A80603 and A80603-1
LED Driver with Pre-Emptive Boost
for Ultra-High Dimming Ratio and Low Output Ripple
FEATURES AND BENEFITS
DESCRIPTION
• Automotive AEC-Q100 qualified
• Enhanced fault handling for ASIL B system compliance
• Wide input voltage range of 4.5 to 40 V for start/stop,
cold crank, and load dump requirements
• Fully integrated LED current sinks and boost converter
with internal power MOSFET
• Operate in Boost or SEPIC mode for flexible output
• Drives up to 11 series white LED in 4 parallel strings, at
up to 120 mA per string (VF = 3.3 V max).
• Boost switching frequency synced externally or
programmed from 200 kHz to 2.3 MHz
• Clock-Out feature for internal switching frequency
• Adjustable boost frequency dithering to reduce EMI
• Advanced control allows minimum PWM on-time down
to 0.3 µs, and avoids MLCC audible noises
• LED contrast ratio: 15,000:1 at 200 Hz using PWM
dimming alone, 150,000:1 when combining PWM and
analog dimming
The A80603 and A80603-1 are multi-output LED drivers that
integrate a current-mode boost converter with an internal power
switch and four current sinks. The boost converter can drive
four strings of LEDs at up to 120 mA, or LED sinks can be
paralleled together to achieve higher currents up to 480 mA total.
The devices operate from single power supply from 4.5 to
40 V; once started, they can continue to operate down to 3.9 V.
This allows the parts to withstand stop/start, cold crank, and
load dump conditions encountered in automotive systems. By
using patented Pre-Emptive Boost control, an LED brightness
contrast ratio of 15,000:1 can be achieved using PWM-only
dimming at 200 Hz. Higher ratios are possible when using a
combination of PWM and analog dimming.
Switching frequency can be either above or below the AM
band, set by either a resistor or the synchronization pin to
between 200 kHz and 2.3 MHz. A programmable dithering
feature further reduces EMI. The Clock-Out pin allows other
converters to be fed the clock frequency, including programmed
dithering—even when the LED output is turned off.
Continued on next page...
PACKAGE:
The A80603 provides protection against application faults
and external component open/short. Current sense/gate drive
functions allow optional use of an input supply disconnect FET
in case of output to ground short fault in boost configuration. The
A80603-1 is identical to the A80603 except for soft start timer
and FAULT pin behavior (see Fault Table section for details).
24-Pin 4 mm × 4 mm QFN
with Wettable Flank
Not to scale
VIN
VOUT
*optional
L1
RSC
Cin
D1
Q1
RADJ
ROVP
SW
GATE
Vsense
Vc
CVDD
RPU
Vin
LED1
A80603
LED2
EN
LED4
APWM
CLKOUT
APWM 100 kHz 0-90%
AGND
Up to 11 WLEDs in series
Up to 120 mA/channel
LED3
PWM
PWM tON ≥ 0.3 µs
COUT2
PGND
VDD
FAULT
Enable
COUT1
OVP
ISET
FSET
DITH
COMP
PEB
RZ
CP
RISET
RFSET
RDITH
CDITH
RPEB
CZ
Figure 1: Typical application diagram showing A80603 in Boost mode
A80603-DS
MCO-0000619
March 4, 2019
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
FEATURES AND BENEFITS (continued)
APPLICATIONS
• Excellent input voltage transient response even at lowest
PWM duty cycle
• Gate driver for optional PMOS input disconnect switch
• Extensive protection against:
□□ Shorted boost switch, inductor or output capacitor
□□ Shorted FSET or ISET resistor
□□ Open or shorted LED pins and LED strings
□□ Open boost Schottky diode
□□ Overtemperature
•
•
•
•
Automotive infotainment backlighting
Automotive cluster
Automotive center stack
Automotive exterior lighting
SELECTION GUIDE [1]
Part Number
Soft Start Timer
Package
Packing
Leadframe Plating
A80603KESJSR
8 ms
A80603KESJSR-1 [2]
16 ms
24-pin 4 × 4 mm wettable flank QFN
with exposed thermal pad and sidewall plating
6000 pieces per reel
100% matte tin
[1] Contact Allegro
[2] Contact Allegro
for additional packing options.
factory for availability of A80603KESJSR-1.
ABSOLUTE MAXIMUM RATINGS [3]
Characteristic
Symbol
Rating
Unit
–0.3 to 40
V
VOVP
–0.3 to 40
V
VIN
–0.3 to 40
V
VSENSE,
VGATE
Higher of –0.3
and (VIN – 7.4) to
VIN +0.4
V
Continuous
–0.6 to 50
V
t < 50 ns (repetitious, 60 V
VIN
D1
L1
CC
L1 & L2 may be either
separate or integrated
CIN
SW
GATE
Vsense
Vc
RPU
ROVP
OVP
VDD
VDD
LED1
A80603
LED3
PWM
LED4
APWM
COMP
CLKOUT
AGND
Up to 4 WLEDs in series
(VOUT < 15 V)
Up to 120 mA/ch
LED2
EN
APWM 100 kHz 0-90%
COUT2
Vin
CVDD
FAULT
PWM tON ≥ 0.3 µs
COUT1
ISET
FSET
DITH
PEB
CP
RISET
RFSET
RDITH
CDITH
RPEB
RZ
CZ
Figure 2: Typical application showing SEPIC configuration for flexible input/output voltage ratio
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
3
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
GATE
DITH
Oscillator
CLKOUT active as
long as EN=H
Frequency
dithering
Clock Out
Buffer
COMP
CCOMP
VLED
ref
VDD
Rsense
Current
sense
1 MHz
4 MHz
OCP2
System
Oscillator
TSD
VOUT
FSET or ISET
pin Open/Short
Internal VDD
(4.25 V)
CVDD
Rovp
VIN
Regulator
UVLO Block
1.235 V
REF
OVP
sense
Vref
Enable
Open/Short
LED Detect
+
VSENSE
Input current
sense amp
iADJ
Chopping
Frequency
4 MHz
VIN
GATE
Boost
Enable
PMOS
Driver
LED1
LED
Driver
Block
On/Off
GATE
OFF
Current
level
LED2
LED3
LED4
AGND
Enable
Int VDD
EN
1 MHz
100 kΩ
OVP
Fault Block
AGND
RSC
External PWM
PGND
PGND
÷4
LED1
.
.
LED4
Multi-input
Error Amp
NMOS
FET
NMOS
Gate
Drive
Boost
Enable
Comparator
COMP
SW
VDD
fSW
Soft Start
Ramp
(8/16 ms)
L1
CDITH
RDITH
RFSET
FSET/SYNC
CLKOUT
VOUT
VSENSE
External
SYNC
Keep-Alive
Timer
Vref
ISET
Block
APWM
ISET
RISET
VDD
PWM
RPU
LED Enable
PEB
100 kΩ
start
Pre-Emptive
Boost
Internal FAULT
delay
RPEB
A80603
FAULT
AGND
Figure 3: Functional Block Diagram
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
4
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
FAULT
19 OVP
21 SW
20 SW
22 GATE
23 VSENSE
24 VIN
PINOUT DIAGRAM AND TERMINAL LIST
1
18 PGND
CLKOUT
2
17 PGND
VDD
3
16 LED4
AGND
4
COMP
5
14 LED2
ISET
6
13 LED1
EN 12
9
FSET
15 LED3
PWM 11
8
APWM 10
7
PEB
DITH
PAD
Package ES, 24-Pin QFN Pinouts
Terminal List Table
Number
Name
Function
1
FAULT
The pin is an open-drain type configuration that will be pulled low when a fault occurs. Connect a 10 kΩ resistor between this pin and desired
logic level voltage.
2
CLKOUT
Logic output representing the switching frequency of internal boost oscillator. This allows other converters to be synchronized to the same fSW
with the same dithering modulation, if applicable. Output is active as long as EN = H.
Output of internal LDO (bias regulator). Connect a 1 µF decoupling capacitor between this pin and GND.
3
VDD
4
AGND
LED current ground. Also serves as ‘quiet’ ground for analog signals.
5
COMP
Output of the error amplifier and compensation node. Connect a series RZ-CZ network from this pin to GND for control loop compensation.
6
ISET
Connect RISET resistor between this pin and GND to set the 100% LED current.
