AIC1747
300mA Linear Regulator With Bypass Pin
FEATURES
DESCRIPTION
Guarantee 300mA Output Current.
Fast Response in Line/Load Transient
Wide Operating Voltage Ranges: 2.0V to 6.0V.
0.01μA Shutdown Standby Current
Low Quiescent Current：80µA.
Output Voltage is available within 1.1~4.2V
Low Dropout：270mV at 300mA
PSRR：60dB at 1kHz.
AIC1747 is optimized for ceramic capacitor
operation with 300mA continuous current. The
AIC1747 is designed for portable RF and wireless
applications with demanding performance and
space requirements.
The AIC1747 offers high precision output voltage
of 2% tolerance. Output Voltage is available
within 1.1~4.2V. There are version of 1.1, 1.2, 1.3,
1.5, 1.8, 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.5, 3.7, 3.8
and 4.0 for a fixed output voltage.
A noise bypass pin is available for further
reduction of output noise. At 300mA load current,
a 270mV dropout can be performed. The quality
of low quiescent current and low dropout voltage
makes the device ideal for battery power
applications. The high ripple rejection and low
noise of the AIC1747 provide enhanced
performances for critical applications such as
cellular phones, and PDAs.
Active High Shutdown Control.
Fixed: 1.1, 1.2, 1.3, 1.5, 1.8, 2.5, 2.7, 2.8, 2.85,
3.0, 3.3, 3.5, 3.7, 3.8, 4.0 Output
Voltage.Current Limit and Thermal Protection.
Available in ±2% Output Tolerance.
Available in 3 & 5 lead of SOT-23, TSOT23,
SC70, & SOT-89 & DFN 6L 2x2 Package.
APPLICATIONS
Cellular Phones.
PCMCIA Cards
Laptop, Palmtops, Notebook Computers
Personal Communication Equipment.
PDAs.
Digital Still Cameras.
Portable Consumer Equipments.
In addition, a logic-level shutdown input is
included, which reduce supply current to less than
0.01μA (typ.) in shutdown mode with fast turn-on
& off time less than 50 μ s & 30 μ s. The
AIC1747’s current limit and thermal protection
provide protection against any overload condition
that would cause excessive junction temperatures.
TYPICAL APPLICATION CIRCUIT
VIN
VIN
VOUT
CIN
VOUT
COUT
1F
1F
GND
BP
EN
AIC1747
CBP
0.1nF
Ultra LDO Regulator
Analog Integrations Corporation
Si-Soft Research Center
DS-1747G-07
20120612
3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510
www.analog.com.tw
1
AIC1747
ORDERING INFORMATION
3 pin:
AIC1747-XXXXX XX
3 PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
BG: BAG
PACKAGE TYPE
U3: SOT-23
X3A: SOT-89
X3T: SOT-89
K3: TSOT23
J3: SC70
SOT-23/TSOT23
TOP VIEW
1: GND
2: VOUT
3: VIN
1
2
SOT-89 (X3A)
TOP VIEW
1: GND
2. VIN
3. VOUT
P: Lead Free Commercial
G: Green Package
(SC70 is only available on
Green Package)
3
1
SOT-89 (X3T)
TOP VIEW
1: VOUT
2. GND
3. VIN
OUTPUT VOLTAGE
11: 1.1V
12: 1.2V
SC70
13: 1.3V
TOP VIEW
15: 1.5V
1: GND
18: 1.8V
2: VOUT
25: 2.5V
3: VIN
27: 2.7V
28: 2.8V
285: 2.85V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
40: 4.0V
(Of a unit of 0.1V within 1.1~4.2V, additional
voltage versions are available on demand)
2
1
3
2
3
3
1
2
Example: AIC1747-18GX3ATR
1.8V Version, in SOT-89 Green
Package & Tape & Reel Packing Type
2
AIC1747
ORDERING INFORMATION
(Continued)
5 pin:
AIC1747-XXXXX XX
5 PIN C ONFIGURATION
PACKING TYPE
TR: TAPE & REEL
BG: BAG
PACKAGE TYPE
V5 : SOT-23-5
V5N : SOT-23-5
X5 : SOT-89-5
K5 : TSOT23-5
K5N : TSOT23-5
J5 : SC70-5
DA : DFN 6L 2x2
P: Lead Free Commercial
G: Green Package
(SC-70 and DFN are only
available on Green Package)
