SQF-ISDS1-1G-21C

SQFlash Industrial SD Card SQFlash SD Card Datasheet (SQF-ISDx1-xG-21x) Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 1 of 20 Mar. 15, 2016 SQFlash Industrial SD Card CONTENTS 1. Overview ............................................................................................ 4 2. Standard Features ............................................................................. 5 3. Additional Features ........................................................................... 6 4. Pin Assignment and Block Diagram ................................................ 8 5. Power Consumption ......................................................................... 9 6. DC Characters ................................................................................... 9 7. AC Characters ................................................................................. 12 8. Dimensions ...................................................................................... 18 Appendix: Part Number Table ........................................................... 19 Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 2 of 20 Mar. 15, 2016 SQFlash Industrial SD Card Revision History Rev. Date History st 0.1 2014/7/1 1. 1 draft 0.2 2015/7/1 1. Update to 15nm MLC 0.3 2016/3/10 1. Add ultra MLC and wear leveling information 0.4 2016/3/15 1. Add TBW information Advantech reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Advantech is believed to be accurate and reliable. However, Advantech does not assure any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. Copyright © 1983-2010 Advantech Co., Ltd. All rights reserved. Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 3 of 20 Mar. 15, 2016 SQFlash Industrial SD Card 1. Overview The Industrial SD Card (ISD) of the SQFlash is fully compliant to the specification released by SD Card Association. The Command List supports [Part 1 Physical Layer Specification Ver3.1 Final] definitions. Card Capacity of Non-secure Area, Secure Area Supports [Part 3 Security Specification Ver3.0 Final] Specifications. The SQF-ISD is based on 9-pin interface, designed to operate at a maximum operating frequency of 100MHz. It can alternate communication protocol between the SD mode and SPI mode. It performs data error detection and correction with very low power consumption. Current capacity would be offered from 4GB to 64GB; it’s possible to reach 2TB in the future with ex-FAT, which is called SDXC (Extended Capacity SD Memory Card). The SQF-ISD is specifically made for any rigorous environments where devices need to be operated at extended temperature, and strong data integrity and reliability are demanded. Such environments include both industrial and automotive applications. The SQF-ISD is the best choice for exceptional reliability, excellent performance and wide compatibility. Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 4 of 20 Mar. 15, 2016 SQFlash Industrial SD Card 2. Standard Features  Support SD system specification version 2.0 and 3.0. and compliant with UHS-I  Card Capacity of Non-secure Area, Secure Area Supports [Part 3 Security Specification Ver3.0 Final] Specifications  Support SD SPI mode  Designed for read-only and read/write cards.  The Command List supports [Part 1 Physical Layer Specification Ver3.01 Final] definitions  Copyrights Protection Mechanism - Complies with highest security of SDMI standard   CPRM (Content Protection for Recordable Media) of SD Card supported Support up to 72bits BCH ECC circuits to protect data communication.  