7
PEB
Connect resistor to GND to adjust delay time (~2 to 9 µs) for Pre-Emptive Boost. Leave pin open for minimum PEB delay of 1 µs.
8
DITH
Dithering control: connect a capacitor to GND to set the dithering modulation frequency (typically 1 to 3 kHz). Connect a resistor between
DITH and FSET pins to set the dithering range (such as ±5% of fSW).
9
FSET/SYNC
10
APWM
Analog dimming. Apply APWM clock (40 kHz to 1 MHz) to this pin and the duty cycle of this clock determines the LED current. Leave open or
connect to GND for 100%.
11
PWM
Controls the on/off state of LED current sinks to reduce the light intensity by using pulse-width modulation. Typical PWM dimming frequency
is in the range of 200 Hz to 2 kHz. EN and PWM pins may be tied together to allow single-wire dimming control.
12
EN
Enables the IC when this pin is pulled high. If EN goes low, the IC remains in standby mode for up to 16 ms, then shuts down completely.
13-16
LED1-4
LED current sinks #1 to 4. Connect the cathode of each LED string to pin. Unused LED pin must be terminated to GND through a 6.19 kΩ
resistor.
17-18
PGND
Power ground for internal NMOS switching device.
19
OVP
Overvoltage protection. Connect external resistor from VOUT to this pin to adjust the over voltage protection level.
20-21
SW
The drain of the internal NMOS switching device of the boost converter.
22
GATE
Frequency/synchronization pin. A resistor RFSET from this pin to GND sets the switching frequency fSW (with dithering super-imposed)
between 200 kHz and 2.3 MHz. It can also be used to synchronize fSW to an external frequency between 260 kHz and 2.3 MHz (dithering is
disabled in this case).
Output gate driver pin for external P-channel FET control.
Connect this pin to the negative sense side of the current sense resistor RSC. The threshold voltage is measured as VIN – VSENSE. There is
also a fixed ~20 µA current sink to allow for trip threshold adjustment.
23
VSENSE
24
VIN
Input power to the IC as well as the positive input used for current sense resistor.
–
PAD
Exposed pad of the package providing enhanced thermal dissipation. Must be connected to the ground plane(s) of the PCB with at least
8 vias, directly in the pad.
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
5
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
ELECTRICAL CHARACTERISTICS [1]: Unless otherwise noted, specifications are valid at VIN = 16 V, TJ = 25°C, • indicates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
INPUT VOLTAGE SPECIFICATIONS
●
4.5
−
40
V
VUVLO(rise)
VIN rising
●
−
–
4.35
V
VIN UVLO Stop Threshold
VUVLO(fall)
VIN falling
●
−
–
3.95
V
UVLO Hysteresis [2]
VUVLO_HYS
300
450
600
mV
Operating Input Voltage Range [3]
VIN UVLO Start Threshold
VIN
INPUT CURRENTS
VIN Pin Operating Current
IOP
EN and PWM = H, fSW = 2 MHz
●
−
13
18
mA
VIN Pin Quiescent Current
IQ
EN = H and PWM = L, fCLKOUT = 2 MHz
●
−
10
−
mA
VIN = 16 V, VEN = 0 V
●
−
2
10
µA
VIN Pin Sleep Current
IQSLEEP
INPUT LOGIC LEVELS (EN, PWM, APWM)
Input Logic Level-Low
VIL
●
−
−
0.4
V
Input Logic Level-High
VIH
●
1.5
−
−
V
60
100
140
kΩ
Input Pull-Down Resistor
REN, RPWM,
RAPWM
Input = 5 V
OUTPUT LOGIC LEVELS (CLKOUT)
Output Logic Level-Low
VOL
5 V < VIN < 40 V
●
−
−
0.3
V
Output Logic Level-High
VOH
5 V < VIN < 40 V
●
1.8
−
−
V
●
33
50
67
%
−
200
−
ns
CLKOUT Duty Cycle
DCLKOUT
fSW = 2 MHz, no external sync
CLKOUT Negative Pulse Width [2]
tCLKNPW
External sync = 260 kHz to 2.3 MHz
APWM PIN
APWM Frequency Range [2]
fAPWM
Clock signal applied to pin
●
40
−
1000
kHz
Range [2]
DAPWM
Clock signal applied to pin
●
0
−
90
%
VDD
VIN > 4.5 V, iLOAD < 1 mA
APWM Duty Cycle
VDD REGULATOR
Regulator Output Voltage
4.05
4.25
4.45
V
VDD UVLO Start Threshold
VDDUVLOrise
VDD rising, no external load
−
3.2
−
V
VDD UVLO Stop Threshold
VDDUVLOfall
VDD falling, no external load
−
2.65
−
V
gm
VCOMP = 1.5 V
−
1000
−
μA/V
Source Current
IEA(SRC)
VCOMP = 1.5 V
−
–500
−
μA
Sink Current
IEA(SINK)
VCOMP = 1.5 V
−
+500
−
μA
COMP Pin Pull Down Resistance
RCOMP
FAULT = 0, VCOMP = 1.5 V
−
1.4
−
kΩ
ERROR AMPLIFIER
Amplifier Gain [2]
Continued on the next page…
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
6
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 16 V, TJ = 25°C, • indicates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
DITHERING CONTROL
DITH Pin Source Current
iDITH(src)
Output current when VDITH < 0.8 V
−
20
−
μA
DITH Pin Sink Current
iDITH(sink)
Output current when VDITH > 1.2 V
−
−20
−
μA
VOVP(th)
OVP pin connected to VOUT
OVERVOLTAGE PROTECTION
OVP Pin Voltage Threshold
OVP Pin Sense Current Threshold
iOVP(th)
OVP Sense Current Temperature
Coefficient [2]
∆iOVP
Current into OVP pin
IOVPLKG
VOUT = 16 V, EN = L
OVP Pin Leakage Current
OVP Variation at Output
Undervoltage Detection Threshold
Secondary Overvoltage Protection
ΔOVP
VUVP(th)
VOVP2
●
Current into OVP pin at 125ºC
Measured over temperature
●
●
2.2
2.5
2.8
V
140
146.5
153
µA
140
150
160
µA
−
−36
−
nA/ºC
−
0.1
1
µA
Measured at VOUT when ROVP = 249 kΩ
−
−
5
%
Measured at VOUT when ROVP = 249 kΩ [2]
−
3.3
4.2
V
Measured at VOUT when ROVP = 0 Ω
−
0.2
0.25
V
Measured at SW pin; part latches when OVP2
is detected
●
51
55
59
V
ISW = 0.75 A, VIN = 16 V
●
−
250
500
mΩ
BOOST SWITCH
Switch On Resistance
Switch Pin Leakage Current
RSW
ISWLKG25
VSW = 13.5 V, VPWM = VIL, TJ = 25°C
−
0.1
1
µA
ISWLKG85 [2]
VSW = 13.5 V, VPWM = VIL, TJ = 85°C
−
−
10
µA
●
3.0
3.75
4.5
A
Switch Pin Current Limit
ISW(LIM)
IC truncates present switching cycle when
primary limit is reached
Secondary Switch Current Limit [2]
ISW(LIM2)
IC latches off when secondary limit is reached
−
5.1
−
A
Minimum Switch On-Time
tSW(ON)
●
45
65
85
ns
Minimum Switch Off-Time
tSW(OFF)
●
−
50
66
ns
●
1.95
2.15
2.35
MHz
OSCILLATOR FREQUENCY
Oscillator Frequency
FSET Pin Voltage
fSW
RFSET = 10 kΩ
RFSET = 110 kΩ
−
200
−
kHz
VFSET
RFSET = 10 kΩ
−
1.00
−
V
VSYNCL
FSET/SYNC pin logic Low
●
−
−
0.4
V
VSYNCH
FSET/SYNC pin logic High
SYNCHRONIZATION
Sync Input Logic Level
●
1.5
−
−
V
fSWSYNC
●
260
−
2300
KHz
Synchronization Input Min Off-Time
tPWSYNCOFF
●
150
−
−
ns
Synchronization Input Min On-Time
tPWSYNCON
●
150
−
−
ns
Synchronized PWM Frequency
Continued on the next page…
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
7
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 16 V, TJ = 25°C, • indicates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
LED CURRENT SINKS
LEDx Accuracy [4]
ErrLED
iISET = 120 µA (RISET = 8.33 kΩ),
RFSET = 10 kΩ, VAPWM = 0 V
●
−
0.7
3
%
LEDx Matching
ΔLEDx
iISET = 120 µA, RFSET = 10 kΩ, VAPWM = 0 V
●
−
0.8
2
%
LEDx Regulation Voltage
VLED
Measured individually with all other LED pins
tied to ≥1 V, iISET = 120 µA, VAPWM = 0 V
●
600
700
800
mV
iISET = 120 µA, VAPWM = 0 V
●
IISET to ILEDx Current Gain
AISET
ISET Pin Voltage
VISET
Allowable ISET Current
iISET
812
832
852
A/A
0.97
1
1.03
V
●
20
−
144
µA
●
4.5
5.2
6
V
LED String Partial-Short-Detect
