Intel® Solid-State Drive DC S3500 Series
Product Specification
Capacity:
− 2.5-inch: 80/120/160/240/300/480/600/800 GB
− 1.8-inch: 80/240/400/800 GB
−
−
−
−
−
Components:
− Intel® 20nm NAND Flash Memory
− Multi-Level Cell (MLC)
Form Factor: 2.5–inch and 1.8-inch
Read and Write IOPS1,2 (Full LBA Range,
Iometer* Queue Depth 32)
−
−
−
−
Random
Random
Random
Random
4
4
8
8
KB3 Reads: Up to 75,000 IOPS
KB Writes: Up to 11,500 IOPS
KB3 Reads: Up to 47,500 IOPS
KB Writes: Up to 5,500 IOPS
Bandwidth Performance1
− Sustained Sequential Read: Up to 500 MB/s4
− Sustained Sequential Write: Up to 450 MB/s
Quality of Service5, 6
AES 256-bit Encryption
Compliance
− SATA Revision 3.0; compatible with SATA 6Gb/s,
3Gb/s and 1.5Gb/s interface rates
− ATA8-ACS2; includes SCT (Smart Command
Transport) and device statistics log support
− Enhanced SMART ATA feature set
− Native Command Queuing (NCQ) command set
− Data set management Trim command
Windows 7 and Windows 8
Windows Server 2012
Windows Server 2008 Enterprise 32/64bit SP2
Windows Server 2008 R2 SP1
Windows Server 2003 Enterprise R2 64bit SP2
Red Hat Enterprise Linux* 5.5, 5.6, 6.1, 6.3
SUSE* Linux Enterprise Server 10, 11 SP1
CentOS 64bit 5.7, 6.3
Intel® SSD Toolbox with Intel® SSD Optimizer
Product Ecological Compliance
− RoHS*
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
Temperature
Operating: 0° C to 70° C
Non-Operating9: -55° C to 95° C
Temperature monitoring and logging
Thermal throttling
Shock (operating and non-operating):
Vibration
1,000 G/0.5 msec
− Operating: 2.17 GRMS (5-700 Hz)
− Non-Operating: 3.13 GRMS (5-800 Hz)
Compatibility
−
−
−
−
−
−
−
−
−
− Active: Up to 5.0 W (TYP)
− Idle: 650 mW8
Weight:
− 2.5-inch 80-240 GB: 70 grams ± 2 grams
− 2.5-inch 300-800 GB: 72 grams ± 2 grams
− 1.8-inch 80 GB: 35 grams ± 2 grams
− 1.8-inch 240-800 GB: 37 grams ± 2 grams
− Read/Write: 500 µs / 5 ms (99.9%)
2.5 inch: 5 V or 12 V SATA Supply Rail7
1.8 inch: 3.3 V SATA Supply Rail
SATA Interface Power Management
OS-aware hot plug/removal
Enhanced power-loss data protection
Power
−
−
−
−
Latency (average sequential)
− Read: 50 µs (TYP)
− Write: 65 µs (TYP)
Power Management
Altitude (simulated)
− Operating: -1,000 to 10,000ft
− Non-Operating: -1,000 to 40,000ft
Reliability
− Uncorrectable Bit Error Rate (UBER):
− 1 sector per 1017 bits read
− Mean Time Between Failures (MTBF):
2,000,000 hours
− End-to-End data protection
Endurance Rating10:
− 80 GB: 45 TBW
– 120 GB: 70 TBW
− 160 GB: 100 TBW
– 240 GB: 140 TBW
− 300 GB: 170 TBW – 400 GB: 225 TBW
− 480 GB: 275 TBW – 600 GB: 330 TBW
− 800 GB: 450 TBW
Certifications and Declarations
− UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK,
VCCI*, SATA-IO
Performance values vary by capacity and form factor
Performance specifications apply to both compressible and incompressible data
4 KB = 4,096 bytes; 8 KB = 8,192 bytes
MB/s = 1,000,000 bytes/second.
Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive
and back to host
Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data
reliability
Defaults to 12V, if both 12V and 5V are present
Based on 5V supply
Please contact your Intel representative for details on the non-operating temperature range
Based on JESD218 standard
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
Ordering Information
Contact your local Intel sales representative for ordering information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF
SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,
OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD
YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS
SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS
COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY,
PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR
WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of
any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this
information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725,
or go to: http://www.intel.com/design/literature.htm
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased
components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of
halogenated flame retardants and/or PVC may not be better for the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2013 Intel Corporation. All rights reserved.
Product Specification
2
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
Contents
Revision History ..............................................................................................................................4
Terms and Acronyms .......................................................................................................................4
1.0
Overview .............................................................................................................................5
2.0
Product Specifications ..........................................................................................................6
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Capacity ............................................................................................................................... 6
Performance ........................................................................................................................ 6
Electrical Characteristics ..................................................................................................... 8
Environmental Conditions ................................................................................................. 10
Product Regulatory Compliance........................................................................................ 11
Reliability ........................................................................................................................... 11
Temperature Sensor.......................................................................................................... 12
Power Loss Capacitor Test ................................................................................................ 12
Hot Plug Support ............................................................................................................... 12
3.0
Mechanical Information .....................................................................................................13
4.0
Pin and Signal Descriptions .................................................................................................15
4.1
4.2
4.3
4.4
5.0
2.5-inch Form Factor Pin Locations ................................................................................... 15
1.8-inch Form Factor Pin Locations ................................................................................... 15
Connector Pin Signal Definitions ....................................................................................... 16
Power Pin Signal Definitions ............................................................................................. 16
Supported Command Sets ..................................................................................................18
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
ATA General Feature Command Set ................................................................................. 18
Power Management Command Set .................................................................................. 18
Security Mode Feature Set ................................................................................................ 18
SMART Command Set ....................................................................................................... 19
Device Statistics................................................................................................................. 24
SMART Command Transport (SCT).................................................................................... 25
Data Set Management Command Set ............................................................................... 25
Host Protected Area Command Set .................................................................................. 25
48-Bit Address Command Set............................................................................................ 25
General Purpose Log Command Set.................................................................................. 25
Native Command Queuing ................................................................................................ 26
Software Settings Preservation ......................................................................................... 26
6.0
Certifications and Declarations ...........................................................................................27
7.0
References .........................................................................................................................27
Appendix A: IDENTIFY DEVICE Command Data ...............................................................................28
Order Number: 328860-001US
3
Intel® Solid-State Drive DC S3500
Revision History
Date
Revision
April 2013
001
Description
Initial release.
Terms and Acronyms
Term
Definition
ATA
Advanced Technology Attachment
CRC
Cyclic Redundancy Check
DAS
Device Activity Signal
DMA
Direct Memory Access
ECC
Error Correction Code
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Note: The total usable capacity of the SSD may be less than the total physical capacity because a small
portion of the capacity is used for NAND flash management and maintenance purposes.
Gb
Gigabit
HDD
Hard Disk Drive
HET
High Endurance Technology
KB
Kilobyte
I/O
Input/Output
IOPS
Input/Output Operations Per Second
ISO
International Standards Organization
LBA
Logical Block Address
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
PB
Petabyte
PCB
Printed Circuit Board
PIO
Programmed Input/Output
RDT
Reliability Demonstration Test
RMS
Root Mean Square
SATA
Serial Advanced Technology Attachment
SCT
SMART Command Transport
Gigabyte
SMART
Self-Monitoring, Analysis and Reporting Technology
An open standard for developing hard drives and software systems that automatically monitors the
health of a drive and reports potential problems.
SSD
Solid-State Drive
TB
Terabyte
TYP
Typical
UBER
Uncorrectable Bit Error Rate
Product Specification
4
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
1.0
Overview
This document describes the specifications and capabilities of the Intel® SSD DC S3500.
The Intel® SSD DC S3500 delivers leading performance and Quality of Service combined
with world-class reliability for Serial Advanced Technology Attachment (SATA)-based
computers in nine capacities: 80 GB, 120 GB, 160 GB, 240 GB, 300 GB, 400 GB, 480 GB,
600 GB and 800 GB.
By combining 20nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface
support, the Intel® SSD DC S3500 delivers sequential read speeds of up to 500 MB/s and
sequential write speeds of up to 450 MB/s. Intel SSD DC S3500 delivers Quality of
Service of 500 us for random 4KB reads measured at a queue depth of 1.
