AS5147U-HTSM

AS5147 14-Bit On-Axis Magnetic Rotary Position Sensor with 11-Bit Binary Incremental Pulse Count General Description The AS5147 is a high-resolution rotary position sensor for fast absolute angle measurement over a full 360-degree range. This new position sensor is equipped with a revolutionary integrated dynamic angle error compensation (DAEC™) with almost 0 latency. The robust design of the device suppresses the influence of any homogenous external stray magnetic field. A standard 4-wire SPI serial interface allows a host microcontroller to read 14-bit absolute angle position data from the AS5147 and to program non-volatile settings without a dedicated programmer. Incremental movements are indicated on a set of ABI signals with a maximum resolution of 2048 steps / 512 pulses per revolution. The resolution of the ABI signal is programmable to 1024 steps / 256 pulses per revolution. Brushless DC (BLDC) motors are controlled through a standard UVW commutation interface with a programmable number of pole pairs from 1 to 7. The absolute angle position is also provided as PWM-encoded output signal. The AS5147 supports embedded self-diagnostics including magnetic field strength too high, magnetic field strength too low or lost magnet, and other related diagnostic features. The product is defined as SEooC (Safety Element out of Context) according ISO26262 including FMEDA, safety manual and third party qualification. The AS5147 is available as a single die in a compact 14-pin TSSOP package. Ordering Information and Content Guide appear at end of datasheet. ams Datasheet [v1-10] 2016-Apr-27 Page 1 Document Feedback AS5147 − General Description Key Benefits & Features The benefits and features of AS5147, 14-Bit On-Axis Magnetic Rotary Position Sensor with 11-Bit Binary Incremental Pulse Count are listed below: Figure 1: Added Value of Using the AS5147 Benefits Features • Easy to use – saving costs on DSP • DAEC™ Dynamic angle error compensation • Good resolution for motor and position control • 14-bit core resolution • Versatile choice of the interface • Independent output interfaces: SPI, ABI, UVW, PWM • No programmer needed (via SPI command) • Zero position, configuration programmable • Supports safety challenging applications • Self-Diagnostics • Lower system costs (no shielding) • Immune to external stray field Applications The AS5147 has been designed to support BLDC motor commutation for the most challenging automotive applications (AEC-Q100 grade 0 automotive qualified) such as electric power steering (EPS), transmission (gearbox, actuator), pump, brake (actuator) and starter and alternator. Page 2 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − General Description Block Diagram The functional blocks of this device are shown below: Figure 2: AS5147 Block Diagram VDD3V3 AS5147 CSn SCL MISO MOSI Volatile Memory SPI VDD OTP LDO ABI Hall Sensors Analog Front-End A/D AGC ATAN (CORDIC) INTERPOLATOR Dynamic Angle Error Compensation UWV A B I/PWM U V W / PWM PWM Decoder Selectable on I or W GND ams Datasheet [v1-10] 2016-Apr-27 Page 3 Document Feedback AS5147 − Pin Assignment Pin Assignment Figure 3: TSSOP-14 Pin Assignment I / PWM CLK GND MISO VDD3V MOSI TEST AS5147 CSn B VDD U V A W / PWM Figure 4: Pin Description Pin Number Pin Name 1 CSn Digital input SPI chip select (active low) 2 CLK Digital input SPI clock 3 MISO Digital output SPI master data input, slave output 4 MOSI Digital input SPI master data output, slave input 5 Test 6 B Digital output Incremental signal B 7 A Digital output Incremental signal A Page 4 Document Feedback Pin Type Description Test pin (connect to ground) ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Pin Assignment Pin Number Pin Name Pin Type Description 8 W/PWM Digital output Commutation signal W or PWM-encoded output 9 V Digital output Commutation signal V 10 U Digital output Commutation signal U 11 VDD Power supply 5V power supply voltage for on-chip regulator 12 VDD3V3 Power supply 3.3V on-chip low-dropout (LDO) output. Requires an external decoupling capacitor (1μF) 13 GND Power supply Ground 14 I Digital output Incremental signal I (index) or PWM Note(s) and/or Footnote(s): 1. Floating state of a digital input is not allowed. 2. If SPI is not used, a Pull up resistor on CSn is required. 3. If SPI is not used, a Pull down resistor on CLK and MOSI is required. 