Global Wear Leveling support – SQFlash provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the life expectancy of the NAND Flash is greatly improved.  Card removal during read operation will never harm the content  Password Protection of cards (option)  Write Protect feature using mechanical switch  Built-in write protection features (permanent and temporary)  High transmission speed  +4KV/-4KV ESD protection in contact pads  Dimensions: 32mm (L) x 24mm (W) x 2.1mm (H)  Operating voltage range : 2.7-3.6V Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 5 of 20 Mar. 15, 2016 SQFlash Industrial SD Card 3.  Additional Features Capacities – SLC type：128MB，256MB，512MB，1GB，2GB，4GB，8GB，16GB，32GB – Ultra MLC type：4GB，8GB，16GB，32GB，64GB – MLC type：8GB，16GB，32GB，64GB，128GB  Flash type – SLC：32nm for 1G / 2G, the rest are 24nm – MLC：15nm  Performance (MB per sec) –  Max. Read / Write: 90 / 45 Temperature Ranges – Commercial Temperature ● 0℃ to 70℃ – Industrial Temperature ● -40℃ to 85℃  Mechanical Specification – Shock：1,500G, Peak / 0.5ms – Vibration：5G, Peak / 10~2000Hz – Drop Test: 1.5m free fall – Torque Test: 0.15N-m or +/-2.5deg – Switch Cycles Test: Slide 0.4N to 5N  Humidity – Operating Humidity：5% ~ 93% – Non-Operating Humidity：5% ~ 93%  NAND flash Data Retention – 10 years Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 6 of 20 Mar. 15, 2016 SQFlash Industrial SD Card  Endurance JEDEC defined an endurance rating TBW (TeraByte Written), following by the equation below, for indicating the number of terabytes a flash drive can be written which is a measurement of flash drive’s expected lifespan, represents the amount of data written to the device. TBW = [(NAND Endurance) x (Flash Drive Capacity)] / WAF    NAND Endurance: Program / Erase cycle of a NAND flash. o SLC: 60,000 cycles o Ultra MLC: 20,000 cycles o MLC: 3,000 cycles Flash Drive Capacity: Physical capacity in total of a Flash Drive. WAF: Write Amplification Factor (WAF), as the equation shown below, is a numerical value representing the ratio between the amount of data that a flash drive controller needs to write and the amount of data that the host’s flash controller writes. A better WAF, which is near to 1, guarantees better endurance and lower frequency of data written to flash memory. WAF = (Lifetime write to flash) / (Lifetime write to host) The TBW rating for a flash drive shall be derived for and verified under the following workload conditions,  Sequential Write (copy file into card)  P/E cycles incurred: erase count after writing – erase count before writing  SQFlash SD Card TBW WAF TBW SLC Ultra MLC MLC -- -- 1 GB 1.02441 57 2 GB 1.02564 114 -- -- 4 GB 1.03013 227 75 -- 8 GB 1.03226 454 151 22 16 GB 1.03226 908 302 45 32 GB 1.03060 1819 606 90 64 GB TBD -- TBD TBD 128 GB TBD -- -- TBD Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 7 of 20 Mar. 15, 2016 SQFlash Industrial SD Card 4. Pin Assignment and Block Diagram SD memory Card Pad Assignment SD Mode pin (1) Name Type Description Name SPI Mode Type Description Card Detect/ (3) CS I Chip Select (net true) Data Line[bit3] CMD PP Command/Response DI I Data In VSS1 S Supply voltage ground VSS S Supply voltage ground VDD S Supply voltage VDD S Supply voltage CLK I Clock SCLK I Clock VSS2 S Supply voltage ground VSS2 S Supply voltage ground DAT0 I/O/PP Data Line[bit0] DO O/PP Data Out DAT1 I/O/PP Data Line[bit1] RSV DAT2 