AIC1117GYTR

AIC1117 800mA Low Dropout Positive Regulator   FEATURES DESCRIPTION  Dropout Voltage 1.2V at 800mA Output Current. The AIC1117 is a low dropout, three terminals  Fast Transient Response. regulator designed to provide output current  Line Regulation, typical at 0.015%. up to 800mA. The device is available in an  Load Regulation, typical at 0.1%. adjustable version and fixed output voltage of  Current Limiting and Thermal Protection. 1.8V, 2.5V and 3.3V. Dropout voltage of  Adjustable Output Voltage or Fixed at 1.8V, 2.5V maximum of 1.4V is guaranteed at 800mA and 3.3V. output current. The quality of low dropout Standard 3-Pin Power Packages. voltage and fast transient response make this   device ideal for low voltage microprocessor APPLICATIONS applications.  Active SCSI Terminators. The AIC1117 requires output capacitance of a  Post Regulators for Switching Supplies. minimum of 10μF for stability. Built-in output  Battery Chargers. current limiting and thermal limiting provide  PC Add-On Card. maximal protection to the AIC1117 against fault conditions.  TYPICAL APPLICATION CIRCUIT 3 VIN 5V AIC1117 1 ADJ C1 + 10F 2 VOUT 3.3V RF1 125 + 1% C2 RF2 10F 205 (Note1) 1% VREF VREF=VOUT - VADJ=1.25V (typ.) VOUT=VREF x (1+RF2/RF1)+ IADJ x RF2 IADJ=55A (typ.) (1) C1 needed if device is far away from filter capacitors. (2) C2 required for stability. Adjustable Voltage Regulator 3 VIN 5V AIC1117-33 2 VOUT 3.3V 1 + C2 10F C1 + 10F (Note1) GND Fixed Voltage Regulator Analog Integrations Corporation Si-Soft Research Center DS-1117G-02 20131018 st 3A1, 1 Li-Hsin 1 Rd., Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw 1 AIC1117  ORDERING INFORMATION AIC1117-XXXXXX PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE TO-252 (GE&PE) TOP VIEW 1: ADJ (GND) 2: VOUT (TAB) 3: VIN PACKAGING TYPE E: TO-252 M: TO-263 T: TO-220 Y: SOT-223 1 2 3 1 2 3 1 2 3 TO-263 (GM&PM) TOP VIEW P: Lead Free Commercial G: Green Package OUTPUT VOLTAGE DEFAULT:ADJUSTABLE 18: 1.8V 25: 2.5V 33: 3.3V 1: ADJ (GND) 2: VOUT (TAB) 3: VIN TO-220 (GT&PT) FRONT VIEW 1: ADJ (GND) 2: VOUT (TAB) 3: VIN Example: AIC1117-25GETR  2.5V version in TO-252 Green Package & Taping & Reel Packing Type AIC1117-25PYTR  2.5V version in SOT-223 Lead SOT-223 (GY&PY) TOP VIEW 1: ADJ (GND) 2: VOUT (TAB) 3: VIN 1 2 3 Free Package & Taping & Reel  SOT-223 Marking Part No. AIC1117 AIC1117-18 AIC1117-25 AIC1117-33 GY AK17G AK18G AK25G AK33G PY AK17P AK18P AK25P AK33P 2 AIC1117  ABSOLUTE MAXIMUM RATINGS VIN pin to ADJ/ GND pin 7V Operating Temperature Range –40C to 85C Storage Temperature Range –65C to 150C Maximum Junction Temperature 125C Lead Temperature (Soldering, 10 sec) 260C Thermal Resistance (Junction to Case) TO-220 3C /W TO-252 12.5C /W SOT-223 15C /W TO-263 3C /W TO-252 100C/W (Assume no ambient airflow, no heatsink) TO-263 60C /W Thermal Resistance Junction to Ambient SOT-223 TO-220 155C /W 50C /W Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.  TEST CIRCUIT Refer to TYPICAL APPLICATION CIRCUIT. 