MAX25232ATCB/V+

MAX25232ATCB/V+

  • 厂商:

    AD(亚德诺)

  • 封装:

    WFDFN12_EP

  • 描述:

    降压 开关稳压器 IC 正 固定 3.3V 1 输出 3A 12-WFDFN 裸露焊盘

  • 数据手册
  • 价格&库存
MAX25232ATCB/V+ 数据手册
Click here to ask about the production status of specific part numbers. MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ General Description Benefits and Features The MAX25232 is a small, synchronous buck converter with integrated high-side and low-side switches. The device is designed to deliver up to 3A with 3.5V to 36V input voltages while using only 3.5µA quiescent current at no load. ● Synchronous DC-DC Converter with Integrated FETs • MAX25232ATCA/ATCB/ATCG/ATCH = 2.5A IOUT • MAX25232ATCD/ATCE/ATCF = 3A IOUT • 3.5μA Quiescent Current in Standby Mode The device provides an accurate output voltage of ±2% in FPWM mode within the normal 6V to 18V operation input range. With 65ns minimum on-time capability, the converter is capable of large input-to-output conversion ratios. Voltage quality can be monitored by observing the PGOOD signal. The device can operate in dropout by running at 99% duty cycle, making it ideal for automotive and industrial applications. The IC comes in fixed output voltage and adjustable output voltage (MAX25232ATCF and MAX25232ATCG only) options. For MAX25232ATCF and MAX25232ATCG, output voltage can be set between 3V and 10V using an external resistor-divider. Frequency is internally fixed at 2.1MHz, which allows for small external components and reduced output ripple, and guarantees no AM interference. A 400kHz option is also offered to provide minimum switching losses and maximum efficiency. The device automatically enters skip mode at light loads with ultra-low 3.5µA quiescent current at no load. The device offers pin-enabled spread-spectrum-frequency modulation designed to minimize EMI-radiated emissions due to the modulation frequency. The MAX25232 variants are available in a small (3mm x 3mm) 12-pin TDFN package with an exposed pad, and requires very few external components. Applications ● Automotive ● Industrial ● High-Voltage DC-DC Converters 19-100723; Rev 3; 4/21 ● Small Solution Size Saves Space • 65ns Minimum On-Time • 2.1MHz or 400kHz Operating Frequency • Fixed 5V/3.3V Output Voltage with ±2% Output Accuracy in FPWM Mode (5V/3.3V) • Other Fixed VOUT Options Between 3V - 5.5V (in 50mV steps) Available for Precise Output Voltage Setting • External Resistor Divider Options to Adjust the Output Voltage Between 3V and 10V • Fixed 3.5ms Internal Soft-Start • Innovative Current-Mode-Control Architecture Minimizes Total Board Space and BOM Count ● PGOOD Output and High-Voltage EN Input Simplify Power Sequencing ● Protection Features and Operating Range Ideal for Automotive Applications • 3.5V to 36V Operating VIN Range • 40V Load-Dump Protection • 99% Duty-Cycle Operation with Low Dropout • -40°C to +125°C Automotive Temperature Range • AEC-Q100 Qualified Ordering Information appears at end of data sheet. MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Simplified Block Diagram SPS SYNC MAX25232 HVLDO EN REF BANDGAP OSC BST BIAS SUP CLK CURRENT SENSE + SOFTSTART SLOPE COMP LOGIC OUT CONTROL PWM BIAS LX EAMP FB FB SW1 V/RESET COMP SW2 GND MAX25232ATCF MAX25232ATCG PGOOD www.maximintegrated.com Maxim Integrated | 2 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Absolute Maximum Ratings SUP ........................................................................ -0.3V to +40V EN........................................................................... -0.3V to +40V BST to LX (Note 1) ................................................................. +6V BST......................................................................... -0.3V to +45V FB ...............................................................-0.3V to VBIAS + 0.3V SYNC..........................................................-0.3V to VBIAS + 0.3V SPS ............................................................-0.3V to VBIAS + 0.3V OUT ........................................................................ -0.3V to +18V PGOOD .................................................................... -0.3V to +6V PGND to AGND..................................................... -0.3V to +0.3V BIAS....................................................................... -0.3V to +6.0V LX Continuous RMS Current ....................................................3A OUT Short-Circuit Duration........................................................... ESD Protection Human Body Model.....................................±2kV Continuous Power Dissipation (TA = +70°C) 12-pin SWTDFN (derate 24.4mW/°C above +70°C) ..................................1951mW Storage Temperature Range .............................. -65ºC to +150ºC Operating Junction Temperature (Note 6) ..........-40ºC to +150ºC Lead Temperature (Soldering, 10s) .................................. +300ºC Soldering Temperature (Reflow)....................................... +260ºC Note 1: LX has internal clamp diodes to PGND/AGND and SUP. Applications that forward bias these diodes should take care not to exceed the IC’s package power-dissipation limits. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information 12 TDFN Package Code TD1233+2C Outline Number 21-0664 Land Pattern Number 90-0397 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction-to-Ambient (θJA) 41°C/W Junction-to-Case Thermal Resistance (θJC) 9°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial. Electrical Characteristics (VSUP = VEN, VSUP = 14V, VSYNC = 0V, VOUT = 5V, TJ = -40°C to +150°C, unless otherwise noted. (Notes 2 and 5)) PARAMETER Supply Voltage Range SYMBOL VSUP CONDITIONS After Start-Up MIN TYP 36 3 36 t < 1s Supply Current ISUP MAX25232ATCA, MAX25232ATCD, MAX25232ATCH www.maximintegrated.com UNITS V 40 VEN = low MAX25232ATCB, MAX25232ATCE MAX 3.5 1 5 No load, no switching 3.5 8 No load (Note 3) 4.5 No load, no switching No load (Note 3) 6 µA 10 7.5 Maxim Integrated | 3 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Electrical Characteristics (continued) (VSUP = VEN, VSUP = 14V, VSYNC = 0V, VOUT = 5V, TJ = -40°C to +150°C, unless otherwise noted. (Notes 2 and 5)) PARAMETER LX Leakage SYMBOL ILX,LEAK Undervoltage Lockout UVLO BIAS Voltage VBIAS CONDITIONS VSUP = 40V, LX = 0 or 40V, TA = +25°C VBIAS rising MIN TYP MAX UNITS +1 µA 2.73 2.93 -1 2.53 Hysteresis 0.13 5.5V ≤ VSUP ≤ 36V, PWM mode 5 V V BUCK CONVERTER Skip mode (Note 3) 4.85 4.99 5.1 Fixed-frequency PWM mode 4.93 5 5.07 Skip mode (Note 3) 3.2 3.3 3.37 Fixed-frequency PWM mode 3.25 3.3 3.35 Skip Mode (Note 3) 3.88 4 4.12 Fixed-frequency PWM mode 3.92 4 4.08 VOUT,5V MAX25232ATCA, MAX25232ATCD VOUT,3.3V MAX25232ATCB, MAX25232ATCE Voltage Accuracy, 4V VOUT,4V MAX25232ATCH Output Voltage Range VOUT MAX25232ATCF, MAX25232ATCG 3 FB Voltage Accuracy VFB MAX25232ATCF, MAX25232ATCG 0.985 IFB MAX25232ATCF, MAX25232ATCG VFB = 1V, TA = +25°C 0.02 µA MAX25232ATCF, MAX25232ATCG VSUP = 6V to 36V 0.02 %/V Voltage Accuracy, 5V Voltage Accuracy, 3.3V FB Current FB Line Regulation 1 V 10 V 1.015 V High-Side Switch OnResistance RON,HS VBIAS = 5V, ILX = 1A 70 mΩ Low-Side Switch OnResistance RON,LS VBIAS = 5V, ILX = 1A 70 mΩ High-Side Current-Limit Threshold ILIM Low-Side Negative Current-Limit Threshold INEG Soft-Start Ramp Time (Note 4) ISS Minimum On-Time tON MAX25232ATCA, MAX25232ATCB, MAX25232ATCG, MAX25232ATCH 3.05 3.50 3.95 MAX25232ATCD, MAX25232ATCE, MAX25232ATCF 4.10 4.70 5.60 -1.2 fSW Spread-Spectrum Range SS www.maximintegrated.com A MAX25232ATCA, MAX25232ATCB, MAX25232ATCG, MAX25232ATCH 3.5 5 MAX25232ATCD, MAX25232ATCE, MAX25232ATCF 5.5 7.5 ms (Note 3) 65 ns 98 99 % MAX25232ATCA, MAX25232ATCB, MAX25232ATCG, MAX25232ATCH 1.925 2.1 2.275 MHz MAX25232ATCD, MAX25232ATCE, MAX25232ATCF 360 400 440 kHz Maximum Duty Cycle PWM Switching Frequency A VSPS = 5V ±3 % Maxim Integrated | 4 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Electrical Characteristics (continued) (VSUP = VEN, VSUP = 14V, VSYNC = 0V, VOUT = 5V, TJ = -40°C to +150°C, unless otherwise noted. (Notes 2 and 5)) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS PGOOD PGOOD Threshold, Rising VTHR,PGD VOUT rising 91 93 95 % PGOOD Threshold, Falling VTHF,PGD VOUT falling 90 92 94 % PGOOD