LTC5531
Precision 300MHz to 7GHz
RF Detector with Shutdown
and Offset Adjustment
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DESCRIPTIO
FEATURES
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■
■
■
■
■
■
■
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Temperature Compensated Internal Schottky
Diode RF Detector
Wide Input Frequency Range: 300MHz to 7GHz*
Wide Input Power Range: –32dBm to 10dBm
Buffered Detector Output
Precision VOUT Offset Control
Wide VCC Range of 2.7V to 6V
Low Operating Current: 500µA
Low Shutdown Current: 120mV, VOUT is the sum of VOS plus the
detected RF signal.
VOUT (Pin 5): Detector Output.
VCC (Pin 6): Power Supply Voltage, 2.7V to 6V. VCC should
be bypassed appropriately with ceramic capacitors.
W
BLOCK DIAGRA
RFSOURCE
VCC
6
SD
+
BIAS
BUFFER
SHUTDOWN
500Ω
RFIN
1
VOUT
4
VOS
30k
500Ω
30k
180Ω
100Ω
SD
31k
+
25pF
RF DET
24k
50µA
GND 2
5
–
+
80k
–
SD
50µA
–
80k
120mV
+
160k
3
5531 BD
SHDN
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LTC5531
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APPLICATIO S I FOR ATIO
the input range of a variety of analog-to-digital converters.
VOUT will not change until VOS exceeds 120mV. The
voltage at VOUT for VOS ≥120mV and with no RF signal
present is:
Operation
The LTC5531 RF detector integrates several functions to
provide RF power detection over frequencies ranging from
300MHz to 7GHz. These functions include an internal frequency compensated buffer amplifier, an RF Schottky diode peak detector and level shift amplifier to convert the RF
input signal to DC and a delay circuit to avoid voltage transients at VOUT when powering up. The LTC5531 has both
shutdown and voltage offset adjustment capabilities.
VOUT = VOS
VOUT will exactly track VOS above 120mV.
RF Detector
The internal RF Schottky diode peak detector and level
shift amplifier converts the RF input signal to a low
frequency signal. The detector demonstrates excellent
efficiency and linearity over a wide range of input power.
The Schottky diode is biased at about 55µA and drives a
25pF internal peak detector capacitor.
Buffer Amplifier
The output buffer amplifier is capable of supplying typically 4mA into a load. The amplifier has a bandwidth of
2MHz and a fixed internal gain of two.
The VOS input controls the DC input voltage to the buffer
amplifier. VOS must be connected to ground if the DC
output voltage is not to be changed. The buffer is initially
trimmed to approximately 120mV with VOS connected to
ground.
Shutdown
The part is in shutdown mode when SHDN is low. The
supply current is reduced to < 2µA and VOUT is shorted to
ground via a 280Ω resistor. When SHDN is asserted high,
the part is enabled after about 8µs.
The VOS pin is used to change the initial VOUT starting
voltage. This function enables the LTC5531 output to span
Demo Board Schematic
VCC
2.7V TO 6V
RFIN
C4
39pF
1
R1
(OPT)
2
3
VCC
SHDN
22k
C1
0.1µF
LTC5531ES6
RFIN
VCC
GND VOUT
SHDN VOS
C2
100pF
6
5
4
VOS
VOUT
C3
(OPT)
5531 DB
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LTC5531
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APPLICATIO S I FOR ATIO
Applications
The LTC5531 can be used as a self-standing signal strength
measuring receiver for a wide range of input signals from
–32dBm to 10dBm for frequencies from 300MHz to 7GHz.
Operation at higher frequencies is achievable. Consult
factory for more information.
The LTC5531 can be used as a demodulator for AM and
ASK modulated signals with data rates up to 2MHz.
Depending on specific application needs, the RSSI output
can be split between two branches, providing AC-coupled
0.1µF
LTC5531ES6
1
2
3
DISABLE ENABLE
RFIN
VCC
GND VOUT
SHDN VOS
data (or audio) output and DC-coupled RSSI output for
signal strength measurements and AGC.
The LTC5531 can be used for RF power detection and
control. Figure 1 is an example of transmitter power
control, using the LTC5531 with a capacitive tap to the
power amplifier. A 0.5pF capacitor (C1) followed by a
200Ω resistor (R1) forms a coupling circuit with about
20dB loss at 900MHz referenced to the LTC5531 RF input
pin. In the actual product implementation, component
values for the capacitive tap may be different depending on
parts placement, PCB parasitics and parameters of the
antenna.
Li-Ion
Tx PA
MODULE
R1
200Ω
1%
C1
0.5pF
±0.05pF
CELL BAND
6
DIPLEXER
5
4
PCS BAND
OFFSET
ADJUSTMENT
MOBILE
PHONE
DSP
VPC
BSE
5532 F01
Figure 1. Mobile Phone Tx Power Control Application with a Capacitive Tap
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LTC5531
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PACKAGE DESCRIPTIO
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
0.62
MAX
2.90 BSC
(NOTE 4)
0.95
REF
1.22 REF
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.30 – 0.45
6 PLCS (NOTE 3)
0.95 BSC
0.80 – 0.90
0.20 BSC
0.01 – 0.10
1.00 MAX
DATUM ‘A’
0.30 – 0.50 REF
0.09 – 0.20
(NOTE 3)
1.90 BSC
S6 TSOT-23 0302
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
11
LTC5531
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Linear Technology Corporation
LT/TP 0104 1K • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
LINEAR TECHNOLOGY CORPORATION 2004