96FD-H032-PLG

PX-xxxG5He-72 Series Half-slim SATA Solid State Drive Engineering Specification (for Advantech) LITE-ON IT CORPORATION Document History Revision Date Rev 0.1 2012/12/28 Rev 0.2 2013/1/9 Changes First draft release Added PX-xxxG5He-72 series, update Identify Device data Update Smart attribute Rev 0.3 2013/2/6 Update Current Consumption Sec 5.2Current Consumption Rev 0.4 2013/3/15 Update Sec.4.8 Band Performance Modify Sec 8.3 Identify data Rev 0.5 2013/05/23 Update Sec. 8.1 SMART commands Add Sec 4.19 Compliance Rev 0.6 Product Specification 2013/07/01 Update Sec. 5.2 Max current consumption Page 2 of 31 Copyright 2013 LITE-ON IT CORPORATION Disclaimer The information in this document is subject to change without prior notice in order to improve reliability, design, and function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages. This document contains proprietary information protected by copyright. All rights are reserved. No part of this datasheet may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of LITEON IT Corporation. Product Specification Page 3 of 31 Table of Contents 1 Introduction ...................................................................... 6 2 Features ........................................................................... 6 3 Block Diagram .................................................................. 7 4 Basic Specifications .......................................................... 8 4.1 Capacity.................................................................................................8 4.1.1 Physical Capacity ..................................................................................8 4.1.2 User Capacity ........................................................................................8 4.2 Flash Type .............................................................................................8 4.3 Program/Erase Cycle .............................................................................8 4.4 ECC Ability ............................................................................................8 4.5 Buffer Memory Size ...............................................................................9 4.6 Compatibility .........................................................................................9 4.7 Temperature Sensor (Optional) .............................................................9 4.8 Band Performance .................................................................................9 4.9 Read and Write IOPS (IOMETER) ......................................................... 10 4.10 Power On to Ready .............................................................................. 10 4.11 Temperature ........................................................................................ 10 4.12 Reliability ............................................................................................. 11 4.13 Shock and Vibration ............................................................................ 11 4.14 Altitude ................................................................................................ 12 4.15 Angle ................................................................................................... 12 4.16 Rattle Noise ......................................................................................... 12 4.17 Operating noise ................................................................................... 12 4.18 Electromagnetic Compatibility of PX-xxxG5He-72 series .................... 12 5 Power Supply.................................................................. 14 5.1 5.2 5.3 5.4 5.5 5.6 Power Interface .................................................................................... 14 Current Consumption .......................................................................... 14 Power ON Reset................................................................................... 14 Power Off Sequence ............................................................................ 15 Power Mode ......................................................................................... 16 Temperature Sensor ............................................................................ 16 6 Outline and Dimension .................................................... 17 7 Pin Locations and Definition ............................................ 18 7.1 7.2 Pin Location......................................................................................... 18 Signal Description ............................................................................... 18 8 Handling Recommendation................... 錯誤! 尚未定義書籤。 Product Specification Page 4 of 31 9 Command Description ..................................................... 20 9.1 9.2 9.3 ATA Command .................................................................................... 20 Vendor Specify Command: Get Temperature Command (Optional) .... 24 Identify Device Data ............................................................................. 25 References.............................................................................. 30 Terms and Acronyms ................................................................ 31 Table 1 User Addressable Sectors ............................................................................... 8 Table 2 Maximum Sustained Read and Write Bandwidth ...................................... 