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A3241ELHLT

A3241ELHLT

  • 厂商:

    ALLEGRO(埃戈罗)

  • 封装:

    SOT23W

  • 描述:

    IC SWITCH HALL EFFECT SOT23W

  • 数据手册
  • 价格&库存
A3241ELHLT 数据手册
A3241 and A3242 Chopper-Stabilized Unipolar Hall-Effect Switches Discontinued Product This device is no longer in production. The device should not be purchased for new design applications. Samples are no longer available. Date of status change: August 1, 2011 Recommended Substitutions: For existing customer transition, and for new customers or new applications, refer to the A1122. NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative. Allegro MicroSystems, Inc. reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use. A3241 and A3242 Chopper-Stabilized Unipolar Hall-Effect Switches Features and Benefits Description ▪ Chopper stabilization ▫ Superior temperature stability ▫ Extremely low switchpoint drift ▫ Insensitive to physical stress ▪ Reverse battery protection ▪ Output short circuit protection ▪ Solid state reliability ▪ Small size ▪ Robust EMC capability ▪ High ESD ratings (HBM) The A3241 and A3242 integrated circuits are unipolar Halleffect switches with digital outputs. These devices are suited for operation over extended temperature ranges, up to +150°C. Superior high-temperature performance is made possible through an Allegro® dynamic offset cancellation, which reduces the residual offset voltage normally caused by device overmolding, temperature excursions, and thermal stress. Packages: 3 pin SOT23W (suffix LH), and 3 pin SIP (suffix UA) The A3241 and A3242 Hall-effect switches include the following on a single silicon chip: voltage regulator, Hallvoltage generator, small-signal amplifier, chopper stabilization, Schmitt trigger, and a short circuit protected open-drain output. Advanced BiCMOS wafer fabrication processing is used to take advantage of low-voltage requirements, component matching, very low input-offset errors, and small component geometries. The integrated voltage regulator permits operation from 3.6 to 24 V. The unipolar family members operate with a sufficient south polarity field only, turning off in the absence of such a south polarity field. Continued on the next page… Not to scale Functional Block Diagram VCC Regulator Amp Low-Pass Filter Amp Sample and Hold Dynamic Offset Cancellation To All Subcircuits VOUT Control Current Limit BOP – – 500 mV Output Current Limit IOM B > BOP 30 – 60 mA Power-On Time tPO VCC > VCC(MIN) – – 50 μs – 200 – kHz Output On Voltage Chopping Frequency fc Output Rise Time2 tr RLOAD = 820 Ω, CS = 20 pF – – 1 μs Output Fall Time2 tf RLOAD = 820 Ω, CS = 20 pF – – 1 μs ICCON B > BOP – 1.5 3.5 mA ICCOFF B < BRP – 1.5 3.5 mA VRCC = –18 V – – –2 mA VZSupply ICC = 6.5 mA; TA = 25°C 28 – – V IZSupply VS = 28 V – – 6.5 mA A3241 50 95 135 G A3242 120 150 200 G A3241 40 70 110 G A3242 110 125 190 G Supply Current Reverse Battery Current Supply Zener Clamp Voltage Supply Zener Current3 IRCC Magnetic Characteristics4 Operate Point BOP Release Point BRP Hysteresis BHYS A3241 A3242 BOP – BRP 10 25 42 G 10 25 40 G 1 Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section. 2 C = oscilloscope probe capacitance. S 3 Maximum current limit is equal to the maximum I CC(MAX) + 3 mA. 4 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields. This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated by the absolute value of B, and the sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but opposite polarity). DEVICE QUALIFICATION PROGRAM Contact Allegro for information. EMC (Electromagnetic Compatibility) REQUIREMENTS Contact Allegro for information. