LTC3410
2.25MHz, 300mA
Synchronous Step-Down
Regulator in SC70
U
FEATURES
DESCRIPTIO
■
The LTC ®3410 is a high efficiency monolithic synchronous buck regulator using a constant frequency, current
mode architecture. The device is available in adjustable
and fixed output voltage versions. Supply current during
operation is only 26µA, dropping to 2.5V
10µH or 2x 4.7µF
4.7µF
If tantalum capacitors are used, it is critical that the
capacitors are surge tested for use in switching power
supplies. An excellent choice is the AVX TPS series of
surface mount tantalum. These are specially constructed
and tested for low ESR so they give the lowest ESR for a
given volume. Other capacitor types include Sanyo
POSCAP, Kemet T510 and T495 series, and Sprague 593D
and 595D series. Consult the manufacturer for other
specific recommendations.
Output Voltage Programming (LTC3410 Only)
Using Ceramic Input and Output Capacitors
The efficiency of a switching regulator is equal to the
output power divided by the input power times 100%. It is
often useful to analyze individual losses to determine what
is limiting the efficiency and which change would produce
the most improvement. Efficiency can be expressed as:
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high ripple
current, high voltage rating and low ESR make them ideal
for switching regulator applications. Because the
LTC3410’s control loop does not depend on the output
capacitor’s ESR for stable operation, ceramic capacitors
can be used freely to achieve very low output ripple and
small circuit size.
The output voltage is set by a resistive divider according
to the following formula:
⎛ R2⎞
VOUT = 0.8V ⎜ 1+ ⎟
( 2)
⎝ R1⎠
The external resistive divider is connected to the output,
allowing remote voltage sensing as shown in Figure 2.
Efficiency Considerations
Efficiency = 100% – (L1 + L2 + L3 + ...)
0.8V ≤ VOUT ≤ 5.5V
R2
However, care must be taken when ceramic capacitors are
used at the input and the output. When a ceramic capacitor
is used at the input and the power is supplied by a wall
adapter through long wires, a load step at the output can
induce ringing at the input, VIN. At best, this ringing can
couple to the output and be mistaken as loop instability. At
worst, a sudden inrush of current through the long wires
VFB
LTC3410
R1
GND
3410 F02
Figure 2. Setting the LTC3410 Output Voltage
3410fb
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LTC3410
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APPLICATIO S I FOR ATIO
where L1, L2, etc. are the individual losses as a percentage
of input power.
Although all dissipative elements in the circuit produce
losses, two main sources usually account for most of the
losses in LTC3410 circuits: VIN quiescent current and I2R
losses. The VIN quiescent current loss dominates the
efficiency loss at very low load currents whereas the I2R
loss dominates the efficiency loss at medium to high load
currents. In a typical efficiency plot, the efficiency curve at
very low load currents can be misleading since the actual
power lost is of no consequence as illustrated in Figure 3.
1. The VIN quiescent current is due to two components:
the DC bias current as given in the electrical characteristics and the internal main switch and synchronous
switch gate charge currents. The gate charge current
results from switching the gate capacitance of the
internal power MOSFET switches. Each time the gate is
switched from high to low to high again, a packet of
charge, dQ, moves from VIN to ground. The resulting
dQ/dt is the current out of VIN that is typically larger than
the DC bias current. In continuous mode,
IGATECHG = f(QT + QB) where QT and QB are the
gate charges of the internal top and bottom
switches. Both the DC bias and gate charge
losses are proportional to VIN and thus their effects will
be more pronounced at higher supply voltages.
2. I2R losses are calculated from the resistances of the
internal switches, RSW, and external inductor RL. In
continuous mode, the average output current flowing
through inductor L is “chopped” between the main
switch and the synchronous switch. Thus, the series
resistance looking into the SW pin is a function of both
top and bottom MOSFET RDS(ON) and the duty cycle
(DC) as follows:
RSW = (RDS(ON)TOP)(DC) + (RDS(ON)BOT)(1 – DC)
The RDS(ON) for both the top and bottom MOSFETs can
be obtained from the Typical Performance Charateristics
curves. Thus, to obtain I2R losses, simply add RSW to
RL and multiply the result by the square of the average
output current.
