AIC1117A-25GYTR

AIC1117A 1A Low Dropout Positive Regulator   FEATURES DESCRIPTION The AIC1117A is a low dropout, three terminals  Dropout Voltage 1.3V at 1A Output Current. Fast Transient Response.  Line Regulation, typical at 0.015%. to 1A. The device is available in an adjustable  Load Regulation, typical at 0.1% Current Limiting and Thermal Protection. Adjustable Output Voltage or Fixed at 1.8V, 2.5V and 3.3V. Standard 3-Pin Power Packages. version and fixed output voltage of 1.8V, 2.5V      APPLICATIONS and 3.3V. Dropout voltage of maximum of 1.5V is guaranteed at 1A output current. The quality of low dropout voltage and fast transient response make this device ideal for low voltage microprocessor applications. The AIC1117A requires output capacitance of a  Active SCSI Terminators.  Post Regulators for Switching Supplies.  Battery Chargers.  PC Add-On Card.  regulator designed to provide output current up minimum of 10μF for stability. Built-in output current limiting and thermal limiting provide maximal protection to the AIC1117A against fault conditions. TYPICAL APPLICATION CIRCUIT 3 VIN 5V AIC1117A 1 ADJ C1 + 10F 2 VOUT 3.3V RF1 125 + 1% C2 RF2 10F 205 (Note1) 1% VREF VREF=VOUT - VADJ=1.25V (typ.) VOUT=VREF x (1+RF2/RF1)+ IADJ x RF2 IADJ=55A (typ.) (1) C1 needed if device is far away from filter capacitors. (2) C2 required for stability. Adjustable Voltage Regulator 3 VIN 5V AIC1117A-33 2 VOUT 3.3V 1 C1 + 10F + C2 10F (Note1) GND Fixed Voltage Regulator Analog Integrations Corporation Si-Soft Research Center DS-1117AG-02 20131018 st 3A1, 1 Li-Hsin 1 Rd., Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw 1 AIC1117A  ORDERING INFORMATION AIC1117A-XXXXXX PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE BG: BAG (for SOT-223) PACKAGING TYPE E: TO-252 M: TO-263 T: TO-220 Y: SOT-223 P: Lead Free Commercial G: Green Package OUTPUT VOLTAGE DEFAULT:ADJUSTABLE 18: 1.8V 25: 2.5V 33: 3.3V TO-252 TOP VIEW 1: ADJ (GND) 2: VOUT (TAB) 3: VIN 1 2 3 1 2 3 1 2 3 TO-263 TOP VIEW 1: ADJ (GND) 2: VOUT (TAB) 3: VIN TO-220 FRONT VIEW 1: ADJ (GND) 2: VOUT (TAB) 3: VIN Example: AIC1117A-25GETR  2.5V version in TO-252 Green Package & Taping & Reel Packing Type TOP VIEW AIC1117A-25PYTR  2.5V version in SOT-223 Lead Free Package & Taping & Reel Packing Type  SOT-223 1: ADJ (GND) 2: VOUT (TAB) 3: VIN 1 2 3 SOT-223 Marking Part No. AIC1117A AIC1117A-18 AIC1117A-25 AIC1117A-33 PY BS17P BS18P BS25P BS33P GY BS17G BS18G BS25G BS33G 2 AIC1117A  ABSOLUTE MAXIMUM RATINGS VIN pin to ADJ/GND pin 7V Operating Temperature Range –40C to 85C Storage Temperature Range –65C to 150C Maximum Junction Temperature 125C Lead Temperature (Soldering, 10 sec) 260C Thermal Resistance (Junction to Case) TO-220 3C /W TO-263 3C /W SOT-223 15C /W TO-252 12.5C /W 50C/W 60C/W 155C/W 100C/W Thermal Resistance (Junction to Ambient) TO-220 (Assume no ambient airflow, no heatsink) TO-263 SOT-223 TO-252 Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.  