9 Table 3 Random Read/Write Input/output Operations per Second ................... 10 Table 4 Latency Specifications.................................................................................... 10 Table 5 Temperature Relative Specifications .......................................................... 10 Table 6 Reliability specifications ................................................................................ 11 Table 7 Shock and Vibration ........................................................................................ 11 Table 8 Radio Frequency Specifications .................................................................. 12 Table 10 Operating Voltage .......................................................................................... 14 Table 11 Current Consumption .................................................................................... 14 Table 12 Power On Reset Characteristics ................................................................ 14 Table 13 DC Characteristics ......................................................................................... 16 Table 14 Pin Name........................................................................................................... 19 Figure 1 Block Diagram .......................................................................................................... 7 Figure 2 Buffer Memory ......................................................................................................... 9 Figure 3 Power On Reset ...................................................................................................... 15 Figure 4 Power off sequence ............................................................................................... 15 Figure 5 Power Mode ........................................................................................................... 16 Product Specification Page 5 of 31 1 Introduction The PX-xxxG5He-72 series Half-Slim SATA Solid State Drive (SSD) deliver leading performance in an industry standard Half Slim form factor while simultaneously improving system responsiveness for automotive applications over standard rotating drive media or hard disk drives. By combining leading NAND flash memory technology with our innovative high performance firmware; LITE-ON IT delivers Half Slim SATA SSD drives drop-in replacement with enhanced performance, reliability, ruggedness and power savings. Since there are no rotating platters, moving heads, fragile actuators, or unnecessary delays due to spin-up time or positional seek time that can slow down the storage subsystem, significant I/O and throughput performance improvement is achieved as compared to rotating media or hard disk drives. This document describes the specifications of the PX-xxxG5He-72 series Half-Slim SATA Solid State Drive (SSD) form factors. The PX-xxxG5He-series-72 Half Slim SATA SSD key attributes include high performance, low power, increased system responsiveness, high reliability, and enhanced ruggedness as compared to standard automotive SATA hard drives. The PX-xxxG5He-72 series Half Slim SATA SSD is available in a Half Slim form factor that is electrically, mechanically, and software compatible with existing Half Slim SATA slots and cables. Our flexible design allows interchangeability with existing mobile hard drives based on the SATA interface standard. The PX-xxxG5He-72 series Half Slim SATA SSD includes the advantage of the PX-xxxG5He-72 series Half Slim SATA SSD and comes with standard MO-297 small form factor. It is suitable for the application with limited space and high performance requirement. 2 Features
High speed mass storage device
S-ATA III 6.0G interface
No movement parts and noise free
Excellent ability against Shock/Vibration
Fast access performance
Half Slim (MO-297) SSD form factor Product Specification Page 6 of 31 3 Block Diagram Host Interface Figure 1 Block Diagram Product Specification Page 7 of 31 4 Basic Specifications 4.0 Key Component and FW Version 4.0.1 Flash Type: Toshiba 19nm 4.0.2 Controller: Marvell Monet Lite 9188 4.0.3 FW Version: 1.00 4.1 Capacity 4.1.1 Physical Capacity 32GB, PX-32G5He-72 64GB, PX-64G5He-72 128GB, PX-128G5He-72 4.1.2 User Capacity Unformatted capacity Total user addressable sectors in LBA mode 32GB 62,533,296 64GB 125,045,424 128G 250,069,680 Table 1 User Addressable Sectors Notes: 1. 1GB=1,000,000,000 bytes and not all of the memory can be used for storage. 2. 1 Sector = 512 bytes 4.2 Flash Type Multi-Level Cell (MLC) 4.3 Program/Erase Cycle 3000(global) 4.4 ECC Ability 81bits/2KB Product Specification Page 8 of 31 4.5 Buffer Memory Size 128-256MB DDR3, consist of FTL Table and write cache data. Write Cache Data FTL Table Figure 2 Buffer Memory 4.6 Compatibility -- SATA Revision 3.0 compliant Compatible with SATA 1.5Gb/s, 3.0Gb/s & 6.0Gb/s Interface rates -- ATA/ATAPI- 8 compliant -- SSD enhanced SMART ATA feature set -- Native Command Queuing (NCQ) command set -- TRIM supported 4.7 Temperature Sensor (Optional) The temperature information is available from a built-in temperature sensor between -40 °C to +125 °C with ± 3 °C accuracy. 4.8 Band Performance Capacity 32GB 64GB 128G Access Type MB/s Sequential Read Up to 280 MB/s Sequential Write Up to 80 MB/s Sequential Read Up to 280 MB/s Sequential Wrire Up to 160 MB/s Sequential Read TBD Sequential Wrire TBD Table 2 Maximum Sustained Read and Write Bandwidth Notes: 1). Performance measured using CrystalDiskMark. 2). 