FEATURES
PIN CONFIGURATION
Complete microphone conditioner in a 10-lead package
Single 3 V operation
Low shutdown current < 2 µA
Adjustable noise gate threshold
Adjustable compression ratio
Automatic limiting feature prevents ADC overload
Low noise and distortion: 0.2% THD + N
20 kHz bandwidth
GND 1
10
VDD
VCAIN 2
9
OUTPUT
SHUTDOWN 3
BUFOUT 4
SSM2167
TOP VIEW
(Not to Scale)
INPUT 5
The SSM2167 is a complete and flexible solution for conditioning
microphone inputs in personal electronics and computer audio
systems. It is also excellent for improving vocal clarity in communications and public address systems. A low noise voltage
controlled amplifier (VCA) provides a gain that is dynamically
adjusted by a control loop to maintain a set compression characteristic. The compression ratio is set by a single resistor and can
be varied from 1:1 to over 10:1 relative to the fixed rotation
point. Signals above the rotation point are limited to prevent
overload and to eliminate popping. A downward expander (noise
gate) prevents amplification of background noise or hum. This
results in optimized signal levels prior to digitization, thereby
eliminating the need for additional gain or attenuation in the
digital domain. The flexibility of setting the compression ratio
and the time constant of the level detector, coupled with two
values of rotation point, make the SSM2167 easy to integrate in
a wide variety of microphone conditioning applications.
6
AVG CAP
LIMITING
THRESHOLD
(ROTATION POINT)
OUTPUT (dB)
DOWNWARD
EXPANSION
THRESHOLD
(NOISE GATE)
LIMITING
REGION
COMPRESSION
REGION
1
VCA GAIN
r
DOWNWARD
EXPANSION
REGION
1
1
VDE
VRP
INPUT (dB)
02628-002
GENERAL DESCRIPTION
COMPRESSION RATIO
GATE THRS
Figure 1. 10-Lead MSOP (RM Suffix)
APPLICATIONS
Desktop, portable, or palmtop computers
Telephone conferencing
Communication headsets
Two-way communications
Surveillance systems
Karaoke and DJ mixers
8
7
02628-001
Data Sheet
Low Voltage Microphone Preamplifier with
Variable Compression and Noise Gating
SSM2167
Figure 2. General Input/Output Characteristics
The device is available in a 10-lead MSOP package, and is
guaranteed for operation over the extended industrial
temperature range of −40°C to +85°C.
Rev. G
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2001–2011 Analog Devices, Inc. All rights reserved.
SSM2167
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Theory of Operation .....................................................................8
Applications ....................................................................................... 1
Signal Path ......................................................................................8
General Description ......................................................................... 1
Level Detector ................................................................................9
Pin Configuration ............................................................................. 1
Control Circuitry...........................................................................9
Revision History ............................................................................... 2
Setting the Compression Ratio ....................................................9
Specifications..................................................................................... 3
Setting the Noise Gate Threshold (Downward Expansion) . 10
Absolute Maximum Ratings ............................................................ 4
Rotation Point (Limiting).......................................................... 10
Thermal Resistance ...................................................................... 4
Shutdown Feature ....................................................................... 10
ESD Caution .................................................................................. 4
PCB Layout Considerations ...................................................... 10
Typical Performance Characteristics ............................................. 5
Outline Dimensions ....................................................................... 11
Applications Information ................................................................ 8
Ordering Guide .......................................................................... 11
REVISION HISTORY
Changes to Ordering Guide .......................................................... 11
Updated Outline Dimensions ....................................................... 11
Changes to Ordering Guide .......................................................... 11
2/11—Rev. E to Rev. F
9/03—Rev. A to Rev. B
Added Storage Temperature Range Parameter to Table 2........... 4
Deleted Figure 15; Renumbered Figures Sequentially ................. 7
Change to Level Detector Section and Figure 17 ......................... 9
Updated Outline Dimensions ....................................................... 11
Deleted SSM2167-2 Model................................................ Universal
Changes to Ordering Guide .............................................................3
Edits to Figure 2 and Figure 3 ..........................................................6
Updated Outline Dimensions ..........................................................9
6/09—Rev. D to Rev. E
3/02—Rev. 0 to Rev. A
Change to Signal Path Section ........................................................ 8
Updated Outline Dimensions ....................................................... 11
Edits to Specifications .......................................................................2
Edits to Figure 2 and Figure 3 ..........................................................6
2/09—Rev. C to Rev. D
7/01—Revision 0: Initial Version
9/11—Rev. F to Rev. G
Changes to Figure 4, Figure 5, Figure 6, and Figure 7 ................. 5
Changes to Ordering Guide .......................................................... 11
11/07—Rev. B to Rev. C
Updated Format .................................................................. Universal
Changes to PSRR .............................................................................. 3
Rev. G | Page 2 of 12
Data Sheet
SSM2167
SPECIFICATIONS
VS = 3.0 V, f = 1 kHz, RL = 100 kΩ, RCOMP = 0 Ω, TA = 25°C, VIN = 100 mV rms, RGATE = 2 kΩ, unless otherwise noted.
