LTM8045
Inverting or SEPIC µModule
DC/DC Converter with Up
to 700mA Output Current
Description
Features
SEPIC or Inverting Topology
n Wide Input Voltage Range: 2.8V to 18V
n Up to 700mA Output Current at V = 12V,
IN
VOUT = 2.5V or –2.5V
n Up to 375mA Output Current at V = 12V,
IN
VOUT =15V or –15V
n 2.5V to 15V or –2.5V to –15V Output Voltage
n Selectable Switching Frequency: 200kHz to 2MHz
n Programmable Soft-Start
n User Configurable Undervoltage Lockout
n 6.25mm × 11.25mm × 4.92mm BGA Package
The LTM®8045 is a µModule® (micromodule) DC/DC
converter that can be configured as a SEPIC or inverting
converter by simply grounding the appropriate output rail.
In a SEPIC configuration the regulated output voltage can
be above, below or equal to the input voltage. The LTM8045
includes power devices, inductors, control circuitry and
passive components. All that is needed to complete the
design are input and output capacitors, and small resistors to set the output voltage and switching frequency.
Other components may be used to control the soft-start
and undervoltage lockout.
n
The LTM8045 is packaged in a compact (6.25mm ×
11.25mm) overmolded ball grid array (BGA) package suitable for automated assembly by standard surface mount
equipment. The LTM8045 is available with SnPb (BGA)
or RoHS compliant terminal finish.
Applications
Battery Powered Regulator
Local Negative Voltage Regulator
n Low Noise Amplifier Power
n
n
L, LT, LTC, LTM, Linear Technology, the Linear logo, µModule and PolyPhase are registered
trademarks of Linear Technology Corporation. All other trademarks are the property of their
respective owners.
Typical Application
Use Two LTM8045s to Generate ±5V
Maximum Output Current
vs Input Voltage
LTM8045
VOUT–
VIN
RUN
SS
SYNC
700
22µF
FB
RT
130k
VOUT+
GND
LTM8045
600
500
400
•
•
±2.5VOUT
±3.3VOUT
±5VOUT
±8VOUT
±12VOUT
±15VOUT
300
200
VOUT–
VIN
100
RUN
SS
100µF
FB
2
4
6
8
10 12 14
INPUT VOLTAGE (V)
16
18
8045 TA01b
RT
115k
800
60.4k
OUTPUT CURRENT (mA)
4.7µF
VOUT
–5V
•
•
VIN
2.8VDC TO 18VDC
VOUT+
SYNC
GND
45.3k
VOUT
5V
8045 TA01b
8045fc
For more information www.linear.com/LTM8045
1
LTM8045
Absolute Maximum Ratings
Pin Configuration
(Note 1)
TOP VIEW
VIN, RUN....................................................................20V
RT, SYNC.....................................................................5V
SS, FB.......................................................................2.5V
VOUT+ (VOUT– = 0V)....................................................16V
VOUT– (VOUT+ = 0V).................................................. –16V
Maximum Internal Temperature............................. 125°C
Maximum Solder Temperature............................... 250°C
Storage Temperature.............................. –55°C to 125°C
VOUT–
BANK 1
5
3
VOUT+
BANK 2
VIN
BANK 4
4
GND
FB
RUN
BANK 3
2
SYNC
1
A
B
C
D
E
F
H
G
SS
RT
BGA PACKAGE
40-LEAD (11.25mm × 6.25mm × 4.92mm)
TJMAX = 125°C, θJA = 28.7°C/W, θJB = 7.6°C/W,
θJCtop = 40.3°C/W, θJCbottom = 10.5°C/W
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
WEIGHT = 0.9g
Order Information
http://www.linear.com/product/LTM8045#orderinfo
PART MARKING*
PART NUMBER
PAD OR BALL FINISH
DEVICE
FINISH CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
LTM8045EY#PBF
SAC305 (RoHS)
LTM8045Y
e1
BGA
3
–40°C to 125°C
LTM8045IY#PBF
SAC305 (RoHS)
LTM8045Y
e1
BGA
3
–40°C to 125°C
LTM8045IY
SnPb (63/37)
LTM8045Y
e0
BGA
3
–40°C to 125°C
LTM8045MPY#PBF
SAC305 (RoHS)
LTM8045Y
e1
BGA
3
–55°C to 125°C
LTM8045MPY
SnPb (63/37)
LTM8045Y
e0
BGA
3
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
• Terminal Finish Part Marking:
www.linear.com/leadfree
• LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
2
8045fc
For more information www.linear.com/LTM8045
LTM8045
Electrical Characteristics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. RUN = 12V unless otherwise specified. (Note 2)
PARAMETER
CONDITIONS
MIN
Input DC Voltage
l
TYP
2.8
MAX
UNITS
18
V
Positive Output DC Voltage
IOUT = 0.7A, RFB = 15.4kΩ, VOUT– Grounded
IOUT = 0.375A, RFB =165kΩ, VOUT– Grounded
2.5
15
V
V
Negative Output DC Voltage
IOUT = 0.7A, RFB = 30.0kΩ, VOUT+ Grounded
IOUT = 0.375A, RFB =178kΩ, VOUT+ Grounded
–2.5
–15
V
V
Continuous Output DC Current
VIN = 12V, VOUT = 2.5V or –2.5V
VIN = 12V, VOUT = 15V or –15V
VIN Quiescent Current
VRUN = 0V
Not Switching
0.7
0.375
0
10
1
A
A
µA
mA
Line Regulation
4V ≤ VIN ≤ 18V, IOUT = 0.2A
0.6
%
Load Regulation
0.01A ≤ IOUT ≤ 0.58A
0.2
%
Output RMS Voltage Ripple
VIN = 12V, VOUT = 5V, IOUT = 580mA, 100kHz to 4MHz
4
mV
Input Short-Circuit Current
VOUT+ = VOUT– = 0V, VIN = 12V
200
mA
Switching Frequency
RT = 45.3k
RT = 464k
l
l
1800
180
2000
200
2200
220
kHz
kHz
Voltage at FB Pin (Positive Output)
Voltage at FB Pin (Negative Output)
l
l
1.195
0
1.215
5
1.235
12
V
mV
Current into FB Pin (Positive Output)
Current into FB Pin (Negative Output)
l
l
81
81
83.3
83.3
86
86.5
µA
µA
1.235
1.32
1.29
1.385
V
V
9.7
40
11.6
0
60
13.4
0.1
µA
µA
µA
5
8
13
µA
RUN Pin Threshold Voltage
RUN Pin Rising
RUN Pin Falling
RUN Pin Current
VRUN = 3V
VRUN = 1.3V
VRUN = 0V
SS Sourcing Current
SS = 0V
Synchronization Frequency Range
200
2000
kHz
Synchronization Duty Cycle
35
65
%
SYNC Input Low Threshold
0.4
SYNC Input High Threshold
V
1.3
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTM8045E is guaranteed to meet performance specifications
from 0°C to 125°C. Specifications over the –40°C to 125°C internal
temperature range are assured by design, characterization and correlation
with statistical process controls. LTM8045I is guaranteed to meet
specifications over the full –40°C to 125°C internal operating temperature
range. The LTM8045MP is guaranteed to meet specifications over the
V
full –55°C to 125°C internal operating temperature range. Note that
the maximum internal temperature is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors.