Voltage
VLEDSC
Sensed from each LED pin to GND while its current
sink is in regulation; all other LED pins tied to 1 V
LED String Partial-Short-Detect
Duration
tLEDSC
Time required to confirm LED string partialshort and pull FAULT = L
−
−
6.6
µs
LED Pin Shorted-to-GND Check
Duration
tLEDSTG
Wait time before proceeding with Soft-Start (if
no LED pin is shorted to GND)
−
1.5
−
ms
Soft-Start Ramp Up Time
Enable Pin Shut Down Delay
Minimum PWM Dimming On-Time
tSSRU
A80603
6.5
8
9.5
ms
A80603-1
13
16
19
ms
EN goes from High to Low; exceeding tEN(OFF)
results in IC shutdown
●
10
16
22
ms
tPWMH
First and subsequent PWM pulses
●
−
0.3
0.4
µs
IGSINK
VGS = VIN, no input OCP fault
−
−113
−
µA
VGS = VIN – 6 V, input OCP fault tripped
−
6
−
mA
VIN – VSENSE = 200 mV; monitored at FAULT pin
−
−
3
µs
Measured between GATE and VIN when gate
is fully on
−
−6.7
−
V
●
16
20
24
µA
Measured between VIN and VSENSE, RADJ = 0 Ω ●
88
100
110
mV
tPEB
iPEB = 60 µA
2.4
3.2
4.0
µs
VFAULT
IFAULT = 1 mA
−
−
0.5
V
iFAULT-LKG
VFAULT = 5 V
−
−
1
µA
155
170
−
°C
−
20
−
°C
tEN(OFF)
GATE PIN
Gate Pin Sink Current
Gate Pin Source Current
Gate Shutdown Delay When OverCurrent Fault Is Tripped [2]
Gate Voltage
IGSOURCE
tFAULTT
VGS
VSENSE PIN
VSENSE Pin Sink Current
VSENSE Trip Point
iADJ
VSENSETRIP
PEB PIN
PEB Delay Time
FAULT PIN
FAULT Pull Down Voltage
FAULT Pin Leakage Current
THERMAL PROTECTION (TSD)
Thermal Shutdown Threshold [2]
Thermal Shutdown
Hysteresis [2]
TSD
Temperature rising
TSDHYS
For input and output current specifications, negative current is defined as coming out of the node or pin (sourcing);
positive current is defined as going into the node or pin (sinking).
[2] Ensured by design and characterization; not production tested.
[3] Minimum V = 4.5 V is only required at startup. After startup is completed, IC can continue to operate down to V = 4 V.
IN
IN
[4] LED current is trimmed to cancel variations in both Gain and ISET voltage.
[1]
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
8
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
FUNCTIONAL DESCRIPTION
The A80603 is a multistring LED regulator with an integrated
boost switch and four precision current sinks. It incorporates a
patented Pre-Emptive Boost (PEB) control algorithm to achieve
PWM dimming ratio over 15,000:1 at 200 Hz. PEB control
also minimizes output ripple to avoid audible noise from output
ceramic capacitors.
The switching frequency can be either synchronized to an
external clock or generated internally. Spread-spectrum technique (with user-programmable dithering range and modulation
frequency) is provided to reduce EMI. A clock-out signal (CLKOUT) allows other converters to be synchronized to the switching
frequency of A80603.
Only if no faults were detected, then the IC can proceed to start
switching.
As long as EN = H, the PWM pin can be toggled to control the
brightness of LED channels by using PWM dimming. Alternatively, EN and PWM can be tied together to allow single-wire
control for both power on/off and PWM dimming. If EN is pulled
low for longer than 16 ms, the IC shuts off.
Enabling the IC
The A80603 wakes up when EN pin is pulled above logic high
level, provided that VIN pin voltage is over the VIN_UVLO
threshold. The boost stage and LED channels are enabled separately by PWM = H signal after the IC powers up.
The IC performs a series of safety checks at power up, to determine if there are possible fault conditions that might prevent the
system from functioning correctly. Power-up checks include:
• VOUT shorted to GND
• LED pin shorted to GND
• FSET pin open/shorted
Figure 4: Startup showing EN, VDD, CLKOUT, and ISET (PWM = L).
Note that CLKOUT is available as soon as VDD ramps up, even though
Boost stage and LED drivers are not yet enabled.
• ISET pin open/shorted to GND, etc.
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
9
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Powering Up: LED Detection Phase
The VIN pin has an undervoltage lockout (UVLO) function that
prevents the A80603 from powering up until the UVLO threshold is
reached. Once the VIN pin goes above UVLO and a high signal is
present on the EN pin, the IC proceeds to power up. At this point, the
A80603 is going to enable the disconnect switch and will try to check
if any LED pins are shorted to GND and/or are not used. The LED
detection phase starts when PWM = H and the GATE voltage of the
input disconnect PMOS switch is pulled down to 3.3 V below VIN.
VOUT
VOUT
Using all LED
Channels
Using LED
Channels 1-3
LED1
LED1
LED2
LED2
LED3
LED3
GND
LED4
GND
LED4
6.19 kΩ
Figure 6: How to signal an unused LED channel
during startup LED detection phase
Table 1: LED Detection phase voltage threshold levels
LED Pin
Voltage Measured
Interpretation
Outcome
< 120 mV
LED pin shorted to
GND fault
Cannot proceed with
soft-start unless fault
is removed
~ 230 mV
LED channel not in
use
LED channel is
removed from
operation
> 340 mV
LED channel in use
Proceed with soft-start
Figure 5: Startup showing EN+PWM, GATE, LED1, and ISET.
Switching frequency = 2.15 MHz. Note that LED Detection Phase
starts as soon as GATE pin is pulled down to 3.3 V below VIN
(provided that PWM = H).
Once the voltage threshold on VLED pins exceeds ~120 mV, a
delay of approximately 1.5 ms is used to determine the status of
the pins.
Unused LED pin should be terminated with a 6.19 kΩ resistor to
GND. At the end of LED detection phase, any channel with pull
down resistor is then disabled and will not contribute to the boost
regulation loop.
Figure 7: A80603 normal startup showing all channels passed LED
Detection phase. Total LED current = 100 mA × 4 (only LED1 and
LED2 pin voltages are shown).
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Figure 8: A80603-1 normal startup showing all channels passed
LED Detection phase. Note longer soft start timer.
Figure 9: A80603 normal startup showing LED1 channel is disabled
with a 6.19 kΩ resistor to GND. Total LED current = 100 mA × 3.
If an LED pin is shorted to ground, the A80603 will not proceed
with soft start until the short is removed from the LED pin. This
prevents the A80603 from ramping up the output voltage and putting an uncontrolled amount of current through the LEDs.
Figure 10: A80603; LED1 is shorted-to-GND initially, then released.
After the fault is removed, the IC auto-recovers and proceeds with
soft-start. FAULT is released at the end of LED detection phase.
Figure 11: A80603-1, LED1 is shorted-to-GND initially, then released.
After the fault is removed, the IC auto-recovers and proceeds with
soft-start. FAULT is released at the beginning of LED detection phase.
The FAULT pin is pulled low in case of LED pin shorted-to-GND
fault (A80603 only), but the IC continues to retry. Once the fault
is removed, the soft-start process will continue. The same applies
in case of FSET or ISET pin is shorted to GND.