Table 1.
Parameter
AUDIO SIGNAL PATH
Voltage Noise Density
Noise
Total Harmonic Distortion + Noise
Input Impedance
Output Impedance
Load Drive
Input Voltage Range
Output Voltage Range
Gain Bandwidth Product
CONTROL SECTION
VCA Dynamic Gain Range
VCA Fixed Gain
Compression Ratio, Minimum
Compression Ratio, Maximum
Rotation Point
Noise Gate Range
POWER SUPPLY
Supply Voltage
Supply Current
DC Output Voltage
Power Supply Rejection Ratio
SHUTDOWN
Supply Current
Symbol
Test Conditions/Comments
en
10:1 compression
20 kHz bandwidth, VIN = GND
VIN = 100 mV rms
THD + N
ZIN
ZOUT
Min
Minimum resistive load
Maximum capacitive load
0.4% THD + N
0.4% THD + N
1:1 compression, VCA G = 18 dB
See Table 4 for RCOMP
Maximum threshold
VSY
ISY
Typ
Unit
20
−70
0.2
100
145
5
2
600
700
1
nV/√Hz
dBV
%
kΩ
Ω
kΩ
nF
mV rms
mV rms
MHz
40
18
1:1
10:1
63
−40
dB
dB
2.5
PSRR
VSY = 2.5 V to 6 V
2.3
1.4
45
ISY
Pin 3 = GND
2
Rev. G | Page 3 of 12
Max
mV rms
dBV
5.5
5
V
mA
V
dB
8
µA
SSM2167
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Parameter
Supply Voltage
Input Voltage
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Lead Temperature (Soldering, 10 sec)
883 (Human Body) Model
θJA is specified for worst-case conditions, that is, θJA is specified
for a device soldered in a 4-layer circuit board for surface-mount
packages.
Rating
6V
6V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
500 V
Table 3.