I/O/PP Data Line[bit2] RSV (1) S: power supply, I:input; O:output using push-pull drivers; PP:I/O using push-pull drivers (2) The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode, as well, while they are not used. It is defined so, in order to keep compatibility to MultiMedia Cards. (3) At power up this line has a 50KOhm pull up enabled in the card. This resistor serves two functions Card detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high to select SD mode. If the host wants to select SPI mode it should drive the line low. For Card detection, the host detects that the line is pulled high. This pull-up should be disconnected by the user, during regular data transfer, with SET_CLR_CARD_DETECT (ACMD42) command. 1 CD/DAT3 2 3 4 5 6 7 8 9 (2) I/O/PP Name CID Width 128bit RCA 16bit DSR CSD 16bit 128bit SCR 64bit OCR SSR OCR 32bit 512bit 32bit (3) Description Card identification number; card individual number for identification. Mandatory Relative card address; local system address of a card, dynamically suggested by the card and approved by the host during initialization. Mandatory Driver Stage Register; to configure the card’s output drivers. Optional Card Specific Data; information about the card operation conditions. Mandatory SD Configuration Register; information about the SD Memory Card’s Special Features capabilities. Mandatory Operation condition registers. Mandatory SD Status; information about the card proprietary features. Mandatory Card Status; information about the card status. Mandatory Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 8 of 20 Mar. 15, 2016 SQFlash Industrial SD Card 5. Power Consumption Table list as below is the power consumption of ISD card with different type of flash memory. Capacity Flash Structure Read (mA) Write (mA) Idle (uA) 64GB 32GB x 2, COB (Wide Temp.) 8GB x 8, SIP (Std. Temp.) 200 200 250 (1) Data transfer mode is single channel. (2) Power Consumption may differ according to flash configuration, SDR configuration, or platform. 6. DC Characters 6.1 BUS Operating Conditions for 3.3V Signaling  Threshold level for High Voltage Range Parameter Symbol Min Max Unit Supply voltage VDD 2.7 3.6 V Output High Voltage Output Low Voltage VOH VOL 0.75*VDD 0.125*VDD V V Input High Voltage VIH 0.625*VDD VDD+0.3 V Input Low Voltage VIL VSS-0.3 0.25 *VDD V 250 ms From 0v to VDDmin. Unit V Remarks Power up time Remarks IOH=-100uA VDDMin. IOL = 100uA VDDmin  Peak Voltage and Leakage Current Parameter Peak voltage on all lines Symbol Input Leakage Current Output Leakage Current Min Max -0.3 VDD+0.3 All Inputs -10 10 All Outputs -10 10 uA uA  Threshold Level for 1.8V Signaling Parameter Supply Voltage Regulator Voltage Output High Voltage Symbol VDD VDDIO VOH Output Low Voltage VOL Input High Voltage VIH Input Low Voltage VIL Min 2.7 1.7 1.4 Max 3.6 1.95 - Unit V V V Condition Generated by VDD IOH = -2mA 0.45 V IOL = 2mA 1.27 2.00 V Vss – 0.3 0.58 V Max 2 Unit uA  Input Leakage Current for 1.8V Signaling Parameter Input Leakage Current Symbol Min -2 Remarks DAT3 pull-up isdisconnected. Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 9 of 20 Mar. 15, 2016 Industrial 8032 MLC SD3.0 Pre. v.0.3 SQFlash E2. Bus signal line load Industrial SD Card Circuitry Diagram: 6.2Bus BUS Operating Conditions for 3.3V Signaling  BUS Circuitry Diagram:  BUS Operating Conditions – Signal Line’s Load Total bus cpapcitance = Line's CHOST Bus Operating Conditions - Signal Load+ CBUS + N CCARD Parameter Total bus capa Symbol RCMD RDAT Pull-up resistance Parameter Total bus capacitance for CL Pull-up each resistance signal line Capacitance of the card for CCARD each signal pin Total bus capacitance for each signal line Maximum signal line inductance Pull-up resistance inside RDAT3 card (pin1) Caoacity Connected Card Capacitance for eachtosignal pin CC Power Line Min Max Unit 10 100 kΩ symbol Min Max Remark to prevent bus floating Unit Remark 1 card CHOST+CBUS shall not toexceed prevent30 bus kΩ pFfloating RCMD 40 10 pF 100 RDAT 10 pF 16 pF 40 nH 90 kΩ exceed 30 detection pF May be not used for card 5 10 uF 16 pF 90 kΩ May be used for card detection 5 uF To prevent inrush current CL 10 CCARD Maximum signal line inductance Pull-up resistance inside card (pin1) RDAT3 Capacity Connected to Power Line CC 10 1 card CHOST+CBUS shall To prevent inrush current nH 8 Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 10 of 20 Mar. 15, 2016 SQFlash Industrial SD Card 6.3 Power Up Time  Host needs to keep power line level less than 0.5V and more than 1ms before power ramp up. Power On or Power Cycle Followings are requirements for Power on and Power cycle to assure a reliable SD Card hard reset. (1) Voltage level shall be below 0.5V (2) Duration shall be at least 1ms. Power Supply Ramp Up The power ramp up time is defined from 0.5V threshold level up to the operating supply voltage which is stable between VDD(min.) and VDD(max.) and host can supply SDCLK. Followings are recommendation of Power ramp up: (1) Voltage of power ramp up should be monotonic as much as possible. (2) The minimum ramp up time should be 0.1ms. (3) The maximum ramp up time should be 35ms for 2.7-3.6V power supply. Power Down and Power Cycle • When the host shuts down the power, the card VDD shall be lowered to less than 0.5Volt for a minimum period of 1ms. During power down, DAT, CMD, and CLK should be disconnected or driven to logical 0 by the host to avoid a situation that the operating current is drawn through the signal lines. • If the host needs to change the operating voltage, a power cycle is required. Power cycle means the power is turned off and supplied again. Power cycle is also needed for accessing cards that are already in Inactive State. To create a power cycle the host shall follow the power down description before power up the card (i.e. the card VDD shall be once lowered to less than 0.5Volt for a minimum period of 1ms). Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 11 of 20 Mar. 15, 2016 Industrial 8032 MLC SD3.0 Pre. v.0.3 IndustrialIndustrial 8032 MLC8032 SD3.0 Pre. v.0.3Pre. v.0.3 MLC SD3.0 SQFlash 7. F. AC Characteristic F. AC Characteristic F. AC Characteristic Industrial SD Card AC Characters F1. SD Interface timing (Default) F1. SD Interface timing (Default) F1. SD Interface timing (Default) 7.1 SD Interface Timing (Default) Card Input Timing (Default Speed Card) Card Output Timing (Default Speed Mode) 10 10 Specifications subject to change without notice, contact your sales representatives for the most 10 update information. REV 0.4 Page 12 of 20 Mar. 15, 2016 SQFlash Industrial SD Card Parameter Symbol Min Max Unit Clock CLK (All values are referred to min(VIH) and max(VIL) Clock frequency Data Transfer Mode fPP 0 25 MHz Clock frequency Identification Mode fOD 0(1)/100 400 kHz Clock low time tWL 10 ns Clock high time tWH 10 ns Clock rise time tTLH 10 ns Clock fall time tTHL 10 ns Remark Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Inputs