19-1716; Rev 0; 4/00
Low-Voltage SIM/Smart Card
Level Translators in µMAX
Features
♦ SIM/Smart Card Level Shifting
♦ +1.4V to +5.5V Controller Voltage Range
♦ +1.7V to +5.5V Card Voltage Range
♦ ±10kV ESD Card Socket Protection
♦ Allows Level Translation with DVCC ≥ VCC or
DVCC ≤ VCC
♦ Automatically Shuts Down When Either Supply Is
Removed
♦ Card Contacts Actively Pulled Low During
Shutdown
♦ 1µA Total Quiescent Supply Current
♦ 0.01µA Total Shutdown Supply Current
♦ Ultra-Small 10-Pin µMAX Package
♦ Compliant with GSM Test Specifications 11.11
and 11.12
Applications
SIM Interface in GSM Cellular Telephones
Ordering Information
PART
TEMP. RANGE
PIN-PACKAGE
Smart Card Readers
MAX1840EUB
-40°C to +85°C
10 µMAX
Logic Level Translation
MAX1841EUB
-40°C to +85°C
10 µMAX
SPI™/QSPI™/MICROWIRE™ Level Translation
Typical Operating Circuit
DVCC
DVCC
SYSTEM
CONTROLLER
Pin Configuration
VCC
TOP VIEW
DVCC
VCC
VCC
RIN
RST
RST
MAX1840
MAX1841
CIN
CLK
CLK
SIM OR
SMART
CARD
DATA
1
DVCC
2
CIN
3
RIN
4
SHDN (DDRV)
5
DATA
OPTIONAL
OPTIONAL
10 IO
9
MAX1840
MAX1841
VCC
8
CLK
7
RST
6
GND
µMAX
SHDN*
IO
DDRV*
GND
GND
* SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.
IO
( ) ARE FOR MAX1841.
GND
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
________________________________________________________________ Maxim Integrated Products
1
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
MAX1840/MAX1841
General Description
The MAX1840/MAX1841 subscriber identity module
(SIM)/smart card level translators provide level shifting
and electrostatic discharge (ESD) protection for SIM and
smart card ports. These devices integrate two unidirectional level shifters for the reset and clock signals, a bidirectional level shifter for the serial data stream, and
±10kV ESD protection on all card contacts.
The MAX1840 includes a SHDN control input to aid
insertion and removal of SIM and smart cards, while the
MAX1841 includes a system-side data driver to support
system controllers without open-drain outputs. The logic
supply voltage range is +1.4V to +5.5V for the “controller
side” and +1.7V to +5.5V for the “card side.” Total supply current is 1.0µA. Both devices automatically shut
down when either power supply is removed. For a complete SIM card interface, combine the MAX1840/
MAX1841 with the MAX1686H 0V/3V/5V regulated
charge pump.
The MAX1840/MAX1841 are available in ultra-small
10-pin µMAX packages that are only 1.09mm high and
half the area of an 8-pin SO.
The MAX1840/MAX1841 are compliant with GSM test
specifications 11.11 and 11.12.