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11
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Power Up: Boost Output Undervoltage
During startup, after the input disconnect switch has been
enabled, the output voltage is checked through the OVP (overvoltage protection) pin. If the sensed voltage does not rise above
VUVP(th), the output is assumed to be at fault and the IC will not
proceed with soft start. Output UVP level is linked to the OVP
level programmed according to the equation:
VUVP = VOVP / 12
Undervoltage protection may be caused by one of the following
faults:
• Output capacitor shorted to GND
• Boost inductor or diode open
• OVP sense resistor open
After an UVP (undervoltage protection) fault, the A80603 is
immediately shutdown and latched off. To enable the IC again,
the latched fault must be cleared. This can be achieved by
powering-cycling the IC, which means either:
• VIN falls below falling UVLO threshold, or
• EN = L for >16 ms.
This is illustrated by the following startup timing diagram (not to
scale):
EN
PWM
VIN
3.3 V
GATE
6.7 V
0
1V
LEDx
0
LED detection
phase
93% OVP
1.5 ms
OVP
VOUT
VIN
0
tSSRU
i LED
0
A B
C
D
Soft-Start
E
Regulation
Figure 12: Complete startup process of A80603
Alternatively, latched fault can be cleared by keeping EN = H but
pulling PWM = L for >16 ms. This method has the advantage that
it does not interrupt the CLKOUT signal.
Explanation of Events:
Soft Start Function
B: When GATE is pulled down to 3.3 V below VIN, ISET becomes
enabled. IC is now waiting for PWM = H to startup.
During startup, the A80603 ramps up its boost output voltage
following a fixed slope, as determined by OVP set point and SoftStart Timer. This technique limits the input inrush current, and
ensures consistent startup time regardless of the PWM dimming
duty cycle.
The soft-start process is completed when any one of the following conditions is met:
• All enabled LED channels have reached their regulation
current,
• Output voltage has reached 93% of its OVP threshold, or
• Soft-start ramp time (tSSRU) has expired.
A: EN = H wakes up the IC. VDD ramps up and CLKOUT
becomes available. IC starts to pull down GATE slowly.
C: Once PWM = H, the IC checks each LEDx pins to determine
if it is in use, disabled, or shorted to GND.
D: Soft-Start begins at the completion of LED pin short-detect
phase of 1.5 ms. VOUT ramps up following a fixed slope set by
OVP and soft-start timer of ~8 ms (16 ms for the A80603-1).
E: Soft-start terminates when all LED currents reached regulation, VOUT reached 93% OVP, or soft-start timer expired.
To summarize, the complete startup process of A80603 consists
of:
•
•
•
•
Power-up error checking
Enabling input disconnect switch
LED pin open/short detection
Soft-start ramp
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12
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Frequency Selection
IC Off
The switching frequency of the boost regulator is programmed
by a resistor connected to FSET pin. The switching frequency
can be selected anywhere from 200 kHz to 2.3 MHz. The chart
below shows the typical switching frequency verses FSET resistor value.
EN=H &
VIN>UVLO
EN=L
Power up
(VDD, BG ready; GATE
pulled L; Fault checking)
FAULT State
(FAULT = L)
Any Fault
detected?
Yes
No
EN=L
IC Ready
(CLKOUT active,
FAULT = L )
EN=H &
PWM=L
EN=H & PWM=H
Pin shorted
to GND fault
→ FAULT = L
LED Pin Check
(In Use, Disabled, or
Shorted to GND)
Time-out without faults
→ FAULT = H
Soft Start
(boost SW active;
LED sinks = on
when PWM = H)
Soft start finished
Any Fault
detected?
PWM Dimming
Yes
Alternatively, the following empirical formula can be used:
No
Equation 1:
LED=on
EN && PWM = L
LED=off
Start 16 ms timer
fSW = 21.5 / (RFSET + 0.2)
where fSW is in MHz and RFSET is in kΩ.
Clear 16 ms timer
EN && PWM = H
Figure 14: Switching Frequency
as a function of FSET Resistance
Timer expired
Figure 13: A80603 Startup Flow Chart
If a fault occurs during operation that will increase the switching frequency, the internal oscillator frequency is clamped to a
maximum of 3.5 MHz. If the FSET pin is shorted to GND, the
part will shut down. For more details, refer to the Fault Mode
Table section.
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13
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Synchronization
EN
The A80603 can also be synchronized using an external clock.
At power up, if the FSET pin is held low, the IC will not start.
Only when the FSET pin is tristated to allow for the pin to rise to
about 1 V, or when a sync clock is detected, the A80603 will then
try to power up.
The basic requirement of the external sync signal is 150 ns
minimum on-time and 150 ns minimum off time. The diagram
below shows the timing restrictions for a synchronization clock at
2.2 MHz.
t PWSYNCON
154 ns
PWM
500 ns
Ext_Sync
/ FSET 1 V
CLKOUT
Internal oscillator
External Sync
Figure 16: Avoid switching over between Internal
Oscillator and External Sync in highlighted region
Loss of External Sync Signal
150 ns
Suppose the A80603 started up with a valid external SYNC signal, but the SYNC signal is lost during normal operation. In that
case, one of the following happens:
150 ns
t PWSYNCOFF
t = 454 ns
Figure 15: Pulse width requirements
for an External Sync clock at 2.2 MHz
Based on the above, any clock with a duty cycle between 33%
and 66% at 2.2 MHz can be used. The table below summarizes
the allowable duty cycle range at various synchronization frequencies.
Table 2: Acceptable Duty Cycle range for External Sync
clock at various frequencies
Sync. Pulse Frequency
Duty Cycle Range
2.2 MHz
33% to 66%
2 MHz
30% to 70%
1 MHz
15% to 85%
600 kHz
9% to 91%
300 kHz
4.5% to 95.5%
If it is necessary to switch over between internal oscillator and
external sync during operation, ensure the transition takes place
at least 500 ns after the previous PWM = H rising edge. Alternatively, execute the switchover during PWM = L only. This restriction does not apply if PWM dimming is not being used.
• If the external SYNC signal is high impedance (open), the
IC continues normal operation after approximately 5 μs, at
the switching frequency set by RFSET. No FAULT flag is
generated.
• If the external SYNC signal is stuck low (shorted to ground),
the IC will detect an FSET-shorted-to-GND fault. FAULT
pin is pulled low after approximately 10 μs, and switching is
disabled. Once the FSET pin is released or SYNC signal is
detected again, the IC will proceed to soft-start.
To prevent generating a fault when the external SYNC signal
is stuck at low, the circuit shown below can be used. When the
external SYNC signal goes low, the IC will continue to operate
normally at the switching frequency set by the RFSET. No FAULT
flag is generated.
External
Sychronization
220 pF
Signal
Schottky
Barrier
Diode
FSET/SYNC
RFSET
10 kΩ
Figure 17: Countermeasure for
External Sync Stuck-at-Low Fault
It is important to use a small capacitance for the AC-coupling
capacitor (220 pF in the above example). If the capacitance is too
large, the IC may incorrectly declare a FSET-shorted-to-GND
fault and restart.
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14
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Switching Frequency Dithering
To minimize the peak EMI spikes at switching frequency harmonics, the A80603 offers the option of frequency dithering, or
spread-spectrum clocking. This feature simplifies the input filters
needed to meet the automotive CISPR 25 conducted and radiated
emission limits.
There are no hard limits on dithering range and modulation
frequency. As a general guideline, pick a dithering range between
±5% and 10%, with the modulation frequency between 1 kHz and
3 kHz. In practice, using a larger dithering range and/or higher
modulation frequency do not generate any noticeable benefits.
For maximum flexibility, the A80603 allows both dithering range
and modulation frequency to be independently programmable
using two external components.
If dithering function is not desired, it can be disabled by disconnecting the RDITH between DITH and FSET pins. Connect DITH
pin to VDD if CDITH is not populated. Dithering is always disabled when fSW is controlled by external sync. RDITH and CDITH
have no effects in this case even if they were populated.
The Dithering Modulation Frequency is given by the approximate
equation:
Clock Out Function
Equation 2:
fDM (kHz) = 25 / CDITH (nF)
where CDITH is the value of capacitor connected from DITH
pin to GND.
The dithering Range is given by the approximate equation:
Equation 3:
Range (±%) = 20 × RFSET / RDITH
where RFSET is the resistor from FSET pin to GND, RDITH is
the resistor between DITH and FSET pins.
