MASW-002102-13580G

MASW-002102-13580 MASW-003102-13590 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network Rev. V5 MASW-002102-13580 Features         Broad Bandwidth Specified up to 18 GHz Usable up to 26 GHz Integrated Bias Network Low Insertion Loss / High Isolation Rugged Fully Monolithic Glass Encapsulate Construction RoHS Compliant* and 260°C Reflow Compatible Description The MASW-002102-13580 and MASW-003102-13590 devices are SP2T and SP3T broad band switches with integrated bias networks utilizing M/A-COM Technology Solutions HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Large bond pads facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders or electrically conductive silver epoxy. Parameter Absolute Maximum Operating Temperature -65oC to +125oC Storage Temperature -65oC to +150oC Junction Temperature +175oC Applied Reverse Voltage 50V RF Incident Power +33dBm C.W. Bias Current +25°C ±20mA Max. operating conditions for a combination of RF power, D.C. bias and temperature: +33dBm CW @ 15mA (per diode) @+85°C 1 MASW-003102-13590 Yellow areas denote wire bond pads * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-002102-13580 MASW-003102-13590 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network Rev. V5 MASW-002102-13580 (SPDT) Electrical Specifications @ TAMB = +25oC, 20mA Bias current Parameter Frequency Insertion Loss Isolation Input Return Loss Switching Speed 1 Minimum Nominal Maximum Units 2 GHz 1.5 1.8 dB 6 GHz 0.70 1.0 dB 12 GHz 0.90 1.2 dB 18 GHz 1.2 1.8 dB 2 GHz 55 60 dB 6 GHz 47 50 dB 12 GHz 40 45 dB 18 GHz 36 40 dB 2 GHz 14 dB 6 GHz 15 dB 12 GHz 15 dB 18 GHz - 13.0 50 dB ns MASW-003102-13590 (SP3T) Electrical Specifications @ TAMB = +25oC, 20mA Bias current Parameter Insertion Loss Isolation Input Return Loss Switching Speed1 Note: Frequency 2 GHz 6 GHz 12 GHz 18 GHz 2 GHz 6 GHz 12 GHz 18 GHz 2 GHz 6 GHz 12 GHz 18 GHz - Minimum Nominal Maximum Units 2.0 1.1 1.3 1.9 54 47 40 36 1.6 0.8 1.0 1.3 59 50 45 40 14 15 16 14 dB dB dB dB dB dB dB dB dB dB dB dB 50 ns 1. Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC output spiking network, R = 50 – 200Ω , C = 390 – 560pF. 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-002102-13580 MASW-003102-13590 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network Rev. V5 Typical RF Performance at TA = +25°C, 20mA Bias Current 0 -10 -20 -30 -40 -50 -60 -70 ISOLATION vs FREQUENCY MASW-003102-13590 ISOLATION, dB ISOLATION, dB ISOLATION vs FREQUENCY MASW-002102-13580 0 2 4 6 0 -10 -20 -30 -40 -50 -60 -70 8 10 12 14 16 18 20 22 24 26 0 2 4 6 FREQUENCY, GHz FREQUENCY, GHz INSERTION LOSS vs FREQUENCY MASW-003102-13590 INSERTION LOSS, dB INSERTION LOSS, dB INSERTION LOSS vs FREQUENCY MASW-002102-13580 2 0 -2 -4 -6 -8 0 2 4 6 8 10 12 14 16 18 20 22 24 26 2 0 -2 -4 -6 -8 8 10 12 14 16 18 20 22 24 26 0 2 4 FREQUENCY, GHz 6 8 10 12 14 16 18 20 22 24 26 FREQUENCY, GHz RETURN LOSS, dB RETURN LOSS vs FREQUENCY MASW-003102-13590 0 -5 -10 -15 -20 -25 -30 -35 -40 0 2 4 6 8 10 12 14 16 18 20 22 24 26 FREQUENCY, GHz 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-002102-13580 MASW-003102-13590 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network Rev. V5 MASW-002102-13580 Junction Temperature vs. Incident Power at 8 GHz 140 5 mA 120 Series Diode_5mA Series Diode_10mA Series Diode_20mA Tjunction ( Deg. C ) 100 Series Diode_40mA 10 mA 80 20 mA 60 40 mA 40 20 10.00 15.00 20.00 25.00 30.00 35.00 C.W. Incident Power ( dBm ) MASW-002102-13580 Compression Power vs. Incident Power at 8 GHz 0.80 0.70 Series Diode_5mA Series Diode_10mA Series Diode_20mA Compression Power ( dB ) 0.60 5 mA Series Diode_40mA 0.50 10 mA 0.40 20 mA 0.30 40 mA 0.20 0.10 0.00 10.00 15.00 20.00 25.00 30.00 35.00 C.W. Incident Power ( dBm ) 4 Note: The PIN diodes in the MASW-002102-13580 and the MASW-003102-13590 have the same electrical characteristics and will have similar performance. ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-002102-13580 MASW-003102-13590 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network Rev. V5 Operation of the MASW-002102-13580 and MASW-003102-13590 Operation of the MASW-002102-13580 and MASW-003102-13590 PIN diode switches is achieved by simultaneous application of DC currents to the bias pads. The required levels for the different states are shown in the tables below. The on-chip pull-up resistor @ J1, shown in the schematic below, has a value of 40Ω - 60Ω and must be taken into consideration when defining drive circuitry. Driver Connections MASW-002102-13580 Control Level IDC @ Condition of RF Output Condition of RF Output J4 J5 J1 - J2 J1 - J3 -20mA +20mA Low Loss Isolation +20mA -20mA Isolation Low Loss Equivalent Circuit MASW-002102-13580 Driver Connections MASW-003102-13590 Condition Condition Condition of of of RF Output RF Output RF Output Control Level IDC @ J5 J6 J7 J1 - J2 J1 - J3 J1 - J4 -20mA +20mA +20mA Low Loss Isolation Isolation +20 mA -20mA +20mA Isolation Low Loss Isolation +20mA +20mA -20mA Isolation Isolation Low Loss Equivalent Circuit MASW-003102-13590 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-002102-13580 MASW-003102-13590 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network Rev. V5 Wire/Ribbon and Die Attachment Recommendations Wire Bonding Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as short and straight as possible. Chip Mounting The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive epoxy. Mounting surface must be clean and flat. *Note: This device utilizes a process step designed to have minimal to non-existent burring around the perimeter of the die. Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not be used. Epoxy Die Attachment: A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer’s schedule (typically 125150oC). MASW-002102-13580 Chip Outline Drawing1,2 INCHES DIM MILLIMETERS MIN MAX MIN MAX A 0.066 0.070 1.680 1.780 B 0.048 0.052 1.230 1.330 C 0.004 0.006 0.100 0.150 D 0.004 0.006 0.090 0.140 E 0.012 0.013 0.292 0.317 F 0.029 0.030 0.735 0.760 G 0.030 0.031 0.766 0.791 H 0.029 0.030 0.732 0.757 J 0.005 REF. 0.129 REF. K 0.005 REF. 0.129 REF. Notes: 6 1. 2. Topside and backside metallization is gold, 2.5um thick typical. Yellow areas indicate wire bonding pads ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MASW-002102-13580 MASW-003102-13590 HMIC™ Silicon PIN Diode Switches with Integrated Bias Network Rev. V5 MASW-003102-13590 Chip Outline Drawing1,2 INCHES DIM MILLIMETERS MIN MAX MIN MAX A 0.0697 0,0736 1.770 1.870 B 0.0693 0.0732 1.760 1.860 C 0.0039 0.0059 0.100 0.150 D 0.0310 0.0319 0.787 0.812 E 0.0289 0.0299 0.734 0.759 F 0.0055 0.0075 0.140 0.190 G 0.0035 0.0055 0.089 0.139 H 0.0044 0.0064 0.113 0.163 J 0.0338 0.0358 0.859 0.909 K 0.0632 0.0652 1.610 1.660 L 0.0660 0.0680 1.680 1.730 M 0.0051 REF. 0.1290 REF. N 0.0046 REF. 0.1180 REF. Notes: 1. 2. Topside and backside metallization is gold , 2.5um thick typical. Yellow areas indicate wire bonding pads Ordering Information Part Number Package MASW-002102-13580G Gel Pack (25 per) MASW-002102-13590W Waffle Pack (25 per) MASW-003102-13590G Gel Pack (25 Per) MASW-003102-13590W Waffle Pack (25 Per) 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.