Note 3: This μModule converter includes overtemperature protection that
is intended to protect the device during momentary overload conditions.
Internal temperature will exceed 125°C when overtemperature protection
is active. Continuous operation above the specified maximum internal
operating junction temperature may impair device reliability.
8045fc
For more information www.linear.com/LTM8045
3
LTM8045
Typical Performance Characteristics
Efficiency
3.3VOUT SEPIC
Efficiency
2.5VOUT SEPIC
90
90
70
80
80
70
70
60
60
EFFICIENCY (%)
50
40
30
20
3.3VIN
5VIN
12VIN
18VIN
10
0
0
EFFICIENCY (%)
80
60
EFFICIENCY (%)
Efficiency
5VOUT SEPIC
50
40
30
3.3VIN
5VIN
12VIN
18VIN
20
10
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
0
Efficiency
12VOUT SEPIC
80
70
70
70
60
60
60
3.3VIN
5VIN
12VIN
18VIN
10
0
0
100
200
300
400
500
OUTPUT CURRENT (mA)
50
40
30
3.3VIN
5VIN
12VIN
18VIN
20
10
0
600
0
100
200
300
400
OUTPUT CURRENT (mA)
90
70
EFFICIENCY (%)
60
40
30
20
3.3VIN
5VIN
12VIN
18VIN
10
0
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
8045 G07
30
5VIN
12VIN
18VIN
10
0
500
0
100
200
300
400
OUTPUT CURRENT (mA)
Efficiency
–3.3VOUT Inverting Converter
90
80
70
70
60
60
50
40
30
3.3VIN
5VIN
12VIN
18VIN
20
10
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
8045 G08
500
8045 G06
80
0
700
40
20
EFFICIENCY (%)
Efficiency
–2.5VOUT Inverting Converter
50
600
50
8045 G05
8045 G04
80
200 300 400 500
OUTPUT CURRENT (mA)
90
EFFICIENCY (%)
30
100
Efficiency
15VOUT SEPIC
80
40
0
8045 G03
80
EFFICIENCY (%)
EFFICIENCY (%)
0
90
50
3.3VIN
5VIN
12VIN
18VIN
10
90
20
EFFICIENCY (%)
30
8045 G02
Efficiency
8VOUT SEPIC
4
40
20
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
8045 G01
50
Efficiency
–5VOUT Inverting Converter
50
40
30
3.3VIN
5VIN
12VIN
18VIN
20
10
0
0
100
200 300 400 500
OUTPUT CURRENT (mA)
600
700
8045 G09
8045fc
For more information www.linear.com/LTM8045
LTM8045
Typical Performance Characteristics
Efficiency
–12VOUT Inverting Converter
Efficiency
–15VOUT Inverting Converter
90
90
80
80
80
70
70
70
60
60
60
50
40
30
3.3VIN
5VIN
12VIN
18VIN
20
10
0
100
200
300
400
500
OUTPUT CURRENT (mA)
50
40
30
3.3VIN
5VIN
12VIN
18VIN
20
10
0
600
0
100
200
300
400
OUTPUT CURRENT (mA)
8045 G10
200
500
800
200
0
INPUT CURRENT (mA)
700
0
1000
800
400
300
200
700
600
500
400
300
100
200
300
400
500
OUTPUT CURRENT (mA)
600
8045 G16
200
0
100
200 300 400 500
OUTPUT CURRENT (mA)
600
0
700
8045 G15
900
Input Current vs Output Current,
15VOUT SEPIC
5VIN
12VIN
18VIN
800
700
600
500
400
300
100
100
0
300
200
200
100
0
3.3VIN
5VIN
12VIN
18VIN
900
500
400
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
Input Current vs Output Current,
12VOUT SEPIC
600
500
8045 G14
INPUT CURRENT (mA)
800
600
100
8045 G13
Input Current vs Output Current,
8VOUT SEPIC
500
3.3VIN
5VIN
12VIN
18VIN
700
300
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
3.3VIN
5VIN
12VIN
18VIN
100
200
300
400
OUTPUT CURRENT (mA)
8045 G12
100
0
0
Input Current vs Output Current,
5VOUT SEPIC
400
100
900
0
INPUT CURRENT (mA)
300
5VIN
12VIN
18VIN
10
500
3.3VIN
5VIN
12VIN
18VIN
600
INPUT CURRENT (mA)
INPUT CURRENT (mA)
700
400
0
30
Input Current vs Output Current,
3.3VOUT SEPIC
3.3VIN
5VIN
12VIN
18VIN
500
40
8045 G11
Input Current vs Output Current,
2.5VOUT SEPIC
600
50
20
INPUT CURRENT (mA)
0
EFFICIENCY (%)
90
EFFICIENCY (%)
EFFICIENCY (%)
Efficiency
–8VOUT Inverting Converter
0
100
200
300
400
OUTPUT CURRENT (mA)
500
8045 G17
0
0
100
200
300
400
OUTPUT CURRENT (mA)
500
8045 G18
8045fc
For more information www.linear.com/LTM8045
5
LTM8045
Typical Performance Characteristics
600
700
3.3VIN
5VIN
12VIN
18VIN
400
300
200
100
800
500
400
300
200
100
0
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
0
300
200
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
1000
800
600
500
400
300
900
700
700
600
500
400
300
400
300
100
100
0
0
600
0
100
200
300
400
OUTPUT CURRENT (mA)
8045 G22
40
500
35
30
25
20
2
4
6
8
10 12 14
INPUT VOLTAGE (V)
16
18
8045 G25
6
2.0
450
400
350
300
250
1.8
1.6
1.4
200
15
10
500
2.2
OUTPUT CURRENT (A)
45
100
200
300
400
OUTPUT CURRENT (mA)
Output Current vs Input Voltage,
Output Shorted
550
INPUT CURRENT (mA)
INPUT CURRENT (mA)
50
0
8045 G23
Input Current vs Input Voltage,
Output Shorted
