MAX22000ALB+

EVALUATION KIT AVAILABLE Click here to ask an associate for production status of specific part numbers. MAX22000 Industrial Configurable Analog I/O General Description Benefits and Features The MAX22000 is an industrial-grade configurable analog input/output device that can be configured on-the-fly in software as a voltage input or output, or current input or output. Additional inputs are available to measure other analog signals. ● Accuracy • Analog Output Voltage or Current Mode: • 0.02% FSR Accuracy, Room Temp • 0.1% FSR Accuracy, ±50°C Temp Variation • 5ppm/°C Internal Reference The device offers an 18-bit DAC with fast settling time, as well as a 24-bit delta-sigma ADC. The ADC and DAC can individually choose between an internal or an external reference. ● Flexibility • 6 Analog Inputs/1 Analog Output, Software Configurable for Voltage and Current Mode • Two Auxiliary ADC Inputs for Cold Junction Measurements • RTD Input Mode in 2, 3, or 4-Wire Configurations • Thermocouple Input Mode • ±12.5V Input/Output Voltage Range • ±25mA or ±2.5mA Output Current Range • ±25V, ±2.5V, ±500mV, ±250mV, and ±125mV PGA Input Voltage Ranges • +24V Field Supply for Current Loop • Optional External Reference for ADC and/or DAC • Six GPIOs • 20MHz SPI Interface The MAX22000 supports the ADC with a low-noise programmable gain amplifier (PGA), with high-voltage and low-voltage input ranges to support RTD and thermocouple measurements. Additional auxiliary inputs are provided to measure cold junction temperatures on-board. The MAX22000 communicates through a high speed 20MHz SPI bus for all configuration and management information, as well as for conversion results. An optional 8-bit CRC enhances the reliability of the SPI interface, protecting against all 8-bit bursts and double-bit errors. The MAX22000 operates from 2.7V to 3.6V analog and digital supplies and up to ±24V high-voltage supplies. The device is available in a 64-pin LGA package and operates over the -40°C to +125°C industrial temperature range. Applications ● ● ● ● Distributed Control Systems Process Control Programmable Logic Controllers (PLC) Programmable Automation Controllers (PAC) Ordering Information and Application Block Diagram appear at end of datasheet. ● Robustness • ±36V Protection on All Analog I/O Ports • Overcurrrent Protection • Thermal Shutdown • Undervoltage Interrupt on All High Voltage Supplies • CRC Detection • Open Detection on All Analog Inputs • 1kV HBM Protection on All Pins ● -40°C to +125°C Operating Temperature Range ● 9mm x 9.5mm 64-Pin LGA Package 19-100526; Rev 3; 3/22 © 2022 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. One Analog Way, Wilmington, MA 01887 U.S.A. | Tel: 781.329.4700 | © 2022 Analog Devices, Inc. All rights reserved. MAX22000 Industrial Configurable Analog I/O Functional Block Diagram DVDD AVDD OSCILLATOR BYP_DAC REF_DAC REF_DAC_EXT HART_IN LDO FB HVDD HVDDO + AOP - AON AI1 LDAC + INPUT REGISTER CSA DAC AI2 AGND_DAC AGND_DAC AI3 + NR 2.5V REFERENCE REF_OUT - CS AI4 + SCLK SDI RST DIGITAL INTERFACE AI5 DELTA-SIGMA ADC PGA - INT DIGITAL FILTER + SDO AI6 RDY SYNC AUX2 GPIO CTRL DGND www.analog.com AUX1 LDO CLK AGND BYP_ADC REF_ADC REF_ADC_EXT GPIO[5:0] HVSS HVSSO Analog Devices | 2 MAX22000 Industrial Configurable Analog I/O Absolute Maximum Ratings AVDD to AGND ..................................................... -0.3V to +3.9V DVDD to DGND ..................................................... -0.3V to +3.9V AGND to DGND..................................................... -0.3V to +0.3V AGND_DAC to AGND ........................................... -0.3V to +0.3V AGND_DAC to DGND ........................................... -0.3V to +0.3V AVDD to REF_DAC_EXT ...................................... -0.3V to +3.9V BYP_ADC to DGND .............................................. -0.3V to +2.1V HVDD to HVSS ...................................................... -0.3V to +52V HVDDO to HVSSO ................................................. -0.3V to +52V HVDD to AGND ...................................................... -0.3V to +40V HVDDO to AGND ................................................... -0.3V to +40V AGND to HVSS ...................................................... -0.3V to +40V AGND to HVSSO ................................................... -0.3V to +40V HVSSO to HVSS .................................................... -0.3V to +40V AI_ to HVSS ................................... -0.3V to the lower of +52V or ((VHVDD-VHVSS)+0.3V) HART_IN, FB to HVSSO ................... -0.3 to the lower of +52V or ((VHVDDO-VHVSSO)+0.3V) INT to DGND............................................................. -0.3V to +6V CS, SCLK, SDI, SDO, RDY, RST, SYNC, CLK, LDAC, GPIO_ to DGND ...................... -0.3 to the lower of +3.9V or (VDVDD+0.3V) REF_ADC, REF_DAC, AUX1, AUX2, REF_ADC_EXT, REF_DAC_EXT, NR, REF_OUT, BYP_DAC to AGND ......-0.3 to the lower of +3.9V or (VAVDD+0.3V) AON to HVSS ......................................................... -0.3V to +80V AOP to HVDDO ...................................................... -70V to +0.3V AON to HVSSO ....................................................... -0.3V to +70V Maximum Current into AOP, AON ...................................±100mA Maximum Current into Any Other Pin .............................. ± 50mA Continuous Power Dissipation (TA = +70°C) 64-Pin LGA (derate 42.8mW/°C over TA = +70°C) ..3418.8mW Operating Temperature Range ...........................-40°C to +125°C Junction Temperature ....................................................... +150°C Storage Temperature Range ..............................-65°C to +150°C Soldering Temperature (reflow) ........................................ +260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 64 LGA Package Code L649A9M+1 Outline Number 21-100274 Land Pattern Number 90-100096 Thermal Resistance, Four-Layer Board: Junction to Ambient (θJA) 23.4°C/W Junction to Case (θJC) 7.0°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. www.analog.com Analog Devices | 3 MAX22000 Industrial Configurable Analog I/O Electrical Characteristics (VAVDD = VDVDD = +2.7V to +3.6V, VHVDD = VHVDDO = +18.0V; VHVSS = VHVSSO = -18.0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VAVDD = VDVDD = 3.3V, VHVDD = VHVDDO = +18.0V, VHVSS = VHVSSO = -18.0V, TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ANALOG OUTPUT VOLTAGE MODE 12.5V setting, DAC full-scale range (Note 2) Output Voltage Range VOUT 12.5V setting, linear range (Note 2, Note 3) ±12.5 -10.5 25V setting (Note 2) Dropout Voltage Output Current Protection AOP, AON High Impedance Leakage Current Offset Error 0.85 VHVDDO = -13V, sinking 25mA, measured between AON and HVSSO, gain compression