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 3 A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches Characteristic Data Supply Current (On) versus Supply Voltage 5.0 5.0 4.0 4.0 3.0 VCC (V) 24 3.6 2.0 ICCON (mA) ICCON (mA) Supply Current (On) versus Ambient Temperature 1.0 TA (°C) –40 25 150 3.0 2.0 1.0 0.0 0 -50 0 50 100 150 0 5 10 TA (°C) 20 25 Supply Current (Off) versus Supply Voltage 5.0 5.0 4.0 4.0 3.0 VCC (V) 24 3.6 2.0 ICCOFF (mA) ICCOFF (mA) Supply Current (Off) versus Ambient Temperature TA (°C) -40°C –40 25°C 25 150°C 150 3.0 2.0 1.0 1.0 0 0.0 -50 0 50 100 0 150 5 10 15 20 25 VCC (V) TA (°C) Output Voltage (On) versus Ambient Temperature Output Voltage (On) versus Supply Voltage 500 500 450 450 400 400 350 VCC (V) 24 3.6 300 250 200 150 VOUT(SAT) (mV) V OUT(SAT) (mV) 15 VCC (V) 350 250 200 150 100 100 50 50 0 TA (°C) 150°C –40 25°C 25 -40°C 150 300 0 -50 0 50 TA (°C) 100 150 0 5 10 15 20 25 VCC (V) Continued on the next page... Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 4 A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches Operate Point versus Supply Voltage (A3241) Operate Point versus Ambient Temperature (A3241) 130 130 120 120 110 100 VCC (V) 24 3.6 90 BOP (G) BOP (G) 110 TA (°C) –40 25 150 100 90 80 80 70 70 60 60 50 50 -50 0 50 100 0 150 5 10 110 110 100 100 90 90 VCC (V) 24 3.6 80 70 BRP (G) BRP [G] 20 25 Release Point versus Supply Voltage (A3241) Release Point versus Ambient Temperature (A3241) TA (°C) –40 25 150 80 70 60 60 50 50 40 40 -50 0 50 100 0 150 5 10 15 20 25 VCC (V) TA (°C) Hysteresis versus Supply Voltage (A3241) Hysteresis versus Ambient Temperature (A3241) 40 40 35 35 VCC (V) 24 3.6 30 25 BHYS (G) BHYS (G) 15 VCC (V) TA (°C) 30 TA (°C) –40 25 150 25 20 20 15 15 10 10 -50 0 50 TA (°C) 100 150 0 5 10 15 20 25 VCC (V) Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 5 A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches Operate Point versus Supply Voltage (A3242) 200 200 190 190 180 180 170 VCC (V) 24 3.6 160 150 BOP (G) BOP (G) Operate Point versus Ambient Temperature (A3242) 170 TA (°C) –40 25 150 160 150 140 140 130 130 120 120 -50 0 50 100 150 0 5 10 TA (°C) 190 190 180 180 170 170 160 VCC (V) 24 3.6 150 140 BRP (G) BRP (G) 20 25 Release Point versus Supply Voltage (A3242) Release Point versus Ambient Temperature (A3242) 160 TA (°C) –40 25 150 150 140 130 130 120 120 110 110 -50 0 50 100 0 150 5 10 15 20 25 VCC (V) TA (°C) Hysteresis versus Supply Voltage (A3242) Hysteresis versus Ambient Temperature (A3242) 40 40 35 35 VCC (V) 24 3.6 25 30 BHYS (G) 30 BHYS (G) 15 VCC (V) TA (°C) –40 25 150 25 20 20 15 15 10 10 -50 0 50 TA (°C) 100 150 0 5 10 15 20 25 VCC (V) Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 6 A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information Characteristic Symbol RθJA Package Thermal Resistance Test Conditions Package LH-3, 1-layer PCB with copper limited to solder pads Package LH-3, 2-layer PCB with 0.926 in2 on each side, connected by thermal vias Package UA, 1-layer PCB with copper limited to solder pads Value Units 110 ºC/W 228 ºC/W 165 ºC/W Maximum Allowable V CC (V) Power Derating Curve 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 V CC(max) 1-layer PCB, Package LH (R θJA= 110 °C/W) 1-layer PCB, Package UA (R θJA= 165 °C/W) 2-layer PCB, Package LH (R θJA= 228 °C/W) V CC(min) 20 40 60 80 100 120 140 160 180 Temperature (°C) Power Dissipation, PD (m W) Power Dissipation versus Ambient Temperature 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 1l (R aye rP θJ C A = 11 B, P 0 º ac 1-la C/ ka W (R yer P ) ge L CB θJA = H , 165 Pac ºC/ kage W) UA 2-la y (R er PCB , θJA = 228 Packa ºC/W ge L H ) 20 40 60 80 100 120 Temperature (°C) 140 160 180 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 7 A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches Functional Description Operation The output of these devices switches low (turns on) when a magnetic field (south polarity) perpendicular to the Hall element exceeds the operate point threshold, BOP. After turn-on, the output voltage is VOUT(SAT). The output transistor is capable of