EM0781

Monolithic Hall Effect ICs EM-series EM-0781 Shipped in packet-tape reel(5000pcs/Reel) EM-0781 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC. Omnipolar Hall Supply Voltage Effect Switch 1.6∼5.5Ｖ Hall Element Pulse Excitation High Sensitivity Output Bop：3mT CMOS SON ●Operational Characteristics Vout S or N VOH H Marking 1：VDD 1 2 2：OUT BhN BhS VOL 3：N.C. N or S 4：VSS N-pole BopN BrpN 0 L BrpS BopS S-pole ●Functional Block Diagram Magnetic flux density 1:VDD Switch Item Symbol Limit Unit Supply Voltage VDD −0.1 ∼ 6.0 V Output Current Iout ±0.5 mA Operating Temperature Range Topr −30 ∼ 85 ℃ Storage Temperature Range Tstg −40 ∼ 125 Dynamic Offset Cancellator ●Absolute Maximum Ratings（Ta=25℃） 2:OUT 4:VSS Pulse Hall Chopper Amplifier Regulator Element Stabilizer ℃ Schmitt trigger &Latch Output Stage ●Magnetic q and Electrical Characteristics（Ta=25℃ VDD=1.85V） ●Magnetic Characteristics w（Ta=−30℃∼85℃ VDD=1.85V） Item Supply Voltage Symbol Conditions VDD Min. Typ. Max. Unit 1.6 BOPS Operating Point IBOPNI 1.4* BrpS Release Point IBrpNI BhS Hysteresis I B h NI P e r i o d Tp Output High Voltage VOH Io=−0.5mA Output Low Voltage VOL Io=＋0.5mA Supply Current IDD Average 5.5 3.0 4.0 Item Symbol Conditions 1.2 3.0 4.4 mT mT BrpS Release Point IB NI rp 0.9 2.2 4.1 mT B S H y s t e r e s i s BhN I h I 0.1 0.8 1.7 mT 2.2 3.7* mT 0.3* 0.8 1.5* mT 50 100 ms Note) The above specifications are design targets. ●Application Circuit V 6.5 0.4 V 9 μA 1［mT］=10［Gauss］ N.C. OUT CMOS OUTPUT EM-0781 GND VSS VDD The characteristics with「*」marks are design targets. Bypass Capacitor 0.1μF 23 Typ. Max. Unit V 1.1 VDD −0.4 Min. B S Operating Point IBOPNI OP VDD EM-0781 •Please be aware that our products are not intended for use in life support equipment, devices, or systems. Use of our products in such applications requires the advance written approval of our sales staff. Certain applications using semiconductor devices may involve potential risks of personal injury, property damage, or loss of life. In order to minimize these risks, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards. Inclusion of our products in such applications is understood to be fully at the risk of the customer using our devices or systems. b ●Package（Unit:mm) 4 1 2 0.75 Pin No. 1 2 3 4 0.3 1 1.3 0.50＋0 −0.1 1 4 Pin Name Function Comment VDD Supply Voltage OUT Output Voltage N.C. − Short to GND VSS GND f ※Note1) The sensor center is located within the φ0.3mm circle.  Note2) The tolerances of dimensions with no mentions is ±0.1mm.  Note3) Coplanarity:The differnces between standoff of terminals are  max.50μm.  Note4) Shaded area is plating area ●Supply Voltage Note5) The center shadow area of the bottom of HIC does not need to be soldered. This area shares the lead frame with VSS inside the package and please be careful not to short this area to pins except No.4. ●IDD Pulse Driving（VDD=1.85V） 6 50ms IDD 146μs 5 Supply Voltage［V］ 0.3 0.3 2 0.75 3 1.8±0.1 3 0.45±0.1 0.25±0.1 1.2±0.1 ●(For reference only)Land Pattern（Unit:mm) φ0.3 Sensor Center 0.15±0.1 IDD ON （TYP : 1.8mA） 4 3 2 IDD （TYP : 6.5μA） 1 k IDD OFF （TYP : 1.3μA） time 0 −40 −20 0 20 40 60 80 100 Ambient Temperature［℃］ ●Temparature Dependence of Bop. Brp ●Function Timing Chart IDD Operating Point［mT］ 6 4 BopS n 2 0 t B BrpS Bop VDD＝1.85V t B o Brp BrpN −2 Vout High BopN −4 −6 −50 IDD 0 50 Ambient Temperature［℃］ 100 t 48.8μs Vout High t 48.8μs Low Low t t Operating Point Timing Release Point Timing This Hall IC’ s o utpu t is h eld as interna l da ta just be fo re the interna l circ uit t u r n s O F F ( I D D O F F ) . A n d a f t e r 4 8 . 8 μs , t h e o u t p u t c h a n g e s . N o t e ) 4 8 . 8 μs i n f i g u r e s i s t y p i c a l v a l u e 24 p IMPORTANT NOTICE  These products and their specifications are subject to change without notice. When you consider any use or application of these products, please make inquiries the sales office of Asahi Kasei Microdevices Corporation (AKM) or authorized distributors as to current status of the products.  Descriptions of external circuits, application circuits, software and other related information contained in this document are provided only to illustrate the operation and application examples of the semiconductor products. You are fully responsible for the incorporation of these external circuits, application circuits, software and other related information in the design of your equipments. AKM assumes no responsibility for any losses incurred by you or third parties arising from the use of these information herein. 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Note2) A hazard related device or system is one designed or intended for life support or maintenance of safety or for applications in medicine, aerospace, nuclear energy, or other fields, in which its failure to function or perform may reasonably be expected to result in loss of life or in significant injury or damage to person or property.  It is the responsibility of the buyer or distributor of AKM products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the above content and conditions, and the buyer or distributor agrees to assume any and all responsibility and liability for and hold AKM harmless from any and all claims arising from the use of said product in the absence of such notification. June 2, 2010