JANTX1N6640US

Switching Diodes 1N6638 Series 1N6638, 1N6639, 1N6640, 1N6641, 1N6642, 1N6643, 1N6638U & US, 1N6639U & US, 1N6640U & US, 1N6641U & US 1N6642U & US, 1N6643U & US Features • Available in JAN, JANS, JANTX, JANTXV per MIL‐PRF‐19500/578 & /609 • Switching Diodes • Non‐Cavity Glass Plackage • Category I Metallurgically Bonded Maximum Ratings Operating Temperature: -65°C to +175°C Storage Temperature: -65°C to +175°C Operating Current: 300mA Thermal Resistance: (RӨJEC): U & US 40 °C/W maximum at L = 0” See Figure 6 Derating: See Figure 5 Surge Current: IFSM = 2.5A, half sine wave, PW = 8.3ms (RӨJL): Leaded 150 °C/W maximum at L = .375” See Figure 7 Thermal Impedance: (ZӨJX): 25 °C/W maximum Electrical Specifications @ TA = + 25 ºC ( Unless Otherwise Specified ) VBR @ IR VWRM VFR / tfr @ IF = 200 mA CT1 VR=0 V CT2 VR=1.5 V TYPES V(pk) μA V(pk) 1N6638, U & US 150 100 125 1N6639, U & US 100 10 1N6640, U & US 75 1N6641, U & US IR2 VR=20V IR3 VR=20V IR4 VR = VRWM TA = 150°C V(pk) tfr ns pF pF ns nA dc nA dc μA dc μA dc 5.0 20 2.5 2.0 4.5 35 500 50 100 75 5.0 10 2.5 ‐ 4.0 ‐ 100 ‐ 90 10 50 5.0 10 2.5 ‐ 4.0 ‐ 100 ‐ 90 75 10 50 5.0 10 3.0 ‐ 5.0 ‐ 100 ‐ 90 1N6642, U & US 100 100 75 5.0 20 5.0 2.8 5.0 25 500 50 100 1N6643, U & US 75 100 50 5.0 20 5.0 2.8 6.0 50 500 75 100 VF @ IF TYPES 1N6638, U & US VFR trr IR1 IR = 10mA VR=VRWM IF = 10mA TA = 150°C VF2 @ IF TA = -55°C IF V dc (min) V dc (max) V dc (max) mA (pulsed) ‐ ‐ 1.1 0.8 1.2 ‐ 200 10 1N6639, U & US ‐ 1.2 1.3 500 1N6640, U & US 0.54 0.76 0.82 0.87 0.62 0.86 0.92 1.0 ‐ ‐ 1.1 1 50 100 200 1N6641, U & US ‐ 1.1 1.2 200 1N6642, U & US ‐ ‐ 0.8 1.2 ‐ 1.2 10 100 1N6643, U & US ‐ ‐ 0.8 1.2 ‐ 1.4 10 100 Revision Date: 2/5/2013 1 Switching Diodes 1N6638 Series Outline Drawing LEADED DESIGN DATA CASE: D‐5D, Hermetically sealed glass case, per MIL‐PRF‐19500/578 & /609 LEAD FINISH: Tin/Lead LEAD MATERIAL: Copper clad steel POLARITY: Cathode end is banded. PACKAGE WEIGHT: 0.150g U & US DESIGN DATA CASE: D‐5D, Hermetically sealed glass case, per MIL‐PRF‐19500/578 & /609 LEAD FINISH: Tin/Lead END CAP MATERIAL (U, US): Copper POLARITY: Cathode end is banded. PACKAGE WEIGHT: 0.095g MOUNTING SURFACE SELECTION: The Axial Coefficient of Expansion (COE) of this device is approximately +4PPM/°C. The COE of the Mounting Surface System should be selected to provide a suitable match with this device. NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Dimension BD shall be measured at the largest diameter. 3. The specified lead diameter applies in the zone between .050 inch (1.27 mm) from the diode body to the end of the lead. Outside of this zone lead shall not exceed BD. 4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology. 5. U‐suffix parts are structurally identical to the US‐suffix parts. 2 TEL: 603-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics Revision Date: 2/5/2013 Switching Diodes 1N6638 Series TEL: 603-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics Revision Date: 2/5/2013 3 Switching Diodes 1N6638 Series NOTES: 1. All devices are capable of operating at ≤ TJ specified on this curve. Any parallel line to this curve will intersect the appropriate current for the desired maximum TJ allowed. 2. Derate design curve constrained by the maximum junction temperatures and current rating specified. (See 1.3.) 3. Derate design curve chosen at TJ ≤ 150°C, where the maximum temperature of electrical test is performed. 4. Derate design curves chosen at TJ ≤ 125°C, and 110°C to show current rating where most users want to limit TJ intheir application. 4 TEL: 603-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics Revision Date: 2/5/2013 Switching Diodes 1N6638 Series TEL: 603-641-SEMI (7364) • metelics-sales@aeroflex.com • www.aeroflex.com/metelics Revision Date: 2/5/2013 5 Suggested Minimum Footprints D-5D (D-BODY) U, US DIODES NOTES: 1. Dimensions are in inches / mm. 2. The dimensions listed will match the device terminals based on worst-case package outline drawings and assuming accuracy of device placements is within 0.005 inches. Footprints also provide for solder filets at the outer ends of the device at least as wide as the terminals. 3. F designates recommendation to fill unused area with an extended copper pad in order to reduce the CTE difference between the device and the PC board. The extended area may be3 coated with a solder mask. the width of F depends upon your PCB design rules. Aeroflex / Metelics, Inc. 975 Stewart Drive, Sunnyvale, CA 94085 Tel: (408) 737-8181 Fax: (408) 733-7645 ISO 9001:2008 certified companies 54 Grenier Field Road, Londonderry, NH 03053 Tel: (603) 641-3800 Fax: (603)-641-3500 Sales: 888-641-SEMI (7364) Hi-Rel Components 9 Hampshire Street, Lawrence, MA 01840 Tel: (603) 641-3800 Fax: (978) 683-3264 www.aeroflex.com/MetelicsHRC www.aeroflex.com/metelics metelics-sales@aeroflex.com Aeroflex / Metelics, Inc. reserves the right to make changes to any products and services herein at any time without notice. Consult Aeroflex or an authorized sales representative to verify that the information in this data sheet is current before using this product. Aeroflex does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use of a product or service from Aeroflex convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual rights of Aeroflex or of third parties. Copyright 2009-2013 Aeroflex / Metelics. All rights reserved. Revision Date: 2/5/2013 Our passion for performance is defined by three attributes represented by these three icons: solution-minded, performance-driven and customer-focused.