The industry-standard 2.5-inch and 1.8-inch form factors enable interchangeability with
existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the
enhanced performance, reliability, ruggedness, and power savings offered by an SSD.
Intel SSD DC S3500 offers these key features:
•
•
•
•
•
•
•
•
•
•
•
•
•
Standard Endurance Technology
High I/O and throughput performance
Consistent I/O latency
Enhanced power-loss data protection
End-to-End data protection
Thermal throttling
Temperature Sensor
Inrush current management
Low power
High reliability
Enhanced ruggedness
Temperature monitor and logging
Power loss protection capacitor self-test
April 2013
Order Number: 328860-001US
Product Specification
5
Intel® Solid-State Drive DC S3500
2.0
Product Specifications
2.1
Capacity
Table 1.
User Addressable Sectors
Unformatted Capacity
Intel SSD DC S3500
Notes:
(Total User Addressable Sectors in LBA Mode)
80 GB
156,301,488
120 GB
234,441,648
160 GB
312,581,808
240 GB
468,862,128
300 GB
586,072,368
400 GB
781,422,768
480 GB
937,703,088
600 GB
1,172,123,568
800 GB
1,562,824,368
1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.
The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is
used for NAND flash management and maintenance purposes.
2.2
Performance
Table 2.
Random Read/Write Input/Output Operations Per Second (IOPS)
Intel SSD DC S3500
Specification1
Unit
80 GB
(2.5/
1.8”)
120 GB
160 GB
240 GB
(2.5”/
1.8”)
300 GB
400 GB
(1.8”)
480
/600 GB
800 GB
(2.5”/
1.8”)
Random 4 KB Read (up to)2
IOPS
70,000
75,000
75,000
75,000
75,000
75,000
75,000
75,000
Random 4 KB Write (up to)
IOPS
7,000
4,600
7,500
7,500
9,000
11,000
11,000
11,500
Random 8 KB Read (up to)
IOPS
39,000
47,000
47,500
47,500
47,500
47,500
47,500
47,500
Random 8 KB Write (up to)
IOPS
3,700
2,300
3,800
3,800
4,400
5,500
5,500
5,500
3
Notes:
1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on a full Logical Block
Address (LBA) span of the drive.
2. 4 KB = 4,096 bytes
3. 8 KB = 8,192 bytes
4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the
(IOPS in
the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full
Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background
activities required for normal operation and data reliability
Product Specification
6
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
Table 3.
Random Read/Write IOPS Consistency
Intel SSD DC S3500
4
Specification
Unit
80GB
(2.5/
1.8”)
120GB
160GB
240GB
(2.5”/
1.8”)
300GB
400GB
(1.8”)
480 /
600 GB
800GB
(2.5”/
1.8”)
Random 4 KB Read (up to)2
%
90
90
90
90
90
90
90
90
Random 4 KB Write (up to)
%
75
75
75
75
75
75
75
75
Random 8 KB Read (up to)3
%
90
90
90
90
90
90
90
90
Random 8 KB Write (up to)
%
75
75
75
75
75
75
75
75
Notes:
1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on a full Logical Block
Address (LBA) span of the drive.
2. 4 KB = 4,096 bytes
3. 8 KB = 8,192 bytes
4. Performance consistency measured using Iometer* based on Random 4KB QD=32 workload, measured as the
(IOPS
in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a
full Logical Block Address (LBA) span of the drive once the workload has reached steady state, including all background
activities required for normal operation and data reliability
Table 4.
Sequential Read and Write Bandwidth
Intel SSD DC S3500
Specification
Unit
80GB
(2.5/
1.8”)
120GB
160GB
240GB
(2.5”/
1.8”)
300GB
400GB
(1.8”)
480
/600
GB
800GB
(2.5”/
1.8”)
Sequential Read (SATA
6Gb/s)1
MB/s
340
445
475
500
500
500
500
500
Sequential Write (SATA
6Gb/s)1
MB/s
100
135
175
260
315
380
410
450
Notes:
1. Performance measured using Iometer* with 128 KB (131,072 bytes) of transfer size with Queue Depth 32.
Table 5.