Debounce Time tDEB MAX25232ATCA, MAX25232ATCB, MAX25232ATCG, MAX25232ATCH PWM mode 60 Skip mode 90 MAX25232ATCD, MAX25232ATCE, MAX25232ATCF PWM mode 80 Skip mode 110 µs PGOOD High-Leakage Current ILEAK,PGD TA = +25°C 1 µA PGOOD Low Level VOUT,PGD Sinking 1mA 0.4 V LOGIC LEVELS EN Level, High VIH,EN EN Level, Low VIL,EN EN Input Current IIN,EN External Input Clock Frequency SYNC Threshold, High SYNC Threshold, Low SYNC Internal Pulldown FSYNC 2.4 V VEN = VSUP = 14V, TA = +25°C 2.6 MHz MAX25232ATCD, MAX25232ATCE, MAX25232ATCF 325 500 kHz 1.4 V VIL,SYNC VIH,SPS VIL,SPS µA 1.7 0.4 RPD,MODE SPS Threshold, Low V 1 MAX25232ATCA, MAX25232ATCB, MAX25232ATCG, MAX25232ATCH VIH,SYNC SPS Threshold, High 0.6 1000 1.4 V 0.4 SPS Internal Pulldown V kΩ V 1000 kΩ THERMAL PROTECTION Thermal Shutdown TSHDN (Note 3) 175 °C Thermal-Shutdown Hysteresis TSHDN.HYS (Note 3) 15 °C Note 2: Limits are 100% tested at TA = +25°C. Limits over the operating temperature range and relevant supply voltage are guaranteed by design and characterization. Typical values are at TA = +25°C. Note 3: Guaranteed by design; not production tested. Note 4: Soft-start time is measured as the time taken from EN going high to PGOOD going high. Note 5: The device is designed for continuous operation up to TJ = +125°C for 95,000 hours and TJ = +150°C for 5,000 hours. www.maximintegrated.com Maxim Integrated | 5 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Typical Operating Characteristics (VSUP = VEN = +14V, TA = +25°C, unless otherwise noted.) EFFICIENCY vs. LOAD (fSW= 2.1MHz) 100 toc01 100 5V 90 90 3.3V 5V 50 40 FPWM 30 20 3.3V 60 5V 50 0.01 0.1 1 0.001 0.01 0.1 0 1 LOAD CURRENT (A) SHUTDOWN SUPPLY CURRENT vs. INPUT VOLTAGE (5VOUT, 2.1MHz) 500 VEN = 0V 5V, 2.1MHz 300 250 3.3V, 2.1MHz 100 3.3V, 400kHz 0 36 0.0 0.2 2.0 1.5 OUTPUT-VOLTAGE CHANGE (%) OUTPUT-VOLTAGE CHANGE (%) 1.0 FPWM 0.0 SKIP -0.5 -1.0 FPWM 0.0 SKIP -0.5 -1.0 -2.0 1.0 6 16 -0.5 -1.0 -2.0 0.0 36 FPWM SKIP -1.5 26 2.0 1.5 0.0 -2.0 36 LOAD REGULATION (5VOUT, 400kHz) toc08 1.0 0.5 26 VIN (V) VIN = 14V -1.5 www.maximintegrated.com 0.8 2.0 1.5 VIN (V) 0.6 LOAD REGULATION (5VOUT, 2.1MHz) toc07 1A LOAD 16 0.4 OUTPUT-VOLTAGE CHANGE (%) LINE REGULATION (5VOUT, 400kHz) 6 0.5 ILOAD(mA) VIN (V) 0.5 1.0 -1.5 50 26 toc06 2.0 OUTPUT-VOLTAGE CHANGE (%) ISUP (µA) IQ(µA) 350 150 16 36 1.5 5V, 400kHz 200 6 26 1A LOAD 400 0.1 16 LINE REGULATION (5VOUT, 2.1MHz) toc05 450 1 3.3VOUT, 2.1MHz 6 VIN (V) STANDBY CURRENT vs. LOAD CURRENT toc04 3.3VOUT, 400kHz 5 VIN = 14V L = 10µH LOAD CURRENT (A) 10 5VOUT, 400kHz 5VOUT, 2.1MHz FPWM 10 0 15 10 40 20 VIN = 14V L = 2.2 µH 10 toc03 25 NO LOAD 5V 70 30 20 0.001 toc02 3.3V SKIP IQ (µA) 3.3V 60 0 QUIESCENT SUPPLY CURRENT vs. INPUT VOLTAGE (SKIP MODE) 80 SKIP 70 EFFICIENCY (%) 80 EFFICIENCY (%) EFFICIENCY vs. LOAD (fSW= 400kHz) toc09 VIN = 14V 1.0 0.5 0.0 SKIP FPWM -0.5 -1.0 -1.5 0.5 1.0 1.5 IOUT(A) 2.0 2.5 -2.0 0.0 0.5 1.0 1.5 2.0 2.5 IOUT(A) Maxim Integrated | 6 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Typical Operating Characteristics (continued) (VSUP = VEN = +14V, TA = +25°C, unless otherwise noted.) SHUTDOWN WAVEFORM (5VOUT, 2.1MHz, 2.5A LOAD) STARTUP WAVEFORM (5VOUT, 2.1MHz) toc10 VEN STEADY -STATE SWITCHING WAVEFORM (5VOUT, 2.1MHz, NO LOAD toc11 5V/div toc12 VEN 5V/div 7V/div VLX 5V/div IINDUCTOR VPGOOD 2A/div VPGOOD 5V/div VOUT 200mA/div IINDUCTOR 5V/div 5V/div VOUT VOUT 5V/div 1ms/div SLOW IV N RAMP (5VOUT, 2.1MHz) 200ns/div 100µs/div UNDERVOLTAGE PULSE (5VOUT, 2.1MHz) SHORT -CIRCUIT RESPONSE (5VOUT, 2.1MHz) toc13 toc14 10mA Load toc15 VOUT 5V/div VIN 5V/div 5V/div VOUT 5V/div VBIAS 5V/div VPGOOD 5V/div VPGOOD VIN 5V/div VBIAS VOUT 2V/div VPGOOD 5V/div 5V/div IINDUCTOR 1A/div 5µs/div 10ms/div 5s/div LOAD-DUMP TEST (5VOUT, 2.1MHz) SPECTRAL -ENERGY DENSITY vs. FREQUENCY (5VOUT, 2.1MHz) LOAD-TRANSIENT RESPONSE (5VOUT, 2.1MHz) toc16 toc17 0 VIN 10V/div VOUT 1A/div ILOAD 5V/div 100mV/div (ACCOUPLED) VOUT 5V/div VBIAS OUTPUT SPECTRUM (dBm) -10 toc19 VSPS= 5V -20 -30 -40 -50 -60 -70 -80 100ms/div www.maximintegrated.com 20µs/div -90 1.85 1.95 2.05 2.15 2.25 2.35 FREQUENCY (MHz) Maxim Integrated | 7 