MADP-017015-13140G

SURMOUNT™ 15 µm PIN Diode MAPD-017015 & MAPD-030015 Rev. V9 Features • • • • • • • • Case Style ODS 1314 0603 Outline Surface Mount 15 µm I-Region Length Devices No Wirebonds Required Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling Description This device is a silicon, glass PIN diode surmount chip fabricated with a MACOM patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. Chip Dimensions1,2,3 Applications These packageless devices are suitable for usage in moderate incident power, ≤50 dBm/C.W. or where the peak power is ≤75 dBm, pulse width is ≤1 µs, and duty cycle is ≤0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts. Ordering Information 1 MADP-017015-13140G 100 piece gel pack MADP-017015-13140P 3000 piece reel MADP-030015-13140G 100 piece gel pack MADP-030015-13140P 3000 piece reel DIM. INCHES MM Min. Max. Min. Max. A 0.060 0.061 1.535 1.55 B 0.031 0.032 0.785 0.800 C 0.004 0.005 0.115 0.135 D 0.019 0.021 0.475 0.525 E 0.019 0.021 0.475 0.525 F 0.019 0.021 0.475 0.525 G 0.029 0.031 0.725 0.775 1. Backside metal: 0.1 microns thick. 2. Yellow area with hatch lines indicate backside ohmic gold contacts. 3. Both devices have same outline dimensions ( A to G). * Restrictions on Hazardous Substances, compliant to current RoHS EU directive. MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0007035 SURMOUNT™ 15 µm PIN Diode MAPD-017015 & MAPD-030015 Rev. V9 Electrical Specifications @ TA = 25°C (unless otherwise noted) MADP-017015 Parameter 4. 5. 6. 7. Conditions MADP-030015 Units Min. Typ. Max. Min. Typ. Max. Capacitance (CT) -40 V, 1 MHz 4,6 -40 V, 1 GHz 4,6 pF — 0.32 0.31 0.38 — — 0.79 0.78 0.85 — Capacitance (CT) @ 85°C -40 V, 1 GHz 4,6 pF — 0.29 — — 0.76 — Resistance (RS) +10 mA, 1 GHz 5,6 +70 mA, 1 GHz 5,6 Ω — 0.72 0.51 — — 0.49 0.38 — Resistance (RS) @ 85°C +10 mA, 1 GHz 5,6 +70 mA, 1 GHz 5,6 Ω — 1.08 0.84 — — 0.82 0.69 — Forward Voltage (VF) +10 mA V — 0.74 0.90 — 0.72 0.90 Reverse Leakage Current (IR) -115 V A — — 10 — — 10 Third Order Intermodulation Product (IM3) F1= 1800 MHz F2 = 1810 MHz Input Power = 0 dBm I bias = +70 mA dBc — -36.8 — — -37.0 — Thermal Resistance 7 (θ) — °C/W — 30 — — 13 — Lifetime (TL) +10 mA / -6 mA ( 50% - 90% V ) µs — 1.3 — — 1.6 — Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance). Rs and CT are measured on an HP4291A Impedance Analyzer with the die mounted in an ODS-186 package. Theta (θ) is measured with the die mounted in an ODS-186 package. Typical Spice Parameters @ TA = +25°C Spice Parameter N RS IS IK BV IBV Ct CJO VJ M FC Cpar_Cj Units - W A (mA) (Volts) (mA) (pF) (pF) (Volts) - - (F) MADP-017015-1314 1.1 1.2 9.8E-15 14.7 145 10 0.46 0.10 0.29 0.50 0.34 3.5E-13 MADP-030015-1314 1.1 1.1 8.5E-15 13.9 145 10 1.12 0.29 0.18 0.50 0.19 8.2E-13 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0007035 SURMOUNT™ 15 µm PIN Diode MAPD-017015 & MAPD-030015 Rev. V9 Absolute Maximum Ratings8 @ TA = +25°C (unless otherwise specified) Parameter Absolute Maximum Forward Current 500 mA Reverse Voltage 115 V Operating Temperature -55 °C to +125 °C Storage Temperature -55 °C to +150 °C Junction Temperature +175 °C CW Incident Power 50 dBm Mounting Temperature +280 °C for 30 seconds 8. Exceeding these limits may cause in permanent damage. Handling Procedures All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Techniques Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn, or RoHS compliant solders is recommended. For applications where the average power is ~1 W, conductive silver epoxy may also be used. Cure per manufacturers recommended time and temperature, typically 1 hour at 150 °C. When soldering these devices to a hard substrate, hot gas die bonding is preferred. A vacuum tip pick-up tool and a force of 60 to 100 grams applied to the top surface of the device is recommended. When soldering to soft substrates, such as Duroid, it is recommended to use a soft solder at the circuit board to mounting pad interface. Position the die so that its mounting pads are aligned with the circuit board mounting pads. While applying a downward force perpendicular to the top surface of the die, apply heat near the circuit trace and diode mounting pad. The solder connection to the two pads should not be made one at a time as this will create unequal heat flow and thermal stress to the part. Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. Typical re-flow profiles for Sn60/Pb40 and RoHS compliant solders are provided in Application Note M538, “Surface Mounting Instructions“ and can viewed on the MACOM website @ www.macom.com 3 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0007035 SURMOUNT™ 15 µm PIN Diode MAPD-017015 & MAPD-030015 Rev. V9 Typical Performance @ TA = +25°C Series Resistance (Rs) vs. Forward Current 10.00 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 MADP-030015 Rs @ 1GHz (ohm) Ct @ 1GHz (pF) Total Capacitance (Ct) vs. Reverse Voltage MADP-017015 0 10 20 30 MADP-017015 1.00 MADP-030015 0.10 0.001 40 0.01 Current (A) Voltage (V) Total Capacitance (Ct) vs. Frequency Series Inductance (Ls) vs. Frequency 1.2 Ls @ 5, 10, 20mA (nH) 10V 40V 0.8 Ct (pF) MADP-30015 0V 1 0.6 0V 10V 40V 0.4 0.2 MADP-17015 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0.2 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 1.8 MADP-17015 MADP-30015 0 0.2 0.4 Frequency (GHz) 10mA 20mA 0.6 Ls @ 1GHz (nH) Rs (ohm) 5mA 0.8 5m A 10mA 20mA 0.4 MADP-030015 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Frequency (GHz) 0.8 1 1.2 1.4 1.6 1.8 Series Inductance (Ls) vs. Forward Current MADP-017015 1.0 0.6 Frequency (GHz) Series Resistance (Rs) vs. Frequency 1.2 0.1 1.4 1.6 1.8 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 MADP-017015 MADP-030015 0 0.02 0.04 0.06 0.08 0.1 Current (A) 4 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0007035 SURMOUNT™ 15 µm PIN Diode MAPD-017015 & MAPD-030015 Rev. V9 MACOM Technology Solutions Inc. (“MACOM”). All rights reserved. These materials are provided in connection with MACOM’s products as a service to its customers and may be used for informational purposes only. Except as provided in its Terms and Conditions of Sale or any separate agreement, MACOM assumes no liability or responsibility whatsoever, including for (i) errors or omissions in these materials; (ii) failure to update these materials; or (iii) conflicts or incompatibilities arising from future changes to specifications and product descriptions, which MACOM may make at any time, without notice. These materials grant no license, express or implied, to any intellectual property rights. THESE MATERIALS ARE PROVIDED "AS IS" WITH NO WARRANTY OR LIABILITY, EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHT, ACCURACY OR COMPLETENESS, OR SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES WHICH MAY RESULT FROM USE OF THESE MATERIALS. MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale. 5 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0007035