OUT PUT VOLTAGE
11: 1.1V
12: 1.2V
13: 1.3V
15: 1.5V
18: 1.8V
25: 2.5V
27: 2.7V
28: 2.8V
285: 2.85V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
40: 4.0V
(Of a unit of 0.1V within
1.1~4.2V, additional voltage
versions are available on
demand)
SOT-23-5/TSOT23-5(V5/K5)
TOP VIEW
1: VIN
2: GND
3: EN
4: BP
5: VOUT
SOT-23-5/TSOT23-5(V5N/K5N)
TOP VIEW
1: VIN
2: GND
3: EN
4: NC
5: VOUT
SOT89-5(X5)
TOP VIEW
1: VIN
2: GND
3: EN
4: NC
5: VOUT
DFN 6L 2x2
TOP VIEW
1: EN
2: GND
3: VIN
4: VOUT
5: NC
6.BP
GND
SC70-5
TOP VIEW
1: VIN
2: GND
3: EN
4: BP
5: VOUT
Example: AIC1747-18GV5TR
1.8V Version, in SOT-23-5 Green
Package & Tape & Reel Packing Type
3
AIC1747
ORDERING INFORMATION
(Continued)
Marking
Part No
Package Type
Marking
Part No
Package Type
Marking
AIC1747-xxGJ3
SC70-3
Axx
AIC1747-285GJ3
SC70-3
A2J
AIC1747-xxGJ5
SC70-5
Bxx
AIC1747-285GJ5
SC70-5
B2J
AIC1747-xxGDA
DFN 6L 2x2
FAxxG
AIC1747-285GDA
DFN 6L 2x2
FA2JG
AIC1747-xxPK3
TSOT-23
FCxxP
AIC1747-285PK3
TSOT-23
FC2JP
AIC1747-xxGK3
TSOT-23
FCxxG
AIC1747-285GK3
TSOT-23
FC2JG
AIC1747-xxPK5
TSOT-25
FDxxP
AIC1747-285PK5
TSOT-25
FD2JP
AIC1747-xxGK5
TSOT-25
FDxxG
AIC1747-285GK5
TSOT-25
FD2JG
AIC1747-xxPK5N
TSOT-25
FZxxP
AIC1747-285PK5N
TSOT-25
FZ2JP
AIC1747-xxGK5N
TSOT-25
FZxxG
AIC1747-285GK5N
TSOT-25
FZ2JG
AIC1747-xxPU3
SOT-23
FExxP
AIC1747-285PU3
SOT-23
FE2JP
AIC1747-xxGU3
SOT-23
FExxG
AIC1747-285GU3
SOT-23
FE2JG
AIC1747-xxPV5
SOT-25
FFxxP
AIC1747-285PV5
SOT-25
FF2JP
AIC1747-xxGV5
SOT-25
FFxxG
AIC1747-285GV5
SOT-25
FF2JG
AIC1747-xxPV5N
SOT-25
FVxxP
AIC1747-285PV5N
SOT-25
FV2JP
AIC1747-xxGV5N
SOT-25
FVxxG
AIC1747-285GV5N
SOT-25
FV2JG
AIC1747-xxPX3A
SOT-89-3
FGxxP
AIC1747-285PX3A
SOT-89-3
FG2JP
AIC1747-xxGX3A
SOT-89-3
FGxxG
AIC1747-285GX3A
SOT-89-3
FG2JG
AIC1747-xxPX3T
SOT-89-3
FHxxP
AIC1747-285PX3T
SOT-89-3
FH2JP
AIC1747-xxGX3T
SOT-89-3
FHxxG
AIC1747-285GX3T
SOT-89-3
FH2JG
AIC1747-xxPX5
SOT-89-5
FIxxP
AIC1747-285PX5
SOT-89-5
FI2JP
xx represents output voltage. (11=1.1V, 12=1.2V, ….…, 42=4.2V)
4
AIC1747
ABSOLUTE MAXIMUM RATINGS
Input Voltage ........................................................................................................................................ 7V
EN Pin Voltage ..................................................................................................................................... 7V
Noise Bypass Terminal Voltage ........................................................................................................... 7V
Power Dissipation, PD @ TA = 25ºC
SOT23-5 ................................................................................................................................... 400mW
TSOT23-5 ................................................................................................................................. 400mW
SOT-89-5 .................................................................................................................................. 625mW
SC70-5...................................................................................................................................... 300mW
DFN 6L 2x2 .............................................................................................................................. 606mW
Maximum Junction Temperature.................................................................................................... 150ºC