TEST CIRCUIT  ELECTRICAL CHARACTERISTICS Refer to TYPICAL APPLICATION CIRCUIT. (VIN=5V, TA=25C, IO=10mA, unless otherwise specified) (Note2) PARAMETER TEST CONDITIONS MIN. TYP. MAX. 1.238 1.25 1.262 1.225 1.25 1.275 AIC1117A-18, VIN=3.3V 1.78 1.80 1.82 AIC1117A-25, VIN=5V 2.47 2.50 2.53 AIC1117A-33, VIN=5V 3.26 3.30 3.33 TJ=25C Reference Voltage 0CTJ125C 2.65VVIN7V UNIT V 10mAIO1A Output Voltage V AIC1117A 0CTJ125C 2.65VVIN7V 0.98VOUT VOUT 1.02VOUT 10mAIO1A 3 AIC1117A  ELECTRICAL CHARACTERISTICS (Continued) PARAMETER Line Regulation Load Regulation Dropout Voltage TEST CONDITIONS TYP. MAX. 2.65VIN7V, TJ=25C 0.015 0.2 0CTJ125C 0.035 0.2 TJ=25C, IO=10mA ~1A 0.1 0.3 0CTJ125C 0.2 0.4 VOUT, VREF=1%, IO=1A 1.3 1.5 Current Limit Adjusted Pin Current (IADJ) Adjusted Pin Current Change (IADJ) 1 2.65VIN7V 10mAIO1A 2.65VIN7V 10mAIO1A IO=0.5A Temperature Stability MIN. 0CTJ125C UNIT %VOUT %VOUT V A 55 120 A 0.2 5 A 0.5 % VOUT Minimum Load Current ( Adj. ) 5 10 mA Quiescent Current ( Fixed Version) 10 14 mA RMS Output Noise (% of VOUT) 10Hz  f  10KHz 0.003 %VOUT 120Hz input ripple 60 72 dB COUT=25F Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic capacitor is not suggested. Note 2: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). Ripple Rejection Ratio 4 AIC1117A TYPICAL PERFORMANCE CHARACTERISTICS Output Voltage (mV, AC) Output Voltage (V, AC) 0.1 0.05 0 -0.05 VIN=5V CIN=1F COUT=10F (Tantalum) VOUT=3.3V 0.4A 0.1A 40 80 120 0 --50 COUT=10F (Tantalum) VOUT=3.3V 160 7.0 6.0 0 200 10 20 30 40 50 Time (S) Time (S) Fig. 1 Load Transient Response Fig. 2 Line Transient Response 1.26 1.24 1.22 1.20 1.18 1.16 200 0 400 600 800 1000 Minimum Operating Current (mA) Minimum Differential Voltage (V) 0 50 --100 Input Voltage (V) Load Current -0.1 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0 1 Output Current (mA) Fig. 3 2 3 4 5 Differential Voltage (V) Dropout Voltage (VOUT=3.3V) Fig. 4 Minimum Operating Current 5 Minimum Load Current (mA)  TA=125C 4 TA=25C 3 2 TA=0C 1 0 1 2 3 4 5 6 7 8 9 Input/Output Differential (V) Fig. 5 Minimum Load Current (Adjustable Version) 5 AIC1117A  BLOCK DIAGRAM VIN + GM Current Amp. - VREF + 1.25V Thermal Limit Current Limit 55A VOUT For fixed voltage device ADJ  GND PIN DESCRIPTIONS ADJ PIN - Providing VREF=1.25V (typ.) for adjustable VOUT. VREF=VOUT-VADJ and IADJ=55A (typ.) (GND PIN- Power ground.) VOUT PIN - Adjustable output voltage. VIN PIN Power Input. - 6 AIC1117A  APPLICATION INFORMATION mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 10F with a 10F aluminum electrolytic output capacitor is recommended. POWER DISSIPATION The AIC1117A obtains thermal-limiting circuitry, which is designed to protect the device against overload condition. For continuous load condition, maximum rating of junction temperature must not be