Package Type
10-Lead MSOP (RM)
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. G | Page 4 of 12
θJA
180
θJC
35
Unit
°C/W
Data Sheet
SSM2167
TYPICAL PERFORMANCE CHARACTERISTICS
1
100
THD + N (%)
10
0.1
1
500
1000
1500
2000
2500
3000
3500
RGATE (Ω)
0.01
0.01
COMPRESSION RATIO 10:1
–10
–20
COMPRESSION RATIO 5:1
OUTPUT (dBV)
THD + N (%)
0
TA = 25°C
V+ = 3V
VIN = 24.5mV rms
COMPRESSION RATIO 1:1
ROTATION POINT = 63mV rms
NOISE GATE SETTING = 2mV rms
0.1
–30
COMPRESSION RATIO 2:1
–40
COMPRESSION RATIO 1:1
–50
–60
TA = 25°C
V+ = 3V
RLOAD = 100kΩ
ROTATION POINT = 63mV rms
NOISE GATE SETTING = 2mV rms
–70
100
1k
10k
30k
FREQUENCY (Hz)
–80
–80
02628-004
0.01
20
1
Figure 6. THD + N vs. Input Voltage
Figure 3. Noise Gate vs. RGATE
1
0.1
INPUT VOLTAGE (V rms)
–70
–60
–50
–40
–30
–20
–10
INPUT (dBV)
Figure 4. THD + N vs. Frequency
02628-007
0
02628-006
TA = 25°C
V+ = 3V
VIN FREQUENCY = 1kHz
RLOAD = 100kΩ
COMPRESSION RATIO 1:1
ROTATION POINT = 63mV rms
NOISE GATE SETTING = 2mV rms
02628-003
NOISE GATE (mV rms)
TA = 25°C
V+ = 3V
RLOAD = 100kΩ
COMPRESSION RATIO 2:1
ROTATION POINT = 63mV rms
Figure 7. Output vs. Input Characteristics
–10
35
30
–20
V+ = 3V + 0.1
RGATE = 5kΩ
RCOMP = 0Ω
25
–30
PSRR (dB)
15
10
5
0
–10
–15
1k
–40
–50
–60
VIN = 2mV rms
RCOMP = 175kΩ
ROTATION POINT = 63mV rms
NOISE GATE SETTING = 2mV rms
10k
100k
–70
1M
FREQUENCY (Hz)
10M
Figure 5. GBW Curves vs. VCA Gain
–80
10
100
1k
10k
FREQUENCY (Hz)
Figure 8. PSRR vs. Frequency
Rev. G | Page 5 of 12
100k
02628-008
–5
02628-005
GAIN (dB)
20
TA = 25°C
CSYS = 10µF
SYSTEM GAIN = 19dB
RLOAD = 100kΩ
COMPRESSION RATIO 1:1
TIME (10µs/DIV)
VOLTAGE (200mV/DIV)
Figure 11. Small Signal Transient Response
TA = 25°C
CSYS = 10µF
SYSTEM GAIN = 8.6dB
RLOAD = 100kΩ
COMPRESSION RATIO 1:1
TIME (10µs/DIV)
02628-010
VOLTAGE (500mV/DIV)
Figure 9. Small Signal Transient Response
TA = 25°C
CSYS = 10µF
SYSTEM GAIN = 2.6dB
RLOAD = 100kΩ
COMPRESSION RATIO 1:1
TIME (10µs/DIV)
Figure 10. Large Signal Transient Response
Figure 12. Large Signal Transient Response
Rev. G | Page 6 of 12
02628-012
TIME (10µs/DIV)
TA = 25°C
CSYS = 10µF
SYSTEM GAIN = 8dB
RLOAD = 100kΩ
COMPRESSION RATIO 1:1
02628-011
VOLTAGE (50mV/DIV)
Data Sheet
02628-009
VOLTAGE (50mV/DIV)
SSM2167
VOLTAGE (100mV/DIV)
SSM2167
–6dBV
–6dBV
–66dBV
–66dBV
–85dBV
02628-013
TIME (1s/DIV)
–85dBV
Figure 13. RMS Level Detector Performance with CAVG = 22 µF
TIME (500ms/DIV)
Figure 14. RMS Level Detector Performance with CAVG = 2.2 µF
Rev. G | Page 7 of 12
02628-014
VOLTAGE (100mV/DIV)
Data Sheet
SSM2167
Data Sheet
APPLICATIONS INFORMATION
The SSM2167 is a complete microphone signal conditioning
system on a single integrated circuit. Designed primarily for
voice-band applications, this integrated circuit provides amplification, limiting, variable compression, and noise gate. User
adjustable compression ratio, noise gate threshold, and two
different fixed gains optimize circuit operation for a variety of
applications. The SSM2167 also features a low power shutdown
mode for battery-powered applications.