sinking current up to the short circuit current limit, IOM, which is a minimum of 30 mA. When the magnetic field is reduced below the release point, BRP, the device output goes high (turns off). The difference in the magnetic operate and release points is the hysteresis, Bhys, of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise. Applications It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to reduce both external noise and noise generated by the chopper stabilization technique. As is shown in Panel B of figure 1, a 0.1μF capacitor is typical. Powering-on the device in the hysteresis region, less than BOP and higher than BRP, allows an indeterminate output state. The correct state is attained after the first excursion beyond BOP or BRP. • Soldering Methods for Allegro’s Products – SMT and ThroughHole, AN26009 Extensive applications information on magnets and Hall-effect devices is available in: • Hall-Effect IC Applications Guide, AN27701, • Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead Welding and Lead Forming, AN27703.1 All are provided in Allegro Electronic Data Book, AMS-702 and the Allegro Web site: www.allegromicro.com (B) (A) VS V+ VCC VCC Switch to Low Switch to High VCC CBYP 0.1 µF VOUT(SAT) 0 BRP 0 BOP B– A324x RLOAD VOUT Output GND B+ BHYS Figure 1: Switching Behavior of Unipolar Switches. In Panel A, on the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength, and the B– direction indicates decreasing south polarity field strength (including the case of increasing north polarity). This behavior can be exhibited when using a circuit such as that shown in panel B. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 8 Chopper-Stabilized Unipolar Hall Effect Switches Chopper Stabilization Technique When using Hall-effect technology, a limiting factor for switchpoint accuracy is the small signal voltage developed across the Hall element. This voltage is disproportionally small relative to the offset that can be produced at the output of the Hall element. This makes it difficult to process the signal while maintaining an accurate, reliable output over the specified operating temperature and voltage ranges. Chopper stabilization is a unique approach used to minimize Hall offset on the chip. The Allegro technique, namely Dynamic Quadrature Offset Cancellation, removes key sources of the output drift induced by thermal and mechanical stresses. This offset reduction technique is based on a signal modulationdemodulation process. The undesired offset signal is separated from the magnetic-field-induced signal in the frequency domain, through modulation. The subsequent demodulation acts as a modulation process for the offset, causing the magnetic-fieldinduced signal to recover its original spectrum at baseband, while the DC offset becomes a high-frequency signal. The magnetic-field-induced signal then can pass through a low-pass filter, while the modulated DC offset is suppressed. This configuration is illustrated in figure 2. The chopper stabilization technique uses a 200 kHz high-frequency clock. For demodulation process, a sample and hold technique is used, where the sampling is performed at twice the chopper frequency (400 kHz). This high-frequency operation allows a greater sampling rate, which results in higher accuracy and faster signal-processing capability. This approach desensitizes the chip to the effects of thermal and mechanical stresses, and produces devices that have extremely stable quiescent Hall output voltages and precise recoverability after temperature cycling. This technique is made possible through the use of a BiCMOS process, which allows the use of low-offset, low-noise amplifiers in combination with high-density logic integration and sample-and-hold circuits. The repeatability of magnetic-field-induced switching is affected slightly by a chopper technique. However, the Allegro