19-0823; Rev 0; 5/07
MAX17009 Evaluation Kit
Features
The MAX17009 evaluation kit (EV kit) demonstrates the
high-power, dynamically adjustable, dual-phase notebook CPU application circuit for AMD® mobile serial
VID interface (SVI) CPU core supplies. This DC-DC
converter steps down high-voltage batteries and/or AC
adapters, generating a precision, low-voltage CPU
core. The MAX17009 EV kit meets the AMD mobile SVI
CPU’s transient voltage specification, power-good
signaling, voltage-regulator thermal monitoring
(VRHOT), and power-good output (PWRGD). The
MAX17009 EV kit consists of the MAX17009 dualphase, interleaved fixed-frequency step-down
controller, configured for separate mode operation, and
a reference buffer. The switching regulators (SMPSs)
provide power to two independent CPU cores, while the
reference buffer output (NBV_BUF) sets the voltage
regulation level for a north bridge (NB) regulator,
completing the total CPU cores and NB power
requirements.
♦ Dual Output, Fast-Response Interleaved Fixed
Frequency
Output voltages are dynamically changed through a
2-wire serial interface, allowing the SMPS and the
NBV_BUF to be individually programmed to different
voltages. A programmable slew-rate controller enables
controlled upward transitions between VID codes for
the switching regulators, while the slew rate for the reference buffer is set by an external capacitor.
Soft-start limits the inrush current, and soft-shutdown
brings the output voltage back down to zero without
any negative ring. The MAX17009 EV kit includes active
voltage positioning with adjustable gain, reducing
power dissipation and bulk output capacitance requirements. The MAX17009 includes latched output undervoltage fault, overvoltage fault protection, and thermaloverload protection. It also includes a voltage-regulator
power-good (PWRGD) output.
This fully assembled and tested printed circuit board
(PCB) provides a digitally adjustable 0 to 1.550V output
voltage range (7-bit on-board DAC) from a 7V to 24V battery input range. Each phase delivers up to 18A output
current for a total of 36A. The EV kit operates at 300kHz
switching frequency (per phase) and has superior lineand load-transient response. The EV kit also includes
Windows® 2000/XP-compatible software, which provides a simple graphical user interface (GUI) for exercising the features of the MAX17009.
♦ 0 to 1.550V Output-Voltage Range (7-Bit On-Board
DAC)
♦ AMD Mobile SVI-Compliant Serial Interface
♦ Separate or Combinable Outputs Detected at
Power-Up
♦ Reference Buffer Output
♦ Dynamic Phase Selection Optimizes Active/Sleep
Efficiency
♦ Transient Phase Repeat Reduces Output
Capacitance
♦ Active Voltage Positioning with Adjustable Gain
♦ High Speed, Accuracy, and Efficiency
♦ Low-Bulk Output Capacitor Count
♦ 7V to 24V Input-Voltage Range
♦ 36A Load-Current Capability (18A Each Phase)
♦ Accurate Current Balance and Current Limit
♦ 300kHz Switching Frequency (per Phase)
♦ Power-Good (PWRGD) and Thermal-Fault
(VRHOT) Output Indicators
♦ System Power-OK (PGD_IN) Input
♦ Output Overvoltage and Undervoltage Fault
Protection
♦ 40-Pin Thin QFN Package (5mm x 5mm)
♦ Fully Assembled and Tested
Ordering Information
PART
TYPE
MAX17009EVKIT+
EV Kit
+Denotes lead-free and RoHS-compliant.
AMD is a registered trademark of Advanced Micro Devices, Inc.
Windows is a registered trademark of Microsoft Corp.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1
Evaluates: MAX17009
General Description
Evaluates: MAX17009
MAX17009 Evaluation Kit
Component List
DESIGNATION QTY
C1–C4
C5–C8
C9, C44–C48,
C58
C10, C19, C49,
C50
C11
C12, C13, C14
C15, C21, C22,
C59, C60
C16, C17, C18,
C20, C23
C24, C25
C26–C37
C38, C39, C41,
C42, C43, C53
2
DESCRIPTION
4
10µF ±20%, 25V X5R ceramic
capacitors (1210)
TDK C3225X7R1E106M
AVX 12103D106M
Taiyo Yuden TMK325BJ106MM
4
470µF ±20%, 2V 6mΩ low-ESR
polymer capacitors (D-case)
NEC/Tokin PSGD0E477M6 or
Panasonic EEFUD0D471L6
7
0.1µF ±10%, 25V X7R ceramic
capacitors (0603)
TDK C1608X7R1E104K or
Murata GRM188R71E104K
4
1µF ±10%, 16V X7R ceramic
capacitors (0603)
TDK C1608X7R1C105K
AVX 0603YD105MAT
1
2.2µF ±20%, 10V X5R ceramic
capacitor (0603)
TDK C1608X5R1A225M or
Murata GRM188R61A225M or
AVX 0603ZD225MAT
3
