LTM4664A
30V to 58V Input, Dual 30A, Single 60A µModule
Regulator with Digital Power System Management
FEATURES
DESCRIPTION
Complete 48V Input to Low Voltage Dual 30A Supply
that Can Scale to 300A, Nonisolated
n Dual Analog Loops with Digital Interface for
Compensation, Control and Monitoring
n Input Voltage Range: 30V to 58V
n Output Voltage Range: 0.5V to 1.2V at 30A/Channel
n ±3% Output Current Readback Accuracy (–20° to 125°C)
n 87% Efficiency for 48V to 1V at 60A, 90% at 40A
n ±0.5% Output Voltage Accuracy Over Temperature
n 400kHz PMBus-Compliant I2C Serial Interface
n 16mm × 16mm × 7.72mm BGA Package
The LTM®4664A is a complete nonisolated 48V input
high efficiency step-down µModule® regulator with dual
30A outputs. The switching controllers, power MOSFETs,
inductors and supporting components are included. Only
external capacitors are needed to complete the design.
Operating over a 30V to 58V input voltage range, the
LTM4664A supports an output voltage of 0.5V to 1.5V at up
to 75W. An intermediate output at 25% • VIN is also available.
The LTM4664A product video is available on the website.
n
The LTM4664A dual 30A regulators utilize digitally programmable analog control loops, precision data acquisition
circuitry and EEPROM with ECC. The LTM4664A’s 2-wire
serial interface allows the 30A outputs to be margined,
tuned and ramped up and down at programmable slew
rates and sequencing delay times. True input current sense,
output currents and voltages, input and output power, temperatures, uptime and peak values are all readable for Dual
30A Power System Management (PSM) channels.
APPLICATIONS
48V Systems
Computer and Networking Equipment
n Electronic Test Equipment
n Storage Systems
n
n
Click to view associated TechClip Videos.
All registered trademarks and trademarks are the property of their respective owners. Protected
by U.S. Patents including 5408150, 5481178, 5705919, 5929620, 6144194, 6177787, 6580258,
7420359, 8163643. Licensed under U.S. Patent 7000125 and other related patents worldwide.
TYPICAL APPLICATION
48V to VCORE at 60A
48V to 1V Up to 60A
95
INTVCCS1
CFLY2
CER
CFLY1
CER
10k
PGOOD_C0
PGOODVCORE
85
80
75
SWC0
FREQS1
RFREQS1
INTVCC
RUNS1
SW1
VINS1
SW2
VOUT1
RUNS2
PGOODS1
VINS2F
SW3
VINS2
SW4
ON/OFF
VOUT2
CBULK
90
CBULK
10k
PINS NOT SHOWN FOR 2-PHASE 60A SECTION:
VOUTC0_CFG, VTRIMC0_CFG, VOUTC1_CFG, VTRIMC1_CFG,
FSWPH_CFG, TSNSC0a, TSNSC0b, TSNSC1a, TSNSC1b,
PWM_C0, PWM_C1, GL_C0, GL_C1, PHFLT_C0, PHFLT_C1,
EXTVCC, SHARE_CLK, SCL, SDA, ALERT, SYNC
VOUT2
48V
CER
EFFICIENCY (%)
PINS NOT SHOWN FOR 4:1 VOLTAGE DIVIDER:
VOUT2_SET, OVP_TRIP, VP_SET, INSNSS2+, INSNSS2–,
UVS1, UVS2, HYS_PRGM1, HYS_PRGM2, TIMERS1,
TIMERS2, INSNSS1+, INSNSS1–, FAULTS1, FAULTS2
VCORE 60A
VOUTC0
FREQS2
GND
RFREQS2
70
48VIN, 1.0VOUT EFFICIENCY
0
10
COUT3
20
30
40
OUTPUT CURRENT (A)
50
60
4664A TA01c
SGND_C0_C1
4.7µF
INTVCCS1
VOSNS+_C0
EXTVCCS1
VOUT2
1µF
4.7µF
VOSNS–_C0
LTM4664A
EXTVCCS2
PGOOD_C1
INTVCCS2
SWC1
VOUTC1
IN+
COUT4
LTM4664A
48VIN
VDD25
INTVCC
PGOODS2
4:1 DIVIDER
VOUT1 VIN/2
VIN/4
DUAL
PSM
BUCK
VOUTC0
VOUTC1
0.5V TO 1.2V/30A
0.5V TO 1.2V/30A
VOUT2
4664A TA01b
RSEL
COMPH1
COMPH0
INTVCC
PGOODS2
PGOODS2
RUN_C1
VDD33
VOSNS–_C1
COMP_C1a
VOSNS+_C1
RUN_C0
VINS3_C1
COMP_C0a
10k
VINS3_C0
COMP_C1b
VDD33
LOAD
SGND_C0_C1
COMP_C0b
CER
GND
IN
ASEL
VOUT2
PGOODVCORE
4.7µF
VDD25
4664A TA01a
PMBus
Rev. 0
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1
LTM4664A
TABLE OF CONTENTS
Features...................................................... 1
Applications................................................. 1
Typical Application ......................................... 1
Description.................................................. 1
Absolute Maximum Ratings............................... 4
Pin Configuration........................................... 4
Order Information........................................... 5
Electrical Characteristics.................................. 5
Typical Performance Characteristics................... 15
4:1 Divider Block Diagram............................... 25
Dual 25A/30A Power System Management (PSM)
Block Diagram.............................................. 26
4:1 Divider Operation..................................... 27
4:1 Divider Description............................................ 27
Main Control............................................................ 27
INTVCCS1,2 /EXTVCCS1,2 Power................................. 27
Start-Up and Shutdown........................................... 28
Fault Protection and Thermal Shutdown.................. 28
High Side Current Sensing....................................... 28
Frequency Selection................................................. 28
Power Good and UV (PGOODSn and UVSn pins)....29
Additional Overvoltage Protection...........................29
4:1 Divider Application Information..................... 30
Voltage Divider Pre-Balance Before Switching........30
Overcurrent Protection............................................ 31
Window Comparator Programming......................... 31
Effective Open Loop Output Resistance and
Load Regulation....................................................... 32
Undervoltage Lockout.............................................. 32
Fault Response and Timer Programming................. 32
Design Example.......................................................33
Dual 25A/30A PSM Operation............................ 35
PSM Section Overview, Major Features...................35
EEPROM with ECC ..................................................36
Power-Up and Initialization ..................................... 37
Soft-Start ................................................................38
Time-Based Sequencing .........................................38
Voltage-Based Sequencing .....................................38
Shutdown ............................................................... 39
Light-Load Current Operation ................................. 39
Switching Frequency and Phase..............................40
PWM Loop Compensation ......................................40
Output Voltage Sensing ..........................................40
2
INTVCC/EXTVCC Power ...........................................40
Output Current Sensing and Sub Milliohm DCR
Current Sensing ...................................................... 41
Input Current Sensing ............................................. 41
PolyPhase Load Sharing ......................................... 41
External/Internal Temperature Sense ...................... 42
RCONFIG (Resistor Configuration) Pins .................. 42
Fault Detection and Handling ..................................45
Status Registers and ALERT Masking .....................46
Mapping Faults to FAULT Pins ................................48
Power Good Pins ....................................................48
CRC Protection .......................................................48
Serial Interface .......................................................48
Communication Protection .....................................48
Device Addressing ..................................................48
Responses to VOUT and IIN/IOUT Faults ................... 49
Output Overvoltage Fault Response ........................ 49
Output Undervoltage Response ..............................50
Peak Output Overcurrent Fault Response ...............50
Responses to Timing Faults ....................................50
Responses to VIN OV Faults ....................................50
Responses to OT/UT Faults .....................................50
Internal Overtemperature Fault Response ...............50
External Overtemperature and Undertemperature
Fault Response ..................................................... 51
Responses to Input Overcurrent and Output
Undercurrent Faults ................................................ 51
Responses to External Faults .................................. 51
Fault Logging .......................................................... 51
Bus Timeout Protection .......................................... 51
Similarity Between PMBus, SMBus and I2C
2-Wire Interface ...................................................... 52
PMBus Serial Digital Interface ................................ 52
Figure 11 thru Figure 28 PMBus Protocols..............54
PMBus Command Summary............................. 57
PMBus Commands ................................................. 57
Dual 25A/30A PSM Applications Information.......... 63
VIN to VOUT Step-Down Ratios ................................63
Input Capacitors .....................................................63
Output Capacitors ...................................................63
Light Load Current Operation..................................63
Switching Frequency and Phase .............................64
Output Current Limit Programming ........................65
Rev. 0
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LTM4664A
TABLE OF CONTENTS
Minimum On-Time Considerations .........................66
Variable Delay Time, Soft-Start and Output
Voltage Ramping ....................................................66
Digital Servo Mode .................................................66
Soft Off (Sequenced Off) ........................................ 67
Undervoltage Lockout .............................................68
Fault Detection and Handling ..................................68
Open-Drain Pins .....................................................68
Phase-Locked Loop and Frequency
Synchronization ......................................................69
Input Current Sense Amplifier ................................. 70
Programmable Loop Compensation ....................... 70
Checking Transient Response ................................. 71
PolyPhase® Configuration ......................................72
Connecting the USB to I2C/SMBus/PMBus Controller
to the LTM4664A In-System ...................................72
LTpowerPlay: An Interactive GUI for Digital Power..73
PMBus Communication and
Command Processing .............................................73
Thermal Considerations and Output
Current Derating ..................................................... 75
Table 10 and Table 11: Output Current Derating
(Based on Demo Board).......................................... 78
Dual 25A/30A PSM Applications Information–
Derating Curves............................................ 81
EMI Performance ....................................................82
Safety Considerations .............................................82
Layout Checklist/Example ......................................83
Typical Applications....................................... 84
PMBus Command Details................................ 90
Addressing and Write Protect..................................90
General Configuration Commands...........................92
On/Off/Margin.........................................................93
PWM Configuration.................................................95
Voltage.....................................................................98
Input Voltage and Limits..........................................98
Output Voltage and Limits.......................................99
Output Current and Limits..................................... 102
Input Current and Limits ....................................... 104
Temperature........................................................... 105
External Temperature Calibration........................... 105
Timing................................................................... 106
Timing—On Sequence/Ramp................................ 106
Timing—Off Sequence/Ramp............................... 107
Precondition for Restart........................................ 108
Fault Response...................................................... 108
Fault Responses All Faults..................................... 108
Fault Responses Input Voltage.............................. 109
Fault Responses Output Voltage............................ 109
Fault Responses Output Current............................ 112
Fault Responses IC Temperature........................... 113
Fault Responses External Temperature.................. 114
Fault Sharing.......................................................... 115
Fault Sharing Propagation..................................... 115
Fault Sharing Response......................................... 117
Scratchpad............................................................ 117
Identification.......................................................... 118
Fault Warning and Status....................................... 119
Telemetry............................................................... 126
NVM Memory Commands..................................... 130
Store/Restore........................................................ 130
Fault Logging......................................................... 131
Block Memory Write/Read..................................... 135
Package Description.................................... 136
Typical Applications..................................... 138
Related Parts............................................. 138
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3
LTM4664A
ABSOLUTE MAXIMUM RATINGS
(Note 1)
EXTVCC......................................................... –0.3V to 6V
VOUTCn....................................................... –0.3V to 3.6V
VOSNS+_Cn.................................................... –0.3V to 6V
VOSNS –_Cn................................................. –0.3V to 0.3V
RUN_Cn, SDA, SCL, ALERT....................... –0.3V to 5.5V
FSWPH_CFG, VOUTCn_CFG, VTRIMCn_CFG, ASEL,
COMP_1a, COMP_1b, COMP_0a, COMP_0b.........–0.3V to 2.75V
FAULT_Cn, SYNC, SHARE_CLK, WP, PGOOD_Cn,
PWM_Cn, PHFLT_Cn.................................. –0.3V to 3.6V
TSNS_Cna,................................................ –0.3V to 2.2V
TSNS_Cnb..................................... –0.3V to 0.8V, < 5mA
OVP-SET IMAX Sink..................................... ………. 5mA
INTVCC VDD33, VDD25 and GL_Cn are Outputs.
Internal Operating Temperature
Range (Notes 2, 14, 15).............................–40°C to 125°C
Storage Temperature Range................... –55°C to 125°C
Peak Solder Reflow (Package Body) Temperature. 245°C
4:1 Divider
VINS1, SW1, SW2, INSNSS1+, INSNSS1–,
FAULTS1, FAULTS2..............................................–0.3V to 60V
VINS2, VINS2F, INSNSS2+, INSNSS2–, PGOODS1,
PGOODS2, EXTVCCS1, EXTVCCS2, SW3, SW4,
OVP_SET, VOUT2_SET, OVP_TRIP, VOUT1........–0.3V to 40V
VOUT2............................................................ 0.3V to 20V
INTVCCS1, INTVCCS2................OUTPUT ONLY, RATED 6V
RUNS1, RUNS2............................................. –0.3V to 6V
UVS1, UVS2, HYS_PRGMS1, HYS_PRGMS2,
TIMERS1, TIMERS2, FREQS1,
FREQS2......................–0.3V to INTVCCS1, –0.3 to INTVCCS2
DUAL 25A/30A PSM SECTION
VINS3_Cn, IN+, IN–....................................... –0.3V to 18V
(VINS3_Cn – IN+), (IN+ – IN–)...................... –0.3V to 0.3V
SWC0, SWC1............... –1V to 18V, –5V to 18V Transient
PIN CONFIGURATION
TOP VIEW
1
2
3
4
5
A
6
7
8
9
10
11
VOUTC1
12
13
14
15
16
VOUTC0
B
C
–
INSNSS2
OVP_SET
VOUT2_SET
HYS_PRGMS2
TIMERS2
SW4
RUNS2
VOUT2
D
VOUT1
VINS2
SW3
VINS2F
E
INSNSS2+
INTVCCS1
PGOODS1
OVP_TRIP
UVS1
FREQS1
EXTVCCS2
H
FREQS2
INTVCCS2
PGOODS2
UVS2
FAULTS2
VOUTC0_CFG
VOUTC1_CFG
VDD25
VDD33
PHFLT_C1
L
M
N
VOSNS+_C1
GL_C1
INSNSS1
VINS1
PWM_C1
SHARE_CLK SDA
COMP_1b
VINS3_C1
PGOOD_C1
TSNS_C1b
T
FAULT_C0
SCL TSNSC_0a
VINS3_C0
SGN_DC0_C1
SGND_C0_C1
INTVCC EXTVCC
SWC1
PHFLT_C0
TSNSC_1a
FAULT_C1
PWM_C0
SYNC
COMP_0b
GL_C0
IN–
P
R
FSWPH_CFG
+
INSNSS1
RUN_C0
WP RUN_C1
K
VOSNS–_C1
SW1
–
ALERT
J
VTRIMC0_CFG
COMP_1a
FAULTS1
HYS_PRGMS1
ASEL
VTRIMC1_CFG
EXTVCCS1
RUNS1 TIMERS1
F
G
SW2
+
IN
SWC0
COMP_0a
VOSNS–_C0
PGOOD_C0
VOSNS+_C0
TSNS_C0b
GND
BGA PACKAGE
240-PIN (16mm × 16mm × 7.72mm)
TJMAX = 125°C, θJCTOP = 5.47 C/W, θJCBOTTOM = 2.15 C/W, θJA = 5.3 C/W
θJC VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS.
θJA VALUE IS OBTAINED FROM MEASUREMENTS WITH DEMO BOARD. WEIGHT = 7.26 GRAMS.
REFER TO PAGE 78 FOR LAB MEASUREMENT AND DERATING INFORMATION.
NOTE: NOT RECOMMENDED FOR BACK-SIDE REFLOW SOLDERING. SEE WEBSITE FOR MORE INFORMATION.
4
Rev. 0
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LTM4664A
ORDER INFORMATION
PART MARKING
PART NUMBER
LTM4664AIY#PBF
PAD OR BALL FINISH
SAC305 (RoHS)
DEVICE
FINISH CODE
PACKAGE
TYPE
MSL
RATING
e1
BGA
3
LTM4664AY
• Contact the factory for parts specified with wider operating temperature
ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
TEMPERATURE RANGE
(SEE NOTE 2)
–40°C to 125°C
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
• LGA and BGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the internal operating
junction temperature. TA = 25°C, VINS1 = 48V, and RUNn = 5V where n = stage # unless otherwise noted. See Figure 46 configuration
for setup. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VINS1
Input DC Voltage Stage 1
Note 4
30
58
V
VINS2
Input DC Voltage Stage 2
Note 4
15
29
V
VOUT1 Range
VOUT1 Output Range
Note 4
15
29
V
7.5V
14.5
V
75
W
4:1 Divider Section
VOUT2 Range
VOUT2 Output Range
Note 4
Maximum Power
Maximum Output Power
All Conditions, Note 4
VOUT1(DC)
VOUT1 OUTPUT
Note 4, Based on Figure 49
VINS1 = 48V, RUN = 5V, IVOUT1 = 0A
l
23.5
24
24.5
V
VOUT2(DC)
VOUT2 OUTPUT
Note 4, Based on Figure 49
VINS2 = 24V, RUN = 5V, IVOUT2 = 0A
l
11.5
12
12.5
V
VUVLO
Undervoltage Lockout
INTVCC Falling
INTVCC Rising
4.85
5.05
V
V
IQ VINSn
VINS1, VINS2 Quiescent Current Each
Stage
RUNn = 0V
RUNn = 5V, No Switching
RUNn = 5V, Switching
150
1.6
44
µA
mA
mA
Overcurrent Protection Section
INSNSS1+
Stage 1 Current Sense+
INSNSS1+ = INSNSS1– = 60V
VOUT1 = 30V, RUNS1 = 5V
220
350
µA
INSNSS2+
Stage 2 Current Sense+
INSNSS2+ = INSNSS2– = 30V
VOUT2 = 15V, RUNS2 = 5V
220
350
µA
INSNSS1–
Stage 1 Current Sense–
INSNSS1+ = INSNSS1– = 60V,
RUNS1 = 0V
INSNSS2–
Stage 2 Current Sense–
INSNSS2+ = INSNSS2– = 30V,
RUNS2 = 0V
INSNSS1, INSNSS2 Current Limit Threshold
Threshold
for Each Stage
l
–5
1
5
µA
l
–5
1
5
µA
l
45
50
55
mV
Pre Charge Balance
RVINS2F
VINS2 Resistance to GND
See Block Diagram (Note 10)
1
MΩ
RVF2
Resistance Between Pins
VINS2 to VINS2F
See Block Diagram
Part of a RC Filter Stage 2
1
kΩ
INSNSS1+ Balance
Current
Stage 1 Current Sense + Source
Pre-Balance Phase VINS1 = 60V
INSNSS1+ = INSNSS1– = 60V, VOUT1 = 15V , Timer = 1V
95
mA
INSNSS2+ Balance
Current
Stage 2 Current Sense + Source
Pre-Balance Phase VINS2 = 30V
INSNSS2+ = INSNSS2– = 30V, VOUT2 = 10V, Timer = 1V
95
mA
ISOURCE VOUTn
ISOURCE Current to Pre-Start Up Balance VOUTn and CFLYn, n = Stage #
INSNSSn = VINSn = 24V VOUTn = 10V, Timer = 0.8V
See Block Diagram
95
mA
Rev. 0
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LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the internal operating
junction temperature. TA = 25°C, VINS1 = 48V, and RUNn = 5V where n = stage # unless otherwise noted. See Figure 46 configuration
for setup. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
ISINK VOUTn
ISINK Current to Pre-Start Up Balance INSNSSn = VINSn = 24V VOUTn = 11V, Timer = 0.8V
VOUTn and CFLYn, n = Stage #
See Block Diagram
MIN
TYP
MAX
50
UNITS
mA
RUNn Pins
VTH_RUNn
Run PIN Threshold
n = Stage #
VRUN Rising
VRUNn HYS
Run Pin Hysteresis
n = Stage #
90
mV
OVP-SET In
OVP-SET Input Range MAX
25
V
l
1.1
1.22
1.4
V
OVP Comparator
VOUT2-SET
VOUT2-SET Range MAX
25
V
IB
Input Bias I
VCM = 0V to 25V
30
mA
VOS
Input Offset
0.5V < VCM < 25V
3
mV
PSRR
Power Supply Rejection
0.5V < VCM < 25V (Note 10)
85
db
CMRR
Common Mode Rejection
0.5V < VCM < 25V (Note 10)
80
db
Delay
Propagation Delay
10
µs
OVP_Trip Sink
OVP_Trip Sink
ISINK = 5mA (Note 10)
0.35
V
Internal (LDO) Low Drop Out
Regulator, n = Stage #
30V < VINS1 < 58V, VEXTVCCS1 = 0V, Stage 1
15V < VINS2 < 19V, VEXTVCCS2 = 0V, Stage 2
ICC = 50mA, VEXTVCCSn = 0V
INTVCC Regulators
VINTVCCSn
VINTVCCSn Load
LDO Load Regulation
INTVCCSn IPeak
INTVCC Stage Peak Output Current
VINTVCCSn with
EXTVCC
LDO Output Range with EXTVCCn,
n = Stage #
12V < VEXTVCCn < 24V,
VINSn = 12V
VINTVCCSn Load
EXT
LDO Load Regulation with EXTVCC
ICC = 50mA, VEXTVCCn = 6.5V
VEXTVCCn Threshold EXTVCCn Switch Over
EXTVCCn Hysteresis
VEXTVCCn HYS
5.4
5.6
5.9
0.5
2
150
VEXTVCCn Ramping Positive
5.4
6.3
V
%
mA
5.6
5.9
V
1
2
%
6.5
6.65
V
400
mV
Switching Oscillator
Frequency Range n
Frequency Range
n = Stage #
100
1000
kHz
fNOM Stage 1
Optimized Efficiency Freq. Stage 1
FREQS1. Pin Resistor = 36.5k
100
kHz
fNOM Stage 2
Optimized Efficiency Freq. Stage 2
FREQS2. Pin Resistor = 60.4k
200
kHz
ΔVOUT/VOUT
Stage 1
Stage 1 Load Regulation Accuracy
VOUT1 = 24V, 0A to 3.2A Maximum = 75W
VINS1 = 48V, FREQS1 = 100kHz
CINB1 = 33µF (Bulk Input Capacitor)
CIN1 = 2.2µF 100V Ceramic, CFLY1 = 10µF 50V X6
COUT1 = 10µF 50V
3.5
%
VOUT1 Output Load
VOUT1 Max Load Current
(Note 4)
VOUT1 = 24V, 0A to 3.2A Maximum = 75W
VINS1 = 48V, FREQS1 = 100kHz
CINB1 = 33µF (Bulk Input Capacitor)
CIN1 = 2.2µF 100V Ceramic, CFLY1 = 10µF 50V X6
COUT1 = 10µF 50V
M1-M4 RDS-ON
Stage 1 MOSFET On Resistance
VGS = 5V (Note 16)
Output Specifications
6
3.2
18
A
mΩ
Rev. 0
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LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the internal operating
junction temperature. TA = 25°C, VINS1 = 48V, and RUNn = 5V where n = stage # unless otherwise noted. See Figure 46 configuration
for setup. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
ΔVOUT/VOUT
Stage 2
Stage 2 Load Regulation Accuracy
VOUT2 = 12V, 0A to 6.3A Maximum = 75W
VINS2 = 24V, FREQS2 = 200kHz
CINB2 = 33µF (Bulk Input Capacitor)
CIN2 = 10µF 50V Ceramic,
CFLY2 = 22µF 25V X6, COUT2 = 22µF 25V
VOUT2 Output Load
VOUT1 Max Load Current
(Note 4)
VOUT2 = 12V, 0A to 6.3A Maximum = 75W
VINS2 = 24V, FREQS2 = 200kHz
CINB2 = 33µF (Bulk Input Capacitor)
CIN2 = 10µF 50V Ceramic,
CFLY2 = 22µF 25V X6, COUT2 = 22µF 25V
M5-M8 RDS-ON
VOUT1, (AC)
Stage 2 MOSFET On Resistance
Output Ripple Voltage
10
150
mΩ
mVpk-pk
VOUT2, (AC)
Output Ripple Voltage
50
mVpk-pk
tSTART Stage 1
Turn-on Time
From RUN 1
VGS = 5V (Note 16)
VOUT1 = 24V, 0A to 3A VINS1 = 48V, FREQS1 = 100kHz
CINB1 = 33µF (Input Bulk Capacitor)
CIN1 = 2.2µF 100V Ceramic, CFLY1 = 10µF 50V X6
COUT1 = 10µF 50V
VOUT2 = 12V, 0A to 6A
VINS2 = 12V, FREQS2 = 200kHz
CINB2 = 33µF (Input Bulk Capacitor)
CIN2 = 10µF 50V Ceramic,
CFLY2 = 22µF 25V X6, COUT2 = 22µF 25V
VOUT1 = 0V at Start Up to 24V, 0A, VINS1 = 48V,
FREQS1 = 100kHz
CINB1 = 33µF (Input Bulk Capacitor)
CIN1 = 2.2µF 100V Ceramic, CFLY1 = 10µF 50V X6
COUT1 = 10µF 50V, CTIMERS1 = 0.22µF
VOUT2 = 0V at Start Up to 12V, 0A, VINS2 = 24V,
FREQS2 = 200kHz
CINB2 = 33µF (Input Bulk Capacitor)
CIN1 = 2.2µF 100V Ceramic, CFLY1 = 22µF, 25V X6
COUT2 = 22µF 25V, CTIMERS2 = 0.47µF
40
msec
75
msec
IFAULT = 2mA
VFAULT = 5V
0.2
tSTART Stage 2
Turn-on Time Stage 2
From RUN 2
MIN
TYP
MAX
5
UNITS
%
6.3
A
HYS_PRGMn and FAULTSn
VFAULTSn
IFAULT_LEAKSn
IHYS_PRGMSn
VFAULTSn
VFAULTSn
VFAULTSn
FAULT Voltage Low
FAULT Leakage Current
HYS_PRGM Setting Current
VOUTSn Fault Trip Level
VOUTSn Fault Trip Level
VOUTSn Fault Trip Level
UV COMPARATORn and PGOODn
Undervoltage Threshold
VUVTHSSn
Undervoltage Hysteresis
VHYS_PRGMSn
PGOOD Voltage Low
VPGOODSn
PGOOD Leakage Current
IPGOODSn_LEAK
TimerSn
TimerSn Current
ITIMERn
VINSn = 24V, VOUTn, HYS_PRGMSn = 0V,
VOUTSn Ramp Up
VOUTSn Ramp Down
VINSn = 24V, VOUTn, HYS_PRGMSn = 5V,
VOUTSn Ramp Up
VOUTSn Ramp Down
VINSn = 24V, VOUTn, HYS_PRGMSn = 2.4V,
VOUTSn Ramp Up
VOUTSn Ramp Down
UV Pin Voltage Rising
IPGOOD = 2mA
VPGOOD = 5V
VTIMER < 0.5V or VTIMER > 1.2V
0.5V < VTIMER < 1.2V
l
9
10
0.5
±1
11
l
l
12.2
11.6
12.3
11.7
12.45
11.8
V
V
l
l
12.7
11.1
12.8
11.2
12.9
11.4
V
V
l 14.15
l 9.5
14.3
9.65
14.45
9.8
V
V
0.99
1.01
120
0.35
1.03
V
mV
V
µA
3.5
7
0.5
±1
V
µA
µA
µA
µA
Rev. 0
For more information www.analog.com
7
LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 1, 2, 3). Specified as each individual output channel designated with n (Note 3). TA = 25°C,
VINS3 = 12V, RUN_Cn = 3.3V, EXTVCC = 0V, FREQUENCY_SWITCH = 350kHz and VOUTCn commanded to 1.000V unless otherwise noted.
Configured with factory default EEPROM settings, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DUAL 25A/30A PSM OUTPUT
VINS3
Input DC Voltage Operating
VOUTCn Diff Sensed on VOSNS+_Cn/VOSNS–_Cn-Pin-Pair;
l
7
16
V
l
0.5
1.5
V
1.005
1.015
V
V
VOUTCn
Range of Output Voltage
Regulation
VOUTCn(DC)
Output Voltage, Total Variation with
Line and Load
l 0.995 1.000
Digital Servo Engaged (MFR_PWM_MODEn[6] = 1b)
Digital Servo Disengaged (MFR_PWM_MODEn[6] = 0b) l 0.985 1.000
VOUTCn_CFG Commanded to 1.000V, VOUTCn Low
Range (MFR_PWM_MODEn[1] = 1b) (Note 6)
VINS3 UVLO
Undervoltage Lockout Threshold
VINTVCC Falling
VINTVCC Rising
3.55
3.9
V
V
IINRUSH(VINS3)
Input Inrush Current at Start-Up
VOUTCn =1V, VINS3 = 12V; No Load Besides Capacitors;
TON_RISEn = 3ms
400
mA
IS(VINS3,DCM)
Input Supply Current in
Discontinuous Mode Operation
Discontinuous Mode, MFR_PWM_MODEn[0] = 0b,
IOUTCn = 100mA
60
mA
IS(VINS3,FCM)
Input Supply Current in
Forced-Continuous Mode Operation
Forced Continuous Mode, MFR_PWM_MODEn[0] = 1b
IOUTn = 100mA
IOUTn = 30A VINS3 = 12V, VOUTn = 1V
80
3.0
mA
A
Shutdown, RUN_Cn = 0V
25
mA
IS(VINS3,SHUTDOWN) Input Supply Current in Shutdown
Commanded by Serial Bus or with Resistors
Present at Start-Up on VOUTCn_CFG, Differential
Remote Sense Path Voltage (Notes 4, 6)
Output Specifications
∆
∆
IOUTCn
Output Continuous Current Range
Utilizing MFR_PWM_MODE[7] = 0 ,
and Using ~IOUT = 34A , Page103, (Note 4)
ΔVOUTn (LINE)
Line Regulation Accuracy
Digital Servo Engaged (MFR_PWM_MODEn[6] = 0b)
Digital Servo Disengaged (MFR_PWM_MODEn[6] = 0b)
Open Circuit; IOUTCn = 0A, 7V ≤ VIN ≤ 16V, VOUT Low
Range (MFR_PWM_MODEn[1] = 1b),
FREQUENCY_SWITCH = 350kHz (Note 6)
0.03
0.03
±0.2
%/V
%/V
Load Regulation Accuracy
Digital Servo Engaged (MFR_PWM_MODEn[6] = 1b)
Digital Servo Disengaged (MFR_PWM_MODEn[6] = 0b) l
0A ≤ IOUTn ≤ 30A, VOUT Low Range,
(MFR_PWM_MODEn [1] = 1b) (Note 6)
0.03
0.2
0.5
%
%
VOUTn
ΔVOUTn (LOAD)
VOUTn
VOUTn(AC)
Output Voltage Ripple
0
30
10
fS (Each Channel)
VOUTCn Ripple Frequency
FREQUENCY_SWITCH Set to 350kHz (0xFABC)
Turn-On Overshoot
TON_RISEn = 3ms (Note 7)
8
mV
tSTART
Turn-On Start-Up Time
Time from VIN Toggling from 0V to 12V to Rising Edge
PGOOD_Cn, TON_DELAYn = 0ms, TON_RISEn = 3ms
30
ms
tDELAY(0ms)
Turn-On Delay Time
Time from First Rising Edge of RUN_Cn to Rising Edge
of PGOOD_Cn. TON_DELAYn = 0ms, TON_RISEn =
3ms, VINS3 Having Been Established for at Least 70ms
ΔVOUTn(LS)
Peak Output Voltage
Deviation for Dynamic Load Step
Load: 0A to 12.5A and 12.5A to 0A at 12.5A/μs,
VOUTn = 1V, VINS3 = 12V (Note 7) See Load Transient
Graph
40
mV
tSETTLE
Settling Time for
Dynamic Load Step
Load: 0A to 12.5A and 12.5A to 0A at 12.5A/μs,
VOUTn = 1V, VINS3 = 12V (Note 7) See Load Transient
Graph
30
µs
8
l
2.9
350
mV
ΔVOUTCn(START)
l
320
A
3.3
380
3.7
kHz
ms
Rev. 0
For more information www.analog.com
LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 1, 2, 3). Specified as each individual output channel designated with n (Note 3). TA = 25°C,
VINS3 = 12V, RUN_Cn = 3.3V, EXTVCC = 0V, FREQUENCY_SWITCH = 350kHz and VOUTCn commanded to 1.000V unless otherwise noted.
Configured with factory default EEPROM settings, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
IOUTn(OCL_AVg)
Output Current Limit, Time Averaged
Time-Averaged Output Inductor Current Limit Inception
Threshold, Commanded by IOUT_OC_FAULT_LIMITn
(Note 7) Utilizing MFR_PWM_MODE[7] = 0b, and Using
~IOUT = 34A , Page103
MIN
TYP
MAX
UNITS
VFBCMn
Feedback Input
Common Mode Range
VOSNS–_Cn Valid Input Range (Referred to SGND)
VOSNS+_Cn Valid Input Range (Referred to SGND)
VOUTn-RNGL
Full-Scale Command Voltage
Range Low (0.5V to 2.75V)
Set Point Accuracy
Resolution
LSB Step Size
Limit Design to 1.5V Operating for Module
MFR_PWM_MODEn[1] = 1b, VOUTn Commanded to
2.75V (Notes 8, 10)
–0.5
Full-Scale Command Voltage
Range High (0.5V to 3.6V)
Set Point Accuracy
Resolution
LSB Step Size
Limit Design to 1.5V Operating for Module
MFR_PWM_MODEn[1] = 0b, VOUTn Commanded to
3.60V (Notes 8, 10)
–0.5
RVSENSEn+
VOSNS+_Cn Impedance to SGND
0.05V ≤ VVOSNS+_Cn – VSGND ≤ 3.3V
50
kΩ
tON(MIN)
Minimum On-Time
(Note 10 )
60
nsec
gm0,1
Resolution
Error Amplifier gm(max)
Error Amplifier gm(min)
LSB Step Size
COMP0,1 = 1.35V, MFR_PWM_CONFIG[7:5] = 0 to 7
MFR_PWW_CONFIG Section (Note 10)
3
5.76
1
0.68
Bits
mmho
mmho
mmho
RCOMP0, 1
Resolution
Compensation Resistor RCOMP(MAX)
Compensation Resistor RCOMP(MIN)
MFR_PWM_CONFIG[4:0] = 0 to 31
(See Figure 1, Note 10)
5
62
0.5
Bits
kΩ
kΩ
34
A
Control Section
VOUTn-RNGH
l
l
–0.1
0.3
3.6
2.75
12
0.688
3.60
12
1.375
V
V
V
%
Bits
mV
0.5
V
%
Bits
mV
0.5
Analog OV/UV Ch 0,1(Overvoltage/Undervoltage) Output Voltage Supervisor Comparators (VOUT_OV/UV_FAULT_LIMIT and VOUT_OV/UV_WARN_
LIMIT Monitors)
NOV/UV_COMP
Resolution, Output
Voltage Supervisors
(Notes 9, 10)
VOV-RNG
Output OV Comparator
Threshold Detection Range
(Notes 9, 10) Limit Design to 1.5V Operating for Module
Low Range Scale, MFR_PWM_MODEn[1] = 1b
High Range Scale, MFR_PWM_MODEn[1] = 0b
VOUSTP
Output OV and UV
Comparator Threshold
Programming LSB Step Size
(Notes 9, 10)
Low Range Scale, MFR_PWM_MODEn[1] = 1b
High Range Scale, MFR_PWM_MODEn[1] = 0b
VOV-ACC-Cn
Output OV Threshold Accuracy
Range Low
(Notes 9, 10)
0.5V ≤ VVOSNS+_Cn – VVOSNS–_Cn ≤ 2.7V, MFR_PWM_
MODEn[1] = 1b
1V ≤ VVOSNS+_Cn – VVOSNS–_Cn ≤ 3.6V, MFR_PWM
MODEn[1] = 0b
Range High
9
0.5
1
Bits
2.7
3.6
5.6
11.2
mV
mV
±40
l
±1.5
V
V
mV
%
Rev. 0
For more information www.analog.com
9
LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 1, 2, 3). Specified as each individual output channel designated with n (Note 3). TA = 25°C,
VINS3 = 12V, RUN_Cn = 3.3V, EXTVCC = 0V, FREQUENCY_SWITCH = 350kHz and VOUTCn commanded to 1.000V unless otherwise noted.
Configured with factory default EEPROM settings, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
VUV-RNG
Output UV Comparator
Threshold Detection Range
(Note 10) Limit Design to 1.5V Operating for Module
Low Range Scale, MFR_PWM_MODEn[1] = 1b
High Range Scale, MFR_PWM_MODEn[1] = 0b
0.5
1
VUV-ACC Cn
Output UV Threshold Accuracy
Range Low
(Notes 9, 10)
0.5V ≤ VVOSNS+_Cn – VVOSNS–_Cn ≤ 2.7V, MFR_PWM_
MODEn[1] = 1b
1V ≤ VVOSNS+_Cn – VVOSNS–_Cn ≤ 3.6V, MFR_PWM_
MODEn[1] = 0b
Range High
TYP
l
MAX
UNITS
2.7
3.6
V
V
±40
mV
±1.5
%
tPROP-OV
Output OV Comparator
Response Times
Overdrive to 10% Above Programmed Threshold
100
µs
tPROP-UV
Output UV Comparator
Response Times
Underdrive to 10% Below Programmed Threshold
100
µs
Analog OV/UV VINS3 Input Voltage Supervisor Comparators (Threshold Detectors for VIN_ON and VIN_OFF)
NVINS3-OV/UV-COMP VINS3 OV/UV Comparator
Threshold-Programming Resolution
(Notes 9, 10)
VINS3-OU-RANGE
VINS3 OV/UV Comparator
Threshold-Programming Range
ABS MAX = 18V for Module Design
VINS3-OU-STP
VINS3 OV/UV Comparator
Threshold-Programming
LSB Step Size
(Note 10)
VINS3-OU-ACC
VINS3 OV/UV Comparator
Threshold Accuracy
4.5V < VINS3 ≤ 16V, Operating Range, 16V Max for
Module
tPROP-VINS3-LOW-VIN VINS3 OV/UV Comparator
Response Time, High VIN
Operating Configuration
tPROP-VINS3-LOW-VIN VINS3 OV/UV Comparator
Response Time, Low VIN
Operating Configuration
9
l
4.5
Bits
16
76
V
mV
±350
mV
Test Circuit 1, and:
VIN_ON = 9V; VINS3 Driven from 8.775V to 9.225V
VIN_OFF = 9V; VINS3 Driven from 9.225V to 8.775V
100
100
µs
µs
Test Circuit 2, and:
VIN_ON = 4.5V; VINS3 Driven from 4.225V to 4.725V
VIN_OFF = 4.5V; VINS3 Driven from 4.725V to 4.225V
100
100
µs
µs
l
Input Voltage (VINS3) Readback (READ_VIN)
NVINS3-RB
Input Voltage Readback
Resolution and LSB Step Size
(Notes 5, 10)
10
15.625
Bits
mV
VINS3-F/S
Input Voltage Full-Scale
Digitizable Range
(Notes 7, 11) 18V for Module Design
VINS3-RB-ACC
Input Voltage Readback Accuracy
READ_VIN, 4.5V ≤ VINS3 ≤ 16V, (VIN = VINS3)
tCONVERT-VINS3-RB
Input Voltage Readback
Update Rate
MFR_ADC_CONTROL = 0.00 (Notes 10, 12)
MFR_ADC_CONTROL = 0.01 (Notes 10, 12)
90
8
ms
ms
16
244
Bits
µV
43
V
2
l
%
Channels 0 and 1 Output Voltage Readback (READ_VOUTn)
NVO-RB
Output Voltage Readback
Resolution and LSB Step Size
(Note 10)
VO-F/S
Output Voltage Full-Scale
Digitizable Range
VRUNn = 0V (Note 10)
Design Limited to 1.5V
VO-RB-AC-Cn
Output Voltage Readback Accuracy
0.5V ≤ VVOSNS+_Cn – VVOSNS– _Cn ≤ 1.0V
1V ≤ VVOSNS+_Cn – VVOSNS – _Cn ≤ 3.6V
8
l
V
Within ± 5mV, Reading
Within ± 0.5%, Reading
Channels 0 and 1 Output Current (READ_IOUTn)
NIO-RB
Output Current Readback
Resolution and LSB Step Size
(Notes 5, 10) Based on MFR_PWM_MODE[7] = 1
Using the OUT_OC_FAULT_LIMIT of 34A
10
34.1
IO-F/S
Output Current Full-Scale Digitizable
Range
(Notes 5, 10) Based on MFR_PWM_MODE[7] = 1
Using the IOUT_OC_FAULT_LIMIT of 40A
34
10
Bits
mA
A
Rev. 0
For more information www.analog.com
LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 1, 2, 3). Specified as each individual output channel designated with n (Note 3). TA = 25°C,
VINS3 = 12V, RUN_Cn = 3.3V, EXTVCC = 0V, FREQUENCY_SWITCH = 350kHz and VOUTCn commanded to 1.000V unless otherwise noted.
Configured with factory default EEPROM settings, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
IO-RB-ACC
Output Current, Readback Accuracy
READ_IOUTn, Channels 0 and 1, 0 ≤ IOUTn ≤ 25A,
Forced-Continuous Mode, MFR_PWM_MODEn[0] = 1b l
With Offset Adjustment (–20°C to 125°C) (Note 7)
See Histograms in Typical Performance Characteristics Section
MIN
IO-RB(25A)
Full Load Output Current Readback
IOUTn = 30A Max by Module Design Up to 1.2V (Note 7)
tCONVERT-IO-RB
Output Current Readback Update Rate MFR_ADC_CONTROL = 0×00 (Notes 10, 12)
MFR_ADC_CONTROL = 0×06 (CH0 IOUT)or 0×0A (CH1
IOUT) (Notes 9, 17) See MFR_ADC_CONTROL Section
TYP
MAX
5
3.5
25
30
UNITS
%
%
A
90
8
ms
ms
10
Bits
15.26
30.52
61
µV
µV
µV
Input Current Readback
Resolution
(Notes 5, 10)
VIINSTP
LSB Step Size Full-Scale Range = 16mV
LSB Step Size Full-Scale Range = 32mV
LSB Step Size Full-Scale Range = 64mV
IIN_TUE
Total Unadjusted Error
Gain = 8, 0V ≤ |VIIN+ – VIIN–| ≤ 5mV
Gain = 4, 0V ≤ |VIIN+ – VIIN–| ≤ 20mV
Gain = 2, 0V ≤ |VIIN+ – VIIN–| ≤ 50mV
Gain = 8, 2.5mV ≤ |VIIN+ – VIIN–| (Note 13)
Gain = 4, 4mV ≤ |VIIN+ – VIIN–| (Note 13)
Gain = 2, 6mV ≤ |VIIN+ – VIIN–| (Note 13)
VOS
Zero-Code Offset Voltage
(Note 10)
tCONVERT
Update Rate
(Note 12)
90
ms
(Notes 5,12) See MFR_ADC_CONTROL Section for
Faster Update Rates
10
Bits
244
µV
N
l
l
l
3.5
2.5
1.8
%
%
%
±50
µV
Internal Controller Supply Current Readback VINS3
N
Resolution
VICONTROL STP
LSB Step Size Full-Scale
Range = 256mV
ICONTROL TUE
Total Unadjusted Error
20mV ≤ |VIINS3_C1–SVIN| ≤ 150mV)
tCONVERT
Update Rate
(Note 12)
±3
%
See Block Diagram (Note 10)
90
ms
Temperature Readback (TSNS_C0, TSNS_C1)
TRES_T
Resolution
0.25
°C
T0_TUE
External Temperature Total
Unadjusted Readback Error
Supporting Only Delta VBE Sensing
(Note 13)
3
°C
T1_TUE
Internal TSNS TUE
VRUN_C0,C1 = 0.0, fSYNC = 0kHz (Note 8)
3
°C
tCONVERT
Update Rate
MFR_ADC_CONTROL = 0×04 or 0×0C
(Notes 9, 12, 15)
90
8
ms
ms
INTVCC Regulator/EXTVCC
VINTVCC
Internal VCC Voltage No Load
6V ≤ VIN ≤ 16V
VLDO_INT
INTVCC Load Regulation
ICC = 0mA to 20mA, 6V ≤ VIN ≤ 16V
VEXTVCC
EXTVCC Switchover Voltage
VINS3_C1 ≥ 7V, EXTVCC Rising
5.25
4.5
5.5
5.75
V
0.5
±2
%
4.7
4.9
V
VLDO_HYS
EXTVCC Hysteresis
VLDO_EXT
EXTVCC Voltage Drop
ICC = 20mA, VEXTVCC = 5.5V
340
60
mV
VIN_THR
VIN Threshold to Enable EXTVCC
Switchover
VIN Rising
7.1
V
VIN_THF_HYS
VIN Hysteresis to Disable EXTVCC
Switchover
VIN Falling
600
mV
120
mV
Rev. 0
For more information www.analog.com
11
LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 1, 2, 3). Specified as each individual output channel designated with n (Note 3). TA = 25°C,
VINS3 = 12V, RUN_Cn = 3.3V, EXTVCC = 0V, FREQUENCY_SWITCH = 350kHz and VOUTCn commanded to 1.000V unless otherwise noted.
Configured with factory default EEPROM settings, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
VDD33
Internal VDD33 Voltage
4.5V < VINTVCC or 4.8V < VEXTVCC
3.2
3.3
3.4
UNITS
VDD33 Regulator
V
ILIM
VDD33 Current Limit
VDD33 = GND, VIN = INTVCC = 4.5V
100
mA
VDD33_OV
VDD33 Overvoltage Threshold
(Note 10)
3.5
V
VDD33_UV
VDD33 Undervoltage Threshold
(Note 10)
3.1
V
2.5
V
80
mA
VDD25 Regulator
VDD25
Internal VDD25 Voltage
LIM
VDD25 Current Limit
VDD25 = GND, VIN = INTVCC = 4.5V
Oscillator and Phase-Locked Loop
fRANGE
PLL SYNC Range
Synchronized with Falling Edge of SYNC
l
l
250
1000
kHz
±7.5
%
fOSC
Oscillator Frequency Accuracy
Frequency Switch = 250.0kHz to 1000.0kHz (Note 10)
VTH(SYNC)
SYNC Input Threshold
VSYNC Falling
VSYNC Rising
1
1.5
VOL(SYNC)
SYNC Low Output Voltage
ILOAD = 3mA
0.2
ILEAK(SYNC)
SYNC Leakage Current in Slave Mode
0V ≤ VPIN ≤ 3.6V
θSYNC-θ0
SYNC to Ch0 Phase Relationship
MFR_PWM_CONFIG[2:0] = 0,2,3
Based on the Falling Edge of Sync and MFR_PWM_CONFIG[2:0] = 5
Rising Edge of SWC0)
MFR_PWM_CONFIG[2:0] = 1
MFR_PWM_CONFIG[2:0]= 4,6 (Note 10)
0
60
90
120
Deg
Deg
Deg
Deg
θSYNC-θ1
SYNC to Ch1 Phase Relationship
MFR_PWM_CONFIG[2:0] = 3
Based on the Falling Edge of Sync and MFR_PWM_CONFIG[2:0] = 0
Rising Edge of SWC1
MFR_PWM_CONFIG[2:0] = 2,4,5
MFR_PWM_CONFIG[2:0] = 1
MFR_PWM_CONFIG[2:0] = 6 (Note 10)
120
180
240
270
300
Deg
Deg
Deg
Deg
Deg
V
V
0.4
V
±5
µA
EEPROM Characteristics
Endurance
(Notes 15, 16)
0°C < TJ < 85°C EEPROM Write Operations
l 10,000
Retention
(Notes 15, 16)
TJ < 125°C
l
Mass_Write
Mass Write Operation Time
STORE_USER_ALL, 0°C < TJ < 85°C
During EEPROM Write Operation
l
OV ≤ VPIN ≤ 5.5V
OV ≤ VPIN ≤ 3.6V
Cycles
10
Years
440
4100
ms
l
±5
µA
l
±2
µA
1.35
V
Input Leakage Current SDA, SCL, ALERT, RUN
IOL
Input Leakage Current
Leakage Current FAULTn, PGOOD_Cn
ILEAK
Input Leakage Current
Digital Inputs SCL, SDA, RUN_Cn, FAULT_Cn (Note 10)
VIH
Input High Threshold Voltage
l
VIL
Input Low Threshold Voltage
l
VHYST
Input Hysteresis
CPIN
Input Capacitance
SCL, SDA
0.8
V
0.08
V
10
pF
Digital Input WP (Note 10)
IPUWP
Input Pull-Up Current
WP
10
µA
Open-Drain Outputs SCL, SDA, FAULT_Cn, ALERT, RUN_Cn, SHARE_CLK, PGOOD_Cn
VOL
12
Output Low Voltage
ISINK = 3mA
0.4
V
Rev. 0
For more information www.analog.com
LTM4664A
ELECTRICAL CHARACTERISTICS
The l denotes the specifications which apply over the specified internal
operating temperature range (Note 1, 2, 3). Specified as each individual output channel designated with n (Note 3). TA = 25°C,
VINS3 = 12V, RUN_Cn = 3.3V, EXTVCC = 0V, FREQUENCY_SWITCH = 350kHz and VOUTCn commanded to 1.000V unless otherwise noted.
Configured with factory default EEPROM settings, unless otherwise noted.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
1.5
1.8
UNITS
Digital Inputs SHARE_CLK, WP (Note 10)
VIH
Input High Threshold Voltage
VIL
Input Low Threshold Voltage
ISINK = 3mA
l
l
0.6
V
1
V
3
µs
60
µs
10
µs
Digital Filtering of FAULTCn (Note 10)
TFLTF
Input Digital Filtering FAULTn
Digital Filtering of PGOOD_Cn (Note 10)
TPGF
Output Digital Filtering PGOOD_Cn
Digital Filtering of RUN_Cn (Note 10)
TRUNF
Input Digital Filtering RUN_Cn
PMBus Interface Timing Characteristics (Note 10)
fSCL
Serial Bus Operating Frequency
l
10
tBUF
Bus Free Time Between Stop and Start
l
1.3
400
kHz
µs
tHD(STA)
Hold Time After Repeated Start
Condition After This Period, the First
Clock is Generated
l
0.6
µs
tSU(STA)
Repeated Start Condition Setup Time
l
0.6
tSU(ST0)
Stop Condition Setup Time
l
0.6
tHD(DAT)
Date Hold Time
Receiving Data
Transmitting Data
l
l
0
0.3
tSU(DAT)
Data Setup Time
Receiving Data
tTIMEOUT_SMB
Stuck PMBus Timer Non-Block Reads
Stuck PMBus Timer Block Reads
tLOW
Serial Clock Low Period
l
1.3
tHIGH
Serial Clock High Period
l
0.6
10000
µs
µs
µs
0.9
0.1
Measured from the Last PMBus Start Event
µs
µs
3
255
ms
ms
10000
µs
µs
Channel 0 and Channel 1 Power Stages (Note 10)
PWM_Cn LOW
PWM Drive Low Level, C0, C1
PWM_Cn HIGH
PWM Drive High Level, C0, C1
PHFLT_Cn T
Warning Temperature
PHFLT_Cn ACC
Thermal Warning Accuracy
PHFLT_Cn HYS
Hysteresis
PHFLT_Cn Res
On Resistance
0.6
2.6
PHFLT_Cn Pull-Up Pull-Up Resistor
V
140
–10
C
10
10
Sink = 8mA
PHFLT_Cn Leak
Tied to VDD33
V
Kelvin
Kelvin
37.5
80
Ω
0.1
5
µA
10
kΩ
Rev. 0
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13
LTM4664A
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime. All voltages are referred to GND pin unless
otherwise specified.
Note 2: The LTM4664A is tested under pulsed load conditions such that
TJ ≈ TA. Note that the maximum ambient temperature consistent with
these specifications is determined by specific operating conditions in
conjunction with board layout, the rated package thermal resistance and
other environmental factors.
Note 3: All Currents into the device pins are positive, all currents out of
the device are negative. Each channel of PSM is tested independently in
production. A shorthand notation is used in this document that allows
these parameters to be referred to by “VINS3_Cn" and “VOUTCn”, where n
is permitted to take on a value of 0 or 1. This italicized “n” notation and
convention is extended to encompass all such pin names, as well as
register names with channel-specific, i.e., paged data. For example, VOUT_
COMMANDn refers to the VOUT_COMMAND command code data located
in Pages 0 and 1, which in turn relate to channel 0 (VOUTC0) and channel 1
(VOUTC1). Registers containing non-page-specific data, i.e., whose data is
“global” to the module or applies to both of the module’s channels lack the
italicized, “n”, e.g., FREQUENCY_SWITCH.
Note 4: See output current derating curves for different VIN, VOUT, Load
Current and TA, located in the Dual 25A/30A PSM Applications Information
section. For output voltage up to 1.2V, Dual 30A loads are rated.
Note 5: The data format in PMBus is 5 bits exponent (signed) and 11 bits
mantissa (signed). This limits the output resolution to 10 bits though the
internal ADC is 16 bits and the calculations use 32-bit words.