As an example, by using RFSET = 10 kΩ, RDITH = 40.1 kΩ,
and CDITH = 22 nF, the resulted switching frequency is fSW =
2.15 MHz ±5% modulated at 1.1 kHz. This is illustrated by the
following diagram.
FSET
RFSET
10 kΩ
iFSET = 100 µA
±5 µA
RDITH
40.1 kΩ
DITH
The CLKOUT signal is available as soon as the IC is enabled
(EN = H), even when the boost stage is not active (PWM = L).
Its frequency is the same as that of the internal oscillator. Its
duty cycle, however, depends on how the switching frequency is
generated:
• If fSW is programmed by FSET resistor, the CLKOUT duty
cycles is approximately 50%.
• If fSW is controlled by external sync, the output signal has a
fixed 150 ns negative pulse width (CLKOUT = L), regardless
of the external sync frequency.
This is illustrated by the following waveforms:
VDITH
1.2 V
iDITH = ±20 µA
The A80603 allows other ICs to be synchronized to its internal
switching frequency through the CLKOUT pin.
VFSET
1.0 V
0.8 V
CDITH
22 nF
Dithering Range =
±5%
iDITH
20 µA
0
Modulation
frequency
= 1.1 kHz
–20 µA
Per iod = 0.8 × C / i
(0.88 ms when C = 22 nF)
fSW (MHz)
2.25
2.15
2.05
Time (ms)
0
0.88
Figure 18: How to Program Switching Frequency
Dithering Range and Modulation Frequency
Figure 19: Without external sync, the CLKOUT signal has a fixed
duty cycle of 50%. Delay from CLKOUT falling edge to SW falling
edge is approximately 50 ns.
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15
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
PWM Dimming
When both EN and PWM pins are pulled high, the A80603 turns
on all enabled LED current sinks. When either EN or PWM is
pulled low, all LED current sinks are turned off. The compensation (COMP) pin is floated, and critical internal circuits are kept
active.
Figure 20: With external sync, the CLKOUT signal has a fixed
negative pulse width of 200 ns. Delay from SYNC rising edge to
CLKOUT falling edge is approximately 60 ns.
LED Current Setting
The maximum LED current can be up to 120 mA per channel,
and is set through the ISET pin. Connect a resistor RISET between
this pin and GND. The relation between ILED and RISET is given
below:
Equation 4:
By using the patented Pre-Emptive Boost (PEB) control algorithm, the A80603 is able to achieve minimum PWM dimming
on-time down to 300 ns. This translates to PWM dimming ratio
up to 15,000:1 at the PWM dimming frequency of 200 Hz. Technical details on PEB will be explained in the next section.
ILED = ISET × AISET
ISET = VISET / RISET
Therefore RISET = (VISET × AISET ) / ILED
Figure 21: PWM dimming operation at 20% 1 kHz. CH1 = PWM (5 V/
div), CH2 = SW (20 V/div), CH3 = VOUT, CH4 = iLED (200 mA/div).
= 832 / ILED
where ILED current is in mA and RISET is in kΩ.
This sets the maximum current through the LEDs, referred to
as the ‘100% current’. The average LED current can be reduced
from the 100% current level by using either PWM dimming or
analog dimming.
Table 3: ISET resistor values vs. LED current. Resistances
are rounded to the nearest E-96 (1%) resistor value.
Standard Closest RISET
Resistor Value
LED current per channel
6.98 kΩ
120 mA
8.25 kΩ
100 mA
10.5 kΩ
80 mA
13.7 kΩ
60 mA
21.0 kΩ
40 mA
Figure 22: Zoom in view for PWM on-time = 10 µs. Notice that the
LED current is shifted with respect to PWM signal. Ripple at VOUT
is ~0.2 V when using 2 × 4.7 µF MLCC as output capacitors.
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
CH1 (Yellow) = PWM (5 V/div); CH2 (Red) = Inductor current
(500 mA/div); CH3 (Blue) = VOUT (1 V/div); CH4 (Green) =
LED current (200 mA/div); time scale = 2 µs/div.
Figure 23: Zoom-in view showing A80603 is able to regulate LED
current at PWM on-time down to 300 ns.
The typical PWM dimming frequencies fall between 200 Hz and
1 kHz. There is no hard limit on the highest PWM dimming frequency that can be used. However at higher PWM frequency, the
maximum PWM dimming ratio will be reduced. This is shown in
the following table:
Table 4: Maximum PWM Dimming Ratio that can be achieved
when operating at different PWM Dimming Frequency
PWM Frequency
PWM Period
Maximum PWM
Dimming Ratio
200 Hz
5 ms
15,000:1
1 kHz
1 ms
3,000:1
3.3 kHz
300 µs
1,000:1
20 kHz
50 µs
150:1
Figure 24: Traditional PWM Dimming operation where boost switch
and LED current are enabled at the same time. Note that VOUT
shows overall ripple of ~0.5 V
When PWM signal goes high, a conventional LED driver turns
on its boost switching at the time with LED current sinks. The
problem is that the inductor current takes several switching cycles
to ramp up to its steady-state value before it can deliver full
power to the output load. During the first few cycles, energy to
the LED load is mainly supplied by the output capacitor, which
results in noticeable dip in output voltage.
Pre-Emptive Boost
The basic principle of pre-emptive boost (PEB) can be best
explained by the following two waveforms. The first one shows
how a conventional LED driver operates during PWM dimming
operation. The second one shows that of the A80603.
Common test conditions for both cases:
PWM = 1% at 1 kHz (on-time=10 µs), fSW = 2.15 MHz,
L = 10 µH, VIN = 12 V, LED load = 8 series (VOUT = ~25 V)
at 100 mA × 4. COUT = 2 × 4.7 µF 50 V 1210 MLCC.
COMP: RZ = 280 Ω, CZ = 68 nF.
Common scope settings:
Figure 25: A80603 PWM dimming operation with PEB delay set to
3 µs. Note that VOUT ripple is reduced to ~0.2 V.
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17
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
In the A80603, the boost switch is also enabled when PWM goes
high. However, the LED current is not turned on until after a
short delay of tPEB. This allows the inductor current to build up
before it starts to deliver the full power to LED load. During the
pre-boost period, VOUT actually bumps up very slightly, while
the following dip is essentially eliminated. When PWM goes low,
both boost switching and LED remains active for the same delay
of tPEB. Therefore the PWM on-time is preserved in LED current.
Analog Dimming with APWM Pin
APWM
RISET
PEB delay can be programmed using an external resistor, RPEB,
from PEB pin to GND. Their relationship is shown in the following chart:
LED Driver
Figure 27: Simplified block diagram of APWM function
5
The APWM pin is used in conjunction with the ISET pin to
achieve analog dimming. This is a digital signal pin that internally adjusts the ISET current. The typical input signal frequency
is between 40 kHz and 1 MHz. The duty cycle of this signal is
inversely proportional to the percentage of current delivered to
the LED. The relationship is shown below:
4
Normalized LED Current vs. APWM Duty Cycle
9
8
7
tPEB (µs)
PWM
PEB Delay (µs) vs. PEB Resistor value (kΩ)
10
APWM ISET
Current
Adjust Block
ISET
Current
Mirror
ISET
6
3
100%
2
80%
0
6
8
10
12
14
16
RPEB (kΩ)
18
20
22
24
Figure 26: How PEB delay time varies with value of PEB pin resistor to GND.
Ideally, tPEB is equal to the inductor current ramp up time. But the
latter is affected by many external parameters, such as switching
frequency, inductance, VIN and VOUT ratio, etc. Therefore, some
experimentation is required to optimize the PEB delay time. In
general for switching frequency at 2 MHz, tPEB = 2.5 to 4 µs is a
good starting point.
The advantage of PEB is that even a non-optimized delay time
can significantly reduce the output ripple voltage compared to a
conventional LED driver.
Measured
LED Current
1
60%
Theore�cal
40%
20%
0%
0%
20%
40%
60%
APWM Duty Cycle
80%
100%
Figure 28: Showing LED current is inversely proportional to the
APWM duty cycle. Test conditions: VIN =12 V, VOUT = 25 V (8 ×
WLED), total LED current = 100 mA × 4, APWM frequency = 100 kHz
As an example, a system that delivers a full LED current of
100 mA per channel would deliver 75 mA when an APWM signal
with a duty-cycle of 25% is applied (because analog dimming
level is 100% – 25% = 75%). This is demonstrated by the following waveforms.