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Typical Operating Characteristics (continued) (VSUP = VEN = +14V, TA = +25°C, unless otherwise noted.) SHORT -CIRCUIT RESPONSE (3.3VOUT, 400kHz) toc19 VOUT 5V/div VPGOOD 5V/div VBIAS 5V/div 2A/div IINDUCTOR 10µs/div Pin Configuration AGND 7 FB 8 OUT 9 BIAS SYNC 11 10 PGOOD 12 MAX25232 3 4 5 6 SUP LX PGND 2 EN BST 1 SPS MAX25232 TDFN-EP (3mm x 3mm) Pin Description PIN NAME 1 SPS www.maximintegrated.com FUNCTION Spread-Spectrum Enable. Connect logic-high to enable spread spectrum of internal oscillator, or logic-low to disable spread spectrum. This pin has a 1MΩ internal pulldown. Maxim Integrated | 8 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Pin Description (continued) PIN NAME FUNCTION 2 EN High-Voltage-Compatible Enable Input. If this pin is low, the part is off. 3 BST Bootstrap Pin for HS Driver. It is recommended to use 0.1μF from BST to LX. 4 SUP Supply Input. Connect a 4.7μF ceramic capacitor from SUP to PGND. 5 LX 6 PGND Power Ground. Ground return path for all high-current/high-frequency noisy signals. 7 AGND Analog Ground. Ground return path for all ‘quiet’ signals. 8 FB Buck Switching Node. Connect inductor between LX and OUT. See the Inductor Selection section. If the part is off, this node is high impedance. Connect this pin to BIAS for fixed output voltage options. For MAX25232ATCF and MAX25232ATCG, use it as a FB pin to set the output voltage. 9 OUT Buck Regulator Output-Voltage-Sense Input. Bypass OUT to PGND with ceramic capacitors. 10 BIAS 5V Internal Bias Supply. Connect a 1μF (min) ceramic capacitor to AGND. 11 SYNC Sync Input. If connected to ground or open, skip-mode operation is enabled under light loads; if connected to BIAS, forced-PWM mode is enabled. This pin has a 1MΩ internal pulldown. 12 PGOOD - EP www.maximintegrated.com Open-Drain Reset Output. External pullup required. Exposed Pad. EP must be connected to ground plane on PCB, but is not a current-carrying path and is only needed for thermal transfer. Maxim Integrated | 9 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Detailed Description The MAX25232 family of small, current-mode-controlled buck converters features synchronous rectification and requires no external compensation network. The devices are designed for 3A output current and can stay in dropout by running at 99% duty cycle. Each device provides an accurate output voltage of ±2% in FPWM mode within the 6V to 18V input range. Voltage quality can be monitored by observing the PGOOD signal. The devices operate at 2.1MHz (typ) frequency, which allows for small external components, reduced output ripple, and guarantees no AM band interference. The devices are also available at 400kHz (typ) for minimum switching losses and maximum efficiency. Each device features an ultra-low 3.5μA (typ) quiescent supply current in standby mode. The device enters standby mode automatically at light loads if the high-side FET (HSFET) does not turn on for eight consecutive clock cycles. The devices operate from a 3.5V to 36V supply voltage and can tolerate transients up to 40V, making them ideal for automotive applications. The devices are available in factory-trimmed output voltages (5V, 3.3V). MAX25232ATCF and MAX25232ATCG configuration can be used to program output voltage between 3V and 10V using an external resistordivider. For fixed-output voltages outside of 3.3V and 5V, contact factory for availability. Enable Input (EN) Each device is activated by driving EN high. EN is compatible from a 3.3V logic level to automotive battery levels. EN can be controlled by microcontrollers and automotive KEY or CAN inhibit signals. The EN input has no internal pullup/ pulldown current to minimize the overall quiescent supply current. To realize a programmable undervoltage-lockout level, use a resistor-divider from SUP to EN to AGND. Bias/UVLO Each device features undervoltage lockout. When the device is enabled, an internal bias generator turns on. LX begins switching after VBIAS has exceeded the internal undervoltage-lockout level, VUVLO = 2.73V (typ). Soft-Start Each device features an internal soft-start