0.22µF ±20%, 10V X7R ceramic
capacitors (0603)
Taiyo Yuden LMK107BJ224MA
TDK C1608X7R1C224M
AVX 06033D224KAT
5
5
2
12
0
1000pF ±10%, 50V X7R ceramic
capacitors (0603)
TDK C1608X7R1H102K or
Murata GRM188R71H102K or
equivalent
4700pF ±10%, 50V X7R ceramic
capacitors (0603)
TDK C1608X7R1H472K or
Murata GRM188R71H472K or
equivalent
2200pF ±10%, 50V X7R ceramic
capacitors (0603)
TDK C1608X7R1H222K or
Murata GRM188R71H222K or
equivalent
22µF ±20%, 6.3V X5R ceramic
capacitors (0805)
TDK C2012X5R0J226MT
Taiyo Yuden JMK212BJ226MG
Not installed, ceramic capacitors
(0603)
DESIGNATION QTY
DESCRIPTION
1
3300pF ±10%, 50V X7R ceramic
capacitor (0603)
TDK C1608X7R1H332K
Taiyo Yuden UMK107B332MZ
C51, C52
2
10µF ±20%, 6.3V X5R ceramic
capacitors (0805)
TDK C2012X5R0J106M or
Taiyo Yuden AMK212BJ106MG
AVX 08056D106MAT
C54, C55
2
C56, C57
2
D1, D2
2
D3, D4
2
LEDs, green clear SMD (0805)
J1
1
USB series B right-angle PC-mount
receptacle
J2
0
Not installed
C40
22pF ±5%, 50V C0G ceramic
capacitors (0603)
TDK C1608C0G1H220J
10pF ±5%, 50V C0G ceramic
capacitors (0603)
TDK C1608C0G1H100J
30V, 3A Schottky diodes
Nihon EC31QS03L
Central Semiconductor CMSH3-40M
J4, J5
2
Scope probe jacks
JU1, JU3–JU6
5
3-pin headers
JU2
1
4-pin header
JU7
1
2-pin header
2
0.45µH, 30A 1.1mΩ power inductors
TOKO FDUE1040D-R45M or
NEC-Tokin MPC1040LR45
2
n-channel MOSFETs
(PowerPAK 8-pin SO)
Fairchild FDS6298 (8-pin SO)
Siliconix (Vishay): SI7634DP
N3–N6
4
n-channel MOSFETs
(PowerPAK 8-pin SO)
Fairchild FDS8670 (8-pin SO)
Siliconix (Vishay): SI7336ADP
N7, N8
0
Not installed, n-channel MOSFETs
(DPAK)
R1, R2
2
0.001Ω ±1%, 1W resistors (2512)
Panasonic ERJM1WTF1M0U
R3
1
120kΩ ±1% resistor (0603)
R4
1
100kΩ ±1% resistor (0603)
R5
1
40.2kΩ ±1% resistor (0603)
R6
0
Not installed, resistor—short PC trace
(0603)
L1, L2
N1, N2
_______________________________________________________________________________________
MAX17009 Evaluation Kit
DESIGNATION QTY
R7
R8
DESCRIPTION
DESIGNATION QTY
DESCRIPTION
1
13kΩ ±1% resistor (0603)
R49
1
R50
1
470Ω ±5% resistor (0603)
1
100kΩ ±5% NTC thermistor,
B = 4250 (0603)
Murata NCP18WF104J03RB
TDK NTCG163JF104J (0402) or
Panasonic ERT-J1VR104J
R61–R65
0
Not installed, resistors—short PC
trace (0603)
SW1–SW4
4
Pushbutton switches
U1
1
Dual-phase fixed-frequency controller
(40-pin thin QFN, 5mm x 5mm)
Maxim MAX17009GTL+
U2
1
Microcontroller (68-pin QFN-EP*)
Maxim MAXQ2000-RAX+
R9, R38, R39
3
100kΩ ±5% resistors (0603)
R10
1
143kΩ ±1% resistor (0603)
R11, R51, R53,
R54, R55, R56
6
1kΩ ±5% resistors (0603)
R12, R19
2
1.1kΩ ±1% resistors (0603)
R13, R14, R15,
R20, R21
5
100Ω ±5% resistors (0603)
R16, R36
2
51Ω ±5% resistors (0603)
R17, R18
2
1.5kΩ ±1% resistors (0603)
R22, R23
2
75Ω ±5% resistors (0603)
R24, R25, R37
3
10Ω ±5% resistors (0603)
R26, R27, R57
3
0Ω resistors (0603)
R28, R35
0
Not installed, 1W resistors (2512)
R29–R34,
R40, R41
0
R42, R43,
R45, R46
4
R44, R47, R52
3
1.5kΩ ±5% resistors (0603)
R48
1
2.2kΩ ±5% resistor (0603)
10kΩ ±5% resistor (0603)
93C46 type 3-wire EEPROM (8-pin SO),
16-bit architecture
Atmel AT93C46A-10SU-2.7
Digi-Key AT93C46A-10SU-2.7
UART-to-USB converter
(32-pin TQFP, 7mm x 7mm)
FTDI FT232BL
LDO regulator (5-pin SC70)
Maxim MAX8511EXK33+T
(Top Mark: AEI)
LDO regulator (5-pin SC70)
Maxim MAX8511EXK25+T
(Top Mark: ADV)
U3
1
U4
1
U5
1
Not installed, resistors (0603)
U6
1
27Ω ±5% resistors (0603)
Y1
1
16MHz crystal
Y2
1
6MHz crystal
—
1
PCB: MAX17009 Evaluation Kit+
*EP = Exposed pad.
Component Suppliers
SUPPLIER
PHONE
WEBSITE
AVX Corp.
360-699-8714
www.avx.com
Central Semiconductor
631-435-1110
www.centralsemi.com
Fairchild Semiconductor
888-522-5372
www.fairchildsemi.com
Murata Mfg. Co., Ltd.
770-436-1300
www.murata.com
NEC TOKIN America, Inc.
510-324-4110
www.nec-tokinamerica.com
Nihon Inter Electronics Corp.
847-843-7500
www.niec.co.jp
Panasonic Corp.
714-373-7939
www.panasonic.com
SANYO North America Corp.
619-661-6835
www.sanyodevice.com
Taiyo Yuden
800-348-2496
www.t-yuden.com
TDK Corp.
847-803-6100
www.component.tdk.com
TOKO America, Inc.
408-432-8281
www.tokoam.com
Vishay/Siliconix
402-564-3131
www.vishay.com
Würth Electronik GmbH & Co. KG
201-785-8800
www.we-online.com
Note: Indicate that you are using the MAX17009 when contacting these component suppliers.