MAX1840/MAX1841
Low-Voltage SIM/Smart Card
Level Translators in µMAX
ABSOLUTE MAXIMUM RATINGS
DVCC, VCC to GND................................................-0.3V to +6.0V
RIN, CIN, DATA, DDRV,
SHDN to GND ......................................-0.3V to (DVCC + 0.3V)
RST, CLK, IO to GND .................................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Figure 1, DVCC = +1.8V; VCC = +1.8V, +3.0V, or +5.0V; SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
5.5
V
5.5
V
POWER SUPPLIES
DVCC Operating Range
VCC Operating Range
DVCC Operating Current
VCC Operating Current
Total Shutdown Current
1.4
DVCC
1.7
VCC
IDVCC
IVCC
ISHDN
CIN static
0.1
CIN clocked at 1.625MHz from GND to DVCC
with 50% duty cycle
2.5
CIN clocked at 3.25MHz from GND to DVCC
with 50% duty cycle
5
0.5
µA
CIN static
0.9
CIN clocked at 1.625MHz from GND to DVCC
with 50% duty cycle
3.0
0.4
CIN clocked at 3.25MHz from GND to DVCC
with 50% duty cycle
0.8
IOFF = IVCC + IDVCC, SHDN = GND
(MAX1840 only), or DVCC = GND
or VCC = GND
0.01
µA
mA
1
µA
CIN, RIN, SHDN, DDRV LOGIC INPUTS
Digital Input Low Threshold
VIL
Digital Input High Threshold
VIH
0.2 ✕ DVCC
V
0.7 ✕ DVCC
0.01
Input Leakage Current
V
1
µA
0.4
V
CLK, RST OUTPUTS
Digital Output Low Level
VOL
Digital Output High Level
VOH
ISINK = 200µA
ISOURCE = 20µA
0.9 ✕ VCC
ISOURCE = 200µA
0.8 ✕ VCC
V
DATA INPUT/OUTPUT
Between DATA and DVCC
13
Input Low Threshold
VIL(DATA)
(Note 2)
0.3
Input High Threshold
VIH(DATA)
(Note 3)
DATA Pullup Resistance
RDATA
Input Low Current
IIL
Input High Current
IIH
2
20
28
kΩ
V
DVCC - 0.6
V
1
mA
2
µA
VCC = 5.0V
_______________________________________________________________________________________
Low-Voltage SIM/Smart Card
Level Translators in µMAX
(Figure 1, DVCC = +1.8V; VCC = +1.8V, +3.0V, or +5.0V; SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note1)
PARAMETER
SYMBOL
Output Low Level
VOL(DATA)
Output High Level
VOH(DATA)
CONDITIONS
MIN
TYP
MAX
IO = GND, ISINK = 100µA
0.4
DVCC = 3.0V, IO = GND, ISINK = 200µA
0.4
ISOURCE = 10µA
0.7 ✕ DVCC
DVCC = 3.0V, ISOURCE = 20µA
0.7 ✕ DVCC
UNITS
V
V
IO (INPUT/OUTPUT)
IO Pullup Resistance
RIO
Input Low Threshold
VIL(IO)
Input High Threshold
VIH(IO)
Between IO and VCC
6.5
IIL(MAX) = 1mA (Note 2)
0.3
10
14
kΩ
V
IIH(MAX) = ±20µA (Note 3)
0.7 ✕ VCC
V
Input Low Current
IIL
1
mA
Input High Current
IIH
20
µA
Output Low Level
VOL(IO)
DATA = GND or DDRV = GND,
ISINK = 200µA
0.4
V
Output High Level
VOH(IO)
ISOURCE = 20µA
0.8 ✕ VCC
V
SHUTDOWN OUTPUT LEVELS
Shutdown Output Levels
(IO, CLK, RST)
ISINK = 200µA, SHDN = GND, DATA = CIN =
RIN = DVCC (MAX1840 only)
0.4
V
ISINK = 200µA, DVCC = GND, SHDN
(MAX1840) = DDRV (MAX1841) = DATA =
CIN = RIN = DVCC
0.4
V
ISINK = 200µA, VCC = GND, SHDN
(MAX1840) = DDRV (MAX1841) = DATA =
CIN = RIN = DVCC
0.4
V
TIMING
Maximum CLK Frequency
(Notes 4, 5)
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
VCC = 2.7V to 5.5V, DVCC = 1.4V to 2.7V
5
20
VCC = 1.7V to 3.6V, DVCC = 1.4V to 2.25V
5
15
fCLK
MHz
Specifications to -40°C are guaranteed by design, not production tested.
VIL is defined as the voltage at which the output (DATA/IO) voltage equals 0.5V.
VIH is defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV.
Timing specifications are guaranteed by design, not production tested.
The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is
applied. CIN has 5ns rise and fall times; levels are GND to DVCC. Input and output levels are measured at 50% of the waveform.
_______________________________________________________________________________________
3
MAX1840/MAX1841
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics
(Circuit of Figure 1, DVCC = 3.0V, VCC = +5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.)