timer. The output voltage soft-start time is 3.5ms (typ), which includes the delay in PGOOD. If a short circuit or undervoltage is encountered after the soft-start timer has expired, the device is disabled for 7ms (typ) and then reattempts soft-start again. This pattern repeats until the short circuit has been removed. Oscillator/Synchronization and Efficiency (SYNC) Each device has an on-chip oscillator that provides a 2.1MHz (typ) or 400kHz (typ) switching frequency. There are two operation modes, depending on the condition of SYNC. If SYNC is unconnected or at AGND, the device operates in highly efficient pulse-skipping mode. If SYNC is connected to BIAS or has a clock applied to it, the device is in forcedPWM mode (FPWM). The device can be switched during operation between FPWM mode and skip mode by switching SYNC. Skip-Mode Operation The devices enter skip mode when the SYNC pin is connected to ground or is unconnected and the peak load current is < 600mA (typ). In this mode, the HSFET is turned on until the inductor current ramps up to 600mA (typ) peak value and the internal feedback voltage is above the regulation voltage (1.0V, typ). At this point, both the HSFETs and low-side FETs (LSFETs) are turned off. Depending on the choice of the output capacitor and the load current, the HSFET turns on when OUT (valley) drops below the 1.0V (typ) feedback voltage. When the device is in skip mode, the internal highvoltage LDO is turned off to save current. VBIAS is supplied by the output after the soft start is completed. Achieving High Efficiency at Light Loads Each device operates with very low-quiescent current at light loads to enhance efficiency and conserve battery life. When the device enters skip mode, the output current is monitored to adjust the quiescent current. The lowest quiescent-current standby mode is only available for factory-trimmed devices between 3.0V and 5.5V output voltages. When the output current is < approximately 5mA, the device operates in the lowest quiescent-current mode, also called standby mode. In www.maximintegrated.com Maxim Integrated | 10 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ this mode, the majority of the internal circuitry (excluding that necessary to maintain regulation) in the device is turned off to save current. Under no load and with skip mode enabled, the device typically draws 3.5μA for the 3.3V parts, and 6μA for the 5.0V parts. For load currents > 5mA, the device enters normal skip mode and still maintains very high efficiency. Output-Voltage Overshoot Protection In dropout, the output voltage closely follows the input voltage, but is below the regulation point. The device runs at maximum duty cycle to satisfy the loop, and the internal error-amplifier output is railed high. When the input voltage rises above the output, the device comes out of dropout, but the internal error-amplifier output takes some time to get back to steady state. This causes an overshoot in the output voltage. To limit this overshoot, the device clamps the output of the error amplifier while coming out of dropout, causing it to discharge faster and limiting the output-voltage overshoot. The actual value of the overshoot depends on the output capacitor, inductor, and load. Controlled EMI with Forced-Fixed Frequency In FPWM mode, the device attempts to operate at a constant switching frequency for all load currents. For tightest frequency control, apply the operating frequency to SYNC. The advantage of FPWM is a constant switching frequency, which improves EMI performance; the disadvantage is that considerable current can be thrown away. If the load current during a switching cycle is less than the current flowing through the inductor, the excess current is diverted to AGND. Extended Input Voltage Range In some cases, the device is forced to deviate from its operating frequency, independent of the state of SYNC. At high input voltages above 18V (especially for 2.1MHz operation), the required on-time to regulate its output voltage may be smaller than the minimum on-time (65ns, typ). In this event, the device is forced to lower its