_______________________________________________________________________________________
3
Evaluates: MAX17009
Component List (continued)
Evaluates: MAX17009
MAX17009 Evaluation Kit
MAX17009 EV Kit Files
FILE
INSTALL.EXE
DESCRIPTION
Installs the EV kit files on your computer
MAX17009.EXE
Application program
FTD2XX.INF
USB device driver file
UNINST.INI
Uninstalls the EV kit software
TROUBLESHOOTING_USB.PDF
USB driver installation help file
Quick Start
Recommended Equipment
•
7V to 24V, >100W power supply, battery, or notebook AC adapter
•
DC bias power supply, 5V at 1A
•
Two dummy loads capable of sinking 18A each
•
Digital multimeter (DMM)
•
100MHz dual-trace oscilloscope
•
A user-supplied Windows 2000/XP PC with a spare
USB port
Note: In the following sections, software-related items
are identified by bolding. Text in bold refers to items
directly from the EV kit software. Text in bold and
underlined refers to items from the Windows 2000/XP
operating system.
Procedure
The MAX17009 EV kit is fully assembled and tested.
Follow the steps below to verify board operation.
Caution: Do not turn on the power supply until all
connections are completed.
1) Visit the Maxim website (www.maxim-ic.com/evkitsoftware) to download the latest version of the EV kit
software, 17009xx.ZIP. Save the EV kit software to a
temporary folder and uncompress the ZIP file.
2) Install the EV kit software on your computer by running the INSTALL.EXE program inside the temporary folder. The program files are copied and icons
are created in the Windows Start | Programs
menu.
3) Ensure that the circuit is connected correctly to the
supplies and dummy load prior to applying any
power.
4) Verify that there are shunts across pins 1-2 of JU2
(OPTION = high) and pins 2-3 of JU3 (PRO = low).
5) Verify that there is a shunt across pins 1-2 of JU1
(PGD_IN), pins 1-2 of JU4 (SHDN), pins 1-2 of JU5
(SVD), and pins 1-2 of JU6 (SVC), allowing U2 to
control the MAX17009.
4
6) Turn on the battery power before turning on the 5V
bias power.
7) Connect the USB cable from the PC to the EV kit
board. A Building Driver Database window pops
up in addition to a New Hardware Found message
when installing the USB driver for the first time. If
you do not see a window that is similar to the one
described above after 30s, remove the USB cable
from the board and reconnect it. Administrator
privileges are required to install the USB device
driver on Windows 2000 and XP. Refer to the
TROUBLESHOOTING_USB.PDF document included with the software if you have any problems during this step.
8) Follow the directions of the Add New Hardware
Wizard to install the USB device driver. Choose the
Search for the best driver for your device option.
Specify the location of the device driver to be
C:\Program Files\MAX17009 (default installation
directory) using the Browse button.
9) Start the EV kit software by opening its icon in the
Start | Programs menu. The EV kit software main
window should appear, as shown in Figure 1.
10) Check the Core 0, Core 1, and North Bridge
checkboxes. Move any slider to adjust the voltage
to 1.2V and press the Send Data button.
11) Observe the 1.2000V output voltage on the SMPS
and NBV_BUF outputs with the DMM and/or oscilloscope. Look at the LX switching nodes and MOSFET
gate-drive signals while varying the load current.
Detailed Description of Software
The main window of the evaluation software (Figure 1)
displays Address to Send, Data to Send, Last
Address Sent, and Last Data Sent status. In addition,
the GUI allows the user to select Core 0, Core 1, and/or
North Bridge outputs.
The sliders to the right of each output checkbox correspond with the output voltage setting for that core. The
Send Data button must be pressed to write the new
output voltage setting(s) to the MAX17009. The Last
_______________________________________________________________________________________
MAX17009 Evaluation Kit
Evaluates: MAX17009
Figure 1. MAX17009 EV Kit Software Main Window
Address Sent and Last Data Sent status helps the
user keep track of the last transmission.
Saving Power
Unchecking the Power-Saving Off checkbox puts the
MAX17009 in power-saving mode. The MAX17009 is in
normal operation while the Power-Saving Off checkbox is checked. In power-saving mode, NB_SKP is
forced low, and the SMPS offset, if enabled, is
removed.
Resetting the GUI (RESET GUI)
The software main window will need to be synchronized
to the MAX17009 EV kit hardware after the following
events:
•
Pressing any of the on-board switches (SW1–SW4)
•
Recycling 5V power to the MAX17009 EV kit
Press the RESET GUI button after any of the above
events in order to use the software main window again.
I2C Low-Level Commands
Press the Options | 2-wire low level menu item at
the top of the GUI to execute low-level I2C interface
commands. Once the new window opens, go to the
2-wire Interface tab | General Commands |
SMBusSendByte(addr,cmd) to write hex data manually into the registers of the MAX17009.
_______________________________________________________________________________________
5
Evaluates: MAX17009
MAX17009 Evaluation Kit
Detailed Description of Firmware
The on-board switches (SW1–SW4) allow the user to
perform four different predetermined high-speed I2C
tests. Detailed descriptions of each dynamic output test
are given below.
The sequence for the dynamic output test assigned to
SW1 is shown in Table 1.
Table 1. SW1 Dynamic Output Test with
High-Speed I2C Interface
STEP
ADDRESS
DATA
1
0xC4
0xCC
2
N/A
N/A
3
0xC8
0xCC
4
N/A
N/A
5
0xC2
0xCC
DESCRIPTION
Table 3. SW3 Dynamic Output Test with
High-Speed I2C Interface
STEP
ADDRESS
DATA
1
0xC4
0xCC
2
N/A
N/A
3
0xC8
0xCC
DESCRIPTION
Set all DACs to 0V
(Core 0, Core 1, and NB)
Wait 1ms
Set all DACs to 1.55V
(CORE 0, CORE 1, and NB)
Set DAC1 to 0.6V (Core 0)
Wait 100µs
Set DAC2 to 0.6V (Core 1)
Wait 100µs
Set DAC3 to 0.6V (NB)
6
N/A
N/A
Wait 100µs
7
0xC4
0x94
Set DAC1 to 1.3V (Core 0)
8
N/A
N/A
Wait 100µs
9
0xC8
0x94
Set DAC2 to 1.3V (Core 1)
10
N/A
N/A
Wait 100µs
11
0xC2
0x94
Set DAC3 to 1.3V (NB)
The sequence for the dynamic output test assigned to
SW2 is shown in Table 2.
