HMCAA112G

HIGH DENSITY CARD EDGE Adam Technologies, Inc. INTRODUCTION: Adam Tech HMCA Series Card Edge Connectors include Standard and Express versions designed for PCB’s in Peripheral Component Interconnect (PCI) applications. Each is manufactured in a four row, high density package which is completely compatible to industry standards and has specially engineered contacts which provide a very short electrical path between boards. Adam Tech card edge connectors are designed for high performance with solid board pegs and precision located, selectively gold plated contacts which are ideal in high speed, increased bandwidth applications FEATURES: PCI and PCI Express Versions High density compact designs Industry standard PCI compatible Special contact design reduces electrical path Selectively plated contacts Open bottom for after solder cleaning MATING PC BOARDS: All .050" centerline printed circuit board pads with a thickness of .062" to .072" SPECIFICATIONS: Material: Standard insulator: PPS, 30% glass reinforced, rated UL94V-0 Optional Hi-Temp insulator: Nylon 6T, rated UL94V-0 Insulator Color: Dark Brown (White 120 pos.) Contacts: Phosphor Bronze Contact Plating: Gold Flash (30 µin Optional) over Nickel underplate on contact area, tin over copper underplate on tails. Electrical: Operating voltage: 125V AC max. Current rating: 1 Amp max. Contact resistance: 30 mΩ max. initial Insulation resistance: 1000 MΩ min. Dielectric withstanding voltage: 500V AC for 1 minute Mechanical: Insertion force: 7 oz max. Withdrawal force: 0.9 oz min Temperature Rating: Operating temperature: -55°C to +105°C Soldering process temperature: Standard insulator: 235°C Hi-Temp insulator: 260°C PACKAGING: Anti-ESD plastic trays SAFETY AGENCY APPROVALS: UL Recognized File No. E224053 CSA Certified File No. LR1578596 .050" [1.27] VESA MICRO CHANNEL ARCHITECTURE (MCA) HMCA SERIES ORDERING INFORMATION HMCA A 112 G SERIES INDICATOR HMCA = VESA Micro-channel Card Edge connector PLATING G = Selectively gold plated contacts PEGS = A = Plastic pegs B = Metal boardlocks POSITIONS 112, 120, 132, 182, 184, 194 Pb UL ® ® ® E DCOMPLIANT 2002 2002 / 95 / EC RoHS V HI-TEMP INSULATOR AVA I L A B L E OPTIONS Add designator(s) to end of part number 30 = 30 µin gold plating in contact area HT = Hi-Temp insulator for Hi-Temp soldering processes up to 260°C 172 909 Rahway Avenue • Union, RoHS New Jersey 07083 • T: 908-687-5000 • F: 908-687-5710 • WWW.ADAM-TECH.COM COMPLIANT