switching frequency by skipping pulses. If the input voltage is reduced and the device approaches dropout, it continuously tries to turn on the HSFET. To maintain gate charge on the HSFET, the BST capacitor must be periodically recharged. To ensure proper charge on the BST capacitor when in dropout, the HSFET is turned off every 20μs and the LSFET is turned on for approximately 200ns. This gives an effective duty cycle of > 99%, and a switching frequency of 50kHz when in dropout. Spread-Spectrum Option Each device has an optional spread spectrum enabled by the SPS pin. If SPS is pulled high, the internal operating frequency varies by ±3% relative to the internally generated 2.1MHz (typ) operating frequency. Spread spectrum is offered to improve EMI performance of the device. The internal spread spectrum does not interfere with the external clock applied on the SYNC pin. It is active only when the device is running with an internally generated switching frequency. Power-Good (PGOOD) Each device features an open-drain power-good output. PGOOD is an active-high output that pulls low when the output voltage is below 92% (typ) of its nominal value. PGOOD is high impedance when the output voltage is above 93% (typ) of its nominal value. Connect a 20kΩ (typ) pullup resistor to an external supply, or to the on-chip BIAS output. Overcurrent Protection Each device limits the peak output current to 3.5A (typ) for 2.1MHz switching frequency parts and 4.7A (typ) for the 400kHz switching frequency parts. The accuracy of the current limit is ±12%, making selection of external components very easy. To protect against short-circuit events, the device shuts off when OUT is below 50% of VOUT and an overcurrent event is detected. The device attempts a soft-start restart every 7ms and stays off if the short circuit has not been removed. When the current limit is no longer present, it reaches the output voltage by following the normal soft-start sequence. If the device’s die reaches the thermal limit of 175°C (typ) during the current-limit event, it immediately shuts off. Thermal-Overload Protection Each device features thermal-overload protection. The device turns off when the junction temperature exceeds +175°C (typ). Once the device cools by 15°C (typ), it turns back on with a soft-start sequence. www.maximintegrated.com Maxim Integrated | 11 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Applications Information Setting the Output Voltage MAX25232 comes with fixed VOUT options (set internally) of 5V and 3.3V. For setting the output voltage between 3V - 10V externally using resistor-dividers, chose MAX25232ATCF and MAX25232ATCG. Connect a resistor-divider from output (OUT) to FB to AGND (see Figure 1). Select RFB2 (FB to AGND resistor) ≤ 500kΩ. Calculate RFB1 (OUT to FB resistor) with the following equation: RFB1 = RFB2 [ ] ] VOUT VFB −1 where VFB = 1V (see Electrical Characteristics). Other fixed-output voltage options (set internally) between 3V - 5.5V in 50mV steps are also available. Contact the factory if your application requires fixed output voltage in this range. VOUT RFB1 MAX25232ATCF MAX25232ATCG FB RFB2 Figure 1. Setting the Output Voltage with External Resistor-Dividers Input Capacitor A 4.7μF low-ESR ceramic input capacitor is recommended for proper device operation. This value can be adjusted based on application input-voltage-ripple requirements. The discontinuous input current of the buck converter causes large input-ripple current. Switching frequency, peak inductor current, and the allowable peak-to-peak input-voltage ripple dictate the input-capacitance requirement. Increasing the switching frequency or the inductor value lowers the peak-to-average current ratio, yielding a lower inputcapacitance requirement. The input ripple is mainly comprised of ΔVQ (caused by the capacitor discharge) and ΔVESR (caused by the ESR of the input capacitor). The total voltage ripple is the sum of ΔVQ and ΔVESR. Assume that inputvoltage ripple from the ESR and the capacitor discharge is equal to 50% each. The following equations show the ESR and capacitor requirement for a target