Table 2. SW2 Dynamic Output Test with
High-Speed I2C Interface
STEP
ADDRESS
DATA
1
0xC4
0xFF
Set DAC1 to 0V (Core 0)
2
N/A
N/A
Wait 100µs
3
0xC8
0xFF
Set DAC2 to 0V (Core 1)
6
The sequence for the dynamic output test assigned to
SW3 is shown in Table 3.
DESCRIPTION
4
N/A
N/A
Wait 100µs
5
0xC2
0xFF
Set DAC3 to 0V (NB)
6
N/A
N/A
Wait 100µs
7
0xC4
0x80
Set DAC1 to 1.55V (Core 0)
8
N/A
N/A
Wait 100µs
9
0xC8
0x80
Set DAC2 to 1.55V (Core 1)
10
N/A
N/A
Wait 100µs
11
0xC2
0x80
Set DAC3 to 1.55V (NB)
The sequence for the dynamic output test assigned to
SW4 is shown in Table 4.
Table 4. SW4 Dynamic Output Test with
High-Speed I2C Interface
STEP
ADDRESS
DATA
DESCRIPTION
1
N/A
N/A
Set SHDN and PGD_IN to
logic-low
2
N/A
N/A
Wait 10ms
3
N/A
N/A
Set SCL to logic-high and SDA
to logic-low
4
N/A
N/A
Set SHDN to logic-high
5
N/A
N/A
Wait 2ms
6
N/A
N/A
Set PGD_IN to logic-high
7
N/A
N/A
Wait 10µs
8
0xCE
0x9C
Set all DACs to 1.2V
(Core 0, Core 1, and NB)
Detailed Description of Hardware
This 36A dual-phase buck-regulator design is optimized for a 300kHz switching frequency (per phase)
and output voltage settings around 1.200V. At
VOUT = 1.200V and VIN = 12V, the inductor ripple is
approximately 30% (LIR = 0.3). The MAX17009 controller interleaves both phases, resulting in out-of-phase
operation that minimizes the input and output filtering
requirements. The dual-phase controller shares the current between two phases that operate 180° out-ofphase, supplying up to 18A per phase.
Table 5 lists the boot-voltage codes.
_______________________________________________________________________________________
MAX17009 Evaluation Kit
7-Bit DAC
Inside the MAX17009 are three 7-bit digital-to-analog
converters (DACs). Each DAC can be individually programmed to different voltage levels through the serialinterface bus. The DAC sets the target for the output
voltage for the SMPSs and the NB buffer output
(NBV_BUF). The available DAC codes, and resulting
output voltages, are compatible with the AMD SVI
specifications (Table 6).
2-Wire Serial Interface (SVC, SVD)
The MAX17009 supports the 2-wire, write-only serialinterface bus, as defined by the AMD serial VID interface specification. The serial interface is similar to the
high-speed 3.4MHz I2C bus, but without the mastermode sequence. The bus consists of a clock line (SVC)
and a data line (SVD). The CPU is the bus master, and
the MAX17009 is the slave.
The MAX17009 serial interface works from 100kHz to
3.4MHz. In the AMD mobile application, the bus runs at
3.4MHz. In the MAX17009 EV kit, the serial interface
operates at 400kHz when commands are sent through
the EV kit software. When using the preprogrammed
SW switches, the serial interface operates at 1.7MHz.
The serial interface is active only after PGD_IN goes
high in the startup sequence. The CPU sets the VID
voltage of the three internal DACs and the PSI_L bit
through the serial interface.
During the startup sequence, the SVC and SVD inputs
serve an alternate function to set the 2-bit boot VID for
all three DACs while PWRGD is low. In debug mode,
the SVC and SVD inputs function in the 2-bit VID mode
when PGD_IN is low, and in the serial-interface mode
when PGD_IN is high.
By default, the MAX17009 serial interface is controlled
by U2 through the jumper settings on JU5 (pins 1-2)
and JU6 (pins 1-2). To directly control the MAX17009
with an external I2C serial interface, connect the external controller to the SDA and SCL pads, and move the
shunts on JU5 and JU6 across pins 2-3.
Boot Voltage
On startup, the MAX17009 slews the target for all three
DACs from ground to the boot voltage set by the SVC
and SVD pin voltage levels. While the output is still
below regulation, the SVC and SVD levels may be
changed and the MAX17009 will set the DACs to the
new boot voltage. Once the programmed boot voltage
is reached, and PWRGD goes high, the MAX17009
stores the boot VID. Changes in the SVC and SVD settings will not change the output voltage once the boot
Table 5. Boot-Voltage Codes
SVC
SVD
BOOT VOLTAGE
(VBOOT)
(PRO = VDD OR GND)
BOOT VOLTAGE
(VBOOT)
(PRO = OPEN)
0
0
1.1
1.4
0
1
1.0
1.2
1
0
0.9
1.0
1
1
0.8
0.8
VID is stored. When PGD_IN goes high, the MAX17009
exits boot mode, and the three DACs can be independently set to any voltage in the VID table through the
serial interface.
If PGD_IN goes from high to low any time after the boot
VID is stored, the MAX17009 sets all three DACs back
to the voltage of the stored boot VID.
When in debug mode (PRO = open), the MAX17009
uses a different boot-voltage code set. Keeping
PGD_IN low allows the SVC and SVD inputs to set the
three DACs to different voltages in the boot-voltage
code table. When PGD_IN is subsequently set high, the
three DACs can be independently set to any voltage in
the VID table through the serial interface.