±15VOUT
±12VOUT
±8VOUT
±5VOUT
±3.3VOUT
±2.5VOUT
55
0
500
8045 G23
Input Current vs Input Voltage,
5mA Load
700
500
100
60
600
600
200
200
300
400
500
OUTPUT CURRENT (mA)
200 300 400 500
OUTPUT CURRENT (mA)
5VIN
12VIN
18VIN
800
200
100
100
8045 G21
200
0
0
Input Current vs Output Current,
–15VOUT Inverting Converter
3.3VIN
5VIN
12VIN
18VIN
900
INPUT CURRENT (mA)
INPUT CURRENT (mA)
400
Input Current vs Output Current,
–12VOUT Inverting Converter
3.3VIN
5VIN
12VIN
18VIN
700
500
8045 G20
Input Current vs Output Current,
–8VOUT Inverting Converter
800
600
100
8045 G19
900
3.3VIN
5VIN
12VIN
18VIN
700
INPUT CURRENT (mA)
0
Input Current vs Output Current,
–5VOUT Inverting Converter
3.3VIN
5VIN
12VIN
18VIN
600
INPUT CURRENT (mA)
500
INPUT CURRENT (mA)
Input Current vs Output Current,
–3.3VOUT Inverting Converter
INPUT CURRENT (mA)
Input Current vs Output Current,
–2.5VOUT Inverting Converter
150
2
4
6
8
10 12 14
INPUT VOLTAGE (V)
16
18
8045 G26
1.2
2
4
6
8
10 12 14
INPUT VOLTAGE (V)
16
18
8045 G27
8045fc
For more information www.linear.com/LTM8045
LTM8045
Typical Performance Characteristics
Minimum Required Input Voltage
vs Output Current
10
8
6
2
600
500
400
±2.5VOUT
±3.3VOUT
±5VOUT
±8VOUT
±12VOUT
±15VOUT
300
200
4
0
200
400
600
OUTPUT CURRENT (mA)
100
800
2
4
6
8
10 12 14
INPUT VOLTAGE (V)
16
8045 G28
25
20
15
10
5
0
0
25
20
15
10
5
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
0
30
25
20
15
10
5
0
0
100
200
300
400
OUTPUT CURRENT (mA)
500
8045 G34
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
100
200 300 400 500
OUTPUT CURRENT (mA)
Internal Temperature Rise vs Output
Current, 8VOUT SEPIC
600
30
25
20
15
10
5
0
700
18VIN
12VIN
5VIN
3.3VIN
35
0
40
30
20
10
0
0
100
200
300
400
OUTPUT CURRENT (mA)
200
300
400
500
OUTPUT CURRENT (mA)
600
Internal Temperature Rise
vs Output Current, –2.5VOUT
Inverting Converter
25
18VIN
12VIN
5VIN
50
100
8045 G33
Internal Temperature Rise vs Output
Current, 15VOUT SEPIC
INTERNAL TEMPERATURE RISE (°C)
INTERNAL TEMPERATURE RISE (°C)
35
5
8045 G32
60
18VIN
12VIN
5VIN
3.3VIN
10
40
18VIN
12VIN
5VIN
3.3VIN
30
Internal Temperature Rise vs Output
Current, 12VOUT SEPIC
40
15
Internal Temperature Rise vs Output
Current, 5VOUT SEPIC
8045 G31
45
20
8045 G30
INTERNAL TEMPERATURE RISE (°C)
30
35
INTERNAL TEMPERATURE RISE (°C)
INTERNAL TEMPERATURE RISE (°C)
18VIN
12VIN
5VIN
3.3VIN
25
0
18
18VIN
12VIN
5VIN
3.3VIN
8045 G29
Internal Temperature Rise vs Output
Current, 3.3VOUT SEPIC
35
INTERNAL TEMPERATURE RISE (°C)
12
700
OUTPUT CURRENT (mA)
INPUT VOLTAGE (V)
14
30
800
±15VOUT
±12VOUT
±8VOUT
±5VOUT
±3.3VOUT
±2.5VOUT
16
Internal Temperature Rise vs Output
Current, 2.5VOUT SEPIC
INTERNAL TEMPERATURE RISE (°C)
18
Maximum Output Current
vs Input Voltage
500
8045 G35
20
15
10
18VIN
12VIN
5VIN
3.3VIN
5
0
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
8045 G36
8045fc
For more information www.linear.com/LTM8045
7
LTM8045
Typical Performance Characteristics
Internal Temperature Rise
vs Output Current, –5VOUT
Inverting Converter
Internal Temperature Rise
vs Output Current, –8VOUT Inverting
Converter
35
35
25
30
30
20
15
10
18VIN
12VIN
5VIN
3.3VIN
5
0
0
25
20
15
10
18VIN
12VIN
5VIN
3.3VIN
5
0
100 200 300 400 500 600 700 800
OUTPUT CURRENT (mA)
0
100
200 300 400 500
OUTPUT CURRENT (mA)
8045 G37
15
10
18VIN
12VIN
5VIN
3.3VIN
5
0
0
100
200
300
400
500
OUTPUT CURRENT (mA)
600
8045 G39
40
35
30
25
20
15
18VIN
12VIN
5VIN
3.3VIN
10
5
0
100
200
300
400
OUTPUT CURRENT (mA)
500
INTERNAL TEMPERATURE RISE (°C)
60
50
40
30
20
18VIN
12VIN
5VIN
10
0
0
100
200
300
400
OUTPUT CURRENT (mA)
8045 G40
8
20
Internal Temperature Rise
vs Output Current, –15VOUT
Inverting Converter
45
INTERNAL TEMPERATURE RISE (°C)
700
25
8045 G38
Internal Temperature Rise
vs Output Current, –12VOUT
Inverting Converter
0
600
INTERNAL TEMPERATURE RISE (°C)
30
INTERNAL TEMPERATURE RISE (°C)
INTERNAL TEMPERATURE RISE (°C)
Internal Temperature Rise
vs Output Current, –3.3VOUT
Inverting Converter
500
8045 G41
8045fc
For more information www.linear.com/LTM8045
LTM8045
Pin Functions
VOUT– (Bank 1): VOUT– is the negative output of the
LTM8045. Apply an external capacitor between VOUT+ and
VOUT–. Tie this net to GND to configure the LTM8045 as
a positive output SEPIC regulator.