3 AIC1117  ELECTRICAL CHARACTERISTICS (VIN=5V, TA=25C, IO=10mA, unless otherwise specified) (Note2) PARAMETER Reference Voltage Output Voltage TEST CONDITIONS MIN. TYP. MAX. AIC1117 (ADJ), TJ=25C 1.238 1.25 1.262 0CTJ125C 1.225 1.25 1.275 AIC1117-18, VIN=3.3V 1.78 1.8 1.82 AIC1117-25, VIN=5V 2.47 2.5 2.53 AIC1117-33, VIN=5V 3.26 3.30 3.33 0.015 0.2 0.035 0.2 0.1 0.3 2.65VIN7V, VOUT=1.25V Line Regulation TJ=25C 0CTJ125C TJ=25C Load Regulation 10mA IO800mA VOUT, VREF=1% 10mAIO800mA Current Limit Adjusted Pin Current (IADJ) Adjusted Pin Current Change (IADJ) Temperature Stability 0.2 0.4 1.2 1.4 0.85 2.65VIN7V 10mAIO 800mA 2.65VIN7V 10mAIO800mA IO=0.5A 2.65VIN7V RMS Output Noise (% of VOUT) 10Hz  f  10KHz Ripple Rejection Ratio 120Hz input ripple COUT=25F V % 60 V A 55 120 A 0.2 5 A 0.5 Minimum Load Current GND Current V % 0CTJ125C Dropout Voltage UNIT % 5 10 mA 10 14 mA 0.003 % 72 dB Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic capacitor is not suggested. Note 2: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). 4 AIC1117 5 1.8 Minimum Load Current (mA) Minimum Differential Voltage (V) TYPICAL PERFORMANCE CHARACTERISTICS 1.6 TA=0C 1.4 TA=50C 1.2 1.0 TA=125C 0.8 0.6 0.4 0.2 0.0 0 200 400 600 800 3 TA=25C 2 TA=0C 1 1 2 3 4 5 6 7 8 9 Input/ Output Differential (V) Fig. 2 Minimum Load Current (Adjustable Version) Fig. 1 AIC1117 (ADJ) Dropout Voltage 1.6 0.08 IOUT=500mA (30mS Puls) 0.07 TA=125C Output Voltage Deviation (%) 0.09 Thermal Regulation (%/W) TA=125C 4 0 1000 Output Current (mA) 0.06 0.05 0.04 0.03 0.02 0.01 0.5 1.0 1.5 2.0 2.5 3.0 1.2 IOUT=0.5A 0.8 0.4 0.0 -0.4 -0.8 -1.2 -1.6 3.5 Power (Watt) Fig. 3 AIC1117 (ADJ) Power vs. Thermal Regulation -20 0 20 40 60 80 100 120 140 Temperature (C) Fig. 4 AIC1117 (ADJ) Temperature Stability -20 Ripple Rejection Ratio (dB)  COUT=3.3F -30 -40 COUT=10F -50 -60 COUT=25F -70 -80 1 10 2 10 3 10 4 10 5 10 Frequency (Hz) 6 10 7 10 Fig. 5 AIC1117 (ADJ) Ripple Rejection Ratio (dB) 5 AIC1117 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) Output Voltage (mV, AC) Output Voltage (V, AC) 0.1 0.05 0 -0.05 VIN=5V CIN=1F COUT=10F (Tantalum) VOUT=3.3V 0.4A 0.1A 0 40 80 120 160 50 0 CIN=1F COUT=10F (Tantalum) VOUT=3.3V --50 --100 Input Voltage (V) -0.1 Load Current  200 Time (S) Fig. 6 Load Transient Response Fig. 8 Region of Stable COUT ESR vs. Load Current 7.0 6.0 0 10 20 30 40 50 Time (S) Fig. 7 Line Transient Response Fig. 9 Region of Stable COUT ESR vs. Load Current 6 AIC1117  BLOCK DIAGRAM VIN + GM VREF + 1.25V Current Amp. - Thermal Limit Current Limit 55A VOUT For fixed voltage device ADJ  GND PIN DESCRIPTIONS ADJ PIN - Providing VREF=1.25V (typ.) for adjustable VOUT. VREF=VOUT -VADJ and IADJ=55A (typ.) (GND PIN - Power ground.) VOUT PIN - Adjustable output voltage. VIN PIN Power Input. - 7 AIC1117  APPLICATION INFORMATION temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: (T - TA ) PMAX  J-max Rθ JA INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 10F with a 10F aluminum electrolytic output capacitor is recommended. To avoid oscillation, it is recommended to follow