Reduced Power-Dissipation
Voltage Positioning
The MAX17009 EV kit uses voltage positioning to
decrease the size of the output capacitor and to reduce
power dissipation at heavy loads. The MAX17009
includes two transconductance amplifiers for adding gain
to the voltage-positioning sense path for each output. The
amplifier’s input is generated by summing the currentsense inputs, which differentially sense the voltage
across the current-sense resistors (R1 = R2 = 1mΩ). The
transconductance amplifier’s output connects to the
voltage-positioned feedback input (FBDC1), so the
resistance between FBDC1 and VCORE0 (R19)
determines the voltage-positioning gain. Similarly, the
other transconductance amplifier’s output connects to the
voltage-positioned feedback input (FBDC2), so the
resistance between FBDC2 and VCORE1 (R12)
determines the voltage-positioning gain. Resistors R12
and R19 provide a -1.3mV/A voltage-positioning slope at
the outputs. Remote output and ground sensing eliminate
any additional PCB voltage drops.
Load-Transient Experiment
One interesting experiment is to subject the output to
large, fast-load transients and observe the output with
an oscilloscope. Accurate measurement of output ripple and load-transient response invariably requires that
_______________________________________________________________________________________
7
Evaluates: MAX17009
Setting the Output Voltage
Evaluates: MAX17009
MAX17009 Evaluation Kit
Table 6. Output Voltage VID DAC Codes
SVID[6:0]
OUTPUT
VOLTAGE
(V)
SVID[6:0]
OUTPUT
VOLTAGE
(V)
SVID[6:0]
OUTPUT
VOLTAGE
(V)
SVID[6:0]
OUTPUT
VOLTAGE
(V)
000_0000
1.5500
010_0000
1.1500
100_0000
0.7500
110_0000
0.3500
000_0001
1.5375
010_0001
1.1375
100_0001
0.7375
110_0001
0.3375
000_0010
1.5250
010_0010
1.1250
100_0010
0.7250
110_0010
0.3250
000_0011
1.5125
010_0011
1.1125
100_0011
0.7125
110_0011
0.3125
000_0100
1.5000
010_0100
1.1000
100_0100
0.7000
110_0100
0.3000
000_0101
1.4875
010_0101
1.0875
100_0101
0.6875
110_0101
0.2875
000_0110
1.4750
010_0110
1.0750
100_0110
0.6750
110_0110
0.2750
000_0111
1.4625
010_0111
1.0625
100_0111
0.6625
110_0111
0.2625
000_1000
1.4500
010_1000
1.0500
100_1000
0.6500
110_1000
0.2500
000_1001
1.4375
010_1001
1.0375
100_1001
0.6375
110_1001
0.2375
000_1010
1.4250
010_1010
1.0250
100_1010
0.6250
110_1010
0.2250
000_1011
1.4125
010_1011
1.0125
100_1011
0.6125
110_1011
0.2125
000_1100
1.4000
010_1100
1.0000
100_1100
0.6000
110_1100
0.2000
000_1101
1.3875
010_1101
0.9875
100_1101
0.5875
110_1101
0.1875
000_1110
1.3750
010_1110
0.9750
100_1110
0.5750
110_1110
0.1750
000_1111
1.3625
010_1111
0.9625
100_1111
0.5625
110_1111
0.1625
001_0000
1.3500
011_0000
0.9500
101_0000
0.5500
111_0000
0.1500
001_0001
1.3375
011_0001
0.9375
101_0001
0.5375
111_0001
0.1375
001_0010
1.3250
011_0010
0.9250
101_0010
0.5250
111_0010
0.1250
001_0011
1.3125
011_0011
0.9125
101_0011
0.5125
111_0011
0.1125
001_0100
1.3000
011_0100
0.9000
101_0100
0.5000
111_0100
0.1000
001_0101
1.2875
011_0101
0.8875
101_0101
0.4875
111_0101
0.0875
001_0110
1.2750
011_0110
0.8750
101_0110
0.4750
111_0110
0.0750
001_0111
1.2625
011_0111
0.8625
101_0111
0.4625
111_0111
0.0625
001_1000
1.2500
011_1000
0.8500
101_1000
0.4500
111_1000
0.0500
001_1001
1.2375
011_1001
0.8375
101_1001
0.4375
111_1001
0.0375
001_1010
1.2250
011_1010
0.8250
101_1010
0.4250
111_1010
0.0250
001_1011
1.2125
011_1011
0.8125
101_1011
0.4125
111_1011
0.0125
001_1100
1.2000
011_1100
0.8000
101_1100
0.4000
111_1100
0
001_1101
1.1875
011_1101
0.7875
101_1101
0.3875
111_1101
0
001_1110
1.1750
011_1110
0.7750
101_1110
0.3750
111_1110
0
001_1111
1.1625
011_1111
0.7625
101_1111
0.3625
111_1111
0
ground clip leads be completely avoided and that the
probe must be removed to expose the GND shield, so
the probe can be directly grounded with as short a wire
as possible to the board. Otherwise, EMI and noise
pickup corrupt the waveforms.
Most benchtop electronic loads intended for powersupply testing lack the ability to subject the DC-DC
8
converter to ultra-fast-load transients. Emulating the
supply current (di/dt) at the CPU VCORE pins requires
at least 500A/µs load transients. One easy method for
generating such an abusive load transient is to install a
power MOSFET at the N7 location and install resistor
R35 between 5mΩ and 10mΩ to monitor the transient
current. Then drive its gate (TP5) with a strong pulse
generator at a low duty cycle (< 5%) to minimize heat
_______________________________________________________________________________________
MAX17009 Evaluation Kit
To determine the load current, you might expect to insert
a meter in the load path, but this method is prohibited
here by the need for low resistance and inductance in
the path of the dummy-load MOSFET. To determine how
much load current a particular pulse-generator amplitude is causing, observe the current through inductor L1
by looking across R1 with a differential probe. In the
buck topology, the load current is approximately equal
to the average value of the inductor current.