VOUT+ (Bank 2): VOUT+ is the positive output of the
LTM8045. Apply an external capacitor between VOUT+ and
VOUT–. Tie this net to GND to configure the LTM8045 as
a negative output inverting regulator.
GND (Bank 3): Tie these GND pins to a local ground plane
below the LTM8045 and the circuit components. GND
MUST BE CONNECTED EITHER TO VOUT+ OR VOUT– FOR
PROPER OPERATION. In most applications, the bulk of
the heat flow out of the LTM8045 is through these pads,
so the printed circuit design has a large impact on the
thermal performance of the part. See the PCB Layout and
Thermal Considerations sections for more details. Return
the feedback divider (RFB) to this net.
VIN (Bank 4): The VIN pin supplies current to the LTM8045’s
internal regulator and to the internal power switch. This
pin must be locally bypassed with an external, low ESR
capacitor.
SYNC (Pin E1): To synchronize the switching frequency
to an outside clock, simply drive this pin with a clock. The
high voltage level of the clock needs to exceed 1.3V, and
the low level should be less than 0.4V. Drive this pin to
less than 0.4V to revert to the internal free running clock.
Ground this pin if the SYNC function is not used. See the
Applications Information section for more information.
SS (Pin F1): Place a soft-start capacitor here. Upon start-up,
the SS pin will be charged by a (nominally) 275k resistor
to about 2.2V.
RT (Pin G1): The RT pin is used to program the switching
frequency of the LTM8045 by connecting a resistor from
this pin to ground. The necessary resistor value for the
LTM8045 is determined by the equation RT = (91.9/fOSC) – 1,
where fOSC is the typical switching frequency in MHz and
RT is in kΩ. Do not leave this pin open.
RUN (Pin G3): This pin is used to enable/disable the chip
and restart the soft-start sequence. Drive below 1.235V
to disable the chip. Drive above 1.385V to activate chip
and restart the soft-start sequence. Do not float this pin.
FB (Pin A3): If configured as a SEPIC, the LTM8045
regulates its FB pin to 1.215V. Apply a resistor between
FB and VOUT+. Its value should be RFB = [(VOUT – 1.215)/
0.0833]kΩ. If the LTM8045 is configured as an inverting
converter, the LTM8045 regulates the FB pin to 5mV. Apply
a resistor between FB and VOUT– of value RFB = [(|VOUT|
+ 0.005)/0.0833]kΩ.
8045fc
For more information www.linear.com/LTM8045
9
LTM8045
Block Diagram
VOUT–
VIN
•
•
10µH
1µF
2µF
10µH
0.1µF
VOUT+
RUN
FB
SS
SYNC
CURRENT
MODE
CONTROLLER
RT
GND
8045 BD
10
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LTM8045
Operation
The LTM8045 is a stand-alone switching DC/DC converter
that may be configured either as a SEPIC (single-ended
primary inductance converter) or inverting power supply
simply by tying VOUT– or VOUT+ to GND, respectively.
It accepts an input voltage up to 18VDC. The output is
adjustable between 2.5V and 15V for the SEPIC, and
between –2.5V and –15V for the inverting configuration.
The LTM8045 can provide 700mA at VIN = 12V when VOUT
= 2.5V or –2.5V.
As shown in the Block Diagram, the LTM8045 contains a
current mode controller, power switching element, power
coupled inductor, power Schottky diode and a modest
amount of input and output capacitance. The LTM8045
is a fixed frequency PWM converter.
The LTM8045 switching can free run by applying a resistor to the RT pin or synchronize to an external source at
a frequency between 200kHz and 2MHz. To synchronize
to an external source, drive a valid signal source into the
SYNC pin. An RT resistor is required whether or not a
SYNC signal is applied. See the Applications Information
section for more details.
The LTM8045 also features RUN and SS pins to control
the start-up behavior of the device. The RUN pin may also
be used to implement an accurate undervoltage lockout
function by applying just one or two resistors.
The LTM8045 is equipped with a thermal shutdown to
protect the device during momentary overload conditions.
It is set above the 125°C absolute maximum internal temperature rating to avoid interfering with normal specified
operation, so internal device temperatures will exceed
the absolute maximum rating when the overtemperature
protection is active. Therefore, continuous or repeated
activation of the thermal shutdown may impair device
reliability.
8045fc
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11
LTM8045
Applications Information
For most applications, the design process is straight
forward, summarized as follows:
1. Look at Table 1 and find the row that has the desired
input range and output voltage.
2. Apply the recommended CIN, COUT, RFB and RT values.
While these component combinations have been tested
for proper operation, it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental conditions. Bear in mind that the
maximum output current is limited by junction temperature, the relationship between the input and output voltage
magnitudes, polarity and other factors. Please refer to the
graphs in the Typical Performance Characteristics section
for guidance.
The maximum frequency (and attendant RT value) at which
the LTM8045 should be allowed to switch is given in
Table 1 in the fMAX column, while the recommended frequency (and RT value) for optimal efficiency over the given
input condition is given in the fOPTIMAL column.