CMD, DAT (referenced to CLK) Input set-up time tISU 5 ns Input hold time tIH 5 ns Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Outputs CMD, DAT (referenced to CLK) Output Delay time during Data CL≤40 pF tODLY 0 14 ns Transfer Mode (1 card) Output Delay time during C L≤40 pF 8032 v.0.3 tODLY Industrial 0 50 MLCnsSD3.0 Pre. Identification Mode (1 card) (1) 0Hz means to stop the clock. The given minimum frequency range is for cases were continues clock is required. F2. SD Interface timing (High-speed Mode) 7.2 SD Interface Timing (High-speed Mode) Card Input Timing (High Speed Card) Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 13 of 20 Mar. 15, 2016 SQFlash Industrial SD Card Card Output Timing (Default Speed Mode) Parameter Symbol Min Max Unit Clock CLK (All values are referred to min(VIH) and max(VIL) Clock frequency Data Transfer fPP 0 50 MHz Mode Clock low time tWL 7 ns Clock high time tWH 7 ns Clock rise time tTLH Clock fall time tTHL 3 ns 3 ns 12 Inputs CMD, DAT (referenced to CLK) Input set-up time tISU 6 ns Input hold time tIH 2 ns Remark Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Outputs CMD, DAT (referenced to CLK) Output Delay time during Data tODLY 14 ns Transfer Mode Output Hold time TOH 2.5 50 ns Total System capacitance of CL 40 pF each line¹ (1) In order to satisfy severe timing, host shall drive only one card. CL≤40 pF (1 card) CL≤15 pF (1 card) CL≤15 pF (1 card) Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 14 of 20 Mar. 15, 2016 Industrial 8032 MLC SD3.0 Pre. v.0.3 SQFlash Industrial SD Card Industrial 8032 MLC SD3.0 Pre. v.0.3 F3. SD Interface timing (SDR12, SDR25 and SDR50 Modes) 7.3 SD InterfaceF3. timing (SDR12, SDR25 Modes) SD Interface timing (SDR12, and SDR25SDR50 and SDR50 Modes) Input: Input:  Input: SymbolSymbol Min Min Max Max Unit Unit tCLK 4.80 tCR, tCF tCLK tCR, tCF Clock DutySymbol Clock Duty tCLK 30 4.80 - 0.2* tCLK ns 0 0.975V 0.2 * tCLK ns tCR, tCF < 2.00ns (max.) at 100MHz, CCARD=10pF 30 Min 70 Max% Unit Remark Clock Signal Timing 70 % 4.80 ns 208MHz (Max.), Between rising edge, VCT= 0.975V 0.2*Clock tCLK Signal ns Timing tCR, tCF < 2.00ns (max.) at 100MHz, CCARD=10pF tCR, tCF - Clock Duty 30  Remark Remark ns 208MHz (Max.), Between rising edge, VCT= 0.975V Between rising edge, VCT= ns 208MHz tCR, tCF =10.0ns, CL=30pF, using driver Type B, for Unit Remark SDR50 ns tCLK>=10.0ns, CL=30pF, using driver Type B, for SDR50 tCLK>=20.0ns, CL=40pF, using driver Type B, for tCLK>=20.0ns, CL=40pF, using driver Type B, for SDR25 ns SDR25 and and SDR12,SDR12, ns time the tODLY (min.),(min.), CL=15pF CL=15pF HoldHold time atatthe tODLY Output Timing of Fixed Data Window Output Timing of Fixed Data Window Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 15 of 20 Mar. 15, 2016 14 F4. SD Interface timing (DDR50 Modes) SQFlash Industrial 8032 MLC SD3.0 Industrial Pre. v.0.3 SD Card 7.4 SD Interface timing (DDR50 Modes) F4. SD Interface timing (DDR50 Modes) Symbol Min Max Unit Remark tCLK 20 - ns 50MHz (Max.), Between rising edge Symbol tCR, tCF - Min 0.2* Max tCLK tCLK 20 Clock Duty 45 55 tCR, Symbol tCF - Min0.2 * tCLK Max Clock Duty 45 55 tCLK 20 tCR, tCF - 0.2* tCLK Clock Duty 45 55 Unit ns tCR, tCF < 4.00nsRemark (max.) at 50MHz, CCARD=10pF ns 50MHz (Max.), Between rising edge nsUnit tCR, tCF < 4.00ns (max.) at 50MHz, CCARD=10pF Remark %nsClock Signal Timing 50MHz (Max.), Between rising edge % Clock Signal Timing ns tCR, tCF < 4.00ns (max.) at 50MHz, CCARD=10pF % Clock Signal