Other losses including CIN and COUT ESR dissipative
losses and inductor core losses generally account for less
than 2% total additional loss.
Thermal Considerations
In most applications the LTC3410 does not dissipate
much heat due to its high efficiency. But, in applications
where the LTC3410 is running at high ambient
temperature with low supply voltage and high duty
cycles, such as in dropout, the heat dissipated may
exceed the maximum junction temperature of the part. If
1
VIN = 3.6V
POWER LOSS (W)
0.1
0.01
0.001
0.0001
0.00001
0.1
VOUT = 3.3V
VOUT = 1.8V
VOUT = 1.2V
10
100
1
LOAD CURRENT (mA)
1000
3410 F03
Figure 3. Power Loss vs Load Current
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the junction temperature reaches approximately 150°C,
both power switches will be turned off and the SW node
will become high impedance.
To avoid the LTC3410 from exceeding the maximum
junction temperature, the user will need to do some
thermal analysis. The goal of the thermal analysis is to
determine whether the power dissipated exceeds the
maximum junction temperature of the part. The temperature rise is given by:
TR = (PD)(θJA)
where PD is the power dissipated by the regulator and
θJAis the thermal resistance from the junction of the die to
the ambient temperature.
The junction temperature, TJ, is given by:
T J = TA + TR
where TA is the ambient temperature.
As an example, consider the LTC3410 in dropout at an
input voltage of 2.7V, a load current of 300mA and an
ambient temperature of 70°C. From the typical performance graph of switch resistance, the RDS(ON) of the
P-channel switch at 70°C is approximately 1.0Ω.
Therefore, power dissipated by the part is:
PD = ILOAD2 • RDS(ON) = 90mW
For the SC70 package, the θJA is 250°C/ W. Thus, the
junction temperature of the regulator is:
TJ = 70°C + (0.09)(250) = 92.5°C
which is well below the maximum junction temperature
of 125°C.
Note that at higher supply voltages, the junction temperature is lower due to reduced switch resistance (RDS(ON)).
Checking Transient Response
The regulator loop response can be checked by looking at
the load transient response. Switching regulators take
several cycles to respond to a step in load current. When
a load step occurs, VOUT immediately shifts by an amount
equal to (∆ILOAD • ESR), where ESR is the effective series
resistance of COUT. ∆ILOAD also begins to charge or
discharge COUT, which generates a feedback error signal.
The regulator loop then acts to return VOUT to its steadystate value. During this recovery time VOUT can be monitored for overshoot or ringing that would indicate a stability
problem. For a detailed explanation of switching control
loop theory, see Application Note 76.
A second, more severe transient is caused by switching in
loads with large (>1µF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with COUT, causing a rapid drop in VOUT. No regulator can
deliver enough current to prevent this problem if the load
switch resistance is low and it is driven quickly. The only
solution is to limit the rise time of the switch drive so that
the load rise time is limited to approximately (25 • CLOAD).
Thus, a 10µF capacitor charging to 3.3V would require a
250µs rise time, limiting the charging current to about
130mA.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3410. These items are also illustrated graphically in
Figures 4 and 5. Check the following in your layout:
1. The power traces, consisting of the GND trace, the SW
trace and the VIN trace should be kept short, direct and
wide.