Table 1. Recommended Component Values and Configuration
(TA = 25°C. See the Typical Performance Characteristics for Load Conditions)
SEPIC Topology
VIN (V)
VOUT (V)
CIN
COUT
RFB (k)
fOPTIMAL
RT(OPTIMAL) (k)
fMAX (MHz)
RT(MIN) (k)
2.8 to 18
2.5
4.7µF, 25V, 1206
100µF, 6.3V, 1210
15.4
600kHz
154
1.3
69.8
2.8 to 18
3.3
4.7µF, 25V, 1206
100µF, 6.3V, 1210
24.9
700kHz
130
1.5
60.4
2.8 to 18
5
4.7µF, 25V, 1206
100µF, 6.3V, 1210
45.3
800kHz
115
2
45.3
2.8 to 18
8
4.7µF, 25V, 1206
47µF, 10V, 1210
80.6
1MHz
90.9
2
45.3
2.8 to 18
12
4.7µF, 25V, 1206
22µF, 16V, 1210
130
1.2MHz
75.0
2
45.3
4.5 to 18
15
4.7µF, 25V, 1206
22µF, 25V, 1210
165
1.5MHz
60.4
2
45.3
Inverting Topology
VIN (V)
VOUT (V)
CIN
COUT
RFB (k)
fOPTIMAL
RT(OPTIMAL) (k)
fMAX (MHz)
RT(MIN) (k)
2.8 to 18
–2.5
4.7µF, 25V, 0805
47µF, 6.3V, 1206
30.1
600kHz
154
1.3
69.8
2.8 to 18
–3.3
4.7µF, 25V, 0805
47µF, 6.3V, 1206
39.2
650kHz
140
1.5
60.4
2.8 to 18
–5
4.7µF, 25V, 0805
22µF, 6.3V, 1206
60.4
700kHz
130
2
45.3
2.8 to 18
–8
4.7µF, 25V, 1206
22µF, 10V, 1206
95.3
1MHz
90.9
2
45.3
2.8 to 18
–12
4.7µF, 25V, 1206
10µF, 16V, 1206
143
1.2MHz
75.0
2
45.3
4.5 to 18
–15
4.7µF, 25V, 1206
4.7µF, 25V, 1206
178
1.5MHz
60.4
2
45.3
12
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LTM8045
Applications Information
Setting Output Voltage
The output voltage is set by connecting a resistor (RFB)
from VOUT+ to the FB pin for a SEPIC and from VOUT– to
the FB pin for an inverting converter. RFB is determined
from the equation RFB = [(VOUT – 1.215)/0.0833]kΩ for
a SEPIC and from RFB = [(|VOUT| + 0.005)/0.0833]kΩ for
an inverting converter.
Capacitor Selection Considerations
The CIN and COUT capacitor values in Table 1 are the
minimum recommended values for the associated operating conditions. Applying capacitor values below those
indicated in Table 1 is not recommended, and may result
in undesirable operation. Using larger values is generally
acceptable, and can yield improved dynamic response, if
it is necessary. Again, it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental conditions.
Ceramic capacitors are small, robust and have very low
ESR. However, not all ceramic capacitors are suitable.
X5R and X7R types are stable over temperature and applied voltage and give dependable service. Other types,
including Y5V and Z5U have very large temperature and
voltage coefficients of capacitance. In an application circuit they may have only a small fraction of their nominal
capacitance resulting in much higher output voltage ripple
than expected.
A final precaution regarding ceramic capacitors concerns
the maximum input voltage rating of the LTM8045. A
ceramic input capacitor combined with trace or cable
inductance forms a high Q (under damped) tank circuit.
If the LTM8045 circuit is plugged into a live supply, the
input voltage can ring to twice its nominal value, possibly exceeding the device’s rating. This situation is easily
avoided; see the Hot-Plugging Safely section.
Programming Switching Frequency
The LTM8045 has an operational switching frequency range
between 200kHz and 2MHz. The free running frequency is
programmed with an external resistor from the RT pin to
ground. Do not leave this pin open under any circumstance.
When the SYNC pin is driven low (< 0.4V), the frequency
of operation is set by the resistor from RT to ground. The
RT value is calculated by the following equation:
RT =
91.9
−1
fOSC
where fOSC is the typical switching frequency in MHz and
RT is in kΩ.
Switching Frequency Trade-Offs
It is recommended that the user apply the optimal RT value
given in Table 1 for the corresponding input and output
operating condition. System level or other considerations,
however, may necessitate another operating frequency.
While the LTM8045 is flexible enough to accommodate a
wide range of operating frequencies, a haphazardly chosen
one may result in undesirable operation under certain operating or fault conditions. A frequency that is too high can
reduce efficiency, generate excessive heat or even damage
the LTM8045 in some fault conditions. A frequency that
is too low can result in a final design that has too much
output ripple or too large of an output capacitor.
Switching Frequency Synchronization
The switching frequency can be synchronized to an external
clock source. To synchronize to the external source, simply
provide a digital clock signal at the SYNC pin. Switching
will occur at the SYNC clock frequency. Drive SYNC low
and the switching frequency will revert to the internal
free-running oscillator after a few clock periods.
Switching will stop if SYNC is driven high.
The duty cycle of SYNC must be between 35% and 65%
for proper operation. Also, the frequency of the SYNC
signal must meet the following two criteria:
1. SYNC may not toggle outside the frequency range of
200kHz to 2MHz unless it is stopped low to enable the
free-running oscillator.
2. The SYNC frequency can always be higher than the
free-running oscillator frequency, fOSC, but should not
be less than 25% below fOSC (fOSC is set by RT).
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13
LTM8045
Applications Information
Soft-Start
The LTM8045 soft-start function controls the slew rate
of the power supply output voltage during start-up. A
controlled output voltage ramp minimizes output voltage
overshoot, reduces inrush current from the VIN supply,
and facilitates supply sequencing. A capacitor connected
from the SS pin to GND programs the slew rate. In the
event of a commanded shutdown or lockout (RUN pin),
internal undervoltage lockout or a thermal shutdown, the
soft-start capacitor is automatically discharged before
charging resumes, thus assuring that the soft-start occurs
when the LTM8045 restarts. The soft-start time is given
by the equation:
The RUN pin has a voltage hysteresis with typical thresholds of 1.32V (rising) and 1.29V (falling) and an internal
circuit that draws typically 11.6µA at the RUN threshold.
