AP1010AEN

[AP1010AEN] AP1010 18V 2ch H-Bridge Motor Driver IC 1. General Description The AP1010 is a 2ch H-Bridge motor driver compatible with motor operating voltage 18V and can drive two DC motors or one stepping motor. The protection circuit has under voltage lockout circuit, thermal shutdown circuit, and overcurrent protection circuit, and overcurrent protection circuit can be disabled with the DIS OCP terminal. The package adopts a small 16-pin QFN package and contributes to downsize Printed Circuit Board. 2.        Motor Operating Voltage Range Maximum Output Current (DC) H-Bridge On-Resistance Parallel Connection Possible Under Voltage Lockout Circuit Thermal Shutdown Circuit Overcurrent Protection Circuit   Operating Temperature Range Package Features 6.0V～18V (Control power supply is unnecessary) 0.7A @Ta=25°C RON(TOP+BOT) = 1.1Ω @Ta=25°C Overcurrent protection circuit is disabled when DIS OCP terminal = “H” -30°C～85°C 16-pin QFN (3mm×3mm) 017006174-E-01 2017/11 -1- [AP1010AEN] 3. Table of Contents 1. 2. 3. 4. 5. General Description ............................................................................................................................ 1 Features .............................................................................................................................................. 1 Table of Contents ................................................................................................................................ 2 Block Diagram ..................................................................................................................................... 3 Pin Configurations and Functions ....................................................................................................... 4 5.1 Pin Configurations ........................................................................................................................ 4 5.2 Functions ...................................................................................................................................... 4 6. Absolute maximum Ratings ................................................................................................................ 5 7. Recommended Operating Conditions................................................................................................. 6 8. Electrical Charateristics ...................................................................................................................... 6 9. Functional Descriptions....................................................................................................................... 7 9.1 Operation Outline ......................................................................................................................... 7 9.2 Motor Driver Block Configuration................................................................................................. 8 9.3 Protection Circuits ........................................................................................................................ 9 10. Recommended External Circuits................................................................................................... 10 ■ Driving Stepper Motor ................................................................................................................... 10 ■ Driving DC Motor ........................................................................................................................... 10 11. Package ......................................................................................................................................... 11 11.1 Outline Dimensions.................................................................................................................... 11 11.2 Recommended Land Pattern..................................................................................................... 11 11.3 Marking ...................................................................................................................................... 11 12. Ordering Guide .............................................................................................................................. 12 13. Revise History ............................................................................................................................... 12 IMPORTANT NOTICE ......................................................................................................................... 