4. If SPI is not used, the pin MISO can be left open. 5. If ABI, UVW or PWM is not used, the pins can be left open. ams Datasheet [v1-10] 2016-Apr-27 Page 5 Document Feedback AS5147 − Absolute Maximum Ratings Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units VDD5 DC supply voltage at VDD pin -0.3 7.0 V VDD3 DC supply voltage at VDD3V3 pin -0.3 5.0 V VSS DC supply voltage at GND pin -0.3 0.3 V Vin Input pin voltage VDD+0.3 V Iscr Input current (latch-up immunity) 100 mA AEC-Q100-004 ESD Electrostatic discharge kV AEC-Q100-002 Pt Total power dissipation (all supplies and outputs) Ta5V0 Ambient temperature 5V0 Ta3V3 TaProg -100 ±2 Note 150 mW -40 150 °C In the 5.0V power supply mode only Ambient temperature 3V3 -40 125 °C In the 3.3V power supply mode if NOISESET = 0 Programming temperature 5 45 °C Programming @ room temperature (25°C ± 20°C) -55 150 °C 260 °C 85 % Tstrg Storage temperature Tbody Package body temperature RHNC Relative humidity non-condensing MSL Moisture sensitivity level Page 6 Document Feedback 5 3 IPC/JEDEC J-STD-020 Represents a maximum floor lifetime of 168h ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Electrical Characteristics Electrical Characteristics All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Figure 6: Electrical Characteristics Symbol Parameter Conditions Min Typ Max Units VDD Positive supply voltage 5.0V operation mode 4.5 5.0 5.5 V VDD3V3 Positive supply voltage 3.3V operation mode; only from -40 to 125°C 3.0 3.3 3.6 V Positive supply voltage 3.3V operation mode; only from -40 to 150°C (3V150°C Bit has to be set) 3.2 3.4 3.6 V Positive supply voltage Supply voltage required for programming in 3.3V operation 3.3 3.5 V Regulated voltage Voltage at VDD3V3 pin if VDD ≠ VDD3V3 3.2 3.6 V 15 mA VDD3V3_150 VDD_Burn VREG 3.4 IDD Supply current VIH High-level input voltage VIL Low-level input voltage VOH High-level output voltage VOL Low-level output voltage VSS + 0.4 V I_Out Current on digital output (ABI, UVW) 1 mA I_Out_MISO Current on digital output MISO 4 mA C_L Capacitive load on digital output 50 pf ams Datasheet [v1-10] 2016-Apr-27 0.7 × VDD V 0.3 × VDD VDD - 0.5 V V Page 7 Document Feedback AS5147 − Magnetic Characteristics Magnetic Characteristics Figure 7: Magnetic Specifications Symbol Parameter Conditions Min Max Unit Bz Orthogonal magnetic field strength, normal operating mode Required orthogonal component of the magnetic field strength measured at the die's surface along a circle of 1.1mm 35 70 mT Note(s) and/or Footnote(s): 1. It is possible to operate the AS5147 below 35mT with reduced noise performance. System Characteristics Figure 8: System Specifications Symbol RES RES_ABI Parameter Conditions Min Core resolution Resolution of the ABI interface Typ Max 14 Programmable with register setting (ABIRES) 10 Units bit 11 bit INLOPT @ 25°C Non-linearity, optimum placement of the magnet ±0.8 degree INLOPT+TEMP Non-linearity optimum placement of the magnet over the full Temperature Range ±1 degree INLDIS+TEMP Non-linearity @ displacement of magnet and temperature -40°C to 150°C Assuming N35H Magnet (D=8mm, H=3mm) 500μm displacement in x and y z-distance @ 2000μm ±1.2 degree ONL RMS output noise (1 sigma). Not tested, guaranteed by design. Orthogonal component for the magnetic field within the specified range (Bz), NOISESET = 0 0.068 degree ONH RMS output noise (1 sigma) on SPI, ABI and UVW interfaces. Not tested, guaranteed by design. Orthogonal component for the magnetic field within the specified range (Bz), NOISESET = 1 0.082 degree Page 8 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Timing Characteristics Symbol Parameter Max Units ON_PWM RMS output noise (1 sigma) on PWM interface Orthogonal component for the magnetic field within the specified range (Bz) 0.068 degree tdelay System propagation delay –core Reading angle via SPI 90 110 μs tdelay_ Residual system propagation delay after dynamic angle error correction. At ABI, UVW and SPI 1.5 1.9 μs Sampling rate Refresh rate at SPI 202 247 ns DAE1700 Dynamic angle error At 1700 RPM constant speed 0.02 degree DAEmax Dynamic angle error At 14500 RPM constant speed 0.18 degree DAEacc Dynamic angle error at constant acceleration (25krad/s²) 25k radians/s² constant acceleration 0.175 degree 14500 RPM DAEC tsampl MS Conditions Min Typ 222 Maximum speed Reference magnet: N35H, 8mm diameter; 3mm thickness Timing Characteristics Figure 9: Timing Specifications Symbol tpon Parameter Power-on time ams Datasheet [v1-10] 2016-Apr-27 Conditions Not tested, guaranteed by design. Time between VDD > VDDMIN and the first valid outcome Min Typ Max Units 10 ms Page 9 Document Feedback AS5147 − Detailed Description Detailed Description The AS5147 is a Hall-effect magnetic sensor using a CMOS technology. The Hall sensors convert the magnetic field component perpendicular to the surface of the chip into a voltage. The signals from the Hall sensors are amplified and filtered by the analog front-end (AFE) before being converted by the analog-to-digital converter (ADC). The output of the ADC is processed by the hardwired CORDIC (coordinate rotation digital computer) block to compute the angle and magnitude of the magnetic vector. The intensity of the magnetic field (magnitude) is used by the automatic gain control (AGC) to adjust the amplification level for compensation of the temperature and magnetic field variations. The AS5147 generates continuously the angle information, which can be requested by the different interfaces of the device. The internal 14-bit resolution is available by readout register via the SPI interface. The resolution on the ABI output can be programmed for 10 or 11 bits. The Dynamic Angle Error Compensation