VDD
+
10µF
1
+
10
9
OUTPUT
100kΩ
10µF
GND
2
VDD
SSM2167
10µF
500kΩ
4
7
3
8
RCOMP
SHUTDOWN
5
INPUT
+
GND
Figure 15. Typical Application Circuit
C2
10µF
+
VDD
BUFOUT
VCAIN
C1
0.1µF
1kΩ
+1
OUTPUT
VCA
BUFFER
LEVEL
DETECTOR
CAVG
C3
SHUTDOWN GND 10µF
CONTROL
+
RG
RC
NOISE GATE AND
COMPRESSION
SETTINGS
VDD
02628-017
INPUT
+
1kΩ
Input signals below VDE are downward expanded; that is, a
−1 dB change in the input signal level causes approximately a
−3 dB change in the output level. As a result, the gain of the
system is small for very small input signal levels, even though
it may be quite large for small input signals above VDE. The
external resistor at Pin 7, RGATE, is used to set the downward
expansion threshold (VDE).
SIGNAL PATH
6
10µF
0.1µF
The gain of the system with an input signal level of VRP is the fixed
gain, 18 dBV for the SSM2167, regardless of the compression ratio.
Finally, the SSM2167 provides an active low, CMOS-compatible
digital power-down feature that reduces device supply current
to typically less than 2 µA.
RGATE
02628-016
VDD
The breakpoint between the compression region and the limiting
region is referred to as the limiting threshold or the rotation point.
The term, rotation point, derives from the observation that the
straight line in the compression region rotates about this point on
the input/output characteristic as the compression ratio is changed.
Figure 16. Functional Block Diagram
THEORY OF OPERATION
The typical transfer characteristic for the SSM2167 is shown in
Figure 2 where the output level in dB is plotted as a function of
the input level in dB. The dotted line indicates the transfer characteristic for a unity-gain amplifier. For input signals in the range
of VDE (downward expansion) to VRP (rotation point), an “r” dB
change in the input level causes a 1 dB change in the output level.
Here, r is defined as the compression ratio. The compression ratio
may be varied from 1:1 (no compression) to 10:1 via a single
resistor, RCOMP. Input signals above VRP are compressed with a
fixed compression ratio of approximately 10:1. This region of
operation is the limiting region. Varying the compression ratio
has no effect on the limiting region.
Figure 16 illustrates the block diagram of the SSM2167. The
audio input signal is processed by the input buffer and then by
the VCA. The input buffer presents an input impedance of
approximately 100 kΩ to the source. A dc voltage of approximately
400 mV is present at INPUT (Pin 5) of the SSM2167, requiring the
use of a blocking capacitor (C1) for ground-referenced sources.
A 0.1 µF capacitor is a good choice for most audio applications.
The input buffer is a unity-gain stable amplifier that can drive
the low impedance input of the VCA and an internal rms detector.
The VCA is a low distortion, variable gain amplifier whose gain
is set by the side-chain control circuitry. An external blocking
capacitor (C2) must be used between the buffer output and the
VCA input. The 1 kΩ impedance between amplifiers determines
the value of this capacitor, which is typically between 4.7 µF and
10 µF. An aluminum electrolytic capacitor is an economical choice.
The VCA amplifies the input signal current flowing through C2
and converts this current to a voltage at the output pin (Pin 9) of
the SSM2167. The net gain from input to output can be as high
as 40 dB, depending on the gain set by the control circuitry.
The output impedance of the SSM2167 is typically less than
145 Ω, and the external load on Pin 9 should be >5 kΩ. The
nominal output dc voltage of the device is approximately 1.4 V;
therefore, a blocking capacitor for grounded loads must be used.
The bandwidth of the SSM2167 is quite wide at all gain settings.
The upper 3 dB point is over 1 MHz at gains as high as 30 dB.
The GBW plots are shown in Figure 5. The lower 3 dB cutoff
frequency of the SSM2167 is set by the input impedance of the
VCA (1 kΩ) and C2. Whereas the noise of the input buffer is
fixed, the input-referred noise of the VCA is a function of gain.
