A705SFT-250

A705 www.addmtek.com DESCRIPTION The A705 is a low dropout current regulator rated for 210mA, 230mA, 250mA, 270mA, and 290mA constant sink current. The low quiescent current and low dropout voltage are achieved by advanced Bi-CMOS process. 200mA ~ 300mA ADVANCED CURRENT REGULATOR FEATURES Only bypass capacitor is required. 210/230/250/270/290mA constant sink current. Output short / open circuit protection. Low dropout voltage. Low quiescent current. Supply voltage range 2.7V ~ 12V. 2KV HBM ESD protection. Advanced Bi-CMOS process. SOT-89 and TO-252 package available. TYPICAL APPLICATION CIRCUIT V LED+ APPLICATIONS Power LED Driver LED Cap-Lamp C BP PACKAGE PIN OUT VDD VDD O UT GND OUT SOT-89 (Top View) TO-252 GND OUT V DD C IN VDD A705X GND ORDER INFORMATION Output Current 200mA ~ 220mA 220mA ~ 240mA 240mA ~ 260mA 260mA ~ 280mA 280mA ~ 300mA N SOT-89 3-pin A705NFT-210 A705NFT-230 A705NFT-250 A705NFT-270 A705NFT-290 S TO-252 3-pin A705SFT-210 A705SFT-230 A705SFT-250 A705SFT-270 A705SFT-290 Note: The letter ”F” is marked for Lead Free process, and letter “T” is marked for Tape & Reel. Copyright © 2007 ADDtek Corp. 1 DD077_A -- AUGUST 2007 A705 ABSOLUTE MAXIMUM RATINGS (Note) Input Voltage, VDD Output Voltage, VOUT Maximum Junction Temperature, TJ Storage Temperature Range Lead Temperature (Soldering, 10 seconds) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. -0.3V to 13.2V -0.3V to 17V 150°C -40°C to 150°C 260°C BLOCK DIAGRAM A705 VDD Band-gap Reference Control Circuit OUT GND PIN DESCRIPTION Pin Name VDD OUT GND Pin Function Power supply. Output pins. Connected to load. Ground. THERMAL RESISTANCE Package N S SOT-89 TO-252 θJT (°C /W) 35 7 Note: TJ = TC + (PD × θJT) θJT: Thermal Resistance - Junction to Tab. TC: Case (Tab) Temperature. TJ: Junction Temperature. PD: Power Consumption. Copyright © 2007 ADDtek Corp. 2 DD077_A -- AUGUST 2007 A705 RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Output Sink Current Operating Free-air Temperature Range Symbol VDD IOUT TA Min 2.7 -40 Typ Max 12 260 +85 Unit V mA °C DC ELECTRICAL CHARACTERISTICS VDD=3.7V, TA=25°C, No Load (Unless otherwise noted) Parameter Symbol Condition A705P A705Q Output Sink Current IOUT VOUT=0.2V A705R A705S A705T Load Regulation Line Regulation Output Dropout Voltage (Note) Supply Current Consumption VOUTL IDD VOUT=0.2V to 3V VDD= 3V to 12V, VOUT=0.2V 120 200 Min 200 220 240 260 280 Typ 210 230 250 270 290 Max 220 240 260 280 300 2 2 mA/V mA/V mV uA VDD OUT mA Unit Apply Pin Note: Output dropout voltage: 90% x IOUT @ VOUT=200mV Copyright © 2007 ADDtek Corp. 3 DD077_A -- AUGUST 2007 A705 APPLICATION INFORMATION The Maximum Power Dissipation on Regulator: PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IQ VOUT(MAX) = the maximum voltage on output pin; IOUT(NOM) = the nominal output current; IQ = the quiescent current the regulator consumes at IOUT(MAX); VIN(MAX) = the maximum input voltage. Thermal Consideration: The A705 has internal power and thermal limiting circuitry designed to protect the device under overload conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load conditions. The thermal protection circuit of A705 prevents the device from damage due to excessive power dissipation. When the device temperature rises to approximately 150°C, the regulator will be turned off. When power consumption is over about 700mW (SOT-89 package, at TA=70°C) or 1000mW (TO-252 package, at TA=70°C), additional heat sink is required to control the junction temperature below 120°C. The junction temperature is: TJ = PD (θJT +θCS +θSA ) + TA PD : Dissipated power. θJT : Thermal resistance from the junction to the mounting tab of the package. θCS : Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically, θCS < 1.0°C /W) θSA : Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through-hole vias. PCB θSA (°C /W) PCB heat sink size (mm ) 2 59 500 45 1000 38 1500 33 2000 27 3000 24 4000 21 5000 Copyright © 2007 ADDtek Corp. 4 DD077_A -- AUGUST 2007 A705 PACKAGE Top Marking for SOT-89 X : Output Current Options A705X Y WWVV P = 210mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA Y : Year Code WW : Week Code V : Vendor Code 3-Pin Surface Mount SOT-89 INCHES MIN TYP MAX 0.181 0.102 0.063 0.017 0.090 0.019 MILLIMETERS MIN 4.39 2.28 1.39 0.38 2.13 0.33 TYP 1.49 BSC 2.99 BSC 0.45 3.94 1.70 0° 0.89 0.55 4.24 1.82 8° 1.19 MAX 4.59 2.59 1.60 0.43 2.28 0.48 A L C D A B 0.173 0.090 C 0.055 D 0.015 K N F J G H B E E F 0.084 0.016 M G H J K L M 0.059 BSC 0.118 BSC 0.018 0.155 0.067 0° 0.022 0.167 0.072 8° 0.047 N 0.035 Copyright © 2007 ADDtek Corp. 5 DD077_A -- AUGUST 2007 A705 Top Marking for TO-252 X : O utput Current Options A705X Y WWVV LLLLL.L P = 2 10mA; Q = 230mA; R = 250mA; S = 270mA; T = 290mA Y : Year Code WW : Week Code V : Vendor Code LLLLL.L : Lot Number 3-Pin Surface Mount TO-252 INCHES E b2 L2 SEATING PLAN MILLIMETERS MAX 0.094 0.050 0.215 0.023 0.023 0.220 0.265 MIN 2.18 1.02 5.21 0.46 0.46 5.33 6.35 TYP 0.61 2.29 BSC 4.58 BSC 9.40 0.51 0.64 1.52 10.41 1.02 2.03 MAX 2.39 1.27 5.46 0.58 0.58 5.59 6.73 A A1 c1 MIN A 0.086 TYP 0.024 - A1 0.040 b - b2 0.205 D H c 0.018 c1 0.018 D 0.210 L1 b e1 L E e c 0.250 e e1 0.090 BSC 0.180 BSC 0.410 0.040 0.080 H 0.370 L 0.020 L1 0.025 L2 0.060 Copyright © 2007 ADDtek Corp. 6 DD077_A -- AUGUST 2007 A705 IMPORTANT NOTICE ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer’s applications, the customer should provide adequate design and operating safeguards. ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of its products to the specifications applicable at the time of sale. ADDtek Corp. 9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105 TEL: 2-25700299 FAX: 2-25700196 Copyright © 2007 ADDtek Corp. 7 DD077_A -- AUGUST 2007