APTM100UM65S-AlN
Single switch Series & parallel diodes MOSFET Power Module
SK CR1 D
VDSS = 1000V RDSon = 65mΩ typ @ Tj = 25°C ID = 145A @ Tc = 25°C
Applicatio n • Welding converters • Switched Mode Power Supplies • Uninterruptible Power Supplies • Motor control Features • Power MOS 7® MOSFETs - Low RDSon - Low input and Miller capacitance - Low gate charge - Avalanche energy rated - Very rugged • Kelvin source for easy drive • Very low stray inductance - Symmetrical design - M5 power connectors • High level of integration • AlN substrate for improved thermal performance
S
Q1 G
S
D
SK G
Benefits • Outstanding performance at high frequency operation • Direct mounting to heatsink (isolated package) • Low junction to case thermal resistance • Low profile
Absolute maximum ratings
Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS
Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy Tc = 25°C Tc = 80°C
Tc = 25°C
mJ
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
APT website – http://www.advancedpower.com
1–6
APTM100UM65S-AlN – Rev 1 July, 2005
Max ratings 1000 145 110 580 ±30 78 3250 30 50 3200
Unit V A V mΩ W A
APTM100UM65S-AlN
All ratings @ Tj = 25°C unless otherwise specified
Symbol Characteristic IDSS RDS(on) VGS(th) IGSS
Electrical Characteristics
Zero Gate Voltage Drain Current Drain – Source on Resistance Gate Threshold Voltage Gate – Source Leakage Current
Test Conditions
VGS = 0V,VDS= 1000V VGS = 0V,VDS= 800V
Tj = 25°C Tj = 125°C
Min
Typ
VGS = 10V, ID = 72.5A VGS = VDS, ID = 20mA VGS = ±30 V, VDS = 0 V
65 3
Max 400 2 78 5 ±400
Unit µA mA mΩ V nA
Dynamic Characteristics
Symbol Ciss Coss Crss Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff
Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate – Source Charge Gate – Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy
Test Conditions VGS = 0 V VDS = 25V f = 1MHz VGS = 10V VBus = 500V ID = 145A VGS = 15V VBus = 500V ID = 145A R G = 0.75Ω Inductive switching @ 25°C VGS = 15V, VBus = 670V ID = 145A, R G = 0.75 Ω Inductive switching @ 125°C VGS = 15V, VBus = 670V ID = 145A, R G = 0.75 Ω
Min
Typ 28.5 5.08 0.9 1068 136 692 18 14 140 55 4.8 2.9 8 3.9
Max
Unit nF
nC
ns
mJ mJ
Eon includes diode reverse recovery
Series diode ratings and characteristics
Symbol Characteristic VRRM IRM IF(A V) VF
Maximum Peak Repetitive Reverse Voltage
Test Conditions Tj = 25°C Tj = 125°C
T c = 80°C
Min 200
Typ
Max 350 600
Unit V µA A
Maximum Reverse Leakage Current Maximum Average Forward Current Diode Forward Voltage
VR=200V
50% duty cycle
Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C
trr Qrr
Reverse Recovery Time Reverse Recovery Charge
31 60 120 500
IF = 120A VR = 133V
di/dt = 400A/µs
ns nC
APT website – http://www.advancedpower.com
2–6
APTM100UM65S-AlN – Rev 1 July, 2005
IF = 120A IF = 240A IF = 120A
120 1.1 1.4 0.9
1.15 V
APTM100UM65S-AlN
Parallel diode ratings and characteristics
Symbol Characteristic VRRM IRM IF(A V) VF trr Qrr
Maximum Peak Repetitive Reverse Voltage
Test Conditions Tj = 25°C Tj = 125°C Tc = 80°C
Min 1000
Typ
Max 750 1000
Unit V µA A
Maximum Reverse Leakage Current Maximum Average Forward Current Diode Forward Voltage
VR=1000V
50% duty cycle
IF = 240A IF = 480A IF = 240A IF = 240A VR = 667V
di/dt = 800A/µs
Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Min Transistor Series diode Parallel diode 2500 -40 -40 -40 3 2
240 2 2.2 1.7 280 350 3.04 14.4 Typ
2.5 V
Reverse Recovery Time Reverse Recovery Charge
ns µC
Thermal and package characteristics
Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Junction to Case
Max 0.038 0.46 0.23 150 125 100 5 3.5 280
Unit °C/W V °C N.m g
RMS Isolation Voltage, any terminal to case t =1 min, I sol I D(on)xRDS(on)MAX 250µs pulse test @ < 0.5 duty cycle
7V 6.5V
400 320 240 160 80 0
TJ=25°C TJ =125°C 0 1 2 3 4 5 TJ=-55°C 6 7 8
30
VDS, Drain to Source Voltage (V) RDS(on) vs Drain Current ID, DC Drain Current (A)
Normalized to VGS =10V @ 72.5A
VGS, Gate to Source Voltage (V) DC Drain Current vs Case Temperature 160 120 80 40 0
RDS(on) Drain to Source ON Resistance
1.4 1.3 1.2 1.1 1 0.9 0.8 0
VGS=10V VGS=20V
80
160
240
320
25
50
75
100
125
150
APTM100UM65S-AlN – Rev 1 July, 2005
ID, Drain Current (A)
TC, Case Temperature (°C)
APT website – http://www.advancedpower.com
4–6
APTM100UM65S-AlN
RDS(on), Drain to Source ON resistance (Normalized) Breakdown Voltage vs Temperature BVDSS, Drain to Source Breakdown Voltage (Normalized) 1.15 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (°C) Threshold Voltage vs Temperature 1.2 VGS(TH), Threshold Voltage (Normalized) I D, Drain Current (A) 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, Case Temperature (°C) Capacitance vs Drain to Source Voltage VGS, Gate to Source Voltage (V) 100000 Ciss C, Capacitance (pF) 10000 14 12 10 8 6 4 2 0 0 300 600 900 1200 1500
APTM100UM65S-AlN – Rev 1 July, 2005
ON resistance vs Temperature 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (°C) Maximum Safe Operating Area
VGS =10V ID=72.5A
1000
limited by R DSon
100µs
100
1ms
10 Single pulse TJ=150°C 1 1
10ms
10 100 1000 VDS , Drain to Source Voltage (V)
Gate Charge vs Gate to Source Voltage ID=145A TJ=25°C
VDS=200V VDS=500V V DS =800V
Coss
1000
Crss
100 0 10 20 30 40 50 VDS, Drain to Source Voltage (V)
Gate Charge (nC)
APT website – http://www.advancedpower.com
5–6
APTM100UM65S-AlN
Delay Times vs Current 160 t d(off) td(on) and td(off) (ns) 120
V DS=670V RG=0.75Ω T J=125°C L=100µH
Rise and Fall times vs Current 100 80
V DS =670V RG =0.75Ω T J=125°C L=100µH
tf
tr and tf (ns)
60 40 20 0 tr
80
40
t d(on)
0 50 94 138 182 226 270 ID, Drain Current (A) Switching Energy vs Current
50
94
138 182 226 I D, Drain Current (A)
270
Switching Energy vs Gate Resistance
16 Switching Energy (mJ) 12 10 8 6 4 2 0 50 94 138 182 226 270
ID, Drain Current (A) Operating Frequency vs Drain Current
26 Switching Energy (mJ)
VDS=670V RG=0.75Ω TJ=125°C L=100µH
14
Eon
22 18 14 10 6 2 0
V DS=670V ID=145A T J=125°C L=100µH
Eoff
Eoff
Eon
1
2
3
4
5
6
7
8
Gate Resistance (Ohms) Source to Drain Diode Forward Voltage
250 Frequency (kHz)
ZVS
IDR, Reverse Drain Current (A)
300
1000
200 150 100 50 0 15 35
VDS=670V D=50% RG=0.75Ω T J=125°C T C=75°C
ZCS
100
TJ=150°C TJ=25°C
10
Hard switching
1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
APTM100UM65S-AlN – Rev 1 July, 2005
55 75 95 115 ID, Drain Current (A)
135
VSD, Source to Drain Voltage (V)
APT reserves the right to change, without notice, the specifications and information contained herein
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
APT website – http://www.advancedpower.com
6–6