13 017006174-E-01 2017/11 -2- [AP1010AEN] 4. CL CH Block Diagram VG VM Charge Pump VDC LDO OSC UVLO TSD LDMOS OUT1A H-Bridge 1 OUT1B GND H-Bridge Contorol Circuit IN1 IN2 IN3 Control IN4 Circuit LDMOS OUT2A H-Bridge 2 OUT2B EN OCP EP DIS OCP Figure 1. Block Diagram 017006174-E-01 2017/11 -3- [AP1010AEN] 5. Pin Configurations and Functions CH 15 CL 16 OUT1B OUT2A OUT2B 9 (Top View) Exposed PAD 1 2 3 4 IN4 14 10 IN3 VG 11 IN2 13 12 IN1 VM OUT1A 5.1 Pin Configurations 8 GND 7 DIS OCP 6 VDC 5 EN 5.2 Functions Pin Number 1 2 3 4 5 Pin Name I/O Functions IN1 IN2 IN3 IN4 EN I I I I I Control Signal Input Control Signal Input Control Signal Input Control Signal Input Enable Signal Input 6 VDC O Coupling terminal for internal power supply 7 8 9 10 11 12 13 14 DIS OCP GND OUT2B OUT2A OUT1B OUT1A VM VG I P O O O O P I/O 15 CH I/O 16 CL I/O EP EP P Over current protection function terminal Ground Motor Driver Output Motor Driver Output Motor Driver Output Motor Driver Output Motor Power Supply Connect Terminal for Stabilizing Capacitor. Connect Terminal for Charge Pump Capacitor. Connect Terminal for Charge Pump Capacitor. Ex-posed Pad Notes Built-in 200kΩ Pull-down Built-in 200kΩ Pull-down Built-in 200kΩ Pull-down Built-in 200kΩ Pull-down Built-in 200kΩ Pull-down Connect a 1.0 μF capacitor between VDC pin and GND. Built-in 200kΩ Pull-down (Note 2) Note 1. I(Input pin)、O(Output pin)、 P(Power pin)、I/O(Input/Output pin) Note 2. Exposed PAD must be connected to GND. 017006174-E-01 2017/11 -4- [AP1010AEN] 6. Parameter Absolute maximum Ratings Symbol min max Unit VM -0.3 19 V Vterm1 -0.3 6.0 V Vterm2 -0.3 V DC V Vterm3 -0.3 VM V Vterm4 -0.3 24 V VDC Terminal Voltage VDC -0.3 6.0 V CL Terminal Voltage VCL -0.3 V DC V - 0.7 A - 0.5 A 0.5 A/ch 0.35 A/ch Motor Operating Voltage Input Terminal Voltage 1 (IN1, IN2, IN3, IN4, EN) Input Terminal Voltage 2 (DIS OCP) VM Level Terminal Voltage (OUTnA, OUTnB) CH, VG Terminal Voltage Maximum Output Current Iload - Condition Ta=25°C, 1ch (Note 4) Ta=85°C, 1ch (Note 4) Ta=25°C, 2ch simultaneously (Note 4) Ta=85°C, 2ch simultaneously (Note 4) Ta=25ºC (Note 4, Note 5) Power Dissipation PD 1.83 W Junction Temperature Tj 150 °C Storage Temperature Tstg -40 150 °C Note 3. All voltages are for GND = 0V. Note 4. For Power Dissipation, the output current rating may be limited by duty cycle, Ta, and PCB board heat sinking design. Note 5. A 2-layer board is used. R θJA = 60°C/W. WARNING: Operation at or beyond these limits may result in permanent damage to the device. Normal operation is not guaranteed at these extremes. Figure 2. Maximum Power Dissipation 017006174-E-01 2017/11 -5- [AP1010AEN] 7. Recommended Operating Conditions (Ta=25°C, unless otherwise specified.) Parameter Symbol min typ max Unit Motor Operating Voltage VM 6.0 12 18 V Logic Terminal Voltage VIO 0 5.5 V Input Frequency Range F in 200 kHz Operating Temperature Range Ta -30 85 °C 8. Parameter Quiescent Current VM Quiescent Current at the time of Power Save Electrical Charateristics (Ta=25°C, VM=12V, unless otherwise specified.) Symbol Condition min typ max Unit I VMOFF IN=All “L”, EN=”L” - - 10 µA VM Quiescent Current at the time of Operating I VM IN1=IN3=”H”/”L” 200kHz, IN2=IN4=”L”/”H” 200kHz, EN=”H”, Open between OUTA and OUTB - 1.8 3.0 mA Charge Pump Charge Pump Voltage VG VG=VM+V DC , Iload=0A - - 17 V - 0.6 3.0 ms I load (1ch/2ch) = 0.1A/0.1A - 1.1 1.7 Ω I F = 100mA - 0.8 1.2 V - - 1.0 μs - - 1.0 μs 1.0 1.5 μs 4.2 2.0 - 4.65 - 5.0 0.4 V V V - - 0.6 V 100 -1.0 200 - 1.0 1.0 300 1.0 µs µs kΩ µA 3.85 4.3 4.65 V 135 155 175 °C - 30 - °C 1.3 2.6 3.9 A Charge Pump Rise Time H-Bridge Driver on resistance (H-Bridge High+Low) H-Bridge Driver Body diode forward voltage Delay Time Output Delay Time (“L”→”H”) Output Delay Time (“H”→”L”) Output Pulse Width tVGON EN=”L”→”H”, C VG =0.1uF R ON VF t PDLH t PDHL t PW Connected to 1kΩ between OUTA and OUTB. (Figure 3) Connected to 1kΩ between OUTA and OUTB. 0.5 Input Pulse Width：1μs (Figure 3) Control Logic V DC VDC Terminal Voltage Input High Level Voltage V IH Input Low Level Voltage (EN) V IL1 Input Low Level Voltage V IL2 (IN1, IN2, IN3, IN4, DIS OCP) Input Pulse Rise Time tR Input Pulse Fall Time tF Pull-down resistance R PD Input Low Level Current I IL Protection Circuit Under Voltage Detect VM UV Voltage Thermal Shutdown T TSD Temperature (Note 7) Temperature Hysteresis T TSDHYS (Note 7) DIS OCP=”L” Overcurrent protection I OCP Note 6. All above voltage is defined to GND=0V. Note 7. Not tested under mass-production. 