highfrequency chopping approach minimizes the affect of jitter and makes it imperceptible in most applications. Applications that are more likely to be sensitive to such degradation are those requiring precise sensing of alternating magnetic fields; for example, speed sensing of ring-magnet targets. For such applications, Allegro recommends its digital device families with lower sensitivity to jitter. For more information on those devices, contact your Allegro sales representative. Regulator Hall Element Amp Low-Pass Filter Clock/Logic Sample and Hold A3241 and A3242 Figure 2. Chopper Stabilization Circuit (Dynamic Quadrature Offset Cancellation) Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 9 A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches Power Derating The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems Web site.) The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RJC, is relatively small component of RJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate TJ, at PD. PD = VIN × IIN  (1) T = PD × RJA (2) TJ = TA + ΔT Example: Reliability for VCC at TA = 150°C, package LH, using a low-K PCB. Observe the worst-case ratings for the device, specifically: RJA = 228 °C/W, TJ(max) = 165°C, VCC(max) = 24 V, and ICC(max) = 5 mA. Calculate the maximum allowable power level, PD(max). First, invert equation 3: Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = Tmax ÷ RJA = 15°C ÷ 228 °C/W = 65.8 mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) ÷ ICC(max) = 65.8 mW ÷ 5 mA = 13.2 V The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages ≤VCC(est). Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and VCC(max) is reliable under these conditions. (3) For example, given common conditions such as: TA= 25°C, VCC = 12 V, ICC = 1.5 mA, and RJA = 165 °C/W, then: PD = VCC × ICC = 12 V × 1.5 mA = 18 mW  T = PD × RJA = 18 mW × 165 °C/W = 3°C TJ = TA + T = 25°C + 3°C = 28°C A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RJA and TA. 10 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches Package LH, 3-Pin (SOT-23W) +0.12 2.98 –0.08 1.49 D 4°±4° 3 A +0.020 0.180–0.053 0.96 D +0.10 2.90 –0.20 +0.19 1.91 –0.06 2.40 0.70 D 0.25 MIN 1.00 2 1 0.55 REF 0.25 BSC 0.95 Seating Plane Gauge Plane B PCB Layout Reference View Branded Face 8X 10° REF 1.00 ±0.13 +0.10 0.05 –0.05 0.95 BSC 0.40 ±0.10 NNT 1 C N = Last two digits of device part number T = Temperature code For Reference Only; not for tooling use (reference dwg. 802840) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Active Area Depth, 0.28 mm REF B Reference land pattern layout All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances C Branding scale and appearance at supplier discretion D Hall element, not to scale Standard Branding Reference View Package LH Package UA 3 1 2 1 2 3 Terminal List Name Description Number Package LH Package UA Connects power supply to chip 1 1 VOUT Output from circuit 2 3 GND Ground 3 2 VCC 11 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com A3241 and A3242 Chopper-Stabilized Unipolar Hall Effect Switches Package UA, 3-Pin SIP +0.08 4.09 –0.05 45° B C E 2.04 1.52 ±0.05 1.44 E Mold Ejector Pin Indent +0.08 3.02 –0.05 E Branded Face 45° 1 2.16 MAX D Standard Branding Reference View = Supplier emblem N = Last two digits of device part number T = Temperature code 0.79 REF A 0.51 REF NNT 1 2 3 +0.03 0.41 –0.06 15.75 ±0.51 For Reference Only; not for tooling use (reference DWG-9049) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown A Dambar removal protrusion (6X) B Gate burr area C Active Area Depth, 0.50 mm REF +0.05 0.43 –0.07 D Branding scale and appearance at supplier discretion E Hall element, not to scale 1.27 NOM Copyright ©2005-2010, Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com 12 Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com
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