Operating Temperature Range ............................................................................................. -40ºC~85ºC
Storage Temperature Range .............................................................................................. -65ºC~150ºC
Lead Temperature (Soldering, 10 sec) .......................................................................................... 260ºC
Thermal Resistance - Junction to Case, RθJC
SOT-23-5 ............................................................................................................................115°C /W
TSOT23-5 ............................................................................................................................115°C /W
SOT-89-5 ...............................................................................................................................45°C /W
DFN 6L 2x2 ...........................................................................................................................30°C /W
Thermal Resistance - Junction to Ambient, RθJA
SOT-23-5 .............................................................................................................................250°C /W
TSOT23-5 ............................................................................................................................250°C /W
SOT-89-5 .............................................................................................................................160°C /W
SC70-5.................................................................................................................................333°C /W
DFN 6L 2x2 .........................................................................................................................165°C /W
(Assume no ambient airflow, no heatsink)
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
TEST CIRCUIT
Refer to the TYPICAL APPLICATION CIRCUIT.
5
AIC1747
ELECTRICAL CHARACTERISTICS
(CIN = Cout = 1F, CBP = 0.1nF, VIN = VOUT + 1V, TJ=25C, unless otherwise specified) (Note 1)
PARAMETER
TEST CONDITIONS
Input Voltage (Note 2)
Output Voltage Tolerance
VIN=6V, IOUT = 1mA
Continuous Output Current
SYMBOL
MIN.
VIN
TYP.
MAX.
UNIT
2
6
V
VOUT
-2
2
%
IOUT
300
mA
A
Quiescent Current
VEN ≧1.2V, IOUT = 0 mA
IQ
80
GND Pin Current
IOUT = 300mA
IGND
80
Standby Current
VEN= 0
ISTBY
0.01
0.5
A
Output Current Limit
VIN=5V, RLOAD = 1Ω
IIL
450
600
mA
750
1000
450
670
270
440
330
IOUT = 300 mA, VOUT=1.2V
Dropout Voltage
IOUT = 300 mA, VOUT=1.8V
VDROP
IOUT = 300 mA, VOUT=3.3V
110
A
mV
Line Regulation
VIN = VOUT + 1V to 6V
VLIR
3
10
mV
Load Regulation
IOUT = 1mA to 300mA
VLOR
5
20
mV
f=1KHz, Ripple=0.5Vp-p,
PSRR
-60
Ripple Rejection
f=10KHz, Ripple=0.5Vp-p,
Temperature Coefficient
Thermal Shutdown
Temperature
VIN = VOUT + 1V
Thermal Shutdown
Hysteresis
dB
-55
TC
50
ppm/℃
TSD
150
℃
TSD
20
℃
Enable Pin SPECIFICATION
Enable Pin Current
VEN = VIN or GND
IEN
0
Shutdown Exit Delay Time
IOUT = 30mA
t
50
Max Output Discharge
Resistance to GND during
Shutdown
RDSON_
CLMP
VENH
Output OFF, VIN = 2V to 6V
VENL
Ω
S
30
Output ON, VIN = 2V to 6V
nA
S
700
Shutdown Time
Enable Pin Input
Threshold
100
1.2
0.4
V
Note 1. Specifications are production tested at T =25°C. Specifications over the -40°C to 85°C operating
A
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
Note 2. Vin(min) is the higher value of Vout + Dropout Voltage or 2.0V.