block corrects the calculated angle regarding latency, by using a linear prediction calculation algorithm. At constant rotation speed the latency time is internally compensated by the AS5147, reducing the dynamic angle error at the SPI, ABI and UVW outputs. The AS5147 allows selecting between a UVW output interface and a PWM-encoded interface on the W pin. At higher speeds, the interpolator fills in missing ABI pulses and generates the UVW signals with no loss of resolution. The non-volatile settings in the AS5147 can be programmed through the SPI interface without any dedicated programmer. Power Management The AS5147 can be either powered from a 5.0V supply using the on-chip low-dropout regulator or from a 3.3V voltage supply. The LDO regulator is not intended to power any other loads, and it needs a 1 μF capacitor to ground located close to the chip for decoupling as shown in Figure 11. In 3.3V operation, VDD and VDD3V3 must be tied together. In this configuration, normal noise performance (ONL) is available at reduced maximum temperature (125°C) by clearing NOISESET to 0. When NOISESET is set to 1, the full temperature range is available with reduced noise performance (ONH). Page 10 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description Figure 10: Temperature Range and Output Noise in 3.3V and 5.0V Mode VDD (V) NOISESET Temperature Range (°C) RMS Output Noise (degree) 5.0 0 -40 to 150 0.068 3.3 0 -40 to 125 0.068 3.3 1 -40 to 150 0.082 Figure 11: 5.0V and 3.3V Power Supply Options 5.0V Operation 4.5 - 5.5V VDD LDO 100nF 3.3V Operation VDD3V3 3.0 – 3.6V 1µF 100nF GND VDD VDD3V3 LDO GND AS5147 AS5147 After applying power to the chip, the power-on time (t pon) must elapse before the AS5147 provides the first valid data. Dynamic Angle Error Compensation The AS5147 uses 4 integrated Hall sensors which produce a voltage proportional to the orthogonal component of the magnetic field to the die. These voltage signals are amplified, filtered, and converted into the digital domain to allow the CORDIC digital block to calculate the angle of the magnetic vector. The propagation of these signals through the analog front-end and digital back-end generates a fixed delay between the time of measurement and the availability of the measured angle at the outputs. This latency generates a dynamic angle error represented by the product of the angular speed (ω)and the system propagation delay (tdelay ): (EQ1) DAE = ω x tdelay The dynamic angle compensation block calculates the current magnet rotation speed (ω) and multiplies it with the system propagation delay (t delay) to determine the correction angle to reduce this error. At constant speed, the residual system propagation delay is t delay_DAEC. ams Datasheet [v1-10] 2016-Apr-27 Page 11 Document Feedback AS5147 − Detailed Description The angle represented on the PWM interface is not compensated by the Dynamic Angle Error Compensation algorithm. It is also possible to disable the Dynamic Angle Error Compensation with the DAECDIS setting. Disabling the Dynamic Angle Error Compensation gives a noise benefit of 0.016 degree rms.This setting can be advantageous for low speed (under 100 RPM) respectively static positioning applications. SPI Interface (slave) The SPI interface is used by a host microcontroller (master) to read or write the volatile memory as well as to program the non-volatile OTP registers. The AS5147 SPI only supports slave operation mode. It communicates at clock rates up to 10 MHz. The AS5147 SPI uses mode=1 (CPOL=0, CPHA=1) to exchange data. As shown in Figure 12, a data transfer starts with the falling edge of CSn (SCL is low). The AS5147 samples MOSI data on the falling edge of SCL. SPI commands are executed at the end of the frame (rising edge of CSn). The bit order is MSB first. Data is protected by parity. SPI Timing The AS5147 SPI timing is shown in Figure 12. Figure 12: SPI Timing Diagram tXSSH SS/ (Input) tL tsck tsckH tsckL tH SCK (Input) tMISO tOZ MISO (Output) data[15] data[14] data[0] tOZ tMOSI MOSI (Input) Page 12 Document Feedback data[15] data[14] data[0] ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description Figure 13: SPI Timing Parameter Description Min tL Time between CSn falling edge and CLK rising edge 350 ns tclk Serial clock period 100 ns tclkL Low period of serial clock 50 ns tclkH High period of serial clock 50 ns tclk/2 ns Time between last falling edge of CLK and rising edge of CSn tH Max Units tCSn High time of CSn between two transmissions 350 ns tMOSI Data input valid to falling clock edge 20 ns tMISO CLK edge to data output valid 51 ns Release bus time after CS rising edge. 10 ns tOZ SPI Transaction An SPI transaction consists of a 16-bit command frame followed by a 16-bit data frame. Figure 14 shows the structure of the command frame. Figure 14: SPI Command Frame Bit Name 15 PARC Parity bit (even) calculated on the lower 15 bits of command frame 14 R/W 0: Write 1: Read 13:0 ADDR ams Datasheet [v1-10] 2016-Apr-27 Description Address to read or write Page 13 Document