0.0
–0.2
–0.4
–0.6
LOAD = 1A
VOUT = 5V
5
15
25
35
INPUT VOLTAGE (V)
45
–0.8
–1.0
0.0
80
0.2
70
–0.5
0
5
10
15 20 25 30 35
INPUT VOLTAGE (V)
40
45
3126 G16
VIN – VCC (mV)
0.3
CHANGE IN VFB FROM 25°C (%)
90
VOUT = 3.3V
LOAD = 0.5A
PWM/SYNC = HIGH
2.0
0.1
–0.0
–0.1
–0.2
VIN = 2.4V
PWM/SYNC = HIGH
60 BUCK OPERATING
IN REGULATION
50
40
30
–0.3
20
–0.4
10
–0.5
–50 –25
0
2.5
VCC LDO Voltage Drop vs
Switching Frequency
100
–0.4
1.0
1.5
LOAD CURRENT (A)
3126 G15
0.4
–0.3
0.5
3126 G14
0.4
–0.2
45
0.4
0.5
–0.1
40
0.6
0.5
0.1
15 20 25 30 35
INPUT VOLTAGE (V)
0.8
FB Voltage vs Temperature
–0.0
10
Load Regulation
12
Line Regulation
0.2
5
1.0
4
2200
0.3
0
3126 G12
EXTVCC Current vs Input Voltage
3126 G13
CHANGE IN VOUT FROM VIN = 24V (%)
40
CHANGE IN VOUT (%)
10
EXTVCC CURRENT (mA)
EXTVCC CURRENT (mA)
12
2
1.6
0.4
16
14
4
ENA = LOW
3126 G11
EXTVCC Current vs Switching
Frequency
16
Shutdown Current vs VIN
1
3126 G10
18
2.0
VOUT = 3.3V
PWM/SYNC = LOW
EXTVCC = VOUT
7
INPUT CURRENT (µA)
94
EFFICIENCY (%)
No-Load Input Current
8
INPUT CURRENT (µA)
96
TA = 25°C, unless otherwise noted.
25 50 75 100 125 150
TEMPERATURE (°C)
3126 G17
0
200
BUCK OPERATING
IN DROPOUT
600
1000
1400
1800
SWITCHING FREQUENCY (kHz)
2200
3126 G18
3126f
6
For more information www.linear.com/LTC3126
LTC3126
Typical Performance Characteristics
110
3
100
2
90
80
70
60
3000
SWITCHING FREQUENCY (kHz)
4
1
0
–1
–2
VIN = 2.5V
ICC = 5mA
50
40
–50 –25
0
–4
25 50 75 100 125 150
TEMPERATURE (°C)
0
4
8
12
ICC (mA)
fSW = 700kHz
fSW = 2MHz
VOUT = 3.3V
VIN = 24V
ILOAD = 2A
0.4
0.8
1.2
VOLTAGE ON THE UNUSED INPUT (V)
3.0
2.0
1.0
0
–1.0
–2.0
–3.0
–5.0
–50 –25
0
200
150
EXTVCC = OPEN
VOUT = 3.3V
LOAD = 1A
0
50
0
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
25 50 75 100 125 150
TEMPERATURE (°C)
3126 G25
0
25 50 75 100 125 150
TEMPERATURE (°C)
3126 G24
Temperature Rise
vs Load Current
60
50
4.2
TEMPERATURE RISE (°C)
44
BOTTOM
SWITCH
100
4.5
HIGH SIDE CURRENT LIMIT (A)
60
SW MINIMUM ON-TIME (ns)
250
High Side Current Limit
Threshold vs Temperature
48
TOP
SWITCH
300
3126 G23
Minimum On-Time
vs Temperature
52
3126 G21
350
3126 G22
56
200 300
100
Power Switch Resistance vs
Temperature
–4.0
1.6
20
RT (kΩ)
POWER SWITCH RESISTANCE (mΩ)
0.5
10
3126 G20
4.0
1.0
40
–50 –25
100
20
5.0
1.5
CHANGE IN FSW FROM 25°C (%)
CURRENT OUT OF THE UNUSED INPUT (mA)
16
Switching Frequency
vs Temperature
Reverse Current Out of the
Unused Input (VIN1 or VIN2)
0
1000
–3
3126 G19
0
Switching Frequency vs RT
VCC Load Regulation
120
CHANGE IN VCC (%)
VCC DROPOUT VOLTAGE (mV)
VCC Dropout Voltage
vs Temperature
TA = 25°C, unless otherwise noted.
3.9
3.6
3.3
3.0
–50
VIN = 12V
VIN = 24V
VIN = 36V
40
30
20
fSW = 1MHz
VOUT = 3.3V
ON DEMO PCB
10
0
50
100
TEMPERATURE (°C)
150
3126 G26
0
0.5
1
1.5
2
LOAD CURRENT (A)
2.5
3126 G27
3126f
For more information www.linear.com/LTC3126
7
LTC3126
Typical Performance Characteristics
Temperature Rise
vs Load Current
40
800
VIN = 12V
VIN = 24V
30
20
fSW = 2MHz
VOUT = 3.3V
ON DEMO PCB
10
1
1.5
2
LOAD CURRENT (A)
600
500
400
300
200
fSW = 1MHz
VIN = 3.3V
VOUT = 3.3V
100
0
0.0
2.5
0.5
1.0
1.5
LOAD CURRENT (A)
2.0
3126 G28
25
250mA TO
2.5A LOAD
VOUT = 5V
VOUT = 1.8V
VOUT = 3.3V, EXTVCC = VOUT
VOUT = 3.3V, EXTVCC = OPEN
fSW = 700kHz, L = 4.7µH
fSW = 1MHz, L = 3.3µH
fSW = 2MHz, L = 2.2µH
600
400
0
5
10
15
20 25 30 35
INPUT VOLTAGE (V)
40
45
0.0
–0.4
–1.2
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
3126 G32
3126 G33
Load Step, 0.5A to 1.5A
LOAD
CURRENT
1A/DIV
INDUCTOR
CURRENT
200mA/DIV
INDUCTOR
CURRENT
1A/DIV
VOUT
50mV/DIV
24V TO 5V AT 1A
L = 2.2µH
fSW = 2MHz
45
0.4
Switching Waveforms,
Burst Mode Operation
3126 G34
40
–0.8
Switching Waveforms,
PWM Mode
SW
10V/DIV
20 25 30 35
INPUT VOLTAGE (V)
0.8
VOUT = 3.3V
3126 G31
INDUCTOR
CURRENT
500mA/DIV
15
VREF vs Temperature
200
5
600 800 1000 1200 1400 1600 1800 2000 2200
SWITCHING FREQUENCY (kHz)
10
3126 G30
CHANGE FROM 25°C (%)
LOAD CURRENT (mA)
30
5
1.2
800
35
200ns/DIV
10
0
2.5
1000
40
10
20
Burst Mode Operation Threshold
vs Input Voltage
45
15
30
3126 G29
Maximum Input Voltage without
Pulse Skipping
20
LOAD CURRENT (mA)
40
0
0.5
fSW = 700kHz
L = 4.7µH
VOUT = 5V
PWM/SYNC = HIGH
700
DROPOUT VOLTAGE (mV)
50
TEMPERATURE RISE (°C)
Minimum Load for Full Frequency
Switching (No Pulse Skipping)
Dropout Voltage vs Load Current
60
INPUT VOLTAGE (V)
TA = 25°C, unless otherwise noted.
VOUT
100mV/DIV
10µs/DIV
24V TO 5V AT 25mA
L = 2.2µH
fSW = 2MHz
COUT = 47µF
3126 G35
100µs/DIV
FRONT PAGE APPLICATION
3126 G36
3126f
8
For more information www.linear.com/LTC3126
LTC3126
Typical Performance Characteristics
Load Step, 0.5A to 2.5A
Start-Up Waveforms
ENA
5V/DIV
LOAD
CURRENT
2A/DIV
VALID1
5V/DIV
INDUCTOR
CURRENT
2A/DIV
VOUT
2V/DIV
VOUT
200mV/DIV
PGOOD
5V/DIV
3126 G37
100µs/DIV
FRONT PAGE APPLICATION
2ms/DIV
FRONT PAGE APPLICATION
VIN
VIN, VOUT
2V/DIV
50ms/DIV
VIN1
VIN1, VIN2
5V/DIV
VOUT
INDUCTOR
CURRENT
500mA/DIV
VIN2
PRIORITY
5V/DIV
IIN2 500mA/DIV
IIN1 500mA/DIV
VOUT 100mV/DIV
3126 G39
50ms/DIV
10Ω LOAD
VOUT = 5V
10Ω LOAD
VOUT = 5V
Priority Mode Transition
Hot Plug of Automotive
Input, VIN1
VIN2
VSET1
THRESHOLD
VIN1
PRIORITY
5V/DIV
IIN2 200mA/DIV
IIN1 200mA/DIV
VOUT 100mV/DIV
3126 G38
Ideal Diode Mode Transition
Start-Up Dropout Performance
VIN1, VIN2
10V/DIV
TA = 25°C, unless otherwise noted.