6
AIC1747
TYPICAL PERFORMANCE CHARACTERISTICS
Fig. 1 Quiescent Current VS Input Voltage
Fig. 2 Ground Current VS Loading Current
1.00
VIN = VOUT + 1V
0.75
0.50
Output Voltage (%)
0.25
0.00
VOUT = 3.3V
-0.25
-0.50
VOUT = 1.8V
VOUT = 1.2V
-0.75
-1.00
-40
-20
0
20
40
60
80
o
Temperature ( C)
Fig. 3 Quiescent Current VS Temperature
Fig.5 Dropout Voltage VS Loading Current (1.8V)
Fig. 4 Output Voltage VS Temperature
Fig.6 Dropout Voltage VS Loading Current (3.3V)
7
AIC1747
TYPICAL PERFORMANCE CHARACTERISTICS
Fig. 7 Output Voltage VS Input Voltage (1.2V)
Fig.9 Output Voltage VS Input Voltage (1.8V)
Fig.11 Output Voltage VS Input Voltage (3.3V)
(Continued)
Fig. 8 Output Voltage VS Loading Current (1.2V)
Fig.10 Output Voltage VS Loading Current (1.8V)
Fig.12 Output Voltage VS Loading Current (3.3V)
8
AIC1747
TYPICAL PERFORMANCE CHARACTERISTICS
(Continued)
Iout=1mA to 300mA
Vin
Vin = 2.2V to 3.2V
Iload = 100mA
Vout Ripple
Iout
Vout Ripple
Fig. 13 Load Transient Response (1.2V)
Fig. 14 Line Transient Response (1.2V)
Iout=1mA to 300mA
Vin
Vin = 2.8V to 3.8V
Iload = 100mA
Vout Ripple
Iout
Vout Ripple
Fig. 15 Load Transient Response (1.8V)
Fig. 16 Line Transient Response (1.8V)
Iout=1mA to 300mA
Vin
Vin = 4.3V to 5.3V
Iload = 100mA
Vout Ripple
Iout
Vout Ripple
Fig. 17 Load Transient Response (3.3V)
Fig. 18 Line Transient Response (3.3V)
9
AIC1747
TYPICAL PERFORMANCE CHARACTERISTICS
CBP=0 F
Enable
(Continued)
CBP=0.1n F
Enable
Vout
Vout
Fig. 19 Start-up Waveform
Fig. 20 Start-up Waveform
Enable
Vout
Fig. 21 Shutdown Waveform
10
AIC1747
BLOCK DIAGRAM
PIN DESCRIPTION
VIN - Power supply input pin. Bypass with a 1µF capacitor to GND
GND - Ground.
EN - Active High Enable Input.
VOUT - Regulator Output pin. Sources up to 300 mA.
BP - Bypass pin. It should be connected to external 0.1nF capacitor to GND to reduce output noise.
11
AIC1747
DETAILED DESCRIPTION OF TECHNICAL TERMS
effects, it is a pulsed measurement with the input
DROPOUT VOLTAGE (VDROP)
The dropout voltage is defined as the difference
between input voltage and output voltage at
which point the regulator starts to fall out of
regulation. Below this value, the output voltage
will fall while the input voltage is reduced. It
depends on the load current and junction
temperature. The dropout voltage is specified at
which the output voltage drops 100mV below the
voltage set to VIN = VOUT + 1 V. The load
regulation is specified under the output current
step of 0.1mA to 300mA.
CURRENT LIMIT (IIL)
The AIC1747 includes a current limiting, which
monitors and controls the maximum output
current if the output is shorted to ground. This
can protect the device from being damaged.
value measured with 1V difference.
THERMAL PROTECTION
LINE REGULATION
The thermal sensor protects the device when the
Line regulation is the ability of the regulator to
maintain a constant output voltage as the input
voltage changes. The line regulation is specified
as the input voltage is changed from VIN = VOUT +
1 V to 6 V and IOUT = 1mA.
maintain a constant output voltage as the load
To
transistor and allowing the IC to cool. Thermal
protection is designed to protect the device in the
of
fault
conditions.
For
continuous
operation do not exceed the absolute maximum
Load regulation is the ability of the regulator to
changes.
signals, the shutdown logic, turning off the pass
event
LOAD REGULATION
current
junction temperature exceeds TJ= +150ºC. It
minimize
junction-temperature rating of TJ= 150ºC, or
damage the device.
temperature
12
AIC1747
APPLICATION INFORMATION
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output
capacitors to maintain stability. Input capacitor at
1F with 1uF output capacitor is recommended.