Note 6: VOUTCn (DC) and line and load regulation tests are performed
in production with digital servo disengaged (MFR_PWM_MODEn[6] =
0b) and low VOUTCn range selected MFR_PWM_MODEn[1] = 1b. The
digital servo control loop is exercised in production (setting MFR_PWM_
MODEn[6] = 1b), but convergence of the output voltage to its final settling
value is not necessarily observed in final test—due to potentially long
time constants involved—and is instead guaranteed by the output voltage
readback accuracy specification. Evaluation in application demonstrates
capability; see the Typical Performance Characteristics section.
Note 7: These typical parameters are based on bench measurements and
are not production tested.
14
Note 8: Even though VOUTC0 and VOUTC1 are specified for 3.6V absolute
maximum, the maximum recommended command voltage to regulate
output channels 0 and 1 is 1.5V with VOUT range-setting bit set using
MFR_PWM_MODEn[1].
Note 9: Channel n OV/UV comparator threshold accuracy for MFR_PWM_
MODEn[1] = 1b tested in ATE at VVOSNS+_Cn – VVOSNS–Cn = 0.5V and
2.7V. MFR_PWM_MODEn[1] = 1b is the Low Range.
Note 10: Tested at IC-level ATE
Note 11: The absolute maximum rating for the VINS3 pin is 18V. Input
voltage telemetry (READ_VIN) is obtained by digitizing a voltage scaled
down from the VINS3 pin.
Note 12: The data conversion is done by default in round robin fashion.
All inputs signals are continuously converted for a typical latency of 90ms.
Setting MFR_ADC_CONTRL value to be 0 to 12, LTM4664A can do fast
data conversion with only 8ms to 10ms. See section PMBus Command
for details.
Note 13: Part tested with PWM disabled. Evaluation in application
demonstrates capability. TUE(%) = ADC Gain Error (%) +100 • (Zero code
Offset + ADC Linearity Error)/Actual Value.
Note 14: EEPROM endurance and retention are guaranteed by wafer-level
testing for data retention. The minimum retention specification applies
for devices whose EEPROM has been cycled less than the minimum
endurance specification, and whose EEPROM data was written to at 0°C
≤ TJ ≤ 85°C. The RESTORE_USER_ALL or MFR_RESET is valid over
the entire operating temperature range and does not influence EEPROM
characteristics.
Note 15: Write operations above TJ = 85°C or below 0°C are possible
although the Electrical Characteristics are not guaranteed and the EEPROM
will be degraded. Read operations performed at temperatures below 125°C
will not degrade the EEPROM Writing to the EEPROM above 85°C will
result in a degradation of retention characteristics.
Note 16: M1-M8 power MOSFET are final tested separately before
assembly in to the µModule.
Note 17: MFR_PWM_MODE[2] = 1 or 0 sets device in low DCR mode or
regular DCR mode respectively. MFR_PWM_MODE[7]=1 or 0 sets device in
high output current range or low current range. See “Output Current Sensing
and sub milliohm DCR Current Sensing” in Operation Section for details.
Only VILIMIT codes 2–8 are supported for DCR sensing.
Rev. 0
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LTM4664A
TYPICAL PERFORMANCE CHARACTERISTICS
1.2V Individual Single Output
1st Stage = 100kHz,
2nd Stage = 200kHz,
Final 25A/30A Stages = 250kHz,
EXTVCC = 5V
1V Individual Single Output
1st Stage = 100kHz,
2nd Stage = 200kHz,
Final 25A/30A Stages = 250kHz,
EXTVCC = 5V
95
95
90
90
90
85
80
75
5
10
15
20
OUTPUT CURRENT (A)
85
80
30V INPUT
36V INPUT
48V INPUT
54V INPUT
0
EFFICIENCY (%)
95
EFFICIENCY (%)
EFFICIENCY (%)
0.9V Individual Single Output
1st Stage = 100kHz,
2nd Stage = 200kHz,
Final 25A/30A Stages = 250kHz,
EXTVCC = 5V
75
25
80
30V INPUT
36V INPUT
48V INPUT
54V INPUT
5
0
10
15
20
OUTPUT CURRENT (A)
4664A G01
75
25
95
85
EFFICIENCY (%)
EFFICIENCY (%)
90
0
5
10
15
20
OUTPUT CURRENT (A)
25
10
15
20
OUTPUT CURRENT (A)
FIRST STAGE
SWITCH 20V/DIV
80
SECOND STAGE
SWITCH 20V/DIV
75
70
0.9V OUTPUT
1V OUTPUT
1.2V OUTPUT
1.5V OUTPUT
65
60
25
VIN 30V TO 54V
TRANSIENT
20V/DIV,
50ms/DIV
90
75
5
54V Input Voltage Change,
No Load
95
30V INPUT
36V INPUT
48V INPUT
54V INPUT
0
4664A G03
54V Input, 2-Phase 50A Single Output
1st Stage = 100kHz,
2nd Stage = 200kHz,
Final 25A/30A Stages = 350kHz,
EXTVCC = 5V
85
30V INPUT
36V INPUT
48V INPUT
54V INPUT
4664A G02
1.5V Individual Single Output
1st Stage = 100kHz,
2nd Stage = 200kHz,
Final 25A/30A Stages = 350kHz,
EXTVCC = 5V
80
85
0
10
20
30
40
FINAL 25A/30
STAGES
OUTPUT 1V/DIV
50
OUTPUT CURRENT (A)
4664A G04
4664A G06
54V TO 1V, NO LOAD
4:1 DIVIDER: FIRST STAGE 100kHz,
SECOND STAGE 200kHz,
FINAL 25A/30A STAGES 250kHz
4664A G05
54V Input Voltage Change,
Load 25A Each
Dual Output Tracking
Start-Up/Shutdown
VIN 30V TO 54V
TRANSIENT
20V/DIV,
50ms/DIV
VOUTC0 = 1V,
VOUTC1 = 1.5V
500mV/DIV,
2ms/DIV
FIRST STAGE
SWITCH 20V/DIV
IOUT0
5A/DIV
SECOND STAGE
SWITCH 20V/DIV
RUN_Cn
5V/DIV
FINAL 25A/30A
STAGES
OUTPUT 1V/DIV
4664A G07
54V TO 1V, 25A LOAD EACH
4:1 DIVIDER: FIRST STAGE 100kHz,
SECOND STAGE 200kHz,
FINAL 25A/30A STAGES 250kHz
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4664A G08
48VIN, 10A LOAD ON VOUT0, NO LOAD ON VOUTC1,
TON_RISE 0 = 3ms, TON_RISE 1 = 4.5ms,
TOFF_DELAY 1 = 0ms, TOFF_DELAY 0 = 1.5ms
TOFF_FALL 1 = 4.5ms, TOFF_FALL 0 = 3ms,
ON_OFF_CONFIGn = 0x1E
Rev. 0
15
LTM4664A
TYPICAL PERFORMANCE CHARACTERISTICS
Dual Output Start-Up/Shutdown
with a Prebiased Load
Start-Up
VOUTC1 = 1.5V
500mV/DIV
INPUT VOLTAGE
USED LAB SUPPLY
SWITCH (HP6012B)
20V/DIV, 100ms/DIV
VOUTC0 = 1V
500mV/DIV
FIRST STAGE OUTPUT
20V/DIV, 100ms/DIV
SECOND STAGE
OUTPUT 10V/DIV
IDIODE
20mA/DIV
FINAL 25A/30A STAGE
OUTPUTS
500mV/DIV
RUN_Cn
5V/DIV
4664A G09
4664A G10
2mS/DIV
48VIN, 10A LOAD ON VOUT0, 7.5mA LOAD ON
VOUT1, VOUT1 PREBIASED THROUGH A DIODE
TON_RISE 0 = 3ms, TON_RISE 1 = 4.5ms,
TOFF_DELAY 1 = 0ms, TOFF_DELAY 0 = 1.5ms
TOFF_FALL 1 = 4.5ms, TOFF_FALL 0 = 3ms,
ON_OFF_CONFIGn = 0x1E
48V TO 1V AT 0A LOAD, EACH 25A/30A STAGE
FINAL STAGE TON DELAY AND TON RISE SET
TO 100ms
Shutdown
Full Sequence Turn On
INPUT VOLTAGE
USED LAB SUPPLY
SWITCH (HP6012B)
20V/DIV, 100ms/DIV
RUNS1
2V/DIV, 50ms/DIV
TIMERS1 = 0.047µF
0.5V/DIV
1ST STAGE SWITCH
20V/DIV
FIRST STAGE OUTPUT
20V/DIV, 100ms/DIV
SECOND STAGE
OUTPUT 10V/DIV
1ST STAGE OUTPUT
20V/DIV
FINAL 25A/30A STAGE
OUTPUTS
500mV/DIV
RUNS2
2V/DIV, 50ms/DIV
TIMERS2 = 0.047µF
0.5V/DIV
4664A G11
48V TO 1V AT 0A LOAD, EACH 25A/30A STAGE
FINAL STAGE TON DELAY AND TON RISE SET
TO 100ms
Full Sequence Turn Off
2ND STAGE SWITCH
10V/DIV
2ND STAGE OUTPUT
10V/DIV
RUN_Cn
2V/DIV, 50ms/DIV
RUNS1
2V/DIV, 50ms/DIV
FINAL 25A/30A STAGE SWITCHS
10V/DIV
TIMERS1 = 0.047µF
0.5V/DIV
1ST STAGE SWITCH
20V/DIV
1ST STAGE OUTPUT
20V/DIV
RUNS2
5V/DIV, 50ms/DIV
FINAL 25A/30A STAGE OUTPUTS
1V/DIV
48V TO 1V AT 50A LOAD
4664A G12
TIMERS2 = 0.047µF
0.5V/DIV
2ND STAGE SWITCH
10V/DIV
2ND STAGE OUTPUT
10V/DIV
RUN_C1
2V/DIV, 50ms/DIV
FINAL STAGE SWITCH
10V/DIV
FINAL STAGE OUTPUT
1V/DIV
48V TO 1V AT 50A LOAD
16
4664A G13
Rev. 0
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LTM4664A
TYPICAL PERFORMANCE CHARACTERISTICS
VOUTCn (1V) Load Transient
VOUTCn (1.5V) Load Transient
VOUTCn
50mV/DIV
AC-COUPLED
VOUTCn
50mV/DIV
AC-COUPLED
IOUT
5A/DIV
IOUT
5A/DIV
50µs/DIV
4664A G14
4664A G15
48V TO 1V SINGLE CHANNEL,
0A TO 12.5A/µs LOAD STEP
COUT = 470µF ×2 POSCAP, 100µF ×5 CER,
COMP_Cna = 2200pF, COMP_Cnb = 100pF,
EA-GM = 3.69ms, RCOMP = 5k,
PSM FREQ = 250kHz, ILIMIT RANGE = LOW
VOUT RANGE = LOW
50µs/DIV
48V TO 1.5V SINGLE CHANNEL, 0A TO 12.5A/µs
LOAD STEP
COUT = 470µF ×1 POSCAP, 330µF ×2 CER,
COMP_Cna = 2200pF, COMP_Cnb = 220pF,
EA-GM = 3.02ms, RCOMP = 6k,
PSM FREQ = 350kHz
Dual Phase (50A/0.9V)
Load Transient
Dual Phase (50A/1V) Load Transient
VOUT
50mV/DIV
AC-COUPLED
VOUT
50mV/DIV
AC-COUPLED
IOUT
10A/DIV
IOUT
10A/DIV
4664A G17
4664A G16
50µs/DIV
48V TO 1V DUAL PHASE SINGLE OUTPUT, 0A TO
25A/µs LOAD STEP
COUT = 470µF ×2 POSCAP, 5 × 330µF CER,
COMP_C0,1 = 1500pF, COMP_C01b = 100pF,
EA-GM = 4.36ms, RCOMP = 13k,
PSM FREQ = 350kHz, ILIMIT RANGE = LOW
VOUT RANGE = LOW
50µs/DIV
48V TO 0.9V DUAL PHASE SINGLE OUTPUT, 0A
TO 25A/µs LOAD STEP
COUT = 470µF ×2 POSCAP, 330µF ×5 CER,
COMP_C0, 1 = 1500pF, COMP_C01b = 100pF,
EA-GM = 4.36ms, RCOMP = 13k,
PSM FREQ = 250kHz, ILIMIT RANGE = LOW
VOUT RANGE = LOW
25A AC Ripple Noise
SWC0
VOUTC0
10mV/DIV
AC-COUPLED
SWC1
VOUTC1
10mV/DIV
AC-COUPLED
4664A G18
48V TO VOUTC0 = 1V, AND VOUTC1 = 1V
Rev. 0
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17
LTM4664A
TYPICAL PERFORMANCE CHARACTERISTICS
48V to 1V, Second Stage (12V)
Shorted
48V
INPUT CURRENT
5A/DIV, 20µs/DIV
48V to 1V at 50A Shorted
SWITCH VOUTC0
10V/DIV, 20µs/DIV
SWITCH VOUTC1
10V/DIV, 20µs/DIV
FINAL STAGE VOUT
0.5V/DIV, 20µs/DIV
CURRENT ACROSS RSENSE
5A/DIV, 20µs/DIV
SW1
20V/DIV, 20µs/DIV
SW2
20V/DIV, 20µs/DIV
FAULTS1
5V/DIV, 20µs/DIV
FIRST STAGE VOUT1
20V/DIV, 20µs/DIV
SW3
10V/DIV, 20µs/DIV
SW4
10V/DIV, 20µs/DIV
SECOND STAGE VOUT2
10V/DIV, 20µs/DIV
FAULTS2
2V/DIV, 20µs/DIV
SWITCH VOUTC0
10V/DIV, 20µs/DIV
SWITCH VOUT1
10V/DIV, 20µs/DIV
FINAL STAGE VOUTC0 AND VOUTC1
0.5V/DIV, 20µs/DIV
PGOOD_C0
2V/DIV, 20µs/DIV
PGOOD_C0
2V/DIV, 20µs/DIV
SW3
10V/DIV, 20µS/DIV
SW4
10V/DIV, 20µs/DIV
SECOND STAGE VOUT2
10V/DIV, 20µs/DIV
4664A G20
48V TO 1V AT 50A SHORTED LAST STAGE 1V
OUTPUT VOUTC0 AND VOUTC1 IN PARALLEL
4664A G19
48V TO 1V AT 50A VOUT2 STAGE 12V
OUTPUT SHORTED
READ_IOUT of 16 LTM4664A
Channels 12VIN, 1VOUT, TJ = 125°C,
IOUTn = 25A, System Having
Reached Thermally Steady-State
Condition, No Airflow
READ_IOUT of 16 LTM4664A
Channels 12VIN, 1VOUT, TJ = 25°C,
IOUTn = 25A, System Having
Reached Thermally Steady-State
Condition, No Airflow
4
4
3
3
3
2
1
0
25.4 26.0 25.2 25.2 25.7 25.8 25.9 25.5
READ_IOUT CHANNEL READBACK (A)
4664A G21
18
NUMBER OF CHANNELS
4
NUMBER OF CHANNELS
NUMBER OF CHANNELS
READ_IOUT of 16 LTM4664A
Channels 12VIN, 1VOUT, TJ = –40°C,
IOUTn = 25A, System Having
Reached Thermally Steady-State
Condition, No Airflow
2
1
0
25.2 25.7 24.9 24.9 25.3 25.5
READ_IOUT CHANNEL READBACK (A)
4664A G22
2
1
0
24.4 25.0 24.2 24.6 24.7 24.9 24.3 24.3
READ_IOUT CHANNEL READBACK (A)
4664A G23
Rev. 0
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LTM4664A
PIN FUNCTIONS
4:1 Divider Section (Stage 1)
GND: (A8-A9, B1-B3, B8-B9, B14-B16, C4-C13,
D4,D8,D9, D13, E1-E4, E8-E9, E13-E16, F1-F4, F8-F10,
G4, G8-G11, H4, H9-H11, J1-J4, J11, K1-K4, K11, L3,
L11, L14-L16, M3-M5, M11, M14, N1-N4, N7, N11-N16,
P1-P4, P7-P9, P13-P15, R1-R6, R9, R13-16, T2-T3,
T8-T9, T14-T15) Main ground pins for all ground returns.
Input and output capacitors are connected to these pin.
See recommended layout Figure 45.
VOUT1: (C14-C16) 1st stage divide by two output
pins. These pins connect to the 2nd stage VINS2 pins.
Recommend placing output decoupling capacitance
directly between these pins and GND pins.
INTVCCS1: (D10) Output of the 5.5V internal linear low
dropout regulator. The driver and control circuits are powered from this voltage source. Must be bypassed to power
ground with a minimum of 4.7μF ceramic or other low ESR
capacitor. Do not use the INTVCCS1 pin for any other ICs.
EXTVCCS1: (D11) External Power Input to the Internal
LDO Connected to INTVCCS1. This LDO supplies INTVCCS1
power, bypassing the internal LDO powered from VINS1
whenever EXTVCCS1 is higher than 6.5V and VINS1 is
higher than 7V. Do not exceed 30V on this pin. This
pin can be driven with the VOUT2 output to limit power
loss in LDO with VINS1 at higher input voltage. See
Applications section.
PGOODS1: (D12) This is an open drain output pin.
PGOODS1 is pulled to ground if there are any faults or
the voltage at UVS1 pin is lower than 1V. Use PGOODS1
or FAULTS1 to sequence on RUNS2 for the second stage.
UVS1: (E10) Undervoltage Comparator. If the UVS1 pin
voltage is lower than 1V, the PGOODS1 pin is pulled down.
If the UV pin voltage is higher than 1V and no faults,
PGOODS1 pin is released. Connect to INTVCCS1 if not
used. This pin is used to validate proper output regulation.
FAULTS1: (E11) This is an open drain output pin. FAULTS1
is pulled to ground when the VOUT1 voltage is out of
the (VINS1)/2 window threshold or the voltage between
INSNSS1+ and INSNSS1– is higher than 50mV. FAULTS1
pin is released after INTVCCS1 starts up and passes UVLO.
Use FAULTS1 or PGOODS1 to sequence on RUNS2 for
the second stage.
FREQS1: (E12) Frequency Set Pin. There is a precision
10μA current flowing out of this pin. A resistor to ground
sets a voltage which in turn programs the frequency.
See the 4:1 Divider Application Information section for
detailed information.
RUNS1: (F11) Stage 1 Run Control Input. Forcing RUNS1
below 1.2V shuts down the controller. When RUNS1 is
higher than 1.2V, internal circuitry starts up. There is a
1μA pull-up current flowing out of RUNS1 pin when the
RUNS1 pin voltage is below 1.2V and an additional 5μA
current flowing out of RUNS1 pin when the RUNS1 pin
voltage is above 1.2V.
TIMERS1: (F12) Charge Balance and Fault Timer Control
Input. A capacitor between this pin and ground sets the
amount of time to charge VOUT1 to (VINS1)/2. It also sets
the short-circuit retry time. See the 4:1 Divider Application
Information.
HYS_PRGMS1: (G12) A resistor connected between
this pin and ground will set the window threshold of the
window comparator that monitors the voltage difference
between (VINS1)/2 and VOUT1. There is a 10μA current
flowing out of this pin. See Applications section.
SW1, SW2: (G14-G16), (D14-D16) Switching nodes for
the 1st stage CFLY Flying capacitor. See Block Diagram.
I INSNSS1–: (J13) Current sense comparator negative
input, connected to the negative node of the current sensing resistor. Short to INSNSS1+ if not used.
NSNSS1+: (J14) Current sense comparator positive input,
connected to the positive node of the external current
sensing resistor. The current sensing resistor has to
be placed on the drain of the very top MOSFET. When
the voltage between INSNSS1+ pin and INSNSS1– pin
is higher than 50mV, the Stage 1 controller indicates
an overcurrent fault by pulling the FAULTS1 pin down.
The INSNSS1+ pin is also used to source 95mA current
to the VOUT1 pin during the pre-balance time in divider
applications. Connect directly to the drain of the very top
MOSFET if not used. See application schematic section.
Rev. 0
For more information www.analog.com
19
LTM4664A
PIN FUNCTIONS
VINS1: (J15-J16) Power input pins to the first stage
divide by two. Place input capacitance between these
pins and GND.
4:1 Divider Section (Stage 2)
VINS2: (C1-C3) Power input pins to the second stage
divide by two. Place input capacitance between these pin
and GND.
SW3, SW4: (D1-D3), (G1-G3) Switching nodes for the
2nd stage CFLY Flying capacitor. See Block Diagram.
VINS2F: (D5) Input Voltage Sensing with Filtering. This
pin has a 1kΩ resistor in series from VINS2, and a 4700pf
capacitor to GND. The pin has a 1MΩ resistance to GND.
See Block Diagram.
INSNSS2–: (D6) Current sense comparator negative input,
connected to the negative node of the current sensing
resistor. Short to INSNSS2+ if not used.
RBOT set to 7.5k. If not used, tie this pin to INTVCCS2. See
4:1 Divider Application Information section.
OVP_TRIP: (E7) Open collector output that is used to trip
off input power and clamp hold up energy during an over
voltage fault on VOUT2. See Applications section.
TIMERS2: (F5) Charge Balance and Fault Timer Control
Input. A capacitor between this pin and ground sets the
amount of time to charge VOUT2 to (VINS2)/2. It also sets
the short-circuit retry time. See the 4:1 Divider Application
Information.
VOUT2_SET: (F6) External – comparator input for setting
the VOUT2 trip reference level. This can be done with a
resistor and 5.1V Zener from VIN. This secondary fault
protection is in and above the Fault protection for Stage
1 and Stage 2. The overall input voltage is divided down
by four, so VOUT2 will be 1/4 of VIN. The OVP_SET pin will
have a voltage divider to monitor the VOUT2 voltage and
set to trip when the divider midpoint on the OVP_SET pin
exceeds the reference trip level. If not used, tie this pin to
ground. See 4:1 Divider Application Information section.
INSNSS2+: (D7) Current sense comparator positive input,
connected to the positive node of the external current
sensing resistor. The current sensing resistor has to be
placed on the drain of the very top MOSFET. When the
voltage between INSNSS2+ pin and INSNSS2– pin is
higher than 50mV, the controller indicates an overcurrent
fault by pulling the FAULTS2 pin down. The INSNSS2+
pin is also used to source 95mA current to the VOUT2
pin during the pre-balance time in divider applications.
Connect directly to the drain of the very top MOSFET if
not used. See Application Schematic section.
EXTVCCS2: (F7) External Power Input to the Internal LDO
Connected to INTVCCS2. This LDO supplies INTVCCS2
power, bypassing the internal LDO powered from VIN2
whenever EXTVCCS2 is higher than 6.5V and VINS2 is
higher than 7V. Do not exceed 30V on this pin. This pin
can be driven with the VOUT2 output to limit power loss
in LDO with VINS2 at higher input voltage. See 4:1 Divider
Application Information section.
HYS_PRGMS2: (E5) A resistor connected between this
pin and ground will set the window threshold of the window comparator that monitors the voltage difference
between (VINS2)/2 and VOUT2. There is a 10μA current
flowing out of this pin. See applications section.
FREQS2: (G5) Frequency Set Pin. There is a precision
10μA current flowing out of this pin. A resistor to ground
sets a voltage which in turn programs the frequency.
See the 4:1 Divider Application Information section for
detailed information.
OVP_SET: (E6) External + input for setting the VOUT2
trip level. The OVP_SET pin will have a voltage divider
to monitor the VOUT2 voltage and set to trip when the
divider midpoint on the OVP_SET pin exceeds the reference trip level on the VOUT2_SET pin. For example, if
the OVP_SET trip point was set for VTRIP, then RTOP =
((VTRIP/5.1V)-1) • 7.5K, with RTOP being the top resistor in
the divider, and RBOT is the bottom resistor in the divider.
RUNS2: (G6) Stage 2 Run Control Input. Forcing RUNS2
below 1.2V shuts down the controller. When RUNS2 is
higher than 1.2V, internal circuitry starts up. There is a
1μA pull-up current flowing out of RUNS2 pin when the
RUNS2 pin voltage is below 1.2V and an additional 5μA
current flowing out of RUNS2 pin when the RUNS2 pin
voltage is above 1.2V. Use PGOODS1, and FAULTS1 from
stage one to enable stage 2.
20
Rev. 0
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LTM4664A
PIN FUNCTIONS
INTVCCS2: (G7) Output of the 5.5V internal linear low
dropout regulator. The driver and control circuits are
powered from this voltage source. Must be bypassed to
power ground with a minimum of 4.7μF ceramic or other
low ESR capacitor. Do not use the INTVCCS2 pin for any
other ICs.
VOUT2: (H1-H3) 2nd stage divide by two output pins.
These pins connect to the VINS3 input of dual 25A/30A
PMBus converter. Recommend placing output decoupling
capacitance directly between these pins and GND pins.
PGOODS2: (H5) This is an Open Drain Output Pin.
PGOODS2 is pulled to ground if there are any faults or
the voltage at UVS2 pin is lower than 1V. Use PGOOD2 or
FAULTS2 to sequence on RUN_C0, and RUN_C1 for the
dual 25A/30A stage.
FAULTS2: (H6) This is an Open Drain Output Pin. FAULTS2
is pulled to ground when the VOUT2 voltage is out of
the (VINS2)/2 window threshold or the voltage between
INSNSS2+ and INSNSS2– is higher than 50mV. FAULTS2
pin is released after INTVCCS2 starts up and passes UVLO.
Use FAULTS2 or PGOOD2 to sequence on RUN_C0, and
RUN_C1 for the dual 25A/30A PSM stage.
UVS2: (H7) Undervoltage Comparator. If the UVS2 pin
voltage is lower than 1V, the PGOODS2 pin is pulled
down. If the UV pin voltage is higher than 1V and no faults,
PGOODS2 pin is released. Connect to INTVCCS2 if not
used. This pin is used to validate proper output regulation.
PMBus Dual 25A/30A Section
VOUTC1 (A1-A7, B4-B7): Channel 1 Output Voltage. Place
recommended output capacitors from this connection to
GND. See recommended layout in Figure 45.
VOUTC0: (A10-A16, B10-B13): Channel 0 Output Voltage.
Place recommended output capacitors from this connection to GND. See recommended layout in Figure 45.
FSWPH_CFG (H8): Switching Frequency, Channel
Phase Interleaving Angle and Phase Relationship to
SYNC Configuration Pin. If this pin is left open—or, if
the dual 25A/30A regulator is configured to ignore pinstrap (RCONFIG) resistors, i.e., MFR_CONFIG_ALL[6]
= 1b—then the LTM4664A’s switching frequency
(FREQUENCY_SWITCH) and channel phase relationships (with respect to the SYNC clock; MFR_PWM_
CONFIG[2:0]) are dictated at SVIN power-up according
to the LTM4664A’s NVM contents. Default factory values
are: 350kHz operation; Channel 0 at 0°; and Channel 1 at
180°C (convention throughout this document: a phase
angle of 0° means the channel’s switch node rises coincident with the falling edge of the SYNC pulse). Connecting
a resistor divider from VDD25 to SGND_C0_C1, see page
4 (and using the factory default NVM setting of MFR_
CONFIG_ALL[6] = 0b) allows a convenient way to configure multiple LTM4664As with identical NVM contents
for different switching frequencies of operation and phase
interleaving angle settings of intra- and extra-module-paralleled channels—all, without GUI intervention or the
need to “custom preprogram” module NVM contents.
(See the Dual 25A/30A PSM Applications Information
section.) Minimize capacitance—especially when the pin
is left open—to assure accurate detection of the pin state.
VTRIMC1_ CFG (J5): Output Voltage Select Pin for VOUTC1,
Fine Setting. Works in combination with VOUTC1_CFG
to affect the VOUT_COMMAND (and associated output
voltage monitoring and protection/fault-detection thresholds) of Channel 1, at SVIN power-up. (See VOUTC1_CFG
and the Dual 25A/30A PSM Applications Information section.) Minimize capacitance—especially when the pin is
left open—to assure accurate detection of the pin state.
Note that use of RCONFIGs on VOUTC1_CFG/VTRIMC1_
CFG can affect the VOUTC1 range setting (MFR_PWM_
MODE1 [1]) and loop gain. A resistor divider from VDD25
to SGND_C0_C1 can set the trim value, see page 43.
VOUTC0_CFG (J6): Output Voltage Select Pin for VOUTC0,
Coarse Setting. If the VOUTC0_CFG and VTRIMC0_CFG
pins are both left open—or, if the LTM4664A is configured to ignore pin-strap (RCONFIG) resistors, i.e.,
MFR_CONFIG_ALL[6] = 1b—then the LTM4664A's target VOUTC0 output voltage setting (VOUT_COMMAND0)
and associated power good and OV/UV warning and fault
thresholds are dictated at SVIN power-up according to
the LTM4664A’s NVM contents. A resistor connected
from this pin to SGND—in combination with resistor pin
settings on VTRIMC0_CFG, and using the factory-default
NVM setting of MFR_CONFIG_ALL[6] = 0b—can be used
Rev. 0
For more information www.analog.com
21
LTM4664A
PIN FUNCTIONS
to configure the LTM4664A’s Channel 0 output to power-up to a VOUT_COMMAND value (and associated output
voltage monitoring and protection/fault-detection thresholds) different from those of NVM contents. (See the 4:1
Divider Application Information section.) Minimize capacitance especially when the pin is left open to assure accurate detection of the pin state. Note that use of RCONFIGs
on VOUTC0_CFG/VTRIMC0_CFG can affect the VOUTC0
range setting (MFR_PWM_MODE0 [1]) and loop gain.
VOUTC1_CFG (J7): Output Voltage Select Pin for VOUTC1,
Coarse Setting. If the VOUTC1_CFG and VTRIMC1_CFG
pins are both left open or, if the LTM4664A is configured to ignore pin-strap (RCONFIG) resistors, i.e., MFR_
CONFIG_ALL [6] = 1b then the LTM4664A’s target VOUTC1
output voltage setting (VOUT_COMMAND1) and associated OV/UV warning and fault thresholds are dictated at
SVIN power up according to the LTM4664A’s NVM contents, in precisely the same fashion that the VOUTC1_CFG
and VTRIMC1_CFG pins affect the respective settings of
VOUT1/Channel 1. (See VOUTC1_CFG, VTRIMC1_CFG and
the 4:1 Divider Application Information section.) Minimize
capacitance—especially when the pin is left open—to
assure accurate detection of the pin state. Note that use
of RCONFIGs on VOUTC1_CFG/VTRIMC1_CFG can affect
the VOUTC1 range setting (MFR_PWM_MODE1 [1]) and
loop gain. A resistor divider from VDD25 to SGND_C0_C1.
See page 43.
ASEL (J8): Serial Bus Address Configuration Pin. On any
given I2C/SMBus serial bus segment, every device
must have its own unique slave address. If this pin is
left open, the LTM4664A powers up to a slave address
set by MFR_ADDRESS[6:0] (see Table 4). The factory-default setting is 0x4F (hexadecimal), i.e., 1001111b
(industry standard convention is used throughout this
document: 7-bit slave addressing). The lower four bits of
the LTM4664A’s slave address can be altered from the
NVM-set value by connecting a resistor from this pin to
SGND. Minimize capacitance—especially when the pin is
left open—to assure accurate detection of the pin state.
See 4:1 Divider Application Information section.
RUN_C0, RUN_C1 (J9, K8 Respectively): Enable Run
Input for Channels 0 and 1, respectively. Open-drain input
and output. Logic high on these pins enables the respective
22
outputs of the LTM4664A. These open-drain output pins
hold the pin low until the LTM4664A is out of reset and
VIN3_C1 is detected to exceed VIN_ON. A pull-up resistor to 3.3V is required in the application. The LTM4664A
pulls RUN_C0 and/or RUN_C1 low, as appropriate, when
a global fault and/or channel-specific fault occurs whose
fault response is configured to latch off and cease regulation; issuing a CLEAR_FAULTS command via I2C or
power cycling SVIN is necessary to restart the module, in
such cases. Do not pull RUN logic high with a low impedance source. Use PGOODS2 and FAULTS2 to sequence on
RUN_C0, and RUN_C1 for the dual 25A/30A stage.
ALERT (J10): Open-Drain Digital Output. A pull-up
resistor to 3.3V is required in the application only if
SMBALERT interrupt detection is implemented in one’s
SMBus system.
VTRIMC0_CFG (K5): Output Voltage Select Pin for VOUTC0,
Fine Setting. Works in combination with VOUTC0_CFG
to affect the VOUT_COMMAND (and associated output
voltage monitoring and protection/fault-detection thresholds) of Channel 0, at SVIN power-up. (See VOUTC0_CFG
and the Dual 25A/30A PSM Applications Information section.) Minimize capacitance especially when the pin is left
open to assure accurate detection of the pin state. Note
that use of RCONFIGs on VOUTC0_CFG/VTRIMC0_CFG
can affect the VOUTC0 range setting (MFR_PWM_MODE0
[1]) and loop gain.
VDD25 (K6): Internally Generated 2.5V Power Supply
Output Pin. Do not load this pin with external current;
it is used strictly to bias internal logic and provides current for the internal pull-up resistors connected to the
configuration-programming pins. No external decoupling
is required.
WP (K7): Write Protect Pin, Active High. An internal 10μA
current source pulls this pin to VDD33. If WP is open circuit or logic high, only I2C writes to PAGE, OPERATION,
CLEAR_FAULTS, MFR_CLEAR_PEAKS and MFR_EE_
UNLOCK are supported. Additionally, Individual faults
can be cleared by writing 1b’s to bits of interest in registers prefixed with “STATUS”. If WP is low, I2C writes
are unrestricted.
Rev. 0
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LTM4664A
PIN FUNCTIONS
FAULT_C0/FAULT_C1 (K10/K9): Digital Programmable
FAULT Inputs and Outputs. Open-drain output. A pull-up
resistor to 3.3V is required in the application.
VINS3_C1, VINS3_C0: (L1-L2, M1-M2), (L12-L13, M12M13): Main power input to channel 0, and channel 1
power stages. Provide sufficient decoupling capacitance
in the form of multilayer ceramic capacitors (MLCCs) and
low ESR electrolytic (or equivalent) to handle reflected
input current ripple from the step-down switching
stages. MLCCs should be placed as close to the VINS3
as physically possible. The VINS3_C1 input provides the
input power for the INTVCC LDO regulator. See Layout
Recommendations in the Dual 25A/30A PSM Applications
Information section.
VDD33 (L6): Internally Generated 3.3V Power Supply Output
Pin. This pin should only be used to provide external
current for the pull-up resistors required for FAULT_Cn,
SHARE_CLK, and SYNC, and may be used to provide external current for pull-up resistors on RUN_Cn, SDA, SCL,
ALERT and PGOOD_Cn. No external decoupling is required.
SHARE_CLK (L7): Share_Clock, Bidirectional Open- Drain
Clock Sharing Pin. Nominally 100kHz. Used for synchronizing the time base between multiple LTM4664As (and
any other Analog Devices products with a SHARE_ CLK
pin)—to realize well-defined rail sequencing and rail tracking. Tie the SHARE_CLK pins of all such devices together;
all devices with a SHARE_CLK pin will synchronize to the
fastest clock. A pull-up resistor to 3.3V is required.
SDA (L8): Serial Bus Data Open-Drain Input and Output.
A pull-up resistor to 3.3V is required in the application.
SCL (L9): Serial Bus Clock Open-Drain Input (Can Be an
Input and Output, if Clock Stretching is enabled). A pull-up
resistor to 3.3V is required in the application for digital
communication to the SMBus master(s) that nominally
drive this clock. The LTM4664A will never encounter scenarios where it would need to engage clock stretching
unless SCL communication speeds exceed 100kHz—and
even then, LTM4664A will not clock stretch unless clock
stretching is enabled by means of setting MFR_CONFIG_
ALL[1] = 1b. The factory-default NVM configuration setting has MFR_CONFIG_ALL [1] = 0b: clock stretching
disabled. If communication on the bus at clock speeds
above 100kHz is required, the user’s SMBus master(s)
needs to implement clock stretching support to assure
solid serial bus communications, and only then should
MFR_CONFIG_ALL [1] be set to 1b. When clock stretching is enabled, SCL becomes a bidirectional, open-drain
output pin on LTM4664A.
TSNS_C0a, TSNS_C0b (L10 and T16, Respectively):
Channel 0 Temperature Excitation/Measurement and
Thermal Sensor Pins, respectively. Connect TSNS_C0a
to TSNS_C0b. This allows the LTM4664A to monitor the
Power Stage Temperature of Channel 0.
SYNC (M8): External Clock Synchronization Input and
Open-Drain Output Pin. If an external clock is present at
this pin, the switching frequency will be synchronized to
the external clock. If clock master mode is enabled, this
pin will pull low at the switching frequency with a 500ns
pulse to ground. A resistor pull-up to 3.3V is required in
the application if the LTM4664A is the master.
SGND_C0_C1 (M9, N8-N9): SGND_C0_C1 is the signal
ground return path of the dual 25A/30A control. SGND_C0_
C1 is not internally connected to GND. Connect SGND_C0_C1
to GND at the A9, B9, and C9 pins that is close to the output
capacitor ground connections. See recommended layout.
TSNS_C1a, TSNS_C1b (M10 and T1, Respectively):
Channel 1 Temperature Excitation/Measurement and
Thermal Sensor Pins, respectively. In most applications, connect TSNS_C1a to TSNS_C1b. This allows the
LTM4664A to monitor the Power Stage Temperature of
Channel 1. See the Applications section.
PWM_C0, PWM_C1 (M15, L4): PWM drive signal to
Channel 0, Channel 1 power stage. Utilized for debugging
or monitoring purposes.
PHFLT_C0, PHFLT_C1 (M16, L5): Thermal Warning for
Channel 0 and Channel 1. When the thermal protection
threshold is tripped, the PHFLT_Cn pin is being pulled
low. The power stage does not shut off, and is only a
thermal monitor. These pins are internally pulled up to
3.3V through 10k resistor. COMP_0b/COMP_1b (N10/
M7): Current Control Threshold and Error Amplifier
Compensation Nodes. Each associated channel’s current
comparator tripping threshold increases with its Comp
voltage. Each channel has a 22pF to SGND.
Rev. 0
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23
LTM4664A
PIN FUNCTIONS
VOSNS–_C1 (N6): Channel 1 Negative Differential. Voltage
Sense Input. See VOSNS+_C1.
VOSNS+_C1 (P6): Channel 1 Positive Differential Voltage
Sense Input. Together, VOSNS+_C1 and VOSNS–_C1 serve
to kelvin sense the VOUTC1 output voltage at VOUTC1’s point
of load (POL) and provide the differential feedback signal
directly to Channel 1’s feedback loop. Command VOUTC1’s
target regulation voltage by serial bus. Its initial command
value at VINS3 power-up is dictated by NVM (non-volatile
memory) contents (factory default: 1.000V)—or, optionally, may be set by configuration resistors; see VOUTC1_
CFG and the 4:1 Divider Application Information section.
IN– (P10): Negative Current Sense Amplifier Input. If
the input current sense amplifier is not used, this pin
must be shorted to the IN+ and VIN3 pins. See 4:1 Divider
Application Information section for detail about the input
current sensing.
COMP_0a/COMP_1a (P11/M6): Loop Compensation
Nodes. The internal PWM loop compensation resistors
RCOMPn of the LTM4664A can be adjusted using bit
[4:0] of the MFR_PWM_COMP command. The transconductance of the LTM4664A PWM error amplifier can be
adjusted using bit [7:5] of the MFR_PWM_COMP command. These two loop compensation parameters can be
programmed when device is in operation. Refer to the
Programmable Loop Compensation subsection in the 4:1
Divider Application Information section for further details.
See MFR_PWM_COMP section.
VOSNS–_C0: (P12): Channel 0 Negative Differential Voltage
Sense Input. See VOSNS+_C0.
GL_C0, GL_C1 (P16, P5): Bottom MOSFET gate drive
in the Channel 0 power stage, Channel 1 power stage.
Utilized for debugging or monitoring purposes.
INTVCC (R7): Internal Regulator, 5.5V output. When operating the VINS3 from 7V ≤ VINS3 ≤ 16V, a LDO generates
INTVCC from VINS3_C1 to bias internal control circuits and
the MOSFET drivers of the dual 25A/30A power supply. An
external 2.2µF ceramic decoupling is required. INTVCC is
regulated regardless of the RUN_Cn pin state.
24
EXTVCC (R8): External Power Input to an Internal Switch
Connected to INTVCC. This switch closes and supplies
the IC power, bypassing the internal regulator whenever
EXTVCC is higher than 4.7V and VIN is higher than 7V.
EXTVCC also powers up VDD33 when EXTVCC is higher than
4.7V and INTVCC is lower than 3.8V. Do not exceed 6V
on this pin. Decouple this pin to PGND with a minimum
of 4.7μF low ESR tantalum or ceramic capacitor. If the
EXTVCC pin is not used to power INTVCC, the EXTVCC pin
must be tied GND. Its recommended to use this pin if a
bias is available to reduce power loss.
IN+ (R10): Positive Current Sense Amplifier Input. If the
input current sense amplifier is not used, this pin must
be shorted to the IN– and VINS3 pins. See 4:1 Divider
Application Information section for detail about the input
current sensing.
PGOOD_C0/PGOOD_C1 (R11/N5): Power Good Indicator
Outputs. Open-drain logic output that is pulled to ground
when the output exceeds the UV and OV regulation window. The output is deglitched by an internal 100μs filter.
A pull-up resistor to 3.3V is required in the application.
VOSNS+_C0: (R12) Channel 0 Positive Differential Voltage
Sense Input. Together, VOSNS+_C0 and VOSNS–_C0 serve to
kelvin-sense the VOUTC0 output voltage at VOUTC0’s point
of load (POL) and provide the differential feedback signal
directly to Channel 0’s feedback loop. Command VOUTC0’s
target regulation voltage by serial bus. Its initial command
value at VINS3 power-up is dictated by NVM (non-volatile
memory) contents (factory default: 1.000V)—or, optionally, may be set by configuration resistors; see VOUTC0_
CFG and the 4:1 Divider Application Information section.
SWC0, SWC1 (T10-T13), (T4-T7): Switching Node of
Channel 0 and Channel 1. Used for test purposes or
EMI snubbing.
Rev. 0
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100k
INTVCCS1
10k
PGOODS1
VOUT1
36.4k
100kHz
4.53k
0.068µF
100k
FAULTS1
PGOODS1
UVS1
1V
LEVEL D4
LEVEL D3
FROM OVER CURRENT, VOUT1_ SENSE1
VINS1_SENSE, INTVCC, AND TEMP FAULTS
HYSTERESIS
100mV
VOUT1
LEVEL DR2
LEVEL DR1
50mA
95mA
CVF
RVF
VINS1
VOUT1_SENSE
GATE DRIVE SECTION
TIMERS1
ANTI-SHOOT THROUGH
CONTROL LOGIC
R2
500k
VSENSE FILTER
R3
500k
ON/OFF
1µA ~ 5µA
VINS1_SENSE
RUNS1
FREQS1
VINS1
HYS_PRGMS1
Vhys_prgm
VOUT1_SENSE
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G4
G3
G2
M4
M3
M2
M1
STAGE 1
G1
1µF
VIN 48V
39V
1.74k
CVOUT1
10µF
50V
×3
24V
RSENSE
10mΩ
0.1µF
CFLY1
7.5k
16.2k
48V
49.9k
USE 100V RESISTOR
OVP_SET
10µF CFLY2
×8
50V
10µF
×8
25V
5.1V
VOUT2_SET
SECONDARY OVP
PROTECTION
CIN
2.2µF
100V
×2
SET VOUT2_SET POINT AT 16V
4.7µF 12V
VINS1
LDO
GND
SW2
VOUT1
SW1
VINS1
RSF
INSNSS1–
ISENSE
FILTER
24V
NPN
49.9k
12V
CIN2
10µF
50V
×2
VINS2
LDO
GND
SW4
TO CIRCUIT BREAKER
OVP_TRIP
CVOUT2
10µF
25V
×4
VOUT2
SW3
VINS2
INSNSS2–
ISENSE
FILTER
INSNSS2+
INTVCCS2
4.7µF
G8
G7
G6
G5
0.22µF
INTVCC
1µF
12V
EXTVCC2
LDO
DR8
DR7
DR6
DR5
EXTVCCS2
EXTVCC2>6.5V
AND VINS2>7V
M8
M7
M6
M5
50mV
THRESHOLD
PRE-CHARGE
CHARGE BALANCE
ISENSE–
OVERCURRENT
ISENSE+
COMPARATOR
STAGE 2
INTVCCS2
RSF
CSF
Figure 1. Simplified LTM4664A 4:1 Divider Block Diagram
INTVCCS1
EXTVCCS1 INTVCCS1
EXTVCC1>6.5V
AND VINS1>7V
DR4
DR3
DR2
DR1
EXTVCC1
LDO
0.22µF
INTVCC1
12V
Isense-
PRE-CHARGE
CHARGE BALANCE
50mV
THRESHOLD
OVERCURRENT ISENSE+
COMPARATOR
INSNSS1+
CSF
HYSTERESIS
100mV
GATE DRIVE SECTION
1V
VINS2
4664A BD01
FAULTS2
PGOODS2
UVS2
TIMERS2
ON/OFF
RUNS2
FREQS2
HYS_PRGMS2
Vhys_prgm
VOUT2_SENSE
1µA ~ 5µA
VINS2_SENSE
ANTI-SHOOT THROUGH
CONTROL LOGIC
R18
500k
R17
500k
FROM OVER CURRENT, VOUT2_SENSE1
VINS2_SENSE, INTVCC, AND TEMP FAULTS
LEVEL D8
LEVEL D7
VINS2F
VSENSE FILTER
VOUT2_SENSE
VOUT2
LEVEL DR6
LEVEL DR5
50mA
95mA
RVF1
CVF
VINS2
100k
PGOODS2
10k
VOUT2
0.068µF
PGOODS1
60.4k
200kHz
100k
LTM4664A
4:1 DIVIDER BLOCK DIAGRAM
Rev. 0
25
CSNUB0
RSNUB0
SWC0
GL_C0
GND
SGND_C0, C1
COUT1
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10k
VDD33
3.3V- TOLERANT PULL UP
NOT SHOWN
PGOODS2
COMP_0a
COMP_0b
VOSNS–_C0
SHARE_CLK
FAULT_C1
FAULT_C0
RUN_C1
RUN_C0
WP
ALERT
SDA
SCL
CCOMPL
PGOOD_C0
CCOMPH
CLOAD0
5.5V- TOLERANT PULL UP
NOT SHOWN
LOAD0
VOSNS _C0
+
TSNS_C0a
READ_VOUT0, MFR_VOUT_PEAK,
READ_ IOUT0)
TSNS_C0b
(VOUTC0 TELEMETRY:
COUT2
VOUTC0 ADJ TO 1.5V MAX
UP TO 25A, 30A UP TO 1.2VOUT VOUTC0
OPTIONAL SNUBBER
PHFLT_C0
PWM_C0
UVLO
ROM
PROGRAM
DIGITAL ENGINE, MAIN CONTROL
VDD33
COMPARE
PROG RCOMP
EA0
EXTVCC
2µA
TEMP MUX
DIE TEMP SENSE
SINC3
SPI MASTER
SPI SLAVE
ADC
10:1 MUX
EEPROM
SETPOINT, UV,
OV, ILIM DACs
RAM
PWMC1
32µA READ_TEMPERATURE0
VBE SENSING
PWMC0
AND POWER CONTROL LOGIC)
UV/OV MONITORS, VCO AND PLL, MOSFET DRIVERS
LINEAR REGULATORS, DACs, ADC,
INTVCC
GL_C1
PROG GM
32MHz OSC
SYNC DRIVER
MFR_PWM_COMP
EA1
IOUT1 SENSE
CCM CH1 I SIGNAL
DRMOS BLK C1
DRIVERS
LOGIC
2.2µF
VDD33
330nH
OVER TEMP MONITOR (140°C)
REMOTE SENSE
VDD33
14.3k
2.5V
2.2µF
4664A BD2
22pF
2.2µF
READ_TEMPERATURE1
0.01µF TSNS1
CHANNEL 1 TEMP
DRMOS C1 BOTTOM GATE MONITOR
PROG RCOMP
CONFIG
DETECT
X1
DCR SENSE Z
OTM
10k
VDD33
0.22µF
VINS3_C1
Figure 2. LTM4664A PSM Section Dual Channel 25A/30A PSM Block Diagram
CHANNEL TIMING
MANAGEMENT
PROG GM
POWER MANAGEMENT
DIGITAL SECTION
22pF
X1
POWER CONTROL
ANALOG SECTION
0.22µF
2.2µF
( CURRENT MODE PWM CNTL LOOPS,
SVIN
CHIP
POWER
IOUT0 SENSE
CCM CH0 ISIGNAL
DRMOS BLK C0
DRIVERS
GL_C0 LOGIC
INTVCC
MFR_PWM_COMP
OTM
DCR SENSE Z
330nH
10k
VDD33
I2C BASED SMBus INTERFACE
WITH PMBus COMMANDS
(10kHz TO 400kHz
COMPATIBLE)
10µA VDD33
REMOTE SENSE
READ_TEMPERATURE 0
0.01µF TSNS0
CHANNEL 0 TEMP
DRMOS C0 BOTTOM GATE MONITOR
OVER TEMP MONITOR (140°C)
IIN READBACK
2.2µF
0.1µF
READ_VIN, READ_VIN_PEAK
INPUT CURRENT/ICHIP
( READ_IIN, MFR_READ_IIN_PEAK)
PROG A
0.22µF
VIN TELEMETRY: MFR_READ_ICHIP
IIN
Ω
1Ω
VINS3
INTVCC
ICHIP
VINS3_C1
VINS3_C0
VIN
CIN3
VOUTC0
IN–
VOUTC1
IN+
IOUTC0
CIN2
IOUTC1
CIN1
TEMP
RSENSE
PWM0
26
PWM1
VOUT2 12V
OPTIONAL SNUBBER
COUT4
VOUTC1_CFG
VOUTC0_CFG
VTRIMC1_CFG
VTRIMC0_CFG
CONFIG RESISTORS
NOT SHOWN
NOT SHOWN
CCOMPL
CLOAD1
READ_IOUT1
3.3V– TOLERANT PULL UP
FSWPH_CFG
ASEL
VDD25
SYNC
PGOOD_C1
COMP_1a
COMP_1b
VOSNS–_C1
TSNS_C1a
VOSNS+_C1
LOAD1
CCOMPH
READ_VOUT1, MFR_VOUT_PEAK
TSNS_C1b (VOUTC1_TELEMETRY:
COUT3
VOUTC1 ADJ TO 1.5V MAX
UP TO 25A, 30A UP TO 1.2VOUT
SGND_CO_C1
GND
VOUTC1
GL_C1
SWC1
PHFLT_C1
PWM_C1
CSNUB1
RSNUB1
LTM4664A
DUAL 25A/30A POWER SYSTEM MANAGEMENT (PSM) BLOCK DIAGRAM
Rev. 0
LTM4664A
4:1 DIVIDER OPERATION
4:1 DIVIDER DESCRIPTION
The LTM4664A incorporates a high performance 4:1
switched capacitor divider that divides down the input
voltage by a factor of four over an input voltage range of 30V
to 58V. This 4:1 divider then powers a dual 25A/30A PMBus
compliant core power rails that can regulate from 0.5V to
1.5V at up to 25A, per channel—and from 0.5V to 1.2V at
up to 30A per channel. The LTM4664A will convert this
high input range down directly to the low output voltages.
MAIN CONTROL
The LTM4664A internal 4:1 divider utilizes two constant
frequency, open loop switched capacitor/charge pump
stages for high voltage step down. The conversion efficiency is very high at ~ 99% for stage 1, and ~98.6% efficient for stage 2. Refer to Figure 1 for the block diagram.
In stage 1 steady state operation, the N-channel MOSFETs
M1 and M3 are turned on and off in the same phase with
around 50% duty cycle at a pre-programmed 100kHz
switching frequency. The N-channel MOSFETs M2 and
M4 are turned on and off complementary to MOSFETs M1
and M3. The gate drive waveforms are shown in Figure 3.
During phase 1, M1 and M3 are on and the flying capacitor CFLY1 is in series with COUT1. During phase 2, M2 and
M4 are on and CFLY1 is in parallel with COUT1. The VOUT1
VGS
M1
TS
M2
M3
M4
PHASE 2
The VOUT2 (VINS1/4) is connected to the VINS3_Cn which is
the inputs to the dual 25A/30A PMBus channels. This will
be discussed in more detail in the dual 25A/30A operation
section. There is a secondary fault protection comparator
circuit that can be used to monitor VOUT2 for over voltage.
This will be discussed in more detail in the application
section. The LTM4664A can operate over a 30V to 58V
input range that does have abrupt input voltage changes
that move quicker than a few milliseconds after reaching
steady state. See the window comparator section.