3126 G40
VIN1
VIN1, VIN2
10V/DIV
VIN2
VOUT
100mV/DIV
SW
10V/DIV
50ms/DIV
10Ω LOAD
VIN2 = 10V
VOUT = 3.3V
3126 G41
20µs/DIV
FRONT PAGE APPLICATION
1A LOAD
VIN1 = 13.8V
VIN2 = 6V
3126 G42
3126f
For more information www.linear.com/LTC3126
9
LTC3126
Pin Functions
(QFN/TSSOP)
VCC, PVCC (Pins 2, 3/Pins 5, 6): Internal Linear Regulator Output and Power Supply for the Low Voltage Control
Circuitry in the IC. Internal linear regulators generate a
regulated voltage on these pins from either VIN1, VIN2 or
EXTVCC. VCC and PVCC must be connected together in the
application. A 4.7μF or larger bypass capacitor must be
connected between these pins and ground. The VCC rail
remains powered in shutdown and can be used to supply
up to 1mA to external loads.
EXTVCC (Pin 4/Pin 7): VCC Regulator Bootstrapping Pin. If
this pin is forced to 3.15V or greater then EXTVCC will be
used to power the internal VCC rail. Typically, the EXTVCC
input is connected to the buck converter output voltage.
Bootstrapping the internal VCC rail in this fashion provides
a significant efficiency advantage and reduced quiescent
current especially in applications with high input voltage
and low output voltage. If the EXTVCC pin is left open then
the VCC rail will be powered from the VIN1 and VIN2 pins.
VSET1, VSET2 (Pins 5, 6/Pins 8, 9): Programming Pins for
the UVLO Thresholds on VIN1 and VIN2. The voltage on
the VSET1 and VSET2 pins programs the UVLO threshold
for the power source inputs VIN1 and VIN2, respectively. A
voltage between zero and 1V programs a corresponding
UVLO threshold between zero and 20V. However, there
is also a fixed internal UVLO threshold (typically 2.34V)
on each input which is always in effect. The voltage on
VSET1,2 can be set using a resistor divider from the accurate reference output, VREF. Grounding VSET1,2 will allow
the respective input VIN1,2 to be used down to the fixed,
internal UVLO threshold.
VREF (Pin 7/Pin 10): Voltage Reference Output for Powering Resistor Dividers to Set the VSET1 and VSET2 Inputs.
The voltage at this pin is regulated by the IC to maintain a
high precision, temperature stable 1.0V output. Resistive
dividers from the VREF pin can be used to set the voltage at
the VSET1 and VSET2 pins and thereby program the UVLO
threshold for each input. The VREF output may also be used
as a general purpose voltage reference in the application,
providing a temperature stable reference for comparators,
DACs or other functions. The total current drawn from this
pin must be limited to 1mA and the total capacitive load
should be limited to 470pF. If this pin is not used in the
application (i.e., if there is no resistor from VREF to ground)
then the VREF pin must be connected to VCC.
GND (Pin 8/ Pin 11): Signal Ground. This pin is the ground
connection for the control circuitry of the IC and must be
tied to ground.
FB (Pin 9/Pin 12): Feedback Voltage Input. A resistor divider connected to this pin establishes the output voltage
of the buck converter. Care should be taken in the routing of connections to this pin in order to minimize stray
coupling to the SW, BST1, BST2, COM1 and COM2 pins.
RT (Pin 10/Pin 13): Switching Frequency Programming
Pin. A resistor placed from this pin to ground sets the
switching frequency of the buck converter.
PGOOD (Pin 11/Pin 14): Open-Drain Power Good Indicator
for the Buck Converter Output Voltage. This output is driven
low if the buck converter output voltage is more than 8.7%
below the regulation voltage or more than 9.8% above
the regulation voltage. The PGOOD pin is also driven low
whenever the buck converter is disabled. The maximum
voltage that can be applied to the PGOOD pin is 5.5V.
PRIORITY (Pin 12/Pin 15): Open-Drain Output Indicating That the Priority Input (VIN1) Is Being Utilized. The
PRIORITY pin is driven low if the part is enabled and the
buck converter is operating from the priority input, VIN1.
In disable (ENA low) the PRIORITY pull-down is disabled,
allowing the pin to float. The maximum voltage that can
be applied to the PRIORITY pin is 5.5V.
PVIN2 (Pin 13/Pin 16): Secondary Power Source Input
for the Buck Converter. In priority mode (DIODE pin low)
the buck converter will only operate from this input if the
priority input power source is under voltage. This pin must
be bypassed with a 4.7µF or larger ceramic capacitor to
ground. If the PVIN2 input will be subjected to inductive
shorts to ground, then a power Schottky diode must be
added from ground to PVIN2 to prevent this pin from being
driven below ground.
ENA (Pin 14/Pin 17): Enable Input. Forcing the ENA pin
low disables the input voltage comparators, the VREF pin
driver and the buck converter. The VCC rail remains powered
in disable and therefore ENA can be connected to VCC to
3126f
10
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LTC3126
Pin Functions
(QFN/TSSOP)
continuously enable the part. The maximum voltage that
can be applied to the ENA pin is 5.5V.
PGND (Pins 18, 19, Exposed Pad Pin 29/Pins 21, 22,
Exposed Pad Pin 29): Power Ground Connections. These
pins must be connected to ground in the application.
For optimal thermal performance, the backpad should
be soldered to the PC board and the PC board should
be designed with the maximum possible number of vias
connecting the backpad to the ground plane.
SW (Pins 17, 20/Pins 20, 23): Power Switch Inductor
Connections. This pin should be connected to one side
of the buck converter inductor.
COM1, COM2 (Pins 16, 21/Pins 19, 24): Negative Termination for Charge Pump Capacitors. External 0.1µF
capacitors (with 5V rating or greater) must be connected
between BST1 and COM1 and between BST2 and COM2.
BST1, BST2 (Pins 15, 22/Pins 18, 25): High Side Gate
Driver Supply Rails. External 0.1µF capacitors (with 5V
rating or greater) must be connected between BST1 and
COM1 and between BST2 and COM2. These pins are used
to generate a gate drive rail for the high side power devices.
DIODE (Pin 23/Pin 26): Logic Input Used to Select Between Ideal Diode-OR and Priority Modes. The integrated
power path allows operation from either of two input
power sources, VIN1 or VIN2. An input is considered valid
for use only if its voltage is above the UVLO threshold
for that input as programmed by the respective voltage
at the VSET1 or VSET2 pin. If DIODE is high then the part
operates in ideal-diode mode and the buck converter will
operate from the highest voltage valid input (VIN1 or VIN2).
If DIODE is low then the part operates in priority mode and
the buck converter will operate from VIN1 whenever it is
valid and will switch to VIN2 only if VIN1 becomes invalid.
In either mode, if both inputs are under voltage then the
buck converter will be disabled.
PVIN1 (Pin 24/Pin 27): Priority Power Source Input for
the Buck Converter. In priority mode (DIODE pin low) the
buck converter will preferentially operate from this input
if both input power sources are valid (above their respective UVLO thresholds). This pin must be bypassed with a
4.7µF or larger ceramic capacitor to ground. If the PVIN1
input will be subjected to inductive shorts to ground, then
a power Schottky diode must be added from ground to
PVIN1 to prevent this pin from being driven below ground.
VIN1 (Pin 25/Pin 28): Priority Power Source Kelvin Connection. This pin must be bypassed with a 0.1µF ceramic
capacitor to ground. The VIN1 pin must be connected to
PVIN1 in the application.
VIN2 (Pin 26/ Pin 1): Secondary Power Source Kelvin Connection. This pin must be bypassed with a 0.1µF ceramic
capacitor to ground. The VIN2 pin must be connected to
PVIN2 in the application.
PWM/SYNC (Pin 27/Pin 2): PWM/Burst Mode Operation
Control and External Synchronization Clock Input. Forcing this pin high causes the buck converter to operate
in PWM mode. In PWM mode, the converter maintains
fixed frequency operation over the widest range of load
currents possible, leaving fixed frequency operation only
at extremely light loads where the converter skips pulses
to maintain regulation. Forcing the PWM/SYNC pin low
causes the IC to utilize Burst Mode operation at light loads
and automatically transition to PWM mode at higher load
current. Burst Mode operation improves light load efficiency
and significantly reduces no-load input quiescent current
at the expense of modestly increased output voltage ripple.
