[AK09915D]
AK09915D
3-axis Electronic Compass
1. General Description
AK09915D is 3-axis electronic compass IC with high sensitive Hall sensor technology.
Small package of AK09915D incorporates magnetic sensors for detecting terrestrial magnetism in the X-axis,
Y-axis, and Z-axis, a sensor driving circuit, signal amplifier chain, and an arithmetic circuit for processing the
signal from each sensor. Self-test function is also incorporated. From its compact foot print and thin package
feature, it is suitable for map heading up purpose in GPS-equipped smart phone and tablet to realize pedestrian
navigation function.
2. Features
Functions:
3-axis magnetometer device suitable for compass application
Built-in A to D Converter for magnetometer data out
16-bit data out for each 3-axis magnetic component
Sensitivity: 0.15 µT/LSB (typ.)
Serial interface
I2C bus interface
Standard, Fast and High-speed modes (up to 2.5 MHz) compliant with Philips I2C
specification Ver.2.1
4-wire SPI
Operation mode
Power-down, Single measurement, Continuous measurement and Self-test
Open Drain DRDY function for measurement data ready
Magnetic sensor overflow monitor function
Built-in oscillator for internal clock source
Power on Reset circuit
Self-test function with internal magnetic source
Built-in Noise Suppression Filter (NSF)
Selectable sensor drive
Low power drive / Low noise drive
Built-in magnetic sensitivity adjustment circuit
32 FIFO data buffer
Operating temperatures:
-30˚C to +85˚C
Operating supply voltage:
Analog power supply
+1.7V to +3.6V
Digital Interface supply
+1.65V to analog power supply voltage
Current consumption:
Power-down:
3 µA (typ.)
Measurement:
Average current consumption at 100 Hz repetition rate
Low power drive: 0.9 mA (typ.)
Low noise drive: 1.8 mA (typ.)
Package:
AK09915D 14-pin WL-CSP (BGA): 1.6 mm 1.6 mm 0.5 mm (typ.)
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3. Table of Contents
1.
2.
3.
4.
5.
6.
7.
8.
General Description ...................................................................................................................................1
Features ......................................................................................................................................................1
Table of Contents .......................................................................................................................................2
Block Diagram and Functions ....................................................................................................................4
Pin Configurations and Functions ..............................................................................................................5
Absolute Maximum Ratings.......................................................................................................................6
Recommended Operating Conditions ........................................................................................................6
Electrical Characteristics ...........................................................................................................................6
8.1. DC Characteristics ..............................................................................................................................6
8.2. AC Characteristics ..............................................................................................................................7
8.3. ODDRDY AC Characteristics ............................................................................................................8
8.4. Analog Circuit Characteristics ............................................................................................................9
8.5. 4-wire SPI..........................................................................................................................................10
8.6. I2C Bus Interface ...............................................................................................................................11
9. Functional Descriptions ...........................................................................................................................14
9.1. Power States ......................................................................................................................................14
9.2. Reset Functions .................................................................................................................................14
9.3. Operation Modes ...............................................................................................................................15
9.4. Description of Each Operation Mode ...............................................................................................16
9.4.1. Power-down Mode ....................................................................................................................16
9.4.2. Single Measurement Mode ........................................................................................................16
9.4.3. Continuous Measurement Mode 1, 2, 3, 4, 5 and 6 ...................................................................17
9.4.4. Self-test Mode ...........................................................................................................................20
9.5. Noise Suppression Filter (NSF) ........................................................................................................20
9.6. Sensor Drive Select ...........................................................................................................................20
9.7. FIFO ..................................................................................................................................................21
9.7.1. Watermark .................................................................................................................................21
10.
Serial Interface ......................................................................................................................................22
10.1. 4-wire SPI..........................................................................................................................................22
10.1.1. Writing Data ..............................................................................................................................22
10.1.2. Reading Data .............................................................................................................................23
10.2. I2C Bus Interface ...............................................................................................................................23
10.2.1. Data Transfer .............................................................................................................................23
10.2.2. WRITE Instruction ....................................................................................................................26
10.2.3. READ Instruction ......................................................................................................................26
10.2.4. High-speed Mode (Hs-mode) ....................................................................................................28
11.