POWER DISSIPATION
The AIC1747 obtains thermal-limiting circuitry,
which is designed to protect the device against
overload condition. For continuous load
condition,
maximum
rating
of
junction
temperature must not be exceeded. It is
important to pay more attention in thermal
resistance. It includes junction to case, junction
to ambient. The maximum power dissipation of
AIC1747 depends on the thermal resistance of
its case and circuit board, the temperature
difference between the die junction and ambient
air, and the rate of airflow. The rate of
temperature rise is greatly affected by the
mounting pad configuration on the PCB, the
board material, and the ambient temperature.
When the IC mounting with good thermal
conductivity is used, the junction temperature
will be low even when large power dissipation
applies.
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The maximum power dissipation is:
PMAX
(TJ-max - TA )
Rθ JA
Where TJ-max is the maximum allowable junction
temperature (150C), and TA is the ambient
temperature suitable in application.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
GND pin performs a dual function for providing
an electrical connection to ground and
channeling heat away. Therefore, connecting
the GND pin to ground with a large pad or
ground plane would increase the power
dissipation and reduce the device temperature.
13
AIC1747
PHYSICAL DIMENSIONS
SOT-89 PACKAGE OUTLINE DRAWING
D
A
C
L
H
E
D1
e
S
Y
M
B
O
L
e1
B1
B
SOT-89
MILLIMETERS
MIN.
MAX.
A
1.40
1.60
B
0.44
0.56
B1
0.36
0.48
C
0.35
0.44
D
4.40
4.60
D1
1.50
1.83
E
2.29
2.60
e
1.50 BSC
e1
3.00 BSC
H
3.94
4.25
L
0.89
1.20
Note: 1. Refer to JEDEC TO-243AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
14
AIC1747
SOT-89- 5PIN PACKAGE OUTLINE DRAWING
D
A
C
L
H
E
D1
e
S
Y
M
B
O
L
e1
B
SOT-89-5
MILLIMETERS
MIN.
MAX.
A
1.40
1.60
B
0.36
0.56
C
0.35
0.44
D
4.40
4.60
D1
1.50
1.83
E
2.29
2.60
e
1.50 BSC
e1
3.00 BSC
H
3.94
4.25
L
0.80
1.20
Note: 1. Refer to JEDEC TO-243AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
15
AIC1747
TSOT23 PACKAGE OUTLINE DRAWING
D
A
A
E
E1
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
BASE METAL
A1
SECTION A-A
L2
S
Y
M
B
O
L
GAUGE PLANE
SEATING PLANE
L1
VIEW B
θ
L
Note : 1. Refer to JEDEC MO-193C.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TSOT-23
MILLIMETERS
MIN.
MAX.
A
-
1.00
A1
0
0.10
A2
0.70
0.90
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
E
2.60
3.00
E1
1.50
1.70
e
0.95 BSC
e1
1.90 BSC
L
0.60 REF
0.25 BSC
L2
θ
0.60
0.30
L1
0°
8°
16
AIC1747
TSOT23- 5PIN PACKAGE OUTLINE DRAWING
A
A
E
E1
D
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
SECTION A-A
0.25
A1
BASE METAL
VIEW B
θ
L
L1
S
Y
M
B
O
L
GAUGE PLANE
SEATING PLANE
TSOT-23-5
MILLIMETERS
MIN.
MAX.
A
-
1.00
A1
0
0.10
A2
0.70
0.90
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
2.60
3.00
Note : 1. Refer to JEDEC MO-193AB.
E
2. Dimension "D" does not include mold flash, protrusions
E1
or gate burrs. Mold flash, protrusion or gate burrs shall not
e
exceed 6 mil per side.
e1
3. Dimension "E1" does not include inter-lead flash or protrusions. L
4. Controlling dimension is millimeter, converted inch
L1
dimensions are not necessarily exact.