INTVCCS1,2/EXTVCCS1,2 POWER
~ 50% DUTY CYCLE
PHASE 1
voltage is always close to half of the top voltage at the
drain of MOSFET M1 (refer to GND pin) and in steady state
and it is not sensitive to variable loads due to the very
low impedance at its output. Stage 2 operates exactly the
same way, the N-channel MOSFETs M5 and M7 are turned
on and off in the same phase with around 50% duty cycle
at a pre-programmed 300kHz switching frequency. The
N-channel MOSFETs M6 and M8 are turned on and off
complementary to MOSFETs M5 and M7. The main input
voltage rail is connected to VINS1, and VOUT1 is connected
directly into the VINS2. The LTM4664A front end divider
stages do not regulate the output voltage with a closedloop feedback system. However, it stops switching when
fault conditions occur, such as VOUT pin overvoltage or
undervoltage, an overcurrent event, or an over temperature protection event.
PHASE 1
PHASE 2
4664A F03
Power for the quad N-channel MOSFET drivers and most
other internal circuitry is derived from the INTVCCSn pin.
Normally an internal 5.5V linear regulator supplies INTVCCS1, 2
power from either VINS1 or VINS2 as indicated in Figure 1.
Both of these input supplies have high input voltage, and
increases power loss due to the LDO drop. An optional
external voltage source on EXTVCCS1,2 pin enables a second 5.5V linear regulator and supplies INTVCCS1,2 power
from the EXTVCCS1,2 pin. To enable this more efficient
second regulator, VINS1,2 has to be higher than 7V and
the EXTVCCS1,2 pin voltage has to be higher than 6.5V.
Do not exceed 40V on the EXTVCCSn pin. Figure 1 shows
the VOUT2 supply (12V) connected to both EXTVCCS1 and
EXTVCCS2 to lower power loss in the LDO after startup.
Figure 3. Stage 1 MOSFET Switching Waveforms
Rev. 0
For more information www.analog.com
27
LTM4664A
4:1 DIVIDER OPERATION
Each of these can supply a peak current of 150mA. No
matter what type of bulk capacitor is used, an additional
0.1μF ceramic capacitor placed directly adjacent to the
INTVCCSn and GND pins is highly recommended. Good
bypassing is needed to supply the high transient currents
required by the MOSFET gate drivers. These high input
voltages along with the power MOSFETs being driven at
high frequencies may cause the maximum junction temperature rating for the LTM4664A to be exceeded. The
INTVCCSn current, which is dominated by the gate charge
current, may be supplied by either the 5.5V linear regulator from VINSn or the linear regulator from EXTVCCSn.
When the voltage on the EXTVCCSn pin is less than 6.5V,
the linear regulator from VINSn is enabled. Power dissipation for the internal controller in this case is highest and
is equal to VINSn • IINTVCCSn. The gate charge current is
dependent on operating frequency. This is why it is highly
recommended to use the VOUT2 voltage to supply power
to the EXTVCCS1,2 pins.
START-UP AND SHUTDOWN
The LTM4664A divider stages are in shutdown mode
when their RUNS pins are pulled down and lower than
1.1V. In this mode, most internal circuitry is turned off
including the INTVCCS1,2 regulators and the 4:1 divider
consumes less than 200μA current per stage. All gates
drives are actively pulled low to turn off the external
power MOSFETs in shutdown. Releasing RUNS1,2 allows
an internal 1μA current to pull up these pins and enable
the controller stage. Once the RUNS1,2 pin raises above
1.22V, an additional 5μA is flowing out of the respective
pin. Alternately, the RUNS pin may be externally pulled
up or driven directly by logic. Do not exceed the Absolute
Maximum Rating of 6V on these pins. After RUNS1,2 pin
is released and the INTVCCS1,2 voltage passes UVLO,
then that particular stage starts up and monitors the VINn
and VOUTn voltage continuously. The LTM4664A divider
stages start switching only if the VOUTn voltage is close
to half of the VINSn voltage or both VOUTn and VINSn voltages are close to GND. In voltage divider applications,
VOUT1,2 is pre-balanced to half the VINS1,2 voltage and the
LTM4664A divider stages may start up with capacitors at
different initial conditions and balancing will be invoked
if necessary.
28
FAULT PROTECTION AND THERMAL SHUTDOWN
The LTM4664A divider stages monitor system voltage,
current and temperature for faults. The stage 1 or 2 stops
switching and pulls down its FAULT pin when fault conditions occur. To clear voltage faults, the VOUTn pin voltage
has to be within the programmed window around half of
the VINSn voltage or the VINSn and VOUTSn voltages must
be lower than 1V and 0.5V respectively. To clear current
faults, the voltage drop from INSNSn+ pin to INSNSn– pin
has to be lower than 50mV. To clear temperature faults,
the IC temperature has to be lower than 165°C. The FAULT
pin is allowed to be pulled up by external resistors to
voltages up to 60V. It can also be used to control disconnect FETs that isolates the input and output during fault
conditions. See Figure 1 block diagram.
HIGH SIDE CURRENT SENSING
For over current protection, the LTM4664A uses a sensing
resistor RSENSE to monitor the current. The sensing resistor has to be placed at the drain of the very top MOSFET
M1. See Typical Application section for examples. In most
applications, the current through the sensing resistor is a
pulse current and the peak value is much higher than the
average load current. An internal RC filter on the ISENSE–
pin, with a time constant lower than switching frequency,
is used to set the precision average current protection. If
over current protection is not desired, short the ISENSE+
and ISENSE– pins together and connect them to the drain
of top MOSFET M1 directly. This is done in stage 2 since
stage 1 already monitors for current faults. See Figure 1.
FREQUENCY SELECTION
The selection of switching frequency is a trade-off
between efficiency and component size. Low frequency
operation increases efficiency by reducing MOSFET
switching losses, but requires larger capacitance to maintain low output ripple voltage and low output impedance.
The FREQSn pin can be used to program the controller’s
operating frequency from 100kHz to 1MHz. There is a
precision 10μA current flowing out of the FREQSn pin, so
the user can program the controller’s switching frequency
Rev. 0
For more information www.analog.com
LTM4664A
4:1 DIVIDER OPERATION
with a single resistor to GND. The voltage on the FREQSn
pin is equal to the resistance multiplied by 10μA current (e.g. the voltage is 1V with a 100k resistor from the
FREQSn pin to GND). A curve is provided below showing
the relationship between the voltages on the FREQSn pin
and switching frequency. Stage 1 is operated at 100kHz,
and Stage 2 is operated at 200kHz for optimal efficiency.
See Figure 4.
SWITCHING FREQUENCY (kHz)
1400
1200
1000
800
600
400
200
0
0
0.5
1.5
1
2
FREQ PIN VOLTAGE (V)
2.5
4664A F04
Figure 4. Relationship Between Switching
Frequency and Voltage at FREQ Pin
fSW (kHz) = RFREQ (kΩ) • 8 – 317kHz
POWER GOOD AND UV (PGOODSn AND UVSn PINS)
When the UVSn pin voltage is lower than 1V, the PGOODSn
pin is pulled low. The PGOODSn pin is also pulled low
when the RUNSn pin is low or when the LTM4664A divider
stages are starting up. The PGOODSn pin is released only
when the LTM4664A stage is switching and UVSn pin is
higher than 1V. The PGOODSn pin will flag power bad
immediately when the UVSn pin is low. However, there is
an internal 20μs power good mask and 100mV hysteresis when UVSn is higher than 1V. The PGOODSn pin is
pulled up by external resistor to INTVCC. The UVS1 pin
is used to monitor the VOUT1 level for proper regulation,
the PGOODS1 signal is used to sequence on the stage 2's
RUNS2 pin. Then PGOODS2 is used to sequence on the
downstream dual 25A/30A regulators. Proper setup on
the UV pin to set a specific regulation point will release
the PGOODn pin when the output voltage is at that value.
See Figure 1 block diagram.
ADDITIONAL OVERVOLTAGE PROTECTION
The OVP_SET, VOUT2_SET, and OVP_TRIP pins can be
used to monitor the VOUT2 voltage for an overvoltage fault.
These pins can be used in conjunction with the circuit in
Figure 46 to provide a secondary OVP protection in and
above the 4:1 divider fault protection. This feature can be
used to trip off the input power, and further protect the
low voltage outputs.
Rev. 0
For more information www.analog.com
29
LTM4664A
4:1 DIVIDER APPLICATION INFORMATION
A Typical Application in the Figure 1 block diagram shows
the 4:1 voltage divider circuit. For the 1st stage voltage
divider, the VINS1 input voltage is at the drain of very top
MOSFET M1 and the output voltage is at the VOUT1 pin
which is connected to the source of MOSFET M2 and the
drain of MOSFET M3. The output voltage is around half of
the input voltage in steady state. For the 2nd stage voltage
divider, the VINS2 input voltage is at the drain of very top
MOSFET M5 and the output voltage is at the VOUT2 pin
which is connected to the source of MOSFET M6 and the
drain of MOSFET M7. This completes the 4:1 divider.
When switches M2 and M4 are on or it is limited by the
power MOSFET saturation current in the 1st stage, and
M6 and M8 in the 2nd stage:
For divider applications, if the load current is applied
before startup or heavy resistive loads are connected to
the VOUTn pin, the divider stages may not start up due to
the limited drive current of the pre-balance circuit.
The LTM4664A provides a proprietary pre-balance
method to minimize the inrush charging current in voltage
divider applications. The LTM4664A controller detects
the VOUTn pin voltage before switching and compares
it with the VINSn /2 internally. If the VOUTn pin voltage is
much lower than the VINSn /2, a current source will source
95mA current to the VOUTn pin to pull the VOUTn pin up.
If the VOUTn pin voltage is much higher than the VINSn /2,
another current source will sink 50mA from VOUTn pin to
pull the VOUTn pin down.
Therefore the PGOODS1 signal is used to sequence on
stage 2 RUN2 pin, and the PGOODS2 pin is used to stage
on the dual 25A/30A regulator.
VOLTAGE DIVIDER PRE-BALANCE BEFORE SWITCHING
In voltage divider applications, the VOUTn voltage should
be always close to VINSn /2 in the steady state. The voltages on the flying capacitors (CFLYn) and VOUTn capacitors
are all very close to each other and equal to the half of
the input voltage. The charging inrush current is minimized during each switching cycle because the voltage
difference between capacitors is small. However, without a
special charging method such as the LTM4664A controller pre-charging circuitry, during start-up or fault conditions such as VOUTn short to GND, the difference between
capacitors can be large and huge charging currents may
be large enough to cause very large MOSFETs currents.
When switches M1 and M3 are on in the 1st stage, and
M5 and M7 are on in the 2nd stage. Ideally, the inrush
charge current is:
I=
VINSn – VCFLYn – VOUTn
RONMn +RONMn
30
I=
VCFLYn – VOUTn
RONMn +RONMn
With very low RDS(ON) of the power MOSFETs, the inrush
charge current could easily achieve several hundreds of
Amperes which can be higher than the MOSFET’s Safe
Operating Area (SOA).
If the VOUTn pin voltage is close to VINSn/2 and within
the pre-programmed window, both current sources are
disabled and the divider stages start switching. After 68
switching cycles and the VOUTn pin is still within the window, the FAULTSn pin is released.
For the 4:1 voltage divider with pre-balance startup, the
LTM4664A assumes no load current or very small load
current (less than 50mA) at the VOUTn (output) otherwise
the VOUTn cannot reach VINSn /2 and LTM4664A never
starts up. This no load condition can be achieved by connecting the PGOODn pin to the enable pins of the following electrical loads. If load current cannot be controlled off
such as resistive loads, a disconnected FETs is required to
disconnect the load to the VOUTn during startup as shown
in the typical applications. The input power source can
operate over the 30V to 58V range, but the supply variation needs to be constrained to move much slower than
the switching frequency and not exceed the hysteresis set
by the HYS_PRGMSn pin. Large fast voltage excursions
changes will force the 4:1 divider into pre-balance phase.
Rev. 0
For more information www.analog.com
LTM4664A
4:1 DIVIDER APPLICATION INFORMATION
OVERCURRENT PROTECTION
The LTM4664A 4:1 divider provides overcurrent protection
through a sensing resistor placed on the high voltage side.
A precision rail to rail comparator monitors the differential
voltage between INSNSSn + pin and INSNSSn – pin which
are Kelvin connected to a sensing resistor. Whenever the
INSNSSn + pin voltage is 50mV higher than INSNSSn – pin
voltage, overcurrent fault is triggered and the FAULTSn pin
is pulled down to ground. At the same time the divider
stage stops switching and starts retry mode based on
the timer pin setup. The overcurrent fault will be cleared
when the TIMERSn pin voltage reaches 4V and the voltage
across the sensing resistor is less than 50mV.
The current through the sensing resistor is a pulse current during charging/discharging of the flying capacitors,
which may result a voltage higher than the 50mV threshold at heavy loads. To prevent the inrush current from
falsely triggering the overcurrent protection, an RC filter
is required at the INSNSSn+ pin and INSNSSn– The RC
filter timer constant has to be larger than a switching
period. Typically a 100Ω and 0.1μF filter is good for most
of applications, and this filter is already included inside the
LTM4664A. The current limit can be selected by choosing different sense resistor values. For example, 10mΩ
sensing resistor sets current limit at 50mV/10mΩ = 5A
ideally. Due to the switching ripple, the actual current limit
is always lower than the ideal case. In real circuits, the
current limit is around 4.2A with the 0.1μF/100Ω filter and
200kHz switching frequency. If overcurrent protection is
not used, short INSNSSn+ pin and INSNSSn– pin together
and connect them to the drain of the top as shown in
Figure 1 stage 2. Stage 2 current limit is not usually necessary since stage 1 already has it implemented. Also
the dual 25A/30A regulators have overcurrent protection
discussed later in the data sheet.
WINDOW COMPARATOR PROGRAMMING
In normal operation, VOUTn voltage should be always
close to half of the VINSn voltage. A floating window
comparator monitors the voltage on the VOUTn pin and
compares it with VINSn /2. The window hysteresis voltage can be programmed and is equal to the voltage at
the HYS_PRGMSn pin. There is a precision 10μA current flowing out of HYS_PRGMSn pin. A single resistor
from HYS_PRGMSn pin to GND sets the HYS_PRGMSn
pin voltage, which equals the resistor value multiplied by
10μA current (e.g. the voltage is 1V with a 100k resistor from the HYS_PRGMSn pin to GND). With a 100k
resistor on the HYS_PRGMSn pin, the VINSn /2 voltage
has to be within (VOUTn ± 1V) window during startup and
normal operation, otherwise a fault is triggered and the
LTM4664A divider stages stop switching.
The window hysteresis voltage can be linearly programmed from 0.3V to 2.4V with different resistor values
on HYS_PRGMNSn pin. If the HYS_PRGMSn pin is tied
to INTVCC, a default 0.8V hysteresis window is applied
internally. The hysteresis window voltage has to be programmed large enough to tolerate the VOUTn pin voltage
ripple and voltage drop at maximum load conditions. See
Figure 5. Small internal RC filters can be used on these two
pins to reject noise higher than the switching frequency.
2.5
VOUTn_SENSE WINDOW VOLTAGE (V)
Usually front end circuit breakers control the rate change
and slew rate on the main input power which will eliminate
this problem. As long as the input supply moves much
slower than the operating frequency of the 4:1 divider,
then the regulator will be able to balance without a need
to pre-balance.
2
1.5
1
0.5
0
0
1
3
2
VHYS_PRGM (V)
4
5
4664A F05
Figure 5. Relationship Between HYS_PRGM Pin Voltage
and VOUTn_SENSE Window Comparator Voltage
Rev. 0
For more information www.analog.com
31
LTM4664A
4:1 DIVIDER APPLICATION INFORMATION
EFFECTIVE OPEN LOOP OUTPUT RESISTANCE AND
LOAD REGULATION
The LTM4664A divider stages do not regulate the output
voltage through a closed loop feedback system. However,
the output voltage is not sensitive to load conditions due
to the low output resistance when it is operating with
a certain quantity of flying capacitors and high switching frequency. The Thevenin equivalent circuit of voltage
divider circuit is shown in the Figure 6.
RTH
VIN
UNDERVOLTAGE LOCKOUT
G1
SW1
G2
MID
CFLY
VIN/2
CMID
G3
CMID
SW3
G4
4664A F06
Figure 6.
When duty cycle is around 50%:
–
ROUT =
1
4f R
The LTM4664A divider stages have a precision UVLO
comparator constantly monitoring the INTVCCSn voltage
to ensure that an adequate gate drive voltage is present.
It locks out the switching action when INTVCCSn is below
4.9V. To prevent oscillation when there is a distuSrbance
on the INTVCCSn, the UVLO comparator has 200mV of
precision hysteresis. Another way to detect an under
voltage condition is to monitor the input supply. Because
the RUN pin has a precision turn-on reference of 1.22V,
one can use a resistor divider to the VINSn to turn on the
stage when the input voltage is high enough. An extra 5μA
of current flows out of the RUN pin once the RUNSn pin
voltage passes 1.22V. One can program the hysteresis
of the RUNSn comparator by adjusting the values of the
resistive divider.
C
1+e S DS(ON) FLY
1
⎛
⎞
–
⎜
4fS RDS(ON)C FLY ⎟
4fSC FLY ⎜1– e
⎟
⎜
⎟
⎝
⎠
FAULT RESPONSE AND TIMER PROGRAMMING
The LTM4664A divider stages stop switching and pull
the FAULTSn pins low during fault conditions. A capacitor connected from the TIMERSn pin to GND sets retry
time to start-up if fault conditions are removed. The typical waveform on TIMERSn pin during fault condition is
shown in Figure 7.
Where:
fS is the switching frequency.
CFLY is the flying capacitor.
RDS(ON) is the on resistance of one MOSFET.
At low switching frequencies, RTH = 1/(4fS CFLY). As frequency increases, the RTH will finally approach 2RDS(ON).
In high power applications, it is suggested to select the
switching frequency around 1/(16CFLY RDS(ON)) or higher
for decent load regulation and efficiency. At heavy load
32
conditions, the output voltage will drop from VINSn /2 by
RTH • ILOAD. In many applications, multi-layer ceramic
capacitors (MLCC) are selected as flying capacitors. The
voltage coefficients of MLCC capacitors strongly depend
on the type and size of capacitors. Normally larger size
X7R MLCC capacitors are better than X5R in terms of
voltage coefficient. The capacitance still drops 20% to
30% capacitance with high DC bias voltage. Capacitance
derating needs to be considered when estimating the output resistance of the switched capacitor circuits.
After the FAULTSn pin is pulled low, a 3.5μA pull-up current
flows out of TIMER pin and starts to charge the TIMERSn
capacitor. The pull-up current increases to 7μA when then
TIMERSn pin voltage is higher than 0.5V and back to
3.5μA when the TIMERSn pin voltage is higher than 1.2V.
The TIMERSn pin will be strongly pulled down whenever
the fault conditions are removed or the TIMERSn pin
voltage is higher than 4V. When the TIMERSn pin voltage
Rev. 0
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LTM4664A
4:1 DIVIDER APPLICATION INFORMATION
3.5µA CHARGE
TIMER PIN
3.5µA CHARGE
TIMER PIN
4V
7µA CHARGE
TIMER PIN
1.2V
0.5V
FAULT
LOW
FAULT
RELEASE
PRE-BALANCE TIME
4664A F07
TURN ON
TIME
Figure 7. Timer Behavior During Fault or Startup
is between 0.5V and 1.2V, the internal pre-balance circuit
will source or sink current to the VOUTn pin and regulate
the VOUTn pin to VINSn /2 with around 95mA/50mA capability. The pre-balance time can be calculated based on the
capacitor CTIMERSn on the TIMERSn pin: TPRE-BALANCE =
CTIMER • 0.7V/7μA, so the pre-balance time is 100ms/μF
(e.g. the pre-balance time is 10ms with 0.1μF CTIMER). For
voltage divider applications, if the flying capacitor CFLYn
and the VOUTn capacitor are very large and input voltage
is high, it may take several pre-balance time periods to
pre-balance the VOUTn pin to VINSn /2 with a fixed CTIMER.
A longer start-up time is expected. Assuming zero initial
conditions, the time to charge the capacitors, τcharge can
be estimated from the equation:
Design Example
As a design example using LTM4664A divider stages for
a the 4:1 divider at 72W, assume VINS1 = 48V (nominal),
VINS1 = 60V (maximum), VOUT1 = 24V (nominal), IOUT1 =
3A (maximum) for stage 1. For high power and high voltage
applications, always start with a low switching frequency
e.g. 100kHz to minimize the switching losses. To set the
stage 1 to 100kHz switching frequency, a 36.5k 1% resistor
is connected from FREQS1 pin to ground. Set the CFLY1
voltage ripple to be 2% of the output voltage is a good starting point with tradeoff between efficiency and power density.
The CFLY1 can be calculated based on the equation below:
IOUT1(MAX) = 3A
τCharge =(COUT +CFLY )•(VIN / 2 / 93mA)
Keep in mind that the approximate capacitor value will be
the value at both voltage bias and temperature, this information can be derived from the capacitor data sheet curves.
Input/Output Capacitor and Flying Capacitor Selection
In high power switched capacitor applications, large AC
currents flow through the flying capacitors and input/
output capacitors. Low ESR ceramic capacitors are
highly recommended for high power switch capacitor
applications.
Make sure the maximum RMS capacitor current is within
the spec or higher rated capacitors are preferred. Note
that capacitor manufacturers’ ripple current ratings are
often based on only 2000 hours of life. This makes it
advisable to further derate the capacitor.
CFLY =
IOUT1(MAX)
2 • fSW • VCFLY1(RIPPLE)
∼ 31µF =
3A
2 •100kHz • 0.48V
Consider the ceramic capacitance derating at 24VDC bias
voltage, 8 of 10μF/X7R/50V ceramic capacitors are paralleled as flying capacitors.
The 4:1 divider at 72W, assume VINS2 = 24V (nominal),
VIN = 30V (maximum), VOUT2 = 12V (nominal), IOUT2 = 6A
(maximum) for stage 2. For stage 2 start with a switching
frequency of 200kHz to minimize the switching losses. To
set the 200kHz switching frequency, a 60.4k 1% resistor is connected from FREQS2 pin to ground. Set the
CFLY2 voltage ripple to be 2% of the output voltage is a
good starting point with trade-off between efficiency and
Rev. 0
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33
LTM4664A
4:1 DIVIDER APPLICATION INFORMATION
power density. The CFLY2 can be calculated based on the
equation below:
IOUT2(MAX) = 6A
CFLY =
IOUT2(MAX)
2 • fSW • VCFLY2(RIPPLE)
∼ 62µF =
6A
2 • 200kHz • 0.24V
The output capacitor selection is similar to the flying
capacitor selection. More output capacitors result smaller
output voltage ripple. The output capacitor has less than
1/3 the CFLY RMS current, and the output capacitor can
be much less than the flying capacitor. Some of output
capacitors may be connected between input and output
to serve as input capacitors at the same time. However
the voltage rating of those capacitors has to be selected
based on the input voltage instead of the output voltage.
Capacitors to use for 4:1 Divider
Consider the ceramic capacitance derating at 12VDC bias
voltage, 8 of 10μF/X7R/50V ceramic capacitors are paralleled as flying capacitors.
CAPACITOR
VENDOR
VALUE
(μF)
VOLTAGE
(V)
PART NUMBER
Murata
10
50
GRM32ER71H106KA12
Consider the ceramic capacitance derating at 24V and
12V DC bias voltage.
TDK
10
50
C3225X7R1H106M250AC
Murata
22
25
GRM32ER71G226KE15L
Taiyo Yuden
22
25
TMK325BJ226MMHT
The worst case RMS current may be 40% higher than the
maximum output current. So the worst case RMS on each
capacitor can be estimated by this equation:
IRMS1(MAX) =
IOUT1(MAX) • 140%
N
,
N = # of CFLY1 capacitor s in parallel in stage1
0.525A =
3A •1.4
8
Each capacitor is rated for 2A IRMS, no issue
IRMS2(MAX) =
IOUT2(MAX) • 140%
N
,
N = # of CFLY1 capacitor s in parallel in stage1
1.05A =
6A •1.4
8
Each capacitor is rated for 2A IRMS, no issue
34
Rev. 0
For more information www.analog.com
LTM4664A
DUAL 25A/30A PSM OPERATION
The LTM4664A Power System Management (PSM)
includes a highly configurable dual 25A/30A output
standalone nonisolated switching mode step-down
DC/DC power supply with built-in EEPROM NVM (nonvolatile memory) with ECC and I2C-based PMBus/ SMBus
2-wire serial communication interface capable of 400kHz
SCL bus speed. Two output voltages can be regulated
(VOUTC0, VOUTC1—collectively, VOUTn) with a few external input and output capacitors and pull-up resistors.
Readback telemetry data of input and output voltages and
input and output currents, and module temperatures are
continually digitized cyclically by an integrated 16-bit ADC
(analog-to-digital converter). Many fault thresholds and
responses are customizable. Data can be autonomously
saved to EEPROM when a fault occurs, and the resulting
fault log can be retrieved over I2C at a later time, for analysis. See Figure 2 for Block Diagram.
Programmable Input Voltage On and Off Threshold
Voltage
n
Programmable Current Limit per channel
n
Programmable Switching Frequency
n
Programmable OV and UV Threshold voltage
n
Programmable ON and Off Delay Times
n
Programmable Output Rise/Fall Times
n
Phase-Locked Loop for Synchronous PolyPhase
Operation (2, 3, 4 or 6 Phases)
n
Nonvolatile Configuration Memory with ECC
n
Optional External Configuration Resistors for Key
Operating Parameters
n
Optional Timebase Interconnect for Synchronization
Between Multiple Controllers
n
PSM SECTION OVERVIEW, MAJOR FEATURES
n
Major Features Include:
n
Stand Along Operation After User Factory
Configuration
Dedicated Power Good Indicators
n
PMBus, Version 1.2, 400kHz Compliant Interface
n
Direct Input and Chip Current Sensing
n
Programmable Loop Compensation Parameters
n
TINIT Start-Up Time: 30ms
n
PWM Synchronization Circuit, (See Frequency and
Phasing Section for Details)
MFR_ADC_CONTROL for Fast ADC Sampling of One
Parameter (as Fast as 8ms) (See PMBus Command
for Details)
n
Fully Differential Output Sensing for Both Channels;
VOUT0/VOUT1 Both Programmable Up to 1.5V
n
Power-Up and Program EEPROM with EXTVCC
n
Input Voltage Up to 18V
n
∆VBE Temperature Sensing
n
SYNC Contention Circuit (Refer to Frequency and
Phase Section for Details)
Fault Logging
n
Programmable Output Voltage
The PMBus interface provides access to important power
management data during system operation including:
Internal Controller Temperature
n
n
n
WP Pin to Protect Internal Configuration
Internal Power Channel Temperature Average
Output Current
n
Average Output Voltage
n
Average Input Voltage
n
Average Input Current
n
Average Chip Input Current from VIN
n
Configurable, Latched and Unlatched Individual Fault
and Warning Status
n
Individual channels are accessed through the PMBus
using the PAGE command, i.e., PAGE 0 or 1.
Fault reporting and shutdown behavior are fully configurable. Two individual FAULT_C0, FAULT_C1 outputs are
provided, both of which can be masked independently.
n
Rev. 0
For more information www.analog.com
35
LTM4664A
DUAL 25A/30A PSM OPERATION
Three dedicated pins for ALERT, PGOOD_C0/PGOOD_C1
functions are provided. The shutdown operation also
allows all faults to be individually masked and can be
operated in either unlatched (hiccup) or latched modes.
The degradation in EEPROM retention for temperatures
>125°C can be approximated by calculating the dimensionless acceleration factor using the following equation:
Individual status commands enable fault reporting over
the serial bus to identify the specific fault event. Fault or
warning detection includes the following:
AF = e
Output Undervoltage/Overvoltage
n
Input Undervoltage/Overvoltage
n
Input and Output Overcurrent
n
Internal Overtemperature
n
Communication, Memory or Logic (CML) Fault
n
EEPROM WITH ECC
The LTM4664A PSM dual 25A/30A regulators contain
internal EEPROM with ECC (Error Correction Coding) to
store user configuration settings and fault log information. EEPROM endurance retention and mass write operation time are specified in the Electrical Characteristics
and Absolute Maximum Ratings sections. Write operations above TJ = 85°C are possible although the Electrical
Characteristics are not guaranteed and the EEPROM will
be degraded. Read operations performed at temperatures
between –40°C and 125°C will not degrade the EEPROM.
Writing to the EEPROM above 85°C will result in a degradation of retention characteristics. The fault logging
function, which is useful in debugging system problems
that may occur at high temperatures, only writes to fault
log EEPROM locations. If occasional writes to these registers occur above 85°C, the slight degradation in the data
retention characteristics of the fault log will not take away
from the usefulness of the function.
It is recommended that the EEPROM not be written when
the die temperature is greater than 85°C. If the die temperature exceeds 130°C, the LTM4664A PSM will disable
all EEPROM write operations. All EEPROM write operations will be re-enabled when the die temperature drops
below 125°C. (The controller will also disable all the
switching when the die temperature exceeds the internal
overtemperature fault limit 160°C with a 10°C hysteresis).
36
⎡⎛ Ea ⎞ ⎛
⎞⎤
1
1
–
⎢⎜⎝ ⎟⎠ •⎜
⎟⎠ ⎥
+273
+273
T
T
k
⎝
USE
STRESS
⎦
⎣
where:
AF = acceleration factor
Ea = activation energy = 1.4eV
K = 8.617 • 10–5 eV/°K
TUSE = 125°C specified junction temperature
TSTRESS = actual junction temperature in °C
Example: Calculate the effect on retention when operating
at a junction temperature of 135°C for 10 hours.
TSTRESS = 130°C
TUSE = 125°C,
–5) • (1/398 – 1/403)] )
AF = e([(1.4/8.617 • 10
= 16.6
The equivalent operating time at 125°C = 16.6 hours.
Thus the overall retention of the EEPROM was degraded
by 16.6 hours as a result of operating at a junction temperature of 130°C for 10 hours. The effect of the overstress is negligible when compared to the overall EEPROM
retention rating of 87,600 hours at a maximum junction
temperature of 125°C.
The integrity of the entire onboard EEPROM is checked with
a CRC calculation each time its data is to be read, such as
after a power-on reset or execution of a RESTORE_USER_
ALL command. If a CRC error occurs, the CML bit is set in
the STATUS_BYTE and STATUS_WORD commands, the
EEPROM CRC Error bit in the STATUS_MFR_SPECIFIC
command is set, and the ALERT and RUN pins pulled
low (PWM channels off). At that point the device will only
respond at special address 0x7C, which is activated only
after an invalid CRC has been detected. The chip will also
respond at the global addresses 0x5A and 0x5B, but use
of these addresses when attempting to recover from a
CRC issue is not recommended. All power supply rails
associated with either PWM channel of a device reporting
an invalid CRC should remain disabled until the issue is
resolved. See the application Information section or contact
Rev. 0
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LTM4664A
DUAL 25A/30A PSM OPERATION
the factory for details on efficient in-system EEPROM programming, including bulk EEPROM Programming, which
the LTM4664A PSM also supports.
The LTM4664A PSM contains dual integrated constant frequency current mode control buck regulators (channel 0
and channel 1) whose built-in power MOSFETs are capable
of fast switching speed. The factory NVM-default switching
frequency clocks SYNC at 350kHz, to which the regulators
synchronize their switching frequency. The default phase-interleaving angle between the channels is 180°. A pin-strapping resistor on FSWPH_CFG configures the frequency of
the SYNC clock (switching frequency) and the channel phase
relationship of the channels to each other and with respect
to the falling edge of the SYNC signal. (Most possible combinations of switching frequency and phase-angle assignments are settable by resistor pin programming; see Table 3.
Configure the LTM4664A’s PSM NVM to implement settings
not available by resistor-pin strapping.) When a FSWPH_CFG
pin-strap resistor sets the channel phase relationship of the
LTM4664A’s PSM channels, the SYNC clock is not driven by
the module; instead, SYNC becomes strictly a high impedance input and channel switching frequency is then synchronized to SYNC provided by an externally-generated clock or
sibling LTM4664A with pull-up resistor to VDD33. Switching
frequency and phase relationship can be altered via the I2C
interface, but only when switching action is off, i.e., when the
module is not regulating either output. See the Dual 25A/30A
PSM Applications Information section for details.
Programmable analog feedback loop compensation for
channel 0 and channel 1 is accomplished with a capacitor
connection from COMP_C0a, 1a to SGND, and a capacitor from COMP_C0b, 1b to SGND.) The COMP_C0b, 1b
pin is for the high frequency gain roll off and is the gm
amplifier output that has a programmable range, and the
COMP_C0a, 1a pin has the programmable resistor range
along with a capacitor to SGND that sets the frequency
compensation. See Programmable Loop Compensation
section. The LTM4664A dual 25A/30A regulators module
have sufficient stability margins and good transient performance with a wide range of output capacitors—even
all-ceramic MLCCs. Table 12 provides guidance on input
and output capacitors recommended for many common
operating conditions along with the programmable compensation settings. The Analog Devices LTpowerCAD tool
is available for transient and stability analysis, and experienced users who prefer to adjust the module’s feedback
loop compensation parameters can use this tool.
POWER-UP AND INITIALIZATION
The LTM4664A dual 25A/30A regulators are designed
to provide standalone supply sequencing and controlled
turn-on and turn-off operation. It operates from a single
input supply (4.5V to 16V) while three on-chip linear regulators generate internal 2.5V, 3.3V and 5.5V. The controller configuration is initialized by an internal threshold
based UVLO where VIN must be approximately 4V and
the 5.5V, 3.3V and 2.5V linear regulators must be within
approximately 20% of the regulated values. In addition
to the power supply, a PMBus RESTORE_USER_ALL or
MFR_RESET command can initialize the part too.
The EXTVCC pin is driven by an external regulator to
improve efficiency of the circuit and minimize power loss
when VINS3 is high. The EXTVCC pin must exceed approximately 4.7V, and VINS3 must exceed approximately 7V
before the INTVCC LDO operates from the EXTVCC pin.
To minimize application power, the EXTVCC pin can be
supplied by a switching regulator.
During initialization, the external configuration resistors
are identified and/or contents of the NVM are read into the
controller’s commands and the power train is held off. The
RUN_Cn and FAULT_Cn and PGOOD_Cn are held low. The
LTM4664A dual 25A/30A regulators will use the contents
of Table 1 thru Table 5 to determine the resistor defined
parameters. See the Resistor Configuration section for more
details. The resistor configuration pins only control some
of the preset values of the controller. The remaining values
are programmed in NVM either at the factory or by the user.
If the configuration resistors are not inserted or if the ignore
RCONFIG bit is asserted (bit 6 of the MFR_CONFIG_ALL
configuration command), the LTM4664A PSM will use
only the contents of NVM to determine the DC/DC characteristics. The ASEL value read at power-up or reset is
always respected unless the pin is open. The ASEL will set
the bottom 4LSBs and the MSBs are set by NVM. See the
Dual 25A/30A PSM Applications Information section for
more details.
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37
LTM4664A
DUAL 25A/30A PSM OPERATION
After the part has initialized, an additional comparator
monitors VINS3. The VIN_ON threshold must be exceeded
before the output power sequencing can begin. After VIN
is initially applied, the part will typically require 70ms to
initialize and begin the TON_DELAY timer. The readback
of voltages and currents may require an additional 0ms
to 90ms.
SOFT-START
The method of start-up sequencing described below is
time-based. The part must enter the run state prior to
soft-start. Stage 2 of the 4:1 Divider will release RUN_C0
and RUN_C1 once it has reached regulation defined by
the program valve set by UVS2, and FAULTn is released.
The RUN_Cn pins are released by the LTM4664A PSM
after the part is initialized and VINS3 is greater than the
VIN_ON threshold. If multiple LTM4664A PSMs are used
in an application, they all hold their respective RUN_Cn
pins low until all devices are initialized and VINS3 exceeds
the VIN_ON threshold for every device. The SHARE_CLK
pin assures all the devices connected to the signal use
the same time base. The SHARE_CLK pin is held low until
the part has been initialized after VINS3 is applied. The
LTM4664A PSM can be set to turn-off (or remain off)
if SHARE_CLK is low (set bit 2 of MFR_CHAN_CONFIG
to 1). This allows the user to assure synchronization
across numerous PSM devices even if the RUN_Cn pins
cannot be connected together due to board constraints. In
general, if the user cares about synchronization between
chips it is best not only to connect all the respective RUN_
Cn pins together but also to connect all the respective
SHARE_CLK pins together and pulled up to VDD33 with a
10k resistor. This assures all chips begin sequencing at
the same time and use the same time base.
After the RUN_Cn pins release and prior to entering a
constant output voltage regulation state, the LTM4664A
PSM performs a monotonic initial ramp or “soft-start” on
each of the 25A/30A outputs. Soft-start is performed by
actively regulating the load voltage while digitally ramping
the target voltage from 0V to the commanded voltage setpoint. Once the LTM4664A dual 25A/30A regulators are
commanded to turn on (after power up and initialization),
the controller waits for the user specified turn-on delay
38
(TON_DELAY) prior to initiating this output voltage ramp.
The rise time of the voltage ramp can be programmed
using the TON_RISE command to minimize inrush currents associated with the start-up voltage ramp. The softstart feature is disabled by setting the value of TON_RISE
to any value less than 0.25ms. The LTM4664A PWM_Cn
always uses discontinuous mode during the TON_RISE
operation. In discontinuous mode, the bottom MOSFET
is turned off as soon as reverse current is detected in
the inductor. This will allow the regulator to start up into
a prebiased load. When the TON_MAX_FAULT_LIMIT is
reached, the part transitions to continuous mode, if so
programmed. If TON_MAX_FAULT_LIMIT is set to zero,
there is no time limit and the part transitions to the desired
conduction mode after TON_RISE completes and VOUT
has exceeded the VOUT_UV_FAULT_LIMIT and IOUT_OC
is not present. However, setting TON_MAX_FAULT_LIMIT
to a value of 0 is not recommended.
TIME-BASED SEQUENCING
The default mode for sequencing the outputs on and
off is time-based. Each output is enabled after waiting
TON_DELAY amount of time following either a RUN_Cn
pin going high, a PMBus command to turn on or the VIN
rising above a preprogrammed voltage. Off sequencing is
handled in a similar way. To assure proper sequencing,
make sure all ICs connect the SHARE_CLK pin together and
RUN_Cn pins together. If the RUN_Cn pins cannot be connected together for some reasons, set bit 2 of MFR_CHAN_
CONFIG to 1. This bit requires the SHARE_CLK pin to be
clocking before the power supply output can start. When
the RUN_Cn pin is pulled low, the LTM4664A PSM will hold
the pin low for the MFR_ RESTART_DELAY. The minimum
MFR_RESTART_ DELAY is TOFF_DELAY + TOFF_FALL +
136ms. This delay assures proper sequencing of all rails.
The LTM4664A PSM calculates this delay internally and will
not process a shorter delay. However, a longer commanded
MFR_RESTART_DELAY can be used by the part. The maximum allowed value is 65.52 seconds.
VOLTAGE-BASED SEQUENCING
The sequence can also be voltage-based. As shown in
Figure 8, The PGOOD_Cn pins are asserted when the
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LTM4664A
DUAL 25A/30A PSM OPERATION
UV threshold is exceeded for each output. It is possible
to feed the PGOOD_Cn pin from one LTM4664A PSM
channel into the RUN_Cn pin of the next LTM4664A
PSM channel in the sequence, especially across multiple LTM4664As. The PGOOD_Cn has a 60µs filter. If the
VOUT voltage bounces around the UV threshold for a long
period of time it is possible for the PGOOD_Cn output to
toggle more than once. To minimize this problem, set the
TON_RISE time under 100ms.
If a fault in the string of rails is detected, only the faulted
rail and downstream rails will fault off. The rails in the
string of devices in front of the faulted rail will remain on
unless commanded off.
START
PGOOD_C0
RUN_C0
LTM4664A
RUN_C1
PGOOD_C1
RUN_C0
PGOOD_C0
There are two ways to respond to faults; which are retry
mode and latched off mode. In retry mode, the controller
responds to a fault by shutting down and entering the inactive state for a programmable delay time (MFR_RETRY_
DELAY). This delay minimizes the duty cycle associated
with autonomous retries if the fault that causes the shutdown disappears once the output is disabled. The retry
delay time is determined by the longer of the MFR_RETRY_
DELAY command or the time required for the regulated
output to decay below 12.5% of the programmed value.
If multiple outputs are controlled by the same FAULT_Cn
pin, the decay time of the faulted output determines the
retry delay. If the natural decay time of the output is too
long, it is possible to remove the voltage requirement of
the MFR_RETRY_DELAY command by asserting bit 0
of MFR_CHAN_CONFIG. Alternatively, latched off mode
means the controller remains latched-off following a fault
and clearing requires user intervention such as toggling
RUN_Cn or commanding the part OFF then ON.
LTM4664A
RUN_C1
PGOOD_C1
4664A F08
TO NEXT CHANNEL
IN THE SEQUENCE
Figure 8. Event (Voltage) Based Sequencing
SHUTDOWN
The LTM4664A PSM Regulators supports two shutdown
modes. The first mode is closed-loop shutdown response,
with user defined turn-off delay (TOFF_DELAY) and ramp
down rate (TOFF_FALL). The controller will maintain the
mode of operation for TOFF_FALL. The second mode is discontinuous conduction mode, the controller will not draw
current from the load and the fall time will be set by the
output capacitance and load current, instead of TOFF_FALL.
The shutdown occurs in response to a fault condition
or loss of SHARE_CLK (if bit 2 of MFR_CHAN_ CONFIG
is set to a 1) or VIN falling below the VIN_OFF threshold or FAULT pulled low externally (if the MFR_FAULT_
RESPONSE is set to inhibit). Under these conditions, the
power stage is disabled in order to stop the transfer of
energy to the load as quickly as possible. The shutdown
state can be entered from the soft-start or active regulation states or through user intervention.
LIGHT-LOAD CURRENT OPERATION
The LTM4664A PSM Regulators have two modes of operation: high efficiency discontinuous conduction mode or
forced continuous conduction mode. Mode selection is
done using the MFR_PWM _MODE command (discontinuous conduction is always the start-up mode, forced
continuous is the default running mode).
If a controller is enabled for discontinuous operation, the
inductor current is not allowed to reverse. The reverse
current comparator’s output turns off the bottom MOSFET
just before the inductor current reaches zero, preventing
it from reversing and going negative.
In forced continuous operation, the inductor current is
allowed to reverse at light loads or under large transient
conditions. The peak inductor current is determined solely
by the voltage on the COMP_Cn pins. In this mode, the
efficiency at light loads is lower than in discontinuous
mode operation. However, continuous mode exhibits
lower output ripple and less interference with audio circuitry, but may result in reverse inductor current, which
can cause the input supply to boost. The VIN_OV_FAULT_
LIMIT can detect this and turn off the offending channel.
However, this fault is based on an ADC read and can take
Rev. 0
For more information www.analog.com
39
LTM4664A
DUAL 25A/30A PSM OPERATION
up to tCONVERT to detect. If there is a concern about the
input supply boosting, keep the part in discontinuous
conduction mode.
If the part is set to discontinuous mode operation, as
the inductor average current increases, the controller will
automatically modify the operation from discontinuous
mode to continuous mode.
SWITCHING FREQUENCY AND PHASE
The switching frequency of the PWM_C1 can be established with an internal oscillator or an external time base.
The internal phase-locked loop (PLL) synchronizes the
PWM control to this timing reference with proper phase
relation, whether the clock is provided internally or externally. The device can also be configured to provide the
master clock to other devices through PMBus command,
NVM setting, or external configuration resistors as outlined in Table 3.
As clock master, a LTM4664A PSM device will drive its
open-drain SYNC pin at the selected rate with a pulse width
of 500ns. An external pull-up resistor between SYNC and
VDD33 is required in this case. Only one device connected
to SYNC should be designated to drive the pin. The other
LTM4664A PSM devices will automatically revert to an
external SYNC input, disabling its own SYNC, as long as
the external SYNC frequency is greater than 80% of the
programmed SYNC frequency. The external SYNC input
shall have a duty cycle between 20% and 80%.
Whether configured to drive SYNC or not, the LTM4664A
PSM devices can continue PWM operation using its own
internal oscillator if an external clock signal is subsequently lost.
The device can also be programmed to always require an
external oscillator for PWM operation by setting bit 4 of
MFR_CONFIG_ALL. The status of the SYNC driver circuit
is indicated by bit 10 of MFR_PADS.
The MFR_PWM_CONFIG command can be used to configure the phase of each channel. Desired phase can also
be set from EEPROM or external configuration resistors
as outlined in Table 3. Designated phase is the relationship
between the falling edge of SYNC and the internal clock
40
edge that sets the PWM latch to turn on the top power
switch. Additional small propagation delays to the PWM
control pins will also apply. Both PSM channels must be
off before the FREQUENCY_SWITCH and MFR_PWM_
CONFIG commands can be written to the LTM4664A PSM.
The phase relationships and frequency options provide
for numerous application options. Multiple LTM4664A
PSM channels modules can be synchronized to realize a
PolyPhase array. In this case the phases should be separated by 360/n degrees, where n is the number of phases
driving the output voltage rail.
PWM LOOP COMPENSATION
The internal PWM loop compensation resistors RCOMPna
of the LTM4664A PSM can be adjusted using bit[4:0] of
the MFR_PWM_COMP command.
The transconductance (gm) of the LTM4664A PSM channel PWM error amplifier can be adjusted using bit[7:5]
of the MFR_PWM_COMP command. These two loop
compensation parameters can be programmed when
the device is in operation. Refer to the Programmable
Loop Compensation subsection in the Dual 25A/30A PSM
Applications Information section for further details.
OUTPUT VOLTAGE SENSING
Both PSM channels in LTM4664A have differential amplifiers, which allow the remote sensing of the load voltage
between V+ and V– pins. The telemetry ADC is also fully
differential and makes measurements between VOSNS+_
Cn and VOSNS–_Cn voltages for both channels at the V+
and V– pins, respectively. The maximum allowed is 1.5V,
but the LTM4664A design is limited to 1.8V.
INTVCC/EXTVCC POWER
Power for the internal MOSFET drivers and most other
internal circuitry is derived from the INTVCC pin. When the
EXTVCC pin is shorted to GND or tied to a voltage less than
4.7V, an internal 5.5V linear regulator supplies INTVCC
power from VINS3. If EXTVCC is taken above approximately
4.7V and VINS3_C1 is higher than 7.0V, the 5.5V regulator is turned off and an internal switch is turned on,
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LTM4664A
DUAL 25A/30A PSM OPERATION
connecting EXTVCC to INTVCC. Using the EXTVCC allows
the INTVCC power to be derived from a high efficiency
external source such as a switching regulator output.
EXTVCC can provide power to the internal 3.3V linear regulator even when VINS3 is not present, which allows the
LTM4664A PSM to be initialized and programmed even
without main power being applied.
The INTVCC regulator is powered from the VINS3_C1 pin,
the power through the IC is equal to VINS3_C1 • IINTVCC. The
gate charge current is dependent on operating frequency.
The INTVCC regulator can supply up to 100mA, and the
typical INTVCC current for the LTM4664A PSM is ~50mA. A
12V input voltage would equate to a difference of 7V drop
across the internal controller, when multiplied by 50mA
equals a 350mW power loss. This loss can be eliminated
by providing an external 5V bias on the EXTVCC pin.
Do not tie INTVCC on the LTM4664A PSM to an external
supply because INTVCC will attempt to pull the external
supply high and hit current limit, significantly increasing
the die temperature.
OUTPUT CURRENT SENSING AND SUB MILLIOHM
DCR CURRENT SENSING
telemetry ADC with an input range of ±128mV, a noise floor
of 7µVRMS, and a peak-peak noise of approximately 46.5µV.
The LTM4664A PSM computes the inductor current using
the DCR value stored in the IOUT_CAL_GAIN command and
the temperature coefficient stored in command MFR_IOUT_
CAL_GAIN_TC. The resulting current value is returned by the
READ_IOUT command.
INPUT CURRENT SENSING
To sense total input current consumed by the LTM4664A's
25A/30A two power stages , a sense resistor is placed
between the supply voltage and VINS3 path. The IIN+ and
IIN– pins are connected to the sense resistor. The filtered
voltage is amplified by the internal high side current
sense amplifier and digitized by the LTM4664A’s PSM
telemetry ADC. The input current sense amplifier has
three gain settings of 2x, 4x, and 8x set by the bit[6:5] of
the MFR_PWM_CONFIG command. The maximum input
sense voltage for the three gain settings is 50mV, 20mV,
and 5mV respectively. The LTM4664A PSM computes the
input current using the internal RSENSE value stored in the
IIN_CAL_GAIN command. The resulting measured power
stage current is returned by the READ_IIN command.
The LTM4664A PSM channels use a unique sub-milliohm inductor current sensing technique that provides
a high level signal to noise ratio while sensing very low
signals in current mode operation. This enables higher
conversion efficiencies with the use of the internal
sub-milliohm inductors in heavy load applications. The
current limit threshold can be accurately set with the
MFR_PWM_MODE[7] for high and low range. The low
range setting MFR_PWM_MODE [7] = 0 should be used
(see page103).
The LTM4664A uses a 1Ω resistor to measure the chip
supply current being consumed by the LTM4664A PSM
Controller. This value is returned by the MFR_READ_ICHIP
command. The chip current is calculated by using the 1Ω
value stored in the MFR_RVIN command. Refer to the
subsection titled Input Current Sense Amplifier in the
Dual 25A/30A PSM Applications Information section for
further details.
The internal DCR sensing network, thus current limit are calculated based on the DCR of the inductor at room temperature.
The DCR of the inductor has a large temperature coefficient,
approximately 3900ppm/°C. The temperature coefficient of
the inductor is written to the MFR_IOUT_CAL_GAIN_TC register. The external temperature is sensed near the inductor
and used to modify the internal current limit circuit to maintain an essentially constant current limit with temperature.
The current sensed is then digitized by the LTM4664A PSM
Multiple LTM4664As can be arrayed in order to provide
a balanced load-share solution by bussing the necessary
pins. Figure 48 illustrates a 4-Phase design sharing connections required for load sharing.
PolyPhase LOAD SHARING
If an external oscillator is not provided, the SYNC pin
should only be enabled on one of the LTM4664A's
PSM Channels. The other(s) should be programmed to
disable SYNC using bit 4 of MFR_CONFIG_ALL. If an
external oscillator is present, the chip with the SYNC
Rev. 0
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41
LTM4664A
DUAL 25A/30A PSM OPERATION
pin enabled will detect the presence of the external
clock and disable its output.
Multiple channels need to tie all the VOSNS+_Cn pins
together, and all the VOSNS–_Cn pins together, COMP_na
and COMP_nb pins together as well. Do not assert bit[4]
of MFR_CONFIG_ALL except in a PolyPhase application.
The user must share the SYNC, SHARE_CLK, FAULT_Cn,
and ALERT pins of these parts. Be sure to use pull-up
resistors on SYNC, FAULT_Cn, SHARE_CLK and ALERT.
EXTERNAL/INTERNAL TEMPERATURE SENSE
Temperature is measured using the internal diode-connected
PNP transistors on either of the TSNS_C0b or TSNS_C1b
pins corresponding to channel 0 or 1. TSNS_Cnb pins
should be connected to their respective TSNS_Cna pins,
and these returns are directly connected to the LTM4664A
PSM SGND_C0_C1 pin. Two different currents are applied to
the diode (nominally 2µA and 32µA) and the temperature is
calculated from a ∆VBE measurement made with the internal
16-bit monitor ADC (see Figure 2, Block Diagram).
The LTM4664A PSM channels will only implement ∆VBE
temperature sensing, therefore MFR_PWM_MODE bit[5]
is reserved.
RCONFIG (RESISTOR CONFIGURATION) PINS
There are six input pins utilizing 1% resistors for these pins
to select key operating parameters. The pins are ASEL,
FSWPH_CFG, VOUTC0_CFG, VOUTC1_CFG, VTRIMC0_
CFG, VTRIMC1_CFG. If pins are floated, the value stored in
the corresponding NVM command is used. If bit 6 of the
MFR_CONFIG_ALL configuration command is asserted in
NVM, the resistor input is ignored upon power-up except
for ASEL which is always respected. The resistor configuration pins are only measured during a power-up reset
or after a MFR_RESET or after a RESTORE_USER_ALL
command is executed.
The VOUTn_CFG pin settings are described in Table 1.
These pins set the LTM4664A VOUTC0 and VOUTC1 output
voltage coarse settings. If the pin is open, the VOUT_
COMMAND command is loaded from NVM to determine
the output voltage. The default setting is to have the
42
switcher off unless the voltage configuration pins are
installed. The VTRIMn_CFG pins in Table 2 are used to set
the output voltage fine adjustment setting. Both combine
to offer several distinct output voltages.
The following parameters are set as a percentage of the
output voltage if the RCONFIG pins are used to determine
the output voltage:
n
n
n
n
n
n
VOUT_OV_FAULT_LIMIT.....................................+10%
VOUT_OV_WARN_LIMIT.....................................+7.5%
VOUT_MAX..........................................................+7.5%
VOUT_MARGIN_HIGH.........................................+5%
VOUT_MARGIN_LOW..........................................–5%
VOUT_UV_FAULT_LIMIT.....................................–7%
The FSWPH_CFG pin settings are described in Table 3.