Registers................................................................................................................................................29
11.1. Description of Registers ....................................................................................................................29
11.2. Register Map .....................................................................................................................................30
11.3. Detailed Description of Registers .....................................................................................................31
11.3.1. WIA: Who I Am ........................................................................................................................31
11.3.2. RSV: Reserved ..........................................................................................................................31
11.3.3. INFO: Information .....................................................................................................................31
11.3.4. ST1: Status 1 .............................................................................................................................31
11.3.5. HXL to HZH: Measurement magnetic data ..............................................................................32
11.3.6. TMPS: Dummy..........................................................................................................................33
11.3.7. ST2: Status 2 .............................................................................................................................33
11.3.8. CNTL1: Control 1 .....................................................................................................................34
11.3.9. CNTL2: Control 2 .....................................................................................................................35
11.3.10. CNTL3: Control 3 .....................................................................................................................35
11.3.11. TS1, TS2, TS3: Test ..................................................................................................................36
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11.3.12. I2CDIS: I2C Disable ..................................................................................................................36
11.3.13. TS4: Test ...................................................................................................................................36
11.3.14. ASAX,ASAY,ASAZ: Dummy ..................................................................................................36
11.3.15. TPH1,TPH2,RR,SYT,DT: Test .................................................................................................37
12.
Example of Recommended External Connection .................................................................................38
12.1. I2C Bus Interface ...............................................................................................................................38
12.2. 4-wire SPI..........................................................................................................................................39
13.
Package .................................................................................................................................................40
13.1. Marking .............................................................................................................................................40
13.2. Pin Assignment .................................................................................................................................40
13.3. Outline Dimensions...........................................................................................................................41
13.4. Recommended Foot Print Pattern .....................................................................................................41
14.
Relationship between the Magnetic Field and Output Code ................................................................42
IMPORTANT NOTICE ...................................................................................................................................43
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4. Block Diagram and Functions
3-axis
Hall
sensor
Chopper
SW
PreAMP
Integrator&ADC
Signal
Processing
MUX
RSTN
OSC1
HE-Drive
Timing
Control
Magnetic source
Interface,
Logic
& Register
SCL/SK
SDA/SI
CSB
SO
VREF
OSC2
OD-DRDY
POR
FIFO
CAD0
CAD1
Block
3-axis Hall sensor
MUX
Chopper SW
HE-Drive
Pre-AMP
Integrator & ADC
OSC1
OSC2
POR
VREF
FIFO
Interface Logic
&
Register
Signal Processing
Timing Control
Magnetic Source
VSS
VDD
VID
Function
Monolithic Hall elements.
Multiplexer for selecting Hall elements.
Performs chopping.
Magnetic sensor drive circuit for constant-current driving of sensor.
Fixed-gain differential amplifier used to amplify the magnetic sensor signal.
Integrates and amplifies pre-AMP output or T-sensor output and performs
analog-to-digital conversion.
Generates an operating clock for sensor measurement.
Generates an operating periodic clock for sequencer.
Power on Reset circuit. Generates reset signal on rising edge of VDD.
Generates reference voltage and current.
The buffer is capable up to 32sets of data.
Exchanges data with an external CPU.
ODDRDY pin indicates sensor measurement has ended and data is ready to be read.
I2C bus interface using two pins, namely, SCL and SDA. Standard, Fast and
High-speed modes are supported. The low-voltage specification can be supported by
applying 1.65V to the VID pin.
4-wire SPI is also supported by SK, SI, SO and CSB pins.
4-wire SPI works in VID pin voltage down to 1.65 V, too.
Noise suppression function by the filtering process.
Filtering process can be enabled or disabled.
Generates a timing signal required for internal operation from a clock generated by
the OSC1.
Generates magnetic field for self-test of magnetic sensor.
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5. Pin Configurations and Functions
Pin Pin name
No.
A1 ODDRDY
I/O
O
Power
supply
VID
Type
Function
Open
Drain
Open Drain Data Ready output pin.
“L” active. Informs measurement ended and data is ready to be read.
Connect to VID on contact with pull-up resister.
Do not apply more than VID voltage to ODDRDY pin.
Chip select pin for 4-wire SPI.