In addition, an external clock can be applied to the PWM/
SYNC pin for synchronization purposes. When synchronized to an external clock the buck converter operates in
PWM mode (Burst Mode operation is disabled).
VALID1, VALID2 (Pins 1, 28/Pins 3, 4): Open-Drain
Outputs Indicating Whether the VIN1 and VIN2 Inputs Are
Valid. When the part is enabled (ENA is high) VALID1 and
VALID2 are driven low if the voltage at the VIN1 or VIN2
input is above the UVLO threshold set by the respective
VSET1 or VSET2 pin. When the part is disabled (ENA is low)
the VALID1 and VALID2 pull-downs are disabled allowing
the pins to float. The maximum voltage that can be applied
to the VALID1 and VALID2 pins is 5.5V.
3126f
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11
LTC3126
Block Diagram
VSET1
VIN1
2.34V
+
–
VIN2
2.34V
6
23
26
25
4
2
3
15
13
COM1
–
+
VALID1
VIN1 HIGHER
–
+
UVLO2
7
12
RUN ON VIN1
ENA
VIN1 VALID
POWER
PATH
VALID2
ENA
VIN2 VALID
DIODE
28
1
VIN2
VIN1
TRIPLE INPUT
LDO
EXTVCC
CURRENT
LIMIT
VCC
PVCC
GATE
DRIVERS
PVCC
ZERO
CURRENT
BST1
SW
+
–
3.9A
0A
+
–
SW
898mV
5.2A
CLK
OSCILLATOR
PWM/SYNC
MODE SELECTION PWM/BURST
MODE OPER.
(PWM MODE IF
PWM/SYNC IS HIGH
OR SWITCHING
+
–
VREF
CONTROL
LOGIC
OV
20
+
–
PGOOD
11
SLOPE
COMPENSATION
+
+
–
+
–
17
BUCK ENABLE
BST2
RT
+
–
FB
747mV
FB
+
–
27
PRIORITY
COM2
UVLO1
PGND
10
16
PVIN2
ENA
CURRENT
LIMIT
22
21
PVIN1
–
+
0.05VIN2
VSET2
24
–
+
0.05VIN1
+
–
5
Pin numbers shown for QFN package
FB
9
818mV
FB
898mV
1.000V
ENA
ENA
14
NOTE:
PVIN1 AND VIN1 MUST BE CONNECTED TOGETHER IN THE APPLICATION
PVIN2 AND VIN2 MUST BE CONNECTED TOGETHER IN THE APPLICATION
VCC AND PVCC MUST BE CONNECTED TOGETHER IN THE APPLICATION
GND
PGND
PGND
PGND
8
18
19
29
3126 BD
Quick Reference
This section of the data sheet contains all of the equations
necessary for external component selection as well as
key part usage notes all compiled into one location for
ease of use.
Switching Frequency
The buck converter switching frequency, fSW, is set by the
value of RT resistor connected between the RT pin and
ground according to the following equation:
RT =
12
Table 1. RT Value for Common Switching Frequencies
fSW
RT
300kHz
110kΩ
500kHz
66.5kΩ
750kHz
44.2kΩ
1.0MHz
33.2kΩ
1.2MHz
27.4kΩ
1.5MHz
22.1kΩ
2.0MHz
16.5kΩ
33.2MHz
kΩ
fSW
3126f
For more information www.linear.com/LTC3126
LTC3126
Quick Reference
Output Voltage
Table 2. Recommended Minimum Inductor Values
fSW = 750kHz
The buck converter output voltage is set via a resistor
divider connected to the FB pin as shown in Figure 1.
In most applications, choosing RTOP equal to 1MΩ represents a good trade-off between quiescent current and
robustness against PCB leakage. RBOT can be determined
by the following equation where VOUT is the desired output
voltage:
VOUT
LTC3126
RBOT
Inductor Value
If the buck converter will be operated at duty cycles greater
than 50% (i.e., VIN < 2VOUT) then the inductor value must
be equal or greater than LMIN as defined by the following
equation:
3.3µH
3.3V
2.2µH
1.8V
1.2µH
VOUT
MINIMUM INDUCTOR VALUE
12V
6.0µH
5V
2.5µH
3.3V
1.8µH
1.8V
1.0µH
fSW = 2MHz
Figure 1. FB Resistor Divider
MHz VOUT
•
µH
fSW 2V
5V
RFF
3126 F01
LMIN =
8.0µH
CFF
FB
GND
MINIMUM INDUCTOR VALUE
12V
fSW = 1MHz
R TOP
RBOT =
VOUT
– 1
0.818V
RTOP
VOUT
VOUT
MINIMUM INDUCTOR VALUE
12V
3.3µH
5V
1.5µH
3.3V
1.0µH
1.8V
1.0µH
The peak-to-peak inductor ripple, ΔIL, is given by the following equation.
∆IL =
VOUT VOUT
1–
fSW •L
VIN
Output Capacitor
The recommended minimum output capacitor, CMIN, is
given below as a function of output voltage:
CMIN =
1V
150µF
VOUT
Table 3. Minimum Output Capacitor vs VOUT
VOUT
MINIMUM COUT
24V
10µF
12V
22µF
5V
33µF
3.3V
47µF
1.8V
100µF
1.2V
150µF
3126f
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13
LTC3126
Quick Reference
VIN1, VIN2 UVLO Thresholds
The VIN1 and VIN2 UVLO thresholds are set by the voltage on the VSET1 and VSET2 pins respectively. Each UVLO
threshold can be set from a maximum of 20V down to the
internal fixed UVLO threshold of 2.34V using a resistor
divider from the VREF output as shown in Figure 2. The
rising UVLO threshold is given by the following equation:
R2
VUVLO1,2 = 20VSET1,2 = 20V
R1+R2
Grounding the VSET1,2 pin will define the respective input as
valid down to the fixed internal UVLO threshold of 2.34V.
LTC3126
VSET1,2
R2
GND
Figure 2. Input UVLO Threshold Divider
External Synchronization Clock Frequency
The buck converter can be synchronized to an external clock
applied to the PWM/SYNC pin. The frequency of the external
clock must be higher than the internal oscillator frequency
as set by the RT pin. In order to accommodate the ±10%
possible variation in the oscillator frequency, the RT resistor
should be chosen to set the internal oscillator frequency at
least 10% below the lowest synchronization frequency. For
example, to synchronize to an external 1MHz clock, RT should
be picked to set the internal oscillator at 900kHz or lower.
Feedforward Capacitor
The feedforward capacitor, CFF, as shown in Figure 1
improves the noise robustness of the FB pin and adds a
zero to the loop at the frequency fZERO given below:
The open-drain outputs (PGOOD, PRIORITY, VALID1 and
VALID2) are low voltage pins and cannot be pulled up to a
voltage higher than 5.5V. PGOOD is forced low in disable.
Logic Inputs
Important Usage Notes
3126 F02
fZERO =
Open-Drain Outputs
The logic input pins (DIODE, ENA, PWM/SYNC) are low
voltage pins and cannot be forced above 5.5V. To force
any of these pins continuously high, the pin can be connected to VCC.
VREF
R1
capacitor can be utilized to reduce the zero frequency and
improve the transient response and phase margin. As
shown in Figure 1, a 10k feedforward resistor, RFF, can
be added to improve noise immunity in applications with
high output voltage ripple or a long distance between the
resistor divider and VOUT.
1
2π •R TOP •CFF
In most applications performance will be optimized if the
zero frequency is set at approximately 16kHz. In applications with large output capacitance, a larger feedforward
1. PVIN1 and VIN1 must be connected together in the
application. PVIN2 and VIN2 must be connected together
in the application. PVIN1 and PVIN2 must each have a
4.7µF or larger bypass capacitor installed and placed
as close to the pin as possible. In addition, VIN1 and
VIN2 should have a separate 0.1µF bypass capacitor
installed as close to the pin as possible.
2. The two SW pins must be connected together in the
application.
3. VCC and PVCC must be connected together in the
application and should be bypassed with a 4.7µF or
larger capacitor.
4. If the VREF pin is not used in the application (i.e., there
is no resistor from VREF to GND) then the VREF pin must
be connected to VCC.
5. If PVIN1 or PVIN2 can be driven below ground in the
application, for example due to large inductive ringing
at the input, then Schottky diodes must be installed
from ground to PVIN1/PVIN2 to protect the LTC3126.