voltage ripple at the input: Equation 1: www.maximintegrated.com Maxim Integrated | 12 MAX25232 ESR = 36V, 3A Mini Buck Converters with 3.5μA IQ ∆ VESR / IOUT + ( ∆ IP − P 2) IOUT × D(1 − D) CIN = ∆ V × × f Q SW where: ∆ IP − P = (VIN − VOUT) × VOUT VIN × fSW × L and: VOUT D= V IN where IOUT is the output current, D is the duty cycle, and fSW is the switching frequency. Use additional input capacitance at lower input voltages to avoid possible undershoot below the UVLO threshold during transient loading. Inductor Selection See Table 1 for inductor selection. The nominal standard value selected should be within ±50% of the specified inductance. The specified values applies to all output voltage settings. Table 1. Inductor Selection PART INDUCTANCE (µH) For fSW = 2.1MHz 2.2 10 For fSW = 400kHz Output Capacitor For optimal phase margin (> 60 degrees, typ), the recommended output capacitances are shown in Table 2. Recommended values are the actual capacitances after voltage derating is taken into account. If a lower output capacitance is required, contact the factory for recommendations. Additional output capacitance may be needed based on application-specific output-voltage-ripple requirements. The specified values applies to all output voltage settings. Table 2. Output-Capacitance Selection PART OUTPUT CAPACITANCE (µF) For fSW = 2.1MHz 30 For fSW = 400kHz 44 The allowable output-voltage ripple and the maximum deviation of the output voltage during step-load currents determine the output capacitance and its ESR. The output ripple comprises ΔVQ (caused by the capacitor discharge) and ΔVESR (caused by the ESR of the output capacitor). Use low-ESR ceramic or aluminum electrolytic capacitors at the output. For aluminum electrolytic capacitors, the entire output ripple is contributed by ΔVESR. Use Equation 2 to calculate the ESR requirement and choose the capacitor accordingly. If using ceramic capacitors, assume the contribution to the output ripple voltage from the ESR and the capacitor discharge to be equal. The following equations show the output capacitance and ESR requirement for a specified output-voltage ripple. Equation 2: ∆ VESR ESR = ∆ I P−P www.maximintegrated.com Maxim Integrated | 13 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ ∆ IP − P COUT = 8 × ∆ V × f Q SW where: ∆ IP − P = (VIN − VOUT) × VOUT VIN × fSW × L and: VOUT_RIPPLE = ∆ VESR + ∆ VQ ΔIP-P is the peak-to-peak inductor current as calculated above, and fSW is the converter’s switching frequency. The allowable deviation of the output voltage during fast transient loads also determines the output capacitance and its ESR. The output capacitor supplies the step-load current until the converter responds with a greater duty cycle. The resistive drop across the output capacitor’s ESR and the capacitor discharge causes a voltage droop during a step load. Use a combination of low-ESR tantalum and ceramic capacitors for better transient-load and ripple/noise performance. Keep the maximum output-voltage deviations below the tolerable limits of the electronics being powered. When using a ceramic capacitor, assume an 80% and 20% contribution from the output-capacitance discharge and the ESR drop, respectively. Use the following equations to calculate the required ESR and capacitance value: Equation 3: ∆ VESR ESROUT = I STEP L COUT ≥ ISTEP2 × 2 × (V SUP − VOUT) × DMAX × ∆ VQ tDELAY + ISTEP × ∆ V Q where ISTEP is the load step and tDELAY is the delay for the PWM mode, the worst-case delay would be (1-D) tSW when the load step occurs right after a turn-on cycle. This delay is higher in skip mode. PCB Layout Guidelines Careful PCB layout is critical to achieve low switching power losses and clean, stable operation. Use a multilayer board whenever possible for better noise immunity. Follow the guidelines below for a good PCB layout: 1. Place the input capacitor (CIN) close to the device to reduce the input AC-current loop. AC current flows on the loop formed by the input capacitor and the half-bridge MOSFETs internal to the device (see Figure 2). A small loop would reduce the radiating effect of high switching currents and improve EMI functionality. 