This pin selects the switching frequency and phase of each
channel. The phase relationships between the two channels
and SYNC pin are determined in Table 3. To synchronize
to an external clock, the part should be put into external
clock mode (SYNC output disabled but frequency set to the
nominal value). If no external clock is supplied, the part will
clock at the programmed frequency. If the application is
multiphase and the SYNC signal between chips is lost, the
parts will not operate at the designed phase even if they are
programmed and trimmed to the same frequency.
This may increase the ripple voltage on the output, possibly produce undesirable operation. If the external SYNC
signal is being generated internally and external SYNC is
not selected, bit 10 of MFR_PADS will be asserted. If no
frequency is selected and the external SYNC frequency
is not present, a PLL_FAULT will occur. If the user does
not wish to see the ALERT from a PLL_FAULT even if
there is not a valid synchronization signal at power-up,
the ALERT mask for PLL_FAULT must be written. See
the description on SMBALERT_MASK for more details.
If the SYNC pin is connected between multiple ICs only
one of the ICs should have the SYNC pin enabled using
the MFR_CONFIG_ALL[4] =1, and all other ICs should
be configured to have the SYNC pin disabled with MFR_
CONFIG_ALL[4] =0.
The ASEL pin settings are described in Table 4. ASEL
selects slave address for the LTM4664A PSM. For more
detail, refer to Table 5.
Rev. 0
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LTM4664A
DUAL 25A/30A PSM OPERATION
NOTE: Per the PMBus specification, pin programmed
parameters can be overridden by commands from the
digital interface with the exception of ASEL which is
always honored. Do not set any part address to 0x5A or
0x5B because these are global addresses and all parts will
respond to them.
Table 2. VTRIMn_CFG Pin Strapping Look-Up Table for the
LTM4664A’s PSM Output Voltages, Fine Adjustment Setting
(Not Applicable if MFR_CONFIG_ALL[6] = 1b)
RVTRIMn_CFG*
BOT (kΩ)
VTRIM (mV) FINE ADJUSTMENT
TO VOUTn SETTING WHEN
RESPECTIVE
RVTRIMn_CFG
TOP (kΩ)
Open
0
14.3
32.4
99
14.3
22.6
86.625
14.3
18.0
74.25
14.3
15.4
61.875
14.3
12.7
49.5
14.3
37.125
14.3
Table 1. VOUTCn _CFG Pin Strapping Look-Up Table for
the LTM4664A’s PSM Output Voltages, Coarse Setting (Not
Applicable if MFR_CONFIG_ALL[6] = 1b)
RVOUTn_CFG
TOP (kΩ)
RVOUTn_CFG*
BOT (kΩ)
VOUTn (V)
SETTING
COARSE
14.3
Open
NVM
NVM
10.7
14.3
32.4
NVM
NVM
9.09
24.75
14.3
12.375
14.3
MFR_PWM
MODEn[1] BIT
14.3
22.6
3.3
0
7.68
14.3
18.0
3.1
0
6.34
–12.375
14.3
–24.75
14.3
–37.125
14.3
14.3
15.4
2.9
0
5.23
14.3
12.7
2.7
0
4.22
14.3
10.7
2.5
0, if VTRIMn > 0mV
1, if VTRIMn ≤ 0mV
3.24
–49.5
14.3
2.43
–61.875
14.3
14.3
14.3
9.09
2.3
1
1.65
–74.25
14.3
7.68
2.1
1
0.787
–86.625
14.3
14.3
6.34
1.9
1
0
–99
14.3
14.3
5.23
1.7
1
14.3
4.22
1.5
1
14.3
3.24
1.3
1
14.3
2.43
1.1
1
14.3
1.65
0.9
1
14.3
0.787
0.7
1
14.3
0
0.5
1
*RVOUTCn_CFG value indicated is nominal. Select RVOUTCn_CFG from a
resistor vendor such that its value is always within 3% of the value
indicated in the table. Take into account resistor initial tolerance, T.C.R.
and resistor operating temperatures, soldering heat/IR reflow, and
endurance of the resistor over its lifetime. Thermal shock/cycling,
moisture (humidity) and other effects (depending on one’s specific
application) could also affect RVOUTCn_CFG’s value over time. All such
effects must be taken into account in order for resistor pin strapping to
yield the expected result at every SVIN power-up and/or every execution
of MFR_RESET or RESTORE_ USER_ALL, over the lifetime of one’s
product.
*RVTRIMCn_CFG value indicated is nominal. Select RVTRIMCn_CFG from
a resistor vendor such that its value is always within 3% of the value
indicated in the table. Take into account resistor initial tolerance, T.C.R. and
resistor operating temperatures, soldering heat/IR reflow, and endurance
of the resistor over its lifetime. Thermal shock/cycling, moisture
(humidity) and other effects (depending on one’s specific application)
could also affect RVTRIMCn_CFG’s value over time. All such effects must be
taken into account in order for resistor pin strapping to yield the expected
result at every SVIN power-up and/or every execution of MFR_RESET, or
RESTORE_USER_ALL over the lifetime of one’s product.
Example:
VDD25
ROUTCn_CFG TOP
VOUTCn_CFG PIN
ROUTCn_CFG BOT
SGND_C0_C1
Rev. 0
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43
LTM4664A
DUAL 25A/30A PSM OPERATION
Table 3. FSWPH_CFG Pin Strapping Look-Up Table to Set the LTM4664A’s PSM Switching Frequency and Channel Phase-Interleaving
Angle (Not Applicable if MFR_CONFIG_ALL[6] = 1b)
RFSWPH_CFG
TOP (kΩ)
RFSWPH_CFG*
BOT (kΩ)
SWITCHING
FREQUENCY (kHz)
θSYNC TO θ0
θSYNC TO θ1
bits [2:0] of
MFR_PWM_CONFIG
bit [4] of
MFR_CONFIG_ALL
14.3
Open
NVM; LTM4664A
PSM
Default = 500
NVM; LTM4664A
Default = 0°
NVM; LTM4664A
PSM
Default = 180°
NVM; LTM4664A PSM
Default = 000b
NVM; LTM4664A PSM
Default = 0b
14.3
32.4
250
0°
180°
000b
0b
14.3
22.6
350
0°
180°
000b
0b
14.3
18.0
425
0°
180°
000b
0b
14.3
15.4
575
0°
180°
000b
0b
14.3
12.7
650
0°
180°
000b
0b
14.3
10.7
750
0°
180°
000b
0b
14.3
7.68
500
120°
240°
100b
0b
14.3
6.34
500
90°
270°
001b
0b
14.3
5.23
External**
0°
240°
010b
1b
14.3
4.22
External**
0°
120°
011b
1b
14.3
3.24
External**
60°
240°
101b
1b
14.3
2.43
External**
120°
300°
110b
1b
14.3
1.65
External**
90°
270°
001b
1b
14.3
0.787
External**
0°
180°
000b
1b
14.3
0
External**
120°
240°
100b
1b
*RFSWPH_CFG value indicated is nominal. Select RFSWPH_CFG from a resistor vendor such that its value is always within 3% of the value indicated in the
table. Take into account resistor initial tolerance, T.C.R. and resistor operating temperatures, soldering heat/IR reflow, and endurance of the resistor over
its lifetime. Thermal shock/cycling, moisture (humidity) and other effects (depending on one’s specific application) could also affect RFSWPH_CFG’s value
over time. All such effects must be taken into account in order for resistor pin-strapping to yield the expected result at every SVIN power-up and/or every
execution of MFR_RESET or RESTORE_USER_ALL, over the lifetime of one’s product.
**External setting corresponds to FREQUENCY_SWITCH (Register 0x33) value set to 0x0000; the device synchronizes its switching frequency to that of
the clock provided on the SYNC pin, provided MFR_CONFIG_ALL[4] = 1b.
Example:
VDD25
RFSWPH_CFG TOP
FSWPH_CFG PIN
RFSWPH_CFG BOT
44
Rev. 0
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LTM4664A
DUAL 25A/30A PSM OPERATION
Table 4. ASEL Pin Strapping Look-Up Table to Set the
LTM4664A’s PSM Slave Address (Applicable Regardless of
MFR_CONFIG_ALL[6] Setting)
RASEL* (kΩ)
Table 5. LTM4664A PSM MFR_ADDRESS Command Examples
Expressed in 7- and 8-Bit Addressing
HEX DEVICE
ADDRESS
SLAVE ADDRESS
MFR_ADDRESS[6:0]_R/W
DESCRIPTION
7-BIT
8-BIT
7 6 5 4 3 2 1 0 R/W
MFR_ADDRESS[6:4]_1111_R/W
Rail4
0x5A
0xB4
0 1 0 1 1 0 1 0
0
22.6
MFR_ADDRESS[6:4]_1110_R/W
Global4
0x5B
0xB6
0 1 0 1 1 0 1 1
0
18.0
MFR_ADDRESS[6:4]_1101_R/W
Default
0x4F
0x9E
0 1 0 0 1 1 1 1
0
15.4
MFR_ADDRESS[6:4]_1100_R/W
Example 1
0x40
0x80
0 1 0 0 0 0 0 0
0
12.7
MFR_ADDRESS[6:4]_1011_R/W
Example 2
0x41
0x82
0 1 0 0 0 0 0 1
0
MFR_ADDRESS[6:4]_1010_R/W
Disabled2,3
1 0 0 0 0 0 0 0
0
9.09
MFR_ADDRESS[6:4]_1001_R/W
7.68
MFR_ADDRESS[6:4]_1000_R/W
6.34
MFR_ADDRESS[6:4]_0111_R/W
5.23
MFR_ADDRESS[6:4]_0110_R/W
4.22
MFR_ADDRESS[6:4]_0101_R/W
3.24
MFR_ADDRESS[6:4]_0100_R/W
2.43
MFR_ADDRESS[6:4]_0011_R/W
1.65
MFR_ADDRESS[6:4]_0010_R/W
Note 1. This table can be applied to the MFR_RAIL_ADDRESSn
commands, but not the MFR_ADDRESS command.
Note 2. A disabled value in one command does not disable the device, nor
does it disable the global address.
Note 3. A disabled value in one command does not inhibit the device from
responding to device addresses specified in other commands.
Note 4. It is not recommended to write the value 0x00, 0x0C (7-bit), 0x5A
(7-bit), 0x5B (7-bit) or 0x7C(7-bit) to the MFR_CHANNEL_ADDRESSn or
the MFR_RAIL_ADDRESSn commands.
0.787
MFR_ADDRESS[6:4]_0001_R/W
0
MFR_ADDRESS[6:4]_0000_R/W
Open
32.4
10.7
Where:
R/W = Read/Write bit in control byte
All PMBus device addresses listed in the specification are 7 bits wide
unless otherwise noted.
Note: The LTM4664A PSM will always respond to slave address 0x5A and
0x5B regardless of the NVM or ASEL resistor configuration values.
*RCFG value indicated is nominal. Select RCFG from a resistor vendor
such that its value is always within 3% of the value indicated in the table.
Take into account resistor initial tolerance, T.C.R. and resistor operating
temperatures, soldering heat/IR reflow, and endurance of the resistor
over its lifetime. Thermal shock cycling, moisture (humidity) and other
effects (depending on one’s specific application) could also affect RCFG’s
value over time. All such effects must be taken into account in order for
resistor pin-strapping to yield the expected result at every SVIN power-up
and/or every execution of MFR_RESET or RESTORE_USER_ALL, over the
lifetime of one’s product.
Example:
FAULT DETECTION AND HANDLING
A variety of fault and warning reporting and handling
mechanisms are available. Fault and warning detection
capabilities include:
Input OV FAULT Protection and UV Warning
n
Average Input OC Warn
n
Output OV/UV Fault and Warn Protection
n
Output OC Fault and Warn Protection
n
Internal control Die and Internal Module
Overtemperature Fault and Warn Protection
n
Internal Undertemperature Fault and Warn Protection
n
CML Fault (Communication, Memory or Logic)
n
n
BIT
ASEL PIN
RASEL
SGND_C0_C1
External Fault Detection via the Bidirectional FAULT_Cn
Pins
In addition, the LTM4664A PSM can map any combination of fault indicators to their respective FAULT_Cn
pin using the propagate FAULTn response commands,
MFR_FAULT_ PROPAGATE. Typical usage of a FAULT_Cn
pin is as a driver for an external crowbar device, overtemperature alert, overvoltage alert or as an interrupt
Rev. 0
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45
LTM4664A
DUAL 25A/30A PSM OPERATION
to cause a microcontroller to poll the fault commands.
Alternatively, the FAULT_Cn pins can be used as inputs
to detect external faults downstream of the controller that
require an immediate response.
Any fault or warning event will always cause the ALERT
pin to assert low unless the fault or warning is masked by
the SMBALERT_MASK. The pin will remain asserted low
until the CLEAR_FAULTS command is issued, the fault bit
is written to a 1 or bias power is cycled or a MFR_RESET
command is issued, or the RUN pins are toggled OFF/
ON or the part is commanded OFF/ON via PMBus or an
ARA command operation is performed. The MFR_FAULT_
PROPAGATE command determines if the FAULT_Cn pins
are pulled low when a fault is detected.
Output and input fault event handling is controlled by the
corresponding fault response byte as specified in Table 3
thru 17. Shutdown recovery from these types of faults
can either be autonomous or latched. For autonomous
recovery, the faults are not latched, so if the fault conditions not present after the retry interval has elapsed, a
new soft-start is attempted.
If the fault persists, the controller will continue to retry.
The retry interval is specified by the MFR_RETRY_DELAY
command and prevents damage to the regulator components by repetitive power cycling, assuming the fault
condition itself is not immediately destructive. The MFR_
RETRY_DELAY must be greater than 120ms. It can not
exceed 83.88 seconds.
Status Registers and ALERT Masking
Figure 9 summarizes the internal LTM4664A PSM status
registers accessible by PMBus command. These contain
indication of various faults, warnings and other important operating conditions. As shown, the STATUS_BYTE
and STATUS_WORD commands also summarize contents of other status registers. Refer to PMBus Command
Summary for specific information.
NONE OF THE ABOVE in the STATUS_BYTE indicates that
one or more of the bits in the most-significant nibble of
STATUS_WORD are also set.
46
In general, any asserted bit in a STATUS_x register also
pulls the ALERT pin low. Once set, ALERT will remain low
until one of the following occurs.
n
A CLEAR_FAULTS or MFR_RESET Command Is Issued
The Related Status Bit Is Written to a One
n
The Faulted Channel Is Properly Commanded Off and
Back On
n
The LTM4664A PSM Successfully Transmits Its
Address During a PMBus ARA
n
Bias Power Is Cycled
n
With some exceptions, the SMBALERT_MASK command
can be used to prevent the LTM4664A PSM from asserting ALERT for bits in these registers on a bit-by-bit basis.
These mask settings are promoted to STATUS_WORD
and STATUS_BYTE in the same fashion as the status bits
themselves. For example, if ALERT is masked for all bits
in channel 0 STATUS_VOUT, then ALERT is effectively
masked for the VOUT bit in STATUS_WORD for PAGE 0.
The BUSY bit in STATUS_BYTE also asserts ALERT low
and cannot be masked. This bit can be set as a result of
various internal interactions with PMBus communication.
This fault occurs when a command is received that cannot
be safely executed with one or both channels enabled.
As discussed in the 4:1 Divider Application Information,
BUSY faults can be avoided by polling MFR_COMMON
before executing some commands.
If masked faults occur immediately after power up, ALERT
may still be pulled low because there has not been time
to retrieve all of the programmed masking information
from EEPROM.
Status information contained in MFR_COMMON and
MFR_PADS can be used to further debug or clarify the
contents of STATUS_BYTE or STATUS_WORD as shown,
but the contents of these registers do not affect the state
of the ALERT pin and may not directly influence bits in
STATUS_BYTE or STATUS_WORD.
Rev. 0
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LTM4664A
DUAL 25A/30A PSM OPERATION
STATUS_WORD
STATUS_VOUT*
7
6
5
4
3
2
1
0
VOUT_OV Fault
VOUT_OV Warning
VOUT_UV Warning
VOUT_UV Fault
VOUT_MAX Warning
TON_MAX Fault
TOFF_MAX Warning
(reads 0)
15
14
13
12
11
10
9
8
VOUT
IOUT
INPUT
MFR_SPECIFIC
POWER_GOOD#
(reads 0)
(reads 0)
(reads 0)
7
6
5
4
3
2
1
0
BUSY
OFF
VOUT_OV
IOUT_OC
(reads 0)
TEMPERATURE
CML
NONE OF THE ABOVE
STATUS_BYTE
(PAGED)
STATUS_IOUT
7
6
5
4
3
2
1
0
IOUT_OC Fault
(reads 0)
IOUT_OC Warning
(reads 0)
(reads 0)
(reads 0)
(reads 0)
(reads 0)
MFR_COMMON
7
6
5
4
3
2
1
0
STATUS_TEMPERATURE
OT Fault
OT Warning
(reads 0)
UT Fault
(reads 0)
(reads 0)
(reads 0)
(reads 0)
(PAGED)
STATUS_CML
7
6
5
4
3
2
1
0
Chip Not Driving ALERT Low
Chip Not Busy
Internal Calculations Not Pending
Output Not In Transition
EEPROM Initialized
(reads 0)
SHARE_CLK_LOW
WP Pin High
Invalid/Unsupported Command
Invalid/Unsupported Data
Packet Error Check Failed
Memory Fault Detected
Processor Fault Detected
(reads 0)
Other Communication Fault
Other Memory or Logic Fault
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
EEPROM ECC Status
Reserved
Reserved
Reserved
Reserved
DESCRIPTION
7
6
5
4
3
2
1
0
Internal Temperature Fault
Internal Temperature Warning
EEPROM CRC Error
Internal PLL Unlocked
Fault Log Present
VDD33 UV or OV Fault
VOUT Short Cycled
FAULT Pulled Low By External Device
(PAGED)
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
VDD33 OV Fault
VDD33 UV Fault
(reads 0)
(reads 0)
Invalid ADC Result(s)
SYNC Clocked by External Source
Channel 1 is POWER_GOOD
Channel 0 is POWER_GOOD
LTM4664A Forcing RUN1 Low
LTM4664A Forcing RUN0 Low
RUN1 Pin State
RUN0 Pin State
LTM4664A Forcing FAULT1 Low
LTM4664A Forcing FAULT0 Low
FAULT1 Pin State
FAULT0 Pin State
MFR_PADS
MFR_INFO
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
VIN_OV Fault
(reads 0)
VIN_UV Warning
(reads 0)
Unit Off for Insuffcient VIN
(reads 0)
IIN_OC Warning
(reads 0)
STATUS_MFR_SPECIFIC
(PAGED)
(PAGED)
7
6
5
4
3
2
1
0
STATUS_INPUT
7
6
5
4
3
2
1
0
4664A F09
MASKABLE GENERATES ALERT BIT CLEARABLE
General Fault or Warning Event
General Non-Maskable Event
Dynamic
Status Derived from Other Bits
Yes
No
No
No
Yes
Yes
No
Not Directly
Yes
Yes
No
No
Figure 9. LTM4664A PSM Status Register Summary
Rev. 0
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47
LTM4664A
DUAL 25A/30A PSM OPERATION
Mapping Faults to FAULT Pins
Channel-to-channel fault (including channels from multiple
LTM4664A PSMs) dependencies can be created by connecting FAULT_Cn pins together. In the event of an internal
fault, one or more of the channels is configured to pull the
bussed FAULT_Cn pins low. The other channels are then
configured to shut down when the FAULT_Cn pins are
pulled low. For autonomous group retry, the faulted channel is configured to let go of the FAULT_Cn pin(s) after a
retry interval, assuming the original fault has cleared. All
the channels in the group then begin a soft-start sequence.
If the fault response is LATCH_OFF, the FAULT_Cn pin
remains asserted low until either the RUN_Cn pin is toggled OFF/ON or the part is commanded OFF/ON. The toggling of the RUN_Cn either by the pin or OFF/ON command
will clear faults associated with the channel. If it is desired
to have all faults cleared when either RUN_Cn pin is toggled or, set bit 0 of MFR_CONFIG_ALL to a 1.
The status of all faults and warnings is summarized in the
STATUS_WORD and STATUS_BYTE commands.
Additional fault detection and handling capabilities are:
See Table 18.
Power Good Pins
The PGOOD_Cn pins of the LTM4664A PSM are connected to the open drains of internal MOSFETs. The
MOSFETs turn on and pull the PGOOD_Cn pins low when
the channel output voltage is not within the channel’s
UV and OV voltage thresholds. During TON_DELAY and
TON_RISE sequencing, the PGOOD_Cn pin is held low.
The PGOOD_Cn pin is also pulled low when the respective
RUN_Cn pin is low. The PGOOD_Cn pin response is deglitched by an internal 100µs digital filter. The PGOOD_Cn
pin and PGOOD status may be different at times due to
communication latency of up to 10µs.
CRC Protection
The integrity of the NVM memory is checked after a power
on reset. A CRC error will prevent the controller from leaving the inactive state. If a CRC error occurs, the CML bit is
set in the STATUS_BYTE and STATUS_WORD commands,
the appropriate bit is set in the STATUS_MFR_SPECIFIC
48
command, and the ALERT pin will be pulled low. NVM
repair can be attempted by writing the desired configuration to the controller and executing a STORE_USER_ALL
command followed by a CLEAR_FAULTS command.
The LTM4664A manufacturing section of the NVM is
mirrored. If both copies are corrupted, the “NVM CRC
Fault” in the STATUS_MFR_SPECIFIC command is set.
If this bit remains set after being cleared by issuing a
CLEAR_FAULTS or writing a 1 to this bit, an irrecoverable
internal fault has occurred. The user is cautioned to disable both output power supply rails associated with this
specific part. There are no provisions for field repair of
NVM faults in the manufacturing section.
SERIAL INTERFACE
The LTM4664A serial interface is a PMBus compliant
slave device and can operate at any frequency between
10kHz and 400kHz. The address is configurable using
either the NVM or an external resistor divider. In addition
the LTM4664A always responds to the global broadcast
address of 0x5A (7-bit) or 0x5B (7-bit).
The serial interface supports the following protocols defined
in the PMBus specifications: 1) send command, 2) write byte,
3) write word, 4) group, 5) read byte, 6) read word and 7) read
block. 8) write block. All read operations will return a valid
PEC if the PMBus master requests it. If the PEC_REQUIRED
bit is set in the MFR_CONFIG_ALL command, the PMBus
write operations will not be acted upon until a valid PEC has
been received by the LTM4664A.
Communication Protection
PEC write errors (if PEC_REQUIRED is active), attempts
to access unsupported commands, or writing invalid data
to supported commands will result in a CML fault. The
CML bit is set in the STATUS_BYTE and STATUS_WORD
commands, the appropriate bit is set in the STATUS_CML
command, and the ALERT pin is pulled low.
DEVICE ADDRESSING
The LTM4664A PSM offers four different types of addressing
over the PMBus interface, specifically: 1) global, 2) device,
3) rail addressing and 4) alert response address (ARA).
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DUAL 25A/30A PSM OPERATION
Global addressing provides a means of the PMBus master
to address all LTM4664A PSM devices on the bus. The
LTM4664A PSM global address is fixed 0x5A (7-bit) or
0xB4 (8-bit) and cannot be disabled. Commands sent to
the global address act the same as if PAGE is set to a
value of 0xFF. Commands sent are written to both channels simultaneously. Global command 0x5B (7-bit) or
0xB6 (8-bit) is paged and allows channel specific command of all LTM4664A PSM devices on the bus. Other LTC
device types may respond at one or both of these global
addresses. Reading from global addresses is strongly
discouraged.
Device addressing provides the standard means of the
PMBus master communicating with a single instance of
an LTM4664A PSM. The value of the device address is set
by a combination of the ASEL configuration pin and the
MFR_ ADDRESS command. When this addressing means
is used, the PAGE command determines the channel being
acted upon. Device addressing can be disabled by writing
a value of 0x80 to the MFR_ADDRESS.
Rail addressing provides a means for the bus master to
simultaneously communicate with all channels connected
together to produce a single output voltage (PolyPhase).
While similar to global addressing, the rail address can
be dynamically assigned with the paged MFR_RAIL_
ADDRESS command, allowing for any logical grouping of
channels that might be required for reliable system control.
Reading from rail addresses is also strongly discouraged.
All four means of PMBus addressing require the user to
employ disciplined planning to avoid addressing conflicts.
Communication to LTM4664A PSM devices at global and rail
addresses should be limited to command write operations.
RESPONSES TO VOUT AND IIN/IOUT FAULTS
The digital processor within the LTM4664A PSM provides
the ability to ignore the fault, shut down and latch off or
shut down and retry indefinitely (hiccup). The retry interval is set in MFR_RETRY_ DELAY and can be from 120ms
to 83.88 seconds in 1ms increments. The shutdown for
OV/UV and OC can be done immediately or after a user
selectable deglitch time.
Output Overvoltage Fault Response
A programmable overvoltage comparator (OV) guards
against transient overshoots as well as long-term overvoltages at the output. In such cases, the top MOSFET
is turned off and the bottom MOSFET is turned on.
However, the reverse output current is monitored while
device is in OV fault. When it reaches the limit, both top
and bottom MOSFETs are turned off. The top and bottom MOSFETs will keep their state until the overvoltage
condition is cleared regardless of the PMBus VOUT_OV_
FAULT_RESPONSE command byte value. This hardware
level fault response delay is typically 2µs from the overvoltage condition to BG asserted high. Using the VOUT_
OV_FAULT_RESPONSE command, the user can select
any of the following behaviors:
OV Pull-Down Only (OV Cannot Be Ignored)
n
VOUT OV and UV conditions are monitored by comparators. The OV and UV limits are set in three ways:
As a Percentage of the VOUT if Using the Resistor
Configuration Pins
n
n
The IIN and IOUT overcurrent monitors are performed by
ADC readings and calculations. Thus these values are
based on average currents and can have a time latency
of up to tCONVERT. The IOUT calculation accounts for the
DCR and their temperature coefficient. The input current is equal to the voltage measured across the RSENSE
resistor divided by the resistors value as set with the
MFR_IIN_CAL_GAIN command. If this calculated input
current exceeds the IN_OC_WARN_LIMIT the ALERT pin
is pulled low and the IIN_OC_WARN bit is asserted in the
STATUS_INPUT command.
In NVM if Either Programmed at the Factory or Through
the GUI
Shut Down (Stop Switching) Immediately—Latch Off
n
n
Shut Down Immediately—Retry Indefinitely at the Time
Interval Specified in MFR_RETRY_DELAY
Either the Latch Off or Retry fault responses can be
de-glitched in increments of (0-7) • 10µs. See Table 14.
By PMBus Command
n
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49
LTM4664A
DUAL 25A/30A PSM OPERATION
Output Undervoltage Response
The response to an undervoltage comparator output can
be the following:
Ignore
n
Shut Down Immediately—Latch Off
n
n
Shut Down Immediately—Retry Indefinitely at the Time
Interval Specified in MFR_RETRY_DELAY.
The UV responses can be deglitched. See Table 14.
Peak Output Overcurrent Fault Response
Due to the current mode control algorithm, peak output current across the inductor is always limited on a
cycle-by-cycle basis. The value of the peak current limit
is specified in Electrical Characteristics table. The current limit circuit operates by limiting the COMP_Cn maximum voltage. Since internal DCR sensing is used, the
COMP_Cn maximum voltage has a temperature dependency directly proportional to the TC of the DCR of the
inductor. The LTM4664A PSM automatically monitors
the external temperature sensors and modifies the maximum allowed COMP_Cn to compensate for this term. The
IOUT_OC_FAULT_LIMIT section provides data points for
IOUT Limiting on page103.
The overcurrent fault processing circuitry can execute the
following behaviors:
Shut Down Immediately—Latch Off
n
Shut Down Immediately—Retry Indefinitely at the Time
Interval Specified in MFR_RETRY_DELAY.
The overcurrent responses can be deglitched in increments of (0-7) • 16ms. See Table 15.
RESPONSES TO TIMING FAULTS
TON_MAX_FAULT_LIMIT is the time allowed for VOUT to
rise and settle at start-up. The TON_MAX_FAULT_LIMIT
condition is predicated upon detection of the VOUT_UV_
FAULT_LIMIT as the output is undergoing a SOFT_START
sequence. The TON_MAX_ FAULT_LIMIT time is started
after TON_DELAY has been reached and a SOFT_START
50
Ignore
n
Shut Down (Stop Switching) Immediately—Latch Off
n
n
Shut Down Immediately—Retry Indefinitely at the Time
Interval Specified in MFR_RETRY_DELAY.
This fault response is not deglitched. A value of 0 in
TON_MAX_FAULT_LIMIT means the fault is ignored. The
TON_MAX_FAULT_LIMIT should be set longer than the
TON_RISE time. It is recommended TON_MAX_FAULT_
LIMIT always be set to a non-zero value, otherwise the
output may never come up and no flag will be set to the
user. See Table 16.
RESPONSES TO VIN OV FAULTS
VIN overvoltage is measured with the ADC. The response
is naturally deglitched by the 100ms typical response time
of the ADC. The fault responses are:
Ignore
n
Shut Down Immediately—Latch Off
n
Shut Down Immediately—Retry Indefinitely at the
Time Interval Specified in MFR_RETRY_DELAY. See
Table 16.
n
Current Limit Indefinitely
n
n
sequence is started. The resolution of the TON_MAX_
FAULT_LIMIT is 10µs. If the VOUT_UV_FAULT _LIMIT
is not reached within the TON_MAX_FAULT_LIMIT time,
the response of this fault is determined by the value of
the TON_MAX_FAULT_RESPONSE command value. This
response may be one of the following:
RESPONSES TO OT/UT FAULTS
Internal Overtemperature Fault Response
An internal temperature sensor protects against NVM
damage. Above 85°C, no writes to NVM are recommended. Above 130°C, the internal overtemperature warn
threshold is exceeded and the part disables the NVM and
does not re-enable until the temperature has dropped
to 125°C. When the die temperature exceed 160°C the
internal temperature fault response is enabled and the
PWM is disabled until the die temperature drops below
150°C. Temperature is measured by the ADC. Internal
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LTM4664A
DUAL 25A/30A PSM OPERATION
temperature faults cannot be ignored. Internal temperature limits cannot be adjusted by the user. See Table 14.
External Overtemperature and Undertemperature
Fault Response
Two internal temperature sensors are used to sense the
temperature of critical circuit elements like inductors
and power MOSFETs on each channel. The OT_FAULT_
RESPONSE and UT_FAULT_ RESPONSE commands are
used to determine the appropriate response to an overtemperature and under temperature condition, respectively. If
no external sense elements are used (not recommended)
set the UT_FAULT_ RESPONSE to ignore—and set the
UT_FAULT_LIMIT to 275°C. The fault responses are:
Ignore
n
Shut Down Immediately—Latch Off
n
n
Shut Down Immediately—Retry Indefinitely at the Time
Interval Specified in MFR_RETRY_DELAY. See Table 16.
RESPONSES TO INPUT OVERCURRENT AND OUTPUT
UNDERCURRENT FAULTS
Input overcurrent and output undercurrent are measured
with the ADC. The fault responses are:
Ignore
FAULT LOGGING
The LTM4664A PSM has fault logging capability. Data is
logged into memory in the order shown in Table 19. The data
is stored in a continuously updated buffer in RAM. When a
fault event occurs, the fault log buffer is copied from the RAM
buffer into NVM. Fault logging is allowed at temperatures
above 85°C; however, retention of 10 years is not guaranteed.
When the die temperature exceeds 130°C the fault logging is
delayed until the die temperature drops below 125°C. The fault
log data remains in NVM until a MFR_FAULT _LOG_CLEAR
command is issued. Issuing this command re-enables the
fault log feature. Before re-enabling fault log, be sure no faults
are present and a CLEAR_FAULTS command has been issued.
When the LTM4664A PSM powers-up or exits its reset
state, it checks the NVM for a valid fault log. If a valid fault
log exists in NVM, the “Valid Fault Log” bit in the STATUS_
MFR_SPECIFIC command will be set and an ALERT event
will be generated. Also, fault logging will be blocked until
the LTM4664A PSM has received a MFR_FAULT_LOG_
CLEAR command before fault logging will be re-enabled.
The information is stored in EEPROM in the event of
any fault that disables the controller on either channel. A
FAULT_Cn being externally pulled low will not trigger a
fault logging event.
n
BUS TIMEOUT PROTECTION
Shut Down Immediately—Latch Off
n
Shut Down Immediately—Retry Indefinitely at the Time
Interval Specified in MFR_RETRY_DELAY. See Table 15.
n
RESPONSES TO EXTERNAL FAULTS
When either FAULT_Cn pin is pulled low, the OTHER bit is
set in the STATUS_WORD command, the appropriate bit
is set in the STATUS_MFR_SPECIFIC command, and the
ALERT pin is pulled low. Responses are not deglitched.
Each channel can be configured to ignore or shut down
then retry in response to its FAULT_Cn pin going low by
modifying the MFR_FAULT_RESPONSE command. To
avoid the ALERT pin asserting low when FAULT_Cn is
pulled low, assert bit 1 of MFR_CHAN_CONFIG, or mask
the ALERT using the SMBALERT_MASK command.
The LTM4664A PSM implements a timeout feature to avoid
persistent faults on the serial interface. The data packet timer
begins at the first START event before the device address
write byte. Data packet information must be completed within
30ms or the LTM4664A PSM will three-state the bus and
ignore the given data packet. If more time is required, assert
bit 3 of MFR_CONFIG_ALL to allow typical bus timeouts of
255ms. Data packet information includes the device address
byte write, command byte, repeat start event (if a read operation), device address byte read (if a read operation), all data
bytes and the PEC byte if applicable.
The LTM4664A PSM allows longer PMBus timeouts for
block read data packets. This timeout is proportional to
the length of the block read. The additional block read
timeout applies primarily to the MFR_FAULT_LOG command. The timeout period defaults to 32ms.
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51
LTM4664A
DUAL 25A/30A PSM OPERATION
The user is encouraged to use as high a clock rate as
possible to maintain efficient data packet transfer between
all devices sharing the serial bus interface. The LTM4664A
PSM supports the full PMBus frequency range from
10kHz to 400kHz.
signals on the bus. The two-bus lines, SDA and SCL, must
be high when the bus is not in use. External pull-up resistors or current sources are required on these lines. The
LTM4664A is a slave device. The master can communicate
with the LTM4664A using the following formats:
Master Transmitter, Slave Receiver
n
SIMILARITY BETWEEN PMBus, SMBus AND I2C
2-WIRE INTERFACE
The PMBus 2-wire interface is an incremental extension
of the SMBus. SMBus is built upon I2C with some minor
differences in timing, DC parameters and protocol. The
PMBus/SMBus protocols are more robust than simple
I2C byte commands because PMBus/SMBus provide
timeouts to prevent persistent bus errors and optional
packet error checking (PEC) to ensure data integrity. In
general, a master device that can be configured for I2C
communication can be used for PMBus communication
with little or no change to hardware or firmware. Repeat
start (restart) is not supported by all I2C controllers but
is required for SMBus/PMBus reads. If a general purpose
I2C controller is used, check that repeat start is supported.
The LTM4664A PSM supports the maximum SMBus
clock speed of 100kHz and is compatible with the higher
speed PMBus specification (between 100kHz and 400kHz)
if MFR_ COMMON polling or clock stretching is enabled.
For robust communication and operation refer to the Note
section in the PMBus command summary. Clock stretching is enabled by asserting bit 1 of MFR_CONFIG_ALL.
For a description of the minor extensions and exceptions
PMBus makes to SMBus, refer to PMBus Specification
Part 1 Revision 1.2: Paragraph 5: Transport.
For a description of the differences between SMBus
and I2C, refer to System Management Bus (SMBus)
Specification Version 2.0: Appendix B—Differences
Between SMBus and I2C.
PMBus SERIAL DIGITAL INTERFACE
Master Receiver, Slave Transmitter
n
The following PMBus protocols are supported:
Write Byte, Write Word, Send Byte
n
Read Byte, Read Word, Block Read, Block Write
n
Alert Response Address
n
Figure 11 thru Figure 28 illustrate the aforementioned
PMBus protocols. All transactions support PEC and GCP
(group command protocol). The Block Read supports 255
bytes of returned data. For this reason, the PMBus timeout may be extended when reading the fault log.
Figure 11 is a key to the protocol diagrams in this section.
PEC is optional.
A value shown below a field in the following figures is
mandatory value for that field.
The data formats implemented by PMBus are:
Master transmitter transmits to slave receiver. The
transfer direction in this case is not changed.
n
Master reads slave immediately after the first byte. At
the moment of the first acknowledgment (provided by
the slave receiver) the master transmitter becomes a
master receiver and the slave receiver becomes a slave
transmitter.
n
Combined format. During a change of direction within
a transfer, the master repeats both a start condition
and the slave address but with the R/Wbit reversed. In
this case, the master receiver terminates the transfer
by generating a NACK on the last byte of the transfer
and a STOP condition.
n
The LTM4664A PSM communicates with a host (master)
using the standard PMBus serial bus interface. The Timing
Diagram, Figure 10, shows the timing relationship of the
52
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LTM4664A
DUAL 25A/30A PSM OPERATION
Refer to Figure 11 for a legend.
Handshaking features are included to ensure robust system communication. Please refer to the PMBus Communication
and Command Processing subsection of the Dual 25A/30A PSM Applications Information section for further details.
SDA
tf
tLOW
tr
tSU(DAT)
tHD(SDA)
tf
tSP
tr
tBUF
SCL
tHD(STA)
tHD(DAT)
tSU(STA)
tHIGH
tSU(STO)
4664A F10
START
CONDITION
REPEATED START
CONDITION
STOP
CONDITION
START
CONDITION
Figure 10. PMBus Timing Diagram
Table 6. Abbreviations of Supported Data Formats
PMBus
TERMINOLOGY
SPECIFICATION
LTC
REFERENCE
TERMINOLOGY DEFINITION
EXAMPLE
Floating point 16-bit data: value = Y • 2N,
b[15:0] = 0x9807 = 10011_000_0000_0111
value = 7 • 2–13 = 854E-6
L11
Linear
Part II ¶7.1
Linear_5s_11s
L16
Linear
VOUT_MODE
Part II ¶8.2
Linear_16u
Floating point 16-bit data: value = Y • 2–12,
where Y = b[15:0], an unsigned integer
b[15:0] = 0x4C00 = 0100_1100_0000_0000
value = 19456 • 2–12 = 4.75
CF
DIRECT
Part II ¶7.2
Varies
16-bit data with a custom format defined in
the detailed PMBus command description
Often an unsigned or two’s compliment
integer
Reg
Register Bits
Part II ¶10.3
Reg
Per-bit meaning defined in detailed PMBus
command description
PMBus STATUS_BYTE command
ASC
Text Characters
Part II ¶22.2.1
ASCII
ISO/IEC 8859-1 [A05]
LTC (0x4C5443)
where N = b[15:11] and Y = b[10:0], both
two’s compliment binary integers
Rev. 0
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53
LTM4664A
DUAL 25A/30A PSM OPERATION
FIGURE 11 THRU FIGURE 28 PMBus PROTOCOLS
S
START CONDITION
Sr
REPEATED START CONDITION
Rd
READ (BIT VALUE OF 1)
Wr
WRITE (BIT VALUE OF 0)
A
ACKNOWLEDGE (THIS BIT POSITION MAY BE 0
FOR AN ACK OR 1 FOR A NACK)
P
STOP CONDITION
PEC PACKET ERROR CODE
MASTER TO SLAVE
SLAVE TO MASTER
...
CONTINUATION OF PROTOCOL
4664A F11
Figure 11. PMBus Packet Protocol Diagram Element Key
1
7
S
1
1
SLAVE ADDRESS Rd/Wr A
1
P
4664A F12
Figure 12. Quick Command Protocol
1
7
S
1
1
8
1
1
SLAVE ADDRESS Wr A COMMAND CODE A
P
4664A F13
Figure 13. Send Byte Protocol
1
S
7
1
1
8
1
SLAVE ADDRESS Wr A COMMAND CODE A
8
1
1
PEC
A
P
4664A F14
Figure 14. Send Byte Protocol with PEC
1
S
7
1
1
8
1
SLAVE ADDRESS Wr A COMMAND CODE A
8
1
1
DATA BYTE
A
P
4664A F15
Figure 15. Write Byte Protocol
1
S
7
1
1
8
1
SLAVE ADDRESS Wr A COMMAND CODE A
8
1
8
1
1
DATA BYTE
A
PEC
A
P
4664A F16
Figure 16. Write Byte Protocol with PEC
1
S
7
1
1
8
1
SLAVE ADDRESS Wr A COMMAND CODE A
8
1
8
1
1
DATA BYTE
A
DATA BYTE
A
P
4664A F17
Figure 17. Write Word Protocol
1
S
7
1
1
8
1
SLAVE ADDRESS Wr A COMMAND CODE A
8
1
8
1
8
1
1
DATA BYTE
A
DATA BYTE
A
PEC
A
P
4664A F18
Figure 18. Write Word Protocol with PEC
54
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LTM4664A
DUAL 25A/30A PSM OPERATION
1
7
S
1
1
8
1
1
1
7
1
SLAVE ADDRESS Wr A COMMAND CODE A Sr SLAVE ADDRESS Rd A
8
1
1
DATA BYTE
A
P
4664A F19
Figure 19. Read Byte Protocol
1
S
7
1
1
8
1
1
7
1
8
1
DATA BYTE
A
1
SLAVE ADDRESS Wr A COMMAND CODE A Sr SLAVE ADDRESS Rd A
PEC
1
1
A
P
4664A F20
Figure 20. Read Byte Protocol with PEC
1
S
7
1
1
8
1
1
SLAVE ADDRESS Wr A COMMAND CODE A
7
1
1
Sr SLAVE ADDRESS Rd A
8
1
DATA BYTE LOW
A
1
1
DATA BYTE HIGH A
8
P
4664A F21
Figure 21. Read Word Protocol
1
S
7
1
1
8
1
1
7
1
1
SLAVE ADDRESS Wr A COMMAND CODE A Sr SLAVE ADDRESS Rd A
8
1
DATA BYTE LOW
A
8
1
DATA BYTE HIGH A
8
1
1
PEC
A
P
4664A F22
Figure 22. Read Word Protocol with PEC
1
S
7
1
1
8
1
1
7
1
1
SLAVE ADDRESS Wr A COMMAND CODE A Sr SLAVE ADDRESS Rd A
8
1
BYTE COUNT = N A
8
1
8
1 …
8
1
1
DATA BYTE 1
A
DATA BYTE 2
A …
DATA BYTE N
A
P
…
4664A F23
Figure 23. Block Read Protocol
1
S
7
1
1
8
1
1
7
1
1
SLAVE ADDRESS Wr A COMMAND CODE A Sr SLAVE ADDRESS Rd A
8
1
BYTE COUNT = N A
8
1
8
1 …
8
1
8
1
1
DATA BYTE 1
A
DATA BYTE 2
A …
DATA BYTE N
A
PEC
A
P
…
4664A F24
Figure 24. Block Read Protocol with PEC
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55
LTM4664A
DUAL 25A/30A PSM OPERATION
1
S
7
1
1
8
1
8
1
SLAVE ADDRESS Wr A COMMAND CODE A BYTE COUNT = M A
8
1
DATA BYTE 2
1
7
1
8
A …
1
Sr SLAVE ADDRESS Rd A
8
1
DATA BYTE 1
A
…
1
A …
DATA BYTE M
8
1
BYTE COUNT = N A
8
1
1
DATA BYTE 1
A
…
8
1 …
8
1
1
DATA BYTE 2
A …
DATA BYTE N
A
P
4664A F25
Figure 25. Block Write – Block Read Process Call
1
S
7
1
1
8
1
8
1
SLAVE ADDRESS Wr A COMMAND CODE A BYTE COUNT = M A
8
1
DATA BYTE 2
1
7
1
8
A …
1
Sr SLAVE ADDRESS Rd A
8
1
DATA BYTE 1
A
…
1
DATA BYTE M
8
A …
1
BYTE COUNT = N A
8
1
1
DATA BYTE 1
A
…
8
1 …
8
1
8
1
1
DATA BYTE 2
A …
DATA BYTE N
A
PEC
A
P
4678A F22
Figure 26. Block Write – Block Read Process Call with PEC
1
7
1
1
8
1
1
S ALERT RESPONSE Rd A DEVICE ADDRESS A
ADDRESS
P
4664A F27
Figure 27. Alert Response Address Protocol
1
7
1
1
8
1
S ALERT RESPONSE Rd A DEVICE ADDRESS A
ADDRESS
8
1
1
PEC
A
P
4664A F28
Figure 28. Alert Response Address Protocol with PEC
56
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LTM4664A
PMBus COMMAND SUMMARY
PMBus COMMANDS
Table 7 lists supported PMBus commands and manufacturer specific commands. A complete description of
these commands can be found in the “PMBus Power
System Mgt Protocol Specification – Part II – Revision
1.2”. Users are encouraged to reference this specification. Exceptions or manufacturer specific implementations
are listed in Table 7. Floating point values listed in the
“DEFAULT VALUE” column are either Linear 16-bit Signed
(PMBus Section 8.3.1) or Linear_5s_11s (PMBus Section
7.1) format, whichever is appropriate for the command.
All commands from 0xD0 through 0xFF not listed in
Table 7 are implicitly reserved by the manufacturer. Users
should avoid blind writes within this range of commands
to avoid undesired operation of the part. All commands
from 0x00 through 0xCF not listed in Table 7 are implicitly
not supported by the manufacturer. Attempting to access
non-supported or reserved commands may result in a
CML command fault event. All output voltage settings and
measurements are based on the VOUT_MODE setting of
0x14. This translates to an exponent of 2–12.
If PMBus commands are received faster than they are
being processed, the part may become too busy to handle
new commands. In these circumstances the part follows
the protocols defined in the PMBus Specification v1.2,
Part II, Section 10.8.7, to communicate that it is busy.
The part includes handshaking features to eliminate busy
errors and simplify error handling software while ensuring robust communication and system behavior. Please
refer to the subsection titled PMBus Communication
and Command Processing in the Dual 25A/30A PSM
Applications Information section for further details.
Table 7. PMBus Commands Summary (Note: The Data Format Abbreviations are Detailed in Table 8)
COMMAND NAME
CMD
CODE DESCRIPTION
PAGE
0x00
Provides integration with multi-page
PMBus devices.
R/W Byte
N
Reg
OPERATION
0x01
Operating mode control. On/off, margin
high and margin low.
R/W Byte
Y
Reg
ON_OFF_CONFIG
0x02
RUN pin and PMBus bus on/off command
configuration.
R/W Byte
Y
Reg
CLEAR_FAULTS
0x03
Clear any fault bits that have been set.
Send Byte
N
PAGE_PLUS_WRITE
0x05
Write a command directly to a
specified page.
W Block
N
90
PAGE_PLUS_READ
0x06
Read a command directly from a
specified page.
Block R/W
N
90
WRITE_PROTECT
0x10
Level of protection provided by the device
against accidental changes.
R/W Byte
N
STORE_USER_ALL
0x15
Store user operating memory to EEPROM.
Send Byte
RESTORE_USER_ALL
0x16
Restore user operating memory from
EEPROM.
Send Byte
CAPABILITY
0x19
Summary of PMBus optional communication
protocols supported by this device.
R Byte
N
Reg
SMBALERT_MASK
0x1B
Mask ALERT activity
Block R/W
Y
Reg
VOUT_MODE
0x20
Output voltage format and exponent (2–12).
VOUT_COMMAND
0x21
VOUT_MAX
0x24
TYPE
DATA
PAGED FORMAT UNITS NVM
Reg
DEFAULT
VALUE
PAGE
0x00
90
Y
0x80
94
Y
0x1E
94
NA
119
Y
0x00
91
N
NA
130
N
NA
130
0xB0
118
See CMD
119
2–12
100
Y
R Byte
Y
Reg
Nominal output voltage set point.
R/W Word
Y
L16
V
Y
1.0
0x1000
101
Upper limit on the commanded output
voltage including VOUT_MARGIN_HI.
R/W Word
Y
L16
V
Y
1.8
0x1CCD
100
0x14
Rev. 0
For more information www.analog.com
57
LTM4664A
PMBus COMMAND SUMMARY
COMMAND NAME
CMD
CODE DESCRIPTION
VOUT_MARGIN_HIGH
0x25
Margin high output voltage set point. Must
be greater than VOUT_COMMAND.
R/W Word
Y
L16
V
Y
1.05
0x10CD
101
VOUT_MARGIN_LOW
0x26
Margin low output voltage set point. Must
be less than VOUT_COMMAND.
R/W Word
Y
L16
V
Y
0.95
0x0F33
101
VOUT_TRANSITION_ RATE
0X27
Rate the output changes when VOUT
commanded to a new value.
R/W Word
Y
L11
V/ms
Y
0.25
0x8042
107
FREQUENCY_SWITCH
0x33
Switching frequency of the controller.
R/W Word
N
L11
kHz
Y
350k
0xFABC
98
VIN_ON
0x35
Input voltage at which the unit should start R/W Word
power conversion.
N
L11
V
Y
4.75
0xCA60
99
VIN_OFF
0x36
Input voltage at which the unit should stop
power conversion.
R/W Word
N
L11
V
Y
4.5
0xCA40
99
VOUT_OV_FAULT_LIMIT
0x40
Output overvoltage fault limit.
R/W Word
Y
L16
V
Y
1.1
0x119A
100
VOUT_OV_FAULT_
RESPONSE
0x41
Action to be taken by the device when an
output overvoltage fault is detected.
R/W Byte
Y
Reg
Y
0xB8
109
VOUT_OV_WARN_LIMIT
0x42
Output overvoltage warning limit.
R/W Word
Y
L16
V
Y
1.075
0x1133
100
VOUT_UV_WARN_LIMIT
0x43
Output undervoltage warning limit.
R/W Word
Y
L16
V
Y
0.925
0x0ECD
101
VOUT_UV_FAULT_LIMIT
0x44
Output undervoltage fault limit.
R/W Word
Y
L16
V
Y
0.9
0x0E66
101
VOUT_UV_FAULT_
RESPONSE
0x45
Action to be taken by the device when an
output undervoltage fault is detected.
R/W Byte
Y
Reg
Y
0xB8
110
IOUT_OC_FAULT_LIMIT
0x46
Output overcurrent fault limit.
R/W Word
Y
L11
Y
40
0xE280
103
IOUT_OC_FAULT_ RESPONSE
0x47
Action to be taken by the device when an
output overcurrent fault is detected.
R/W Byte
Y
Reg
Y
0x00
112
IOUT_OC_WARN_LIMIT
0x4A
Output overcurrent warning limit.
R/W Word
Y
L11
A
Y
30.0
0xDBC0
104
OT_FAULT_LIMIT
0x4F
External overtemperature fault limit.
R/W Word
Y
L11
C
Y
128
0xF200
105
OT_FAULT_RESPONSE
0x50
Action to be taken by the device when an
external overtemperature fault is detected,
R/W Byte
Y
Reg
Y
0xB8
114
OT_WARN_LIMIT
0x51
External overtemperature warning limit.
R/W Word
Y
L11
C
Y
125
0xEBE8
105
UT_FAULT_LIMIT
0x53
External undertemperature fault limit.
R/W Word
Y
L11
C
Y
–45
0xE530
106
UT_FAULT_RESPONSE
0x54
Action to be taken by the device when
an external undertemperature fault is
detected.
R/W Byte
Y
Reg
Y
0xB8
114
VIN_OV_FAULT_LIMIT
0x55
Input supply overvoltage fault limit.
R/W Word
N
L11
Y
15.5
0xD3E0
100
VIN_OV_FAULT_ RESPONSE
0x56
Action to be taken by the device when an
input overvoltage fault is detected.
R/W Byte
Y
Reg
Y
0x80
109
VIN_UV_WARN_LIMIT
0x58
Input supply undervoltage warning limit.
R/W Word
N
L11
V
Y
4.68
0xCA53
99
IIN_OC_WARN_LIMIT
0x5D
Input supply overcurrent warning limit.
R/W Word
N
L11
A
Y
10.0
0xD280
104
58
TYPE
DATA
PAGED FORMAT UNITS NVM
A
V
DEFAULT
VALUE
PAGE
Rev. 0
For more information www.analog.com
LTM4664A
PMBus COMMAND SUMMARY
COMMAND NAME
CMD
CODE DESCRIPTION
TON_DELAY
0x60
Time from RUN and/or Operation on to
output rail turn-on.
R/W Word
Y
L11
ms
Y
0.0
0x8000
106
TON_RISE
0x61
Time from when the output starts to rise
until the output voltage reaches the VOUT
commanded value.
R/W Word
Y
L11
ms
Y
3
0xC300
106
TON_MAX_FAULT_LIMIT
0x62
Maximum time from the start of
TON_RISE for VOUT to cross the
VOUT_UV_FAULT_LIMIT.
R/W Word
Y
L11
ms
Y
5
0xCA80
107
TON_MAX_FAULT_
RESPONSE
0x63
Action to be taken by the device when a
TON_ MAX_FAULT event is detected.