Latency
Intel SSD DC S3500
Specification
80GB (2.5/1.8”), 120GB, 160GB, 240GB (2.5”/1.8”),
300GB, 400GB (1.8”), 480GB, 600 GB
Latency1 (TYP)
Read
Write
Power On to Ready2
April 2013
Order Number: 328860-001US
50 µs
65 µs
2.0 s
800GB (2.5”/1.8”)
50 µs
65 µs
3.0 s
Product Specification
7
Intel® Solid-State Drive DC S3500
Table 6.
Quality of Service
Intel SSD DC S3500
Specification
Queue Depth=1
Unit
Queue Depth=32
80/120/160/
240 GB
300/400/480/
600/800 GB
80/120/160/
240 GB
300/400/480/
600/800 GB
ms
0.5
0.5
2
2
ms
5
2
20
10
Reads
ms
10
5
10
5
Writes
ms
10
10
30
30
Quality of Service3, 4 (99.9%)
Reads
Writes
Quality of Service
3,4
(99.9999%)
Notes:
1.
Device measured using Iometer. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a
sequential workload.
2.
Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command.
3.
Device measured using Iometer. Quality of Service measured using 4 KB (4,096 bytes) transfer size on a random workload on a
full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background
activities required for normal operation and data reliability.
4.
Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish
the round-trip from host to drive and back to host.
2.3
Electrical Characteristics
Table 7.
Operating Voltage for 2.5-inch Form Factor
Intel SSDDC S3500
Electrical Characteristics
80 GB, 120 GB, 160 GB, 240 GB, 300 GB, 480 GB, 600 GB, 800 GB
5 V Operating Characteristics:
Operating Voltage range
5 V (±5%)
Rise time (Max/Min)
Fall time (Min)2
1 s / 1 ms
1 ms
Noise level
Min Off time3
Inrush Current (Typical Peak) 1
500 mV pp 10 Hz – 100 KHz
50 mV pp 100 KHz – 20 MHz
500 ms
1.0 A, < 1 s
12 V Operating Characteristics:
Operating Voltage range
Rise time (Max/Min)
Fall time (Min)2
Noise level
12 V (±10%)
1 s / 1 ms
1 ms
1000 mV pp 10 Hz – 100 KHz
100 mV pp 100 KHz – 20 MHz
Min Off time3
Inrush Current (Typical Peak) 1
500 ms
1.0 A, < 1 s
Notes:
1.
Measured from initial device power supply application.
2
Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management.
3.
The drive needs to be powered off for at least 500msec before powering on.
Product Specification
8
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
Table 8.
Power Consumption for 2.5-inch Form Factor (5V Supply)
Intel SSD DC S3500
Specification
Unit
Active Write - RMS Average
Active Write - RMS Burst
1
2
Idle
Table 9.
80 GB
120 GB
160 GB
240 GB
300 GB
480 GB
600 GB
800 GB
W
1.8
2.0
2.3
2.9
3.5
4.3
4.5
5.0
W
2.0
2.4
2.7
3.2
3.9
5.2
5.5
7.3
W
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
Power Consumption for 2.5-inch Form Factor (12V Supply)
Intel SSD DC S3500
Specification1
Unit
80 GB
120 GB
160 GB
240 GB
300 GB
480 GB
600 GB
800 GB
Active Write - RMS Average
W
2.0
2.3
2.5
3.1
3.5
4.3
4.5
5.0
Active Write - RMS Burst
W
2.2
2.5
2.8
3.4
4.2
5.5
6.8
7.8
Idle
W
0.8
0.8
0.9
0.9
0.9
0.9
0.9
0.9
Notes:
1.
The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) average
power is measured using scope trigger over a 100 ms sample period.
2.
The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) burst power
is measured using scope trigger over a 500 us sample period.
Table 10.