1 MB/sec = 1,048,576 bytes/sec is used in measuring sequential performance. If 1 MB/sec = 1,000,000 bytes/sec is used, performance values become 4.85% higher. Product Specification Page 9 of 31 4.9 Read and Write IOPS (IOMETER) Capacity Access Type IOPS 4K Read (IOPS) 40,000 4K Write (IOPS) 20,000 4K Read (IOPS) 50,000 4K Write (IOPS) 40,000 TBD (IOPS) TBD (IOPS) TBD (IOPS) TBD (IOPS) 32 GB 64 GB 128 GB Table 3 Random Read/Write Input/output Operations per Second Notes: 1. Performance measured using IOMETER with queue depth set to 1. 2. Write cache enabled 4.10 Power On to Ready Operating Mode Typical (25°C) Max.(0°C to +70°C) 1s 4s Power on to Ready Table 4 Latency Specifications Notes: 1. Write cache enabled 2. Device measured using Drive Master 3. Power on to ready time assumes proper shutdown (Power removal preceded by Flush Cache or STANDBY command) 4.11 Temperature Environment Ambient Temperature Mode Min Max Unit Operating 0 70 °C -40 90 °C 5 95 % 5 95 % Non-operating, Storage Operation Humidity Non-operation, Storage Thermal Gradient Operation, Non-operation, 5 - °C/ min Storage Table 5 Temperature Relative Specifications Product Specification Page 10 of 31 No permanent damage will occur on the module when it is powered ON at -40°C and +95°C. There will be no flame / spark / smoke from the module in any condition of short circuit and/or temperature above +95°C. 4.12 Reliability Parameter Value Mean Time between Failure (MTBF) Power on/off cycles Data Reliability > 1,400,000 hours 25,000 cycles 13 1 per 10 bits read (max) 50 cycles of Insert and Removal operation(min) Interface Table 6 Reliability specifications Notes: 1. MTBF is calculated based on a Part Stress Analysis. It assumes nominal voltage. With all other parameters within specified range. 2. Power on/off cycles is defined as power being removed from the drive, and the restored. Application systems remove power with the Flush Cache command or Standby Immediate command in advance before the system shutdown. 3. 4.13 Shock and Vibration Item Mode Operation Non-operating Shock Timing/Frequency At 1 msec half-sine Max 1500G 1 Operation Non-operating Random 2 Vibration At 2 msec half-sine 1000G Operation 7~800 Hz 2.17Grms Non-operation 7~800 Hz 3.08Grms Table 7 Shock and Vibration Product Specification Page 11 of 31 Notes: 1. Shock specifications assume that the SSD is mounted securely with the input vibration applied to the drive mounting screws. Stimulus may be applied in the X, Y or Z axis 2. Vibration specifications assume that the SSD is mounted securely with the input vibration applied to the drive mounting screws. Stimulus may be applied in the X, Y or Z axis. The measured specification is in root mean squared form. 4.14 Altitude Operational Altitude: 5,500 meters Altitude Gradient: 300m / min 4.15 Angle The drives will operate at any Angle or/and Orientation. 4.16 Rattle Noise The drives will have no rattle noise during any operation. Note: There are no movement parts in the SSD drives; the rattle noise will not be tested. 4.17 Operating noise The operating noise of the module will not exceed 35dBA (20Hz to 20kHz) Note: There are no movement parts in the SSD drive; the operation noise will not be tested. 4.18 Electromagnetic Compatibility of PX-xxxG5He-72 series Electromagnetic compatibility tests assume the SSD is properly installed in the representative host system. The drive operates properly without errors degradation in performance when subjected to radio frequency (RF) environments defined in the following table. Test Description Performance criteria Reference standard A IEC 61000-4-2:2008 A IEC 61000-4-2:2008 - CISPER-22 Class B Packaging and Handling Contact ±4KV ±8KV Production and Service Electrostatic discharge Contact ±2KV Electrostatic discharge Radiated Emission - Table 8 Radio Frequency Specifications Product Specification Page 12 of 31 Notes: 1. Performance criterion A = The device shall continue to operate as intended, i.e., normal unit operation with no degradation of performance. 2. Performance criterion B = The device shall continue to operate as intended after completion of test, however, during the test, some degradation of performance is allowed as long as there is no data loss operator intervention to restore device function. 3. Performance criterion C = Temporary loss of function is allowed. Operator intervention is acceptable to restore device function. 4. Contact electrostatic discharge is applied to drive enclosure during operation. 5. Contact electrostatic discharge is applied to drive enclosure and I/O pins when Non-Operation. 4.19 Compliance: Certification Description RoHS compliant Restriction of Hazardous Substance Directive Indicates conformity with the essential health and safety CE compliant requirements set out in European Directives Low voltage Directive and EMC Directive Underwriters Laboratories, Inc. Component Recognition UL certified UL60950-1 Compliance to the Taiwan EMC standard “Limits and methods of BSMI Radio Disturbance Characteristics of Information Technology Equipment, CNS 13438 Class B” Table 9 Device Compliance Product Specification Page 13 of 31 5 Power Supply 5.1 Power Interface Description Specifications Nominal Supply (V1) Absolute Voltage +5Vdc +/- 5% Min. -0.5V Max. +10V Ripple voltage (0-20MHz) 150mV Supply Rise Time 1 – 100ms p-p max Table 10 Operating Voltage 5.2 Current Consumption PX-64G5He: Operation Mode Typical Max. Unit Read Mode 0.37 - A Write Mode 0.42 - A Standby 0.025 - A - 1.5 (T