R/W Byte
Y
Reg
Y
0xB8
112
TOFF_DELAY
0x64
Time from RUN and/or Operation off to the R/W Word
start of TOFF_FALL ramp.
Y
L11
ms
Y
0.0
0x8000
107
TOFF_FALL
0x65
Time from when the output starts to fall
until the output reaches zero volts.
R/W Word
Y
L11
ms
Y
3
0xC300
107
TOFF_MAX_WARN_ LIMIT
0x66
Maximum allowed time, after TOFF_FALL
completed, for the unit to decay below
12.5%.
R/W Word
Y
L11
ms
Y
0
0x8000
108
STATUS_BYTE
0x78
One byte summary of the unit’s fault
condition.
R/W Byte
Y
Reg
NA
120
STATUS_WORD
0x79
Two byte summary of the unit’s fault
condition.
R/W Word
Y
Reg
NA
121
STATUS_VOUT
0x7A
Output voltage fault and warning status.
R/W Byte
Y
Reg
NA
121
STATUS_IOUT
0x7B
Output current fault and warning status.
R/W Byte
Y
Reg
NA
122
STATUS_INPUT
0x7C
Input supply fault and warning status.
R/W Byte
N
Reg
NA
122
STATUS_TEMPERATURE
0x7D
External temperature fault and warning
status for READ_TEMERATURE_1.
R/W Byte
Y
Reg
NA
123
STATUS_CML
0x7E
Communication and memory fault and
warning status.
R/W Byte
N
Reg
NA
123
STATUS_MFR_SPECIFIC
0x80
Manufacturer specific fault and state
information.
R/W Byte
Y
Reg
NA
124
READ_VIN
0x88
Measured input supply voltage.
R Word
N
L11
V
NA
127
READ_IIN
0x89
Measured input supply current.
R Word
N
L11
A
NA
127
READ_VOUT
0x8B
Measured output voltage.
R Word
Y
L16
V
NA
127
READ_IOUT
0x8C
Measured output current.
R Word
Y
L11
A
NA
127
READ_TEMPERATURE_1
0x8D
External temperature sensor temperature.
This is the value used for all temperature
related processing, including
IOUT_CAL_GAIN.
R Word
Y
L11
C
NA
127
READ_TEMPERATURE_2
0x8E
Internal die junction temperature. Does
not affect any other commands.
R Word
N
L11
C
NA
127
READ_FREQUENCY
0x95
Measured PWM switching frequency.
R Word
Y
L11
Hz
NA
127
READ_POUT
0x96
Measured output power
R Word
Y
L11
W
N/A
127
READ_PIN
0x97
Calculated input power
R Word
Y
L11
W
N/A
128
PMBus_REVISION
0x98
PMBus revision supported by this device.
Current revision is 1.2.
R Byte
N
Reg
0x22
118
MFR_ID
0x99
The manufacturer ID of the LTM4664A in
ASCII.
R String
N
ASC
LTC
118
TYPE
DATA
PAGED FORMAT UNITS NVM
DEFAULT
VALUE
PAGE
Rev. 0
For more information www.analog.com
59
LTM4664A
PMBus COMMAND SUMMARY
COMMAND NAME
CMD
CODE DESCRIPTION
MFR_MODEL
0x9A
Manufacturer part number in ASCII.
R String
N
ASC
MFR_VOUT_MAX
0xA5
Maximum allowed output voltage
including VOUT_OV_FAULT_LIMIT.
R Word
Y
L16
MFR_PIN_ACCURACY
0xAC
Returns the accuracy of the READ_PIN
command
R Byte
N
%
USER_DATA_00
0xB0
OEM RESERVED. Typically used for part
serialization.
R/W Word
N
Reg
USER_DATA_01
0xB1
Manufacturer reserved for LTpowerPlay®.
R/W Word
Y
USER_DATA_02
0xB2
OEM RESERVED. Typically used for part
serialization
R/W Word
N
USER_DATA_03
0xB3
An NVM word available for the user.
R/W Word
Y
USER_DATA_04
0xB4
An NVM word available for the user.
R/W Word
N
MFR_EE_UNLOCK
0xBD Contact factory.
135
MFR_EE_ERASE
0xBE
Contact factory.
135
MFR_EE_DATA
0xBF
Contact factory.
MFR_CHAN_CONFIG
0xD0
Configuration bits that are channel
specific.
R/W Byte
Y
Reg
Y
0x1D
92
MFR_CONFIG_ALL
0xD1
General configuration bits.
R/W Byte
N
Reg
Y
0x21
93
MFR_FAULT_ PROPAGATE
0xD2
Configuration that determines which faults
are propagated to the FAULT pin.
R/W Word
Y
Reg
Y
0x6993
115
MFR_PWM_COMP
0xD3
PWM loop compensation configuration
R/W Byte
Y
Reg
Y
0x28
96
MFR_PWM_MODE
0xD4
Configuration for the PWM engine.
R/W Byte
Y
Reg
Y
0xC7
95
MFR_FAULT_RESPONSE
0xD5
Action to be taken by the device when the
FAULT pin is externally asserted low.
R/W Byte
Y
Reg
Y
0xC0
113
MFR_OT_FAULT_ RESPONSE
0xD6
Action to be taken by the device when an
internal overtemperature fault is detected.
R Byte
N
Reg
0xC0
113
MFR_IOUT_PEAK
0xD7
Report the maximum measured
value of READ_ IOUT since last
MFR_CLEAR_PEAKS.
R Word
Y
L11
NA
128
MFR_ADC_CONTROL
0xD8
ADC telemetry parameter selected for
repeated fast ADC read back
R/W Byte
N
Reg
0x00
129
MFR_RETRY_DELAY
0xDB Retry interval during FAULT retry mode.
R/W Word
Y
L11
ms
Y
250.0
0xF3E8
108
MFR_RESTART_DELAY
0xDC Minimum time the RUN pin is held low by
the LTM4664A.
R/W Word
Y
L11
ms
Y
150
0xF258
108
MFR_VOUT_PEAK
0xDD Maximum measured value of READ_VOUT
since last MFR_CLEAR_PEAKS.
R Word
Y
L16
V
NA
128
MFR_VIN_PEAK
0xDE
Maximum measured value of READ_VIN
since last MFR_CLEAR_PEAKS.
R Word
N
L11
V
NA
128
MFR_TEMPERATURE_1_ PEAK
0xDF
Maximum measured value of external
Temperature (READ_TEMPERATURE_1)
since last MFR_CLEAR_PEAKS.
R Word
Y
L11
C
NA
128
MFR_READ_IIN_PEAK
0xE1
Maximum measured value of READ_IIN
command since last MFR_CLEAR_PEAKS
R Word
N
L11
A
NA
128
MFR_CLEAR_PEAKS
0xE3
Clears all peak values.
NA
120
MFR_READ_ICHIP
0xE4
Measured supply current of the SVIN pin
L11
A
NA
128
60
TYPE
DATA
PAGED FORMAT UNITS NVM
DEFAULT
VALUE
PAGE
LTM4664
118
1.8
0x1CCD
102
5.0%
128
Y
NA
118
Reg
Y
NA
118
Reg
Y
NA
118
Reg
Y
0x0000
118
Reg
Y
0x0000
118
V
135
Send Byte
N
R Word
N
A
Rev. 0
For more information www.analog.com
LTM4664A
PMBus COMMAND SUMMARY
COMMAND NAME
CMD
CODE DESCRIPTION
TYPE
DATA
PAGED FORMAT UNITS NVM
MFR_IOUT_CAL_GAIN
0xDA The ratio of the voltage at the current
sense pins to the sensed current. For
devices using a fixed current sense
resistor. It is the resistance value in mohm.
OxAA8B set at factory
R Word
Y
L11
MFR_PADS
0xE5
Digital status of the I/O pads.
R Word
N
Reg
Y
MFR_ADDRESS
0xE6
Sets the 7-bit I2C address byte.
Y
MFR_SPECIAL_ID
0xE7
Manufacturer code representing the
LTM4664A and revision
MFR_IIN_CAL_GAIN
0xE8
MFR_FAULT_LOG_ STORE
R/W Byte
N
Reg
R Word
N
Reg
The resistance value of the input current
sense element in mΩ.
R/W Word
N
L11
0xEA
Command a transfer of the fault log from
RAM to EEPROM.
Send Byte
MFR_INFO
0xB6
Contact factory.
MFR_FAULT_LOG_ CLEAR
0xEC
Initialize the EEPROM block reserved for
fault logging.
MFR_FAULT_LOG
0xEE
MFR_COMMON
DEFAULT
VALUE
PAGE
0.350mΩ
102
NA
124
0x4F
92
0x4100
118
2.0
0xC200
104
N
NA
131
Send Byte
N
NA
135
Fault log data bytes.
R Block
N
Reg
NA
131
0xEF
Manufacturer status bits that are common
across multiple LTC chips.
R Byte
N
Reg
NA
125
MFR_COMPARE_USER_ ALL
0xF0
Compares current command contents
with NVM.
Send Byte
N
NA
130
MFR_TEMPERATURE_2_ PEAK
0xF4
Peak internal die temperature since last
MFR_ CLEAR_PEAKS.
R Word
N
L11
NA
129
MFR_PWM_CONFIG
0xF5
Set numerous parameters for the DC/DC
controller including phasing.
R/W Byte
N
Reg
Y
0x10
97
MFR_IOUT_CAL_GAIN_ TC
0xF6
Temperature coefficient of the current
sensing element.
R/W Word
Y
CF
ppm/
˚C
Y
3900
0x0F3C
102
MFR_RVIN
0xF7
The resistance value of the VIN pin filter
element in mΩ. Set at Factory
R Word
N
L11
mΩ
N
1000
0x03E8
99
MFR_TEMP_1_GAIN
0xF8
Sets the slope of the external temperature
sensor.
R/W Word
Y
CF
Y
0.9
0x3FAE
105
MFR_TEMP_1_OFFSET
0xF9
Sets the offset of the external temperature
sensor with respect to –273.1°C
R/W Word
Y
L11
Y
0.0
0x8000
105
MFR_RAIL_ADDRESS
0xFA
Common address for PolyPhase outputs
to adjust common parameters.
R/W Byte
Y
Reg
Y
0x80
92
MFR_REAL_TIME
0xFB
48-bit share-clock counter value.
R Block
N
CF
NA
xx
MFR_RESET
0xFD
Commanded reset without requiring a
power down.
Send Byte
N
NA
94
mΩ
Y
135
Y
C
C
Note 1. Commands indicated with Y in the NVM column indicate that these commands are stored and restored using the STORE_USER_ALL and
RESTORE_USER_ALL commands, respectively.
Note 2. Commands with a default value of NA indicate “not applicable”. Commands with a default value of FS indicate “factory set on a per part basis”.
Note 3. The LTM4664A contains additional commands not listed in Table 7. Reading these commands is harmless to the operation of the IC; however, the
contents and meaning of these commands can change without notice.
Note 4. Some of the unpublished commands are read-only and will generate a CML bit 6 fault if written.
Note 5. Writing to commands not published in Table 7 is not permitted.
Note 6. The user should not assume compatibility of commands between different parts based upon command names. Always refer to the manufacturer’s
data sheet for each part for a complete definition of a command’s function. LTC strives to keep command functionality compatible between all LTC
devices. Differences may occur to address specific product requirements.
Rev. 0
For more information www.analog.com
61
LTM4664A
PMBus COMMAND SUMMARY
Table 8. Data Format Abbreviations
L11
Linear_5s_11s
PMBus data field b[15:0]
Value = Y • 2N
where N = b[15:11] is a 5-bit two’s complement integer and Y = b[10:0] is an 11-bit two’s complement integer
Example:
For b[15:0] = 0x9807 = ‘b10011_000_0000_0111
Value = 7 • 2–13 = 854 • 10–6
From “PMBus Spec Part II: Paragraph 7.1”
L16
Linear_16u
PMBus data field b[15:0]
Value = Y • 2N
where Y = b[15:0] is an unsigned integer and N = VOUT_MODE_PARAMETER is a 5-bit two’s complement exponent that is
hardwired to –12 decimal
Example:
For b[15:0] = 0x9800 = ‘b1001_1000_0000_0000
Value = 19456 • 2–12 = 4.75 From “PMBus Spec Part II: Paragraph 8.2”
Reg
Register
PMBus data field b[15:0] or b[7:0].
Bit field meaning is defined in detailed PMBus Command Description.
L16
Integer Word
PMBus data field b[15:0]
Value = Y
where Y = b[15:0] is a 16-bit unsigned integer
Example:
For b[15:0] = 0x9807 = ‘b1001_1000_0000_0111
Value = 38919 (decimal)
CF
Custom Format
Value is defined in detailed PMBus Command Description.
This is often an unsigned or two’s complement integer scaled by an MFR specific constant.
ASC
ASCII Format
A variable length string of text characters conforming to ISO/IEC 8859-1 standard.
62
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
VIN TO VOUT STEP-DOWN RATIOS
OUTPUT CAPACITORS
There are restrictions in the maximum VIN and VOUT stepdown ratio that can be achieved for a given input voltage.
Each output of the LTM4664A PSM is capable of 95% duty
cycle at 500kHz, but the VIN to VOUT minimum dropout is
still a function of its load current and will limit output current
capability related to high duty cycle on the topside switch.
The LTM4664A PSM channel outputs are designed for low
output voltage ripple noise and good transient response.
The bulk output capacitors defined as COUT are chosen
with low enough effective series resistance (ESR) to meet
the output voltage ripple and transient requirements. COUT
can be a low ESR tantalum capacitor, a low ESR polymer
capacitor or ceramic capacitor. The typical output capacitance range for each output is from 400µF to 1000µF.
Additional output filtering may be required by the system
designer, if further reduction of output ripple or dynamic
transient spikes is required. Table 12 shows a matrix of different output voltages and output capacitors to minimize
the voltage droop and overshoot during a 12.5A to 25A
step, 12A/µs transient each channel. Table 12 optimizes
total equivalent ESR and total bulk capacitance to optimize
the transient performance. Stability criteria are considered in the Table 12 matrix, and the LTpowerCAD Design
Tool will be provided for stability analysis. Multiphase
operation reduces effective output ripple as a function
of the number of phases. Application Note 77 discusses
this noise reduction versus output ripple current cancellation, but the output capacitance should be considered
carefully as a function of stability and transient response.
The LTpowerCAD Design Tool can calculate the output
ripple reduction as the number of implemented phases
increases by N times. A small value 10Ω resistor can be
placed in series from VOUTn to the VOSNS0+ pin to allow for
a bode plot analyzer to inject a signal into the control loop
and validate the regulator stability. The LTM4664A PSM
stability compensation can be adjusted using two external
capacitors, and the MFR_PWM_COMP commands.
Minimum on-time tON(MIN) is another consideration in operating at a specified duty cycle while operating at a certain
frequency due to the fact that tON(MIN) < D/fSW, where D is
duty cycle and fSW is the switching frequency. tON(MIN) is
specified in the electrical parameters as 60ns. See Note 6
in the Electrical Characteristics section for output current
guideline. Since the LTM4664A front end 4:1 divider feeds
the two 25A/30A PSM channels with a VOUT2 range of 7.5V
to 14.5V, there should be no minimum on time issue.
INPUT CAPACITORS
The LTM4664A PSM channels should be connected to
a low AC impedance DC source. For the regulator input,
four 22µF input ceramic capacitors are used to handle
the RMS ripple current. A 47µF to 100µF surface mount
aluminum electrolytic bulk capacitor can be used for more
input bulk capacitance. This bulk input capacitor is only
needed if the input source impedance is compromised by
long inductive leads, traces or not enough source capacitance. If low impedance power planes are used, then this
bulk capacitor is not needed.
For a buck converter, the switching duty-cycle can be
estimated as:
VOUTn
VINn
Without considering the inductor current ripple, for each
output, the RMS current of the input capacitor can be
estimated as:
Dn =
IOUTn (MAX)
• Dn • (1−Dn )
η%
In the above equation, η% is the estimated efficiency of the
power module. The bulk capacitor can be a switcher-rated
electrolytic aluminum capacitor, or a polymer capacitor.
ICINn (RMS) =
LIGHT LOAD CURRENT OPERATION
The LTM4664A PSM channels have two modes of operation including high efficiency, discontinuous conduction
mode or forced continuous conduction mode. The mode of
operation is configured by bit 0 of the MFR_PWM_MODEn
command (discontinuous conduction is always the start-up
mode, forced continuous is the default running mode).
If a channel is enabled for discontinuous mode operation,
the inductor current is not allowed to reverse. The reverse
Rev. 0
For more information www.analog.com
63
LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
current comparator, IREV, turns off the bottom MOSFET
(MBn) just before the inductor current reaches zero, preventing it from reversing and going negative. Thus, the
controller can operate in discontinuous (pulse-skipping)
operation. In forced continuous operation, the inductor current is allowed to reverse at light loads or under
large transient conditions. The peak inductor current is
determined solely by the voltage on the COMP_Cna pin.
In this mode, the efficiency at light loads is lower than
in discontinuous mode operation. However, continuous
mode exhibits lower output ripple and less interference
with audio circuitry. Forced continuous conduction mode
may result in reverse inductor current, which can cause
the input supply to boost. The VIN_OV_FAULT_LIMIT
can detect this on VIN3 and turn off the offending channel. However, this fault is based on an ADC read and can
nominally take up to 100ms to detect. If there is a concern
about the input supply boosting, keep the part in discontinuous conduction operation.
SWITCHING FREQUENCY AND PHASE
The switching frequency of the LTM4664A’s PSM channels is established by its analog phase-locked-loop (PLL)
locking on to the clock present at the module’s SYNC pin.
The clock waveform on the SYNC pin can be generated by
the LTM4664A’s PSM internal circuitry when an external
pull-up resistor to 3.3V (e.g., VDD33) is provided, in combination with the LTM4664A PSM control IC’s FREQUENCY_
SWITCH command being set to one of the following supported values: 250kHz, 350kHz, 425kHz, 500kHz, 575kHz,
650kHz, 750kHz. In this configuration, the module is called
a “sync master”: (using the factory-default setting of MFR_
CONFIG_ALL[4] = 0b), SYNC becomes a bidirectional
open-drain pin, and the LTM4664A PSM pulls SYNC logic
low for nominally 500ns at a time, at the prescribed clock
rate. The SYNC signal can be bused to other LTM4664A
PSM device modules (configured as “sync slaves”), for
purposes of synchronizing switching frequencies of multiple modules within a system—but only one LTM4664A
PSM devices should be configured as a “sync master”; the
other LTM4664A(s) should be configured as “sync slaves”.
The most straightforward way is to set its
FREQUENCY_ SWITCH command to 0x0000 and
64
MFR_CONFIG_ALL[4] = 1b. This can be easily implemented with resistor pin-strap settings on the FSWPH_
CFG pin (see Table 3). Using MFR_CONFIG_ALL[4] = 1b,
the LTM4664As SYNC pin becomes a high impedance
input, only—i.e., it does not drive SYNC low. The module
synchronizes its frequency to that of the clock applied to
its SYNC pin. The only shortcoming of this approach is:
in the absence of an externally applied clock, the switching frequency of the module will default to the low end of
its frequency-synchronization capture range (~225kHz).
If fault-tolerance to the loss of an externally applied SYNC
clock is desired, the FREQUENCY_SWITCH command of
a “sync slave” can be left at the nominal target switching
frequency of the application, and not 0x0000 However,
it is then still necessary to configure MFR_CONFIG_
ALL[4] = 1b. With this combination of configurations,
the LTM4664A’s SYNC pin becomes a high impedance
input and the module synchronizes its frequency to
that of the externally applied clock, provided that the
frequency of the externally applied clock exceeds ~½.
of the target frequency (FREQUENCY_SWITCH). If the
SYNC clock is absent, the module responds by operating
at its target frequency, indefinitely. If and when the SYNC
clock is restored, the module automatically phase-locks
to the SYNC clock as normal. The only shortcoming of
this approach is: the EEPROM must be configured per
above guidance; resistor pin-strapping options on the
FSWPH_CFG pin alone cannot provide fault-tolerance to
the absence of the SYNC clock.
The FREQUENCY_SWITCH register can be altered via I2C
commands, but only when switching action is disengaged,
i.e., the module’s outputs are turned off. The FREQUENCY_
SWITCH command takes on the value stored in NVM at
VINS3 power-up, but is overridden according to a resistor pin-strap applied between the FSWPH_CFG pin and
SGND only if the module is configured to respect resistor
pin-strap settings (MFR_CONFIG_ALL[6] = 0b). Table 3
highlights available resistor pin-strap and corresponding
FREQUENCY_SWITCH settings.
The relative phasing of all active channels in a PolyPhase
rail should be optimally phased. The relative phasing of
each rail is 360°/n, where n is the number of phases in the
rail. MFR_PWM_CONFIG[2:0] configures channel relative
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DUAL 25A/30A PSM APPLICATIONS INFORMATION
phasing with respect to the SYNC pin. Phase relationship
values are indicated with 0° corresponding to the falling
edge of SYNC being coincident with the turn-on of the
top MOSFETs, MTn.
The MFR_PWM_CONFIG command can be altered via
I2C commands, but only when switching action is disengaged, i.e., the module’s outputs are turned off. The
MFR_PWM_CONFIG command takes on the value stored
in NVM at SVIN power-up, but is overridden according
to a resistor pin-strap applied between the FSWPH_CFG
pin and SGND only if the module is configured to respect
resistor pin-strap settings (MFR_CONFIG_ALL[6] = 0b).
Table 3 highlights available resistor pin-strap and corresponding MFR_PWM_CONFIG[2:0] settings.
Some combinations of FREQUENCY_SWITCH and
MFR_PWM_CONFIG[2:0] are not available by resistor
pin-strapping the FSWPH_CFG pin. All combinations of
supported values for FREQUENCY_SWITCH and MFR_
PWM_CONFIG[2:0] can be configured by NVM programming—or, I2C transactions, provided switching action is
disengaged, i.e., the module’s outputs are turned off.
Care must be taken to minimize capacitance on SYNC
to assure that the pull-up resistor versus the capacitor
load has a low enough time constant for the application
to form a “clean” clock. (See “Open-Drain Pins”, later in
this section.)
When an LTM4664A PSM is configured as a sync slave,
it is permissible for external circuitry to drive the SYNC
pin from a current-limited source (less than 10mA), rather
than using a pull-up resistor. Any external circuitry must
not drive high with arbitrarily low impedance at SVIN power-up, because the SYNC output can be low impedance
until NVM contents have been downloaded to RAM.
Recommended LTM4664A PSM switching frequencies of
operation for many common VIN-to-VOUT applications are
indicated below. When the two channels of an LTM4664A
PSM are stepping input voltage(s) down to output voltages whose recommended switching frequencies below
are significantly different, operation at the higher of the
two recommended switching frequencies is preferable,
but minimum on-time must be considered. (See Minimum
On-Time Considerations section.)
Table 9. Recommended PSM Switching Frequency for Various
VIN-to-VOUT Step-Down Scenarios
V
7.5VIN
10VIN
12VIN
14.5VIN
250kHz
250kHz
250kHz
250kHz
350kHz
350kHz
350kHz
350kHz
0.5
0.7
0.8
0.9
1.0
1.2
1.5
OUTPUT CURRENT LIMIT PROGRAMMING
The cycle-by-cycle current limit (= VISENSE/DCR) is proportional to COMP_Cn, which can be programmed from
1.45V to 2.2V using the PMBus command IOUT_OC_
FAULT_LIMIT. The LTM4664A PSM uses only the sub-milliohm sensing to detect current levels. See page103. The
LTM4664A PSM has two ranges of current limit programming. The value of MFR_PWM_MODE[2] is reserved and
the MFR_PWM_MODE[7], and IOUT_OC_FAULT_LIMIT
are used to set the current limit level, see the section of
the PMBus commands, the device can regulate output
voltage with the peak current under the value of IOUT_OC_
FAULT_LIMIT in normal operation. In case of output current exceeding that current limit, a OC fault will be issued.
Each of the IOUT_OC_FAULT_LIMIT ranges will effects the
loop gain, and subsequently effects the loop stability, so
setting the range of current limiting is a part of loop design.
The LTpowerCAD Design Tool can be used to look at the loop
stability changes if current limit is adjusted. The LTM4664A
PSM will automatically update the current limit as the inductor temperature changes. Keep in mind this operation is on
a cycle-by-cycle basis and is only a function of the peak
inductor current. The average inductor current is monitored
by the ADC converter and can provide a warning if too much
average output current is detected. The overcurrent fault is
detected when the COMP_Cn voltage hits the maximum
value. The digital processor within the LTM4664A PSM
provides the ability to either ignore the fault, shut down
and latch off or shut down and retry indefinitely (hiccup).
Refer to the overcurrent portion of the Dual 25A/30A PSM
Operation section for more detail. The READ_POUT can be
used to readback calculated output power.
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
MINIMUM ON-TIME CONSIDERATIONS
Minimum on-time, tON(MIN), is the smallest time duration
that the LTM4664A PSM is capable of turning on the top
MOSFET. It is determined by internal timing delays and the
gate charge required to turn on the top MOSFET. Low duty
cycle applications may approach this minimum on-time
limit and care should be taken to ensure that:
tON(MIN) <
VOUTn
VINn • fOSC
If the duty cycle falls below what can be accommodated
by the minimum on-time, the controller will begin to skip
cycles. The output voltage will continue to be regulated,
but the ripple voltage and current will increase.
The minimum on-time for the LTM4664A is 60ns.
VARIABLE DELAY TIME, SOFT-START AND OUTPUT
VOLTAGE RAMPING
The LTM4664A PSM must enter its run state prior to softstart. The RUN_Cn pins are released after the part initializes, and VINS3 is greater than the VIN_ON threshold and
Stage 2 PGood pin releases the RUN_Cn pins. If multiple
LTM4664As are used in an application, they should be
configured to share the same RUN_Cn pins. They all hold
their respective RUN_Cn pins low until all devices initialize
and VINS3 exceeds the VIN_ON threshold for all devices.
The SHARE_CLK pin assures all the devices connected to
the signal use the same time base.
After the RUN_Cn pin releases, the controller waits for the
user-specified turn-on delay (TON_DELAYn) prior to initiating an output voltage ramp. Multiple LTM4664As and
other LTC parts can be configured to start with variable
delay times. To work correctly, all devices use the same
timing clock (SHARE_CLK) and all devices must share
the RUN_Cn pin.
This allows the relative delay of all parts to be synchronized. The actual variation in the delay will be dependent
on the highest clock rate of the devices connected to the
SHARE_CLK pin (all Analog Devices ICs are configured
to allow the fastest SHARE_CLK signal to control the
timing of all devices). The SHARE_CLK signal can be
66
±10% in frequency, thus the actual time delays will have
some variance.
Soft-start is performed by actively regulating the load
voltage while digitally ramping the target voltage from 0V
to the commanded voltage set point. The rise time of the
voltage ramp can be programmed using the TON_RISEn
command to minimize inrush currents associated with the
start-up voltage ramp. The soft-start feature is disabled by
setting TON_RISEn to any value less than 0.250ms. The
LTM4664A PSM performs the necessary math internally to
assure the voltage ramp is controlled to the desired slope.
However, the voltage slope can not be any faster than the
VOUTn fundamental limits of the power stage. The number
of tON(MIN) < steps in the ramp is equal to TON_RISE/0.1ms.
Therefore, the shorter the TON_RISEn time setting, the
more discrete steps in the soft-start ramp appear.
The LTM4664A PSM PWM always operates in discontinuous mode during the TON_RISEn operation. In discontinuous mode, the bottom MOSFET (MBn) is turned
off as soon as reverse current is detected in the inductor.
This allows the regulator to start up into a prebiased load.
There is no analog tracking feature in the LTM4664A PSM;
however, two outputs can be given the same TON_RISEn
and TON_DELAYn times to achieve ratiometric rail tracking. Because the RUNn pins are released at the same time
and both units use the same time base (SHARE_CLK), the
outputs track very closely. If the circuit is in a PolyPhase
configuration, all timing parameters must be the same.
DIGITAL SERVO MODE
For maximum accuracy in the regulated output voltage,
enable the digital servo loop by asserting bit 6 of the
MFR_PWM_MODE command. In digital servo mode, the
LTM4664A PSM will adjust the regulated output voltage
based on the ADC voltage reading. Every 90ms the digital servo loop will step the LSB of the DAC (nominally
1.375mV or 0.6875mV depending on the voltage range
bit) until the output is at the correct ADC reading. At power-up this mode engages after TON_MAX_FAULT_LIMIT
unless the limit is set to 0 (infinite). If the TON_MAX_
FAULT_LIMIT is set to 0 (infinite), the servo begins
after TON_RISE is complete and VOUT has exceeded the
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VOUT_UV_FAULT_LIMIT. This same point in time is
when the output changes from discontinuous to the programmed mode as indicated in MFR_PWM_MODE bit 0.
Refer to Figure 29 for details on the VOUT waveform under
time-based sequencing. If the TON_MAX_FAULT_LIMIT
is set to a value greater than 0 and the TON_MAX_FAULT_
RESPONSE is set to ignore 0x00, the servo begins:
1. After the TON_RISE sequence is complete
2. After the TON_MAX_FAULT_LIMIT time is reached;
and
3. After the VOUT_UV_FAULT_LIMIT has been exceeded
or the IOUT_OC_FAULT_LIMIT is no longer active.
If the TON_MAX_FAULT_LIMIT is set to a value greater
than 0 and the TON_MAX_FAULT_RESPONSE is not set
to ignore 0x00, the servo begins:
1. After the TON_RISE sequence is complete
2. After the TON_MAX_FAULT_LIMIT time has expired
and both VOUT_UV_FAULT and IOUT_OC_FAULT are
not present.
The maximum rise time is limited to 1.3 seconds.
In a PolyPhase configuration it is recommended only one
of the control loops have the digital servo mode enabled.
This will assure the various loops do not work against each
other due to slight differences in the reference circuits.
SOFT OFF (SEQUENCED OFF)
In addition to a controlled start-up, the LTM4664A PSM
also supports controlled turn-off. The TOFF_DELAY and
TOFF_FALL functions are shown in Figure 30. TOFF_FALL
is processed when the RUN pin goes low or if the part is
commanded off. If the part faults off or FAULT_Cn is pulled
low externally and the part is programmed to respond to
this, the output will three-state rather than exhibiting a
controlled ramp. The output will decay as a function of the
load. The output voltage will operate as shown in Figure 30
as long as the part is in forced continuous mode and the
TOFF_FALL time is sufficiently slow that the power stage
can achieve the desired slope. The TOFF_FALL time can
only be met if the power stage and controller can sink
sufficient current to assure the output is at zero volts by
the end of the fall time interval. If the TOFF_FALL time is
set shorter than the time required to discharge the load
capacitance, the output will not reach the desired zero
volt state. At the end of TOFF_FALL, the controller will
cease to sink current and VOUT will decay at the natural
rate determined by the load impedance. If the controller is
in discontinuous mode, the controller will not pull negative
current and the output will be pulled low by the load, not
the power stage. The maximum fall time is limited to 1.3
seconds. The shorter TOFF_FALL time is set, the larger
the discrete steps in the TOFF_FALL ramp will appear. The
number of steps in the ramp is equal to TOFF_FALL/0.1ms.
DIGITAL SERVO
MODE ENABLED FINAL OUTPUT
VOLTAGE REACHED
TON_MAX_FAULT_LIMIT
DAC VOLTAGE
ERROR (NOT
TO SCALE)
VOUT
TON_DELAY
TON_RISE
TIME DELAY OF
200-400ms
TIME
VOUT
TOFF_DELAY
4664A F29
Figure 29. Timing Controlled VOUT Rise
TOFF_FALL
TIME
4664A F30
Figure 30. TOFF_DELAY and TOFF_FALL
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
UNDERVOLTAGE LOCKOUT
The LTM4664A PSM is initialized by an internal threshold-based UVLO where VINS3 must be approximately 4V
and INTVCC, VDD33, and VDD25 must be within approximately 20% of their regulated values. In addition, VDD33
must be within approximately 7% of the targeted value
before the RUN_Cn pin is released. After the part has
initialized, an additional comparator monitors VINS3. The
VIN_ON threshold must be exceeded before the power
sequencing can begin. When VINS3 drops below the VIN_
OFF threshold, the SHARE_CLK pin will be pulled low and
VINS3 must increase above the VIN_ON threshold before
the controller will restart. The normal start-up sequence
will be allowed after the VIN_ON threshold is crossed. If
FAULTB is held low when VINS3 is applied, ALERT will be
asserted low even if the part is programmed to not assert
ALERT when FAULTB is held low. If I2C communication
occurs before the LTM4664A is out of reset and only a
portion of the command is seen by the part, this can be
interpreted as a CML fault. If a CML fault is detected,
ALERT is asserted low.
It is possible to program the contents of the NVM in
the application if the VDD33 supply is externally driven
directly to VDD33 or through EXTVCC. This will activate the
digital portion of the LTM4664A PSM without engaging
the high voltage sections. PMBus communications are
valid in this supply configuration. If VINS3 has not been
applied to the LTM4664A PSM, bit 3 (NVM Not Initialized)
in MFR_COMMON will be asserted low. If this condition is
detected, the part will only respond to addresses 5A and
5B. To initialize the part issue the following set of commands: global address 0x5B command 0xBD data 0x2B
followed by global address 5B command 0xBD and data
0xC4. The part will now respond to the correct address.
Configure the part as desired then issue a STORE_USER_
ALL. When VIN is applied a MFR_RESET command must
be issued to allow the PWM to be enabled and valid ADC
conversions to be read.
pins can be pulled low by external sources indicating a fault
in some other portion of the system. The fault response is
configurable and allows the following options:
Ignore
n
Shut Down Immediately—Latch Off
n
n
Shut Down Immediately—Retry Indefinitely at the Time
Interval Specified in MFR_RETRY_DELAY
Refer to the PMBus section of the data sheet and the
PMBus specification for more details.
The OV response is automatic. If an OV condition is
detected, TGn goes low and BGn is asserted.
Fault logging is available on the LTM4664A PSM. The fault
logging is configurable to automatically store data when
a fault occurs that causes the unit to fault off. The header
portion of the fault logging table contains peak values. It
is possible to read these values at any time. This data will
be useful while troubleshooting the fault.
If the LTM4664A PSM internal temperature is in excess
of 85°C, writes into the NVM (other than fault logging)
are not recommended. The data will still be held in RAM,
unless the 3.3V supply UVLO threshold is reached. If the
die temperature exceeds 130°C all NVM communication
is disabled until the die temperature drops below 120°C.
OPEN-DRAIN PINS
The LTM4664A PSM has the following open-drain pins:
3.3V Pins
1. FAULT_Cn
2. SYNC
3. SHARE_CLK
4. PGOOD_Cn
5V Pins (5V pins operate correctly when pulled to 3.3V.)
1. RUN_Cn
FAULT DETECTION AND HANDLING
2. ALERT
The LTM4664A FAULT_Cn pins are configurable to indicate
a variety of faults including OV, UV, OC, OT, timing faults,
and peak over current faults. In addition, the FAULT_Cn
3. SCL
68
4. SDA
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All the above pins have on-chip pull-down transistors that
can sink 3mA at 0.4V. The low threshold on the pins is
0.8V; thus, there is plenty of margin on the digital signals
with 3mA of current. For 3.3V pins, 3mA of current is
a 1.1k resistor. Unless there are transient speed issues
associated with the RC time constant of the resistor
pull-up and parasitic capacitance to ground, a 10k resistor or larger is generally recommended.
For high speed signals such as the SDA, SCL and SYNC,
a lower value resistor may be required. The RC time constant should be set to 1/3 to 1/5 the required rise time
to avoid timing issues. For a 100pF load and a 400kHz
PMBus communication rate, the rise time must be less
than 300ns. The resistor pull-up on the SDA and SCL pins
with the time constant set to 1/3 the rise time is:
RPULLUP =
tRISE
=1k
3 •100pF
The closest 1% resistor value is 1k. Be careful to minimize
parasitic capacitance on the SDA and SCL pins to avoid
communication problems. To estimate the loading capacitance, monitor the signal in question and measure how
long it takes for the desired signal to reach approximately
63% of the output value. This is a one time constant. The
SYNC pin has an on-chip pull-down transistor with the
output held low for nominally 500ns. If the internal oscillator is set for 500kHz and the load is 100pF and a 3x time
constant is required, the resistor calculation is as follows:
RPULLUP =
2µs – 500ns
= 5k
3 •100pF
The closest 1% resistor is 4.99k.
If timing errors are occurring or if the SYNC frequency is
not as fast as desired, monitor the waveform and determine if the RC time constant is too long for the application. If possible reduce the parasitic capacitance. If not,
reduce the pull-up resistor sufficiently to assure proper
timing. The SHARE_CLK pull-up resistor has a similar
equation with a period of 10µs and a pull-down time of
1µs. The RC time constant should be approximately 3µs
or faster.
PHASE-LOCKED LOOP AND FREQUENCY
SYNCHRONIZATION
The LTM4664A PSM has a phase-locked loop (PLL) comprised of an internal voltage-controlled oscillator (VCO)
and a phase detector. The PLL is locked to the falling edge
of the SYNC pin. The phase relationship between the PWM
controller and the falling edge of SYNC is controlled by
the lower 3 bits of the MFR_PWM_ CONFIG command.
For PolyPhase applications, it is recommended that all
the phases be spaced evenly. Thus for a 2-phase system
the signals should be 180° out of phase and a 4-phase
system should be spaced 90°.
The phase detector is an edge-sensitive digital type that
provides a known phase shift between the external and
internal oscillators. This type of phase detector does not
exhibit false lock to harmonics of the external clock.
The output of the phase detector is a pair of complementary current sources that charge or discharge the internal
filter network. The PLL lock range is guaranteed between
200kHz and 1MHz. Nominal parts will have a range beyond
this; however, operation to a wider frequency range is not
guaranteed.
The PLL has a lock detection circuit. If the PLL should
lose lock during operation, bit 4 of the STATUS_MFR_
SPECIFIC command is asserted and the ALERT pin is
pulled low. The fault can be cleared by writing a 1 to the
bit. If the user does not wish to see the ALERT pin assert
if a PLL_FAULT occurs, the SMBALERT_MASK command
can be used to prevent the alert.
If the SYNC signal is not clocking in the application, the
nominal programmed frequency will control the PWM
circuitry. However, if multiple parts share the SYNC pins
and the signal is not clocking, the parts will not be synchronized and excess voltage ripple on the output may be
present. Bit 10 of MFR_PADS will be asserted low if this
condition exists.
If the PWM signal appears to be running at too high a
frequency, monitor the SYNC pin. Extra transitions on
the falling edge will result in the PLL trying to lock on to
noise versus the intended signal. Review routing of digital
control signals and minimize crosstalk to the SYNC signal
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
to avoid this problem. Multiple LTM4664As PSM sections
are required to share one SYNC pin in PolyPhase configurations. For other configurations, connecting the SYNC
pins to form a single SYNC signal is optional. If the SYNC
pin is shared between LTM4664As PSM sections, only
one LTM4664A section can be programmed with a frequency output. All the other LTM4664As sections should
be programmed to disable the SYNC output. However
their frequency should be programmed to the nominal
desired value. See application schematic in Figure 51.
PROGRAMMABLE LOOP COMPENSATION
INPUT CURRENT SENSE AMPLIFIER
By adjusting the gm and RCOMP only, the LTM4664A PSM
can provide a flexible Type II compensation network to
optimize the loop over a wide range of output capacitors.
Adjusting the gm will change the gain of the compensation
over the whole frequency range without moving the pole
and zero location, as shown in Figure 32.
Ω
There is an IR voltage drop from the supply to the VINS3
controller pin due to the current flowing into the VINS3 controller pin. To compensate for this voltage drop, the MFR_
RVIN will be automatically set to the 1Ω internal sense
resistor in the Figure 2 Block Diagram. The LTM4664A
PSM will multiply the MFR_READ_ICHIP measurement
value by this 1Ω resistor and add this voltage to the
measured voltage at the VINS3 controller pin. Therefore,
READ_VIN = VIN_CNTLPIN + (MFR_READ_ICHIP • 1Ω)
The MFR_READ_ICHIP command is used to measure the
internal controller current. Using the READ_PIN command allows for reading calculated input power.
Ω
The LTM4664A input current sense amplifier can sense
the supply current into the VINS3_Cn power stages pins
using an external sense resistor as shown in the Figure 2
Block Diagram. The RSENSE value can be programmed
using the MFR_IIN_CAL_GAIN command. Kelvin sensing
is recommended across the RSENSE resistor to eliminate
errors. The MFR_PWM_CONFIG [6:5] sets the input current sense amplifier gain. See the MFR_PWM_CONFIG
section. The IIN_OC_WARN_LIMIT command sets the
value of the input current measured by the ADC, in
amperes, that causes a warning indicating the input current is high. The READ_IIN value will be used to determine
if this limit has been exceeded. The READ_IIN command
returns the input current, in Amperes, as measured across
the input current sense resistor.
The LTM4664A offers programmable loop compensation
to optimize the transient response without any hardware
change. The error amplifier gain gm varies from 1.0m
to 5.73m , and the compensation resistor RCOMP varies
from 0kΩ to 62kΩ inside the controller. Two compensation capacitors, COMP_na and COMP_nb, are required in
the design and the typical ratio between COMP_na and
COMP_nb is 10. Also see Figure 2 Block Diagram, and
Figure 31.
Adjusting the RCOMP will change the pole and zero location, as shown in Figure 33. It is recommended that the
user determines the appropriate value for the gm and
RCOMP using the LTpowerCAD tool.
gm
RCOMP
+
VREF
–
FB
4664A F31
COMP_na
COMP_nb
Figure 31. Programmable Loop Compensation
TYPE II COMPENSATION
GAIN
INCREASE gm
FREQUENCY
4664A F32
Figure 32. Error Amp gm Adjust
70
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
TYPE II COMPENSATION
GAIN
INCREASE RCOMP
FREQUENCY
4664A F33
Figure 33. RCOMP Adjust
CHECKING TRANSIENT RESPONSE
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC (resistive)
load current. When a load step occurs, VOUT shifts by an
amount equal to ∆ILOAD(ESR), where ESR is the effective
series resistance of COUT. ∆ILOAD also begins to charge or
discharge COUT generating the feedback error signal that
forces the regulator to adapt to the current change and
return VOUT to its steady-state value. During this recovery time VOUT can be monitored for excessive overshoot
or ringing, which would indicate a stability problem. The
availability of the COMP pin not only allows optimization
of control loop behavior but also provides a DC-coupled
and AC-filtered closed-loop response test point. The DC
step, rise time and settling at this test point truly reflects
the closed-loop response. Assuming a predominantly
second order system, phase margin and/or damping factor can be estimated using the percentage of overshoot
seen at this pin. The bandwidth can also be estimated by
examining the rise time at the pin. The COMP_Cna external capacitor shown in the Typical Application circuit will
provide an adequate starting point for most applications.
The programmable parameters that affect loop gain are
the voltage range, bit[1] of the MFR_PWM_CONFIG command, the current range bit[7] of the MFR_PWM_MODE
command, the gm of the PWM channel amplifier bits [7:5]
of MFR_PWM_COMP, and the internal RCOMP compensation resistor, bits[4:0] of MFR_PWM_COMP. Be sure to
establish these settings prior to compensation calculation.
The COMP_Cna series internal RCOMP and external CCOMP_Cna
filter sets the dominant pole-zero loop compensation. The
internal RCOMP value can be modified (from 0Ω to 62kΩ)
using bits[4:0] of the MFR_PWM_ COMP command.
Adjust the value of RCOMP to optimize transient response once
the final PCB layout is done and the particular CCOMP_bn filter
capacitor and output capacitor type and value have been
determined. The output capacitors need to be selected
because the various types and values determine the loop
gain and phase. An output current pulse of 20% to 80%
of full-load current having a rise time of 1µs to 10µs will
produce output voltage and COMP pin waveforms that will
give a sense of the overall loop stability without breaking the feedback loop. Placing a power MOSFET with a
resistor to ground directly across the output capacitor and
driving the gate with an appropriate signal generator is
a practical way to produce to a load step. The MOSFET
+ RSERIES will produce output currents approximately
equal to VOUT/RSERIES. RSERIES values from 0.1Ω to 2Ω
are valid depending on the current limit settings and the
programmed output voltage. The initial output voltage step
resulting from the step change in output current may not
be within the bandwidth of the feedback loop, so this signal
cannot be used to determine phase margin. This is why
it is better to look at the COMP pin signal which is in the
feedback loop and is the filtered and compensated control
loop response. The gain of the loop will be increased by
increasing RCOMP and the bandwidth of the loop will be
increased by decreasing CCOMP_Cna. If RCOMP is increased
by the same factor that CCOMP is decreased, the zero frequency will be kept the same, thereby keeping the phase
shift the same in the most critical frequency range of the
feedback loop. The gain of the loop will be proportional to
the transconductance of the error amplifier which is set
using bits[7:5] of the MFR_PWM_COMP command. The
output voltage settling behavior is related to the stability
of the closed-loop system and will demonstrate the actual
overall supply performance. A second, more severe transient is caused by switching in loads with large (>1µF)
supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with COUT, causing a
rapid drop in VOUT. No regulator can alter its delivery of
current quickly enough to prevent this sudden step change
in output voltage if the load switch resistance is low and
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71
LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
it is driven quickly. If the ratio of CLOAD to COUT is greater
than 1:50, the switch rise time should be controlled so that
the load rise time is limited to approximately 25 • CLOAD.
Thus a 10µF capacitor would require a 250µs rise time,
limiting the charging current to about 200mA.
PolyPhase® Configuration
When configuring a PolyPhase rail with multiple
LTM4664As, the user must share the SYNC, COMP_na,
COMP_nb SHARE_CLK, FAULT_Cn, and ALERT pins of
these parts. Be sure to use pull-up resistors on FAULT_
Cn, SHARE_CLK and ALERT. One of the part’s SYNC pins
must be set to the desired switching frequency, and all
other FREQUENCY_SWITCH commands must be set to
External Clock. If an external oscillator is provided, set
the FREQUENCY_SWITCH command to External Clock for
all parts. The relative phasing of all the channels should
be spaced equally. The MFR_RAIL_ ADDRESS of all the
devices should be set to the same value.
Multiple channels need to tie all the VOSNS+ pins together,
and all the VOSNS– pins together COMP_na and COMP_
nb pins together as well. Do not assert bit[4] of MFR_
CONFIG_ALL except in a PolyPhase application. See
application example Figure 50.
CONNECTING THE USB TO I2C/SMBUS/PMBUS
CONTROLLER TO THE LTM4664A IN-SYSTEM
The LTC USB-to-I2C/SMBus/PMBus adapter (DC1613A
or equivalent) can be interfaced to the LTM4664A PSM
on the user’s board for programming, telemetry and system debug. The adapter, when used in conjunction with
LTpowerPlay, provides a powerful way to debug an entire
power system. Faults are quickly diagnosed using telemetry, fault status commands and the fault log. The final
configuration can be quickly developed and stored to the
LTM4664A PSM EEPROM. Figure 34 illustrates the application schematic for powering, programming and communication with one or more LTM4664As PSM via the
LTC I2C/SMBus/PMBus adapter regardless of whether or
not system power is present. If system power is not present, the dongle will power the LTM4664A PSM through
the VDD33 supply pin. To initialize the part when VIN is not
applied and the VDD33 pin is powered, use global address
0x5B command 0xBD data 0x2B followed by address 0x5B
command 0xBD data 0xC4.The LTM4664A PSM can now
communicate with, and the project file Figure 34. Controller
Connection can be updated. To write the updated project file
to the NVM issue a STORE_USER _ALL command. When
VIN is applied, a MFR_RESET must be issued to allow the
PWM POWER to be enabled and valid ADCs to be read.
VIN
LTC
CONTROLLER
HEADER
ISOLATED
3.3V
SDA
100k
100k
VIN
VDD33
TP0101K
SCL
1µF
10k
VDD25
1µF
LTM4664A PSM
SDA
10k
SCL
WP
PGND/SGND
TO LTC DC1613
USB TO I2C/SMBus/PMBus
CONTROLLER
VIN
TP0101K
VDD33
1µF
VDD25
1µF
LTM4664A PSM
SDA
VGS MAX ON THE TP0101K IS 8V IF VIN > 16V
CHANGE THE RESISTOR DIVIDER ON THE PFET GATE
SCL
WP
PGND/SGND
4664A F34
Figure 34. Controller Connection
72
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
Because of the adapter’s limited current sourcing capability, only the LTM4664As, PSM their associated pull-up
resistors and the I2C pull-up resistors should be powered
from the ORed 3.3V supply. In addition any device sharing
the I2C bus connections with the LTM4664A PSM should
not have body diodes between the SDA/SCL pins and their
respective VDD node because this will interfere with bus
communication in the absence of system power. If VINS3
is applied, the DC1613A will not supply the power to the
LTM4664As PSM on the board. It is recommended the
RUN_Cn pins be held low or no voltage configuration
resistors inserted to avoid providing power to the load
until the part is fully configured.
The LTM4664A PSM is fully isolated from the host PC’s
ground by the DC1613A.The 3.3V from the adapter
and the LTM4664A VDD33 pin must be driven to each
LTM4664A with a separate PFET. If both VINS3 and EXTVCC
are not applied, the VDD33 pins can be in parallel because
the on-chip LDO is off. The controller 3.3V current limit
is 100mA but typical VDD33 currents are under 15mA. The
VDD33 does back drive the INTVCC/EXTVCC pin. Normally
this is not an issue if VIN is open.
LTpowerPlay: AN INTERACTIVE GUI FOR DIGITAL
POWER
LTpowerPlay (Figure 35) is a powerful Windows-based
development environment that supports Analog Devices
digital power system management ICs including the
LTM4664A PSM section. The software supports a variety
of different tasks. LTpowerPlay can be used to evaluate
Analog Devices ICs by connecting to a demo board or
the user application. LTpowerPlay can also be used in
an off-line mode (with no hardware present) in order to
build multiple IC configuration files that can be saved and
reloaded at a later time. LTpowerPlay provides unprecedented diagnostic and debug features. It becomes a
valuable diagnostic tool during board bring-up to program or tweak the power system or to diagnose power
issues when bring up rails. LTpowerPlay utilizes Analog
Devices’ USB-to-I2C/SMBus/PMBus adapter to communication with one of the many potential targets including the DC2165A demo board, the DC2298A socketed
programming board, or a customer target system. The
software also provides an automatic update feature to
keep the revisions current with the latest set of device
drivers and documentation.
A great deal of context sensitive help is available with
LTpowerPlay along with several tutorial demos. Complete
information is available at:
LTpowerPlay
PMBus COMMUNICATION AND COMMAND
PROCESSING
The LTM4664A PSM has a one deep buffer to hold the
last data written for each supported command prior to
processing as shown in Figure 36, Write Command Data
Processing. When the part receives a new command from
the bus, it copies the data into the Write Command Data
Buffer, indicates to the internal processor that this command data needs to be fetched, and converts the command to its internal format so that it can be executed.
Two distinct parallel blocks manage command buffering
and command processing (fetch, convert, and execute) to
ensure the last data written to any command is never lost.
Command data buffering handles incoming PMBus writes
by storing the command data to the Write Command Data
Buffer and marking these commands for future processing. The internal processor runs in parallel and handles
the sometimes slower task of fetching, converting and
executing commands marked for processing. Some computationally intensive commands (e.g., timing parameters, temperatures, voltages and currents) have internal
processor execution times that may be long relative to
PMBus timing. If the part is busy processing a command,
and new command(s) arrive, execution may be delayed or
processed in a different order than received. The part indicates when internal calculations are in process via bit 5 of
MFR_COMMON (“calculations not pending”). When the
part is busy calculating, bit 5 is cleared. When this bit is
set, the part is ready for another command. An example
polling loop is provided in Figure 37 which ensures that
commands are processed in order while simplifying error
handling routines.
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
Figure 35. LTpowerPlay Screen Shot
CMD
PMBus
WRITE
WRITE COMMAND
DATA BUFFER
DECODER
CMDS
DATA
MUX
CALCULATIONS
PENDING
S
R
PAGE
•
•
•
VOUT_COMMAND
0x00
0x21
•
•
•
MFR_RESET
INTERNAL
PROCESSOR
FETCH,
CONVERT
DATA
AND
EXECUTE
0xFD
x1
4664A F36
Figure 36. Write Command Data Processing
74
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
When the part receives a new command while it is busy,
it will communicate this condition using standard PMBus
protocol. Depending on part configuration it may either
NACK the command or return all ones (0xFF) for reads.
It may also generate a BUSY fault and ALERT notification, or stretch the SCL clock low. For more information
refer to PMBus Specification v1.1, Part II, Section 10.8.7
and SMBus v2.0 section 4.3.3. Clock stretching can be
enabled by asserting bit 1 of MFR_CONFIG_ ALL. Clock
stretching will only occur if enabled and the bus communication speed exceeds 100kHz.