2. Solder the exposed pad to a large copper-plane area under the device. To effectively use this copper area as heat exchanger between the PCB and ambient, expose the copper area on the top and bottom side. Add a few small vias or one large via on the copper pad for efficient heat transfer. 3. Connect PGND and AGND pins directly to the exposed pad under the IC. This ensures the shortest connection path between AGND and PGND. 4. Keep the power traces and load connections short. This practice is essential for high efficiency. Use thick copper PCB to enhance full-load efficiency and power-dissipation capability. 5. Using internal PCB layers as ground plane helps to improve the EMI functionality as ground planes act as a shield against radiated noise. Have multiple vias spread around the board, especially near the ground connections to have better overall ground connection. 6. Keep the bias capacitor (CBIAS) close to the device to reduce the bias current loop. This helps to reduce noise on the bias for smoother operation. www.maximintegrated.com Maxim Integrated | 14 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ GROUND SUP MAX25232 LX CBIAS CIN AC current loop GROUND VIAS GROUND COUT OUT COUT COUT INDUCTOR GROUND VCC Figure 2. Recommended PCB Layout for MAX25232 www.maximintegrated.com Maxim Integrated | 15 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Typical Application Circuits Circuit 1 MAX25232 SUP BST CIN 4.7µF LX CBST 0.1µF L 2.2µH NH OUT SYNC FB EN PGOOD SPS COUT 30µF NL BIAS AGND PGND CBIAS 1µF Figure 3. 2.1MHz, 5V/3.3V Fixed Output Voltage Configuration in 12-Pin TDFN Package www.maximintegrated.com Maxim Integrated | 16 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Typical Application Circuits (continued) Circuit 2 MAX25232 SUP BST CIN 4.7µF LX CBST 0.1µF L 10µH NH OUT SYNC FB EN PGOOD SPS COUT 44µF NL BIAS AGND PGND CBIAS 1µF Figure 4. 400kHz, 5V/3.3V Fixed Output Voltage Configuration in 12-Pin TDFN Package www.maximintegrated.com Maxim Integrated | 17 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Typical Application Circuits (continued) Circuit 3 MAX25232 SUP BST CIN 4.7µF CBST 0.1µF L 10µH LX NH OUT SYNC NL RFB1 EN FB PGOOD SPS COUT 44µF BIAS AGND PGND RFB2 CBIAS 1µF Figure 5. 400kHz, External Resistor-Divider Configuration in 12-Pin TDFN Package Ordering Information PART TEMP RANGE PINPACKAGE IOUT (A) DESCRIPTION MAX25232ATCA/V+ -40°C to +125°C 12 TDFN 2.1MHz, Fixed 5V output 2.5 MAX25232ATCB/V+ -40°C to +125°C 12 TDFN 2.1MHz, Fixed 3.3V output 2.5 MAX25232ATCD/V+ -40°C to +125°C 12 TDFN 400kHz, Fixed 5V output 3 MAX25232ATCE/V+ -40°C to +125°C 12 TDFN 400kHz, Fixed 3.3V output 3 MAX25232ATCF/V+ -40°C to +125°C 12 TDFN 400kHz, Adjustable Output Voltage Between 3V and 10V 3 MAX25232ATCG/V+ -40°C to +125°C 12 TDFN 2.1MHz, Adjustable Output Voltage Between 3V and 10V 2.5 MAX25232ATCH/V+ -40°C to +125°C 12 TDFN 2.1MHz, Fixed 4V output 2.5 Note: All parts are OTP versions, no metal mask differences. /V Denotes an automotive-qualified part. + Denotes a lead(Pb)-free/RoHS-compliant package * Future product - contact factory for availability www.maximintegrated.com Maxim Integrated | 18 MAX25232 36V, 3A Mini Buck Converters with 3.5μA IQ Revision History REVISION NUMBER REVISION DATE PAGES CHANGED 0 7/20 Initial release 1 10/20 Updated Benefits and Features, Electrical Characteristics, Pin Configuration, Pin Description, Applications Information, and Ordering Information 2 3/21 Updated Absolute Maximum Ratings, Electrical Characteristics, and Ordering Information 3 4/21 Updated Pin Configuration, Pin Description , Typical Application Circuits DESCRIPTION — 1, 4, 5, 9, 10, 14, 20 3, 4, 19 8, 9, 17, 18 For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2021 Maxim Integrated Products, Inc.
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MAX25232ATCB/V+
  •  国内价格 香港价格
  • 1+40.052601+5.13755
  • 10+30.3115110+3.88806
  • 25+27.8792325+3.57607
  • 100+25.20559100+3.23313
  • 250+23.93073250+3.06960
  • 624+22.94653624+2.94336
  • 1248+22.352141248+2.86711
  • 3120+21.724823120+2.78665

库存:146