The VCA input noise is designed to be at a minimum when the
gain is at a maximum, thereby maximizing the usable dynamic
range of the part.
Rev. G | Page 8 of 12
Data Sheet
SSM2167
LEVEL DETECTOR
10:1
The SSM2167 incorporates a full-wave rectifier and a true rms
level detector circuit whose averaging time constant is set by an
external capacitor (CAVG) connected to the AVG CAP (Pin 6).
For optimal low frequency operation of the level detector down
to 10 Hz, the value of the capacitor should be 2.2 μF. Some experimentation with larger values for CAVG may be necessary to reduce
the effects of excessive low frequency ambient background noise.
The value of the averaging capacitor affects sound quality: too
small a value for this capacitor may cause a pumping effect for
some signals, whereas too large a value can result in slow response
times to signal dynamics. Electrolytic capacitors are recommended
here for lowest cost and should be in the range of 2 μF to 22 μF.
The performance of the rms level detector is illustrated in
Figure 14 for a CAVG of 2.2 μF and Figure 13 for a CAVG of 22 μF.
In Figure 13 and Figure 14, the input signal to the SSM2167
(not shown) is a series of tone bursts in six successive 10 dB
steps. The tone bursts range from −66 dBV (0.5 mV rms) to
−6 dBV (0.5 V rms). As illustrated in these figures, the attack
time of the rms level detector is dependent only on CAVG, but the
release times are linear ramps whose decay times are dependent
on both CAVG and the input signal step size. The rate of release is
approximately 240 dB/s for a CAVG of 2.2 μF, and 12 dB/s for a
CAVG of 22 μF.
CONTROL CIRCUITRY
The output of the rms level detector is a signal proportional to
the log of the true rms value of the buffer output with an added
dc offset. The control circuitry subtracts a dc voltage from this
signal, scales it, and sends the result to the VCA to control the
gain. The gain control of the VCA is logarithmic—a linear change
in control signal causes a dB change in gain. It is this control
law that allows linear processing of the log rms signal to provide
the flat compression characteristic on the input/output characteristic shown in Figure 2.
VCA GAIN
2:1
OUTPUT (dB)
1:1
1
1
VDE
INPUT (dB)
VRP
02628-018
The rms detector filter time constant is approximately given by
10 × CAVG milliseconds where CAVG is in μF. This time constant
controls both the steady state averaging in the rms detector as well
as the release time for compression, that is, the time it takes for
the system gain to increase due to a decrease in input signal. The
attack time, the time it takes for the gain to be reduced because
of a sudden increase in input level, is controlled mainly by internal
circuitry that speeds up the attack for large level changes. In most
cases, this limits overload time to less than 35 ms.
5:1
Figure 17. Effect of Varying the Compression Ratio
SETTING THE COMPRESSION RATIO
Changing the scaling of the control signal fed to the VCA causes
a change in the circuit compression ratio, r. This effect is shown
in Figure 17. Connecting a resistor (RCOMP) between Pin 8 and
VDD sets the compression ratio. Lowering RCOMP gives smaller
compression ratios as indicated in Table 4. AGC performance is
achieved with compression ratios between 2:1 and 10:1, and is
dependent on the application. Shorting RCOMP disables the AGC
function, setting the compression equal to 1:1. If using a compression resistor, using a value greater than 5 kΩ is recommended.
If a value lower than 5 kΩ is used, the device may interpret this
as a short, 0 Ω.