// wait until chip is not busy
do
{
mfrCommonValue = PMBUS_READ_BYTE(0xEF);
partReady = (mfrCommonValue & 0x68) == 0x68;
}while(!partReady)
// now the part is ready to receive the next
command
PMBUS_WRITE_WORD(0x21, 0x2000); //write VOUT_
COMMAND to 2V
Figure 37. Example of a Command Write of VOUT_COMMAND
PMBus busy protocols are well accepted standards, but
can make writing system level software somewhat complex. The part provides three ‘hand shaking’ status bits
which reduce complexity while enabling robust system
level communication.
The three hand shaking status bits are in the MFR_
COMMON register. When the part is busy executing an
internal operation, it will clear bit 6 of MFR_COMMON
(‘chip not busy’). When the part is busy specifically
because it is in a transitional VOUT state (margining hi/lo,
power off/on, moving to a new output voltage set point,
etc.) it will clear bit 4 of MFR_COMMON (‘output not in
transition’). When internal calculations are in process, the
part will clear bit 5 of MFR_COMMON (‘calculations not
pending’). These three status bits can be polled with a
PMBus read byte of the MFR_COMMON register until all
three bits are set. A command immediately following the
status bits being set will be accepted without NACKing or
generating a BUSY fault/ALERT notification. The part can
NACK commands for other reasons, however, as required
by the PMBus spec (for instance, an invalid command or
data). An example of a robust command write algorithm
for the VOUT_COMMAND register is provided in Figure 33.
It is recommended that all command writes (write byte,
write word, etc.) be preceded with a polling loop to avoid
the extra complexity of dealing with busy behavior and
unwanted ALERT notification. A simple way to achieve this
is to create a SAFE_WRITE_BYTE() and SAFE_WRITE_
WORD() subroutine. The above polling mechanism allows
your software to remain clean and simple while robustly
communicating with the part. For a detailed discussion
of these topics and other special cases please refer to the
Analog Devices Application Notes.
When communicating using bus speeds at or below
100kHz, the polling mechanism shown here provides a
simple solution that ensures robust communication without clock stretching. At bus speeds in excess of 100kHz,
it is strongly recommended that the part be configured to
enable clock stretching. This requires a PMBus master that
supports clock stretching. System software that detects
and properly recovers from the standard PMBus NACK/
BUSY faults as described in the PMBus Specification v1.1,
Par II, Section 10.8.7 is required to communicate The
LTM4664A PSM is not recommended in applications with
bus speeds in excess of 400kHz.
THERMAL CONSIDERATIONS AND
OUTPUT CURRENT DERATING
The thermal resistances reported in the Pin Configuration
section of this data sheet are consistent with those
parameters defined by JESD51-12 and are intended for
use with finite element analysis (FEA) software modeling tools that leverage the outcome of thermal modeling,
simulation, and correlation to hardware evaluation performed on a µModule package mounted to a hardware
test board defined by JESD51-9 (“Test Boards for Area
Array Surface Mount Package Thermal Measurements”).
The motivation for providing these thermal coefficients is
found in JESD51-12 (“Guidelines for Reporting and Using
Electronic Package Thermal Information”).
Many designers may opt to use laboratory equipment
and a test vehicle such as the demo board to predict the
µModule regulator’s thermal performance in their application at various electrical and environmental operating
conditions to compliment any FEA activities. Without
FEA software, the thermal resistances reported in the
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
Pin Configuration section are in-and-of themselves not
relevant to providing guidance of thermal performance;
instead, the derating curves provided later in this data
sheet can be used in a manner that yields insight and
guidance pertaining to one’s application-usage, and can
be adapted to correlate thermal performance to one’s own
application.
The Pin Configuration section gives four thermal coefficients explicitly defined in JESD51-12; these coefficients
are quoted or paraphrased below:
1. θJA, the thermal resistance from junction to ambient,
is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to
as “still air” although natural convection causes the
air to move. This value is determined with the part
mounted to a JESD51-9 defined test board, which does
not reflect an actual application or viable operating
condition.
2. θJCbottom, the thermal resistance from junction to the
bottom of the product case, is determined with all of
the component power dissipation flowing through the
bottom of the package. In the typical µModule regulator,
the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient
environment. As a result, this thermal resistance value
may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
3. θJCtop, the thermal resistance from junction to top of
the product case, is determined with nearly all of the
component power dissipation flowing through the top
of the package. As the electrical connections of the typical µModule regulator are on the bottom of the package, it is rare for an application to operate such that
most of the heat flows from the junction to the top of
the part. As in the case of θJCbottom, this value may be
useful for comparing packages but the test conditions
don’t generally match the user’s application.
4. θJB, the thermal resistance from junction to the printed
circuit board, is the junction-to-board thermal resistance where almost all of the heat flows through the
bottom of the µModule regulator and into the board,
and is really the sum of the θJCbottom and the thermal
resistance of the bottom of the part through the solder
joints and through a portion of the board. The board
temperature is measured a specified distance from the
package, using a two sided, two layer board. This board
is described in JESD51-9.
A graphical representation of the aforementioned thermal
resistances is given in Figure 38; blue resistances are
contained within the µModule regulator, whereas green
resistances are external to the µModule package.
As a practical matter, it should be clear to the reader that
no individual or sub-group of the four thermal resistance
parameters defined by JESD51-12 or provided in the Pin
µModule DEVICE
θJA JUNCTION-TO-AMBIENT RESISTANCE
θJCTOP JUNCTION-TO-CASE
(TOP) RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
θJB JUNCTION-TO-BOARD RESISTANCE
JUNCTION
θJCBOTTOM JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
AMBIENT
BOARD-TO-AMBIENT
RESISTANCE
4664A F38
Figure 38. Graphical Representation of JESD51-12 Thermal Coefficients
76
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
Configuration section replicates or conveys normal operating conditions of a µModule regulator. For example, in
normal board-mounted applications, never does 100%
of the device’s total power loss (heat) thermally conduct
exclusively through the top or exclusively through the
bottom of the µModule package—as the standard defines
for θJCtop and θJCbottom, respectively. In practice, power
loss is thermally dissipated in both directions away from
the package—granted, in the absence of a heat sink and
airflow, a majority of the heat flow is into the board.
Within the LTM4664A, be aware there are multiple
power devices and components dissipating power, with
a consequence that the thermal resistances relative to
different junctions of components or die are not exactly
linear with respect to total package power loss. To reconcile this complication without sacrificing modeling
simplicity—but also, not ignoring practical realities—an
approach has been taken using FEA software modeling
along with laboratory testing in a controlled-environment
chamber to reasonably define and correlate the thermal
resistance values supplied in this data sheet: (1) Initially,
FEA software is used to accurately build the mechanical
geometry of the LTM4664A and the specified PCB with
all of the correct material coefficients along with accurate
power loss source definitions; (2) this model simulates
a software-defined JEDEC environment consistent with
JESD51-9 and JESD51-12 to predict power loss heat
flow and temperature readings at different interfaces
that enable the calculation of the JEDEC-defined thermal
resistance values; (3) the model and FEA software is used
to evaluate the LTM4664A with heat sink and airflow; (4)
having solved for and analyzed these thermal resistance
values and simulated various operating conditions in the
software model, a thorough laboratory evaluation replicates the simulated conditions with thermocouples within
a controlled environment chamber while operating the
device at the same power loss as that which was simulated. The outcome of this process and due diligence
yields the set of derating curves provided in later sections
of this data sheet, along with well-correlated JESD51-12defined θ values provided in the Pin Configuration section
of this data sheet.
The 1.0V and 1.5V power loss curves in Figure 39 and
40 respectively can be used in coordination with the load
current derating curves in Figure 41 to 44 for calculating
an approximate θJA thermal resistance for the LTM4664A
with various heat sinking and airflow conditions. These
thermal resistances represent demonstrated performance
of the LTM4664A on hardware; a 8-layer FR4 PCB measuring 99mm × 145mm × 1.6mm using 2oz copper on
all layers. The power loss curves are taken at room temperature, and are increased with multiplicative factors of
1.35 when the junction temperature reaches 125°C. The
derating curves are plotted with the LTM4664A’s paralleled outputs initially sourcing up to 50A and the ambient
temperature at 50°C. The output voltages are 1.0V and
1.5V. These are chosen to include the lower and higher
output voltage ranges for correlating the thermal resistance. Thermal models are derived from several temperature measurements in a controlled temperature chamber
along with thermal modeling analysis. The junction temperatures are monitored while ambient temperature is
increased with and without airflow.
The power loss increase with ambient temperature change
is factored into the derating curves. The junctions are
maintained at 125°C maximum while lowering output current or power while increasing ambient temperature. The
decreased output current decreases the internal module
loss as ambient temperature is increased. The monitored
junction temperature of 120°C minus the ambient operating temperature specifies how much module temperature
rise can be allowed. As an example in Figure 41, the load
current is derated to ~30A at ~97°C ambient with no air
or heat sink and the room temperature (25°C) power loss
for this 48VIN to 1.0VOUT at 30AOUT condition is ~3.2W. A
4.32W loss is calculated by multiplying the ~3.2W room
temperature loss from the 48VIN to 1.0VOUT power loss
curve at 30A (Figure 41), with the 1.35 multiplying factor. If the 97°C ambient temperature is subtracted from
the 120°C junction temperature, then the difference of
23°C divided by 4.32W yields a thermal resistance, θJA,
of 5.3°C/W—in good agreement with Table 11. Table 10
and 11 provide equivalent thermal resistances for 1.0V
and 1.5V outputs with and without airflow. The derived
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
thermal resistances in Table 10 and Table 11 are for the
various conditions can be multiplied by the calculated
power loss as a function of ambient temperature to
derive temperature rise above ambient, thus maximum
junction temperature. Room temperature power loss
can be derived from the efficiency curves in the Typical
Performance Characteristics section and adjusted with the
above ambient temperature multiplicative factors.
Thermal performance expectations at up to 60A output (at
up to 1.2VOUT) can be suitably approximated by studying
this section's figures at analogous nearby output power
conditions. For example: 1.2VOUT at 60A is 72W output.
For thermal purposes, this operating point can be approximated by 1.5VOUT at 48A output (observe: also 72W output). The 1.5VOUT curves shown in this section can thus
be utilized to infer thermal performance at currents higher
than 25A, per channel (for output voltages up to 1.2VOUT).
TABLE 10 AND TABLE 11: OUTPUT CURRENT DERATING (BASED ON DEMO BOARD)
Table 10. 1.0V Output
DERATING CURVE
Figure 41, 42
Figure 41, 42
Figure 41, 42
VIN (V)
48, 54
48, 54
48, 54
POWER LOSS CURVE
Figure 39, 40
Figure 39, 40
Figure 39, 40
AIRFLOW (LFM)
0
200
400
HEAT SINK
None
None
None
θJA (°C/W)
5.3
4.5
4.0
VIN (V)
48, 54
48, 54
48, 54
POWER LOSS CURVE
Figure 39, 40
Figure 39, 40
Figure 39, 40
AIRFLOW (LFM)
0
200
400
HEAT SINK
None
None
None
θJA (°C/W)
5.3
4.5
4.0
Table 11. 1.5V Output
DERATING CURVE
Figure 43, 44
Figure 43, 44
Figure 43, 44
78
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
Table 12. LTM4664A Dual 25A/30A PSM Output Capacitor Matrix
All Below Parameters are Typical and Are Dependent on Board Layout
Murata
220μF 6.3V
GRM32ER60J227ME05
PANASONIC SP-CAP
470μF 2.5V
EEFSX0E471E4
Taiyo Yuden
220μf 4V
AMK325ABJ227MMHT
PANASONIC POSCAP
470μF 2.5V
ETPF470M5H
Murata
100μF 6.3V
GRM32ER60J107M
PANASONIC POSCAP
1000μF 2.5V
Murata
100μF 4V
GRM21BR60G107ME15
PANASONIC POSCAP
1000μF 2.5V
Taiyo Yuden
100μF 4V
AMK325AD7MMHP
Single 25A/30A Output
ETCF1000M5H
Programmed Values
COUT2
VOUT
(BULK) COMPna COMPnb EA-GM RCOMP
LOW- VINS1
ILIM
(μF)
(kΩ) HI-RANGE RANGE (V)
(pF)
(pF)
(ms)
RECOVERY
PEAKLOAD
TIME(µs)
TO-PEAK
DROOP DEVIATION LTpowerCAD/ STEP FREQ.
MEASURE (A/µs) (kHz)
(mV)
(mV)
VOUT
(V)
COUT1
(CERAMIC)
(μF)
0.9
5 × 100
2 × 470
2200
100
3.69
5
Yes
Yes
48
(VINS1/4) or 12V
42.5
0.9
5 × 100
1 × 1000
3300
220
3.02
5
Yes
Yes
48
(VINS1/4) or 12V
55.5
0.9
6 × 220
None
4700
100
3.69
4
Yes
Yes
48
(VINS1/4) or 12V
75
1
5 × 100
2 × 470
2200
100
3.69
5
Yes
Yes
48
(VINS1/4) or 12V
42.5
1
5 × 100
1 × 1000
3300
220
3.02
5
Yes
Yes
48
(VINS1/4) or 12V
56
VINS3
C1, C2
85
36
12.5
250
111
40
12.5
250
150
50
12.5
250
85
36
12.5
250
112
40
12.5
250
1
6 × 220
None
4700
100
3.69
4
Yes
Yes
48
(VINS1/4) or 12V
75
150
50
12.5
250
1.2
3 × 100
1 × 470
2200
220
3.69
3
Yes
Yes
48
(VINS1/4) or 12V
67.5
135
27
12.5
350
1.2
3 × 100
1 × 470
2200
220
3.69
4
Yes
Yes
48
(VINS1/4) or 12V
60
120
27
12.5
350
1.2
3 × 220
None
2200
220
1.68
5
Yes
Yes
48
(VINS1/4) or 12V
85
170
20
12.5
350
1.2
1 × 100
1 × 470
2200
220
3.02
6
Yes
Yes
48
(VINS1/4) or 12V
68
136
33
12.5
350
1.5
3 × 220
None
2200
220
1.68
5
Yes
Yes
48
(VINS1/4) or 12V
115
230
30
12.5
350
1.5
1 × 100
1 × 470
2200
220
3.02
6
Yes
Yes
48
(VINS1/4) or 12V
70
140
27
12.5
350
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LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
Table 13. LTM4664A Dual 25A/30A PSM Output Capacitor Matrix. All Below Parameters Are Typical and Are Dependent on Board Layout
Murata
220µF 6.3V
GRM32ER60J227ME05
PANASONIC SP-CAP
470µF 2.5V EEFSX0E471E4
Taiyo Yuden
220µF 4V
AMK325ABJ227MMHT
PANASONIC POSCAP
470µF 2.5V ETPF470M5H
Murata
100µF 6.3V
GRM32ER60J107M
PANASONIC POSCAP
1000µF 2.5V ETPF1000M5H
Murata
100µF 4V
GRM21BR60G107ME15
PANASONIC POSCAP
1000µF 2.5V ETCF1000M5H
Taiyo Yuden
100µF 4V
AMK325AD7MMHP
Dual Phase Single 50A/60A Output
RECOVERY
PEAKLOAD
TIME(µs)
TO-PEAK
DROOP DEVIATION LTpowerCAD/ STEP FREQ.
MEASURE (A/µs) (kHz)
(mV)
(mV)
COUT1
VOUT (CERAMIC)
(μF)
(V)
COUT2
(BULK)
(μF)
0.9
8 × 100
4 × 470
3300
220
3.69
8
No
Yes
48
(VINS1/4) or 12V
47.5
62/95
30
25
250
1
8 × 100
4 × 470
3300
220
3.69
8
No
Yes
48
(VINS1/4) or 12V
47.5
62/95
30
25
250
35
64
35
25
250
70
100/140
35
25
350
VOUT
LOW- VINS1
COMPna COMPnb EA-GM RCOMP
ILIM
(pF)
(ms)
(kΩ) HI-RANGE RANGE (V)
(pF)
VINS3
C1, C2
1.2
8 × 330
None
5600
100
3.02
5
No
Yes
48
(VINS1/4) or 12V
1.2
4 × 100
2 × 470
3300
220
3.02
6
No
Yes
48
(VINS1/4) or 12V
1.2
4 × 220
None
7500
220
3.02
5
No
Yes
48
(VINS1/4) or 12V
63
126/-
25
25
350
1.5
4 × 220
None
7500
220
3.02
2.5
No
Yes
48
(VINS1/4) or 12V
130
260
30
25
350
1.5
6 × 220
None
7500
220
3.69
3
No
Yes
48
(VINS1/4) or 12V
100
200
30
25
350
1.5
4 × 100
2 × 470
3300
220
3.02
6
No
Yes
48
(VINS1/4) or 12V
70
140
30
25
350
1.5
4 × 220
None
7500
220
3.02
5
No
Yes
48
(VINS1/4) or 12V
63
126
25
25
350
80
Rev. 0
For more information www.analog.com
LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION–DERATING CURVES
9
8
9
7
6
5
4
3
6
5
2
10
20
30
40
OUTPUT CURRENT (A)
1
50
10
0
10
20
30
40
OUTPUT CURRENT (A)
60
OLFM
200LFM
400LFM
30
20
10
10
10
60
TA (°C)
80
100
120
4664A F42
Figure 42. LTM4664A 54VIN 1VOUT
Derating Curve
No Heat Sink
0
100
120
30
20
40
80
40
20
20
60
TA (°C)
OLFM
200LFM
400LFM
50
IOUT (A)
IOUT (A)
IOUT (A)
60
40
0
40
Figure 41. LTM4664A 48VIN 1VOUT
Derating Curve
No Heat Sink
OLFM
200LFM
400LFM
50
40
0
20
4664A F41
Figure 40. 54V Input Power Loss
2-Phase 50A Output
30
0
4664A F40
Figure 39. 48V Input Power Loss
2-Phase 50A Output
50
0
50
4664A F39
60
30
20
4
1
0
40
7
3
OLFM
200LFM
400LFM
50
8
2
0
60
0.9V OUTPUT
1V OUTPUT
1.5V OUTPUT
1.2V OUTPUT
10
POWER LOSS (W)
POWER LOSS (W)
11
0.9V OUTPUT
1V OUTPUT
1.5V OUTPUT
1.2V OUTPUT
10
IOUT (A)
11
0
20
40
60
TA (°C)
80
100
120
4664A F43
Figure 43. LTM4664A 48VIN 1.5VOUT
350kHz Derating Curve
No Heat Sink
0
0
20
40
60
TA (°C)
80
100
120
4664A F44
Figure 44. LTM4664A 54VIN
1.5VOUT 350kHz Derating Curve
No Heat Sink
Rev. 0
For more information www.analog.com
81
LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
EMI PERFORMANCE
The SW_Cn pin provides access to the midpoint of the
power MOSFETs in LTM4664A’s power stages.
Connecting an optional series RC network from SW_Cn to
GND can dampen high frequency (~30MHz+) switch node
ringing caused by parasitic inductances and capacitances
in the switched-current paths. The RC network is called a
snubber circuit because it dampens (or “snubs”) the resonance of the parasitics, at the expense of higher power
loss. To use a snubber, choose first how much power to
allocate to the task and how much PCB real estate is available to implement the snubber. For example, if PCB space
allows a low inductance 0.5W resistor to be used then the
capacitor in the snubber network (CSW) is computed by:
CSW =
PSNUB
VINS3n (MAX) 2 • fSW
where VIN3n(MAX) is the maximum input voltage that the
input to the power stage (VINn) will see in the application,
and fSW is the DC/DC converter’s switching frequency
of operation. CSW should be NPO, C0G or X7R-type (or
better) material.
The snubber resistor (RSW) value is then given by:
RSW =
5nH
CSW
A 2.2nF snubber capacitor is a good value to start with in
series with the snubber resistor to ground. The no load
input quiescent current can be monitored while selecting
different RC series snubber components to get a increased
power loss versus switch node ringing attenuation.
SAFETY CONSIDERATIONS
The LTM4664A modules do not provide galvanic isolation
from VIN to VOUT. There is no internal fuse. If required,
a slow blow fuse with a rating twice the maximum input
current needs to be provided to protect each unit from
catastrophic failure.
The fuse or circuit breaker should be selected to limit the
current to the regulator during overvoltage in case of an
internal top MOSFET fault. If the internal top MOSFET
fails, then turning it off will not resolve the overvoltage,
thus the internal bottom MOSFET will turn on indefinitely
trying to protect the load. Under this fault condition, the
input voltage will source very large currents to ground
through the failed internal top MOSFET and enabled
internal bottom MOSFET. This can cause excessive heat
and board damage depending on how much power the
input voltage can deliver to this system. A fuse or circuit
breaker can be used as a secondary fault protector in
this situation. The device does support over current and
overtemperature protection.
The snubber resistor should be low ESL and capable of
withstanding the pulsed currents present in snubber circuits. A value between 0.7Ω and 4.2Ω is normal.
82
Rev. 0
For more information www.analog.com
LTM4664A
DUAL 25A/30A PSM APPLICATIONS INFORMATION
LAYOUT CHECKLIST/EXAMPLE
n
The high integration of LTM4664A makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout considerations are still necessary.
Use large PCB copper areas for high current paths,
including VINn, GND and VOUTSn. It helps to minimize
the PCB conduction loss and thermal stress.
n
n
Place high frequency ceramic input and output capacitors next to the VINSn, GND and VOUTn pins to minimize
high frequency noise.
Place a dedicated power ground layer underneath the
module.
n
n
To minimize the via conduction loss and reduce module
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
Do not put vias directly on pads, unless they are capped
or plated over.
Use a separate SGND copper plane for components
connected to signal pins. Connect SGND to GND local
to the LTM4664A.
n
Use Kelvin sense connections across the input RSENSE
resistor if input current monitoring is used.
n
For parallel modules, tie the VOUTCn, ,VOSNS+_Cn/
VOSNS–_Cn voltage-sense differential pair lines, RUN_n,
COMP_Cna, COMP_nb pin together. The user must
share the SYNC, SHARE_CLK, FAULT, and ALERT pins
of these parts. Be sure to use pull-up resistors on
FAULT, SHARE_CLK and ALERT.
n
Bring out test points on the signal pins for monitoring.
n
Figure 45 gives a good example of the recommended layout. Reference DC2672A demo manual.
TOP 3 (1210) FLYING CAPS 1ST STAGE
BOTTOM 4 (1210) FLYING CAPS
1ST STAGE
TOP LAYER
LTM4664A 16 ×16 × 8mm
1ST STAGE INPUT CAP (1210)
BOTTOM LAYER
OUTPUT CAPS
INPUT CAP TO
60A CORE (1206)
2ND STAGE INPUT CAP (1206)
TOP 4 (1206) FLYING CAPS
2ND STAGE
BOTTOM 3 (1206) FLYING CAPS
2ND STAGE
4664A F48
Figure 45. Recommended PCB Layout Package Top and Bottom View
Rev. 0
For more information www.analog.com
83
LTM4664A
TYPICAL APPLICATIONS
10µF ×2
50V
VOUT1
1µF
PGOODS2
EXTVCCS2
OVP_SET
OVP_TRIP
INSNSS1+
CIRCUIT
BREAKER
TRIP
INTVCCS1
EXTVCCS1
GND
PGOODS1
PGOODS2
1%
100k
1%
12.1k
RUNS1
RUNS2
PGOOD_C0
VOUT2
IN+
10µF
25V
×4
0.004Ω*
INTVCC
4.7µF VDD33
VDD25
VDD33
10k
VINS3_C0
SGND_C0_C1
VINS3_C1
VOSNS+ _C0
INTVCC
VDD33
PGOOD_C1
VDD25
PINS NOT
SHOWN:
GL_C0
GL_C1
PHFLT_C0
PHFLT_C1
TWO PHASE PSM 60A SECTION PWMC1
PWMC0
PROGRAM EA-GM = 3.02ms
VOUT RANGE = LOW RCOMP = 8k
ILIM RANGE = LOW
*OPTIONAL SENSE RESISTOR
VDD25
100pF
3300pF
FSWPH_CFG
VOUTC1_CFG
VOUTC0_CFG
ALERT
VTRIMC0_CFG
SDA
VTRIMC1_CFG
VOSNS– _C1
SCL
ASEL
SHARE_CLK
COMP_C1a
VOSNS+ _C1
COMP_C0a
SYNC
COMP_C0b
SDA
ALERT
FAULT_C1
COMP_C1b
SCL
470µF
×3
VOSNS–
330µF
4V
×3
SGND_C0_C1
WP
SYNC
SHARE_CLK
PGOODVCORE
GND
FAULT_C0
TSNS_C0b
10k
+
LOAD
VOUTC1
RUN_C1
TSNS_C0a
10k
VOSNS+
SWC1
TSNS_C1b
10k
0.9V/60A
330µF
4V
×2
VOSNS– _C0
TSNS_C1a
10k
10k
PGOODVCORE
GND
PWM_C0
10k
FAULT
INTVCC
1%
36.5k
VOUTC0
IN–
PWM_C1
PGOODS2
ON/OFF
SWC0
LTM4664A
RUN_C0
10k
10k
PGOODS1
FREQS1
UVS2
VOUT2
4.7µF
1µF
FAULTS1
FREQS2
1%
60.4k
19.6k
7.5k
VOUT2
GND
FAULTS2
PGOODS1
VOUT2
MAIN BULK
5.1V
OVP_SET
VOUT2_SET
INSNSS1–
SW1
49.9k
100V
2.2µF
100V
×2
RSENSE
10mΩ
VINS1
SW2
UVS1
VOUT1
VINS2F
INSNS2+
SW3
VINS2
SW4
10µF
×8
50V
1%
6.04k
INSNS2–
INTVCCS2
10µF
×8
100k 50V
HYS_PRGMS1
VOUT2
TIMERS1
GND
HYS_PRGMS2
4:1 VOLTAGE DIVIDER
4.7µF
100k
0.068µF
TIMERS2
0.068µF
48V
1%
100k
EXTVCC
1%
14.7k
14.3k
1%
22.6k
1%
1.65k
1%
32.4k
VOSNS+
VOSNS–
5V BIAS AT 50mA
VDD25
4664A F46
Figure 46. 0.9V at 60A Output DC/DC µModule Regulator with I2C/SMBus/PMBus
Serial Interface Including Hot Swap Front End with VOUT2 OVP Protection
84
Rev. 0
For more information www.analog.com
LTM4664A
TYPICAL APPLICATIONS
CH1 18V PULSE ON VOUT2
20V/DIV, 500mS/DIV
CH2 VIN HOT SWAP TURN OFF
50V/DIV
CH3 CIRCUITBREAKERTRIP SIGNAL
10V/DIV
CH4 1.5V VOUT PSM
500mV/DIV
4664A G46b
Figure 46b. VOUT2 Overvoltage Protection
THIS CIRCUIT CAN BE DUPLICATED AND CONNECTED
TO ADDITIONAL LTM4664As USING EACH LTM4664A’S OVP CIRCUIT
20m
28V TO 58V, 60V MAX
+
10nF
100k
562k
UV=27V
10nF
28k
100nF
100V
10k
33k
DRIVEN BY LTM4664A OVP CIRCUIT
VOUT2
VIN
BSC046N10NS3G
470µF
100V
100nF
100V
100k
VCC
MMBT3906
2M V
1µF
GATE
SNS
U1
SHDN
UV
FLTB
LT4363-1
GND
OUT
FB
TMR
ENOUT
10k
CIRCUITBREAKERTRIP
1k
OUT2SET
30k
4664A F46c
NEXT DUPLICATE
10k
VOUT2 OVP TRIP POINT AT 16.5V
ON/OFF
47nF
Figure 46c. Hot Swap Circuit Breaker Front End
Rev. 0
For more information www.analog.com
85
LTM4664A
TYPICAL APPLICATIONS
VOUT1
VIN
30V–58V
1%
100k
4.7µF
1µF
PGOODS2
EXTVCCS2
49.9k
100V
OVP_SET
INSNSS1+
VOUT2_SET
INSNSS1–
SW1
GND
RUNS1
INTVCC
1%
36.5k
SWC1
RUN_C0
VOUTC1
RUN_C1
GND
SHARE_CLK
*OPTIONAL SENSE RESISTOR
CH0 PROGRAM EA-GM = 3.69ms
RCOMP = 5k
CH1 PROGRAM EA-GM = 3.69ms
RCOMP = 3k
VOSNS+
VOSNS–
2200pF
100pF
2200pF
VDD25
1%
22.6k
1%
14.3k
1%
14.3k
1%
2.43k
LOAD1
+
470µF
×1
4V
+5V BIAS 50mA
FSWPH_CFG
VOUTC1_CFG
VOUTC0_CFG
VTRIMC0_CFG
VTRIMC1_CFG
PWMC0
220µF
×2
1.5V/25A
1%
14.5k
PWMC1
100pF
VOUT RANGE = LOW
ILIM RANGE = LOW
ASEL
COMP_C1a
COMP_C0a
SDA
470µF
×2
4V
VOSNS–
100µF
×3
4V
EXTVCC
SCL
TWO PHASE PSM 25A/30A SECTION
PGOODVCORE
VOSNS–_C1
SYNC
+
LOAD0
VOSNS+_C1
FAULT_C1
ALERT
100µF
+
×2 V
OSNS
4V
SGND_C0_C1
FAULT_C0
COMP_C0b
ALERT
PGOOD_C1
VDD25
COMP_C1b
SCL
SDA
VDD33
WP
SYNC
SHARE_CLK
10k
INTVCC
VOSNS–_C0
TSNS_C0b
FAULT
VOSNS+_C0
TSNS_C0a
10k
PGOODS2
VINS3_C1
TSNS_C1b
10k
SGND_C0_C1
TSNS_C1a
10k
1V/30A
VOUTC0
GND
VINS3_C0
10k
PGOODVCORE
SWC0
LTM4664A
–
PWM_C0
4.7µF VDD33
VDD25
VDD33
PGOOD_C0
IN+
INTVCC
PINS NOT SHOWN:
GL_C0
GL_C1
PHFLT_C0
PHFLT_C1
ON/OFF
FREQS1
VOUT2
IN
10k
PGOODS1
FAULTS1
RUNS2
0.004*
4.7µF
1µF
PGOODS1
PGOODS2
PWM_C1
1%
10µF
25V
x4
10k
VOUT2
GND
UVS2
VOUT2
100k
10k
INTVCCS1
7.5k
60.4k
1%
20k
10k
19.6k
CIRCUIT
BREAKER
TRIP
EXTVCCS1
FREQS2
1%
VOUT2
VOUT2_SET
FAULTS2
PGOODS1
MAIN BULK
5.1V
RSENSE
10mΩ
VINS1
SW2
UVS1
VOUT1
INSNS2+
VINS2
SW3
10µF
×8
50V
1%
10k
INSNS2–
INTVCCS2
HYS_PRGMS1
GND
VOUT2
TIMERS1
TIMERS2
4:1 VOLTAGE DIVIDER
HYS_PRGMS2
0.068µF
SW4
0.068µF
10µF
×8
100k 50V
VINS2F
100k
2.2µF
×2
100V
OVP_TRIP
10µF
×2
VDD25
VDD25
1%
4.22k
22.6k
4664A F47
Figure 47. 54V to 1.0V at 30A and 1.5V Outputs at 25A With Providing I2C/SMBus/PMBus Serial Interface
86
Rev. 0
For more information www.analog.com
LTM4664A
TYPICAL APPLICATIONS
VOUT1A
VIN 40V–58V
1%
100k
1µF
EXTVCCS2
OVP_SET
INTVCCS1
1%
60.4k
VOUT2A
INTVCCA
VDD33A
VDD25A
10k
VOUT2
VOSNS–_C0
VDD33
SWC1
VDD25A
1%
32.4k
100pF
6800pF
1µF
PGOODS2A
EXTVCCS2
OVP_TRIP
OVP_SET
VOUT2__SET
INTVCCS1
EXTVCCS1
GND
PGOODS1
PGOODS2
1%
12.1k
VOUT2B
RUNS1
RUNS2
PGOOD_C0
VOUT2
+
VOSNS _C0
VOSNS–_C0
INTVCC
VDD33
PGOOD_C1
VDD25
SYNC
VOSNS– _C1
EXTVCC
FSWPH_CFG
VOUTC1_CFG
VOUTC0_CFG
VTRIMC0_CFG
ASEL
COMP_C1b
COMP_C0b
COMP_C0a
COMP_C1a
WP
TSNS_C0b
TSNS_C0a
ALERT
TSNS_C1b
SCL
VTRIMC1_CFG
SHARE_CLK
SDA
PINS NOT SHOWN:
GL_C0
PHFLT_C0
PHFLT_C1
GL_C1
PWMC0B
COMPL
COMPH
1%
22.6k
+
220µF
×4
4V
VOSNS–
+5V BIAS ≥ 50mA
VDD25B
1%
14.3k
PWMC1B
TWO PHASE PSM 60A SECTION
VOSNS
VOSNS+_C1
FAULT_C1
TSNS_C1a
SDA
ALERT
VOSNS–
SGND_C0_C1
FAULT_C0
PWM_C0
SCL
470µF
×2
4V
PGOODVCORE
VOUTC1
GND
RUN_C1
PWM_C1
SYNC
SHARE_CLK
VOSNS+
SWC1
RUN_C0
FAULT
220µF
×4
4V
SGND_C0_C1
VINS3_C1
PGOODS2A
1%
36.5k
PGOODVCORE
VOUTC0
GND
VINS3_C0
INTVCCB
ON/OFFB
SWC0
LTM4664A
(B)
IN–
4.7µF VDD33B
VDD25B
10k
PGOODS1B
FREQS1
IN+
10µF
×4
25V
4.7µF
1µF
FAULTS1
UVS2
1%
100k
7.5k
VOUT2B
GND
FREQS2
1%
60.4k
19.6k
CIRCUIT
BREAKER
TRIP
FAULTS2
PGOODS1B
VOUT2B
MAIN BULK
5.1V
OVP_SET
INSNSS1+
INSNSS1–
VINS1
RSENSE1
10mΩ
SW1
SW2
VOUT1
UVS1
VINS2F
INSNS2+
49.9k
100V
2.2µF
100V
×2
10µF
×6
59V
1%
6.04k
VINS2
SW3
SW4
VIN 40V–58V
1%
100k
10µF
×6
50V
INSNS2–
INTVCCS2
HYS_PRGMS1
VOUT2B
4.7µF
HYS_PRGMS2
GND
TIMERS1
4:1 VOLTAGE DIVIDER
100k
VDD25A
32.4k
COMPH
COMPL
0.068µF
TIMERS2
0.068µF
+5V BIAS ≥ 50mA
EXTVCC
1%
14.3k
10µF
×2
50V V
OUT1B
100k
VOSNS _C1
1%
14.3k
1%
1.65Ω
VOSNS–
–
FSWPH_CFG
VOUTC1_CFG
VOUTC0_CFG
ASEL
ALERT
COMP_C1b
SDA
PINS NOT SHOWN:
PWMC1A
GL_C0
TWO PHASE PSM 60A SECTION
PWMC0A
GL_C1
PHFLT_C0
VOUT RANGE = LOW
PROGRAM EA-GM = 3.02ms
PHFLT_C1
ILIM RANGE = LOW
RCOMP = 4k ALL CHANNELS
FOR ALL CHANNELS
COMP_C0b
SCL
COMP_C0a
ALERT
VOSNS+
VOSNS+_C1
SYNC
WP
SCL
SDA
FAULT_C1
SHARE_CLK
COMP_C1a
SHARE_CLK
220µF
×4
4V
SGND_C0_C1
FAULT_C0
TSNS_C0b
SYNC
10k
VOSNS–
VOUTC1
GND
RUN_C1
TSNS_C0a
10k
LOAD
PGOODVCORE
PGOOD_C1
VDD25
TSNS_C1b
10k
VOSNS+
VOSNS+_C0
INTVCC
TSNS_C1a
10k
220µF
×4
4V
SGND_C0_C1
PWM_C0
FAULT
0.9V/120A
VOUTC0
GND
VINS3_C0
VINS3_C1
PWM_C1
10k
10k
10k
PGOODVCORE
SWC0
LTM4664A
(A)
RUN_C0
PGOODS2A
INTVCCA
1%
36.5k
PGOOD_C0
IN–
4.7µF VDD33A
ON/OFFA
RUNS1
FREQS1
IN+
10µF
25V
×4
10k
PGOODS1A
FAULTS1
RUNS2
UVS2
1%
100k
4.7µF
1µF
PGOODS1
PGOODS2
7.5k
VOUT2A
GND
FREQS2
1%
12.1k
19.6k
EXTVCCS1
FAULTS2
PGOODS1A
VOUT2A
CIRCUIT
BREAKER
TRIP
GND
PGOODS2A
MAIN BULK
5.1V
OVP_SET
INSNSS1+
INSNSS1–
RSENSE
10mΩ
SW1
SW2
UVS1
VOUT1
VINS2F
INSNS2+
VINS2
SW4
INSNS2–
INTVCCS2
49.9k
100V
2.2µF
×2
100V
IOUT2_SET
VOUT2A
4.7µF
SW3
GND
TIMERS1
TIMERS2
4:1 VOLTAGE DIVIDER
HYS_PRGMS1
0.068µF
HYS_PRGMS2
0.068µF
10µF
×6
50V
1%
6.04k
VINS1
10µF
×6
100k 50V
100k
OVP_TRIP
10µF
×2
50V
1%
1.65k
1%
1.65k
1%
14.3k
4664A F48
Figure 48. Two Paralleled LTM4664A Producing 54V to 0.9VOUT at 120A. Integrated Power System Management Features
Accessible Over 2-Wire I2C/SMBus/PMBus Serial Interface
Rev. 0
For more information www.analog.com
87
LTM4664A
TYPICAL APPLICATIONS
VIN 30V TO 58V
VOUT1
1%
100k
1µF
PGOODS2
EXTVCCS2
ENABLE
INPUT
OUTPUT
1% 1%
20k 100k VOUT2
PGOODS2
VIN/4
56µF
35V
OTHER DC/DC REGS
NO LOAD UNTIL
ENABLED
OVP_SET
VOUT2_SET
PGOODS2
INTVCC
10k
PGOODS2
FAULT
10k
10k
10k
10k
SGND_C0_C1
VINS3_C1
VOSNS+ _C0
INTVCC
VOSNS– _C0
VDD33
SGND_C0_C1
FAULT_C1
VOSNS+_C1
470µF
INTVCC
100µF
×6
+
470µF
VOSNS–_C1
FSWPH_CFG
VOUTC1_CFG
VOUTC0_CFG
VTRIMC0_CFG
VTRIMC1_CFG
ASEL
COMP_C1b
COMP_C0b
COMP_C0a
COMP_C1a
WP
TSNS_C0b
TSNS_C0a
TSNS_C1b
TSNS_C1a
PWM_C0
PWM_C1
PWMC1
PWMC0
+
1.2V/15A
VOUTC1
GND
FAULT_C0
CHANNEL 0 AND 1
EA-GM = 3.69ms
RCOMP = 5k
10k
SWC1
RUN_C1
TWO PHASE PSM SECTION
100µF
×6
PGOOD_C1
VDD25
SCL
CHANNEL 0 AND 1 VOUT RANGE = LOW
ILIM RANGE = LOW
1V/15A
VOUTC0
GND
VINS3_C0
10k
PGOODVCORE
SWC0
LTM4664A
ALERT
INTVCC
1%
36.5k
PGOOD_C0
VOUT2
SHARE_CLK
PINS NOT SHOWN:
GL_C0
GL_C1
PHFLT_C0
PHFLT_C1
ON/OFF
FREQS1
UVS2
SDA
10k
PGOODS1
RUNS1
RUNS2
SYNC
10k
4.7µF
1µF
FAULTS1
RUN_C0
10k
7.5k
VOUT2
PGOODS1
IN–
4.7µF VDD33
VDD25
VDD33
INTVCCS1
GND
IN+
10µF
25V
×4
19.6k
GND
FREQS2
1%
60.4k
ADDITIONAL 30W FROM VOUT2
VOUT2
CIRCUIT
BREAKER
TRIP
EXTVCCS1
FAULTS2
PGOODS1
MAIN BULK
5.1V
OVP_SET
INSNSS1+
INSNSS1–
SW1
RSENSE
10mΩ
VINS1
SW2
UVS1
VOUT1
VINS2F
INSNS2+
SW4
INSNS2–
INTVCCS2
HYS_PRGMS1
VOUT2
4.7µF
TIMERS1
GND
HYS_PRGMS2
4:1 VOLTAGE DIVIDER
100k
TIMERS2
0.068µF
49.9k
100V
2.2µF
×2
100V
10µF
×8
50V
1%
10k
SW3
0.068µF
10µF
×8
50V
VINS2
100k
OVP_TRIP
10µF
×2
50V
EXTVCC
VDD25
1%
14.3k
100pF
2200pF
100pF
2200pF
+5V 50mA
1%
22.6k
1%
2.43k
1%
32.4k
1%
22.6k
1%
14.3k
1%
14.3k
4664A F49
Figure 49. 30V – 58V to 1V and 1.2V at 15A, with Additional 30W from VOUT2. Integrated Power System Management Features
Accessible Over 2-Wire I2C/SMBus/PMBus Serial Interface. For Evaluation and More Information, See Demo Boards DC2143
88
Rev. 0
For more information www.analog.com
LTM4664A
TYPICAL APPLICATIONS
10µF
×2
50V V
OUT1A
1µF
10k
EXTVCCS2
RSENSE1
10mΩ
OVP_SET
OVP_TRIP
VOUT2_SET
INTVCCS1
FAULTS1
1%
100k
VOUT2A
INTVCCA
4.7µF VDD33A
VDD25A
VDD33A
10k
SGND_C0_C1
VINS3_C1
VOSNS+ _C0
INTVCC
VOSNS– _C0
VDD33
PGOOD_C1
VDD25
VDD25A
1%
14.3k
PWMC1A
PWMC0A
10k
1%
32.4k
49.9k
100V
OVP_TRIP
OVP_SET
VOUT2_SET
INTVCCS1
PGOODS1
PGOODS2
RUNS1 ON/OFFB
PGOOD_C0
VOUT2
VINS3_C0
SGND_C0_C1
VINS3_C1
VOSNS+ _C0
FAULT_C1
COMPH
0.9V CHANNELS
GM = 3.69ms
RCOMP = 3.4k
VOSNS–
4700pF
FSWPH_CFG
VOUTC1_CFG
VOUTC0_CFG
VTRIMC0_CFG
VOSNS–
VOSNS– _C1
EXTVCC
1%
14.3k
COMPL
100pF
VTRIMC1_CFG
ASEL
COMP_C1a
COMP_C0a
COMP_C0b
COMP_C1b
WP
TSNS_C0b
TSNS_C0a
TSNS_C1b
SCL
TSNS_C1a
SHARE_CLK
ALL CHANNELS HAVE
VOUT RANGE = LOW
ILIM RANGE = LOW
1.2V GM = 3.69ms
CHANNEL RCOMP = 4k
470µF
×4
4V
VOSNS+
VOSNS+ _C1
SYNC
PWMC1B
TWO PHASE PSM 60A SECTION PWM C0B
PINS NOT SHOWN:
GL_C0
GL_C1
PHFLT_C0
LOAD
220µF
×2
4V
SGND_C0_C1
FAULT_C0
ALERT
VOSNS+
VOSNS–
VOUTC1
GND
RUN_C1
SDA
INTVCCB
SWC1
PWM_C0
ALERT
220µF
×2
4V
PGOOD_C1 PGOODVCORE
PWM_C1
SCL
SDA
VOSNS+
VOSNS– _C0
RUN_C0
SYNC
10k
0.9V/90A
VOUTC0
GND
INTVCCB
INTVCC
4.7µF VDD33B V
DD33
VDD25B
VDD25
SHARECLK
1%
36.5k
PGOODVCORE
SWC0
LTM4664A
(B)
IN–
FAULT
10k
PGOODS1B
FREQS1
IN+
PGOODS2A
4.7µF
1µF
FAULTS1
UVS2
10µF
×4
25V
7.5k
VOUT2B
SGNDS1
FREQS2
VOUT2B
19.6k
EXTVCCS1
FAULTS2
1%
1%
12.1k 100k
VOUT2B
CIRCUIT
BREAKER
TRIP
PGOODS1B RUNS2
1%
60.4k
MAIN BULK
5.1V
OVP_SET
INSNSS1+
INSNSS1–
VINS1
RSENSE2
10mΩ
SW1
VOUT1
UVS1
VINS2F
INSNS1+
SW2
10µF
×8
50V
1%
6.04k
2.2µF
100V
×2
GND
PGOODS2A
1%
14.3k
1%
14.3k
VIN 40V – 58V
INSNS1
SW4
HYS_PRGMS1
EXTVCCS2
HYS_PRGMS2
VOUT2B
1µF
TIMERS1
INTVCCS2
4.7µF
TIMERS2
GND
100k
1.65k
COMPL
1%
100k
VINS2
0.068µF
1%
3.24k
1%
32.4
VOUT1B
10µF
×8
50V
SW3
100k
COMPH
–
10µF
×2
50V
4:1 VOLTAGE DIVIDER
2200pF
220pF
PINS NOT SHOWN:
GL_C0
GL_C1
PHFLT_C0
PHFLT_C1
0.068µF
VOSNS–
+5V BIAS 50mA
EXTVCC
FSWPH_CFG
VOUTC1_CFG
VOUTC0_CFG
VTRIMC0_CFG
VTRIMC1_CFG
ASEL
ALERT
COMP_C1a
SDA
COMP_C0a
SCL
DUAL 30A PSM SECTION
220µF
×2
4V
VOSNS+
VOSNS– _C1
SHARE_CLK
COMP_C0b
SDA
ALERT
SYNC
COMP_C1b
SCL
LOAD
VOSNS+ _C1
FAULT_C1
WP
CLK SHARE
TSNS_C0b
SYNC
10k
TSNS_C0a
10k
470µF
PGOODVCORE
SGND_C0_C1
FAULT_C0
TSNS_C1b
10k
+
SWC1
TSNS_C1a
10k
FAULT
100µF
×3
VOUTC1
GND
RUN_C1
PWM_C0
10k
1.2V/30A
VOUTC0
GND
VINS3_C0
PWM_C1
10k
10k
10k
PGOOD1P2V
SWC0
LTM4664
(A)
–
RUN_C0
PGOODS2A
1%
36.5k
PGOOD_C0
VOUT2
IN
INTVCCA
FREQS1
IN+
10µF
×4
25V
ON/OFFA
RUNS1
RUNS2
UVS2
1%
12.1k
10k
PGOODS1A
PGOODS1
FREQS2
1%
60.4k
4.7µF
1µF
SGNDS1
PGOODS2
7.5k
VOUT2A
EXTVCCS1
FAULTS2
PGOODS1A
19.6k
CIRCUIT
BREAKER
TRIP
GND
PGOODS2A
VOUT2A
MAIN BULK
5.1V
OVP_SET
INSNSS1+
INSNSS1–
SW1
VINS1
SW2
UVS1
VOUT1
VINS2F
INSNS2+
SW3
SW4
INSNS2–
INTVCCS2
HYS_PRGMS1
VOUT2A
4.7µF
TIMERS1
GND
HYS_PRGMS2
TIMERS2
4:1 VOLTAGE DIVIDER
100k
49.9k
100V
2.2µF
×2
100V
10µF
×8
50V
1%
6.04k
VINS2
0.068µF
0.068µF
VIN 40V – 58V
1%
100k
10µF
×8
50V
100k
1%
22.6k
1%
1.65k
1%
1.65k
+5V BIAS 50mA
VDD25B
1%
14.3k
4664A F50
Figure 50. 48V-58V Input, Converting 1.2V at 30A, and 0.9V at 90A. Power System Management Features Accessible Through
LTM4664A Over 2-Wire I2C/SMBus/PMBus Serial Interface.
Rev. 0
For more information www.analog.com
89
LTM4664A
PMBus COMMAND DETAILS
ADDRESSING AND WRITE PROTECT
CMD
CODE
0x00
0x05
0x06
COMMAND NAME
PAGE
PAGE_PLUS_WRITE
PAGE_PLUS_READ
DATA
DEFAULT
TYPE
PAGED FORMAT UNITS NVM VALUE
R/W Byte
N
Reg
0x00
W Block
N
Block
N
R/W
R/W Byte
N
Reg
Y
0x00
DESCRIPTION
Provides integration with multi-page PMBus devices.
Write a supported command directly to a PWM channel.
Read a supported command directly from a PWM
channel.
0x10 Level of protection provided by the device against
accidental changes.
0xE6 Sets the 7-bit I2C address byte.
0xFA Common address for PolyPhase outputs to adjust
common parameters.
WRITE_PROTECT
MFR_ADDRESS
MFR_RAIL_ADDRESS
R/W Byte
R/W Byte
N
Y
Reg
Reg
Y
Y
0x4F
0x80
PAGE
The PAGE command provides the ability to configure, control and monitor both PWM channels through only one
physical address, either the MFR_ADDRESS or GLOBAL device address. Each PAGE contains the operating commands
for one PWM channel.
Pages 0x00 and 0x01 correspond to Channel 0 and Channel 1, respectively, in this device.
Setting PAGE to 0xFF applies any following paged commands to both outputs. With PAGE set to 0xFF the LTM4664A
will respond to read commands as if PAGE were set to 0x00 (Channel 0 results).
This command has one data byte.
PAGE_PLUS_WRITE
The PAGE_PLUS_WRITE command provides a way to set the page within a device, send a command, and then send
the data for the command, all in one communication packet. Commands allowed by the present write protection level
may be sent with PAGE_PLUS_WRITE.
The value stored in the PAGE command is not affected by PAGE_PLUS_WRITE. If PAGE_PLUS_WRITE is used to send
a non-paged command, the Page Number byte is ignored.
This command uses Write Block protocol. An example of the PAGE_PLUS_WRITE command with PEC sending a
command that has two data bytes is shown in Figure 51.
1
7
S
SLAVE
ADDRESS
1
1
W
PAGE_PLUS
A
A
COMMAND CODE
8
8
LOWER DATA
BYTE
1
8
BLOCK COUNT
(= 4)
1
8
A
PAGE
NUMBER
1
8
1
8
1
1
A
UPPER DATA
BYTE
A
PEC BYTE
A
P
1
8
1
A
COMMAND
CODE
A
…
4664A F54
Figure 51. Example of PAGE_PLUS_WRITE
PAGE_PLUS_READ
The PAGE_PLUS_READ command provides the ability to set the page within a device, send a command, and then read
the data returned by the command, all in one communication packet .
90
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LTM4664A
PMBus COMMAND DETAILS
The value stored in the PAGE command is not affected by PAGE_PLUS_READ. If PAGE_PLUS_READ is used to access
data from a non-paged command, the Page Number byte is ignored.
This command uses the Process Call protocol. An example of the PAGE_PLUS_READ command with PEC is shown
in Figure 52.
1
7
S
SLAVE
ADDRESS
1
7
Sr
SLAVE
ADDRESS
1
R
1
1
W
PAGE_PLUS
A
A
COMMAND CODE
8
1
8
A
BLOCK COUNT
(= 2)
1
8
BLOCK COUNT
(= 2)
1
8
A
LOWER DATA
BYTE
1
8
A
PAGE
NUMBER
1
8
1
A
COMMAND
CODE
A
1
8
1
8
A
UPPER DATA
BYTE
A
PEC BYTE
1
…
1
NA P
4664A F55
Figure 52. Example of PAGE_PLUS_READ
Note: PAGE_PLUS commands cannot be nested. A PAGE_PLUS command cannot be used to read or write another
PAGE_PLUS command. If this is attempted, the LTM4664A will NACK the entire PAGE_PLUS packet and issue a CML
fault for Invalid/Unsupported Data.
WRITE_PROTECT
The WRITE_PROTECT command is used to control writing to the LTM4664A device. This command does not indicate
the status of the WP pin which is defined in the MFR_COMMON command. The WP pin takes precedence over the
value of this command.
BYTE MEANING
0x80 Disable all writes except to the WRITE_PROTECT, PAGE, MFR_
EE_UNLOCK, and STORE_USER_ALL commands.
0x40 Disable all writes except to the WRITE_PROTECT, PAGE,
MFR_EE_UNLOCK, MFR_CLEAR_PEAKS, STORE_USER_ALL,
OPERATION and CLEAR_FAULTS command. Individual fault
bits can be cleared by writing a 1 to the respective bits in the
STATUS commands.
0x20 Disable all writes except to the WRITE_PROTECT, OPERATION,
MFR_EE_UNLOCK, MFR_CLEAR_PEAKS, CLEAR_FAULTS,
PAGE, ON_OFF_CONFIG, VOUT_COMMAND and STORE_USER_
ALL. Individual fault bits can be cleared by writing a 1 to the
respective bits in the STATUS commands.
0x10 Reserved, must be 0
0x08 Reserved, must be 0
0x04 Reserved, must be 0
0x02 Reserved, must be 0
0x01 Reserved, must be 0
Enable writes to all commands when WRITE_PROTECT is set to 0x00.
If WP pin is high, PAGE, OPERATION, MFR_CLEAR_PEAKS, MFR_EE_UNLOCK, WRITE_PROTECT and CLEAR_
FAULTS commands are supported. Individual fault bits can be cleared by writing a 1 to the respective bits in the
STATUS commands.