Timing Timing Diagram DAT Inputs / Outputs Referenced to CLK in DDR50 Mode 16 16 Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 16 of 20 Mar. 15, 2016 SQFlash Industrial SD Card Parameter Symbol Min Max Input CMD (referenced to CLK rising edge) Unit Input set-up time tISU 6 - ns Input hold time tIH 0.8 - ns Output CMD (referenced to CLK rising edge) Output Delay time during Data tODLY 13.7 Transfer Mode Output Hold time tOH 1.5 - ns ns Remark Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Ccard≤ 30 pF (1 card) Ccard≤ 10 pF (1 card) Inputs DAT (referenced to CLK rising and falling edges) Input set-up time tISU2X 3 - ns Input hold time tIH2X 0.8 - ns Outputs CMD, DAT (referenced to CLK) Output Delay time during Data tODLY2X 7.0 Transfer Mode Output Hold time tOH2X 1.5 - ns ns Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) CL≤25 pF (1 card) CL≥15 pF (1 card) Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 17 of 20 Mar. 15, 2016 Industrial 8032 MLC SD3.0 Pre. v.0.3 SQFlash G. Dimension 8. Industrial SD Card Dimensions Dimensions of A SD Card (Bottom View, DIN) Dimensions of A SD Card (Bottom View, DIN) 18 Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 18 of 20 Mar. 15, 2016 SQFlash Industrial SD Card Appendix: Part Number Table SLC Product Advantech PN SQF I-SD C6 SLC 128M (0~70°C) SQF-ISDS1-128M-21C SQF I-SD C6 SLC 256M (0~70°C) SQF-ISDS1-256M-21C SQF I-SD C6 SLC 512M (0~70°C) SQF-ISDS1-512M-21C SQF I-SD C6 SLC 1G (0~70°C) SQF-ISDS1-1G-21C SQF I-SD C6 SLC 2G (0~70°C) SQF-ISDS1-2G-21C SQF I-SD C6 SLC 4G (0~70°C) SQF-ISDS1-4G-21C SQF I-SD C10 SLC 8G (0~70°C) SQF-ISDS1-8G-21C SQF I-SD C10 SLC 16G (0~70°C) SQF-ISDS1-16G-21C SQF I-SD C10 SLC 32G (0~70°C) SQF-ISDS1-32G-21C SQF I-SD C6 SLC 128M (-40~85°C) SQF-ISDS1-128M-21E SQF I-SD C6 SLC 256M (-40~85°C) SQF-ISDS1-256M-21E SQF I-SD C6 SLC 512M (-40~85°C) SQF-ISDS1-512M-21E SQF I-SD C6 SLC 1G (-40~85°C) SQF-ISDS1-1G-21E SQF I-SD C6 SLC 2G (-40~85°C) SQF-ISDS1-2G-21E SQF I-SD C6 SLC 4G (-40~85°C) SQF-ISDS1-4G-21E SQF I-SD C10 SLC 8G (-40~85°C) SQF-ISDS1-8G-21E SQF I-SD C10 SLC 16G (-40~85°C) SQF-ISDS1-16G-21E SQF I-SD C10 SLC 32G (-40~85°C) SQF-ISDS1-32G-21E Ultra MLC Product Advantech PN SQF I-SD UHS-I UMLC 4G (0~70°C) SQF-ISDU1-4G-21C SQF I-SD UHS-I UMLC 8G (0~70°C) SQF-ISDU1-8G-21C SQF I-SD UHS-I UMLC 16G (0~70°C) SQF-ISDU1-16G-21C SQF I-SD UHS-I UMLC 32G (0~70°C) SQF-ISDU1-32G-21C SQF I-SD UHS-I UMLC 64G (0~70°C) SQF-ISDU1-64G-21C SQF I-SD UHS-I UMLC 4G (-40~85°C) SQF-ISDU1-4G-21E SQF I-SD UHS-I UMLC 8G (-40~85°C) SQF-ISDU1-8G-21E SQF I-SD UHS-I UMLC 16G (-40~85°C) SQF-ISDU1-16G-21E SQF I-SD UHS-I UMLC 32G (-40~85°C) SQF-ISDU1-32G-21E SQF I-SD UHS-I UMLC 64G (-40~85°C) SQF-ISDU1-64G-21E Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 19 of 20 Mar. 15, 2016 SQFlash Industrial SD Card MLC Product Advantech PN SQF I-SD UHS-I MLC 8G (0~70°C) SQF-ISDM1-8G-21C SQF I-SD UHS-I MLC 16G (0~70°C) SQF-ISDM1-16G-21C SQF I-SD UHS-I MLC 32G (0~70°C) SQF-ISDM1-32G-21C SQF I-SD UHS-I MLC 64G (0~70°C) SQF-ISDM1-64G-21C SQF I-SD UHS-I MLC 128G (0~70°C) SQF-ISDM1-128G-21C SQF I-SD UHS-I MLC 8G (-40~85°C) SQF-ISDM1-8G-21E SQF I-SD UHS-I MLC 16G (-40~85°C) SQF-ISDM1-16G-21E SQF I-SD UHS-I MLC 32G (-40~85°C) SQF-ISDM1-32G-21E SQF I-SD UHS-I MLC 64G (-40~85°C) SQF-ISDM1-64G-21E SQF I-SD UHS-I MLC 128G (-40~85°C) SQF-ISDM1-128G-21E Specifications subject to change without notice, contact your sales representatives for the most update information. REV 0.4 Page 20 of 20 Mar. 15, 2016