TOTAL OPERATING SUPPLY CURRENT
vs. CARD-SIDE SUPPLY VOLTAGE
(DATA STATIC)
2.0
VCC = 5V
1.5
VCC = 3V
1.0
VCC = 1.8V
0.5
fCIN = 5MHz
1.2
fCIN = 3.25MHz
0.8
0.4
1.6
0
2
4
6
8
VCC = 5V
VCC = 3V
0.8
VCC = 1.8V
0.4
DATA OR DDRV = DVCC
CIN CLOCKED WITH A
0 TO DVCC SQUARE WAVE
0
1.5
10
fCIN = 5MHz
1.2
fCIN = 1.625MHz
0
0
MAX1840/1-03
1.6
DATA OR DDRV = DVCC
CIN CLOCKED WITH A
0 TO DVCC SQUARE WAVE
SUPPLY CURRENT, IVCC + IDVCC (mA)
2.5
2.0
TOTAL OPERATING SUPPLY CURRENT
vs. TEMPERATURE (DATA STATIC)
MAX1840/1-02
DATA OR DDRV = DVCC
CIN CLOCKED WITH A
0 TO DVCC SQUARE WAVE
SUPPLY CURRENT, IVCC + IDVCC (mA)
2.5
3.5
4.5
5.5
-40
-15
10
35
60
85
TEMPERATURE (°C)
TOTAL OPERATING SUPPLY CURRENT
vs. CLOCK FREQUENCY (DATA ACTIVE)
TOTAL OPERATING SUPPLY CURRENT
vs. CARD-SIDE SUPPLY VOLTAGE
(DATA ACTIVE)
TOTAL OPERATING SUPPLY CURRENT
vs. TEMPERATURE (DATA ACTIVE)
2.5
VCC = 5V
2.0
VCC = 3V
1.5
1.0
VCC = 1.8V
0.5
2.0
1.6
fDATA OR fDDRV = fCIN/372
CIN CLOCKED WITH A
0 TO DVCC SQUARE WAVE
1.2
fCIN = 3.25MHz
fCIN = 5MHz
0.8
0.4
fCIN = 1.625MHz
0
0
0
2
4
6
8
fCIN = 5MHz
VCC = 5V
1.6
1.2
VCC = 3V
0.8
0.4
VCC = 1.8V
fDATA OR fDDRV = fCIN/372
CIN CLOCKED WITH A
0 TO DVCC SQUARE WAVE
0
1.5
10
2.0
SUPPLY CURRENT, IVCC + IDVCC (mA)
fDATA OR fDDRV = fCIN/372
CIN CLOCKED WITH A
0 TO DVCC SQUARE WAVE
SUPPLY CURRENT, IVCC + IDVCC (mA)
3.0
MAX1840/1-05
VCC (V)
MAX1840/1-04
FREQUENCY (MHz)
2.5
3.5
4.5
5.5
-40
-15
VCC (V)
FREQUENCY (MHz)
CIN TO CLK OR RIN TO RST
WAVEFORM (3V TO 5V)
10
35
60
85
TEMPERATURE (°C)
CIN TO CLK OR RIN TO RST
WAVEFORM (3V TO 1.8V)
MAX1840/1-07
CIN TO CLK OR RIN TO RST
WAVEFORM (1.8V TO 1.8V)
MAX1840/1-08
fCIN = 5MHz
MAX1840/1-06
SUPPLY CURRENT, IVCC + IDVCC (mA)
3.0
MAX1840/1-01
TOTAL OPERATING SUPPLY CURRENT
vs. CLOCK FREQUENCY (DATA STATIC)
SUPPLY CURRENT, IVCC + IDVCC (mA)
MAX1840/MAX1841
Low-Voltage SIM/Smart Card
Level Translators in µMAX
MAX1840/1-09
fCIN = 5MHz
fCIN = 5MHz
3V
CIN OR RIN 3V
2V/div
CIN OR RIN
1.8V
2V/div
0
0
0
1.8V
CLK OR RST
2V/div
CLK OR RST 1.8V
1V/div
0
0
CIN OR RIN
1V/div
5V
0
20ns/div
4
20ns/div
_______________________________________________________________________________________
CLK OR RST
1V/div
20ns/div
Low-Voltage SIM/Smart Card
Level Translators in µMAX
(Circuit of Figure 1, DVCC = 3.0V, VCC = +5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.)