Rev. 0
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91
LTM4664A
PMBus COMMAND DETAILS
MFR_ADDRESS
The MFR_ADDRESS command byte sets the 7 bits of the PMBus slave address for this device.
Setting this command to a value of 0x80 disables device addressing. The GLOBAL device address, 0x5A and 0x5B,
cannot be deactivated. If RCONFIG is set to ignore, the ASEL pin is still used to determine the LSB of the channel
address. If the ASEL pin is open, the LTM4664A will use the MFR_ADDRESS value stored in NVM to construct the
effective address of the part.
This command has one data byte.
MFR_RAIL_ADDRESS
The MFR_RAIL_ADDRESS command enables direct device address access to the PAGE activated channel. The value
of this command should be common to all devices attached to a single power supply rail.
The user should only perform command writes to this address. If a read is performed from this address and the rail
devices do not respond with EXACTLY the same value, the LTM4664A will detect bus contention and may set a CML
communications fault.
Setting this command to a value of 0x80 disables rail device addressing for the channel.
This command has one data byte.
GENERAL CONFIGURATION COMMANDS
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
DATA
PAGED FORMAT UNITS
NVM
DEFAULT
VALUE
MFR_CHAN_CONFIG
0xD0
Configuration bits that are channel specific.
R/W Byte
Y
Reg
Y
0x10
MFR_CONFIG_ALL
0xD1
General configuration bits.
R/W Byte
N
Reg
Y
0x21
MFR_CHAN_CONFIG
General purpose configuration command common to multiple LTC products.
BIT
MEANING
7
Reserved
6
Reserved
5
Reserved
4
Disable RUN Low. When asserted the RUN pin is not pulsed low if commanded OFF.
3
Enable short cycle recognition if this bit is set to a 1.
2
SHARE_CLOCK control. If SHARE_CLOCK is held low, the output is disabled.
1
No FAULT ALERT, ALERT is not pulled low if FAULT is pulled low externally. Assert this bit if either POWER_GOOD or VOUT_UVUF are
propagated on FAULT.
0
Disables the VOUT decay value requirement for MFR_RETRY_TIME and tOFF(MIN) processing. When this bit is set to a 0, the output must decay to
less than 12.5% of the programmed value for any action that turns off the rail including a fault, an OFF/ON command, or a toggle of RUN from
high to low to high.
This command has one data byte.
92
Rev. 0
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LTM4664A
PMBus COMMAND DETAILS
A short cycle event occurs whenever the PWM channel is commanded back ON, or reactivated, after the part has been
commanded OFF and is processing either the TOFF_DELAY or the TOFF_FALL states. The PWM channel can be turned
ON and OFF through either the RUN pin and or the PMBus OPERATION command.
If the PWM channel is reactivated during the TOFF_DELAY, the part will perform the following:
1. Immediately tri-state the PWM channel output;
2. Start the retry delay timer as specified by the tOFF(MIN).
3. After the tOFF(MIN) value has expired, the PWM channel will proceed to the TON_DELAY state and the STATUS_
MFR_SPECIFIC bit #1 will assert.
If the PWM channel is reactivated during the TOFF_FALL, the part will perform the following:
1. Stop ramping down the PWM channel output;
2. Immediately tri-state the PWM channel output;
3. Start the retry delay timer as specified by the tOFF(MIN).
4. After the tOFF(MIN) value has expired, the PWM channel will proceed to the TON_DELAY state and the STATUS_
MFR_SPEFIFIC bit #1 will assert.
If the short cycle event occurs and the short cycle MFR_CHAN_CONFIG bit is not set, the PWM channel state machine
will complete its TOFF_DELAY and TOFF_FALL operations as previously commanded by the user.
MFR_CONFIG_ALL
General purpose configuration command common to multiple LTC products.
BIT
MEANING
7
Enable Fault Logging
6
Ignore Resistor Configuration Pins
5
Mask PMBus, Part II, Section 10.9.1 Violations
4
Disable SYNC output
3
Enable 255ms PMBus timeout
2
A valid PEC required for PMBus writes to be accepted. If this bit is not
set, the part will accept commands with invalid PEC.
1
Enable the use of PMBus clock stretching
0
Execute CLEAR_FAULTS on rising edge of either RUN pin.
This command has one data byte.
ON/OFF/MARGIN
COMMAND NAME
CMD
CODE
DESCRIPTION
ON_OFF_CONFIG
0x02
OPERATION
0x01
MFR_RESET
0xFD
TYPE
PAGED
RUN pin and PMBus bus on/off command configuration.
R/W Byte
Y
Operating mode control. On/off, margin high and margin
low.
R/W Byte
Y
Commanded reset without requiring a power-down.
Send Byte
N
DATA
FORMAT UNITS
NVM
DEFAULT
VALUE
Reg
Y
0x1E
Reg
Y
0x80
NA
Rev. 0
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93
LTM4664A
PMBus COMMAND DETAILS
ON_OFF_CONFIG
The ON_OFF_CONFIG command specifies the combination of RUNn pin input state and PMBus commands needed to
turn the PWM channel on and off.
Supported Values:
VALUE
MEANING
0x1F
OPERATION value and RUNn pin must both command the device to start/run. Device executes immediate off when commanded off.
0x1E
OPERATION value and RUNn pin must both command the device to start/run. Device uses TOFF_ command values when commanded off.
0x17
RUNn pin control with immediate off when commanded off. OPERATION on/off control ignored.
0x16
RUNn pin control using TOFF_ command values when commanded off. OPERATION on/off control ignored.
Programming an unsupported ON_OFF_CONFIG value will generate a CML fault and the command will be ignored.
This command has one data byte.
OPERATION
The OPERATION command is used to turn the unit on and off in conjunction with the input from the RUNn pins. It
is also used to cause the unit to set the output voltage to the upper or lower MARGIN VOLTAGEs. The unit stays in
the commanded operating mode until a subsequent OPERATION command or change in the state of the RUNn pin
instructs the device to change to another mode. If the part is stored in the MARGIN_LOW/HIGH state, the next RESET
or POWER_ON cycle will ramp to that state. If the OPERATION command is modified, for example ON is changed
to MARGIN_LOW, the output will move at a fixed slope set by the VOUT_TRANSITION_RATE. The default operation
command is sequence off. If VIN is applied to a part with factory default programming and the VOUT_CONFIG resistor
configuration pins are not installed, the outputs will be commanded off.
The part defaults to the Sequence Off state.
This command has one data byte.
Supported Values:
VALUE
MEANING
0xA8
Margin high.
0x98
Margin low.
0x80
On (VOUT back to nominal even if bit 3 of ON_OFF_CONFIG is not set).
0x40*
Soft off (with sequencing).
0x00*
Immediate off (no sequencing).
*Device does not respond to these commands if bit 3 of ON_OFF_CONFIG is not set.
Programming an unsupported OPERATION value will generate a CML fault and the command will be ignored.
This command has one data byte.
MFR_RESET
This command provides a means to reset the LTM4664A PSM from the serial bus. This forces the LTM4664A PSM
to turn off both PWM channels, load the operating memory from internal EEPROM, clear all faults and then perform a
soft-start of both PWM channels, if enabled.
This write-only command has no data bytes.
94
Rev. 0
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LTM4664A
PMBus COMMAND DETAILS
PWM CONFIGURATION
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
PAGED
DATA
DEFAULT
FORMAT UNITS NVM VALUE
MFR_PWM_COMP
0xD3
PWM loop compensation configuration
R/W Byte
Y
Reg
Y
0x28
MFR_PWM_MODE
0xD4
Configuration for the PWM engine.
R/W Byte
Y
Reg
Y
0xC7
MFR_PWM_CONFIG
0xF5
Set numerous parameters for the DC/DC controller
including phasing.
R/W Byte
N
Reg
Y
0x10
FREQUENCY_SWITCH
0x33
Switching frequency of the controller.
R/W
Word
N
L11
Y
350kHz
0xFABC
kHz
MFR_PWM_MODE
The MFR_PWM_MODE command sets important PWM controls for each channel.
The MFR_PWM_MODE command allows the user to program the PWM controller to use discontinuous (pulse-skipping
mode), or forced continuous conduction mode.
BIT
7
0b
1b
6
5
MEANING
Use High Range of ILIMIT
Low Current Range
High Current Range
Enable Servo Mode
External temperature sense:
0: ΔVBE measurement.
[4:3]
2
1
1b
0b
Bit[0]
0b
1b
Now reserved, ΔVBE only supported.
Reserved
Reserved, always low DCR current sense
VOUT Range
The maximum output voltage is 2.75V
The maximum output voltage is 3.6V
Mode
Discontinuous
Forced Continuous
Bit [7] of this command determines if the part is in high range or low range of the IOUT_OC_FAULT_LIMIT command.
Changing this bit value changes the PWM loop gain and compensation. This bit value should not be changed when the
channel output is active. Writing this bit when the channel is active will generate a CML fault.
Bit [6] The LTM4664A PSM will not servo while the part is OFF, ramping on or ramping off. When set to a one, the
output servo is enabled. The output set point DAC will be slowly adjusted to minimize the difference between the
READ_VOUT_ADC and the VOUT_COMMAND (or the appropriate margined value).
The LTM4664A PSM computes temperature in °C from ∆VBE measured by the ADC at the TSNSn pin as
T = (G • ΔVBE • q/(K • ln(16))) – 273.15 + O
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LTM4664A
PMBus COMMAND DETAILS
For both equations,
G = MFR_TEMP_1_GAIN • 2–14, and
O = MFR_TEMP_1_OFFSET
Bit[2] is now reserved, and Ultra Low DCR mode is default.
Bit[1] of this command determines if the part is in high range or low voltage range. Changing this bit value changes
the PWM loop gain and compensation. This bit value should not be changed when the channel output is active. Writing
this bit when the channel is active will generate a CML fault.
Bit[0] determines if the PWM mode of operation is discontinuous (pulse-skipping mode), or forced continuous conduction mode. Whenever the channel is ramping on, the PWM mode will be discontinuous, regardless of the value of
this bit. This command has one data byte.
MFR_PWM_COMP
The MFR_PWM_COMP command sets the gm of the PWM channel error amplifiers and the value of the internal RITHn
compensation resistors. This command affects the loop gain of the PWM output which may require modifications to
the external compensation network.
BIT
MEANING
BIT [7:5]
Error Amplifier GM Adjust (ms)
000b
1.00
001b
1.68
010b
2.35
011b
3.02
100b
3.69
101b
4.36
110b
5.04
111b
5.73
BIT [4:0]
RCOMP (kΩ)
00000b
0
00001b
0.25
00010b
0.5
00011b
0.75
00100b
1
00101b
1.25
00110b
1.5
00111b
1.75
01000b
2
01001b
2.5
01010b
3
01011b
3.5
01100b
4
01101b
4.5
01110b
5
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LTM4664A
PMBus COMMAND DETAILS
01111b
5.5
10000b
6
10001b
7
10010b
8
10011b
9
10100b
11
10101b
13
10110b
15
10111b
17
11000b
20
11001b
24
11010b
28
11011b
32
11100b
38
11101b
46
11110b
54
11111b
62
This command has one data byte.
MFR_PWM_CONFIG
The MFR_PWM_CONFIG command sets the switching frequency phase offset with respect to the falling edge of the
SYNC signal. The part must be in the OFF state to process this command. Either the RUN pins must be low or the
channels must be commanded off. If either channel is in the RUN state and this command is written, the command
will be NACK’d and a BUSY fault will be asserted.
BIT
MEANING
7
Reserved
[6:5]
00b
01b
10b
11b
4
BIT [2:0]
Input current sense gain.
2x gain. 0mV to 50mV range.
4x gain. 0mV to 20mV range.
8x gain. 0mV to 5mV range.
Reserved
Share Clock Enable : If this bit is 1, the
SHARE_CLK pin will not be released until
VIN > VIN_ON. The SHARE_CLK pin will be
pulled low when VIN < VIN_OFF. If this bit is 0, the SHARE_
CLK pin will not be pulled low when VIN < VIN_OFF except
for the initial application of VIN.
CHANNEL 0 (DEGREES)
CHANNEL 1 (DEGREES)
000b
0
180
001b
90
270
010b
0
240
011b
0
120
100b
120
240
101b
60
240
110b
120
300
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97
LTM4664A
PMBus COMMAND DETAILS
FREQUENCY_SWITCH
The FREQUENCY_SWITCH command sets the switching frequency, in kHz, of the LTM4664A.
Supported Frequencies:
VALUE [15:0]
0x0000
0xF3E8
0xFABC
0xFB52
0xFBE8
0x023F
0x028A
0x02EE
0x03E8
RESULTING FREQUENCY (TYP)
External Oscillator
250kHz
350kHz
425kHz
500kHz
575kHz
650kHz
750kHz
1000kHz
The part must be in the OFF state to process this command. The RUN pin must be low or both channels must be
commanded off. If the part is in the RUN state and this command is written, the command will be NACK'd and a BUSY
fault will be asserted. When the part is commanded off and the frequency is changed, a PLL_UNLOCK status may be
detected as the PLL locks onto the new frequency.
This command has two data bytes and is formatted in Linear_5s_11s format.
VOLTAGE
Input Voltage and Limits
COMMAND NAME
CMD
CODE
DESCRIPTION
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
VIN_OV_FAULT_LIMIT
0x55
Input supply overvoltage fault limit.
R/W
Word
N
L11
V
Y
15.5
0xD3E0
VIN_UV_WARN_LIMIT
0x58
Input supply undervoltage warning limit.
R/W
Word
N
L11
V
Y
4.65
0xCA53
VIN_ON
0x35
Input voltage at which the unit should start
power conversion.
R/W
Word
N
L11
V
Y
4.75
0xCA60
VIN_OFF
0x36
Input voltage at which the unit should stop
power conversion.
R/W
Word
N
L11
V
Y
4.5
0xCA40
R Word
N
L11
mΩ
N
1000
0x03E8
MFR_RVIN
The resistance value of the VIN pin filter element
in milliohms set at factory.
DEFAULT
VALUE
VIN_OV_FAULT_LIMIT
The VIN_OV_FAULT_LIMIT command sets the value of the input voltage measured by the ADC, in volts, that causes
an input overvoltage fault.
This command has two data bytes in Linear_5s_11s format.
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LTM4664A
PMBus COMMAND DETAILS
VIN_UV_WARN_LIMIT
The VIN_UV_WARN_LIMIT command sets the value of input voltage measured by the ADC that causes an input undervoltage warning. This warning is disabled until the input exceeds the input startup threshold value set by the VIN_ON
command and the unit has been enabled. If the VIN Voltage drops below the VIN_OV_WARN_LIMIT the device:
• Sets the INPUT Bit Is the STATUS_WORD
• Sets the VIN Undervoltage Warning Bit in the STATUS_INPUT Command
• Notifies the Host by Asserting ALERT, unless Masked
VIN_ON
The VIN_ON command sets the input voltage, in Volts, at which the unit starts power conversion.
This command has two data bytes and is formatted in Linear_5s_11s format.
VIN_OFF
The VIN_OFF command sets the input voltage, in Volts, at which the unit stops power conversion.
This command has two data bytes and is formatted in Linear_5s_11s format.
MFR_RVIN
The MFR_RVIN command is not available, MFR_RVIN is set at factory assembly with 1Ω.
This command has two data bytes and is formatted in Linear_5s_11s format.
Output Voltage and Limits
COMMAND NAME
VOUT_MODE
VOUT_MAX
VOUT_OV_FAULT_ LIMIT
CMD CODE DESCRIPTION
0x20
Output voltage format and exponent
(2–12).
0x24
Upper limit on the output voltage
the unit can command regardless of
any other commands.
0x40
Output overvoltage fault limit.
VOUT_OV_WARN_ LIMIT
0x42
Output overvoltage warning limit.
VOUT_MARGIN_HIGH
0x25
VOUT_COMMAND
0x21
Margin high output voltage set
point. Must be greater than
VOUT_COMMAND.
Nominal output voltage set point.
VOUT_MARGIN_LOW
0x26
VOUT_UV_WARN_ LIMIT
0x43
Margin low output voltage
set point. Must be less than
VOUT_COMMAND.
Output undervoltage warning limit.
VOUT_UV_FAULT_ LIMIT
0x44
Output undervoltage fault limit.
MFR_VOUT_MAX
0xA5
Maximum allowed output voltage.
TYPE
R Byte
PAGED
Y
DATA
FORMAT
Reg
UNITS
NVM
R/W
Word
Y
L16
V
Y
R/W
Word
R/W
Word
R/W
Word
Y
L16
V
Y
Y
L16
V
Y
Y
L16
V
Y
R/W
Word
R/W
Word
Y
L16
V
Y
Y
L16
V
Y
R/W
Word
R/W
Word
R Word
Y
L16
V
Y
Y
L16
V
Y
Y
L16
V
DEFAULT
VALUE
2–12
0x14
1.8
0x2CCD
1.1
0x119A
1.075
0x1133
1.05
0x10CD
1.0
0x1000
0.95
0x0F33
0.925
0x0ECD
0.9
0x0E66
7.8
0x1CCD
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LTM4664A
PMBus COMMAND DETAILS
VOUT_MODE
The data byte for VOUT_MODE command, used for commanding and reading output voltage, consists of a 3-bit mode
(only linear format is supported) and a 5-bit parameter representing the exponent used in output voltage Read/Write
commands.
This read-only command has one data byte.
VOUT_MAX
The VOUT_MAX command sets an upper limit on any voltage, including VOUT_MARGIN_HIGH, the unit can command regardless of any other commands or combinations. The maximum allowed value of this command is 3.6V.
The maximum output voltage the LTM4664A PSM can produce is 1.8V including VOUT_MARGIN_HIGH. However, the
VOUT_OV_FAULT_LIMIT can be commanded as high as 3.6V.
This command has two data bytes and is formatted in Linear_16u format.
VOUT_OV_FAULT_LIMIT
The VOUT_OV_FAULT_LIMIT command sets the value of the output voltage measured by the OV supervisor comparator
at the sense pins, in volts, which causes an output overvoltage fault.
If the VOUT_OV_FAULT_LIMIT is modified and the part is in the RUN state, allow 10ms after the command is modified
to assure the new value is being honored. The part indicates if it is busy making a calculation. Monitor bits 5 and 6 of
MFR_COMMON. Either bit is low if the part is busy. If this wait time is not honored and the VOUT_COMMAND is modified above the old overvoltage limit, an OV condition might temporarily be detected resulting in undesirable behavior
and possible damage to the switcher.
If VOUT_OV_FAULT_RESPONSE is set to OV_PULLDOWN or 0x00, the FAULT pin will not assert if VOUT_OV_FAULT
is propagated. The LTM4664A PSM will pull the TG low and assert the BG bit as soon as the overvoltage condition is
detected.
This command has two data bytes and is formatted in Linear_16u format.
VOUT_OV_WARN_LIMIT
The VOUT_OV_WARN_LIMIT command sets the value of the output voltage measured by the ADC at the sense pins,
in volts, which causes an output voltage high warning. The MFR_VOUT_PEAK value can be used to determine if this
limit has been exceeded.
In response to the VOUT_OV_WARN_LIMIT being exceeded, the device:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Sets the VOUT bit in the STATUS_WORD
• Sets the VOUT Overvoltage Warning bit in the STATUS_VOUT command
• Notifies the host by asserting ALERT pin, unless masked
This condition is detected by the ADC so the response time may be up to tCONVERT.
This command has two data bytes and is formatted in Linear_16u format.
100
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LTM4664A
PMBus COMMAND DETAILS
VOUT_MARGIN_HIGH
The VOUT_MARGIN_HIGH command loads the unit with the voltage to which the output is to be changed, in Volts,
when the OPERATION command is set to “Margin High”. The value should be greater than VOUT_COMMAND. The
maximum guaranteed value on VOUT_MARGIN_HIGH is 3.6V.
This command will not be acted on during TON_RISE and TOFF_FALL output sequencing. The VOUT_TRANSITION_
RATE will be used if this command is modified while the output is active and in a steady-state condition.
This command has two data bytes and is formatted in Linear_16u format.
VOUT_COMMAND
The VOUT_COMMAND consists of two bytes and is used to set the output voltage, in volts. The maximum guaranteed
value on VOUT is 3.6V.
This command will not be acted on during TON_RISE and TOFF_FALL output sequencing. The VOUT_TRANSITION_
RATE will be used if this command is modified while the output is active and in a steady-state condition.
This command has two data bytes and is formatted in Linear_16u format.
VOUT_MARGIN_LOW
The VOUT_MARGIN_LOW command loads the unit with the voltage to which the output is to be changed, in volts,
when the OPERATION command is set to “Margin Low”. The value must be less than VOUT_COMMAND.
This command will not be acted on during TON_RISE and TOFF_FALL output sequencing. The VOUT_TRANSITION_
RATE will be used if this command is modified while the output is active and in a steady-state condition.
This command has two data bytes and is formatted in Linear_16u format.
VOUT_UV_WARN_LIMIT
The VOUT_UV_ WARN_LIMIT command reads the value of the output voltage measured by the ADC at the sense pins,
in volts, which causes an output voltage low warning.
In response to the VOUT_UV_WARN_LIMIT being exceeded, the device:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Sets the VOUT bit in the STATUS_WORD
• Sets the VOUT Undervoltage Warning bit in the STATUS_VOUT command
• Notifies the host by asserting ALERT pin, unless masked
This command has two data bytes and is formatted in Linear_16u format.
VOUT_UV_FAULT_LIMIT
The VOUT_UV_FAULT_LIMIT command reads the value of the output voltage measured by the UV supervisor comparator at the sense pins, in volts, which causes an output undervoltage fault.
This command has two data bytes and is formatted in Linear_16u format.
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LTM4664A
PMBus COMMAND DETAILS
MFR_VOUT_MAX
The MFR_VOUT_MAX command is the maximum output voltage in volts for each channel, including VOUT_OV_FAULT_
LIMIT. If the output voltages are set to high range (Bit 6 of MFR_PWM_CONFIG set to a 0) MFR_VOUT_MAX is 3.6V. If
the output voltage is set to low range (Bit 6 of MFR_PWM_CONFIG set to a 1) the MFR_VOUT_MAX is 2.75V. Entering
a VOUT_COMMAND value greater than this will result in a CML fault and the output voltage setting will be clamped to
the maximum level. This will also result in Bit 3 VOUT_MAX_Warning in the STATUS_VOUT command being set. The
maximum value to program is 1.8V and maximum operating is 1.5V.
This read only command has 2 data bytes and is formatted in Linear_16u format.
OUTPUT CURRENT AND LIMITS
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
DEFAULT
VALUE
R Word
Y
L11
mΩ
Y
0.375
0xD018
Y
3900
0x0F3C
MFR_IOUT_CAL_GAIN
0xDA
The ratio of the voltage at the current
sense pins to the sensed current. For
devices using a fixed current sense
resistor, it is the resistance value in
mΩ.
MFR_IOUT_CAL_GAIN_TC
0xF6
Temperature coefficient of the current R/W Word
sensing element.
Y
CF
IOUT_OC_FAULT_LIMIT
0x46
Output overcurrent fault limit.
R/W Word
Y
L11
A
Y
45.0
0xE2D0
IOUT_OC_WARN_LIMIT
0x4A
Output overcurrent warning limit.
R/W Word
Y
L11
A
Y
34.0
0xE230
MFR_IOUT_CAL_GAIN
The MFR_IOUT_CAL_GAIN command is used to set the resistance value of the current sense resistor in milliohms.
(see also MFR_IOUT_CAL_GAIN_TC).
This command has two data bytes and is formatted in Linear_5s_11s format.
MFR_IOUT_CAL_GAIN_TC
The MFR_IOUT_CAL_GAIN_TC command allows the user to program the temperature coefficient of the IOUT_CAL_
GAIN sense resistor or inductor DCR in ppm/°C.
This command has two data bytes and is formatted in 16-bit 2’s complement integer ppm. N = –32768 to 32767 •
10–6. Nominal temperature is 27°C. The MFR_IOUT_CAL_GAIN is multiplied by:
[1.0 + MFR_IOUT_CAL_GAIN_TC • (READ_TEMPERATURE_1‑27)].
DCR sensing will have a typical value of 3900.
The MFR_IOUT_CAL_GAIN and MFR_IOUT_CAL_GAIN_TC impact all current parameters including: READ_IOUT,
MFR_IOUT_PEAK, IOUT_OC_FAULT_LIMIT and IOUT_OC_WARN_LIMIT.
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LTM4664A
PMBus COMMAND DETAILS
IOUT_OC_FAULT_LIMIT
The IOUT_OC_FAULT_LIMIT command sets the value of the peak output current limit, in Amperes. When the controller
is in current limit, the overcurrent detector will indicate an overcurrent fault condition. The following table lists the
progammable peak output current limit value in mV between ISENSE+ and ISENSE–. The actual value of current limit is
(ISENSE+ – ISENSE–)/MFR_IOUT_CAL_GAIN in Amperes.
MFR_PWM_MODE[7] = 1b,
High Current Range (mV)
ILPEAK (A)
IOUT (A)
MFR_PWM_MODE[7] = 0b,
Use ILIM Low Range Low
Current Range (mV)
ILPEAK (A)
IOUT (A)
18.86
Not Needed
Not Needed
10.48
29.9
23.9
20.42
Not Needed
Not Needed
11.34
32.4
26.4
21.14
Not Needed
Not Needed
11.74*
33.54
27.54
22.27
Not Needed
Not Needed
12.37
35.3
29.3
23.41
Not Needed
Not Needed
13.01**
37.1
31.1
24.55
Not Needed
Not Needed
13.64
38.9
32.9
25.68
Not Needed
Not Needed
14.27
40.8
34.8
26.82
Not Needed
Not Needed
14.90
42.6
36.6
* = Recommended for 25A Current Limit Plus Some Headroom
** = Recommended for 30A Current Limit Plus Some Headroom for Up to 1.2V Output
Note: This is the peak of the current waveform. The READ_IOUT command returns the average current. The peak output
current limits are adjusted with temperature based on the MFR_IOUT_CAL_GAIN_TC using the equation:
Peak Current Limit = MFR_IOUT_CAL_GAIN • (1 + MFR_IOUT_CAL_GAIN_TC • (READ_TEMPERTURE_1-27.0)).
The LTM4664A automatically converts currents to the appropriate internal bit value.
The IOUT range is set with bit 7 of the MFR_PWM_MODE command.
The IOUT_OC_FAULT_LIMIT is ignored during TON_RISE and TOFF_FALL.
If the IOUT_OC_FAULT_LIMIT is exceeded, the device:
• Sets the IOUT bit in the STATUS word
• Sets the IOUT Overcurrent fault bit in the STATUS_IOUT
• Notifies the host by asserting ALERT, unless masked
This command has two data bytes and is formatted in Linear_5s_11s format.
**MFR_PWM_MODE[7]=1 is the high current range for ultra low DCR sensing. This range should be used since these
current threshold values are too large for the LTM4664A.
*Recommended for 35% up above 25A current limit
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103
LTM4664A
PMBus COMMAND DETAILS
IOUT_OC_WARN_LIMIT
This command sets the value of the output current measured by the ADC that causes an output overcurrent warning
in Amperes. The READ_IOUT value will be used to determine if this limit has been exceeded.
In response to the IOUT_OC_WARN_LIMIT being exceeded, the device:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Sets the IOUT bit in the STATUS_WORD
• Sets the IOUT Overcurrent Warning bit in the STATUS_IOUT command, and
• Notifies the host by asserting ALERT pin, unless masked
The IOUT_OC_FAULT_LIMIT is ignored during TON_RISE and TOFF_FALL.
This command has two data bytes and is formatted in Linear_5s_11s format
Input Current and Limits
COMMAND NAME
MFR_IIN_CAL_GAIN
CMD
CODE DESCRIPTION
0xE8 The resistance value of the input current sense
element in mΩ.
TYPE
R/W Word
DATA
FORMAT
L11
UNITS
mΩ
NVM
Y
DEFAULT
VALUE
2
0xC200
MFR_IIN_CAL_GAIN
The MFR_IIN_CAL_GAIN command is used to set the resistance value of the input current sense resistor in milliohms.
(see also READ_IIN).
This command has two data bytes and is formatted in Linear_5s_11s format.
COMMAND NAME
IIN_OC_WARN_LIMIT
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
R/W Word
N
L11
A
Y
CMD CODE DESCRIPTION
0x5D
Input overcurrent warning
limit.
DEFAULT
VALUE
10.0
0xD280
IIN_OC_WARN_LIMIT
The IIN_OC_WARN_LIMIT command sets the value of the input current measured by the ADC, in amperes, that causes
a warning indicating the input current is high. The READ_IIN value will be used to determine if this limit has been
exceeded.
In response to the IIN_OC_WARN_LIMIT being exceeded, the device:
• Sets the OTHER bit in the STATUS_BYTE
• Sets the INPUT bit in the upper byte of the STATUS_WORD
• Sets the IIN Overcurrent Warning bit[1] in the STATUS_INPUT command, and
• Notifies the host by asserting ALERT pin
This command has two data bytes and is formatted in Linear_5s_11s format.
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LTM4664A
PMBus COMMAND DETAILS
TEMPERATURE
External Temperature Calibration
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
PAGED
DATA
DEFAULT
FORMAT UNITS NVM VALUE
MFR_TEMP_1_GAIN
0xF8
Sets the slope of the external temperature
sensor.
R/W Word
Y
CF
MFR_TEMP_1_OFFSET
0xF9
Sets the offset of the external temperature
sensor.
R/W Word
Y
L11
C
Y
0.995
0x3FAE
Y
0.0
0x8000
MFR_TEMP_1_GAIN
The MFR_TEMP_1_GAIN command will modify the slope of the external temperature sensor to account for nonidealities
in the element and errors associated with the remote sensing of the temperature in the inductor.
This command has two data bytes and is formatted in 16-bit 2’s complement integer. The effective gain adjustment is
N • 2–14. The nominal value is 1.
MFR_TEMP_1_OFFSET
The MFR_TEMP_1_OFFSET command will modify the offset of the external temperature sensor to account for nonidealities in the element and errors associated with the remote sensing of the temperature in the inductor.
This command has two data bytes and is formatted in Linear_5s_11s format.
External Temperature Limits
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
DEFAULT
VALUE
OT_FAULT_LIMIT
0x4F
Power stage overtemperature fault
limit.
R/W Word
Y
L11
C
Y
128
0xF200
OT_WARN_LIMIT
0x51
Power stage overtemperature
warning limit.
R/W Word
Y
L11
C
Y
125
0xEBE8
UT_FAULT_LIMIT
0x53
Power stage undertemperature fault
limit.
R/W Word
Y
L11
C
Y
–45
0xE530
OT_FAULT_LIMIT
The OT_FAULT_LIMIT command sets the value of the external sense temperature measured by the ADC, in degrees
Celsius, which causes an overtemperature fault. The READ_TEMPERATURE_1 value will be used to determine if this
limit has been exceeded.
This command has two data bytes and is formatted in Linear_5s_11s format.
OT_WARN_LIMIT
The OT_WARN_LIMIT command sets the value of the external sense temperature measured by the ADC, in degrees
Celsius, which causes an overtemperature warning. The READ_TEMPERATURE_1 value will be used to determine if
this limit has been exceeded.
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LTM4664A
PMBus COMMAND DETAILS
In response to the OT_WARN_LIMIT being exceeded, the device:
• Sets the TEMPERATURE bit in the STATUS_BYTE
• Sets the Overtemperature Warning bit in the STATUS_TEMPERATURE command, and
• Notifies the host by asserting ALERT pin, unless masked
This command has two data bytes and is formatted in Linear_5s_11s format.
UT_FAULT_LIMIT
The UT_FAULT_LIMIT command sets the value of the power stage sense temperature measured by the ADC, in degrees Celsius,
which causes an undertemperature fault. The READ_TEMPERATURE_1 value will be used to determine if this limit has been
exceeded.
Note: If the temp sensors are not installed, the UT_FAULT_LIMIT can be set to –275°C and UT_FAULT_LIMIT response
set to ignore to avoid ALERT being asserted.
This command has two data bytes and is formatted in Linear_5s_11s format.
TIMING
Timing—On Sequence/Ramp
COMMAND NAME
TON_DELAY
CMD CODE DESCRIPTION
0x60
Time from RUN and/or Operation on to
output rail turn-on.
TON_RISE
0x61
Time from when the output starts to
rise until the output voltage reaches the
VOUT commanded value.
TON_MAX_FAULT_LIMIT
0x62
Maximum time from the start of
TON_RISE for VOUT to cross the
VOUT_UV_FAULT_LIMIT.
VOUT_TRANSITION_RATE
0x27
Rate the output changes when VOUT
commanded to a new value.
TYPE
PAGED
R/W Word
Y
DATA
FORMAT
L11
UNITS
ms
NVM
Y
DEFAULT
VALUE
0.0
0x8000
3
0xC300
R/W Word
Y
L11
ms
Y
R/W Word
Y
L11
ms
Y
5
0xCA80
R/W Word
Y
L11
V/ms
Y
0.001
0x8042
TON_DELAY
The TON_DELAY command sets the time, in milliseconds, from when a start condition is received until the output
voltage starts to rise. Values from 0ms to 83 seconds are valid. The resulting turn-on delay will have a typical delay of
270µs for TON_DELAY = 0 and an uncertainty of ±50µs for all values of TON_DELAY.
This command has two data bytes and is formatted in Linear_5s_11s format.
TON_RISE
The TON_RISE command sets the time, in milliseconds, from the time the output starts to rise to the time the output
enters the regulation band. Values from 0 to 1.3 seconds are valid. The part will be in discontinuous mode during
TON_RISE events. If TON_RISE is less than 0.25ms, the LTM4664A digital slope will be bypassed and the output voltage
transition will only be controlled by the analog performance of the PWM switcher. The number of steps in TON_RISE
is equal to TON_RISE (in ms)/0.1ms with an uncertainty of ±0.1ms.
This command has two data bytes and is formatted in Linear_5s_11s format.
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PMBus COMMAND DETAILS
TON_MAX_FAULT_LIMIT
The TON_MAX_FAULT_LIMIT command sets the value, in milliseconds, on how long the unit can attempt to power
up the output without reaching the output undervoltage fault limit.
A data value of 0ms means that there is no limit and that the unit can attempt to bring up the output voltage indefinitely.
The maximum limit is 83 seconds.
This command has two data bytes and is formatted in Linear_5s_11s format.
VOUT_TRANSITION_RATE
When a PMBus device receives either a VOUT_COMMAND or OPERATION (Margin High, Margin Low) that causes the
output voltage to change this command set the rate in V/ms at which the output voltage changes. The commanded
rate of change does not apply when the unit is commanded on or off. The maximum allowed slope is 4V/ms.
This command has two data bytes and is formatted in Linear_5s_11s format.
Timing—Off Sequence/Ramp
COMMAND NAME
TOFF_DELAY
TOFF_FALL
TOFF_MAX_WARN_LIMIT
CMD CODE DESCRIPTION
TYPE
0x64
Time from RUN and/or Operation off to
R/W Word
the start of TOFF_FALL ramp.
Time from when the output starts to fall R/W Word
0x65
until the output reaches zero volts.
Maximum allowed time, after TOFF_FALL R/W Word
0x66
completed, for the unit to decay below
12.5%.
PAGED
Y
DATA
FORMAT
L11
UNITS
ms
NVM
Y
Y
L11
ms
Y
Y
L11
ms
Y
DEFAULT
VALUE
0.0
0x8000
3
0xC300
0
0x8000
TOFF_DELAY
The TOFF_DELAY command sets the time, in milliseconds, from when a stop condition is received until the output
voltage starts to fall. Values from 0 to 83 seconds are valid. The resulting turn off delay will have a typical delay of
270µs for TOFF_DELAY = 0 and an uncertainty of ±50µs for all values of TOFF_DELAY. TOFF_DELAY is not applied
when a fault event occurs
This command has two data bytes and is formatted in Linear_5s_11s format.
TOFF_FALL
The TOFF_FALL command sets the time, in milliseconds, from the end of the turn-off delay time until the output voltage
is commanded to zero. It is the ramp time of the VOUT DAC. When the VOUT DAC is zero, the PWM output will be set
to high impedance state.
The part will maintain the mode of operation programmed. For defined TOFF_FALL times, the user should set the part
to continuous conduction mode. Loading the max value indicates the part will ramp down at the slowest possible rate.
The minimum supported fall time is 0.25ms. A value less than 0.25ms will result in a 0.25ms ramp. The maximum
fall time is 1.3 seconds. The number of steps in TOFF_FALL is equal to TOFF_FALL (in ms)/0.1ms with an uncertainty
of ±0.1ms.
In discontinuous conduction mode, the controller will not draw current from the load and the fall time will be set by
the output capacitance and load current.
This command has two data bytes and is formatted in Linear_5s_11s format.
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LTM4664A
PMBus COMMAND DETAILS
TOFF_MAX_WARN_LIMIT
The TOFF_MAX_WARN_LIMIT command sets the value, in milliseconds, on how long the output voltage exceeds
12.5% of the programmed voltage before a warning is asserted. The output is considered off when the VOUT voltage
is less than 12.5% of the programmed VOUT_COMMAND value. The calculation begins after TOFF_FALL is complete.
A data value of 0ms means that there is no limit and that the output voltage exceeds 12.5% of the programmed voltage
indefinitely. Other than 0, values from 120ms to 524 seconds are valid.
This command has two data bytes and is formatted in Linear_5s_11s format.
Precondition for Restart
COMMAND NAME
CMD CODE DESCRIPTION
MFR_RESTART_ DELAY
0xDC
Minimum time the RUN pin is held
low by the LTM4664A.
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
R/W Word
Y
L11
ms
Y
DEFAULT
VALUE
150
0xF258
MFR_RESTART_DELAY
This command specifies the minimum RUN off time in milliseconds. This device will pull the RUN pin low for this length
of time once a falling edge of RUN has been detected. The minimum recommended value is 136ms.
Note: The restart delay is different than the retry delay. The restart delay pulls RUN low for the specified time, after
which a standard start-up sequence is initiated. The minimum restart delay should be equal to TOFF_DELAY + TOFF_
FALL + 136ms. Valid values are from 136ms to 65.52 seconds in 16ms increments. To assure a minimum off time,
set the MFR_RESTART_DELAY 16ms longer than the desired time. The output rail can be off longer than the MFR_
RESTART_DELAY after the RUN pin is pulled high if the output decay bit 0 is enabled in MFR_CHAN_CONFIG and the
output takes a long time to decay below 12.5% of the programmed value.
This command has two data bytes and is formatted in Linear_5s_11s format.
FAULT RESPONSE
Fault Responses All Faults
COMMAND NAME
MFR_RETRY_ DELAY
CMD CODE DESCRIPTION
0xDB
Retry interval during FAULT retry
mode.
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
R/W Word
Y
L11
ms
Y
DEFAULT
VALUE
250
0xF3E8
MFR_RETRY_DELAY
This command sets the time in milliseconds between retries if the fault response is to retry the controller at specified
intervals. This command value is used for all fault responses that require retry. The retry time starts once the fault has
been detected by the offending channel. Valid values are from 120ms to 83.88 seconds in 10µs increments.
Note: The retry delay time is determined by the longer of the MFR_RETRY_DELAY command or the time required
for the regulated output to decay below 12.5% of the programmed value. If the natural decay time of the output is
too long, it is possible to remove the voltage requirement of the MFR_RETRY_DELAY command by asserting bit 0 of
MFR_CHAN_CONFIG.
This command has two data bytes and is formatted in Linear_5s_11s format.
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LTM4664A
PMBus COMMAND DETAILS
Fault Responses Input Voltage
COMMAND NAME
VIN_OV_FAULT_RESPONSE
CMD CODE DESCRIPTION
0x56
Action to be taken by the device when an
input supply overvoltage fault is detected.
TYPE
R/W Byte
DATA
PAGED FORMAT
Y
UNITS
Reg
NVM
DEFAULT
VALUE
Y
0x80
VIN_OV_FAULT_RESPONSE
The VIN_OV_FAULT_RESPONSE command instructs the device on what action to take in response to an input overvoltage fault. The data byte is in the format given in Table 17.
The device also:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Set the INPUT bit in the upper byte of the STATUS_WORD
• Sets the VIN Overvoltage Fault bit in the STATUS_INPUT command, and
• Notifies the host by asserting ALERT pin, unless masked
This command has one data byte.
Fault Responses Output Voltage
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
DEFAULT
VALUE
VOUT_OV_FAULT_RESPONSE
0x41
Action to be taken by the device when an
output overvoltage fault is detected.
R/W Byte
Y
Reg
Y
0xB8
VOUT_UV_FAULT_RESPONSE
0x45
Action to be taken by the device when an
output undervoltage fault is detected.
R/W Byte
Y
Reg
Y
0xB8
TON_MAX_FAULT_
RESPONSE
0x63
Action to be taken by the device when a
TON_MAX_FAULT event is detected.
R/W Byte
Y
Reg
Y
0xB8
VOUT_OV_FAULT_RESPONSE
The VOUT_OV_FAULT_RESPONSE command instructs the device on what action to take in response to an output
overvoltage fault. The data byte is in the format given in Table 13.
The device also:
• Sets the VOUT_OV bit in the STATUS_BYTE
• Sets the VOUT bit in the STATUS_WORD
• Sets the VOUT Overvoltage Fault bit in the STATUS_VOUT command
• Notifies the host by asserting ALERT pin, unless masked
The only values recognized for this command are:
0x00–Part performs OV pull down only, or OV_PULLDOWN.
0x80–The device shuts down (disables the output) and the unit does not attempt to retry. (PMBus, Part II, Section 10.7).
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LTM4664A
PMBus COMMAND DETAILS
0xB8–The device shuts down (disables the output) and device attempts to retry continuously, without limitation, until
it is commanded OFF (by the RUN pin or OPERATION command or both), bias power is removed, or another fault
condition causes the unit to shut down.
0x4n The device shuts down and the unit does not attempt to retry. The output remains disabled until the part is commanded OFF then ON or the RUN pin is asserted low then high or RESET through the command or removal of VIN.
The OV fault must remain active for a period of n • 10µs, where n is a value from 0 to 7.
0x78+n The device shuts down and the unit attempts to retry continuously until either the fault condition is cleared
or the part is commanded OFF then ON or the RUN pin is asserted low then high or RESET through the command or
removal of VIN. The OV fault must remain active for a period of n • 10µs, where n is a value from 0 to 7.
Any other value will result in a CML fault and the write will be ignored.
This command has one data byte.
Table 14. VOUT_OV_FAULT_RESPONSE Data Byte Contents
BITS
7:6
DESCRIPTION
Response
VALUE
00
For all values of bits [7:6], the LTM4664A:
• Sets the corresponding fault bit in the status commands and
• Notifies the host by asserting ALERT pin, unless masked.
01
The fault bit, once set, is cleared only when one or more of the
following events occurs:
• The device receives a CLEAR_FAULTS command.
• The output is commanded through the RUN pin, the OPERATION
command, or the combined action of the RUN pin and
OPERATION command, to turn off and then to turn back on, or
5:3
• Bias power is removed and reapplied to the LTM4664A.
Retry Setting
2:0
Delay Time
10
11
MEANING
Part performs OV pull down only or OV_PULLDOWN
(i.e., turns off the top MOSFET and turns on lower MOSFET
while VOUT is > VOUT_OV_FAULT).
The PMBus device continues operation for the delay time
specified by bits [2:0] and the delay time unit specified for that
particular fault. If the fault condition is still present at the end of
the delay time, the unit responds as programmed in the Retry
Setting (bits [5:3]).
The device shuts down immediately (disables the output) and
responds according to the retry setting in bits [5:3].
Not supported. Writing this value will generate a CML fault.
000
The unit does not attempt to restart. The output remains
disabled until the fault is cleared until the device is commanded
OFF bias power is removed.
111
The PMBus device attempts to restart continuously, without
limitation, until it is commanded OFF (by the RUN pin or
OPERATION command or both), bias power is removed, or
another fault condition causes the unit to shut down without
retry. Note: The retry interval is set by the MFR_RETRY_DELAY
command.
000-111 The delay time in 10µs increments. This delay time determines
how long the controller continues operating after a fault is
detected. Only valid for deglitched off state.
VOUT_UV_FAULT_RESPONSE
The VOUT_UV_FAULT_RESPONSE command instructs the device on what action to take in response to an output
undervoltage fault. The data byte is in the format given in Table 8.
The device also:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Sets the VOUT bit in the STATUS_WORD
• Sets the VOUT undervoltage fault bit in the STATUS_VOUT command
• Notifies the host by asserting ALERT pin, unless masked
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LTM4664A
PMBus COMMAND DETAILS
The UV fault and warn are masked until the following criteria are achieved:
1) The TON_MAX_FAULT_LIMIT has been reached
2) The TON_DELAY sequence has completed
3) The TON_RISE sequence has completed
4) The VOUT_UV_FAULT_LIMIT threshold has been reached
5) The IOUT_OC_FAULT_LIMIT is not present
The UV fault and warn are masked whenever the channel is not active.
The UV fault and warn are masked during TON_RISE and TOFF_FALL sequencing.
This command has one data byte.
Table 15. VOUT_UV_FAULT_RESPONSE Data Byte Contents
BITS
7:6
DESCRIPTION
VALUE
Response
MEANING
00
The PMBus device continues operation without interruption.
(Ignores the fault functionally)
01
The PMBus device continues operation for the delay time
specified by bits [2:0] and the delay time unit specified for
that particular fault. If the fault condition is still present at the
end of the delay time, the unit responds as programmed in the
Retry Setting (bits [5:3]).
• The device receives a CLEAR_FAULTS command.
10
• The output is commanded through the RUN pin, the OPERATION
command, or the combined action of the RUN pin and
OPERATION command, to turn off and then to turn back on, or
The device shuts down (disables the output) and responds
according to the retry setting in bits [5:3].
11
Not supported. Writing this value will generate a CML fault.
000
The unit does not attempt to restart. The output remains
disabled until the fault is cleared until the device is commanded
OFF bias power is removed.
111
The PMBus device attempts to restart continuously, without
limitation, until it is commanded OFF (by the RUN pin or
OPERATION command or both), bias power is removed, or
another fault condition causes the unit to shut down without
retry. Note: The retry interval is set by the MFR_RETRY_DELAY
command.
For all values of bits [7:6], the LTM4664A:
• Sets the corresponding fault bit in the status commands and
• Notifies the host by asserting ALERT pin, unless masked.
The fault bit, once set, is cleared only when one or more of the
following events occurs:
• The device receives a RESTORE_USER_ALL command.
• The device receives a MFR_RESET command.
• The device supply power is cycled.
5:3
2:0
Retry Setting
Delay Time
000-111 The delay time in 10µs increments. This delay time determines
how long the controller continues operating after a fault is
detected. Only valid for deglitched off state.
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LTM4664A
PMBus COMMAND DETAILS
TON_MAX_FAULT_RESPONSE
The TON_MAX_FAULT_RESPONSE command instructs the device on what action to take in response to a TON_MAX
fault. The data byte is in the format given in Table 13.
The device also:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Sets the VOUT bit in the STATUS_WORD
• Sets the TON_MAX_FAULT bit in the STATUS_VOUT command, and
• Notifies the host by asserting ALERT pin, unless masked
A value of 0 disables the TON_MAX_FAULT_RESPONSE. It is not recommended to use 0.
Note: The PWM channel remains in discontinues mode until the TON_MAX_FAULT_LIMIT has been exceeded.
This command has one data byte.
Fault Responses Output Current
COMMAND NAME
IOUT_OC_FAULT_RESPONSE
CMD CODE DESCRIPTION
0x47
Action to be taken by the device when an
output overcurrent fault is detected.
TYPE
PAGED
DATA
FORMAT
R/W Byte
Y
Reg
UNITS
NVM
DEFAULT
VALUE
Y
0x00
IOUT_OC_FAULT_RESPONSE
The IOUT_OC_FAULT_RESPONSE command instructs the device on what action to take in response to an output
overcurrent fault. The data byte is in the format given in Table 9.
The device also:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Sets the IOUT_OC bit in the STATUS_BYTE
• Sets the IOUT bit in the STATUS_WORD
• Sets the IOUT Overcurrent Fault bit in the STATUS_IOUT command, and
• Notifies the host by asserting ALERT pin, unless masked
This command has one data byte.
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PMBus COMMAND DETAILS
Table 16. IOUT_OC_FAULT_RESPONSE Data Byte Contents
BITS
7:6
DESCRIPTION
VALUE
Response
00
The LTM4664A PSM continues to operate indefinitely while
maintaining the output current at the value set by
IOUT_OC_FAULT_LIMIT without regard to the output
voltage (known as constant-current or brick-wall limiting).
01
Not supported.
10
The LTM4664A PSM continues to operate, maintaining the
output current at the value set by IOUT_OC_FAULT_LIMIT
without regard to the output voltage, for the delay time set by
bits [2:0]. If the device is still operating in current limit at the
end of the delay time, the device responds as programmed by
the Retry Setting in bits [5:3].
11
The LTM4664A PSM shuts down immediately and responds as
programmed by the Retry Setting in bits [5:3].
000
The unit does not attempt to restart. The output remains
disabled until the fault is cleared by cycling the RUN pin or
removing bias power.
111
The device attempts to restart continuously, without limitation,
until it is commanded OFF (by the RUN pin or OPERATION
command or both), bias power is removed, or another fault
condition causes the unit to shut down. Note: The retry interval
is set by the MFR_RETRY_DELAY command.
For all values of bits [7:6], the LTM4664A:
• Sets the corresponding fault bit in the status commands and
• Notifies the host by asserting ALERT pin, unless masked.
The fault bit, once set, is cleared only when one or more of the
following events occurs:
• The device receives a CLEAR_FAULTS command.
• The output is commanded through the RUN pin, the OPERATION
command, or the combined action of the RUN pin and
OPERATION command, to turn off and then to turn back on, or
• The device receives a RESTORE_USER_ALL command.
MEANING
• The device receives a MFR_RESET command.
• The device supply power is cycled.
5:3
2:0
Retry Setting
Delay Time
000-111 The number of delay time units in 16ms increments. This
delay time is used to determine the amount of time a unit is
to continue operating after a fault is detected before shutting
down. Only valid for deglitched off response.
Fault Responses IC Temperature
COMMAND NAME
MFR_OT_FAULT_RESPONSE
CMD CODE DESCRIPTION
0xD6
Action to be taken by the device when an
internal overtemperature fault is detected.
TYPE
PAGED
DATA
FORMAT
R Byte
N
Reg
UNITS
NVM
DEFAULT
VALUE
0xC0
MFR_OT_FAULT_RESPONSE
The MFR_OT_FAULT_RESPONSE command byte instructs the device on what action to take in response to an internal
overtemperature fault. The data byte is in the format given in Table 12.
The LTM4664A also:
• Sets the NONE_OF_THE_ABOVE bit in the STATUS_BYTE
• Sets the MFR bit in the STATUS_WORD, and
• Sets the Overtemperature Fault bit in the STATUS_MFR_SPECIFIC command
• Notifies the host by asserting ALERT pin, unless masked
This command has one data byte.
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LTM4664A
PMBus COMMAND DETAILS
Table 17. Data Byte Contents MFR_OT_FAULT_RESPONSE
BITS
7:6
DESCRIPTION
VALUE
MEANING
Response
00
Not supported. Writing this value will generate a CML fault.
For all values of bits [7:6], the LTM4664A:
01
Not supported. Writing this value will generate a CML fault
• Sets the corresponding fault bit in the status commands and
10
The device shuts down immediately (disables the output) and
responds according to the retry setting in bits [5:3].
11
The device’s output is disabled while the fault is present.
Operation resumes and the output is enabled when the fault
condition no longer exists.
000
The unit does not attempt to restart. The output remains
disabled until the fault is cleared.
• Notifies the host by asserting ALERT pin, unless masked.
The fault bit, once set, is cleared only when one or more of the
following events occurs:
• The device receives a CLEAR_FAULTS command.
• The output is commanded through the RUN pin, the OPERATION
command, or the combined action of the RUN pin and
OPERATION command, to turn off and then to turn back on, or
• Bias power is removed and reapplied to the LTM4664A.
5:3
Retry Setting
001-111 Not supported. Writing this value will generate CML fault.
2:0
Delay Time
XXX
Not supported. Value ignored
Fault Responses External Temperature
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
PAGED
DATA
FORMAT
UNITS
NVM
DEFAULT
VALUE
OT_FAULT_ RESPONSE
0x50
Action to be taken by the device when an
external overtemperature fault is detected,
R/W Byte
Y
Reg
Y
0xB8
UT_FAULT_ RESPONSE
0x54
Action to be taken by the device when an
external undertemperature fault is detected.
R/W Byte
Y
Reg
Y
0xB8
OT_FAULT_RESPONSE
The OT_FAULT_RESPONSE command instructs the device on what action to take in response to an external overtemperature fault on the external temp sensors. The data byte is in the format given in Table 8.
The device also:
• Sets the TEMPERATURE bit in the STATUS_BYTE
• Sets the Overtemperature Fault bit in the STATUS_TEMPERATURE command, and
• Notifies the host by asserting ALERT pin, unless masked
This command has one data byte.
UT_FAULT_RESPONSE
The UT_FAULT_RESPONSE command instructs the device on what action to take in response to an external undertemperature fault on the external temp sensors. The data byte is in the format given in Table 13.