exceeded. It is important to pay more attention in thermal resistance. It includes junction to case, junction to ambient. The maximum power dissipation of AIC1117A depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the  PMAX  (TJ-max - TA ) Rθ JA Where TJ-max is the maximum allowable junction temperature (125C), and TA is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. APPLICATION EXAMPLES 3 Vin 5V + TTL C1 10uF R3 1k AIC1117A 2 R1 125 1 ADJ MMBT2222A R4 1k Vout 3.3V + 3 Vin 5V + C2 10uF 2 AIC1117A 1 ADJ C1 10uF Vout 3.3V R1 125 + C2 100uF R2 205 Cadj R2 205 * Cadj can improve ripple rejection Fig. 6 VOUT=3.3V with Shutdown Vin 5V 3 + C1 10uF AIC1117A 1 ADJ Fig. 7 Improving Ripple Rejection T1 2 R1 125 Vout 1.25V D1 Vin 3 + C2 + 10uF C1 10uF AIC1117A-33 2 1 FLOATING INPUT Fig. 8 VOUT=1.25V Application Circuit + C2 100uF Vout -3.3V Fig. 9 Low Dropout Negative Supply 7 AIC1117A  PHYSICAL DIMENSIONS (unit: mm)  TO-220 A A1 E1 THERMAL PAD H1 Q E L L1 D1 D D2 P A b2 A e A2 S Y M B O L b c WITH PLATING BASE METAL SECTION A-A Note: 1. Refer to JEDEC TO-220AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-220 MILLIMETERS MIN. MAX. A 3.56 4.82 A1 0.51 1.39 A2 2.04 2.92 b 0.38 1.01 b2 1.15 1.77 c 0.35 0.61 D 14.23 16.51 D1 8.38 9.02 D2 11.75 12.88 E 9.66 10.66 E1 6.86 e H1 L 8.90 2.54 BSC 5.85 6.85 12.70 14.73 L1 -- 6.35 P 3.54 4.08 Q 2.54 3.42 8 AIC1117A  SOT-223 D A A E E1 b2 SEE VIEW B e e1 WITH PLATING c A A2 b BASE METAL A1 SECTION A-A GAUGE PLANE SEATING PLANE 0.25 VIEW B θ L Note: 1. Refer to JEDEC TO-261AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L SOT-223 MILLIMETERS MIN. MAX. A 1.80 A1 0.02 0.10 A2 1.55 1.65 b 0.66 0.84 b2 2.90 3.10 c 0.23 0.33 D 6.30 6.70 E 6.70 7.30 E1 3.30 e e1 L θ 3.70 2.30 BSC 4.60 BSC 0.90 0° 8° 9 AIC1117A  TO-263 A c2 E1 THERMAL PAD L2 H D D1 L1 E A b2 A e SEE VIEW B b S Y M B O L c WITH PLATING BASE METAL SECTION A-A  GAUGE PLANE SEATING PLANE A1 L3 L VIEW B Note: 1. Refer to JEDEC TO-263AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-263-3L MILLIMETERS MIN. MAX. A 4.06 4.83 A1 0.00 0.25 b 0.51 0.99 b2 1.14 1.78 c 0.38 0.74 c2 1.14 1.65 D 8.38 9.65 D1 6.86 -- E 9.65 10.67 E1 6.23 -- e 2.54 BSC H 14.61 L 1.78 2.79 L1 -- 1.68 L2 -- 1.78 0.25 BSC L3 θ 15.88 0° 8° 10 AIC1117A  TO-252 A E c2 E1 THERMAL PAD L4 H D D1 L3 b3 A A e S Y M B O L SEE VIEW B b c WITH PLATING BASE METAL SECTION A-A  GAUGE PLANE SEATING PLANE L1 VIEW B A1 L2 L TO-252-3L MILLIMETERS MIN. MAX. A 2.19 2.38 A1 0.00 0.13 b 0.64 0.89 b3 4.95 5.46 c 0.46 0.61 c2 0.46 0.89 D 5.33 6.22 D1 4.60 6.00 E 6.35 6.73 E1 3.90 5.46 e 2.28 BSC H 9.40 10.41 L 1.40 1.78 L1 Note: 1. Refer to JEDEC TO-252AA and AB. L3 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not L4  exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 2.67 REF 0.51 BSC L2 0.89 2.03 -- 1.02 0° 8° Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 11