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
As an example, assume that:
• LED from lowest bin has an efficacy of 80 lm/W
• LED highest bin has an efficacy of 120 lm/W
Suppose the maximum LED current was set at 100 mA based
LEDs from lowest bin. When using LEDs from highest bin, the
current should then be reduces to 67% (80/120). This can be
achieved by sending APWM clock with 33% duty cycle.
When analog dimming is not used, APWM pin should be either
tied to GND or left floating (there is an internal pull-down resistor to GND).
Extending LED Dimming Ratio
Figure 29: PWM = H. Total LED current drops from 400 mA (4 ×
100 mA/ch) to 300 mA when APWM of 25% duty cycle is applied.
Note that LED current takes ~0.5 ms to settle after change in APWM.
The dynamic range of LED brightness can be further extended,
by using a combination of PWM duty cycle, APWM duty cycle,
and analog dimming method.
For example, the following approach can be used to achieve a
100,000:1 dimming ratio at 200 Hz:
• Vary PWM duty cycle from 100% down to 0.01% to give
10,000:1 dimming. This requires PWM dimming on-time be
reduced down to 0.5 µs.
• With PWM dimming on-time fixed at 0.5µs, vary APWM
duty from 0% to 90% to reduce peak LED current from 100%
down to 10%. This gives a net effect of 100,000:1 dimming.
Figure 30: PWM = 25% at 1 kHz. Peak LED current drops from
400 mA (4 × 100 mA/ch) to 300 mA when APWM of 25% duty cycle
is applied
One popular application of analog dimming is for LED brightness
calibration, commonly known as ‘LED Binning’. LEDs from
the same manufacturer and series are often grouped into different ‘bins’ according to their light efficacy (lumens per watt). It is
therefore necessary to calibrate the ‘100% current’ for each LED
bin, in order to achieve uniform luminosity.
To use APWM pin as a trim function, the user should first set
the 100% current based on efficacy of LED from the lowest bin.
When using LED with higher efficacy, the required current is then
trimmed down to the appropriate level using APWM duty cycle.
Normalized LED Current (%)
100
Average LED Current vs. PWM Dimming Duty Cycle
10
1
0.1
PWM Dimming
0.01
APWM + PWM
Ideal
0.001
0.001
0.01
0.1
1
10
PWM Dimming Duty Cycle (%)
100
Figure 31: How to achieve 100,000:1 dimming ratio by using both
PWM and APWM. Test conditions: VIN = 12 V, VOUT = 25 V (8 ×
WLED), total LED current = 400 mA, PWM frequency = 200 Hz,
APWM frequency = 100 kHz.
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19
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Note that the A80603 is capable of providing analog dimming
range greater than 10:1. By applying APWM with 96% duty
cycle, for example, an analog dimming range of 25:1 can be
achieved. However, this requires the external APWM signal
source to have very fine pulse-width resolution. At 200 kHz
APWM frequency, a resolution of 50 ns is required to adjust its
duty cycle by 1%.
Analog Dimming with External Voltage
Besides using APWM signal, the LED current can also be
reduced by using an external voltage source applied through a
resistor to the ISET pin. The dynamic range of this type of dimming is dependent on the ISET pin current. The recommended
iSET range is from 20 µA to 144 µA for the A80603. Note that
the IC will continue to work at iSET below 20 µA, but the relative
error in LED current becomes larger at lower dimming level.
Below is a typical application circuit using a DAC (digital-analog
converter) to control the LED current. The ISET current (which
directly controls the LED current) is normally set as VISET/RISET.
The DAC voltage can be higher or lower than VISET, thus adjusting the LED current to a lower or higher value.
A80603
R2
VDAC
When VDAC is lower than 1.00 V, the LED current is increased.
Some common applications for the above scheme include:
• LED binning
• Thermal fold-back using external NTC (negative temperature
coefficient) thermistor
In the following application example, the thermistor used is NTCS0805E3684JXT (680 kΩ @ 25°C). R1 = 336 kΩ, R2 = 20 kΩ,
and R3 = 8.45 kΩ. The LED current per channel is reduced from
97 mA at 25°C to 34 mA at 125°C.
VDD
(4.25 V)
NTC
R2
R1
A80603
ISET
(1.0 V)
R3
GND
Figure 33: Thermal foldback of
LED current using NTC thermistor
ISET
RISET
GND
Figure 32: Adjusting LED current
with an external voltage source
Equation 5:
iISET =
VISET VDAC − VISET
−
RISET
R2
where VISET is the ISET pin voltage (typically 1.0 V), and
VDAC is the DAC output voltage.
When VDAC is higher than 1.00 V, the LED current is reduced.
Figure 34: LED current varies with temperature
when using thermistor NTCS0805E3684JXT
for thermal foldback
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20
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
VDD
The VDD pin provides regulated bias supply for internal circuits.
Connect a CVDD capacitor with a value of 1 μF or greater to this
pin. The internal LDO can deliver up to 2 mA of current with a
typical VDD voltage of about 4.25 V. This allows it to serve as
the pull up voltage for FAULT pin.
There is an alternative way to reset the internal fault status registers. By keeping EN = H and PWM = L for longer than 16 ms,
the A80603 clears all internal fault registers but does not go into
sleep mode. The next time PWM pin goes high, the IC will still
go through soft start process. The difference is that VDD voltage
and CLKOUT signal are always available as long as EN = H.
Shutdown
If EN pin is pulled low for longer than tEN(OFF) (~16 ms), the
A80603 enters shutdown (sleep mode). The next time EN pin
goes high, all internal fault registers are cleared. The IC needs to
go through a complete soft start process after PWM goes high.
Figure 36: As long as EN = H, the IC does not shut down VDD and
CLKOUT. But internal latched faults are cleared by PWM = L for
~16 ms.
Figure 35: After EN = L for ~16 ms, the IC completely shuts down
so VDD (Blue) decays.
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21
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
FAULT DETECTION AND PROTECTION
LED String Partial-Short Detect
All LED current sink pins (LED1 to LED4) are designed to withstand the maximum output voltage, as specified in the Absolute
Maximum Ratings table. This prevents the IC from being damaged if VOUT is directly applied to an LED pin due to an output
connector short.
For the A80603 only, the FAULT pin is pulled low in case any
LED string is directly or partially shorted. However, the rest of
the LED strings continue to operate. The FAULT pin is latched at
low until it is reset by either EN = L or PWM = L for >16 ms.
In case of direct-short or partial-shorted fault in any LED string during operation, the LED pin with voltage exceeding VLEDSC will be
removed from regulation. This prevents the IC from dissipating too
much power due to large voltage drop across the LED current sink.
Figure 39: A80603-1 startup sequence when LED string#2 has a
partial-short fault (6 × WLED instead of 8). As soon as LED2 pin rises
above VLEDSC (~5 V), the channel is disabled but FAULT remains High.
Figure 37: A80603 Normal startup sequence showing voltage at LED1 and
LED2 pins. VIN = 6 V, output = 8 × WLED in series, current = 4 × 100 mA
At least one LED pin must be at regulation voltage (below
~1.2 V) for the LED string partial-short detection to activate.
In case all of the LED pins are above regulation voltage (this
could happen when the input voltage rises too high for the LED
strings), they will continue to operate normally.
Overvoltage Protection
The A80603 offers a programmable output overvoltage protection
(OVP), plus a fixed secondary overvoltage protection (OVP2).
The OVP pin has a threshold level of 2.5 V typical. Overvoltage
protection is tripped when current into this pin exceeds ~150 µA.
A resistor can be used to set the OVP threshold up to 40 V approximately. This is sufficient for driving 11 white LEDs in series.
The formula for calculating the OVP resistor is shown below:
Equation 6:
ROVP = (VOVP – VOVP(th)) / iOVP(th)
where VOVP is the desired OVP threshold, VOVP(th) = 2.5 V
typical, iOVP(th) = 150 µA typical.