3126f
14
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LTC3126
Operation
The LTC3126 is a dual-input synchronous monolithic buck
converter featuring the ability to operate from two different input power sources with voltage ranges from 2.4V
to 40V. An integrated lossless power path eliminates the
need for an external diode-OR circuit or another type of
external power path enabling a complete multi-input power
supply solution with higher efficiency, fewer components,
lower quiescent current and reduced drop-out voltage. The
LTC3126 integrates all of the control circuitry required to
automatically transition between two input power sources
based on user programmable UVLO thresholds and selectable ideal-diode and priority modes. These features
allow the LTC3126 to serve as a complete single chip
power supply solution from a variety of different power
sources including automotive, wall adapter, USB/Firewire
and a wide range of battery chemistries. In addition, the
LTC3126 is ideally suited for capacitor backup supplies
with its ability to automatically transition to a capacitive
backup rail when primary power is interrupted. A low 1µA
quiescent current in disable and 2µA operating current
make the LTC3126 ideally suited for battery powered and
automotive applications.
PowerPath Operation
The power path controls whether the buck converter
operates from the VIN1 or VIN2 input based on programmable undervoltage lockout thresholds for each input. The
UVLO architecture used by the LTC3126 eliminates the
need to connect external resistor dividers directly to the
input voltages thereby providing a substantial reduction
in quiescent current.
The VSET1 and VSET2 pins are used to set the undervoltage lockout thresholds for the two power source inputs
VIN1 and VIN2 respectively. The UVLO threshold for each
input can be independently set to any voltage from 20V
down to the internal fixed UVLO threshold of 2.34V using an external resistor divider as shown in Figure 3. The
VREF pin is regulated to a fixed, temperature stable 1.0V.
An external resistor divider from the VREF pin is used to
establish the voltage at the VSET1 and VSET2 pins. The
programmed voltage at the VSET1,2 pin is compared to
the respective input voltage (VIN1 or VIN2) scaled down
through an internal resistor divider with a ratio of 20:1 to
determine if that input is undervoltage. As a result, a voltage
+
–
VREF
VIN1,2
R1
VIN1,2
VIN
20
VSET1,2
2.34V
–
+
1.00V
LTC3126
–
+
UVLO1,2
R2
3126 F03
Figure 3. Programming the UVLO Thresholds on VIN1 and VIN2
range of zero to 1V on the VSET1,2 corresponds to a UVLO
threshold of zero to 20V on VIN1,2. In addition, there is a
fixed internal minimum UVLO threshold of 2.34V which is
always enforced independent of the programmed voltage
on the VSET1 and VSET2 pins. To enable a channel down
to this minimum UVLO threshold, the respective VSET1,2
pin can be simply connected to ground.
The LTC3126 power path has two operational modes as
determined by the state of the DIODE logic input. With
DIODE high, the part utilizes ideal diode-OR mode and operates from the input that has the higher voltage (assuming
both inputs are above their respective UVLO thresholds).
If one input is in UVLO then the other input will be utilized.
If both inputs are in UVLO then the buck converter will
be disabled. With the DIODE input low, the part operates
in priority mode whereby VIN1 is always given priority
and is utilized as long as it is above its UVLO threshold.
If VIN1 is in UVLO then VIN2 is utilized as long as it is not
in UVLO. If both VIN1 and VIN2 are in UVLO then the buck
converter is disabled.
All current drawn from the VREF pin is supplied by one of the
inputs, VIN1 or VIN2. If neither input is above its respective
UVLO threshold, then this current will be drawn from the
input with the higher voltage. Otherwise, this current will
be drawn by the active channel as determined by the power
path. The VREF pin current will be supplied by the EXTVCC
pin if that pin is utilized and has a valid voltage present.
The PRIORITY, VALID1 and VALID2 open-drain outputs
provide feedback on the state of the power path. The
VALID1 and VALID2 outputs indicate that the respective
input is present and above its UVLO threshold. Specifically,
3126f
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15
LTC3126
Operation
the VALID1 pin is driven low if the part is enabled (ENA is
high) and VIN1 is above its UVLO threshold. The VALID2
pin is driven low if the part is enabled and VIN2 is above
its UVLO threshold. The PRIORITY pin is driven low if the
part is enabled and the buck converter is operating from
the priority channel, VIN1. The PRIORITY pin provides the
ability to determine which input is being utilized in idealdiode mode when both inputs are valid.
The VCC rail stays powered even when the LTC3126 is
disabled (ENA is low) as long as either VIN1 or VIN2 is
powered. In this disabled state, the VCC output is powered
from whichever input (VIN1 or VIN2) is higher in voltage
independent of the state of the DIODE pin. Given that the
VCC output remains powered in shutdown, the ENA pin
can be connected to VCC to continuously enable the part.
Buck Converter Operation
The LTC3126 buck converter utilizes constant frequency
switching with peak current mode control to provide low
noise operation. The switching frequency can be set from
200kHz to 2.2MHz by appropriate choice of the RT pin
resistor. In addition, the buck converter can be synchronized to an external clock applied to the PWM/SYNC pin.
The buck converter always operates from a single input
power source (VIN1 or VIN2) at any time. The input that is
used is determined by the state of the DIODE input, the
programmed UVLO thresholds and the voltage of each
input as described in the PowerPath Operation section.
Each switching cycle begins with the high side switch of
the active input turning on. The high side switch remains
on until the inductor current reaches the current level set
by the output of the internally compensated error amplifier.
At that point, the low side synchronous rectifier turns on
and remains on for the remainder of the cycle or until the
inductor current falls to zero. The error amplifier continuously adjusts the commanded current level to maintain
regulation of the FB pin voltage.
If PWM/SYNC is forced high or has an external clock applied, then the buck converter will operate in PWM mode.
In PWM mode operation, the buck converter will maintain
fixed frequency switching at all possible load currents,
switching to pulse skipping only at very light load currents
when the minimum on-time of the SW is reached. PWM
mode provides low noise, fixed frequency operation and
low output voltage ripple over the widest possible range
of load currents and should be used when it is necessary
to maintain the lowest possible noise levels. With PWM/
SYNC forced low, the converter will automatically transition to Burst Mode operation at light loads to increase
efficiency and reduce no-load quiescent current.
The LTC3126 buck converter is current limit protected
to prevent damage to the IC during output overload and
short-circuit conditions. If the inductor current exceeds
the high side switch current limit threshold then the high
side switch is turned off for the remainder of the cycle.
If the inductor current exceeds the low side current limit
threshold, then the high side switch will remain off during
the next cycle to prevent increasing the inductor current
further during the high side switch minimum on-time. In
addition, the switching frequency is reduced by a factor
of 16 if the FB voltage is below 200mV to ensure control
of the inductor current is maintained during output overcurrent conditions.
The internal circuitry of the buck converter including the
gate drivers is powered from VCC. Internal LDOs generate the VCC rail from the active input, VIN1 or VIN2. In
applications where the buck converter output is 3.3V or
greater, the VCC rail can be bootstrapped by connecting
the EXTVCC pin to the buck converter output. This allows
a third LDO to generate the VCC rail directly from EXTVCC.
Given that the buck converter has much greater efficiency
than the LDOs, bootstrapping via the EXTVCC pin increases
the efficiency of the converter and reduces its quiescent
current. This is particularly the case for applications with
high input voltage, low output voltage and high switching
frequencies.
3126f
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LTC3126
Applications Information
Input UVLO Thresholds on VIN1, VIN2
The undervoltage lockout threshold for each input, VIN1
and VIN2, is set by the voltage on the VSET1 and VSET2
pins respectively. A voltage between 0V and 1V on VSET1,2
linearly programs a corresponding UVLO threshold of
zero to 20V. There is also an additional internal minimum
undervoltage lockout threshold of 2.34V on each input
which is always in effect independent of the voltage at
the VSET1,2 pins. To allow an input to operate fully down
to the internal minimum UVLO threshold, the respective
VSET1,2 pin can be connected to ground.
In most applications, the voltage at the VSET1 and VSET2
pin is established using a resistor divider from the VREF
pin as shown in Figure 4. The corresponding rising UVLO
threshold is given by the following equation:
VUVLO1,2 = 20VSET1,2 = 20V
R2
R1+R2
When neither input is valid (above its respective UVLO
threshold), the current drawn from the VREF pin will add
directly to the quiescent current of the higher voltage input
(VIN1 or VIN2). Therefore, use of large value resistors in
the VSET1,2 divider string will reduce the quiescent current. However, larger value resistors also result in lower
immunity to noise and leakage currents. A reasonable
compromise in most applications is to utilize a total resistor string impedance of 1MΩ.