Table 7. Jumper JU4 Function (SHDN)
SHUNT
POSITION
SHDN PIN
1-2
Connected to
U2 pin 58
—
2-3
Connected to
GND
Shutdown mode, SMPS output
voltages disabled.
VCORE0 = 0V
VCORE1 = 0V
Not installed
Connected to
VDD through
100kΩ
resistor R9
SMPS output voltages
enabled.
VCORE0, VCORE1, and
NBV_BUF voltages are set by
SVC and SVD inputs.
NBV_BUF Operation
Controlling the North Bridge (NB) Regulator
The reference buffer (NBV_BUF) sets the output voltage
of any regulator with an analog reference input (REFIN)
function. This regulator can be an LDO (e.g., MAX1510
or MAX8794), a single-switching regulator (e.g.,
MAX8792), or a dual-switching regulator (e.g.,
MAX8775).
Connect the NBV_BUF output to the REFIN pin of the
NB regulator and the GNDS_NB input to the NB regulator ground. Connect the required supply voltages and
control signals to the selected NB regulator. The
MAX17009 SHDN input may be connected to the
enable input of the NB regulator so that both regulators
start up and shut down at the same time.
Use the SW1–SW4 switches or the EV kit software to
control the output of the NB regulator. Monitor the NB
regulator output voltage with a DMM to measure the
final voltage, or with an oscilloscope to observe the
transitions.
Reference Buffer Output (NBV_BUF)
When the MAX17009 EV kit is not connected to an NB
regulator, the GNDS_NB input must be grounded back
to the MAX17009 EV kit ground using jumper wires.
Leaving the GNDS_NB floating can result in false readings of the NBV_BUF voltage.
Use the SW1–SW4 switches or the EV kit software to
control the output of the NBV_BUF. Monitor the
NBV_BUF output voltage with a DMM to measure the
final voltage, or with an oscilloscope to observe the
transitions.
Jumper Settings
Shutdown (SHDN)
When SHDN goes low (JU4 = GND), the MAX17009
enters the low-power shutdown mode. PWRGD is
pulled low immediately and the SMPS output voltages
ramp down at 1mV/µs. See Table 7.
MAX17009 OUTPUT
The MAX17009 shuts down completely—the drivers are
disabled, the reference turns off, and the supply currents drop to about 1µA (max)—20µs after the controller reaches the 0V target. When a fault condition
(overvoltage or undervoltage) occurs on one SMPS, the
other SMPS and the NBV_BUF immediately go through
the soft-shutdown sequence. To clear the fault latch
and reactivate the controller, toggle SHDN or cycle VCC
power.
Soft-shutdown for the NB regulator is determined by the
particular NB regulator’s shutdown behavior. In the typical application, the NB regulator’s SHDN pin or enable
pin is toggled at the same time as the MAX17009’s
SHDN pin.
System Power-Good Input (PGD_IN)
After the SMPS outputs reach the boot voltage, the
MAX17009 switches over to the serial-interface mode
when PGD_IN goes high. Any time during normal operation, a high-to-low transition on PGD_IN causes the
MAX17009 to slew all three internal DACs back to the
stored boot VIDs. PWRGD goes low for a minimum of
20µs when PGD_IN goes low, and stays low until 20µs
after both SMPS internal DACs reach the boot VID. The
SVC and SVD inputs are disabled during this time that
PGD_IN is low. The serial interface is reenabled when
PGD_IN goes high again. See Table 8.
Offset and Transient-Phase Repeat (OPTION)
The 12.5mV offset and the transient-phase repeat features of the MAX17009 can be selectively enabled and
disabled by the OPTION pin setting. Table 9 shows the
OPTION pin voltage levels and the features that are
enabled. Refer to the Offset and the Transient-Phase
Repeat sections in the MAX17009 data sheet for a
detailed description of the respective features.
_______________________________________________________________________________________
9
Evaluates: MAX17009
stress in the MOSFET. Vary the high-level output voltage of the pulse generator to vary the load current.
Evaluates: MAX17009
MAX17009 Evaluation Kit
Table 8. Jumper JU1 Function (PGD_IN)
SHUNT
POSITION
PGD_IN PIN
1-2
Connected to
U2 pin 59
—
2-3
Connected to
GND
The SVC and SVD inputs are
disabled during the time
PGD_IN is low.
Connected to
2.5V through
100kΩ
resistor R39
The serial interface is reenabled when PGD_IN goes
high again.
The MAX17009 switches over
to the serial-interface mode
when PGD_IN goes high.
Not installed
MAX17009 OUTPUT
Selectable Overvoltage Protection
and Debug Mode (PRO)
The MAX17009 features a tri-level PRO pin that enables
the overvoltage protection (OVP) feature, or puts the
MAX17009 in debug mode. Table 10 shows the PRO
Table 9. Jumper JU2 Function (OPTION)
SHUNT
POSITION
OPTION
PIN
OFFSET
ENABLED
TRANSIENTPHASE REPEAT
ENABLED
1-2
Connected
to VDD
0
0
Not installed
Open
0
1
1-3
Connected
to REF
1
0
1-4
Connected
to GND
1
1
10
selectable options. Debug mode is intended for applications where the serial interface is not properly functioning and the output voltage needs to be adjusted to different levels. The DAC voltage settings in debug mode further depend on the PGD_IN level to switch between the
2-bit VID setting or serial-interface operation.
