AMC1112SJF

AMC1112 www.addmtek.com DESCRIPTION The AMC1112 of positive fixed regulators is designed to provide 1A for applications requiring high efficiency. All internal circuitry is designed to operated down to 800mV input to output differential and the dropout voltage is fully specified as a function of load current. The AMC1112 offers current limiting and thermal protection. The on chip trimming adjusts the reference voltage accuracy to 1%. 1A LOW DROPOUT POSITIVE REGULATOR FEATURES Output current of 1A typical Three-terminal fixed 1.2V outputs Low dropout of typical 800mV Thermal protection built in Typical 0.015% line regulation Typical 0.01% load regulation Fast transient response Available in SOT-223 and TO-252 packages Pin assignment identical to earlier FAN1112. APPLICATIONS 2.85V Model for SCSI-2 Active Termination Battery Charger High Efficiency Linear Regulators Battery Powered Instrumentation Post Regulator for Switching DC/DC Converter PACKAGE PIN OUT 3. VIN 2. VOUT 1. GND 3-Pin Plastic SOT-223 Surface Mount (Top View) 3. VIN 2. VOUT 1. GND 3-Pin Plastic TO-252 Surface Mount (Top View) ORDER INFORMATION TA (OC) 0 to 70 Note: SOT223 3-pin AMC1112SK (SnPb) AMC1112KF (Lead Free) SK TO-252 3-pin AMC1112SJ (SnPb) AMC1112SJF (Lead Free) SJ 1.All surface-mount packages are available in Tape & Reel. 2.The letter “F” is marked for Lead Free process. Append the letter “T” to part number (i.e. AMC1112SJT). Copyright © 2007 ADDtek Corp 1 DD003_B -- MAY 2007 AMC1112 ABSOLUTE MAXIMUM RATINGS Input Voltage Operating Junction Temperature Range, TJ Storage Temperature Range Lead Temperature (soldiering, 10 seconds) Note 1: Exceeding these ratings could cause damage to the device. negative out of the specified terminal. (Note 1) 13V 0 OC to 150 OC -65 OC to 150 OC 260 OC All voltages are with respect to Ground. Currents are positive into, POWER DISSIPATION TABLE Package SK SKF SJ SJF θJA (OC /W ) 136 136 80 80 Derating factor ( mW/ OC) TA≥ 25 OC 7.35 7.35 12.5 12.5 TA≤ 25 OC Power rating(mW) 919 919 1562 1562 TA=70 OC Power rating(mW) 588 588 1000 1000 TA= 85 OC Power rating (mW) 478 478 812 812 Note : 1. θJA: Thermal Resistance-Junction to Ambient, DF : Derating factor, Po: Power consumption. Junction Temperature Calculation: TJ = TA + (PD × θJA), Po = DF × (TJ- TA) The θJA numbers are guidelines for the thermal performance of the device/PC-board system. All of the above assume no ambient airflow. 2. θJT: Thermal Resistance-Junction to Tab, TC: case(Tab) temperature, TJ = TC + (PD × θJT) For SK package, θJT = 15.0 OC /W. For SJ package, θJT = 7.0 OC /W. BLOCK DIAGRAM VIN VOUT For 1.2V Output GND Copyright © 2007 ADDtek Corp 2 DD003_B -MAY 2007 AMC1112 RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Input Voltage VIN 2.4 12 Load Current (with adequate heatsinking) IO 10 Input Capacitor (VIN to GND) 1.0 Output Capacitor with ESR of 10Ω max., (VOUT to GND) 4.7 Junction temperature TJ ELECTRICAL CHARACTERISTICS Unless otherwise specified, VIN = VOUT +2V, IO =10mA, and TJ = 25 OC. Parameter Output Voltage AMC1112 Symbol Vout ∆VOI Test Conditions IO = 10mA, VIN – VOUT = 2V 10mA ≤ IO ≤ 1A, VOUT +1.5V ≤ VIN ≤ 12V IO = 10mA, VOUT +1.5V ≤ VIN ≤ 12V IO = 10mA, VOUT +1.5V ≤ VIN ≤ 12V 10mA ≤ IO ≤ 1A, VIN – VOUT = 3V 10mA ≤ IO ≤ 1A, VIN = VOUT +1.5V IO = 10mA IO = 500mA I O = 1A 3.0V ≤ Vin ≤ 12V IQ ICL VIN ≤ 12V VIN – VOUT = 3V IO = 10mA, VIN – VOUT = 2V TA = 25 C, 30 ms pulse RR fO = 120HZ, 1V RMS, I O = 400mA, VIN – VOUT = 3V 60 O Units V mA µF µF O 125 C AMC1112 Line Regulation AMC1112 AMC1112 Load Regulation AMC1112 Dropout Voltage Minimum Load Current (Note 1) Quiescent Current AMC1112 AMC1112 Min Typ 1.18 1.20 1.17 1.20 0.04 1.0 0.10 1.0 0.8 0.8 1.0 10 6 1 1.2 50 0.01 75 Max 1.26 1.27 0.20 6.0 0.40 10.0 1.15 1.20 120 Units V % mV % mV V ∆VOL ∆V mA 10 mA A µA %/W dB Current Limit Adjust Pin Current Thermal Regulation (Note 2) Ripple rejection (Note 2) Note 1: Note 2: 120 0.1 For the adjustable device, the minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor divider used to set the output voltage is selected to meet the minimum load current requirement. These parameters, although guaranteed, are not tested in production. Copyright © 2007 ADDtek Corp 3 DD003_B -- MAY 2007 AMC1112 CHARACTERIZATION CURVES Unless otherwise specified, VIN= VOUT+2V，CIN=1µF，COUT=4.7µF，TA=25 OC Load Regulation 102.0% Output Voltage (%) 101.5% 101.0% 100.5% 100.0% 99.5% 99.0% 98.5% 98.0% 10 200 400 600 800 1000 Current (mA) Temperature Stability Output Voltage Change (%) 1.5 1 0.5 0 -0.5 -1 -1.5 -2 -40 -20 0 20 40 60 80 100 120 Quiescent Current vs. Temperature Quiescent Current (mA) 10 8 6 4 2 0 -40 -20 0 20 40 O 2 60 80 100 120 TA (OC) TA ( C) Copyright © 2007 ADDtek Corp 4 DD003_B -- MAY 2007 AMC1112 APPLICATION INFORMATION VIN AMC1112 VOUT * 120 Ω C1 10µF R C2 22µF Note: 1. *120Ω for warrant work on 10mA. 2. R doesn’t need to use if load more than 120Ω. Fixed Voltage Regulator Copyright © 2007 ADDtek Corp 5 DD003_B -- MAY 2007 AMC1112 Application Note: Maximum Power Calculation: TJ(MAX) – TA(MAX) θJA TJ(OC): Maximum recommended junction temperature TA(OC): Ambient temperature of the application θJA(OC/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating materials. The maximum power dissipation of a single-output regulator : PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ PD(MAX)= Where: VOUT(NOM) = the nominal output voltage IOUT(NOM) = the nominal output current, and IQ = the quiescent current the regulator consumes at IOUT(MAX) VIN(MAX) = the maximum input voltage Then θJA = (150 OC – TA)/ PD Thermal consideration: When power consumption is over about 404 mW ( for SOT-223 package, 687mW for TO-252 package, at TA=70 OC), additional heat sink is required to control the junction temperature below 125 OC. The junction temperature is: TJ = P D ( θJT + θCS + θSA ) + TA P D :Dissipated power. θJT :Thermal resistance from the junction to the mounting tab of the package. θCS :Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically, θCS < 1.0°C/W) θSA : Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through hole vias. 59 PCB θSA (OC /W ) 2 PCB heat sink size (mm ) 500 45 1000 38 1500 33 2000 27 3000 24 4000 21 5000 Recommended figure of PCB area used as a heat sink. through hole vias (Top View) (Bottom View) Copyright © 2007 ADDtek Corp 6 DD003_B -- MAY 2007 AMC1112 PACKAGE 3-Pin Surface Mount SOT-223 ( SK ) D A c MILLIMETERS MIN A A1 B 1.50 0.02 0.60 2.90 0.28 6.30 3.30 TYP 1.65 0.05 0.70 0.30 6.50 3.50 2.3 BSC 4.6 BSC 6.70 0.91 1.50 0° 7.00 1.00 1.75 5° 3° 7.30 1.10 2.00 10 ° MAX 1.80 0.08 0.80 3.15 0.32 6.70 3.70 B1 H E B1 c K L D E A1 e e1 e e1 H L K B α β 3-Pin Surface Mount TO-252 (SJ) INCHES MIN E b2 L2 SEATING PLAN MILLIMETERS MAX 0.094 0.050 0.215 0.023 0.023 0.220 0.265 MIN 2.18 1.02 5.21 0.46 0.46 5.33 6.35 TYP 0.61 2.29 BSC 4.58 BSC 9.40 0.51 0.64 1.52 10.41 1.02 2.03 MAX 2.39 1.27 5.46 0.58 0.58 5.59 6.73 TYP 0.024 - A A1 c1 A 0.086 A1 0.040 b - b2 0.205 D c H 0.018 c1 0.018 D 0.210 L1 b e1 L E e e1 0.250 e c 0.090 BSC 0.180 BSC 0.410 0.040 0.080 H 0.370 L 0.020 L1 0.025 L2 0.060 Copyright © 2007 ADDtek Corp 7 DD003_B -- MAY 2007 AMC1112 IMPORTANT NOTICE ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer’s applications, the customer should provide adequate design and operating safeguards. ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of its products to the specifications applicable at the time of sale. ADDtek Corp. 9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105 TEL: 2-25700299 FAX: 2-25700196 Copyright © 2007 ADDtek Corp 8 DD003_B -MAY 2007