LTC3126
VSET1,2
R2
LTC3126
VSET1,2
R2
VSET2,1
R3
3126 F05
Figure 5. Setting Both Input UVLO Thresholds Using
a Single Resistor String
Resistor R3 can be chosen independently and selecting
R3 equal to 200k is a reasonable starting choice for most
applications. The value of R2 and R1 can then be determined from the following equations where VUVLOH is the
undervoltage lockout threshold on the higher voltage
channel and VULVOL is the UVLO threshold on the lower
voltage channel:
V
R2 = R3 UVLOH – 1
VUVLOL
20
– 1
R1= (R2+R3)
VUVLOH
If the resulting total resistance through the resistor chain
(R1 + R2 + R3) is larger or smaller then desired, the choice
of R3 can be adjusted in the appropriate direction and the
calculation for R2 and R1 can be repeated.
Input Hold-Up Capacitance
VREF
R1
VREF
R1
GND
3126 F04
Figure 4. Setting the Input UVLO Thresholds
To minimize quiescent current and eliminate an external
resistor it is also possible to set both UVLO thresholds via
a single resistor string as shown in Figure 5. The upper
resistor divider tap is connected to whichever pin, VSET1
or VSET2, requires the higher UVLO threshold.
The LTC3126 features internal micropower UVLO comparators which minimize the quiescent current required
by the application. However, due to their low operating
current, the UVLO comparators exhibit a significant delay
when responding to an undervoltage condition. Sufficient
input hold-up capacitance must be provided to ensure the
voltage on the utilized channel remains sufficient to power
the buck converter until the transition to the secondary
channel is completed.
Consider the example illustrated in Figure 6 where the
LTC3126 is being powered by the priority input (VIN1)
at 12.8V and the UVLO threshold on the VIN1 channel is
3126f
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17
LTC3126
Applications Information
programmed to 10V. At time t1, the priority input is unplugged and the buck converter begins discharging the
input capacitor. At time t2, the UVLO threshold is reached
but the buck converter remains operating from the priority channel due to the comparator delay. At time t3, after
comparator delay tDELAY, the buck converter switches over
to the secondary input (VIN2) and the input capacitor on
VIN1 maintains its voltage since there is no longer any
current being drawn on that channel. In this example, the
input capacitor on VIN1 must be large enough that VIN1
remains at sufficient voltage to maintain the output voltage
in regulation until time t3. If VIN1 is allowed to drop lower
than the regulated output voltage then the buck converter
output will temporarily lose regulation during the transition.
tDELAY
VIN1
IIN2
t1
t2
t3
3126 F06
Figure 6. Waveforms During Transition from VIN1 to VIN2
The required value of hold-up capacitance, CIN, can be
estimated from the following equation where VOUT is the
buck converter regulated output voltage, ILOAD is the buck
converter load current, η is the buck converter efficiency,
VUVLO is the falling UVLO threshold of the active channel
and VMIN is the minimum required input voltage needed
for the buck converter to maintain regulation.
CIN =
2 ( 3.3V ) ( 2.5A ) ( 60µs )
2
2
0.80[(10V ) – ( 4V ) ]
= 14.7
µs • A
= 14.7µF
V
Therefore, in this example a minimum capacitor value of
15µF or greater must be utilized on VIN1 to maintain regulation of the buck converter output throughout the transition to the secondary channel. In practice, an additional
guardband should be included to account for variations
in component tolerances and delays.
Soft-Start
10V
CIN =
+ 700mV = 4V. Finally, assuming an efficiency of 80%,
the minimum required input hold-up capacitance on the
priority channel can be calculated as:
2VOUT •ILOAD • tDELAY
(
η VUVLO2 – VMIN2
)
In the example from Figure 6, the UVLO threshold, VUVLO,
is 10V. The typical comparator delay of tDELAY = 60µs is
specified in the Electrical Characteristics section of this
data sheet. For the sake of this example, consider a buck
converter output voltage of 3.3V with a 2.5A load. The
buck converter dropout voltage at 2.5A is approximately
700mV. Therefore, the minimum buck converter input
voltage, VMIN, required to maintain regulation is 3.3V
The LTC3126 incorporates an internal soft-start circuit with
a nominal duration of 7.5ms. The soft-start is implemented
by a linearly increasing ramp of the error amplifier reference voltage during the soft-start duration. As a result, the
duration of the soft-start period is largely unaffected by the
size of the output capacitor or the output regulation voltage.
Given the closed-loop nature of the soft-start implementation, the converter is able to respond to load transients that
occur during the soft-start interval. The soft-start period
is reset by thermal shutdown, when the buck converter is
disabled via the ENA pin and when both inputs are in UVLO.
VREF Output
The VREF output is a regulated, temperature stable 1.00V
voltage reference. It is intended primarily to be used to
establish the VSET1 and VSET2 pin voltages. However, it
can also be used for other functions as long as the total
current drawn from the pin is limited to 1mA or less.
In addition to that restriction, there is also a maximum
amount of capacitance that can be placed on the VREF pin
in order to maintain suitable phase margin in the internal
pin driver. The maximum recommended capacitance on
the VREF pin is 470pF or less. If the VREF pin is not being
used in the application (i.e., there is no resistor from VREF
to GND) then the VREF pin should be connected to VCC.
The VREF pin cannot be left floating. The VREF pin is only
powered when the part is enabled (ENA is high).
3126f
18
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LTC3126
Applications Information
Buck Converter Switching Frequency
The LTC3126 buck converter utilizes fixed-frequency PWM
to achieve low output ripple and low noise operation. The
switching frequency can be set from 200kHz to 2.2MHz
by appropriate selection of the RT resistor placed between
the RT pin and ground. See the Quick Reference section
for details on selecting the value for RT.
Higher switching frequencies facilitate the use of smaller
inductors as well as smaller input and output capacitors
which results in a smaller solution size and reduced component height. However, higher switching frequencies also
generally reduce conversion efficiency due to increased
switching losses.
The on-time of the buck converter SW pin decreases as
the step-down ratio from VIN to VOUT increases and as the
switching frequency is increased. The minimum switch
on-time, tON(MIN), is the smallest duration on-time that the
SW pin can generate. If the required on-time is shorter
than the minimum on-time then the part will pulse skip to
maintain regulation. Although regulation of the output will
be maintained, pulse skipping results in lower frequency
switching and increased output voltage ripple. In order to
avoid pulse-skipping operation, the switching frequency
should be selected to be less than fSW(MAX) as given by
the following equation where tON(MIN) is the minimum SW
pin on time with a typical value of 60ns:
fSW(MAX) =
VOUT
VIN • tON(MIN)
The SW minimum on-time is a function of load current
and temperature as shown in the Typical Performance
Characteristics section.
Input Capacitors
To ensure proper functioning of the buck converter, minimize EMI and reduce input ripple, the PVIN1 and PVIN2 pins
must each be connected to a low ESR bypass capacitor
with a value of at least 4.7µF. Ceramic capacitors with
X5R or X7R dielectric are recommended. Each bypass
capacitor must be located as close as possible to the respective pin and should connect to the ground plane via
the shortest route possible.
When powered through an inductive connection such as
a long cable, the inductance of the power source and the
input bypass capacitor form a High-Q resonant LC filter.
In such applications, hot-plugging into a powered source
can lead to a significant voltage overshoot, even up to
twice the nominal input source voltage. Care must be
taken in such situations to ensure that the absolute maximum input voltage rating of the LTC3126 is not violated.
See Linear Technology Application Note 88 for solutions
to increase damping in the input filter and minimize this
voltage overshoot.
The VIN1 and VIN2 pins provide power to the VCC regulator
and other internal circuitry. Each of these pins should be
connected to a 0.1µF bypass capacitor located as close
to the pin as possible.
Buck Output Capacitor
A low ESR capacitor should be utilized at the output of
the buck converter in order to minimize output voltage
ripple. For most applications, a ceramic capacitor with
X5R or X7R dielectric is the optimal choice. There is also
a minimum required output capacitor value as specified
in the Quick Reference section. The crossover frequency
of the voltage control loop increases with lower output
capacitance and therefore a minimum capacitance value
is required to limit the bandwidth and ensure stability
of the voltage feedback loop. Given that the loop gain is
dependent on the voltage divider ratio, the minimum required output capacitor is a function of the output voltage
as well. At lower output voltages, the loop gain is higher
and a larger output capacitor is required to maintain a
fixed loop crossover frequency. The larger recommended
output capacitance at low output voltages also helps to
reduce the magnitude of voltage steps on load transients
in proportion to the reduced output voltage rail in order
to maintain a constant percentage deviation.