Fig. 8, 9 to choose proper capacitor specifications. POWER DISSIPATION The AIC1117 obtains thermal-limiting circuitry, which is designed to protect the device against overload condition. For continuous load condition, maximum rating of junction temperature must not be exceeded. It is important to pay more attention in thermal resistance. It includes junction to case, junction to ambient. The maximum power dissipation of AIC1117 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of  Where TJ-max is the maximum allowable junction temperature (125C), and TA is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. . APPLICATION EXAMPLES 3 Vin 5V TTL AIC1117 + C1 10F R3 1k 2 R1 125 1 ADJ MMBT2222A Vin 5V Vout 3.3V 3 + C1 10F + C2 10F 2 AIC1117 R1 125 1 ADJ + C2 100F R2 205 Cadj R2 205 Vout 3.3V R4 1k * Cadj can improve ripple rejection Fig. 10 VOUT=3.3V with Shutdown Fig. 11 Improving Ripple Rejection T1 3 Vin AIC1117 5V + C1 10F 1 ADJ 2 R1 125 Vout 1.25V D1 3 Vin + C2 + 10F C1 10F AIC1117-33 2 1 FLOATING INPUT Fig. 12 VOUT=1.25V Application Circuit + C2 100F Vout -3.3V Fig. 13 Low Dropout Negative Supply 8 AIC1117  PHYSICAL DIMENSIONS (unit: mm)  TO-220 A A1 E1 THERMAL PAD H1 Q E L L1 D1 D D2 P A b2 A e A2 S Y M B O L b c WITH PLATING BASE METAL SECTION A-A Note: 1. Refer to JEDEC TO-220AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-220 MILLIMETERS MIN. MAX. A 3.56 4.82 A1 0.51 1.39 A2 2.04 2.92 b 0.38 1.01 b2 1.15 1.77 c 0.35 0.61 D 14.23 16.51 D1 8.38 9.02 D2 11.75 12.88 E 9.66 10.66 E1 6.86 e H1 L 8.90 2.54 BSC 5.85 6.85 12.70 14.73 L1 -- 6.35 P 3.54 4.08 Q 2.54 3.42 9 AIC1117  TO-252 A E c2 E1 THERMAL PAD L4 H D D1 L3 b3 A A e SEE VIEW B S Y M B O L b c WITH PLATING BASE METAL SECTION A-A  GAUGE PLANE SEATING PLANE L1 VIEW B A1 L2 L TO-252-3L MILLIMETERS MIN. MAX. A 2.19 2.38 A1 0.00 0.13 b 0.64 0.89 b3 4.95 5.46 c 0.46 0.61 c2 0.46 0.89 D 5.33 6.22 D1 4.60 6.00 E 6.35 6.73 E1 3.90 e 5.46 2.28 BSC H 9.40 10.41 L 1.40 1.78 L1 2.67 REF 0.51 BSC L2 L3 0.89 2.03 L4 -- 1.02  0° 8° Note: 1. Refer to JEDEC TO-252AA and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 10 AIC1117  SOT-223 D A A E E1 b2 SEE VIEW B e e1 WITH PLATING c A A2 b BASE METAL A1 SECTION A-A GAUGE PLANE SEATING PLANE 0.25 VIEW B θ L Note: 1. Refer to JEDEC TO-261AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L SOT-223 MILLIMETERS MIN. MAX. A 1.80 A1 0.02 0.10 A2 1.55 1.65 b 0.66 0.84 b2 2.90 3.10 c 0.23 0.33 D 6.30 6.70 E 6.70 7.30 E1 3.30 e e1 L θ 3.70 2.30 BSC 4.60 BSC 0.90 0° 8° 11 AIC1117  TO-263 A c2 E1 THERMAL PAD L2 H D D1 L1 E A b2 A e SEE VIEW B b S Y M B O L c WITH PLATING BASE METAL SECTION A-A  L VIEW B SEATING PLANE A1 L3 GAUGE PLANE Note: 1. Refer to JEDEC TO-263AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-263-3L MILLIMETERS MIN. MAX. A 4.06 4.83 A1 0.00 0.25 b 0.51 0.99 b2 1.14 1.78 c 0.38 0.74 c2 1.14 1.65 D 8.38 9.65 D1 6.86 -- E 9.65 10.67 E1 6.23 e -2.54 BSC H 14.61 15.88 L 1.78 2.79 L1 -- 1.68 L2 -- θ 1.78 0.25 BSC L3 0° 8° Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 12