Table 10. Jumper JU3 Function (PRO)
SHUNT
POSITION
PRO PIN
MAX17009 OUTPUT
1-2
Connected to
VDD
OVP disabled
2-3
Connected to
GND
OVP enabled
Not installed
Open
Debug mode, OVP disabled
Combined-Mode Operation
To configure the MAX17009 for combined-mode operation, remove R13 and connect the GNDS2 input to the
2.5V, 3.3V, or 5V supply using a wire. Connect a
copper strap (e.g., solder wick) between the output
capacitors of each phase.
The SW1–SW4 switches and the EV kit software still
control the combined SMPS and NBV_BUF outputs in
combined mode, but in combined mode, the
MAX17009 SMPS only responds to core 0 commands.
Core 1 commands are ignored.
In combined mode, unchecking the Power-Saving Off
checkbox in the software sets the MAX17009 SMPS into
single-phase operation, removes the offset, if enabled,
and sets NB_SKP low. Checking the Power-Saving Off
checkbox in the software sets the MAX17009 SMPS into
dual-phase operation.
______________________________________________________________________________________
3
1
2
NBV_BUF
NB_SKP
GNDS_NB
VDD
SVD
SVC
R38
100kΩ
1
VDD
4
2
VDD
D3
PWRGD
R8
100kΩ
3
1
2
VDD
C15
1000pF
36
14
5
VDD
______________________________________________________________________________________
OPTION
SHDN
PGD_IN
41
EP
NBV_BUF
NB_SKP
GNDS_NB
PWRGD
SVD
SVC
VRHOT
THRM
PRO
DH1
GNDS2
FBDC2
FBAC2
FBDC1
FBAC1
GNDS1
CSN2
CSP2
GND2
DL2
LX2
DH2
BST2
CSN1
CSP1
GND1
DL1
11
12
13
39
38
40
16
17
25
24
21
20
22
35
34
26
27
30
31
(BACKSIDE CONNECTED TO GND)
2
19
15
1
9
8
32
10
33
37
3
U1
MAX17009 LX1
VDDIO
ILIM
OSC
4 REF
6
R9
100kΩ
SHDN
VDD
JU3
3
C18
4700pF
R15
100Ω
R11
1kΩ
R7
13kΩ
1%
JU4
1
2
C9
0.1μF
R37
10Ω
18
28 23
VCC VDD1 VDD2
7
TIME
29
BST1
R5
40.2kΩ
1%
+2.5V
REF
R3
120kΩ
1%
R6
SHORT
(PC TRACE)
R4
100kΩ
1%
R10
143kΩ
1%
U2-58
VDDIO
R39
100kΩ
+2.5V
PGD_IN
JU2
3
VRHOT
REF
JU1
U2-59
C12
0.22μF
C11
2.2μF
10V
VCC
2
1
2
R17
1.5kΩ
1%
4
N5
C60
1000pF
C16
4700pF
1
5
5
C14
0.22μF
4
R12
1.1kΩ
1%
C20
4700pF
C21
1000pF
C24
2200pF
C39
OPEN
C22
1000pF
C25
2200pF
C38
OPEN
N4
C13
0.22μF
C10
C19 1μF
1μF 16V
16V
R18
1.5kΩ
1%
R27
0Ω
R26
0Ω
R57
OΩ
1
2
1
2
5
5
5
R13
100Ω
C59
1000pF
R19
1.1kΩ
1%
R21
100Ω
3 3
4
3 3
4
5
1
2
1
3
4
N6
4
N3
N2
2
3
N1
+5V
C17
4700pF
C23
4700pF
D2
C3
10μF
25V
R29
OPEN
R14
100Ω
R20
100Ω
R32
OPEN
C4
10μF
25V
VCORE1
R25
10Ω
R34
OPEN
L2
0.45μH
R24
10Ω
R31
OPEN
L1
0.45μH
GND
VBATT
CORE1SENSE_L
CORE1SENSE_H
CORE0SENSE_H
CORE0SENSE_L
R22
75Ω
R33
OPEN
R23
75Ω
R30
OPEN
VCORE0
TP4
TP2
VBATT
C2
10μF
25V
VBATT
D1
C1
10μF
25V
GND
VBIAS
TP5
1
R2
0.001Ω
1%
R1
0.001Ω
1%
R36
51Ω
TP3
TP1
4
R35
OPEN
N7
3 OPEN
VCORE0
C7
470μF
2V
GND
VCORE0
C26
22μF
6.3V
VCORE0
R16
51Ω
TP6
C8
470μF
2V
1
4
R28
OPEN
N8
3 OPEN
VCORE1
GND
VCORE1
C32
22μF
6.3V
VCORE1
NOTE: C5, C6, C7, C8
• USE 470μF FOR ±50mV AC REQUIREMENTS.
• USE 330μF FOR ±125mV AC REQUIREMENTS.
C6
470μF
2V
VCORE1
C5
470μF
2V
VCORE0
C33
22μF
6.3V
C27
22μF
6.3V
C34
22μF
6.3V
C28
22μF
6.3V
C35
22μF
6.3V
C29
22μF
6.3V
C36
22μF
6.3V
C30
22μF
6.3V
C37
22μF
6.3V
C31
22μF
6.3V
J5
J4
Evaluates: MAX17009
VDIG
MAX17009 Evaluation Kit
Figure 2a. MAX17009 EV Kit Schematic (Sheet 1 of 2)
11
C44
0.1μF
VDIG
SVD
C50
1μF
VDIG
C55
22pF
U5
GND
OUT
JU5
3
2
1
SDA
R49
10kΩ
2
5
Y2
6MHz
C54
22pF
R47
1.5kΩ
C40
3300pF
R48
VDIG
2.2kΩ
R46
27Ω
MAX8511
+2.5V
SHDN
IN
4
3
1
2
R45
27Ω
R40
OPEN
3
1
8
VCC
CS
6
ORG U3 SK
AT93C46A
7
N.C.