Increasing the value of the buck converter output capacitor
will decrease the bandwidth of the feedback loop. If the
output capacitor gets too large, the crossover frequency
may decrease too far below the compensation zero leading to degraded phase margin and underdamped transient
response. In such cases, the phase margin and transient
performance can be improved by increasing the size
3126f
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19
LTC3126
Applications Information
of the feedforward capacitor in parallel with the upper
resistor divider resistor to restore the full bandwidth of
the feedback loop.
Feedforward Resistor
In applications where there is a long connection between
the feedback resistor divider and the point at which the
output voltage is sensed, it is recommended that a 10k
feedforward resistor (RFF) be added in series with the
feedforward capacitor as shown in Figure 7 below. The
feedforward resistor prevents high frequency noise on
the VOUT trace from coupling into the sensitive FB node.
The addition of a 10k feedforward resistor will have little
impact on the frequency response of the control loop
since the divider pole location is dominated by the values
of resistors RTOP and RBOT.
LTC3126
RTOP
VOUT
RBOT
3126 F07
Figure 7. Feedforward Resistor (RFF) for Improved
Noise Robustness
Inductor Selection
The choice of inductor value influences both the efficiency
and the magnitude of the output voltage ripple. Larger
inductance values will reduce inductor current ripple and
will therefore lead to lower output voltage ripple. For a
fixed DC resistance, a larger value inductor will yield higher
efficiency via reduced RMS and core losses. However, a
larger inductor within a given inductor family will generally
have a greater series resistance, thereby counteracting
this efficiency advantage. The peak-to-peak current ripple,
∆IL, given by the following equation will be largest at the
highest input voltage experienced in the application.
∆IL =
VOUT VOUT
1–
fSW •L
VIN
High values of inductor ripple current will reduce the output current capability of the converter since higher ripple
increases the peak switch current and will therefore trip
the current limit at a lighter load current. The maximum
output current is equal to the current limit minus half the
peak-to-peak ripple current as shown in the following
equation where ILIMIT is the threshold of the high side
switch current limit:
CFF
FB
GND
RFF
10k
A reasonable choice for ripple current is ∆IL = 1A which
represents 33% of the minimum current limit. The DC current rating of the inductor should be at least equal to the
maximum load current plus half the ripple current in order
to prevent core saturation and loss of efficiency during
operation. To optimize efficiency the inductor should have
a low DC resistance. As a general guideline, the inductor
resistance (ESR) should be approximately equal to the
low side switch resistance (70mΩ) or less.
IOUT(MAX) =ILIMIT –
∆IL
2
In addition, there is a minimum inductor value required
to maintain stability of the current loop as determined by
the fixed internal slope compensation. Specifically, if the
buck converter is going to be utilized at duty cycles over
50%, the inductance value must be at least equal to LMIN
as given by the following equation:
LMIN =
MHz VOUT
•
µH
fSW 2V
To ensure sufficient slope compensation if the external
synchronization feature is being used, the inductor must
be sized for the lowest possible switching frequency the
part will experience which is determined by the internal
oscillator frequency.
PGOOD Output
The open-drain PGOOD output is driven low whenever FB
is more than +9.8%/–8.7% (typical) from the FB reference
voltage. The PGOOD output is also driven low whenever
the buck converter is disabled. The maximum voltage that
can be applied to the PGOOD output is 5.5V. The PGOOD
comparator has a deglitching delay of approximately 200µs.
3126f
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LTC3126
Applications Information
VCC Regulators and Bootstrapping with EXTVCC
The VCC rail powers the internal control circuitry and
power device gate drivers of the LTC3126. Two internal
low dropout linear regulators provide the ability to generate
this rail from either VIN1 or VIN2. When the IC is disabled
(ENA low) the VCC rail is powered by the higher voltage
input, VIN1 or VIN2, regardless of the state of the VSET1,
VSET2 and DIODE pins. When the IC is enabled, the input
voltage comparators on the VSET1 and VSET2 pins become
active and the VCC rail will be powered by the active channel. In ideal diode mode (DIODE high) the active channel
is the valid input with the higher voltage. In priority mode
(DIODE low) the active channel is VIN1 if VIN1 is valid or
VIN2 otherwise (assuming it is valid). If both VIN1 and VIN2
are in UVLO then the higher voltage input will be utilized
to power the VCC rail.
A third linear regulator allows the VCC rail to be powered
via the EXTVCC pin which can be connected to the buck
converter output or an auxiliary rail with a voltage above
3.15V. When operating at high input voltages, the losses
in the VCC regulator powered from the input voltage can
become a significant factor in conversion efficiency and
can even become a substantial source of power dissipation.
A significant performance improvement can be obtained
by connecting the EXTVCC input to the buck converter
output so that the gate drive current is provided through
the high efficiency buck converter rather than the less
efficient linear regulator. This is of particular benefit at
higher input voltages, lower output voltages and higher
switching frequencies. The EXTVCC pin is only utilized to
power the VCC rail when the buck converter is operating.
Thermal Considerations
The LTC3126 is designed to operate continuously up to
its full rated 2.5A output current. However, when operating at high current levels there will be significant heat
generated within the IC. In addition, in many applications
the VCC regulator is operated with large input-to-output
voltage differential resulting in significant levels of power
dissipation in its pass element which can add significantly
to the total power dissipated within the IC. To ensure full
output current capability and optimal efficiency, careful
consideration must be given to the thermal environment
of the IC. This is even more important in applications that
function over an extended ambient temperature range.
Specifically, the exposed die attach pad of both the QFN
and TSSOP packages must be soldered to the PC board
and the PC board should be designed to maximize the
conduction of heat out of the IC package. This can be
accomplished by utilizing multiple vias from the die attach
pad connection to other PCB layers containing a large area
of exposed copper.
If the die temperature exceeds approximately 170°C, the
IC will enter overtemperature shutdown and all switching
will be inhibited. The part will remain disabled until the
die cools by approximately 10°C. The soft-start circuit is
re-initialized in overtemperature shutdown to provide a
smooth recovery when the fault condition is removed.
PCB Layout Guidelines
The LTC3126 buck converter switches large currents at
high frequencies. Special attention must be paid to the PC
board layout to ensure a stable, noise-free and efficient
application circuit. Figures 6 and 7 show representative
PC board layouts for each package option to outline some
of the primary considerations. A few key guidelines are
listed below.
1. The parasitic inductance and resistance of all circulating
high current paths should be minimized. This can be
accomplished by keeping the routes to the inductor,
output capacitor and PVIN1/2 bypass capacitors as
short and as wide as possible. Capacitor ground connections should via down to the ground plane by way
of the shortest route possible. The bypass capacitors
on PVIN1, PVIN2 and VCC should be placed as close to
the IC as possible and should have the shortest possible
return paths to ground.
2. The exposed pad in both packages provides one of the
primary paths for heat generated within the package.
The IC must be soldered down to the backpad and the
backpad area should be filled with vias connecting it
to the ground plane.
3126f
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21
LTC3126
Applications Information
3. There should be an uninterrupted ground plane under
the entire converter in order to minimize the crosssectional area of the high frequency current loops.
This minimizes EMI and reduces the inductive drops
in these loops thereby minimizing SW pin overshoot
and ringing.
4. Connections to the PVIN1, PVIN2 and SW pins should
be made as wide as possible to reduce the series impedance. This will improve efficiency and reduce the
thermal resistance.
5. To prevent large circulating currents in the ground plane
from disrupting operation of the part, all small-signal
grounds should either return directly to the small-signal
ground pin (GND) or via down to the ground plane
close to the GND pin and not near the power stage
components. This includes the ground connections for
the RT resistor, the FB resistor divider and the VSET1
and VSET2 resistor dividers.
6. Keep the routes connecting to the high impedance
noise sensitive inputs (FB, RT, VSET1, VSET2) as short
as possible to minimize noise pickup.
7. The BST1/BST2 pins transition at the switching frequency to the full input voltage. To minimize radiated
noise and coupling, keep the routes connecting to the
boost capacitors as short as possible and keep these
routes away from all sensitive circuitry and pins (FB,
RT, VSET1, VSET2).
8. The connection to the VIN1 pin (Pin 25) should be
separate from the connection to the PVIN1 (Pin 24) and
should have a separate 0.1µF bypass capacitor. This will
prevent noise from the PVIN1 trace from being coupled
into the sensitive VIN1 pin.