Operating Voltage and Power Consumption for 1.8-inch Form Factor
Intel SSD DC S3500
Electrical Characteristics
80 GB
Operating Voltage for 3.3 V (±5%)
Min
Max
Rise time (Max/Min)
Fall time (Min)2
Noise level
240 GB
400 GB
800 GB
3.13 V
3.47 V
1 s / 1 ms
1 ms
300 mV pp 10 Hz – 100 KHz
500 mV pp 100 KHz – 20 MHz
Min Off time3
Inrush Current (Typical Peak) 1
500 ms
1.2 A, < 1 s
Notes:
1.
Measured from initial device power supply application.
2.
Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management.
3.
The drive needs to be powered off for at least 500msec before powering on.
April 2013
Order Number: 328860-001US
Product Specification
9
Intel® Solid-State Drive DC S3500
Table 11.
Power Consumption for 1.8-inch Form Factor
Specification1
Unit
Intel SSD DC S3500
80 GB
240 GB
400 GB
800 GB
Active Write - RMS Average @ 3.3V
W
2.0
3.5
4.5
5.2
Active Write - RMS Burst @ 3.3V
W
2.2
3.8
5.0
7.5
Idle @ 3.3V
W
0.6
0.6
0.6
0.6
Notes:
1.
The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. Root Mean Squared (RMS) power
is measured using scope trigger over a 100 ms sample period.
2.4
Table 12.
Environmental Conditions
Temperature, Shock, Vibration
Temperature
Range
Case Temperature
Operating
Non-operating1
Temperature Gradient2
Operating
Non-operating
Humidity
Operating
Non-operating
Shock and Vibration
0 – 70 oC
-55 – 95 oC
30 oC/hr (Typical)
30 oC/hr (Typical)
5 – 95 %
5 – 95 %
Range
Shock3
Operating
1,000 G (Max) at 0.5 msec
Non-operating
1,000 G (Max) at 0.5 msec
Vibration4
Operating
2.17 GRMS (5-700 Hz) Max
Non-operating
3.13 GRMS (5-800 Hz) Max
Notes:
1.
Please contact your Intel representative for details on the non-operating temperature range.
2.
Temperature gradient measured without condensation.
3.
Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus
may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.
3.
Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws.
Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.
Product Specification
10
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
2.5
Product Regulatory Compliance
Intel SSD DC S3500 meets or exceeds the regulatory or certification requirements
in Table 13.
Table 13.
Product Regulatory Compliance Specifications
Title
TITLE 47-Telecommunications CHAPTER 1— FEDERAL
COMMUNMICATIONS COMMISSION PART 15 — RADIO
FREQUENCY DEVICES
Region For Which
Conformity Declared
Description
FCC Part 15B Class B
USA
ICES-003, Issue 4 Interference-Causing Equipment
Standard Digital Apparatus
CA/CSA-CEI/IEC CISPR 22:02. This is CISPR
22:1997 with Canadian Modifications
IEC 55024 Information Technology Equipment —
Immunity characteristics— Limits and methods of
measurement CISPR24:2010
EN-55024: 1998 and its amendments
European Union
IEC 55022 Information Technology Equipment — Radio
disturbance Characteristics— Limits and methods of
measurement CISPR24:2008 (Modified)
EN-55022: 2006 and its amendments
European Union
EN-60950-1 2nd Edition
Information Technology Equipment — Safety
— Part 1: General Requirements
USA/Canada
UL/CSA EN-60950-1 2nd Edition
Information Technology Equipment — Safety
— Part 1: General Requirements
USA/Canada
2.6
Canada
Reliability
Intel SSD DC S3500 meets or exceeds SSD endurance and data retention requirements
as specified in the JESD218 standard. Reliability specifications are listed in the table
below:
Table 14.
Reliability Specifications
Parameter
Value
Uncorrectable Bit Error Rate (UBER)
Uncorrectable bit error rate will not exceed one sector in the
specified number of bits read. In the unlikely event of a
non-recoverable read error, the SSD will report it as a read failure to
the host; the sector in error is considered corrupt and is not returned
to the host.
< 1 sector per 1017 bits read
Mean Time Between Failures (MTBF)
Mean Time Between Failures is estimated based on Telcordia*
methodology and demonstrated through Reliability Demonstration
Test (RDT).