3410fb
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LTC3410
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APPLICATIO S I FOR ATIO
1
1
RUN
2
–
VFB
GND
+
2
6
COUT
VOUT
L1
VIN
SW
5
6
COUT
VOUT
R1
4
VOUT
GND
–
R2
3
RUN
LTC3410-1.875
LTC3410
3
+
L1
CFWD
SW
VIN
5
CIN
4
CIN
VIN
VIN
3410 F04b
3410 F04a
BOLD LINES INDICATE HIGH CURRENT PATHS
BOLD LINES INDICATE HIGH CURRENT PATHS
Figure 4a. LTC3410 Layout Diagram
Figure 4b. LTC3410-1.875 Layout Diagram
VIA TO GND
R1
VOUT
VOUT
VIN
VIA TO VIN
VIA TO VOUT
R2
PIN 1
L1
PIN 1
L1
CFWD
LTC3410
VIN
VIA TO VIN
LTC34101.875
SW
SW
COUT
COUT
CIN
CIN
GND
3410 F05b
3410 F05a
Figure 5b. LTC3410 Fixed Output Voltage
Suggested Layout
Figure 5a. LTC3410 Suggested Layout
2. Does the VFB pin connect directly to the feedback
resistors? The resistive divider R1/R2 must be connected between the (+) plate of COUT and ground.
3. Does the (+) plate of CIN connect to VIN as closely as
possible? This capacitor provides the AC current to the
internal power MOSFETs.
4. Keep the (–) plates of CIN and COUT as close as possible.
5. Keep the switching node, SW, away from the sensitive
VFB node.
Design Example
As a design example, assume the LTC3410 is used in a
single lithium-ion battery-powered cellular phone
application. The VIN will be operating from a maximum of
4.2V down to about 2.7V. The load current requirement
is a maximum of 0.3A but most of the time it will be in
standby mode, requiring only 2mA. Efficiency at both low
and high load currents is important. Output voltage is
3V. With this information we can calculate L using
Equation (1),
L=
⎛ V ⎞
1
VOUT ⎜ 1− OUT ⎟
( f)(∆IL ) ⎝ VIN ⎠
(3)
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LTC3410
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APPLICATIO S I FOR ATIO
Substituting VOUT = 3V, VIN = 4.2V, ∆IL = 100mA
and f = 2.25MHz in Equation (3) gives:
L=
of less than 0.5Ω. In most cases, a ceramic capacitor will
satisfy this requirement. From Table 2, Capacitance Selection, COUT = 10µF and CIN = 4.7µF.
3V
3V ⎞
⎛
⎜ 1−
⎟ = 3.8µH
2.25MHz(100mA) ⎝ 4.2V ⎠
For the feedback resistors, choose R1 = 301k. R2 can
then be calculated from equation (2) to be:
A 4.7µH inductor works well for this application. For best
efficiency choose a 350mA or greater inductor with less
than 0.3Ω series resistance.
⎛V
⎞
R2 = ⎜ OUT − 1⎟ R1= 827.8k ; use 825k
⎝ 0.8
⎠
Figure 6 shows the complete circuit along with its
efficiency curve.
CIN will require an RMS current rating of at least 0.125A ≅
ILOAD(MAX)/2 at temperature and COUT will require an ESR
VIN
2.7V
TO 4.2V
4
CIN††
4.7µF
CER
VIN
SW
3
VOUT
3V
10pF
LTC3410
1
4.7µH*
COUT†
10µF
CER
RUN
VFB
6
825k
GND
2, 5
301k
3410 F06a
†
TAIYO YUDEN JMK212BJ106
TAIYO YUDEN JMK212BJ475
*MURATA LQH32CN4R7M23
††
Figure 6a
100
90
VOUT
100mV/DIV
AC COUPLED
EFFICIENCY (%)
80
70
60
50
IL
200mA/DIV
40
30
20
VIN = 3.6V
VIN = 4.2V
10
0
0.1
1
10
ILOAD (mA)
100
1000
3410 F06b
Figure 6b
ILOAD
200mA/DIV
20µs/DIV
VIN = 3.6V
VOUT = 3V
ILOAD = 100mA TO 300mA
3410 F06c
Figure 6c
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LTC3410
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TYPICAL APPLICATIO S
Using Low Profile Components,