VIN1
VIN2
VIN2
28 27 26 25 24 23
VIN1
1
28
2
27
26
1
22
3
2
21
4
25
3
20
5
24
4
19
6
23
5
18
7
22
6
17
8
21
7
16
9
20
8
15
10
19
11
18
12
17
13
16
14
15
9 10 11 12 13 14
CONNECT
TO
VOUT
VOUT
CONNECT
TO
VOUT
VIN2
ALL COMPONENTS DISPLAYED
ABOVE SHOULD BE PLACED AS
CLOSE TO THE IC AS POSSIBLE
VIA TO GROUND PLANE
3126 F08
OUTLINE OF UNINTERRUPTED
GROUND PLANE
Figure 8. Recommended PC Board Layout for QFN Package
ALL COMPONENTS DISPLAYED
ABOVE SHOULD BE PLACED AS
CLOSE TO THE IC AS POSSIBLE
VIA TO GROUND PLANE
VOUT
VIN2
3126 F09
OUTLINE OF UNINTERRUPTED
GROUND PLANE
Figure 9. Recommended PC Board Layout for TSSOP Package
3126f
22
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LTC3126
Typical Applications
12V, 1MHz Step-Down Converter with Dual Inputs
0.1µF
13.1V TO 42V
13.1V TO 42V
4.7µF
4.7µF
4.7µF
12V, 2MHz Step-Down Converter with Dual Inputs
0.1µF
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE GND PGND
L1
6.8µH
22pF
1M
VOUT
12V
COUT 2.5A
22µF
×2
13.1V TO 42V
13.1V TO 42V
4.7µF
L1: COILCRAFT XAL4030
COUT: TDK C4532X7R1E226M250KC
94% EFFICIENCY, VIN = 24V, 1A LOAD
92% EFFICIENCY, VIN = 36V, 2A LOAD
10µA NO LOAD IQ AT VIN = 24V
450mV DROPOUT AT 1A LOAD
1.05V DROPOUT AT 2.5A LOAD
6V TO 42V
4.7µF
4.7µF
4.7µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE GND PGND
3126 TA04
5V, 750kHz Step-Down Converter with Dual Inputs
6V TO 42V
4.7µF
73.2k
33.2k
3126 TA03
0.1µF
4.7µF
0.1µF
3126 TA05
L1
4.7µH
33pF
1M
VOUT
5V
COUT 2.5A
47µF
×2
6V TO 42V
6V TO 42V
4.7µF
4.7µF
196k
44.2k
L1
4.7µH
12pF
1M
VOUT
12V
COUT 2.5A
33µF
73.2k
16.5k
L1: COILCRAFT XAL4030
COUT: CHEMI-CON KTS250B366M55N0B00
92% EFFICIENCY, VIN = 24V, 1.5A LOAD
89% EFFICIENCY, VIN = 36V, 1.5A LOAD
11µA NO LOAD IQ AT VIN = 24V
0.6V DROPOUT AT 1A LOAD
1.1V DROPOUT AT 2.5A LOAD
5V, 2MHz Step-Down Converter with Dual Inputs
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE GND PGND
0.1µF
4.7µF
L1: COILCRAFT XAL4030
COUT: MURATA GRM43ER61A476KE19L
93% EFFICIENCY, VIN = 12V, 1A LOAD
90% EFFICIENCY, VIN = 24V, 1.5A LOAD
3µA NO LOAD IQ AT VIN = 24V
330mV DROPOUT AT 1A LOAD
850mV DROPOUT AT 2.5A LOAD
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE GND PGND
3126 TA06
L1
3.3µH
10pF
1M
VOUT
5V
COUT 2.5A
22µF
×2
196k
16.5k
L1: TOKO FDSD0518
COUT: MURATA GRM43ER71A226KE01L
91% EFFICIENCY, VIN = 12V, 1A LOAD
87% EFFICIENCY, VIN = 24V, 1.5A LOAD
3µA NO LOAD IQ AT VIN = 24V
390mV DROPOUT AT 1A LOAD
680mV DROPOUT AT 2A LOAD
3126f
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23
LTC3126
Typical Applications
3.3V, 750kHz Step-Down Converter with Dual Inputs
0.1µF
4.2V TO 42V
4.2V TO 42V
4.7µF
4.7µF
4.7µF
3.3V, 2MHz Step-Down Converter with Dual Inputs
0.1µF
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE GND PGND
L1
4.7µH
10pF
909k
VOUT
3.3V
COUT 2.5A
47µF
4.3V TO 25V
42V TRANSIENT*
4.7µF
4.3V TO 25V
42V TRANSIENT*
4.7µF
301k
44.2k
3126 TA07
4.7µF
L1: COILCRAFT XAL4030
91% EFFICIENCY, VIN = 12V, 1A LOAD
87% EFFICIENCY, VIN = 24V, 1A LOAD
2µA NO LOAD IQ AT VIN = 24V
330mV DROPOUT AT 1A LOAD
660mV DROPOUT AT 2A LOAD
1.8V, 750kHz Step-Down Converter with Dual Inputs
0.1µF
2.4V TO 36V
42V TRANSIENT*
4.7µF
2.4V TO 36V
42V TRANSIENT*
4.7µF
4.7µF
3126 TA09
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE
GND PGND
68pF
280k
VOUT
1.8V
COUT 2.5A
100µF
×2
2.4V TO 14V
42V TRANSIENT*
4.7µF
2.4V TO 14V
42V TRANSIENT*
4.7µF
232k
44.2k
15pF
909k
VOUT
3.3V
COUT 2.5A
22µF
×2
301k
16.5k
L1: TOKO FDSD0518
COUT: MURATA GRM43ER71A226KE01L
88% EFFICIENCY, VIN = 12V, 1A LOAD
80% EFFICIENCY, VIN = 24V, 1A LOAD
4µA NO LOAD IQ AT VIN = 24V
400mV DROPOUT AT 1A LOAD
750mV DROPOUT AT 2A LOAD
1.8V, 2MHz Step-Down Converter with Dual Inputs
0.1µF
L1
3.3µH
L1
3.3µH
3126 TA08
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE
GND PGND
0.1µF
4.7µF
L1: COILCRAFT XAL4030
COUT: AVX 12106D107KAT2A
86% EFFICIENCY, VIN = 12V, 1A LOAD
79% EFFICIENCY, VIN = 24V, 1.5A LOAD
5µA NO LOAD IQ AT VIN = 24V
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
RT
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE
GND PGND
3126 TA10
L1
2.2µH
82pF
280k
VOUT
1.8V
COUT 2.5A
100µF
×2
232k
16.5k
L1: TOKO FDSD0518
COUT: AVX 12106D107KAT2A
87% EFFICIENCY, VIN = 5V, 1A LOAD
80% EFFICIENCY, VIN = 12V, 1A LOAD
5µA NO LOAD IQ AT VIN = 12V
*The step-down converter can operate over the specified input voltage range without any pulse skipping for loads from 250mA to 2.5A. However, in all
applications, the converter can operate from an input voltage as high as 42V, but pulse skipping may occur if operated above the specified voltage range.
Pulse skipping is not detrimental to the IC, but can result in significant output voltage ripple and is therefore generally avoided while in nominal operating
conditions.