Feedback AS5147 − Detailed Description To increase the reliability of communication over the SPI, an even parity bit (PARC) must be generated and sent. A wrong setting of the parity bit causes an parity bit error which is shown the PARERR bit in the error flag register. The parity bit is calculated from the lower 15 bits of the command frame. The 16-bit command consists of a register address and read/write bit which indicates if the transaction is a read or write and the parity bit. Figure 15 shows the read data frame. Figure 15: SPI Read Data Frame Bit Name Description 15 PARD Parity bit (even) calculated on the lower 15 bits of the read data frame 14 EF 13:0 DATA 0: No command frame error command occurred 1: Error occurred Data The data is sent on the MISO pin. The parity bit PARD is calculated by the AS5047D of the lower 15 bits of data frame. If an error is detected in the previous SPI command frame, the EF bit is set high. The SPI read is sampled on the rising edge of CSn and the data is transmitted on MISO with the next read command, as shown in Figure 16. Figure 16: SPI Read CSn MOSI MISO Page 14 Document Feedback Command Command Command Command Read ADD[m] Read ADD[n] Read ADD[o] Read ADD[p] Data Data Data DATA (ADD[m]) DATA (ADD[n]) DATA (ADD[o]) ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description Figure 17: SPI Write Data Frame Bit Name Description 15 PARD Parity bit (even) 14 0 Always low 13:0 DATA Data The parity bit PARD must be calculated from the lower 15 bit of write data frame. In an SPI write transaction, the write command frame is followed by a write data frame at MOSI. The write data frame consists of the new content of register which address is in the command frame. During the new content is transmitted on MOSI by the write data frame, the old content is send on MISO. At the next command on MOSI the actual content of the register is transmitted on MISO, as shown in Figure 18. Figure 18: SPI Write Transaction CSn Command MOSI Write ADD[n] Data to write into ADD[n] DATA (x) Data content ADD[n] MISO ams Datasheet [v1-10] 2016-Apr-27 DATA (ADD[n]) Command Write ADD[m] New Data content of ADD[n] DATA (x) Data to write into ADD[m] DATA (y) Data content ADD[m] DATA (ADD[m]) Command Next command New Data content of ADD[m] DATA (y) Page 15 Document Feedback AS5147 − Detailed Description Volatile Registers The volatile registers are shown in Figure 19. Each register has a 14-bit address. Figure 19: Volatile Register Table Address Name Default Description 0x0000 NOP 0x0000 No operation 0x0001 ERRFL 0x0000 Error register 0x0003 PROG 0x0000 Programming register 0x3FFC DIAAGC 0x0180 Diagnostic and AGC 0x3FFD MAG 0x0000 CORDIC magnitude 0x3FFE ANGLEUNC 0x0000 Measured angle without dynamic angle error compensation 0x3FFF ANGLECOM 0x0000 Measured angle with dynamic angle error compensation Reading the NOP register is equivalent to a nop (no operation) instruction for the AS5147. Figure 20: ERRFL (0x0001) Name Read/Write Bit Position Description PARERR R 2 Parity error INVCOMM R 1 Invalid command error: set to 1 by reading or writing an invalid register address FRERR R 0 Framing error: is set to 1 when a non-compliant SPI frame is detected Reading the ERRFL register automatically clears its contents (ERRFL=0x0000). Page 16 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description Figure 21: PROG (0x0003) Name Read/Write Bit Position Description PROGVER R/W 6 Program verify: must be set to 1 for verifying the correctness of the OTP programming PROGOTP R/W 3 Start OTP programming cycle OTPREF R/W 2 Refreshes the non-volatile memory content with the OTP programmed content PROGEN R/W 0 Program OTP enable: enables reading / writing the OTP memory The PROG register is used for programming the OTP memory. (See programming the zero position.) Figure 22: DIAAGC (0x3FFC) Name Read/Write Bit Position Description MAGL R 11 Diagnostics: Magnetic field strength too low; AGC=0xFF MAGH R 10 Diagnostics: Magnetic field strength too high; AGC=0x00 COF R 9 Diagnostics: CORDIC overflow LF R 8 Diagnostics: Loops Finished LF=0:internal offset loops not ready regulated LF=1:internal offset loop finished AGC R 7:0 Automatic gain control value Note(s) and/or Footnote(s): 1. LF = Loops Finished Figure 23: MAG (0x3FFD) Name Read/Write Bit Position CMAG R 13:0 Name Read/Write Bit Position CORDICANG R 13:0 Description CORDIC magnitude information Figure 24: ANGLE (0x3FFE) ams Datasheet [v1-10] 2016-Apr-27 Description Angle information without dynamic angle error compensation Page 17 Document Feedback AS5147 − Detailed Description Figure 25: ANGLECOM (0x3FFF) Name Read/Write Bit Position DAECANG R 13:0 Description Angle information with dynamic angle error compensation Non-Volatile Registers (OTP) The OTP (One-Time Programmable) memory is used to store the absolute zero position of the sensor and the customer settings permanently in the sensor IC. SPI write/read access is possible several times for all Non-Volatile Registers (soft write). Soft written register content