APT20M18B2VFR

APT20M18B2VFR A20M18LVFR 200V 100A 0.018Ω POWER MOS V® FREDFET Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V® also achieves faster switching speeds through optimized gate layout. B2VFR T-MAX™ TO-264 LVFR • T-MAX™ or TO-264 Package • Faster Switching • Lower Leakage MAXIMUM RATINGS Symbol VDSS ID IDM VGS VGSM PD TJ,TSTG TL IAR EAR EAS Parameter Drain-Source Voltage Continuous Drain Current Pulsed Drain Current 1 6 • Avalanche Energy Rated • FAST RECOVERY BODY DIODE G S D All Ratings: TC = 25°C unless otherwise specified. APT20M18B2VFR_LVFR UNIT Volts Amps 200 @ TC = 25°C 100 400 ±30 ±40 625 5.00 -55 to 150 300 100 50 3000 Gate-Source Voltage Continuous Gate-Source Voltage Transient Total Power Dissipation @ TC = 25°C Linear Derating Factor Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. Avalanche Current 1 Volts Watts W/°C °C Amps mJ (Repetitive and Non-Repetitive) 1 4 Repetitive Avalanche Energy Single Pulse Avalanche Energy STATIC ELECTRICAL CHARACTERISTICS Symbol BVDSS RDS(on) IDSS IGSS VGS(th) Characteristic / Test Conditions Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA) Drain-Source On-State Resistance 2 MIN TYP MAX UNIT Volts 200 0.018 250 1000 ±100 2 4 (VGS = 10V, ID = 50A) Ohms µA nA Volts 5-2004 050-5906 Rev A Zero Gate Voltage Drain Current (VDS = 200V, VGS = 0V) Zero Gate Voltage Drain Current (VDS = 160V, VGS = 0V, TC = 125°C) Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) Gate Threshold Voltage (VDS = VGS, ID = 2.5mA) CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com DYNAMIC CHARACTERISTICS Symbol Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge 3 APT20M18B2VFR_LVFR Test Conditions VGS = 0V VDS = 25V f = 1 MHz VGS = 10V VDD = 150V ID = 100A @ 25°C VGS = 15V VDD = 150V ID = 100A @ 25°C RG = 0.6Ω MIN TYP MAX UNIT 9880 2320 700 330 55 145 18 27 55 6 ns nC pF Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Symbol IS ISM VSD dv/ dt Characteristic / Test Conditions Continuous Source Current (Body Diode) Pulsed Source Current Diode Forward Voltage Peak Diode Recovery 1 2 MIN TYP MAX UNIT Amps Volts V/ns ns µC Amps 100 400 1.3 8 Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C (Body Diode) (VGS = 0V, IS = -100A) d v/ 5 dt t rr Q rr IRRM Reverse Recovery Time (IS = -100A, di/dt = 100A/µs) Reverse Recovery Charge (IS = -100A, di/dt = 100A/µs) Peak Recovery Current (IS = -100A, di/dt = 100A/µs) 230 450 0.9 3.4 11 20 THERMAL CHARACTERISTICS Symbol RθJC RθJA Characteristic Junction to Case Junction to Ambient MIN TYP MAX UNIT °C/W 0.20 40 1 Repetitive Rating: Pulse width limited by maximum junction temperature 2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2% 3 See MIL-STD-750 Method 3471 4 Starting Tj = +25°C, L = 600µH, RG = 25Ω, Peak IL = 100A 5 dv/dt numbers reflect the limitations of the test circuit rather than the device itself. IS ≤ -ID100A di/dt ≤ 200A/µs VR ≤200V TJ ≤ 150°C 6 The maximum current is limited by lead temperature. APT Reserves the right to change, without notice, the specifications and information contained herein. 0.25 Z JC, THERMAL IMPEDANCE (°C/W) θ 0.20 0.9 0.15 0.7 0.5 0.3 Note: PDM t1 t2 Peak TJ = PDM x ZθJC + TC Duty Factor D = t1/t2 5-2004 0.10 050-5906 Rev A 0.05 0.1 0 0.05 10-5 10-4 SINGLE PULSE 10-3 10-2 10-1 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION 1.0 Typical Performance Curves ID, DRAIN CURRENT (AMPERES) Junction temp. (°C) RC MODEL 250 APT20M18B2VFR_LVFR VGS =15 &10 V 7V 200 6.5V 150 6V 100 5.5V 50 5V 4.5V 5 10 15 20 25 30 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS 0 0 0.0302 0.00809F Power (watts) 0.0729 0.0182F 0.0955 Case temperature. (°C) 0.264F FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE 120 100 80 60 40 TJ = +25°C 20 0 TJ = +125°C 0 1 2 3 4 5 6 7 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) FIGURE 4, TRANSFER CHARACTERISTICS VDS> ID (ON) x RDS (ON)MAX. 250 µSEC. PULSE TEST @