This makes RUVLO2 optional, allowing UVLO implementation with a single resistor. Resistor RUVLO2 is optional.
RUVLO2 can be included to reduce the overall UVLO voltage
variation caused by variations in the RUN pin current (see
the Electrical Characteristics section). A good choice for
RUVLO2 is ≤10k ±1%. After choosing a value for RUVLO2,
RUVLO1 can be determined from either of the following:
RUVLO1 =
tSS = CSS /5.45,
or
where CSS is in µF and tSS is in seconds.
RUVLO1 =
Configurable Undervoltage Lockout
Figure 1 shows how to configure an undervoltage lockout (UVLO) for the LTM8045. Typically, UVLO is used in
situations where the input supply is current-limited, has
a relatively high source resistance, or ramps up/down
slowly. A switching regulator draws constant power from
the source, so source current increases as source voltage
drops. This looks like a negative resistance load to the
source and can cause the source to current-limit or latch
low under low source voltage conditions. UVLO prevents
the regulator from operating at source voltages where
these problems might occur.
VIN
VIN
For example, to disable the LTM8045 for VIN voltages
below 3.5V using the single resistor configuration, choose:
RUVLO1 =
3.5V − 1.29V
= 191k
1.29V
+ 11.6µA
∞
To activate the LTM8045 for VIN voltage greater than 4.5V
using the two resistor configuration, choose RUVLO2 =
10k and:
RUVLO1 =
RUVLO1
RUN
VIN(FALLING) − 1.29V
1.29V
+ 11.6µA
RUVLO2
where VIN(RISING) and VIN(FALLING) are the VIN threshold
voltages when rising or falling, respectively.
LTM8045
4.5V − 1.32V
= 22.1k
1.32V
+ 11.6µA
10k
Internal Undervoltage Lockout
RUVLO2
GND
8045 F01
Figure 1. The RUN Pin May Be Used
to Implement an Accurate UVLO
14
VIN(RISING) − 1.32V
1.32V
+ 11.6µA
RUVLO2
The LTM8045 monitors the VIN supply voltage in case VIN
drops below a minimum operating level (typically about
2.3V). When VIN is detected low, the power switch is
deactivated, and while sufficient VIN voltage persists, the
soft-start capacitor is discharged. After VIN is detected high,
the LTM8045 will reactivate and the soft-start capacitor
will begin charging.
8045fc
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LTM8045
Applications Information
Thermal Shutdown
If the part is too hot, the LTM8045 engages its thermal
shutdown, terminates switching and discharges the softstart capacitor. When the part has cooled, the part automatically restarts. This thermal shutdown is set to engage at
temperatures above the 125°C absolute maximum internal
operating rating to ensure that it does not interfere with
functionality in the specified operating range. This means
that internal temperatures will exceed the 125°C absolute
maximum rating when the overtemperature protection is
active, possibly impairing the device’s reliability.
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8045. The LTM8045 is nevertheless a switching power supply, and care must be taken to
minimize EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 2
for the suggested layout of the inverting topology application and Figure 3 for the suggested layout of the SEPIC
topology application. Ensure that the grounding and heat
sinking are acceptable.
6. Use vias to connect the GND copper area to the board’s
internal ground planes. Liberally distribute these GND
vias to provide both a good ground connection and
thermal path to the internal planes of the printed circuit
board. Pay attention to the location and density of the
thermal vias in Figures 2 and 3. The LTM8045 can
benefit from the heat sinking afforded by vias that connect to internal GND planes at these locations, due to
their proximity to internal power handling components.
The optimum number of thermal vias depends upon
the printed circuit board design. For example, a board
might use very small via holes. It should employ more
thermal vias than a board that uses larger holes.
VOUT–
COUT
GND
RFB
FB
VIN
CIN
RUN
RT
GND
RT
8045 F02
GROUND, THERMAL VIAS
A few rules to keep in mind are:
1. Place the RFB and RT resistors as close as possible to
their respective pins.
2. Place the CIN capacitor as close as possible to the VIN
and GND connection of the LTM8045.
GND
Figure 2. Layout Showing Suggested External
Components, GND Plane and Thermal Vias for
the Inverting Topology Application
GND
VIN
CIN
3. Place the Cout capacitor as close as possible to the
VOUT+ and VOUT– connections of the LTM8045.
4. Place the CIN and COUT capacitors such that their
ground currents flow directly adjacent or underneath
the LTM8045.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8045.
COUT
FB
RUN
RFB
RT
VOUT+
GROUND, THERMAL VIAS
RT
GND
8045 F03
Figure 3. Layout Showing Suggested External
Components, GND Plane and Thermal Vias
for the SEPIC Topology Application
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15
LTM8045
Applications Information
Hot-Plugging Safely
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
bypass capacitor of the LTM8045. However, these capacitors can cause problems if the LTM8045 is plugged into a
live input supply (see Application Note 88 for a complete
discussion). The low loss ceramic capacitor combined with
stray inductance in series with the power source forms an
underdamped tank circuit, and the voltage at the VIN pin
of the LTM8045 can ring to more than twice the nominal
input voltage, possibly exceeding the LTM8045’s rating
and damaging the part. If the input supply is poorly controlled or the user will be plugging the LTM8045 into an
energized supply, the input network should be designed
to prevent this overshoot. This can be accomplished by
installing a small resistor in series with VIN, but the most
popular method of controlling input voltage overshoot is
to add an electrolytic bulk capacitor to the VIN net. This
capacitor’s relatively high equivalent series resistance
damps the circuit and eliminates the voltage overshoot.
The extra capacitor improves low frequency ripple filtering and can slightly improve the efficiency of the circuit,
though it is physically large.