will be lost after a hardware reset. The programming itself can be done just once. Therefore the content of the Non-Volatile Registers is stored permanently in the sensor. The register content is still present after a hardware reset and cannot be overwritten. For a correct function of the sensor the OTP programming is not required. If no configuration or programming is done, the Non-Volatile Registers are in default state 0x0000. Figure 26: Non-Volatile Register Table Address Name Default Description 0x0016 ZPOSM 0x0000 Zero position MSB 0x0017 ZPOSL 0x0000 Zero position LSB/ MAG diagnostic 0x0018 SETTINGS1 0x0001 Custom setting register 1 0x0019 SETTINGS2 0x0000 Custom setting register 2 0x001A RED 0x0000 Redundancy register Figure 27: ZPOSM (0x0016) Name Read/Write/Program Bit Position ZPOSM R/W/P 7:0 Page 18 Document Feedback Description 8 most significant bits of the zero position ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description Figure 28: ZPOSL (0x0017) Name Read/Write/Program Bit Position Description ZPOSL R/W/P 5:0 6 least significant bits of the zero position comp_l_error_en R/W/P 6 This bit enables the contribution of MAGH (Magnetic field strength too high) to the error flag comp_h_error_en R/W/P 7 This bit enables the contribution of MAGL (Magnetic field strength too low) to the error flag Figure 29: SETTINGS1 (0x0018) Name Read/Write/Program Bit Position Description IWIDTH R/W/P 0 Width of the index pulse I (0 = 3LSB, 1 = 1LSB) NOISESET R/W/P 1 Noise setting DIR R/W/P 2 Rotation direction UVW_ABI R/W/P 3 Defines the PWM Output (0 = ABI is operating, W is used as PWM 1 = UVW is operating, I is used as PWM) DAECDIS R/W/P 4 Disable Dynamic Angle Error Compensation (0 = DAE compensation ON, 1 = DAE compensation OFF) Dataselect R/W/P 6 This bit defines which data can be read form address 16383dec (3FFFhex). 0->DAECANG 1->CORDICANG PWMon R/W/P 7 Enables PWM (setting of UVW_ABI Bit necessary) ams Datasheet [v1-10] 2016-Apr-27 Page 19 Document Feedback AS5147 − Detailed Description Figure 30: SETTINGS2 (0x0019) Name Read/Write/Program Bit Position Description UVWPP R/W/P 2:0 UVW number of pole pairs (000 = 1, 001 = 2, 010 = 3, 011 = 4, 100 = 5, 101 = 6, 110 = 7, 111 = 7) Hysteresis for 11 Bit ABI Resolution: (00=3LSB, 01= 2LSB,10=1LSB,11=no hysteresis) Hysteresis for 10 Bit ABI Resolution: (00=2LSB, 01= 1LSB,10=no Hysteresis LSB,11=3LSB) HYS R/W/P 4:3 ABIRES R/W/P 5 Resolution of ABI (0 = 11 bits, 1 = 10 -bits) The hysteresis (Figure 35)is in terms of the chosen resolution (11 bits vs. 10 bits). The ABIRES resolution does not affect the UVW signals. Figure 31: RED (0x001A) Name Read/Write/ Program REDUNDANCY Page 20 Document Feedback R/W/P Bit Position Description 4:0 Redundancy bits addresses one bit in the nonvolatile memory. If a non-successful OTP programing occurred, one bit can be forced to 1. For more details please refer to the application note “AN5000 – AS5147_Redundancy_Bits” ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description ABI Incremental Interface The AS5147 can send the angle position to the host microcontroller through an incremental interface. This interface is available simultaneously with the other interfaces. By default, the incremental interface is set to work at the highest resolution (11 bits), which corresponds to 2048 steps per revolution or 512 pulses per revolution (ppr). This resolution can be cut in half using the OTP bit ABIRES, which results in 1024 steps per revolution or 256 pulses per revolution. The phase shift between the A and B signals indicates the rotation direction: e.g. DIR-Bit = 0, clockwise (A leads, B follows) or counterclockwise (B leads, A follows). The DIR bit can be used to invert the sense of the rotation direction. During the start-up time, after power on to the chip, all three ABI signals are high. The IWIDTH setting programs the width of the index pulse from 3 LSB (default) to 1 LSB. Figure 32: ABI Signals at 11-Bit Resolution A B I Steps N-7 N-6 N-5 N-4 N-3 N-2 N-1 0 1 2 3 Clockwise rotation 4 5 6 7 8 7 6 5 4 3 2 1 0 N-1 N-2 N-3 N-4 Counter-clockwise rotation N = 2048 for 11-bit resolution, and N = 1024 for 10-bit resolution. The Figure 32 shows the ABI signal flow if the magnet rotates in clockwise direction and counter-clockwise direction (DIR=0). The rotation direction of the magnet is defined as clockwise (DIR=0) when the view is from the topside of AS5147. ams Datasheet [v1-10] 2016-Apr-27 Page 21 Document Feedback AS5147 − Detailed Description UVW Commutation Interface The AS5147 can emulate the UVW signals generated by the three discrete Hall switches commonly used in BLDC motors. The UVWPP field in the SETTINGS register selects the number of pole pairs of the motor (from 1 to 7 pole pairs). The UVW signals are generated with 14-bit resolution. During the start-up time, after power on of the chip, the UVW signals are low. Figure 33: UVW Signals U V W angle 0° 60° 120° 180° 240° Clockwise rotation 300° 360° 360° 300° 240° 180° 120° 60° 0° Counter-clockwise rotation The Figure 