UNDERVOLTAGE
SHUTDOWN WAVEFORM
DDRV TO IO AND DATA WAVEFORM
(MAX1841 ONLY)
MAX1840/1-10
MAX1840/1-11
3V
DDRV
2V/div
1.5V
VCC
0.5V/div
0
3V
DATA
2V/div
0
5V
0
1V
IO
2V/div
CLK, RST, OR IO
0.5V/div
0
0
1µs/div
1ms/div
Pin Description
PIN
NAME
FUNCTION
1
DATA
System Controller Data Input/Output. An open-drain IO with a 20kΩ pull-up
resistor to DVCC. For bidirectional data transfer, connect to an open-drain controller output
capable of sinking 1mA while pulling DATA low. If the controller is not open-drain, use
DDRV to send data and DATA to receive data.
2
2
DVCC
Supply Voltage for System Controller Digital Pins. Set at +1.4V to +5.5V.
3
3
CIN
System Controller Clock Input
4
4
RIN
System Controller Reset Input
—
5
DDRV
Optional System Controller Data Input. Connect to controllers without an open-drain output. When not used, connect DDRV to DVCC.
5
—
SHDN
Shutdown Mode Input. Driving SHDN low reduces the total supply current to less than
1µA. In shutdown mode, RST, CLK, and IO are actively pulled low and the transfer gate
between DATA and IO is disabled. When not used, connect SHDN to DVCC.
6
6
GND
System Controller and Card Ground
7
7
RST
Reset Output to Card. Actively pulled low during shutdown.
8
8
CLK
Clock Output to Card. Actively pulled low during shutdown.
9
9
VCC
Supply Voltage for Card-Side Digital Pins. Set at +1.7V to +5.5V. Proper supply bypassing
is required to meet ±10kV ESD specifications.
10
10
IO
Card-Side Bidirectional Input/Output. An open-drain output with a 10kΩ pull-up resistor to
VCC. For bidirectional data transfer, connect to an open-drain card output capable of sinking 1mA while pulling IO low. Actively pulled low during shutdown.
MAX1840
MAX1841
1
_______________________________________________________________________________________
5
MAX1840/MAX1841
Typical Operating Characteristics (continued)
MAX1840/MAX1841
Low-Voltage SIM/Smart Card
Level Translators in µMAX
Detailed Description
The MAX1840/MAX1841 provide the necessary level
translation for interfacing with SIMs and smart cards in
multivoltage systems. These devices operate with logic
supply voltages between +1.4V and +5.5V on the controller side (DVCC) and between +1.7V and +5.5V on the
card side (VCC). The total supply current (IDVCC + IVCC)
is 1µA while operating in an idle state (see Electrical
Characteristics). Figure 1 shows the MAX1840/MAX1841
test circuit. The Typical Application Circuit appears at the
end of this data sheet.
MAX1840
MAX1841
+1.8V
DVCC
+1.8V,
+3.0V, OR
+5.0V
VCC
SHDN*
RST
RIN
CIN
DDRV*
DATA
CLK
IO
30pF
30pF
30pF 30pF
GND
Level Translation
The MAX1840/MAX1841 provide level translators for a
clock input, a reset input, and a bidirectional data IO.
The clock and reset inputs (CIN and RIN) are level shifted from the controller-side supply rails (DVCC to GND)
to the card-side supply rails (VCC to GND). When connected to an open-drain controller output, DATA and IO
provide bidirectional level translation. All level translation is valid for DV CC ≥ V CC or DV CC ≤ V CC . The
MAX1840/MAX1841 contain internal pull up resistors
from DATA to the controller-side supply (DVCC) and
from IO to the card-side supply (VCC). For push-pull
controller outputs, see the Data Driver section for bidirectional data translation.
Data Driver (MAX1841 Only)
When using a microcontroller (µC) without an open-drain
output, use the data driver (DDRV) input to send data to
the SIM/smart card, while DATA provides the controllerside output for bidirectional data transfer. When not
used, connect DDRV to DVCC to reduce total supply current.
Shutdown Mode
For the MAX1840, drive SHDN low to activate shutdown. Connect SHDN to DVCC or drive high for normal
operation. To allow for card insertion and removal, shutdown mode actively pulls CLK, RST, and IO low; it also
disconnects the internal 10kΩ pull up resistor from VCC
to prevent excessive current draw. Shutdown mode
reduces the total supply current (I DVCC + I VCC ) to
0.01µA.