Table 4. Setting Compression Ratio
Compression Ratio
1:1
2:1
3:1
5:1
10:1
Rev. G | Page 9 of 12
Value of RCOMP
0 Ω (short to V+)
15 kΩ
35 kΩ
75 kΩ
175 kΩ
SSM2167
Data Sheet
ROTATION POINT (LIMITING)
SETTING THE NOISE GATE THRESHOLD
(DOWNWARD EXPANSION)
The noise gate threshold is a programmable point using an external
resistor (RGATE) that is connected between Pin 7 (GATE THRS)
and VDD. The downward expansion threshold may be set between
−40 dBV and −55 dBV, as shown in Table 5. The downward
expansion threshold is inversely proportional to the value of this
resistance: setting this resistance to 0 Ω sets the threshold at
approximately 10 mV rms (−40 dBV), whereas a 5 kΩ resistance
sets the threshold at approximately 1 mV rms (−55 dBV). This
relationship is illustrated in Figure 18. It is not recommended
to use more than 5 kΩ for the RGATE resistor because the noise
floor of the SSM2167 prevents the noise gate from being
lowered further without causing problems.
Table 5. Setting Noise Gate Threshold
Noise Gate (dBV)
−40
−48
−54
−55
Value of RGATE
0 Ω (short to V+)
1 kΩ
2 kΩ
5 kΩ
Input signals above a particular level, the rotation point, are
attenuated (limited) by internal circuitry. This feature allows the
SSM2167 to limit the maximum output, preventing clipping of
the following stage, such as a codec or ADC. The rotation point
for the SSM2167 is set internally to −24 dBV (63 mV rms).
SHUTDOWN FEATURE
The supply current of the SSM2167 can be reduced to under
10 μA by applying an active low, 0 V CMOS-compatible input
to the SHUTDOWN pin (Pin 3) of the SSM2167. In this state,
the input and output circuitry of the SSM2167 assumes a high
impedance state; as such, the potentials at the input pin and the
output pin are determined by the external circuitry connected
to the SSM2167. The SSM2167 takes approximately 200 ms to
settle from a shutdown to power-on command. For power-on to
shutdown, the SSM2167 requires more time, typically less than
1 sec. Cycling the power supply to the SSM2167 can result in
quicker settling times: the off-to-on settling time of the SSM2167 is
less than 200 ms, whereas the on-to-off settling time is less than
1 ms. The SSM2167 shutdown current is related to both temperature and voltage.
PCB LAYOUT CONSIDERATIONS
Because the SSM2167 is capable of wide bandwidth operation
and can be configured for as much as 60 dB of gain, special care
must be exercised in the layout of the PCB that contains the IC
and its associated components. The following applications hints
should be considered for the PCB.
r:1
OUTPUT (dB)
VCA GAIN
The layout should minimize possible capacitive feedback from
the output of the SSM2167 back to its input. Do not run input
and output traces adjacent to each other.
1
VDE2
VDE1 VDE3
VRP
INPUT (dB)
Figure 18. Effects of Varying the Downward
Expansion (Noise Gate) Threshold
02628-019
1
A single-point (star) ground implementation is recommended
in addition to maintaining short lead lengths and PCB runs. In
applications where an analog ground and a digital ground are
available, the SSM2167 and its surrounding circuitry should be
connected to the analog ground of the system. As a result of
these recommendations, wire-wrap board connections and
grounding implementations are to be explicitly avoided.
Rev. G | Page 10 of 12
Data Sheet
SSM2167
OUTLINE DIMENSIONS
3.10
3.00
2.90
10
3.10
3.00
2.90
1
5.15
4.90
4.65
6
5
PIN 1
IDENTIFIER
0.50 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.30
0.15
6°
0°
0.23
0.13
COMPLIANT TO JEDEC STANDARDS MO-187-BA
0.70
0.55
0.40
091709-A
0.15
0.05
COPLANARITY
0.10
Figure 19. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
SSM2167-1RMZ-REEL
SSM2167-1RMZ-R7
SSM2167Z-EVAL
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
10-Lead MSOP
10-Lead MSOP
Evaluation Board
Z = RoHS Compliant Part, # denotes RoHS compliant product may be top or bottom marked.
Rev. G | Page 11 of 12
Package Option
RM-10
RM-10
Branding
B11
B11
SSM2167
Data Sheet
NOTES
©2001–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02628-0-9/11(G)
Rev. G | Page 12 of 12
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