33 shows the UVW signal flow if the magnet rotates in clockwise direction and counter-clockwise direction (DIR=0). The rotation direction of the magnet is defined as clockwise (DIR=0) when the view is from the topside of AS5147. With the bit DIR, it is possible to invert the rotation direction. Page 22 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description PWM The PWM can be enabled with the bit setting PWMon. The PWM encoded signal is displayed on the pin W or the pin I. The bit setting UVW_ABI defines which output is used as PWM. The PWM output consists of a frame of 4119 PWM clock periods, as shown in Figure 34. The PWM frame has the following sections: • 12 PWM Clocks for INIT • 4 PWM Clocks for Error detection • 4095 PWM clock periods of data • 8 PWM clock periods low The angle is represented in the data part of the frame with 12-bit resolution. One PWM clock period represents 0.088 degree and has a typical duration of 444 ns. If the embedded diagnostic of the AS5147 detects any error, the PWM interface displays only 12 clock periods high (0.3% duty-cycle). Respectively the 4 clocks for error detection are forced to low. Figure 34: Pulse Width Modulation Encoded Signal 4 clock 12 clock periods periods high Error detection ams Datasheet [v1-10] 2016-Apr-27 4089 4090 4091 4092 4093 4094 4095 Error detection 1 2 3 4 5 6 7 8 INIT frame 4095 clock periods data 8 clock periods low time Page 23 Document Feedback AS5147 − Detailed Description Hysteresis The hysteresis can be programmed in the HYS bits of the SETTINGS register. The hysteresis can be 1, 2, or 3 LSB bits, in which the LSB is defined by the ABI resolution setting (ABIRES). Figure 35: Hysteresis Settings HYS HYSTERESIS with 11BIT ABI Resolution HYSTERESIS with 10BIT ABI Resolution 00 3 2 01 2 1 10 1 0 11 0 3 Automatic Gain Control (AGC) and CORDIC Magnitude The AS5147 uses AGC to compensate for variations in the magnetic field strength due to changes of temperature, air gap between the chip and the magnet, and demagnetization of the magnet. The automatic gain control value can be read in the AGC field of the DIAAGC register. Within the specified input magnetic field strength (Bz), the Automatic Gain Control keeps the CORDIC magnitude value (MAG) constant. Below the minimum input magnetic field strength, the CORDIC magnitude decreases and the MAGL bit is set. Diagnostic Features The AS5147 supports embedded self-diagnostics. MAGH: magnetic field strength too high, set if AGC = 0x00 . This indicates the non-linearity error may be increased. MAGL: magnetic field strength too low, set high if AGC = 0xFF. This indicates the output noise of the measured angle may be increased. COF: CORDIC overflow. This indicates the measured angle is not reliable. LF: offset compensation completed. At power-up, an internal offset compensation procedure is started, and this bit is set when the procedure is completed. Page 24 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Detailed Description LF Error / COF Error In case of an LF or COF error, all outputs are changing into a safe state: SPI Output: Information in the DIAAGC (0x3FFC) register. The angle information is still valid. PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock Periods = low. Additional there is no angle information valid (all 4096 clock periods = low) ABI Output: The state of ABI is frozen to ABI = 111 UVW Output: The state of UVW is frozen to UVW = 000 MAGH Error / MAGL Error Default diagnostic setting for MAGH error /MAGL error: In case of a MAGH error or MAGL error, there is no safe state on the PWM,ABI or UVW outputs if comp_h_error_en is 0 and comp_l_error_en is 0. The error flags can be read out with the DIAAGC (0x3FFC) register. Enhanced diagnosis setting for MAGH error / MAGL error: In case of a MAGH error or MAGL error, the PWM,ABI or UVW outputs are going into a safe state if comp_h_error_en is 1 and comp_l_error_en is 1. The device is operating with the performance as explained. SPI Output: Information in the DIAAGC (0x3FFC) register. The angle information is still valid, if the MAGH or MAGL error flag is on. PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock Periods = low. Additional there is no angle information valid (all 4096 clock periods = low) ABI Output: The state of ABI is frozen to ABI = 111 UVW Output: The state of UVW is frozen to UVW = 000 Important: When comp_(h/l)_error_en is enabled a marginal magnetic field input can cause toggling of MAGH or MAGL which will lead to toggling of the ABI/UVW outputs between operational mode and failure mode. ams Datasheet [v1-10] 2016-Apr-27 Page 25 Document Feedback AS5147 − Application Information Application Information Burn and Verification of the OTP Memory Step-by-step procedure to permanently program the non-volatile memory (OTP): Figure 36: Minimum Programming Diagram for the AS5147 in 5 V Operation 5V operation VDD during programming 4.5 – 5.5V VDD I CSn CLK GND MISO Programmer TEST A B AS5147 MOSI VDD3V VDD U V 100nF 1μF W GND Note(s) and/or Footnote(s): 1. In