2,000,000 hours
Power On/Off Cycles
Power On/Off Cycles is defined as power being removed from the
SSD, and then restored. Most host systems remove power from the
SSD when entering suspend and hibernate as well as on a system
shutdown.
April 2013
Order Number: 328860-001US
24 per day
Product Specification
11
Intel® Solid-State Drive DC S3500
Table 14.
Reliability Specifications
Parameter
Value
Insertion Cycles
50 on SATA cable
SATA/power cable insertion/removal cycles.
Data Retention
500 on backplane
3 months power-off retention once SSD
The time period for retaining data in the NAND at maximum rated
endurance.
Endurance Rating
Based on JESD219 workload.
reaches rated write endurance at 40 °C
80 GB: 45 TBW
120 GB:70 TBW
160 GB: 100 TBW
240 GB: 140 TBW
300 GB: 170 TBW
400 GB: 225 TBW
480 GB: 275 TBW
600 GB: 330 TBW
800 GB: 450 TBW
while running JESD218 standard1
1.
Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD requirements
2.7
Temperature Sensor
The Intel SSD DC S3500 has an internal temperature sensor with an accuracy of +/-2C
over a range of -20C to +80C which can be monitored using two SMART attributes:
Airflow Temperature (BEh) and Device Internal Temperature (C2h).
For more information on supported SMART attributes, see “SMART Attributes” on page
18.
2.8
Power Loss Capacitor Test
The Intel SSD DC S3500 supports testing of the power loss capacitor, which can be
monitored using the following SMART attribute: (175, AFh).
2.9
Hot Plug Support
Hot Plug insertion and removal is supported in the presence of a proper connector and
appropriate operating system (OS), as described in the SATA 3.0 specification.
This product supports asynchronous signal recovery and issues an unsolicited COMINIT
when first mated with a powered connector to guarantee reliable detection by a host
system without hardware device detection.
Product Specification
12
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
3.0
Mechanical Information
Figures 1 and 2 show the physical package information for the Intel SSD DC S3500 in the
2.5- and 1.8-inch form factors. All dimensions are in millimeters.
Figure 1:
Intel SSD DC S3500 2.5-inch Dimensions
April 2013
Order Number: 328860-001US
Product Specification
13
Intel® Solid-State Drive DC S3500
Figure 2:
Intel SSD DC S35001.8-inch Dimensions
Product Specification
14
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
4.0
Pin and Signal Descriptions
4.1
2.5-inch Form Factor Pin Locations
Figure 3:
Layout of 2.5-inch Form Factor Signal and Power Segment Pins
Note:
2.5-inch connector supports built in latching capability.
4.2
1.8-inch Form Factor Pin Locations
Figure 4:
Layout of 1.8-inch Form Factor Signal and Power Segment Pins
April 2013
Order Number: 328860-001US
Product Specification
15
Intel® Solid-State Drive DC S3500
4.3
Connector Pin Signal Definitions
Table 15.
Serial ATA Connector Pin Signal Definitions—2.5-inch and 1.8-inch Form
Factors
Pin
Function
S1
Ground
S2
A+
S3
A-
S4
Ground
S5
B-
S6
B+
S7
Ground
Note:
Definition
1st mate
Differential signal pair A
1st mate
Differential signal pair B
1st mate
Key and spacing separate signal and power segments.
4.4
Power Pin Signal Definitions
Table 16.
Serial ATA Power Pin Definitions—2.5-inch Form Factors
Pin1
Function
Definition
P12
Not connected
(3.3 V Power)
P22
Not connected
(3.3 V Power)
P3
2
Mating Order
--nd
Not connected
(3.3 V Power; pre-charge)
2
P43,4
Ground
Ground
1st Mate
P53
Ground
Ground
1st Mate
3
Ground
Ground
1st Mate
P73,5
V5
5 V Power
1st Mate
P8
3,5
V5
5 V Power
2nd Mate
P9
3,5
V5
5 V Power
2nd Mate
Ground
Ground
1st Mate
DAS/DSS
Device Activity Signal/Disable Staggered Spin-up
2nd Mate
P6
P103
P11
6
P123,4
Mate
Ground
Ground
1st Mate
7
V12
12 V Power
1st Mate
P147
V12
12 V Power
2nd Mate
7
V12
12 V Power
2nd Mate
P13
P15
Notes:
1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.