017006174-E-01 2017/11 -6- [AP1010AEN] 1μs IN1 50％ IN1 50％ tPDLH 50% tPDHL VM VM 90％ OUT1B OUT1B 10％ 50% tPW (a) Delay Time (IN2=”H”) (b) Pulse Width (IN2=”H”) Figure 3. Timing Chart（Delay Time, Pulse Width） 9. 9.1 Functional Descriptions Operation Outline Table 1. The relationship between input and output in each mode is as follows. INPUT OUTPUT Mode EN IN1 IN2 IN3 IN4 OUT1A OUT1B OUT2A OUT2B L Hi-Z Hi-Z Hi-Z Hi-Z Power Save(Note 8) L Hi-Z H L Hi-Z Standby H H H L L CW L L H H H CCW H H H L L Brake L Hi-Z H L Hi-Z Standby H H H L L CW L L H H H CCW H H H L L Brake Note 8. Charge Pump Block and TSD, UVLO, OCP don’t operate at the Power Save. Note 9. After inputting "H" to the EN pin, input "H or L" to IN 1 - 4 pin. 017006174-E-01 2017/11 -7- [AP1010AEN] 9.2 Motor Driver Block Configuration The Nch LDMOS FET is placed on both sides of the high side and the low side in the output stage, making it possible to apply a small package. Hi-side FET is driven by VG. VG = VM + V DC is generated by the charge pump. Lo-side FET is driven by V DC . VG IN1 CH IN2 IN3 CVG CHL Charge Pump Control Pre Driver CL Logic IN4 VM VG CVM EN OUTnA VDC VG VDC OUTnB PGNDn Figure 4. Driver Block Equivalent circuit 017006174-E-01 2017/11 -8- [AP1010AEN] 9.3 Protection Circuits 9.3.1 Under Voltage Lockout (UVLO) If VM voltage is lower than 4.3V at the starting, the H-Bridge output is the Hi-Z. 9.3.2 Thermal Shutdown(TSD) When the internal temperature of the IC reaches the specified temperature (T TSD =155°C), and the H-Bridge driver outputs Hi-Z. When the internal temperature after the detection is lowered about 30°C (T TSDHYS ), the driver resumes operation. Detection of abnormal heating ↓ OUTnA/OUTnB: Hi-Z Restart Temperature = T TSD - T TSDHYS Waiting for Temperature decrease Hysterisis：30℃typ Motor Driver restaarts OUTnA/OUTnB: IN1～IN4 setting Figure 5. Detection of abnormal heating 9.3.3 Over current protection (OCP) When the current of 2.6 A or more continues to flow to the H - Bridge driver for 10 μs, all H - Bridge driver outputs are set to Hi - Z, and automatically return after 200 ms. Over current protection circuit can be used by setting the DIS OCP terminal to L level. When not using the overcurrent protection circuit, connect the DIS OCP terminal to the VDC terminal. TSD TTSD TTSDHYS Tj UVLO VM VMUV EN IN 10us IOCP IOUT OUT 200ms Hi-Z Hi-Z Hi-Z Hi-Z Figure 6. Protection Function Timing Chart 017006174-E-01 2017/11 -9- [AP1010AEN] 10. Recommended External Circuits   Driving Stepper Motor VM CVM1 Driving DC Motor CHL CVM2 VM CVG VM CH CL CVM1 CHL CVM2 CVG VG VM CH VG CL OUT1A OUT1A OUT1B VDC CVDC M VDC M CVDC OUT1B OUT2A AP1010 IN1 OUT2B IN1 IN2 IN3 CPU AP1010 OUT2A IN2 M IN3 CPU IN4 IN4 EN OUT2B EN GND GND DIS OCP DIS OCP EP EP Figure 7. Recommended External Circuits Table 2. Parts List Items Motor driver power connection capacity(Decoupling capacitor) Charge pump capacity Symbol CVM1 CVM2 CHL CVG min 0.047 0.047 typ 10 1 0.1 0.1 max 0.22 0.22 Unit μF μF μF μF Note (Note 10) Internal power connection CVDC 0.47 1.0 2.2 μF capacity (Decoupling capacitor) Note 10. Capacitance of CVM should be determined in consideration of the load current profile, the load capacitance, the line resistance and etc. of the actual system board. Note 11. Please layout the large ground plane on the PCB. Note 12. Please connect the exposed pad (heat sink) to the ground of the PCB. 017006174-E-01 2017/11 - 10 - [AP1010AEN] 11. Package 11.1 Outline Dimensions ・16-pin QFN (Unit : mm) Part A Detail View of part A 11.2 Recommended Land Pattern ・16-pin QFN (Unit : mm) 3.6 2.2 0.22±0.05 1.8 3.6 2.2 1.8 φ0.3 Thermal Via 0.2 The optimum dimensions of the mount pad will vary depending on the substrate material, solder paste method, device accuracy, etc. In actual design, please optimize according to the situation. 11.3 Marking (2) 1010 YWW A (1) (3) (4) (5) (1) (2) (3) (4) (5) 1pin Indication Market No. Year code（last 1 digit） Week code Management code 017006174-E-01 2017/11 - 11 - [AP1010AEN] 12. Ordering Guide AP1010AEN -30°C～85°C 16-pin QFN 13. Revise History Date (YY/MM/DD) 17/07/11 17/11/01 Revision Page 00 - 01 5 Contents First Edition Correction of mistake in Note 5. A 4-layer board is used.→A 2-layer board is used. 017006174-E-01 2017/11 - 12 - [AP1010AEN] IMPORTANT NOTICE 0. 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