Thermal Considerations
The LTM8045 output current may need to be derated if
it is required to operate in a high ambient temperature or
deliver a large amount of continuous power. The amount
of current derating is dependent upon the input voltage,
output power and ambient temperature. The temperature
rise curves given in the Typical Performance Characteristics section can be used as a guide. These curves were
generated by a LTM8045 mounted to a 25.8cm2 4-layer
FR4 printed circuit board with a copper thickness of 2oz
for the top and bottom layer and 1oz for the inner layers.
Boards of other sizes and layer count can exhibit different thermal behavior, so it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental operating conditions.
16
The thermal resistance numbers listed in the Pin Configuration section of the data sheet are based on modeling the
µModule package mounted on a test board specified per
JESD 51-9 (“Test Boards for Area Array Surface Mount
Package Thermal Measurements”). The thermal coefficients
provided in this page are based on JESD 51-12 (“Guidelines for Reporting and Using Electronic Package Thermal
Information”).
For increased accuracy and fidelity to the actual application,
many designers use FEA to predict thermal performance.
To that end, the Pin Configuration section of the data sheet
typically gives four thermal coefficients:
• θJA – Thermal resistance from junction to ambient
• θJCbottom – Thermal resistance from junction to the
bottom of the product case
• θJCtop – Thermal resistance from junction to top of the
product case
• θJB – Thermal resistance from junction to the printed
circuit board.
While the meaning of each of these coefficients may seem
to be intuitive, JEDEC has defined each to avoid confusion
and inconsistency. These definitions are given in JESD
51-12, and are quoted or paraphrased below:
• θJA is the natural convection junction-to-ambient air
thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to as
“still air” although natural convection causes the air to
move. This value is determined with the part mounted to
a JESD 51-9 defined test board, which does not reflect
an actual application or viable operating condition.
• θJCbottom is the thermal resistance between the junction
and bottom of the package with all of the component
power dissipation flowing through the bottom of the
package. In the typical µModule converter, the bulk of
the heat flows out the bottom of the package, but there
is always heat flow out into the ambient environment.
As a result, this thermal resistance value may be useful
for comparing packages but the test conditions don’t
generally match the user’s application.
8045fc
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LTM8045
Applications Information
• θJCtop is determined with nearly all of the component
power dissipation flowing through the top of the package. As the electrical connections of the typical µModule
converter are on the bottom of the package, it is rare
for an application to operate such that most of the heat
flows from the junction to the top of the part. As in the
case of θJCbottom, this value may be useful for comparing
packages but the test conditions don’t generally match
the user’s application.
• θJB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
µModule converter and into the board, and is really
the sum of the θJCbottom and the thermal resistance
of the bottom of the part through the solder joints and
through a portion of the board. The board temperature is
measured a specified distance from the package, using
a two-sided, two layer board. This board is described
in JESD 51-9.
Given these definitions, it should now be apparent that none
of these thermal coefficients reflects an actual physical
operating condition of a µModule converter. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 4.
The blue resistances are contained within the µModule
converter, and the green are outside.
The die temperature of the LTM8045 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8045. The bulk of the heat flow out of the LTM8045
is through the bottom of the μModule converter and the
BGA pads into the printed circuit board. Consequently a
poor printed circuit board design can cause excessive
heating, resulting in impaired performance or reliability.
Please refer to the PCB Layout section for printed circuit
board design suggestions.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-CASE
CASE (BOTTOM)-TO-BOARD
(BOTTOM) RESISTANCE
RESISTANCE
AMBIENT
BOARD-TO-AMBIENT
RESISTANCE
8045 F04
µMODULE DEVICE
Figure 4.
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For more information www.linear.com/LTM8045
17
LTM8045
Typical Applications
–5V Inverting Converter
Maximum Output Current vs Input Voltage
–5VOUT Inverting Converter
650
LTM8045
VOUT–
•
4.7µF
RUN
60.4k
SS
RT
130k
600
VOUT
–5V
OUTPUT CURRENT (mA)
VIN
•
VIN
2.8VDC TO
18VDC
22µF
FB
SYNC
VOUT+
GND
550
500
450
400
350
8045 TA02
300
2
4
6
8
10 12 14
INPUT VOLTAGE (V)
16
18
8045 TA02b
–5V Inverting Converter with Added Output Filter
Output Ripple and Noise
LTM8045
•
•
RUN
4.7µF
60.4k
SS
RT
130k
MPZ1608S601A
FERRITE BEAD
VOUT–
VIN
VIN
12VDC
SYNC
200µV/DIV
22µF
FB
VOUT
–5V
580mA
10µF
VOUT+
GND
8045 TA03
500ns/DIV
MEASURED PER AN70,
USING HP461A AMPLIFIER,
150MHz BW
8045 TA03b
–12V Inverting Converter
LTM8045
VOUT–
VIN
4.7µF
RUN
143k
SS
RT
75.0k
SYNC
VOUT
–12V
•
•
VIN
2.8VDC TO
18VDC
10µF
FB
GND
VOUT+
8045 TA04
18
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For more information www.linear.com/LTM8045
LTM8045
Package Description
Table 2. Pin Assignment Table (Arranged by Pin Number)
PIN NUMBER
FUNCTION
A1
VOUT
+
A2
VOUT+
A3
FB
PIN NUMBER
FUNCTION
PIN NUMBER
FUNCTION
PIN NUMBER
FUNCTION
B1
VOUT
+
C1
GND
D1
GND
B2
VOUT+
C2
GND
D2
GND
B3
GND
C3
GND
D3
GND
A4
VOUT
–
B4
VOUT
–
C4
GND
D4
GND
A5
VOUT–
B5
VOUT–
C5
GND
D5
GND
E1
SYNC
F1
SS
G1
RT
H1
GND
E2
GND
F2
GND
G2
GND
H2
GND
E3
GND
F3
GND
G3
RUN
H3
GND
E4
GND
F4
GND
G4
VIN
H4
VIN
E5
GND
F5
GND
G5
VIN
H5
VIN
Package Photo
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19
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3.4925
2.8575
4
4.445
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
2.540
SUGGESTED PCB LAYOUT
TOP VIEW
1.270
PACKAGE TOP VIEW
0.3175
0.000
0.3175
PIN “A1”
CORNER
E
1.270
aaa Z
2.540
20
Y
D
X
aaa Z
3.95 – 4.05
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
NOM
4.92
0.60
4.32
0.78
0.63
11.25
6.25
1.27
8.89
5.08
DIMENSIONS
0.15
0.10
0.20
0.30
0.15
MAX
5.12
0.70
4.42
0.85
0.66
NOTES
DETAIL B
PACKAGE SIDE VIEW
TOTAL NUMBER OF BALLS: 40
MIN
4.72
0.50
4.22
0.71
0.60
DETAIL A
b1
0.27 – 0.37
SUBSTRATE
ddd M Z X Y
eee M Z
DETAIL B
MOLD
CAP
ccc Z
A1
A2
A
Z
(Reference LTC DWG # 05-08-1867 Rev A)
Øb (40 PLACES)
// bbb Z
b
3
F
e
SEE NOTES
4
3
2
1
DETAIL A
PACKAGE BOTTOM VIEW
5
G
H
G
F
E
D
C
B
A
PIN 1
7
SEE NOTES
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
7
TRAY PIN 1
BEVEL
!