2. Pins P1, P2 and P3 are connected together, although they are not connected internally to the device. The host may put 3.3 V on
these pins.
3. The mating sequence is:
•
ground pins P4-P6, P10, P12 and the 5V power pin P7
•
signal pins and the rest of the 5V power pins P8-P9
4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to
discharge ESD in a suitably configured backplane connector.
5. Power pins P7, P8, and P9 are internally connected to one another within the device.
6. The host may ground P11 if it is not used for Device Activity Signal (DAS).
7. Pins P13, P14 and P15 are internally connected to one another within the device. The host may put 12 V on these pins.
Product Specification
16
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
Table 17.
Serial ATA Power Pin Definitions—1.8-inch Form Factors
Pin
Function
Definition
Mating Order1
P12
V33
3.3 V Power
2nd Mate
P22
V33
3.3 V Power, per-charge
2nd Mate
P33
Ground
--
1st Mate
P43
Ground
--
1st Mate
P54
V5
5 V Power; not connected.
1st Mate
P64
V5
5 V Power; not connected.
2nd Mate
P75
DAS/DSS
Device Activity Signal/Disable Staggered Spin-up
2nd Mate
Key
Key
NC
P86
Optional
Manufacturing Test Pin
2nd Mate
P96
Optional
Manufacturing Test Pin
2nd Mate
NC
Notes:
1. All mate sequences assume zero angular offset between connectors.
2. P1 and P2 are internally connected to one another within the device.
3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to discharge ESD in a suitably configure backplane connector.
4. Pins P5 and P6 are not connected internally to the device but there is an option to connect through a zero ohm stuffing
resistor. The host may put 5V on these pins.
5. The host may ground P7 if it is not used for Device Activity Signal (DAS).
6. P8 and P9 should not be connected by the host.
April 2013
Order Number: 328860-001US
Product Specification
17
Intel® Solid-State Drive DC S3500
5.0
Supported Command Sets
Intel SSD DC S3500 supports all mandatory ATA (Advanced Technology Attachment)
commands defined in the ATA8-ACS specification described in this section.
5.1
ATA General Feature Command Set
The Intel SSD DC S3500 supports the ATA General Feature command set (non- PACKET),
which consists of:
− EXECUTE DEVICE DIAGNOSTIC
− SET FEATURES
− IDENTIFY DEVICE
Note: See Appendix A, “IDENTIFY DEVICE Command Data” on page 27 for details on
the sector data returned after issuing an IDENTIFY DEVICE command.
Intel SSD DC S3500 also supports the following optional commands:
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
READ DMA
WRITE DMA
READ SECTOR(S)
READ VERIFY SECTOR(S)
READ MULTIPLE
SEEK
SET FEATURES
WRITE SECTOR(S)
SET MULTIPLE MODE1
WRITE MULTIPLE
FLUSH CACHE
READ BUFFFER
WRITE BUFFER
NOP
DOWNLOAD MICROCODE
WRITE UNCORRECTABLE EXT
1. The only multiple supported will be multiple 1
5.2
Power Management Command Set
Intel SSD DC S3500 supports the Power Management command set, which consists of:
−
−
−
−
−
−
5.3
CHECK POWER MODE
IDLE
IDLE IMMEDIATE
SLEEP
STANDBY
STANDBY IMMEDIATE
Security Mode Feature Set
Intel SSD DC S3500 supports the Security Mode command set, which consists of:
−
−
−
−
−
−
Product Specification
18
SECURITY
SECURITY
SECURITY
SECURITY
SECURITY
SECURITY
SET PASSWORD
UNLOCK
ERASE PREPARE
ERASE UNIT
FREEZE LOCK
DISABLE PASSWORD
April 2013
Order Number: 328860-001US
Intel® Solid-State Drive DC S3500
5.4
SMART Command Set
Intel SSD DC S3500 supports the SMART command set, which consists of:
−
−
−
−
−
−
−
−
−
−
−
5.4.1
SMART
SMART
SMART
SMART
SMART
SMART
SMART
SMART
SMART
SMART
SMART
READ DATA
READ ATTRIBUTE THRESHOLDS
ENABLE/DISABLE ATTRIBUTE AUTOSAVE
SAVE ATTRIBUTE VALUES
EXECUTE OFF-LINE IMMEDIATE
READ LOG SECTOR
WRITE LOG SECTOR
ENABLE OPERATIONS
DISABLE OPERATIONS
RETURN STATUS
ENABLE/DISABLE AUTOMATIC OFFLINE
SMART Attributes
Table 18 lists the SMART attributes supported by the Intel SSD DC S3500 and the
corresponding status flags and threshold settings.