The device also:
• Sets the TEMPERATURE bit in the STATUS_BYTE
• Sets the Undertemperature Fault bit in the STATUS_TEMPERATURE command, and
• Notifies the host by asserting ALERT pin, unless masked
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LTM4664A
PMBus COMMAND DETAILS
This condition is detected by the ADC so the response time may be up to tCONVERT.
This command has one data byte.
Table 18. Data Byte Contents: TON_MAX_FAULT_RESPONSE, VIN_OV_FAULT_RESPONSE,
OT_FAULT_RESPONSE, UT_FAULT_RESPONSE
BITS
7:6
DESCRIPTION
VALUE
MEANING
Response
00
The PMBus device continues operation without interruption.
For all values of bits [7:6], the LTM4664A:
01
Not supported. Writing this value will generate a CML fault.
• Sets the corresponding fault bit in the status commands, and
10
The device shuts down immediately (disables the output) and
responds according to the retry setting in bits [5:3].
11
Not supported. Writing this value will generate a CML fault.
000
The unit does not attempt to restart. The output remains
disabled until the fault is cleared until the device is commanded
OFF bias power is removed.
111
The PMBus device attempts to restart continuously, without
limitation, until it is commanded OFF (by the RUN pin or
OPERATION command or both), bias power is removed, or
another fault condition causes the unit to shut down without
retry. Note: The retry interval is set by the MFR_RETRY_DELAY
command.
XXX
Not supported. Values ignored
• Notifies the host by asserting ALERT pin, unless masked.
The fault bit, once set, is cleared only when one or more of the
following events occurs:
• The device receives a CLEAR_FAULTS command.
• The output is commanded through the RUN pin, the OPERATION
command, or the combined action of the RUN pin and
OPERATION command, to turn off and then to turn back on, or
• The device receives a RESTORE_USER_ALL command.
• The device receives a MFR_RESET command.
• The device supply power is cycled.
5:3
2:0
Retry Setting
Delay Time
FAULT SHARING
Fault Sharing Propagation
COMMAND NAME
MFR_FAULT_
PROPAGATE
CMD CODE
0xD2
DESCRIPTION
Configuration that determines which faults
are propagated to the FAULT pins.
TYPE
PAGED
DATA
FORMAT
R/W Word
Y
Reg
UNITS
NVM
DEFAULT
VALUE
Y
0x6993
MFR_FAULT_PROPAGATE
The MFR_FAULT_PROPAGATE command enables the faults that can cause the FAULTn pin to assert low. The command is formatted as shown in Table 15. Faults can only be propagated to the FAULTn pin if they are programmed to
respond to faults.
This command has two data bytes.
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LTM4664A
PMBus COMMAND DETAILS
Table 19. FAULTn Propagate Fault Configuration
The FAULT0 and FAULT1 pins are designed to provide electrical notification of selected events to the user. Some of these events are common to both output
channels. Others are specific to an output channel. They can also be used to share faults between channels.
BIT(S)
B[15]
SYMBOL
VOUT disabled while not decayed.
B[14]
Mfr_fault_propagate_short_CMD_cycle
OPERATION
This is used in a PolyPhase configuration when bit 0 of the MFR_CHAN_CONFIG is a zero. If the
channel is turned off, by toggling the RUN pin or commanding the part OFF, and then the RUN
is reasserted or the part is commanded back on before the output has decayed, VOUT will not
restart until the 12.5% decay is honored. The FAULT pin is asserted during this condition if bit 15
is asserted.
0: No action
Mfr_fault_propagate_ton_max_fault
1: Asserts low if commanded off then on before the output has sequenced off. Re-asserts high
tOFF(MIN) after sequence off.
0: No action if a TON_MAX_FAULT fault is asserted
b[13]
1: Associated output will be asserted low if a TON_MAX_FAULT fault is asserted
FAULT0 is associated with page 0 TON_MAX_FAULT faults
FAULT1 is associated with page 1 TON_MAX_FAULT faults
b[12]
b[11]
Reserved
Mfr_fault0_propagate_int_ot,
b[10]
b[9]
b[8]
Mfr_fault1_propagate_int_ot
Reserved
Reserved
Mfr_fault0_propagate_ut,
0: No action if the UT_FAULT_LIMIT fault is asserted
Mfr_fault1_propagate_ut
1: Associated output will be asserted low if the UT_FAULT_LIMIT fault is asserted
0: No action if the MFR_OT_FAULT_LIMIT fault is asserted
1: Associated output will be asserted low if the MFR_OT_FAULT_LIMIT fault is asserted
FAULT0 is associated with page 0 UT faults
b[7]
Mfr_fault0_propagate_ot,
FAULT1 is associated with page 1 UT faults
0: No action if the OT_FAULT_LIMIT fault is asserted
Mfr_fault1_propagate_ot
1: Associated output will be asserted low if the OT_FAULT_LIMIT fault is asserted
FAULT0 is associated with page 0 OT faults
FAULT1 is associated with page 1 OT faults
b[6]
b[5]
b[4]
Reserved
Reserved
Mfr_fault0_propagate_input_ov,
b[3]
b[2]
Mfr_fault1_propagate_input_ov
Reserved
Mfr_fault0_propagate_iout_oc,
0: No action if the IOUT_OC_FAULT_LIMIT fault is asserted
Mfr_fault1_propagate_iout_oc
1: Associated output will be asserted low if the IOUT_OC_FAULT_LIMIT fault is asserted
0: No action if the VIN_OV_FAULT_LIMIT fault is asserted
1: Associated output will be asserted low if the VIN_OV_FAULT_LIMIT fault is asserted
FAULT0 is associated with page 0 OC faults
b[1]
Mfr_fault0_propagate_vout_uv,
FAULT1 is associated with page 1 OC faults
0: No action if the VOUT_UV_FAULT_LIMIT fault is asserted
Mfr_fault1_propagate_vout_uv
1: Associated output will be asserted low if the VOUT_UV_FAULT_LIMIT fault is asserted
FAULT0 is associated with page 0 UV faults
b[0]
Mfr_fault0_propagate_vout_ov,
FAULT1 is associated with page 1 UV faults
0: No action if the VOUT_OV_FAULT_LIMIT fault is asserted
Mfr_fault1_propagate_vout_ov
1: Associated output will be asserted low if the VOUT_OV_FAULT_LIMIT fault is asserted
FAULT0 is associated with page 0 OV faults
FAULT1 is associated with page 1 OV faults
116
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LTM4664A
PMBus COMMAND DETAILS
Fault Sharing Response
COMMAND NAME
CMD CODE DESCRIPTION
MFR_FAULT_RESPONSE
0xD5
Action to be taken by the device when the
FAULT pin is asserted low.
TYPE
R/W Byte
PAGED
Y
DATA
FORMAT
Reg
UNITS
NVM
Y
DEFAULT
VALUE
0xC0
MFR_FAULT_RESPONSE
The MFR_FAULT_RESPONSE command instructs the device on what action to take in response to the FAULTn pin
being pulled low by an external source.
Supported Values:
VALUE
MEANING
0xC0
FAULT_INHIBIT The LTM4664A will three-state the output in response to the FAULT pin pulled low.
0x00
FAULT_IGNORE The LTM4664A continues operation without interruption.
The device also:
• Sets the MFR Bit in the STATUS_WORD.
• Sets Bit 0 in the STATUS_MFR_SPECIFIC Command to Indicate FAULTn Is Being Pulled Low
• Notifies the Host by Asserting ALERT, Unless Masked
This command has one data byte.
SCRATCHPAD
COMMAND NAME
USER_DATA_00
USER_DATA_01
USER_DATA_02
USER_DATA_03
USER_DATA_04
CMD CODE DESCRIPTION
0xB0
OEM reserved. Typically used for part
serialization.
0xB1
Manufacturer reserved for LTpowerPlay.
0xB2
OEM reserved. Typically used for part
serialization.
0xB3
A NVM word available for the user.
0xB4
A NVM word available for the user.
TYPE
R/W Word
PAGED
N
DATA
FORMAT
Reg
NVM
Y
DEFAULT
VALUE
NA
R/W Word
R/W Word
Y
N
Reg
Reg
Y
Y
NA
NA
R/W Word
R/W Word
Y
N
Reg
Reg
Y
Y
0x0000
0x0000
UNITS
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117
LTM4664A
PMBus COMMAND DETAILS
USER_DATA_00 through USER_DATA_04
These commands are non-volatile memory locations for customer storage. The customer has the option to write any
value to the USER_DATA_nn at any time. However, the LTpowerPlay software and contract manufacturers use some of
these commands for inventory control. Modifying the reserved USER_DATA_nn commands may lead to undesirable
inventory control and incompatibility with these products.
These commands have 2 data bytes and are in register format.
IDENTIFICATION
COMMAND NAME
PMBus_REVISION
CAPABILITY
MFR_ID
MFR_MODEL
MFR_SPECIAL_ID
CMD CODE DESCRIPTION
0x98
PMBus revision supported by this device.
Current revision is 1.2.
0x19
Summary of PMBus optional communication
protocols supported by this device.
0x99
The manufacturer ID of the LTM4664A in ASCII.
0x9A
Manufacturer part number in ASCII.
0xE7
Manufacturer code representing the LTM4664A.
TYPE
R Byte
PAGED
N
DATA
FORMAT
Reg
R Byte
N
Reg
0xB0
R String
R String
R Word
N
N
N
ASC
ASC
Reg
LTC
LTM4664
0x020X
UNITS
NVM
FS
DEFAULT
VALUE
0x22
PMBus_REVISION
The PMBUS_REVISION command indicates the revision of the PMBus to which the device is compliant. The LTM4664A
is PMBus Version 1.2 compliant in both Part I and Part II.
This read-only command has one data byte.
CAPABILITY
This command provides a way for a host system to determine some key capabilities of a PMBus device.
The LTM4664A supports packet error checking, 400kHz bus speeds, and ALERT pin.
This read-only command has one data byte.
MFR_ID
The MFR_ID command indicates the manufacturer ID of the LTM4664A using ASCII characters.
This read-only command is in block format.
MFR_MODEL
The MFR_MODEL command indicates the manufacturer’s part number of the LTM4664A using ASCII characters.
This read-only command is in block format.
MFR_SPECIAL_ID
The 16-bit word representing the part name and revision. 0x4C denotes the part is an LTM4664A, XX is adjustable by
the manufacturer.
This read-only command has two data bytes.
118
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LTM4664A
PMBus COMMAND DETAILS
FAULT WARNING AND STATUS
COMMAND NAME
CLEAR_FAULTS
SMBALERT_MASK
CMD CODE DESCRIPTION
0x03
Clear any fault bits that have been set.
0x1B
Mask activity.
MFR_CLEAR_PEAKS
STATUS_BYTE
0xE3
0x78
STATUS_WORD
0x79
STATUS_VOUT
0x7A
STATUS_IOUT
0x7B
STATUS_INPUT
STATUS_ TEMPERATURE
0x7C
0x7D
STATUS_CML
0x7E
STATUS_MFR_ SPECIFIC
0x80
MFR_PADS
MFR_COMMON
0xE5
0xEF
TYPE
Send Byte
Block R/W
Clears all peak values.
Send Byte
One byte summary of the unit’s fault
R/W Byte
condition.
Two byte summary of the unit’s fault
R/W Word
condition.
Output voltage fault and warning
R/W Byte
status.
Output current fault and warning
R/W Byte
status.
Input supply fault and warning status. R/W Byte
External temperature fault and warning R/W Byte
status for READ_TEMERATURE_1.
Communication and memory fault and R/W Byte
warning status.
Manufacturer specific fault and state
R/W Byte
information.
Digital status of the I/O pads.
R Word
Manufacturer status bits that are
R Byte
common across multiple LTC chips.
Y
Y
Reg
DEFAULT
VALUE
NA
See CMD
Details
NA
NA
Y
Reg
NA
Y
Reg
NA
Y
Reg
NA
N
Y
Reg
Reg
NA
NA
N
Reg
NA
Y
Reg
NA
N
N
Reg
Reg
NA
NA
PAGED
N
Y
FORMAT
Reg
UNITS
NVM
Y
CLEAR_FAULTS
The CLEAR_FAULTS command is used to clear any fault bits that have been set. This command clears all bits in all
status commands simultaneously. At the same time, the device negates (clears, releases) its ALERT pin signal output
if the device is asserting the ALERT pin signal. If the fault is still present when the bit is cleared, the fault bit will remain
set and the host notified by asserting the ALERT pin low. CLEAR_FAULTS can take up to 10µs to process. If a fault
occurs within that time frame it may be cleared before the status register is set.
This write-only command has no data bytes.
The CLEAR_FAULTS does not cause a unit that has latched off for a fault condition to restart. Units that have shut
down for a fault condition are restarted when:
• The output is commanded through the RUN pin, the OPERATION command, or the combined action of the RUN pin
and OPERATION command, to turn off and then to turn back on, or
• MFR_RESET command is issued.
• Bias power is removed and reapplied to the integrated circuit
SMBALERT_MASK
The SMBALERT_MASK command can be used to prevent a particular status bit or bits from asserting ALERT as they
are asserted.
Figure 33 shows an example of the Write Word format used to set an ALERT mask, in this case without PEC. The bits in
the mask byte align with bits in the specified status register. For example, if the STATUS_TEMPERATURE command code
is sent in the first data byte, and the mask byte contains 0x40, then a subsequent External Overtemperature Warning
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119
LTM4664A
PMBus COMMAND DETAILS
would still set bit 6 of STATUS_TEMPERATURE but not assert ALERT. All other supported STATUS_TEMPERATURE
bits would continue to assert ALERT if set.
Figure 50 shows an example of the Block Write – Block Read Process Call protocol used to read back the present state
of any supported status register, again without PEC.
SMBALERT_MASK cannot be applied to STATUS_BYTE, STATUS_WORD, MFR_COMMON or MFR_PADS. Factory
default masking for applicable status registers is shown below. Providing an unsupported command code to SMBALERT_
MASK will generate a CML for Invalid/Unsupported Data.
SMBALERT_MASK Default Setting: (Refer Also to Figure 2)
STATUS RESISTER
ALERT Mask Value MASKED BITS
STATUS_VOUT
STATUS_IOUT
STATUS_TEMPERATURE
STATUS_CML
STATUS_INPUT
STATUS_MFR_SPECIFIC
0x00
0x00
0x00
0x00
0x00
0x11
None
None
None
None
None
Bit 4 (internal PLL unlocked), bit 0 (FAULT pulled low by external device)
1
7
S
SLAVE
ADDRESS
1
1
W
A SMBALERT_MASK A
COMMAND CODE
8
1
8
8
1
1
MASK BYTE
A
P
1
STATUS_x
A
COMMAND CODE
4664A F56
Figure 53. Example of Writing SMBALERT_MASK
1
7
S
SLAVE
ADDRESS
1
1
W
A SMBALERT_MASK A
COMMAND CODE
1
7
Sr
SLAVE
ADDRESS
8
1
R
1
8
1
BLOCK COUNT
(= 1)
A
8
1
STATUS_x
A
COMMAND CODE
1
8
1
8
A
BLOCK COUNT
(= 1)
A
MASK BYTE
1
…
1
NA P
4664A F57
Figure 54. Example of Reading SMBALERT_MASK
MFR_CLEAR_PEAKS
The MFR_CLEAR_PEAKS command clears the MFR_*_PEAK data values. A MFR_RESET command will also clear the
MFR_*_PEAK data values.
This write-only command has no data bytes.
STATUS_BYTE
The STATUS_BYTE command returns one byte of information with a summary of the most critical faults. This is the
lower byte of the status word.
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LTM4664A
PMBus COMMAND DETAILS
STATUS_BYTE Message Contents:
BIT
7*
6
STATUS BIT NAME
BUSY
OFF
5
4
3
2
1
0*
VOUT_OV
IOUT_OC
VIN_UV
TEMPERATURE
CML
NONE OF THE ABOVE
MEANING
A fault was declared because the LTM4664A was unable to respond.
This bit is set if the channel is not providing power to its output, regardless of the reason, including simply not
being enabled.
An output overvoltage fault has occurred.
An output overcurrent fault has occurred.
Not supported (LTM4664A returns 0).
A temperature fault or warning has occurred.
A communications, memory or logic fault has occurred.
A fault Not listed in bits[7:1] has occurred.
*ALERT can be asserted if either of these bits is set. They may be cleared by writing a 1 to their bit position in the STATUS_BYTE, in lieu of a CLEAR_
FAULTS command.
This command has one data byte.
STATUS_WORD
The STATUS_WORD command returns a two-byte summary of the channel's fault condition. The low byte of the
STATUS_WORD is the same as the STATUS_BYTE command.
STATUS_WORD High Byte Message Contents:
BIT
STATUS BIT NAME
MEANING
15
VOUT
An output voltage fault or warning has occurred.
14
IOUT
An output current fault or warning has occurred.
13
INPUT
An input voltage fault or warning has occurred.
12
MFR_SPECIFIC
A fault or warning specific to the LTM4664A has occurred.
11
POWER_GOOD#
The POWER_GOOD state is false if this bit is set.
10
FANS
Not supported (LTM4664A returns 0).
9
OTHER
Not supported (LTM4664A returns 0).
8
UNKNOWN
Not supported (LTM4664A returns 0).
If any of the bits in the upper byte are set, NONE_OF_THE_ABOVE is asserted.
This command has two data bytes.
STATUS_VOUT
The STATUS_VOUT command returns one byte of VOUT status information.
STATUS_VOUT Message Contents:
BIT
7
6
5
4
3
2
1
0
MEANING
VOUT overvoltage fault.
VOUT overvoltage warning.
VOUT undervoltage warning.
VOUT undervoltage fault.
VOUT max warning.
TON max fault.
TOFF max fault.
Not supported (LTM4664A returns 0).
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121
LTM4664A
PMBus COMMAND DETAILS
The user is permitted to write a 1 to any bit in this command to clear a specific fault. This permits the user to clear
status by means other than using the CLEAR_FAULTS command.
Any supported fault bit in this command will initiate an ALERT event.
This command has one data byte.
STATUS_IOUT
The STATUS_IOUT command returns one byte of IOUT status information.
STATUS_IOUT Message Contents:
BIT
MEANING
7
IOUT overcurrent fault.
6
Not supported (LTM4664A returns 0).
5
IOUT overcurrent warning.
4:0
Not supported (LTM4664A returns 0).
The user is permitted to write a 1 to any bit in this command to clear a specific fault. This permits the user to clear
status by means other than using the CLEAR_FAULTS command.
Any supported fault bit in this command will initiate an ALERT event. This command has one data byte.
STATUS_INPUT
The STATUS_INPUT command returns one byte of VIN (VINS3_C1) status information.
STATUS_INPUT Message Contents:
BIT
7
6
5
4
3
2
1
0
MEANING
VIN overvoltage fault.
Not supported (LTM4664A returns 0).
VIN undervoltage warning.
Not supported (LTM4664A returns 0).
Unit off for insufficient VIN.
Not supported (LTM4664A returns 0).
IIN overcurrent warning.
Not supported (LTM4664A returns 0).
The user is permitted to write a 1 to any bit in this command to clear a specific fault. This permits the user to clear
status by means other than using the CLEAR_FAULTS command.
Any supported fault bit in this command will initiate an ALERT event. Bit 3 of this command is not latched and will not
generate an ALERT even if it is set. This command has one data byte.
122
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LTM4664A
PMBus COMMAND DETAILS
STATUS_TEMPERATURE
The STATUS_TEMPERATURE commands returns one byte with status information on temperature. This is a paged
command and is related to the respective READ_TEMPERATURE_1 value.
STATUS_TEMPERATURE Message Contents:
BIT
MEANING
7
External overtemperature fault.
6
External overtemperature warning.
5
Not supported (LTM4664A returns 0).
4
External undertemperature fault.
3:0
Not supported (LTM4664A returns 0).
.
The user is permitted to write a 1 to any bit in this command to clear a specific fault. This permits the user to clear
status by means other than using the CLEAR_FAULTS command.
This command has one data byte.
STATUS_CML
The STATUS_CML command returns one byte of status information on received commands, internal memory and logic.
STATUS_CML Message Contents:
BIT
MEANING
7
Invalid or unsupported command received.
6
Invalid or unsupported data received.
5
Packet error check failed.
4
Memory fault detected.
3
Processor fault detected.
2
Reserved (LTM4664A returns 0).
1
Other communication fault.
0
Other memory or logic fault.
If either bit 3 or bit 4 of this command is set, a serious and significant internal error has been detected. Continued
operation of the part is not recommended if these bits are continuously set.
The user is permitted to write a 1 to any bit in this command to clear a specific fault. This permits the user to clear
status by means other than using the CLEAR_FAULTS command.
Any supported fault bit in this command will initiate an ALERT event.
This command has one data byte.
Rev. 0
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123
LTM4664A
PMBus COMMAND DETAILS
STATUS_MFR_SPECIFIC
The STATUS_MFR_SPECIFIC commands returns one byte with the manufacturer specific status information.
The format for this byte is:
BIT
MEANING
7
Internal Temperature Fault Limit Exceeded.
6
Internal Temperature Warn Limit Exceeded.
5
Factory Trim Area NVM CRC Fault.
4
PLL is Unlocked
3
Fault Log Present
2
VDD33 UV or OV Fault
1
Short-cycle Event Detected
0
FAULT Pin Asserted Low by External Device
If any of these bits are set, the MFR bit in the STATUS_WORD will be set, and ALERT may be asserted.
The user is permitted to write a 1 to any bit in this command to clear a specific fault. This permits the user to clear
status by means other than using the CLEAR_FAULTS command. However, the fault log present bit can only be cleared
by issuing the MFR_FAULT_LOG_CLEAR command.
Any supported fault bit in this command will initiate an ALERT event.
This command has one data byte.
MFR_PADS
This command provides the user a means of directly reading the digital status of the I/O pins of the device. The bit
assignments of this command are as follows:
BIT
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
ASSIGNED DIGITAL PIN
VDD33 OV Fault
VDD33 UV Fault
Reserved
Reserved
ADC Values Invalid, Occurs During Start-Up. May Occur Briefly on Current Measurement Channels During Normal Operation
SYNC clocked by external device (when LTM4664A configured to drive SYNC pin)
Channel 1 Power Good
Channel 0 Power Good
LTM4664A Driving RUN1 Low
LTM4664A Driving RUN0 Low
RUN1 Pin State
RUN0 Pin State
LTM4664A Driving FAULT1 Low
LTM4664A Driving FAULT0 Low
FAULT1 Pin State
FAULT0 Pin State
A 1 indicates the condition is true.
This read-only command has two data bytes.
124
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LTM4664A
PMBus COMMAND DETAILS
MFR_COMMON
The MFR_COMMON command contains bits that are common to all LTC digital power and telemetry products.
BIT
MEANING
7
Chip Not Driving ALERT Low
6
LTM4664A Not Busy
5
Calculations Not Pending
4
LTM4664A Outputs Not in Transition
3
NVM Initialized
2
Reserved
1
SHARE_CLK Timeout
0
WP Pin Status
This read-only command has one data byte.
MFR_INFO
The MFR_INFO command contains additional status bits that are LTC3884-specific and may be common to multiple
ADI PSM products.
MFR_INFO Data Contents:
BIT
15:5
4
MEANING
Reserved.
EEPROM ECC status.
0: Corrections made in the EEPROM user space.
1: No corrections made in the EEPROM user space.
3:0
Reserved
EEPROM ECC status is updated after each RESTORE_USER_ALL or RESET command, a power-on reset or an EEPROM
bulk read operation. This read-only command has two data bytes.
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125
LTM4664A
PMBus COMMAND DETAILS
TELEMETRY
COMMAND NAME
READ_VIN
READ_IIN
READ_VOUT
READ_IOUT
READ_TEMPERATURE_1
CMD
CODE
0x88
0x89
0x8B
0x8C
0x8D
READ_TEMPERATURE_2
0x8E
READ_FREQUENCY
READ_POUT
READ_PIN
MFR_PIN_ACCURACY
MFR_IOUT_PEAK
0x95
0x96
0x97
0xAC
0xD7
MFR_VOUT_PEAK
0xDD
MFR_VIN_PEAK
0xDE
MFR_TEMPERATURE_1_PEAK
0xDF
MFR_READ_IIN_PEAK
0xE1
MFR_READ_ICHIP
MFR_TEMPERATURE_2_PEAK
0xE4
0xF4
MFR_ADC_CONTROL
0xD8
126
DESCRIPTION
TYPE
PAGED FORMAT UNITS
Measured input supply voltage.
R Word
N
L11
V
Measured input supply current.
R Word
N
L11
A
Measured output voltage.
R Word
Y
L16
V
Measured output current.
R Word
Y
L11
A
Power stage diode junction temperature. This
R Word
Y
L11
C
is the value used for all temperature related
processing, including MFR_IOUT_CAL_GAIN.
Power stage junction temperature. Does not
R Word
N
L11
C
affect any other commands.
Measured PWM switching frequency.
R Word
Y
L11
Hz
Calculated output power.
R Word
Y
L11
W
Calculated input power.
R Word
N
L11
W
Returns the accuracy of the READ_PIN command R Byte
N
%
Report the maximum measured value of
R Word
Y
L11
A
READ_IOUT since last MFR_CLEAR_PEAKS.
Maximum measured value of READ_VOUT
R Word
Y
L16
V
since last MFR_CLEAR_PEAKS.
Maximum measured value of READ_VIN since
R Word
N
L11
V
last MFR_CLEAR_PEAKS.
Maximum measured value of external
R Word
Y
L11
C
Temperature (READ_TEMPERATURE_1) since
last MFR_CLEAR_PEAKS.
Maximum measured value of READ_IIN
R Word
N
L11
A
command since last MFR_CLEAR_PEAKS.
Measured current used by the LTM4664A.
R Word
N
L11
A
R Word
N
L11
C
Peak internal die temperature since last
MFR_CLEAR_PEAKS.
ADC telemetry parameter selected for repeated R/W Byte
N
N
Reg
fast ADC read back.
NVM
DEFAULT
VALUE
NA
NA
NA
NA
NA
NA
NA
NA
NA
5.0%
NA
NA
NA
NA
NA
NA
NA
NA
Rev. 0
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LTM4664A
PMBus COMMAND DETAILS
READ_VIN
The READ_VIN command returns the measured VIN pin voltage, in volts added to READ_ICHIP • MFR_RVIN. This
compensates for the IR voltage drop across the VIN filter element due to the supply current of the LTM4664A.
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
READ_VOUT
The READ_VOUT command returns the measured output voltage by the VOUT_MODE command.
This read-only command has two data bytes and is formatted in Linear_16u format.
READ_IIN
The READ_IIN command returns the input current, in Amperes, as measured across the input current sense resistor
(see also MFR_IIN_CAL_GAIN).
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
READ_IOUT
The READ_IOUT command returns the average output current in amperes. The IOUT value is a function of:
a) the differential voltage measured across the ISENSE pins
b) the MFR_IOUT_CAL_GAIN value
c) the MFR_IOUT_CAL_GAIN_TC value, and
d) READ_TEMPERATURE_1 value
e) The MFR_TEMP_1_GAIN and the MFR_TEMP_1_OFFSET
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
READ_TEMPERATURE_1
The READ_TEMPERATURE_1 command returns the temperature, in degrees Celsius, of the power stage sense element.
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
READ_TEMPERATURE_2
The READ_TEMPERATURE_2 command returns the LTM4664A’s die temperature, in degrees Celsius, of the internal
sense element.
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
READ_FREQUENCY
The READ_FREQUENCY command is a reading of the PWM switching frequency in kHz.
This read-only command has 2 data bytes and is formatted in Linear_5s_11s format.
READ_POUT
The READ_POUT command is a reading of the DC/DC converter output power in Watts. POUT is calculated based on
the most recent correlated output voltage and current reading.
This read-only command has 2 data bytes and is formatted in Linear_5s_11s format.
Rev. 0
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127
LTM4664A
PMBus COMMAND DETAILS
READ_PIN
The READ_PIN command is a reading of the DC/DC converter input power in Watts. PIN is calculated based on the
most recent input voltage and current reading.
This read-only command has 2 data bytes and is formatted in Linear_5s_11s format.
MFR_PIN_ACCURACY
The MFR_PIN_ACCURACY command returns the accuracy, in percent, of the value returned by the READ_PIN command.
There is one data byte. The value is 0.1% per bit which gives a range of ±0.0% to ±25.5%.
This read-only command has one data byte and is formatted as an unsigned integer.
MFR_IOUT_PEAK
The MFR_IOUT_PEAK command reports the highest current, in amperes, reported by the READ_IOUT measurement.
This command is cleared using the MFR_CLEAR_PEAKS command.
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
MFR_VOUT_PEAK
The MFR_VOUT_PEAK command reports the highest voltage, in volts, reported by the READ_VOUT measurement.
This command is cleared using the MFR_CLEAR_PEAKS command.
This read-only command has two data bytes and is formatted in Linear_16u format.
MFR_VIN_PEAK
The MFR_VIN_PEAK command reports the highest voltage, in volts, reported by the READ_VIN measurement.
This command is cleared using the MFR_CLEAR_PEAKS command.
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
MFR_TEMPERATURE_1_PEAK
The MFR_TEMPERATURE_1_PEAK command reports the highest temperature, in degrees Celsius, reported by the
READ_TEMPERATURE_1 measurement.
This command is cleared using the MFR_CLEAR_PEAKS command.
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
MFR_READ_IIN_PEAK
The MFR_READ_IIN_PEAK command reports the highest current, in Amperes, reported by the READ_IIN measurement.
This command is cleared using the MFR_CLEAR_PEAKS command.
This command has two data bytes and is formatted in Linear_5s_11s format.
MFR_READ_ICHIP
The MFR_READ_ICHIP command returns the measured input current, in Amperes, used by the LTM4664A.
This command has two data bytes and is formatted in Linear_5s_11s format.
128
Rev. 0
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LTM4664A
PMBus COMMAND DETAILS
MFR_TEMPERATURE_2_PEAK
The MFR_TEMPERATURE_2_PEAK command reports the highest temperature, in degrees Celsius, reported by the
READ_TEMPERATURE_2 measurement.
This command is cleared using the MFR_CLEAR_PEAKS command.
This read-only command has two data bytes and is formatted in Linear_5s_11s format.
MFR_ADC_CONTROL
The MFR_ADC_CONTROL command determines the ADC read back selection. A default value of 0 in the command runs
the standard telemetry loop with all parameters updated in a round robin fashion with a typical latency of tCONVERT.
The user can command a non-zero value to monitored a single parameter with an approximate update rate of 8ms.
This command has a latency of up to 2 ADC conversions or approximately 16ms (external temperature conversions
may have a latency of up to 3 ADC conversion or approximately 24ms). It is recommended the part remain in standard
telemetry mode except for special cases where fast ADC updates of a single parameter is required. The part should be
commanded to monitor the desired parameter for a limited period of time (less then 1 second) then set the command
back to standard round robin mode. If this command is set to any value except standard round robin telemetry (0) all
warnings and faults associated with telemetry other than the selected parameter are effectively disabled and voltage
servoing is disabled. When round robin is reasserted, all warnings and faults and servo mode are re-enabled.
COMMANDED VALUE
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x05
0x04
0x03
0x02
TELEMETRY COMMAND NAME
0x01
0x00
READ_VIN
READ_TEMPERATURE_1
READ_IOUT
READ_VOUT
READ_TEMPERATURE_1
READ_IOUT
READ_VOUT
READ_TEMPERATURE_2
READ_IIN
MFR_READ_ICHIP
DESCRIPTION
Reserved
Reserved
Reserved
Channel 1 external temperature
Reserved
Channel 1 measured output current
Channel 1 measured output voltage
Channel 0 external temperature
Reserved
Channel 0 measured output current
Channel 0 measured output voltage
Internal junction temperature
Measured input supply current
Measured supply current of the
LTM4664A
Measured input supply voltage
Standard ADC Round Robin Telemetry
If a reserved command value is entered, the telemetry will default to Internal IC Temperature and issue a CML fault.
CML faults will continue to be issued by the LTM4664A until a valid command value is entered. The accuracy of the
measured input supply voltage is only guaranteed if the MFR_ADC_CONTROL command is set to standard round
robin telemetry.
This write-only command has 1 data byte and is formatted in register format.
Rev. 0
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129
LTM4664A
PMBus COMMAND DETAILS
NVM MEMORY COMMANDS
Store/Restore
COMMAND NAME
STORE_USER_ALL
CMD
CODE
0x15
RESTORE_USER_ALL
0x16
MFR_COMPARE_USER_ALL
0xF0
DESCRIPTION
TYPE
Store user operating memory to
Send Byte
EEPROM.
Restore user operating memory from Send Byte
EEPROM.
Compares current command contents Send Byte
with NVM.
PAGED
N
FORMAT
UNITS
NVM
DEFAULT
VALUE
NA
N
NA
N
NA
STORE_USER_ALL
The STORE_USER_ALL command instructs the PMBus device to copy the non-volatile user contents of the Operating
Memory to the matching locations in the non-volatile User NVM memory.
Executing this command if the die temperature exceeds 85°C or is below 0°C is not recommended and the data retention
of 10 years cannot be guaranteed. If the die temperature exceeds 130°C, the STORE_USER_ALL command is disabled.
The command is re-enabled when the IC temperature drops below 125°C.
Communication with the LTM4664A and programming of the NVM can be initiated when EXTVCC or VDD33 is available
and VIN is not applied. To enable the part in this state, using global address 0x5B write MFR_EE_UNLOCK to 0x2B
followed by 0xC4. The LTM4664A will now communicate normally, and the project file can be updated. To write the
updated project file to the NVM issue a STORE_USER_ALL command. When VIN is applied, a MFR_RESET must be
issued to allow the PWM to be enabled and valid ADCs to be read.
This write-only command has no data bytes.
RESTORE_USER_ALL
The RESTORE_USER_ALL command instructs the LTM4664A to copy the contents of the non-volatile User memory
to the matching locations in the Operating Memory. The values in the Operating Memory are overwritten by the value
retrieved from the User commands. The LTM4664A ensures both channels are off, loads the operating memory from
the internal EEPROM, clears all faults, reads the resistor configuration pins, and then performs a soft-start of both
PWM channels if applicable.
STORE_USER_ALL, MFR_COMPARE_USER_ALL and RESTORE_USER_ALL commands are disabled if the die exceeds
130°C and are not re-enabled until the die temperature drops below 125°C.
This write-only command has no data bytes.
MFR_COMPARE_USER_ALL
The MFR_COMPARE_USER_ALL command instructs the PMBus device to compare current command contents with
what is stored in non-volatile memory. If the compare operation detects differences, a CML bit 0 fault will be generated.
This write-only command has no data bytes.
130
Rev. 0
For more information www.analog.com
LTM4664A
PMBus COMMAND DETAILS
Fault Logging
COMMAND NAME
MFR_FAULT_LOG
MFR_FAULT_LOG_ STORE
MFR_FAULT_LOG_CLEAR
CMD CODE DESCRIPTION
0xEE
Fault log data bytes.
0xEA
Command a transfer of the fault log from RAM
to EEPROM.
0xEC
Initialize the EEPROM block reserved for fault
logging.
DATA
TYPE
PAGED FORMAT UNITS
R Block
N
CF
Send Byte
N
Send Byte
N
NVM
Y
DEFAULT
VALUE
NA
NA
NA
MFR_FAULT_LOG
The MFR_FAULT_LOG command allows the user to read the contents of the FAULT_LOG after the first fault occurrence
since the last MFR_FAULT_LOG_CLEAR command was written. The contents of this command are stored in non-volatile
memory, and are cleared by the MFR_FAULT_LOG_CLEAR command. The length and content of this command are listed
in Table 15. If the user accesses the MFR_FAULT_LOG command and no fault log is present, the command will return
a data length of 0. If a fault log is present, the MFR_FAULT_LOG will return a block of data 147 bytes long. If a fault
occurs within the first second of applying power, some of the earlier pages in the fault log may not contain valid data.
NOTE: The approximate transfer time for this command is 3.4ms using a 400kHz clock.
This read-only command is in block format.
MFR_FAULT_LOG_STORE
The MFR_FAULT_LOG_STORE command forces the fault log operation to be written to NVM just as if a fault event
occurred. This command will set bit 3 of the STATUS_MFR_SPECIFIC fault if bit 7 “Enable Fault Logging” is set in the
MFR_CONFIG_ALL command.
If the die temperature exceeds 130°C, the MFR_FAULT_LOG_STORE command is disabled until the IC temperature
drops below 125°C.
This write-only command has no data bytes.
Rev. 0
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131
LTM4664A
PMBus COMMAND DETAILS
Table 20. Fault Logging
This table outlines the format of the block data from a read block data of the MFR_FAULT_LOG command.
Data Format Definitions
DATA
Block Length
LIN 11 = PMBus = Rev 1.2, Part 2, section 7.1
LIN 16 = PMBus Rev 1.2, Part 2, section 8. Mantissa portion only
BYTE = 8 bits interpreted per definition of this command
BITS
DATA
FORMAT
BYTE
BYTE NUM BLOCK READ COMMAND
147
The MFR_FAULT_LOG command is a fixed length of 147 bytes
The block length will be zero if a data log event has not been captured
HEADER INFORMATION
Fault Log Preface
MFR_VOUT_PEAK (PAGE 0)
[7:0]
[7:0]
[15:8]
[7:0]
[7:0]
[7:0]
[15:8]
[23:16]
[31:24]
[39:32]
[47:40]
[15:8]
L16
0
1
2
3
4
5
6
7
8
9
10
11
MFR_VOUT_PEAK (PAGE 1)
[7:0]
[15:8]
L16
12
13
MFR_IOUT_PEAK (PAGE 0)
[7:0]
[15:8]
L11
14
15
MFR_IOUT_PEAK (PAGE 1)
[7:0]
[15:8]
L11
16
17
Fault Source
MFR_REAL_TIME
MFR_VIN_PEAK
READ_TEMPERATURE1 (PAGE 0)
READ_TEMPERATURE1 (PAGE 1)
READ_TEMPERATURE2
132
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
ASC
Reg
Reg
Reg
L11
L11
L11
L11
18
19
20
21
22
23
24
25
26
Returns LTxx beginning at byte 0 if a partial or complete fault log exists.
Word xx is a factory identifier that may vary part to part.
Refer to Table 16.
48 bit share-clock counter value when fault occurred (200µs resolution).
Peak READ_VOUT on Channel 0 since last power-on or CLEAR_PEAKS
command.
Peak READ_VOUT on Channel 1 since last power-on or CLEAR_PEAKS
command.
Peak READ_IOUT on Channel 0 since last power-on or CLEAR_PEAKS
command.
Peak READ_IOUT on Channel 1 since last power-on or CLEAR_PEAKS
command.
Peak READ_VIN since last power-on or CLEAR_PEAKS command.
External temperature sensor 0 during last event.
External temperature sensor 1 during last event.
LTM4664A die temperature sensor during last event.
Rev. 0
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LTM4664A
PMBus COMMAND DETAILS
CYCLICAL DATA
EVENT n
Event “n” represents one complete cycle of ADC reads through the MUX
at time of fault. Example: If the fault occurs when the ADC is processing
step 15, it will continue to take readings through step 25 and then store
the header and all 6 event pages to EEPROM
(Data at Which Fault Occurred; Most Recent Data)
READ_VOUT (PAGE 0)
READ_VOUT (PAGE 1)
READ_IOUT (PAGE 0)
READ_IOUT (PAGE 1)
READ_VIN
READ_IIN
STATUS_VOUT (PAGE 0)
STATUS_VOUT (PAGE 1)
STATUS_WORD (PAGE 0)
STATUS_WORD (PAGE 1)
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
STATUS_MFR_SPECIFIC (PAGE 0)
STATUS_MFR_SPECIFIC (PAGE 1)
EVENT n-1
(data measured before fault was detected)
[15:8]
READ_VOUT (PAGE 0)
[7:0]
READ_VOUT (PAGE 1)
[15:8]
[7:0]
READ_IOUT (PAGE 0)
[15:8]
[7:0]
READ_IOUT (PAGE 1)
[15:8]
[7:0]
READ_VIN
[15:8]
[7:0]
READ_IIN
[15:8]
[7:0]
STATUS_VOUT (PAGE 0)
STATUS_VOUT (PAGE 1)
STATUS_WORD (PAGE 0)
[15:8]
[7:0]
STATUS_WORD (PAGE 1)
[15:8]
[7:0]
STATUS_MFR_SPECIFIC (PAGE 0)
STATUS_MFR_SPECIFIC (PAGE 1)
LIN 16
LIN 16
LIN 16
LIN 16
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
BYTE
BYTE
WORD
WORD
WORD
WORD
BYTE
BYTE
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
LIN 16
LIN 16
LIN 16
LIN 16
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
BYTE
BYTE
WORD
WORD
WORD
WORD
BYTE
BYTE
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
Rev. 0
For more information www.analog.com
133
LTM4664A
PMBus COMMAND DETAILS
EVENT n-5
(Oldest Recorded Data)
READ_VOUT (PAGE 0)
READ_VOUT (PAGE 1)
READ_IOUT (PAGE 0)
READ_IOUT (PAGE 1)
READ_VIN
READ_IIN
STATUS_VOUT (PAGE 0)
STATUS_VOUT (PAGE 1)
STATUS_WORD (PAGE 0)
STATUS_WORD (PAGE 1)
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
[15:8]
[7:0]
STATUS_MFR_SPECIFIC (PAGE 0)
STATUS_MFR_SPECIFIC (PAGE 1)
LIN 16
LIN 16
LIN 16
LIN 16
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
LIN 11
BYTE
BYTE
WORD
WORD
WORD
WORD
BYTE
BYTE
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
Table 21. Explanation of Position_Fault Values
POSITION_FAULT VALUE
SOURCE OF FAULT LOG
0xFF
MFR_FAULT_LOG_STORE
0x00
TON_MAX_FAULT
0x01
VOUT_OV_FAULT
0x02
VOUT_UV_FAULT
134
0x03
IOUT_OC_FAULT
0x05
TEMP_OT_FAULT
0x06
TEMP_UT_FAULT
0x07
VIN_OV_FAULT
0x0A
MFR_TEMP_2_OT_FAULT
Rev. 0
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LTM4664A
PMBus COMMAND DETAILS
MFR_INFO
Contact the factory for details.
MFR_IOUT_CAL_GAIN
Contact the factory for details.
MFR_FAULT_LOG_CLEAR
The MFR_FAULT_LOG_CLEAR command will erase the
fault log file stored values. It will also clear bit 3 in the
STATUS_MFR_SPECIFIC command. After a clear is
issued, the status can take up to 8ms to clear.
This write-only command is send bytes.
Block Memory Write/Read
COMMAND NAME
CMD CODE DESCRIPTION
TYPE
DATA
PAGED FORMAT UNITS
NVM
DEFAULT
VALUE
MFR_EE_UNLOCK
0xBD
Unlock user EEPROM for access by MFR_EE_ERASE
and MFR_EE_DATA commands.
R/W Byte
N
Reg
NA
MFR_EE_ERASE
0xBE
Initialize user EEPROM for bulk programming by
MFR_EE_DATA.
R/W Byte
N
Reg
NA
MFR_EE_DATA
0xBF
Data transferred to and from EEPROM using
sequential PMBus word reads or writes. Supports bulk
programming.
R/W
Word
N
Reg
NA
All the NVM commands are disabled if the die temperature
exceeds 130°C. NVM commands are re-enabled when the
die temperature drops below 125°C.
MFR_EE_xxxx
The MFR_EE_xxxx commands facilitate bulk programming of the LTM4664A internal EEPROM. Contact the
factory for details.
Rev. 0
For more information www.analog.com
135
136
GND
VOUTC0
VOUTC0
VOUTC0
VOUTC0
VOUTC0
VOUTC0
VOUTC0
A9
A10
A11
A12
A13
A14
A15
A16
B9
B10
B11
B12
B13
B14
B15
B16
PIN ID
B1
B2
B3
B4
B5
B6
B7
B8
GND
VOUTC0
VOUTC0
VOUTC0
VOUTC0
GND
GND
GND
FUNCTION
GND
GND
GND
VOUTC1
VOUTC1
VOUTC1
VOUTC1
GND
C9
C10
C11
C12
C13
C14
C15
C16
PIN ID
C1
C2
C3
C4
C5
C6
C7
C8
GND
GND
GND
GND
GND
VOUT1
VOUT1
VOUT1
FUNCTION
VINS2
VINS2
VINS2
GND
GND
GND
GND
GND
D9
D10
D11
D12
D13
D14
D15
D16
PIN ID
D1
D2
D3
D4
D5
D6
D7
D8
GND
INTVCCS1
EXTVCCS1
PGOODS1
GND
SW2
SW2
SW2
FUNCTION
SW3
SW3
SW3
GND
VINS2F
INSNSS2–
INSNSS2+
GND
E9
E10
E11
E12
E13
E14
E15
E16
GND
UVS1
FAULTS1
FREQS1
GND
GND
GND
GND
F9
F10
F11
F12
F13
F14
F15
F16
GND
GND
RUNS1
TIMERS1
G9
G10
G11
G12
G13
G14
G15
G16
PIN ID FUNCTION
PIN ID FUNCTION PIN ID
E1
GND
F1
GND
G1
E2
GND
F2
GND
G2
E3
GND
F3
GND
G3
E4
GND
F4
GND
G4
E5 HYS_PRGMS2 F5
TIMERS2
G5
E6
OVP_SET
F6 VOUT2_SET G6
E7
OVP_TRIP
F7
EXTVCCS2
G7
E8
GND
F8
GND
G8
PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION PIN ID FUNCTION
PIN ID FUNCTION PIN ID
M1
VINS3_C1
N1
GND
P1
GND
R1
J1
GND
K1
GND
L1
VINS3 _C1
J2
GND
K2
GND
L2
VINS3 _C1
M2
VINS3_C1
N2
GND
P2
GND
R2
J3
GND
K3
GND
L3
GND
M3
GND
N3
GND
P3
GND
R3
J4
GND
K4
GND
L4
PWM_C1
M4
GND
N4
GND
P4
GND
R4
PHFLT_C1
M5
GND
N5
PGOOD_C1
P5
GL_C1
R5
J5 VTRIMC1_CFG K5 VTRIMC0_CFG L5
–
+
L6
VDD33
M6
COMP_1a
N6
VOSNS _C1
P6
VOSNS _C1 R6
J6 VOUTC0_CFG K6
VDD25
J7 VOUTC1_CFG K7
WP
L7
SHARE_CLK
M7
COMP_1b
N7
GND
P7
GND
R7
J8
ASEL
K8
RUN_C1
L8
SDA
M8
SYNC
N8 SGND_C0_C1
P8
GND
R8
J9
RUN_C0
K9
FAULT_C1
L9
SCL
M9 SGND_C0_C1 N9 SGND_C0_C1
P9
GND
R9
R10
J10
ALERT
K10
FAULT_C0
L10
TSNS_C0a
M10
TSNS_C1a
N10
COMP_0b
P10
IN–
J11
GND
K11
GND
L11
GND
M11
GND
N11
GND
P11
COMP_0a R11
M12
VINS3_C0
N12
GND
P12 VOSNS–_C0 R12
J12
K12
L12
VINS3 _C0
K13
L13
VINS3 _C0
M13
VINS3_C0
N13
GND
P13
GND
R13
J13
INSNSS1–
+
K14
L14
GND
M14
GND
N14
GND
P14
GND
R14
J14
INSNSS1
K15
L15
GND
M15
PWM_C0
N15
GND
P15
GND
R15
J15
VINS1
K16
L16
GND
M16
PHFLT_C0
N16
GND
P16
GL_C0
R16
J16
VINS1
FUNCTION
VOUTC1
VOUTC1
VOUTC1
VOUTC1
VOUTC1
VOUTC1
VOUTC1
GND
PIN ID
A1
A2
A3
A4
A5
A6
A7
A8
Table 22. LTM4664AY Pin Out Array BGA
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY.
FUNCTION
GND
GND
GND
GND
GND
GND
INTVCC
EXTVCC
GND
IN+
PGOOD_C0
VOSNS+_C0
GND
GND
GND
GND
PIN ID FUNCTION
T1 TSNS_C1b
T2
GND
T3
GND
T4
SWC1
T5
SWC1
T6
SWC1
T7
SWC1
T8
GND
T9
GND
T10
SWC0
T11
SWC0
T12
SWC0
T13
SWC0
T14
GND
T15
GND
T16 TSNS_C0b
PIN ID FUNCTION
H1
VOUT2
H2
VOUT2
H3
VOUT2
H4
GND
H5
PGOODS2
H6
FAULTS2
H7
UVS2
H8
FSWPH_
CFG
GND
H9
GND
GND
H10
GND
GND
H11
GND
HYS_PRGMS1 H12
H13
SW1
H14
SW1
H15
SW1
H16
FUNCTION
SW4
SW4
SW4
GND
FREQS2
RUNS2
INTVCCS2
GND
LTM4664A
PACKAGE DESCRIPTION
Rev. 0
For more information www.analog.com
X
15.65
0.500 ±0.025 Ø 240x
Y
E
D
15.60
PACKAGE TOP VIEW
2.500
SUGGESTED PCB LAYOUT
TOP VIEW
2.500
aaa Z
1.500
4
0.500
0.0000
0.500
// f f f Z
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For
is granted
implication or
otherwise under any patent or patent rights of Analog Devices.
more by
information
www.analog.com
7.500
6.500
5.500
4.500
3.500
2.500
1.500
0.500
0.0000
0.500
1.500
2.500
3.500
4.500
5.500
6.500
7.500
DETAIL A
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
H3
aaa
bbb
ccc
ddd
eee
fff
H2
MOLD
CAP
ccc Z
b1
A2
e
14
b
13
12
11
10
9
G
8
7
6
e
5
4
3
2
DETAIL A
1
F
E
D
C
B
A
NOM
7.72
0.50
1.82
0.60
0.50
16.00
16.00
1.00
15.00
15.00
0.32
1.50
5.40
0.36
1.55
5.52
0.15
0.10
0.20
0.25
0.10
0.35
MAX
8.03
0.55
1.91
0.70
0.53
DIMENSIONS
DETAIL B
SUBSTRATE THK
MOLD CAP HT
INDUCTOR HT
BALL DIMENSION
PAD DIMENSION
BALL HT
NOTES
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
7
!
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXX
µModule
3
SEE NOTES
PIN 1
7
SEE NOTES
BGA 240 0617 REV B
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
6. SOLDER BALL COMPOSITION CAN BE 96.5% Sn/3.0% Ag/0.5% Cu
OR Sn Pb EUTECTIC
5. PRIMARY DATUM -Z- IS SEATING PLANE
BALL DESIGNATION PER JESD MS-028 AND JEP95
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
PACKAGE BOTTOM VIEW
T
R
P
N
M
L
K
J
H
15
G
F
b
16
H1
PACKAGE SIDE VIEW
A
Z
SUBSTRATE
A1
TOTAL NUMBER OF BALLS: 240
0.28
1.45
5.28
MIN
7.41
0.45
1.73
0.50
0.47
ddd M Z X Y
eee M Z
DETAIL B
Øb (240 PLACES)
H3
INDUCTOR
// bbb Z
(Reference LTC DWG # 05-08-1567 Rev B)
Z
PIN “A1”
CORNER
1.500
BGA Package
240-Lead (16mm × 16mm × 7.72mm)
LTM4664A
PACKAGE DESCRIPTION
aaa Z
Rev. 0
137
7.500
6.500
5.500
4.500
3.500
3.500
4.500
5.500
6.500
7.500
LTM4664A
TYPICAL APPLICATIONS
DESIGN RESOURCES
SUBJECT
DESCRIPTION
Manufacturing:
• Quick Start Guide
• PCB Design, Assembly and Manufacturing Guidelines
• Package and Board Level Reliability
µModule Design and Manufacturing Resources
Design:
• Selector Guides
• Demo Boards and Gerber Files
• Free Simulation Tools
µModule Regulator Products Search
1. Sort table of products by parameters and download the result as a spread sheet.
2. Search using the Quick Power Search parametric table.
Digital Power System Management
Analog Devices’ family of digital power supply management ICs are highly integrated solutions that
offer essential functions, including power supply monitoring, supervision, margining and sequencing,
and feature EEPROM for storing user configurations and fault logging.
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
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LTM4678
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LTM4686
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LTM4650
Dual 50A or Single 100A µModule Regulator
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LTM4650A
Dual 50A or Single 100A µModule Regulator with High VOUT Range
4.5V ≤ VIN ≤ 16V, 0.6V ≤ VOUT ≤ 5.5V. 16mm × 16mm × 5.01mm
BGA. 16mm × 16mm × 4.41mm LGA.
LTC®2977
Octal Digital Power Supply Manager with EEPROM
I²C/PMBus Interface, Configuration EEPROM, Fault Logging,
16-Bit ADC with ±0.25% TUE, 3.3V to 15V Operation
LTC2974
Quad Digital Power Supply Manager with EEPROM
I²C/PMBus Interface, Configuration EEPROM, Fault Logging, Per
Channel Voltage, Current and Temperature Measurements
138
Rev. 0
12/21
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