BGA 40 1212 REV A
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
5. PRIMARY DATUM -Z- IS SEATING PLANE
BALL DESIGNATION PER JESD MS-028 AND JEP95
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
COMPONENT
PIN “A1”
BGA Package
40-Lead (11.25mm × 6.25mm × 4.92mm)
LTM8045
Package Description
Please refer to http://www.linear.com/product/LTM8045#packaging for the most recent package drawings.
8045fc
LTM8045
Revision History
REV
DATE
DESCRIPTION
A
02/13
Output voltage maximum: changed from 16V and –16V to 15V and –15V, respectively
PAGE NUMBER
B
02/14
Add SnPb BGA package option
1, 2
C
10/16
Table 1: changed from RADJ to RFB
12
1
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However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection
of its information
circuits as described
herein will not infringe on existing patent rights.
For more
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21
LTM8045
Typical Application
12V SEPIC Converter
Maximum Output Current vs Input
Voltage 12VOUT SEPIC
500
LTM8045
VOUT–
VIN
RUN
SS
FB
RT
75.0k
22µF
SYNC
GND
VOUT+
130k
VOUT
12V
8045 TA05
OUTPUT CURRENT (mA)
4.7µF
450
•
•
VIN
2.8VDC TO 18VDC
400
350
300
250
200
150
2
4
6
8
10 12 14
INPUT VOLTAGE (V)
16
18
8045 TA05b
Related Parts
PART NUMBER
DESCRIPTION
COMMENTS
LTM8047
1.5W, 725VDC Isolated μModule Regulator
1.5W Output Power, 3.1V ≤ VIN ≤ 32V, 2.5V ≤ VOUT ≤ 12V,
9mm × 11.25mm × 4.92mm BGA Package
LTM8048
1.5W, 725VDC Isolated μModule Regulator with
Integrated Low Noise Post Regulator
1.5W Output Power, 3.1V ≤ VIN ≤ 32V, 1.2V ≤ VOUT ≤ 12V,
1mVP-P Output Ripple, 9mm × 11.25mm × 4.92mm BGA Package
LTM8025
36VIN, 3A Step-Down μModule Regulator
3.6V ≤ VIN ≤ 36V, 0.8V ≤ VOUT ≤ 24V, Synchronizable,
9mm × 15mm × 4.32mm LGA Package
LTM8033
36V, 3A EN55022 Class B Certified DC/DC Step-Down
μModule Regulator
3.6V ≤ VIN ≤ 36V, 0.8V ≤ VOUT ≤ 24V, Synchronizable,
11.25mm × 15mm × 4.3mm LGA
LTM8026
36VIN, 5A Step-Down μModule Regulator with
Adjustable Current Limit
6V ≤ VIN ≤ 36V, 1.2V ≤ VOUT ≤ 24V, Adjustable Current Limit,
Synchronizable, 11.25mm × 15mm × 2.82mm LGA
LTM8027
60VIN, 4A DC/DC Step-Down μModule Regulator
4.5V ≤ VIN ≤ 60V, 2.5V ≤ VOUT ≤ 24V, Synchronizable,
15mm × 15mm × 4.3mm LGA
LTM4613
36VIN, 8A EN55022 Class B Certified DC/DC Step-Down 3.3V ≤ VOUT ≤ 15V, 5V ≤ VIN ≤ 36V, PLL Input, VOUT Tracking and Margining,
μModule Regulator
15mm × 15mm × 4.3mm LGA
LTM8061
32V, 2A Step-Down μModule Battery Charger with
Programmable Input Current Limit
Suitable for CC-CV Charging Single and Dual Cell Li-Ion or Li-Poly Batteries,
4.95V ≤ VIN ≤ 32V, C/10 or Adjustable Timer Charge Termination, NTC
Resistor Monitor Input, 9mm × 15mm × 4.32mm LGA
LTM8062A
32V, 2A Step-Down μModule Battery Charger with
Integrated Maximum Peak Power Tracking (MPPT) for
Solar Applications
Suitable for CC-CV Charging Method Battery Chemistries (Li-Ion, Li-Poly,
Lead-Acid, LiFePO4), User adjustable MPPT servo voltage, 4.95V ≤ VIN ≤
32V, 3.3V ≤ VBATT ≤ 18.8V Adjustable, C/10 or Adjustable Timer Charge
Termination, NTC Resistor Monitor Input, 9mm × 15mm × 4.32mm LGA
LTC2978
Octal Digital Power Supply Manager with EEPROM
I2C/PMBus Interface, Configuration EEPROM, Fault Logging, 16-Bit ADC with
±0.25% TUE, 3.3V to 15V Operation
LTC2974
Quad Digital Power Supply Manager with EEPROM
I2C/PMBus Interface, Configuration EEPROM, Fault Logging, Per Channel
Voltage, Current and Temperature Measurements
LTC3880
Dual Output PolyPhase® Step-Down DC/DC Controller
with Digital Power System Management
I2C/PMBus Interface, Configuration EEPROM, Fault Logging, ±0.5% Output
Voltage, Accuracy, MOSFET Gate Drivers
22 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LTM8045
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/LTM8045
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LT 1116 REV C • PRINTED IN USA
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