3126f
24
For more information www.linear.com/LTC3126
LTC3126
Typical Applications
Automotive and Photovoltaic Powered 5V USB Supply
0.1µF
AUTOMOTIVE
12V NOMINAL
8V TO 40V
18V
PHOTOVOLTAIC
PANEL
22µF
+
4.7µF
309k
+
BST2 COM2 BST1 COM1
VIN2
PVIN2
SW
EXTVCC
VIN1
PVIN1
FB
PVCC
LTC3126
VCC
ENA
VREF
PRIORITY
VSET1
VALID1
VSET2
VALID2
PWM/SYNC
PGOOD
DIODE
RT
GND
PGND
4.7µF
+
0.1µF
432k
499k
L1
4.7µH
10pF
VOUT
5V
COUT 2.5A
47µF
976k
191k
33.2k
3126 TA11a
fSW = 1MHz
VIN1 UVLO THRESHOLD = 15V
VIN2 UVLO THRESHOLD = 8V
L1: COILCRAFT XAL4030
Efficiency, VIN = 12V
100
Burst Mode OPERATION
90
EFFICIENCY (%)
80
70
60
50
40
PWM Mode
30
20
10
0
0.001
0.01
0.1
LOAD CURRENT (A)
1
4
3126 TA11b
Photovoltaic Panel Disconnect
(Switch to Automotive Input)
Load Step, 250mA to 2.5A
VIN1, VIN2
5V/DIV
VOUT
200mV/DIV
INDUCTOR
CURRENT
1A/DIV
50µs/DIV
VIN = 18V
3126 TA11c
VIN2
VIN1
VOUT
200mV/DIV
INDUCTOR CURRENT
2A/DIV
IIN2
2A/DIV
50µs/DIV
3126 TA11d
VIN1 = 18V
VIN2 = 12.8V
2.5A LOAD
3126f
For more information www.linear.com/LTC3126
25
LTC3126
Typical Applications
5V, 2A Supply from Wall Adapter and Lead-Acid Backup Battery
0.1µF
12V WALL
ADAPTER INPUT
+
12V
SEALED
LEAD-ACID
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
ENA
VREF
4.7µF
47µF
ELECT
+
0.1µF
4.7µF
4.7µF
499k
VSET1
VSET2
499k
PWM/SYNC
DIODE
GND
PRIORITY
VALID1
VALID2
PGOOD
RT
PGND
L1
4.7µH
47µF
10pF
VOUT
5V
2A
976k
191k
33.2k
3126 TA12a
fSW = 1MHz
L1: COILCRAFT XAL5030
Efficiency, VIN = 12V
100
Load Step, 200mA to 2A
Burst Mode OPERATION
90
VOUT
200mV/DIV
EFFICIENCY (%)
80
70
60
INDUCTOR CURRENT
1A/DIV
50
40
PWM Mode
30
50µs/DIV
3126 TA12c
VIN1 = 12V
20
10
0
0.0001
0.001
0.01
0.1
LOAD CURRENT (A)
1
4
3126 TA12b
Wall Adapter Plug-In Transient
VIN1, VIN2
5V/DIV
VIN2
VIN1, VIN2
5V/DIV
VIN1
VOUT
200mV/DIV
IIN1
1A/DIV
INDUCTOR CURRENT
2A/DIV
VIN2
VOUT
200mV/DIV
IIN1
1A/DIV
INDUCTOR CURRENT
2A/DIV
20µs/DIV
2A LOAD
Wall Adapter Disconnect Transient
3126 TA12d
VIN1
50µs/DIV
3126 TA12e
2A LOAD
3126f
26
For more information www.linear.com/LTC3126
LTC3126
Typical Applications
3.3V/2.5A Supply from 24V Wall Adapter and Lead-Acid Battery
0.1µF
24V
WALL ADAPTER
12V
LEAD-ACID
+
4.7µF
4.7µF
4.7µF
499k
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
ENA
PWM/SYNC
PRIORITY
VREF
VALID1
VSET1
VALID2
VSET2
PGOOD
RT
DIODE GND
PGND
499k
L1
4.7µH
12pF
1.13M
VOUT
3.3V
COUT 2.5A
47µF
×2
374k
33.2k
3126 TA13a
fSW = 1MHz
VIN1 UVLO THRESHOLD = 20V
VIN2 UVLO THRESHOLD = 10V
L1: WURTH 744 778 9004
Load Step, 250mA to 2.5A
Soft-Start
ENA
2V/DIV
VOUT
200mV/DIV
VOUT
2V/DIV
PGOOD
5V/DIV
INDUCTOR CURRENT
1A/DIV
INDUCTOR CURRENT
1A/DIV
100µs/DIV
3126 TA13b
2ms/DIV
3126 TA13c
VIN = 24V
Wall Adapter Plug-In Transient
VIN1, VIN2
10V/DIV
VIN1
Wall Adapter Disconnect Transient
VIN1, VIN2
10V/DIV
VIN2
VIN1
VIN2
VOUT
200mV/DIV
IIN1
1A/DIV
INDUCTOR CURRENT
2A/DIV
VOUT
200mV/DIV
IIN1
1A/DIV
INDUCTOR CURRENT
2A/DIV
50µs/DIV
3126 TA13d
50µs/DIV
3126 TA13e
3126f
For more information www.linear.com/LTC3126
27
LTC3126
Package Description
Please refer to http://www.linear.com/product/LTC3126#packaging for the most recent package drawings.
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev C)
0.70 ±0.05
4.50 ±0.05
3.10 ±0.05
2.50 REF
2.65 ±0.05
3.65 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
3.50 REF
4.10 ±0.05
5.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.05
TYP
PIN 1 NOTCH
R = 0.20 OR 0.35
× 45° CHAMFER
2.50 REF
R = 0.115
TYP
27
28
0.40 ±0.10
PIN 1
TOP MARK
(NOTE 6)
1
2
5.00 ±0.10
(2 SIDES)
3.50 REF
3.65 ±0.10
2.65 ±0.10
(UFD28) QFN 0816 REV C
0.200 REF
0.00 – 0.05
0.25 ±0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGHD-3).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3126f
28
For more information www.linear.com/LTC3126
LTC3126
Package Description
Please refer to http://www.linear.com/product/LTC3126#packaging for the most recent package drawings.
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation EB
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
4.75
(.187)
28 27 26 2524 23 22 21 20 1918 17 16 15
6.60 ±0.10
4.50 ±0.10
2.74
(.108)
SEE NOTE 4
0.45 ±0.05
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
6.40
2.74
(.252)
(.108)
BSC
1.05 ±0.10
0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.09 – 0.20
(.0035 – .0079)
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN MILLIMETERS
(INCHES)
3. DRAWING NOT TO SCALE
1 2 3 4 5 6 7 8 9 10 11 12 13 14
0.25
REF
1.20
(.047)
MAX
0° – 8°
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE28 (EB) TSSOP REV K 0913
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
3126f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its circuits
as described
herein will not infringe on existing patent rights.
For more
information
www.linear.com/LTC3126
29
LTC3126
Typical Application
3.3V Supply with 200ms Transient Ride-Through Capability
0.1µF
12V
INPUT RAIL
L1
10µH
0.1Ω
4.7µF
D1
35V
4.7µF
ISN
ISP
SW
LT1618
+
887k
FB
SHDN
33.2k
1000µF
50V
ELECT
×3
VCC
4.7µF
4.7µF
VIN
4.7µF
0.1µF
BST2 COM2 BST1 COM1
VIN1
PVIN1
SW
EXTVCC
VIN2
PVIN2
FB
PVCC
LTC3126
VCC
ENA
249k
2k
D1: MBR0530
L1: SUMIDA CR43-100
L2: BOURNS SRN5020-4R7M
249k
VSET1
VSET2
PWM/SYNC
DIODE
GND
PRIORITY
VALID1
VALID2
PGOOD
RT
VIN1
10V/DIV
100k
100k
33.2k
3126 TA02a
Power-Up Waveforms
VIN1
10V/DIV
VIN2
10V/DIV
VIN1
10V/DIV
VIN2
20V/DIV
VOUT
2V/DIV
IIN1
500mA/DIV
VOUT
2V/DIV
IIN2
2A/DIV
VOUT
2V/DIV
3126 TA02b
374k
fSW = 1MHz
VIN2
10V/DIV
100ms/DIV
1.13M
PGND
VOUT Hold-Up with Loss of
Input Supply
Transient Ride-Through
VOUT
3.3V
47µF 2A
VCC
VREF
10nF
10pF
100k
499k
IADJ GND VC
L2
4.7µH
50ms/DIV
3126 TA02c
100ms/DIV
3126 TA02d
Related Parts
PART NUMBER
DESCRIPTION
COMMENTS
LT®8609
42V, 2A (3A Peak) 2MHz Synchronous Step-Down
Regulator with IQ = 2.5µA
VIN: 3V to 42V, IQ = 2.5μA, ISD = 1μA, MSOP-10E Package
LTC3118
18V, 2A Buck-Boost DC/DC Converter with Low Loss
Dual Input PowerPath
VIN: 2.2V to 18V, IQ = 50μA, ISD = 2μA, TSSOP-28, QFN-24 Packages
LT8610
42V, 2.5A Synchronous Step-Down Regulator
VIN: 3.4V to 42V, IQ = 2.5μA, ISD = 1μA, MSOP-16 Package
LTC4417
Prioritized PowerPath Controller
Controller for External P-Channel MOSFETs, Three Channels,
VIN: 2.5V to 36V, IQ = 28μA, SSOP-24, QFN-24 Packages
LTC3114-1
40V, 1A Synchronous 4-Switch Monolithic Buck-Boost
DC/DC Converter
VIN: 2.2V to 40V, VOUT: 2.7V to 40V, IQ = 30μA, ISD = 3μA,
TSSOP-16, DFN-16 Packages
LTC3115-1
40V, 2A Synchronous 4-Switch Monolithic Buck-Boost
DC/DC Converter
VIN: 2.7V to 40V, VOUT: 2.7V to 40V, IQ = 30μA, ISD = 3μA,
TSSOP-20, DFN-16 Packages
3126f
30 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LTC3126
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LTC3126
LT 0916 • PRINTED IN USA
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