Figure 38: A80603 startup sequence when LED string#2 has a partialshort fault (6 × WLED instead of 8). As soon as LED2 pin rises above
VLEDSC (~5 V), the channel is disabled and FAULT = Low.
To determine the desired OVP threshold, take the maximum LED
string voltage at cold and add ~10% margin on top of it.
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
The OVP event is not a latched fault and, by itself, does not pull
the FAULT pin to low. If the OVP condition occurs during a load
dump, for example, the IC will stop switching but not shut down.
There are several possibilities of why an OVP condition is
encountered during operation. The two most common being an
open LED string and a disconnected output connector.
The waveform below shows a typical OVP condition. When one
LED string becomes open, current through its LED driver drops
to zero. The A80603 responses by boosting the output voltage
higher. When output reaches OVP threshold, the LED string without current is removed from regulation. The rest of LED strings
continue to draw current and drain down VOUT. Once VOUT falls
below ~97% OVP, boost will resume switching to power the
remaining LED strings.
Figure 41: An open-diode fault is introduced during normal operation. SW voltage jumps to ~70 V, causing the MOSFET to self-conduct and dissipate energy in the inductor.
It should be noted that the SW MOSFET in A80603 is designed
to avalanche and dissipate the excess energy safely in case of
open-diode fault. Therefore the IC is not damaged even though
SW node rises above AbsMax rating momentarily.
Boost Switch Overcurrent Protection
The boost switch is protected with cycle-by-cycle current limiting set at typical 3.75 A, minimum 3.0 A. The waveform below
shows normal switching at VIN = 6 V, VOUT = 25 V, and total
LED current 400 mA.
Figure 40: An open-LED string faults causes VOUT to ramp up and
trip OVP. The A80603 then disables the open LED string and continues with remaining strings.
The A80603 also has a fixed secondary overvoltage protection to
protect its internal switch. If the boost Schottky diode suddenly
becomes open during normal operation, the energy stored in the
inductor will force SW node voltage to increase rapidly. Once
voltage on the SW pin exceeds OVP2, switching and all LED
drivers are disabled. The IC remains latched off until it is reset.
Figure 42: Normal switching waveform at VIN = 6 V showing the SW
node voltage (Red) and inductor current (Green).
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
When the input voltage is reduced further, input current increases
and peak switch current reaches 3.2 A. SW_OCP is tripped and
the IC skips a switching cycle to reduce the current
If the input current level goes above the preset current limit threshold, the part will be shut down in less than 3 µs. This is a latched
condition. The fault flag is also set to indicate a fault. This feature
protects the input from drawing too much current during heavy
load. It also prevents catastrophic failure in the system due to a
short of the inductor or output capacitors shorted to GND.
The waveform below illustrates the typical input overcurrent
fault condition. As soon as input OCP limit is reached, the part
disables the gate of the disconnect switch Q1 and latches off.
Figure 43: When peak current in SW pin reaches ~3.2 A, overcurrent protection kicks in and the IC skips a switching cycle.
There is also a secondary current limit (ISW(LIM2)) that is sensed
on the boost switch. This current limit once detected immediately
shuts down the A80603. This current limit is set at about 33%
higher than the pulse-by-pulse current limit. It is to protect the
switch from destructive current spikes in case the boost inductor
is shorted. Once this limit is tripped, the A80603 will immediately shut down and latch off.
Input Overcurrent Protection and
Disconnect Switch
VIN
iSENSE
RSC
iADJ
To L1
RADJ
VSENSE
VIN
CG
Q1
(PMOS)
GATE
A80603
VIN – VSENSE = RSC × iSENSE + RADJ × iADJ
Figure 44: Optional input disconnect switch using a PMOSFET
The primary function of the input disconnect switch is to protect
the system and the device from catastrophic input currents during
a fault condition.
Figure 45: Startup into an output shorted-to-GND fault. Input OCP
is tripped when current (Green trace) exceeds 4 A. PMOS Gate
(Red) is turned off immediately and IC latches off.
During startup when Q1 first turns on, an inrush current flows
through Q1 into the output capacitance. If Q1 turns on too fast
(due to its low gate capacitance), the inrush current may trip
input OCP limit. In this case, an external gate capacitance CG is
added to slow down the turn-on transition. Typical value for CG is
around 4.7 to 22 nF. Do not make CG too large, since it also slows
down the turn-off transient during a real input OCP fault.
Setting the Current Sense Resistor
The typical threshold for the current sense is 100 mV when RADJ
is 0 Ω. The A80603 can have this voltage trimmed using the RADJ
resistor. The typical trip point should be set to at least 3.75 A,
which coincides with the cycle-by-cycle peak current limit typical threshold. A sample calculation is done below for 4.2 A of
input current.
When RADJ is not used:
Equation 7:
VSENSETRIP = RSC × iSENSE = 100 mV
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
The desired sense resistor is RSC = 100 mV / 4.2 A = 23.8 mΩ.
But this is not a standard E-24 resistor value. Pick the closest
lower value which is 22 mΩ.
When RADJ is used:
Equation 8: VSENSETRIP = RSC × iSENSE + RADJ × iADJ
Therefore
RADJ = [VSENSETRIP – (RSC × iSENSE)] / iADJ
= [100 mV – 92.4 mV] / 20 µA = 380 Ω
Input UVLO
When VIN and VSENSE rise above VUVLOrise threshold, the
A80603 is enabled. The IC is disabled when VIN falls below VUVLOfall threshold for more than 50 μs. This small delay is used to
avoid shutting down because of momentary glitches in the input
power supply.
The possible fault conditions that the part can detect include:
•
•
•
•
•
•
•
•
•
•
Open LED Pin or open LED string
Shorted or partially shorted LED string
LED pin shorted to GND
Open or shorted boost diode
Open or shorted boost inductor
VOUT short to GND
SW shorted to GND
ISET shorted to GND
FSET shorted to GND
Input disconnect switch drain shorted to GND
Note that some of these faults will not be protected if the input
disconnect switch is not being used. An example of this is VOUT
short to GND fault.
Fault Protection During Operation
The A80603 constantly monitor the state of the system to determine if any fault conditions occur during normal operation. The
response to a triggered fault condition is summarized in the table
below. It is important to note that there are several points at which
the A80603 monitors for faults during operation. The locations are
input current, switch current, output voltage, switch voltage, and
LED pins. Some of the protection features might not be active during startup to prevent false triggering of fault conditions.
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Table 5: A80603 Fault Mode Table
Fault Name
Type
Active
Fault Flag
Set
Description
Boost Switch
Disconnect
Switch
LED Sink drivers
Primary Switch Overcurrent
Protection (Cycle-By-Cycle
Current Limit)
Auto-restart
Always
NO
This fault condition is triggered when the SW current exceeds the
cycle-by-cycle current limit, ISW(LIM).The present SW on-time is
truncated immediately to limit the current. Next switching cycle starts
normally.
Off for a single
cycle
ON
ON
Secondary Switch Current
Limit
Latched
Off
Always
YES
When current through boost switch exceeds secondary SW current
limit (iSW(LIM2)) the device immediately shuts down the disconnect
switch, LED drivers and boost. The Fault flag is set. To reset the fault
the EN or PWM pin needs to be pulled low for 16 ms.
OFF
OFF
OFF
Input Disconnect Current
Limit
Latched
Off
YES
The device is immediately shut off if the voltage
across the input sense resistor is above the
VSENSEtrip threshold. To reset the fault the EN or PWM pin must be
pulled low for 16 ms.
OFF
OFF
OFF
Secondary OVP
Latched
Off
Always
YES
Secondary overvoltage protection is used for open diode detection.
When diode D1 opens, the SW pin voltage will increase until
VOVP(SEC) is reached . This fault latches the IC. The input disconnect
switch and LED drivers are disabled. To reset the fault the EN or
PWM pin needs to be pulled low for 16 ms.
OFF
OFF
OFF
LEDx Pin Shorted to GND
Auto-restart
Startup
YES
If any of the LED pins is determined to be shorted to GND when PWM
first goes high, soft-start process is halted. Only when the short is
removed, then soft-start is allowed to proceed.
OFF
ON
OFF
LEDx Pin Open
Auto-restart
Normal
operation
YES
If an LED string is not getting enough current, the device will first
respond by increasing the output voltage until OVP is reached. Any
LED string that is still not in regulation will be disabled. The device will
then go back to normal operation by reducing the output voltage to
the appropriate voltage level.
