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EM0791

EM0791

  • 厂商:

    AKM(旭化成)

  • 封装:

    -

  • 描述:

    ICHALLLATCHSON

  • 数据手册
  • 价格&库存
EM0791 数据手册
Monolithic Hall Effect ICs EM-series EM-0791 Shipped in packet-tape reel(5000pcs/Reel) EM-0791 is ultra-small Hall effect ICs of a single silicon chip composed of Hall element and a signal processing IC. Unipolar Hall Effect Switch Two output for S and N-pole Supply Voltage 1.6∼5.5V Output CMOS Two output for S and N-pole High Sensitivity Hall Element Pulse Excitation Bop:2.5mT SON Notice:It is requested to read and accept "IMPORTANT NOTICE" written on the back of the front cover of this catalogue. ●Operational Characteristics Vout1 Vout 2 S or N Marking 1 H H VOH VOH 2 1:VDD Bh1 Bh2 2:VSS 3:OUT 2(S-pole) N or S L VOL 4:OUT 1(N-pole) 0 Brp1 L Bop1 N-pole VOL Bop2 S-pole 0 Brp2 Magnetic flux density Magnetic flux density ●Functional Block Diagram 1:VDD ●Absolute Maximum Ratings(Ta=25℃) Symbol Limit Unit Supply Voltage VDD −0.1 ∼ 6.0 V Output Current Iout ±0.5 mA Operating Temperature Range Topr −30 ∼ +85 ℃ Storage Temperature Range Tstg −40 ∼ +125 ℃ Switch 4:OUT1   (N-pole) Dynamic Offset Cancellation Item 3:OUT2  (S-pole) Oscillator Hall Chopper & Element Stabilizer Timing Logic Amplifier Schmitt Output Trigger Stage & Latch 2:VSS ●Magnetic q and Electrical Characteristics(Ta=25℃ VDD=1.85V) ●Magnetic Characteristics w(Ta=−30∼+85℃ VDD=1.85V) Item Symbol Conditions Supply Voltage VDD Min. Typ. 1.6 Max. Unit Item 5.5 V Operating Point BOP1 *1.4 2.5 3.2 BOP2 −3.2 −2.5 *−1.4 Brp1 1.2 2.0 *3.0 Operating Point mT Brp2 *−3.0 H y s t e r e s i s Bh1,Bh2 P e r i o d Hysteresis mT Release Point −2.0 −1.2 0.5 50 Tp Output High Voltage VOH Io=−0.2mA VDD−0.4 Output Low Voltage VOL Io=+0.2mA Supply Current IDD Average BOPS |BOPN| BrpS |BrpN| BhS Min. Typ. Max. Unit 1.3 2.5 3.5 mT 1.1 2.0 3.3 mT 0.5 |BhN| mT 100 ms 0.4 V 9 μA 1[mT]=10[Gauss] ※ The characteristics with「*」marks are design targets. ※ OUT1 responds to the positive flux from the north pole(Bop1,Brp1) ,OUT2 to the   negative flux from the south pole(Bop2,Brp2) . 25 Conditions Note) The above specifications are design targets. V 6.5 Release Point Symbol ●Application Circuit VDD Bypass Capacitor 0.1μF GND VDD OUT CMOS OUTPUT EM-0791 VSS OUT CMOS OUTPUT mT EM-0791 •Please be aware that our products are not intended for use in life support equipment, devices, or systems. Use of our products in such applications requires the advance written approval of our sales staff. Certain applications using semiconductor devices may involve potential risks of personal injury, property damage, or loss of life. In order to minimize these risks, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards. Inclusion of our products in such applications is understood to be fully at the risk of the customer using our devices or systems. a ●Package(Unit:mm) 2 3 0.3 0.75 4 0.50+0 −0.1 Pin No. 1 2 3 4 0.3 3 1 1.3 0.3 4 0.75 1 1.8±0.1 1 0.45±0.1 0.25±0.1 1.2±0.1 ●(For reference only)Land Pattern(Unit:mm) φ0.3 Sensor Center 0.15±0.1 2 Pin Name Function Comment VDD Supply Voltage VSS GND S-pole OUT2 Output Voltage OUT1 Output Voltage N-pole f ※Note1) The sensor center is located within the φ0.3mm circle.  Note2) The tolerances of dimensions with no mentions is ±0.1mm.  Note3) Coplanarity:The differnces between standoff of terminals are  max.50μm.  Note4) Shaded area is plating area ●Function Timing Chart IDD Note5) The center shadow area of the bottom of HIC does not need to be soldered. This area shares the lead frame with VSS inside the package and please be careful not to short this area to pins except No.2. ●IDD Pulse Driving(VDD=1.85V) IDD 50ms t B t B Bop 146μs IDD ON (TYP=1.8mA) Brp t Vout High Vout High 48.8μs IDD t (TYP=6.5μA) IDD OFF (TYP=1.3μA) 48.8μs k Time Low Low t Operating Point Timing Release Point Timing t T h i s H all IC’ s output is held as inter nal dat a just befor e the int er nal cir c u it t u r n s O F F ( I D D O F F ) . A n d a f t e r 4 8 . 8 μs , t h e o u t p u t c h a n g e s . N o t e ) 4 8 . 8 μs i n f i g u r e s i s t y p i c a l v a l u e ●Supply Voltage ●Temparature Dependence of Bop. Brp 4 6 3 Operating Point[mT] Supply Voltage[V] 5 4 3 2 1 2 N-pole 1 0 −40 −20 0 20 40 60 Ambient Temperature[℃] 80 100 n Brp1 o VDD=1.85V p −1 Brp2 S-pole −2 −3 0 Bop1 −4 −40 Bop2 −20 0 20 40 60 80 100 Ambient Temperature[℃] 26 IMPORTANT NOTICE  These products and their specifications are subject to change without notice. When you consider any use or application of these products, please make inquiries the sales office of Asahi Kasei Microdevices Corporation (AKM) or authorized distributors as to current status of the products.  Descriptions of external circuits, application circuits, software and other related information contained in this document are provided only to illustrate the operation and application examples of the semiconductor products. You are fully responsible for the incorporation of these external circuits, application circuits, software and other related information in the design of your equipments. AKM assumes no responsibility for any losses incurred by you or third parties arising from the use of these information herein. AKM assumes no liability for infringement of any patent, intellectual property, or other rights in the application or use of such information contained herein.  Any export of these products, or devices or systems containing them, may require an export license or other official approval under the law and regulations of the country of export pertaining to customs and tariffs, currency exchange, or strategic materials.  AKM products are neither intended nor authorized for use as critical componentsNote1) in any safety, life support, or other hazard related device or systemNote2), and AKM assumes no responsibility for such use, except for the use approved with the express written consent by Representative Director of AKM. As used here: Note1) A critical component is one whose failure to function or perform may reasonably be expected to result, whether directly or indirectly, in the loss of the safety or effectiveness of the device or system containing it, and which must therefore meet very high standards of performance and reliability. Note2) A hazard related device or system is one designed or intended for life support or maintenance of safety or for applications in medicine, aerospace, nuclear energy, or other fields, in which its failure to function or perform may reasonably be expected to result in loss of life or in significant injury or damage to person or property.  It is the responsibility of the buyer or distributor of AKM products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the above content and conditions, and the buyer or distributor agrees to assume any and all responsibility and liability for and hold AKM harmless from any and all claims arising from the use of said product in the absence of such notification. June 2, 2010
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