SIM/Smart Card Insertion/Removal
The SIM/smart card specifications require that the cardside pins (VCC, CLK, RST, IO) be at ground potential
prior to inserting the SIM/smart card. For applications
using the MAX1686H (Figure 3), the easiest way to
achieve this is by shutting down the MAX1686H or by
6
* SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.
NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF
TEST PROBES AND BOARD LAYOUT.
Figure 1. MAX1840/MAX1841 Test Circuit
driving SHDN (MAX1840 only) low. If specific sequencing is desired, pull IO low by driving either DATA or
DDRV (MAX1841 only) low, and pull CLK and RST low
by driving CIN and RIN low, respectively.
ESD Protection
As with all Maxim devices, ESD-protection structures on
all pins protect against ESDs encountered during handling and assembly. For further protection during card
insertion and removal, the pins that connect to the card
socket (CLK, RST, IO, VCC, and GND) provide protection against ±10kV of ESD. The ESD structures withstand high ESD in all states: normal operation,
shutdown, and power-down. After an ESD event, the
MAX1840/MAX1841 continue working without latchup.
A 1µF bypass capacitor from VCC to GND is required to
exceed ±10kV ESD specifications.
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report documenting test
setup, test methodology, and test results.
Applications Information
SIM/Smart Card Interface
To provide 5V when interfacing with a 5V SIM/smart card,
+3V systems require a DC-DC converter. The MAX1686H
+5V regulating charge pump for SIM cards provides
_______________________________________________________________________________________
Low-Voltage SIM/Smart Card
Level Translators in µMAX
CXN
CXP
3.0V OR 5.0V
DVCC
MAX1686H
SHDN
SYSTEM
CONTROLLER
OUT
MAX8867
MAX8860
PGND
SHDN
SIM OR
SMART
CARD
SYSTEM
CONTROLLER
SET
PGND
SPI/QSPI/
MICROWIRE
SYSTEM
MAX1840
MAX1841
DVCC
VCC
VCC
DVCC
VCC
VCC
RIN
RST
RST
RIN
RST
CS
CIN
CLK
CLK
CIN
CLK
SCLK
IO
DOUT
DATA
OPTIONAL
IN
GND
MAX1840
MAX1841
OPTIONAL
+3.3V
DVCC
IN MAX1686 OUT
3/5
GND
MAX1840/MAX1841
+5.0V
+3.0V
IO
DATA
IO
OPTIONAL
SHDN*
DDRV*
GND
GND
* SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.
OPTIONAL
GND
SHDN*
DDRV*
DIN
GND
GND
* SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.
Figure 2. Using MAX1840/MAX1841 and MAX1686/MAX1686H
Charge Pump for SIM Card Applications
Figure 3. MAX1840/MAX1841 with SPI/QSPI/MICROWIRE
Interfaces
0V/3V/5V for full compatibility with SIM/smart-card specifications. Figure 2 shows the charge pump for SIM card
applications. Alternatively, the MAX619 generates a regulated 5V from input voltages as low as 2V.
level shifters transfer chip select and clock signals to
the slave device(s), while the bidirectional level shifter
transfers data.
SPI/QSPI/MICROWIRE Interface
___________________Chip Information
The MAX1840/MAX1841 are also useful as 3V/5V level
shifters in SPI, QSPI, and MICROWIRE applications
(Figure 3). On the slave side, connect CLK to SCLK,
RST to CS, and IO to DOUT and DIN. The unidirectional
TRANSISTOR COUNT: 211
_______________________________________________________________________________________
7
Typical Application Circuit
VCC
DVCC
DVCC
DVCC
VCC
RIN
RST
1µF
VCC
RST
1µF
CLK
CIN
SYSTEM
CONTROLLER
20k
OPTIONAL
SHDN*
OPTIONAL
DDRV*
SIM OR
SMART CARD
10k
IO
DATA
IO
SHUTDOWN
CONTROL
GND
MAX1840
MAX1841
GND
CLK
GND
* SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.
Packaging Information
10LUMAX.EPS
MAX1840/MAX1841
Low-Voltage SIM/Smart Card
Level Translators in µMAX
Note: The MAX1840/MAX1841 do not have an exposed pad.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2000 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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