Table 18.
SMART Attributes
ID
05h
Status Flags
Attribute
Re-allocated Sector Count
Raw value: shows the number of retired blocks since
leaving the factory (grown defect count).
Threshold
SP
EC
ER
PE
OC
PW
1
1
0
0
1
0
0 (none)
1
1
0
0
1
0
0 (none)
1
1
0
0
1
0
0 (none)
Normalized value: beginning at 100, shows the percent
remaining of allowable grown defect count.
Power-On Hours Count
09h
Raw value: reports power-on time, cumulative over the life
of the SSD, integer number in hour time units.
Normalized value: always 100.
0Ch
Power Cycle Count
Raw value: reports the cumulative number of power cycle
events over the life of the device.
Normalized value: always 100.
AAh
Available Reserved Space (See Attribute E8)
1
1
0
0
1
1
10
ABh
Program Fail Count
Raw value: shows total count of program fails.
Normalized value: beginning at 100, shows the percent
remaining of allowable program fails.
1
1
0
0
1
0
0 (none)
ACh
Erase Fail Count
Raw value: shows total count of erase fails.
Normalized value: beginning at 100, shows the percent
remaining of allowable erase fails.
1
1
0
0
1
0
0 (none)
AEh
Unexpected Power Loss
Also known as “Power-off Retract Count” per magnetic-drive terminology.
Raw value: reports number of unclean shutdowns, cumulative over the life of the SSD.
An “unclean shutdown” is the removal of power without
STANDBY IMMEDIATE as the last command (regardless of
PLI activity using capacitor power).
Normalized value: always 100.
1
1
0
0
1
0
0 (none)
AFh
Power Loss Protection Failure
Last test result as microseconds to discharge cap, saturates
at max value. Also logs minutes since last test and lifetime
number of tests.
Raw value:
Bytes 0-1: Last test result as microseconds to discharge
cap, saturates at max value. Test result expected in range
1
1
0
0
1
1
10
April 2013
Order Number: 328860-001US
Product Specification
19
Intel® Solid-State Drive DC S3500
Table 18.
SMART Attributes
ID
Status Flags
Attribute
Threshold
SP
EC
ER
PE
OC
PW
B7h
SATA Downshift Count
Raw value: reports number of times SATA interface
selected lower signaling rate due to error.
Normalized value: always 100.
1
1
0
0
1
0
0 (none)
B8h
End-to-End Error Detection Count
Raw value: reports number of End-to-End detected and
corrected errors by hardware.
Normalized value: always 100.
1
1
0
0
1
0
0 (none)
BBh
Uncorrectable Error Count
Raw value: shows the number of errors that could not
be recovered using Error
Correction Code (ECC).
Normalized value: always 100.
1
1
0
0
1
0
0 (none)
BEh
Temperature - Airflow Temperature (Case)
Raw value: reports SSD case temperature statistics.
Bytes 0-1: Current case temperature, Celsius
Byte 2: Recent min case temperature, Celsius
Byte 3: Recent max case temperature, Celsius
Bytes 4-5: Over temperature counter. Number of times
sampled temperature exceeds drive max operating temperature specification.
Normalized value: 100 – case temperature in C degrees.
1
0
0
0
1
0
0 (none)
1
1
0
0
1
0
0 (none)
1
0
0
0
1
0
0 (none)
0
1
0
0
1
0
0 (none)
1
1
0
0
1
0
0 (none)
1
1
0
0
1
0
0 (none)
25
工商网监
湘ICP备2023018690号