terms of EMC and for remote application, additional circuits are necessary. Page 26 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Application Information Figure 37: Minimum Programming Diagram for the AS5147 in 3.3V Operation 3.3V operation VDD during programming: 3.3V – 3.5V VDD I CSn GND CLK VDD3V MOSI TEST Programmer A AS5147 MISO B VDD U V 100nF W GND Note(s) and/or Footnote(s): 1. In terms of EMC and for remote application, additional circuits are necessary. Figure 38: Programming Parameter Symbol Parameter Conditions Min TaProg Programming temperature Programming @ Room Temperature (25°C ± 20°C) 5 VDD Positive supply voltage 5 V operation mode. Supply voltage during programming 4.5 VDD Positive supply voltage 3.3 V operation mode. Supply voltage during programming 3.3 IProg Current for programming Max current during OTP burn procedure ams Datasheet [v1-10] 2016-Apr-27 Typ 5 Max Units 45 °C 5.5 V 3.5 V 100 mA Page 27 Document Feedback AS5147 − Application Information The programming can either be performed in 5V operation using the internal LDO (1uF on regulator output pin), or in 3V Operation but using a supply voltage between 3.3V and 3.5V. 1. Power on cycle 2. Write the SETTINGS1 and SETTINGS2 registers with the Custom settings for this application 3. Place the magnet at the desired zero position 4. Read out the measured angle from the ANGLE register 5. Write ANGLE [5:0] into the ZPOSL register and ANGLE [13:6] into the ZPOSM register 6. Read reg(0x0016) to reg(0x0019) → Read register step1 7. Comparison of written content (settings and angle) with content of read register step1 8. If point 7 is correct, enable OTP read / write by setting PROGEN = 1 in the PROG register 9. Start the OTP burn procedure by setting PROGOTP = 1 in the PROG register 10. Read the PROG register until it reads 0x0001 (Programming procedure complete) 11. Clear the memory content writing 0x00 in the whole non-volatile memory 12. Set the PROGVER = 1 to set the Guard band for the guard band test (1) . 13. Refresh the non-volatile memory content with the OTP content by setting OTPREF = 1 14. Read reg(0x0016) to reg(0x0019) → Read register step2 15. Comparison of written content (settings and angle) with content of read register step2. Mandatory: guard band test 16. New power on cycle, if point 16 is correct. If point 16 fails, the test with the guard band test 1 was not successful and the device is incorrectly programmed. A reprogramming is not allowed! 17. Read reg(0x0016) to reg(0x0019) → Read register step3 18. Comparision of written content (settings and angle) with content of read register step3. 19. If point 19 is correct, the programming was successful. If point 19 fails, device is incorrectly programmed. A reprogramming is not allowed. 1. Guard band test: - Restricted to temperature range: 25 °C ± 20 °C - Right after the programming procedure (max. 1 hour with same conditions 25°C ± 20 °C), same VDD voltage. The guard band test is only for the verification of the burned OTP fuses during the programming sequence. A use of the guard band in other cases is not allowed. Page 28 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Application Information Figure 39: OTP Memory Burn and Verification Flowchart Power on cycle START AS5147 settings Write reg(0x0018) Write reg(0x0019) Write Reg(0x0016)=0x00 Reg(0x0017)=0x00 Reg(0x0018=0x00 Reg(0x0019)=0x00 Clear memory Set the magnet to the zero position Write Reg(0x0003)=0x40 Set Guardband Position of the magnet to the zero position Read ANGLE Not correct Read reg(0x3FFF) Write Angle into ZPOSL and ZPOSM Write Reg(0x0017(5:0))= reg(0x3FFF(5:0)) Reg(0x0016(7:0))= reg(0x3FFF(13:6)) Read Register step 1 Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0019) Write Reg(0003)=0x04 Refresh memory with OTP content Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0016) Read Register step 2 Comparison of written content (settings and angle) with content of Read Register step 2 mandatory Guardband-Test Verify 2 Not correct correct Comparison of written content (settings and angle) with content of Read Register step 1 YES Verify 1 Power-on cycle Guardbandtest fails. Wrong programming. Reprogramming not allowed correct Unlock OTParea for burning (PROGEN=1) Start OTP burning procedure (PROGOTP=1) Write Reg(0x0003)=0x01 Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0016) Write Reg(0x0003)=0x08 Verify 3 Read Register step 3 Comparison of written content (settings and angle) with content of Read Register step 3 Not correct correct Read OTP_CTRL END Correct programming and verification Read Reg(0x0003) END Wrong programming Reprogramming not allowed NO OTP burning procedure complete if Reg(0x0003) =0x01 ams Datasheet [v1-10] 2016-Apr-27 Reg(0x0003)=0x01 Page 29 Document Feedback AS5147 − Application Information Figure 40: Minimum Circuit Diagram for the AS5147 4.5 – 5.5V VDD CSn I CLK GND MISO MCU TEST A AS5147 MOSI VDD3V B VDD U V 100nF 1µF W GND Note(s) and/or Footnote(s): 1. In terms of EMC and for remote application, additional circuits are necessary. Page 30 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Package Drawings & Markings The axis of the magnet must be aligned over the center of the package. Package Drawings & Markings Figure 41: Package Outline Drawing RoHS Green Symbol Min Nom Max Symbol Min Nom Max A - - 1.20 R 0.09 - - A1 0.05 - 0.15 R1 0.09 - - A2 0.80 1.00 1.05 S 0.20 - - b 0.19 - 0.30 Θ1 0º - 8º c 0.09 - 0.20 Θ2 - 12 REF - D 4.90 5.00 5.10 Θ3 - 12 REF - E - 6.40 BSC - aaa - 0.10 - E1 4.30 4.40 4.50 bbb - 0.10 - e - 0.65 BSC - ccc - 0.05 - L 0.45 0.60 0.75 ddd - 0.20 - L1 - 1.00 REF - N 14 Note(s) and/or Footnote(s): 1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994. 