“L” active. Connect to VID when selecting I2C bus interface.
When the I2C bus interface is selected (CSB pin is connected to VID).
SCL: Control clock input pin
Input: Schmitt trigger
When the 4-wire SPI is selected.
SK: Serial clock input pin.
When the I2C bus interface is selected (CSB pin is connected to VID).
SDA: Control data input/output pin
Input: Schmitt trigger, Output: Open-drain
When the 4-wire SPI is selected.
SI: Serial data input pin
A2
CSB
I
VID
CMOS
A3
SCL
I
VID
CMOS
SDA
I/O
VID
CMOS
SI
I
B1
B3
VDD
N/C
-
-
Power
-
B4
SO
O
VID
CMOS
C1
C2
VSS
N/C
-
-
Power
-
C3
N/C
-
-
-
C4
D1
VID
CAD0
I
VDD
Power
CMOS
D2
CAD1
I
VDD
CMOS
D4
RSTN
I
VID
CMOS
SK
A4
Positive power supply pin.
Non-connect
Connect to VSS or keep this pin non-connected.
When the I2C bus interface is selected (CSB pin is connected to VID)
Hi-Z output. Keep this pin electrically non-connected.
When the 4-wire SPI is selected.
Serial data output pin
Ground pin
Non-connect
Connect to VSS or keep this pin non-connected.
Non-connect
Connect to VSS or keep this pin non-connected.
Digital interface positive power supply pin.
When the I2C bus interface is selected (CSB pin is connected to VID)
CAD0:Slave address 0 input pin
Connect to VSS or VDD.
When the 4-wire serial interface is selected.
Connect to VSS.
When the I2C bus interface is selected (CSB pin is connected to VID).
CAD1:Slave address 1 input pin
Connect to VSS or VDD.
When the 4-wire serial interface is selected.
Connect to VSS.
Reset pin.
Resets registers by setting to “L”. Connect to VID when not in use.
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6. Absolute Maximum Ratings
Vss = 0V
Parameter
Power supply voltage
(Vdd, Vid)
Input voltage
(except for power supply pin)
Input current
(except for power supply pin)
Storage temperature
Symbol
V+
Min.
-0.3
Max.
+4.3
Unit
V
VIN
-0.3
(V+)+0.3
V
IIN
-
±10
mA
Tst
-40
+125
˚C
If the device is used in conditions exceeding these values, the device may be destroyed. Normal operations are
not guaranteed in such exceeding conditions.
7. Recommended Operating Conditions
Vss = 0V
Parameter
Operating temperature
Power supply voltage
Remark
VDD pin voltage
VID pin voltage
Symbol
Ta
Vdd
Vid
Min.
-30
1.7
1.65
Typ.
3.0
Max.
+85
3.6
Vdd
Unit
˚C
V
V
8. Electrical Characteristics
The following conditions apply unless otherwise noted:
Vdd = 1.7V to 3.6V, Vid = 1.65V to Vdd, Temperature range = -30 ˚C to +85 ˚C
8.1. DC Characteristics
Parameter
High level input voltage 1
Symbol
VIH1
Low level input voltage 1
High level input voltage 2
Low level input voltage 2
High level input voltage 3
VIL1
VIH2
VIL2
VIH3
Low level input voltage 3
Input current 1
VIL3
IIN1
Hysteresis input voltage
(Note 1)
VHS
High level output voltage 1
(Note 2)
Low level output voltage 1
(Note 2)
Low level output voltage 2
(Note 2)
(Note 3)
VOH1
Low level output voltage 3
(Note 3)
VOL3
Pin
CSB
RSTN
SK/SCL
SI/SDA
SK/SCL
SI/SDA
CSB
RSTN
CAD0
CAD1
SCL
SDA
SO
SDA
ODDRDY
Min.
70%Vid
70%Vid
-0.3V
70%Vdd
CAD0
CAD1
VOL1
VOL2
Condition
Typ.
Max.
Unit
V
30%Vid
Vid+0.3
30%Vid
V
V
V
V
V
µA
Vin = Vss or Vid
-10
30%Vdd
+10
Vin = Vss or Vdd
-10
+10
Vid≥2V
Vid
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