D1
5
D0
GND
J1-4
J1-3
J1-2
J1-1
J1
USB
SDA
XTOUT
XTIN
RESET
2
31
EEDATA
C52
10μF
TEST
U4
FT232BL
SVC
C49
1μF
VDIG
3
1
19
20
21
22
23
24
+2.5V
R41
OPEN
10
15
3
2
1
SCL
GND
OUT
JU6
MAX8511
U6
SLEEP
PWREN
SHDN
IN
DCD
DSR
DTR
CTS
RTS
RXD
TXD
25
18
RI
16
TXDEN
12
TXLED
11
RXLED
14
PWRCTL
AGND GND GND
29
9
17
RSTOUT
USBDP
USBDM
3V3OUT
32
EECS
1
EESK
28
27
4
5
+3.3V
VDIG
7
8
6
2
5
R51
1kΩ
RI
SCL
C51
10μF
D4
+3.3V
C46
0.1μF
+2.5V
DCD
DSR
DTR
P65
RTS
P70
P71
+2.5V
42
28
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
49
GND
GND
C43
OPEN
SW3
SEG27/P3.3
SEG26/P3.2
SEG25/P3.1
SEG24/P3.0
SEG23/P2.7
SEG22/P2.6
SEG21/P2.5
SEG20/P2.4
SEG19/P2.3
SEG18/P2.2
SEG17/P2.1
SEG16/P2.0
SEG15/P1.7
SEG14/P1.6
SEG13/P1.5
SEG12/P1.4
SEG11/P1.3
VDD
67
66
1
3
18
SEG9/P1.1
68
SEG10/P1.2
13
65
64
63
62
61
60
1
3
C42
OPEN
U2
59
58
57
U2-59 U2-58
56
MAXQ2000
(BACKSIDE CONNECTED TO GND)
C53
OPEN
SW4
21 22 23 24 25 26
R55 R56
1kΩ 1kΩ
19 20
SEG29/P3.5/INT5
26
SEG8/P1.0
SEG28/P3.4/INT4
3
SEG7/P0.7/INT3
SEG30/P3.6/INT6
VCC VCC VCCIO
SEG6/P0.6/INT2
SEG31/P3.7/INT7
AVCC
SEG33/COM3
30
SEG5/P0.5/INT1
SEG32
R54
1kΩ
SEG3/P0.3
SEG34/COM2
R53
1kΩ
SEG35/COM1
C41
OPEN
COM0
R50
+3.3V
470Ω
C48
VDIG VDIG
0.1μF
29
P4.0/TCK/INT8
C45
0.1μF
SEG2/P0.2
1
SEG1/P0.1
SW1
SEG0/P0.0
3
30
31
55
32
+3.3V
54
C58
0.1μF
P4.3/TDO
3
35
VLCD
SW2
VLCD1
RESET
1
VADJ
P4.1/TDI/INT9
53
52
HFXIN
VDDIO
TCK
TDI
TMS
TDO
RESET
32KOUT
32KIN
P5.2/RX1/INT10
P5.5/TX1/INT11
P5.4/SS
P5.5/MOSI
P5.6/SCLK
P5.7/MISO
P6.0/T1B/INT12
P6.1/T1/INT13
P6.2/T2B/OW_OUT
P6.3/T2/OW_IN
P6.4/TOB/WKOUT0
P6.5/TO/WKOUT1
HFXOUT
P71 P70
P7.0/TXO/INT14
VDIG
VLCD2
P4.2/TMS
P7.1/RXO/INT15
12
SEG4/P0.4/INT0
J2-1 J2-10
J2-9 J2-2
J2-5 J2-8
J2-3 J2-7
J2-6 J2-4
C47
0.1μF
R42
27Ω
+3.3V
RTS
DTR
+2.5V
JU7
C57
10pF
C56
Y1
16MHz 10pF
R52
1.5kΩ
J2
JTAG
35
34
36
37
38
39
40
41
43
44
45
46
47
48
50
51
27
+2.5V
TCK
TDI
TMS
TDO
RESET
SDA
DSR
P65
R61
SHORT
(PC TRACE)
R62
SHORT
(PC TRACE)
R63
SHORT
(PC TRACE)
R64
SHORT
(PC TRACE)
R65
SHORT
(PC TRACE)
R43
27Ω
R44
1.5kΩ
+2.5V
DSR
DCD
RTS
RI
DTR
SCL
Evaluates: MAX17009
MAX17009 Evaluation Kit
Figure 2b. MAX17009 EV Kit Schematic (Sheet 2 of 2)
______________________________________________________________________________________
MAX17009 Evaluation Kit
Evaluates: MAX17009
Figure 3. MAX17009 EV Kit Component Placement Guide—Component Side
______________________________________________________________________________________
13
Evaluates: MAX17009
MAX17009 Evaluation Kit
Figure 4. MAX17009 EV Kit PCB Layout—Component Side
14
______________________________________________________________________________________
MAX17009 Evaluation Kit
Evaluates: MAX17009
Figure 5. MAX17009 EV Kit PCB Layout—Internal Layer 2
______________________________________________________________________________________
15
Evaluates: MAX17009
MAX17009 Evaluation Kit
Figure 6. MAX17009 EV Kit PCB Layout—Internal Layer 3
16
______________________________________________________________________________________
MAX17009 Evaluation Kit
Evaluates: MAX17009
Figure 7. MAX17009 EV Kit PCB Layout—Internal Layer 4
______________________________________________________________________________________
17
Evaluates: MAX17009
MAX17009 Evaluation Kit
Figure 8. MAX17009 EV Kit PCB Layout —Internal Layer 5
18
______________________________________________________________________________________
MAX17009 Evaluation Kit
Evaluates: MAX17009
Figure 9. MAX17009 EV Kit PCB Layout—Solder Side
______________________________________________________________________________________
19
Evaluates: MAX17009
MAX17009 Evaluation Kit
Figure 10. MAX17009 EV Kit Component Placement Guide—Solder Side
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20 __________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2007 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products, Inc.
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