2. All dimensions are in millimeters. Angles are in degrees. 3. N is the total number of terminals. ams Datasheet [v1-10] 2016-Apr-27 Page 31 Document Feedback AS5147 − Package Drawings & Mark ings Figure 42: Package Marking Figure 43: Packaging Code YY Last two digits of the current year Page 32 Document Feedback WW Manufacturing week M Plant identifier ZZ Free choice / traceability code @ Sublot identifier ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Mechanical Data Mechanical Data Figure 44: Angle Detection by Default (No Zero Position Programmed) S N S N 270 degree S AS5147 N AS5147 180 degree S N ams Datasheet [v1-10] 2016-Apr-27 AS5147 90 degree AS5147 AS5 147 0 degree Page 33 Document Feedback AS5147 − Mechanical Data Figure 45: Die Placement and Hall Array Position ƒŽŽ”ƒ†‹—• ɥŜɪɥɭʭɥŜɨɥɥ ɪŜɩɥɥʭɥŜɩɪɬ ɩŜɨɪɥʭɥŜɩɪɬ ɥŜɭɰɫʭɥŜɨɬɥ ɥŜɩɪɭʭɥŜɨɥɥ Note(s) and/or Footnote(s): 1. Dimensions are in mm. 2. The Hall array center is located in the center of the IC package. Hall array radius is 1.1mm. 3. Die thickness is 203μm nominal. Page 34 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Ordering & Contact Information Ordering & Contact Information Figure 46: Ordering Information Ordering Code Package Marking Delivery Form Delivery Quantity AS5147-HTST TSSOP-14 AS5147 13” Tape & Reel in dry pack 4500 pcs/reel AS5147-HTSM TSSOP-14 AS5147 7” Tape & Reel in dry pack 500 pcs/reel Online product information is available at: www.ams.com/AS5147 Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30 8141 Premstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com ams Datasheet [v1-10] 2016-Apr-27 Page 35 Document Feedback AS5147 − RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Page 36 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. ams Datasheet [v1-10] 2016-Apr-27 Page 37 Document Feedback AS5147 − Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) Page 38 Document Feedback Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Revision Information Revision Information Changes from 1-06 (2014-Oct-31) to current revision 1-10 (2016-Apr-27) Page 1-06 (2014-Oct-31) to 1-07 (2015-Feb-17) Added Notes under Figure 4 3 Updated Figure 9 8 Updated text under Detailed Description section 9 Updated text under Non-Volatile Registers (OTP) section 17 Updated Figure 31 19 Added Figure 45 and notes under it 32 1-07 (2015-Feb-17) to 1-08 (2015-Feb-18) Updated Figure 9 8 1-08 (2015-Feb-18) to 1-09 (2015-Mar-18) Updated notes below Figure 4 3 Updated text under Non-Volatile Registers (OTP) section 17 Updated PWM section 22 Updated notes below Figure 45 33 ams Datasheet [v1-10] 2016-Apr-27 Page 39 Document Feedback AS5147 − Revision Information Changes from 1-06 (2014-Oct-31) to current revision 1-10 (2016-Apr-27) Page 1-09 (2015-Mar-18) to 1-10 (2016-Apr-27) Updated Figure 6 7 Updated text under Detailed Description 10 Updated text under Dynamic Angle Error Compensation 11 Updated Figure 12 12 Updated SPI Transaction section 13 Updated Figure 26 18 Updated Figure 28 19 Updated ABI Incremental Interface section 21 Updated Figure 33 and text under it 22 Updated Figure 34 23 Updated MAGH Error / MAGL Error section 25 Updated text under Figure 38 27 Updated Figure 39 29 Updated Figure 44 33 Note(s) and/or Footnote(s): 1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision. 2. Correction of typographical errors is not explicitly mentioned. Page 40 Document Feedback ams Datasheet [v1-10] 2016-Apr-27 AS5147 − Content Guide Content Guide ams Datasheet [v1-10] 2016-Apr-27 1 2 2 3 General Description Key Benefits & Features Applications Block Diagram 4 6 7 8 8 9 Pin Assignment Absolute Maximum Ratings Electrical Characteristics Magnetic Characteristics System Characteristics Timing Characteristics 10 11 12 13 13 14 17 19 22 23 24 25 25 25 26 26 Detailed Description Power Management Dynamic Angle Error Compensation SPI Interface (Slave) SPI Timing SPI Transaction Volatile Registers Non-Volatile Registers (OTP) ABI Incremental Interface UVW Commutation Interface PWM Hysteresis Automatic Gain Control (AGC) and CORDIC Magnitude Diagnostic Features LF Error / COF Error MAGH Error / MAGL Error 27 27 Application Information Burn and Verification of the OTP Memory 32 34 36 37 38 39 40 Package Drawings & Markings Mechanical Data Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information Page 41 Document Feedback