θ
1.50
1.70
0.95 BSC
1.90 BSC
0.60
0.30
0.60 REF
0°
8°
17
AIC1747
SOT-23 PACKAGE OUTLINE DRAWING
D
A
A
E
E1
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
BASE METAL
0.25
A1
SECTION A-A
GAUGE PLANE
SEATING PLANE
L1
VIEW B
Note: 1. Refer to JEDEC MO-178.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
SOT-23
MILLIMETERS
MIN.
MAX.
A
0.95
1.45
A1
0.00
0.15
A2
0.90
1.30
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
E
2.60
3.00
E1
1.50
1.70
θ
L
S
Y
M
B
O
L
e
0.95 BSC
e1
1.90 BSC
L
θ
0.60
0.30
0.60 REF
L1
0°
8°
18
AIC1747
SOT-23- 5PIN PACKAGE OUTLINE DRAWING
A
A
E
E1
D
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
SECTION A-A
0.25
A1
BASE METAL
GAUGE PLANE
SEATING PLANE
L1
S
Y
M
B
O
L
θ
L
VIEW B
A
Note : 1. Refer to JEDEC MO-178AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 10 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
SOT-23-5
MILLIMETERS
MIN.
MAX.
0.95
1.45
A1
0.00
0.15
A2
0.90
1.30
b
0.30
0.50
c
0.08
0.22
D
2.80
3.00
E
2.60
3.00
E1
1.50
1.70
e
0.95 BSC
e1
1.90 BSC
L
θ
0.60
0.30
L1
0.60 REF
0°
8°
19
AIC1747
SC70-3PIN PACKAGE OUTLINE DRAWING
D
A
A
E
E1
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
BASE METAL
0.15
A1
SECTION A-A
L
GAUGE PLANE
SEATING PLANE
L1
VIEW B
Note: 1. Refer to JEDEC M O-203.
2. Dim ension "D" does not include m old flash, protrusions
or gate burrs. M old flash, protrusion or gate burrs shall not
exceed 6 m il per side.
3. Dim ension "E1" does not include inter-lead flash or protrusions.
4. Controlling dim ension is m illim eter, converted inch
dim ensions are not necessarily exact.
S
Y
M
B
O
L
SC70-3L
MILLIMETERS
MIN.
MAX.
1.10
A
-
A1
0
0.10
A2
0.70
1.00
b
0.15
0.40
c
0.08
0.25
D
1.85
2.15
E
1.80
2.40
E1
1.10
e
e1
L
L1
1.40
0.65 BSC
1.30 BSC
0.46
0.26
0.42 REF
20
AIC1747
SC70 - 5PIN PACKAGE OUTLINE DRAWING
A
A
E
E1
D
e
e1
SEE VIEW B
WITH PLATING
c
A
A2
b
SECTION A-A
0.15
A1
BASE METAL
L
GAUGE PLANE
SEATING PLANE
L1
VIEW B
Note: 1. Refer to JEDEC MO-203AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side.
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
A
SC70-5L
MILLIMETERS
MIN.
MAX.
-
1.10
A1
0
0.10
A2
0.70
1.00
b
0.15
0.30
c
0.08
0.25
D
1.85
2.15
E
1.80
2.40
E1
1.10
1.40
e
0.65 BSC
e1
1.30 BSC
L
L1
0.46
0.26
0.42 REF
21
AIC1747
DFN 6L 2x2 PACKAGE OUTLINE DRAWING
D2
D
6
E
E2
L
4
3
1
e
PIN#1
BOTTOM VIEW
TOP VIEW
A
S
Y
M
B
O
L
A
DFN 6L-2x2x0.75-0.65mm
MILLIMETERS
MIN.
MAX.
0.70
0.80
A3
A3
b
b
SEATING PLANE
0.20 BSC
0.25
D
D2
2.00 BSC
1.20
E
SIDE VIEW
E2
1.60
2.00 BSC
0.55
0.85
0.65 BSC
e
L
0.35
0.25
0.45
Note : 1. DIMENSION AND TOLERANCING CONFORM TO ASME Y14.5M-1994.
2.CONTROLLING DIMENSIONS：MILLIMETER，CONVERTED INCH
DIMENSION ARE NOT NECESSARILY EXACT.
3.DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS
MEASURED BETWEEN 0.10 AND 0.25 mm FROM TERMINAL TIP.
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than
circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We
reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are
devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when
properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
22
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