ON
ON
OFF for open
pins.
ON for all others.
ISET Short Protection
Auto-restart
Always
YES
Fault occurs when the ISET current goes above 150% of max current.
The boost will stop switching and the IC will disable the LED sinks
until the fault is removed. When the fault is removed, the IC will try to
regulate to the preset LED current.
OFF
ON
OFF
YES
Fault occurs when the FSET current goes above 150% of max
current. The boost will stop switching, Disconnect switch will turn off
and the IC will disable the LED sinks until the fault is removed. When
the fault is removed, the IC will try to restart with soft-start.
OFF
OFF
OFF
STOP during
OVP event.
ON
ON
FSET/SYNC Short
Protection
Auto-restart
Always
Always
Overvoltage Protection
Auto-restart
Always
NO
Fault occurs when current into OVP pin exceeds iOVP(th) (typically
150 µA). The IC will immediately stop switching but keep the LED
drivers active, to drain down the output voltage. Once the output
voltage decreases to ~97% OVP level, the IC will restart switching to
regulate the output current.
Undervoltage Protection
Auto-restart
Always
YES
Device immediately shuts off boost and current sinks if the voltage at
VOUT is below VUVP(th). This may happen if VOUT is shorted to GND,
or boost diode is open before startup. It will auto-restart once the fault
is removed.
OFF
ON
OFF
LED String Partial Short
Detection
Latched
and
Continue
Always
YES
Fault occurs if an LED pin voltage exceeds VLEDSC with its current
sink in regulation, while at least one other LED pin is below ~1.2 V.
This may happen when two or more LEDs are shorted within a string.
The LED string exceeding the threshold will then be disabled and
removed from operation. This fault cannot be detected if PWM ontime is < tLEDSD (5.5 µs max)
ON
ON
OFF for shorted
string. ON for all
others.
Overtemperature Protection
Auto-restart
Always
YES
Fault occurs when the die temperature exceeds the over-temperature
threshold, typically 170°C. IC will restart after temperatures drops
lower by TSDHYS
OFF
OFF
OFF
VIN UVLO
Auto-restart
Always
NO
Fault occurs when VIN drops below VUVLO(fall), which is 3.9 V max.
This fault resets all latched faults.
OFF
OFF
OFF
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Table 6: A80603-1 Fault Mode Table
Fault Name
Type
Active
Fault Flag
Set
Description
Boost Switch
Disconnect
Switch
LED Sink drivers
Primary Switch Overcurrent
Protection (Cycle-By-Cycle
Current Limit)
Auto-restart
Always
NO
This fault condition is triggered when the SW current exceeds the
cycle-by-cycle current limit, ISW(LIM).The present SW on-time is
truncated immediately to limit the current. Next switching cycle starts
normally.
Off for a single
cycle
ON
ON
Secondary Switch Current
Limit
Latched
Off
Always
YES
When current through boost switch exceeds secondary SW current
limit (iSW(LIM2)) the device immediately shuts down the disconnect
switch, LED drivers and boost. The Fault flag is set. To reset the fault
the EN or PWM pin needs to be pulled low for 16 ms.
OFF
OFF
OFF
Input Disconnect Current
Limit
Latched
Off
YES
The device is immediately shut off if the voltage
across the input sense resistor is above the
VSENSEtrip threshold. To reset the fault the EN or PWM pin must be
pulled low for 16 ms.
OFF
OFF
OFF
Secondary OVP
Latched
Off
Always
YES
Secondary overvoltage protection is used for open diode detection.
When diode D1 opens, the SW pin voltage will increase until
VOVP(SEC) is reached . This fault latches the IC. The input disconnect
switch and LED drivers are disabled. To reset the fault the EN or
PWM pin needs to be pulled low for 16 ms.
OFF
OFF
OFF
LEDx Pin Shorted to GND
Auto-restart
Startup
NO *
If any of the LED pins is determined to be shorted to GND when PWM
first goes high, soft-start process is halted. Only when the short is
removed, then soft-start is allowed to proceed.
OFF
ON
OFF
LEDx Pin Open
Auto-restart
Normal
operation
NO *
If an LED string is not getting enough current, the device will first
respond by increasing the output voltage until OVP is reached. Any
LED string that is still not in regulation will be disabled. The device will
then go back to normal operation by reducing the output voltage to
the appropriate voltage level.
ON
ON
OFF for open
pins.
ON for all others.
ISET Short Protection
Auto-restart
Always
YES
Fault occurs when the ISET current goes above 150% of max current.
The boost will stop switching and the IC will disable the LED sinks
until the fault is removed. When the fault is removed, the IC will try to
regulate to the preset LED current.
OFF
ON
OFF
YES
Fault occurs when the FSET current goes above 150% of max
current. The boost will stop switching, Disconnect switch will turn off
and the IC will disable the LED sinks until the fault is removed. When
the fault is removed, the IC will try to restart with soft-start.
OFF
OFF
OFF
STOP during
OVP event.
ON
ON
FSET/SYNC Short
Protection
Auto-restart
Always
Always
Overvoltage Protection
Auto-restart
Always
NO
Fault occurs when current into OVP pin exceeds iOVP(th) (typically
150 µA). The IC will immediately stop switching but keep the LED
drivers active, to drain down the output voltage. Once the output
voltage decreases to ~97% OVP level, the IC will restart switching to
regulate the output current.
Undervoltage Protection
Auto-restart
Always
YES
Device immediately shuts off boost and current sinks if the voltage at
VOUT is below VUVP(th). This may happen if VOUT is shorted to GND,
or boost diode is open before startup. It will auto-restart once the fault
is removed.
OFF
ON
OFF
ON
ON
OFF for shorted
string. ON for all
others.
LED String Partial Short
Detection
Auto-restart
Always
NO *
Fault occurs if an LED pin voltage exceeds VLEDSC with its current
sink in regulation, while at least one other LED pin is below ~1.2 V.
This may happen when two or more LEDs are shorted within a string.
The LED string exceeding the threshold will then be disabled and
removed from operation. This fault cannot be detected if PWM ontime is < tLEDSD (5.5 µs max)
Overtemperature Protection
Auto-restart
Always
YES
Fault occurs when the die temperature exceeds the over-temperature
threshold, typically 170°C. IC will restart after temperatures drops
lower by TSDHYS
OFF
OFF
OFF
VIN UVLO
Auto-restart
Always
NO
Fault occurs when VIN drops below VUVLO(fall), which is 3.9 V max.
This fault resets all latched faults.
OFF
OFF
OFF
* Indicates different behavior between A80603 and A80603-1.
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A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
A80603 Fault Recovery Mechanism
IC Off
EN=H &
VIN>UVLO
Power up
(VDD, BG ready; GATE
pulled L; Fault checking)
Timing Diagram to show how to clear Latched Fault with PWM = L
IC Ready
EN=L
(CLKOUT active,
FAULT =L)
EN=H &
PWM=L
Normal
Fault Removed
OCP
EN=H & PWM=H
Pin shorted
to GND fault
FAULT =L
VOUT-GND Shorted Fault
i_IN
LED Pin Check
0
(In-Use, Disabled, or
Shorted-to-GND)
Time-out without faults
FAULT =H
FAULT
Soft Start
(boost SW active; LED
sinks=on when PWM=H)
EN=H &
PWM=L for
>16 ms
EN=L for
>16 ms
PWM
Soft start finished
A
Running
(boost and LED sinks
controlled by PWM)
fault cleared
EN=H & PWM=L
for >16 ms
EN=L for
>16 ms
Latching fault
detected *
Non-latching
fault detected *
Latched Off
(GATE pulled H, boost
SW and LED sinks
disabled, FAULT =L)
Non-Latched
Fault State
`
16 ms
B
C
16 ms
D
E F
Explanation of events :
A: VOUT-to-GND Short fault introduced. IC trips input OCP which is a latched fault.
FAULT is then pulled Low and IC stays in Latched mode (CLKOUT remains available).
B: After PWM=L for 16 ms, IC clears the latched fault internally but FAULT stays Low.
C: Input OCP is tripped again since VOUT is still shorted to GND. So IC returns to
Latched mode again and FAULT remains Low.
D: PWM=H and VOUT -to-GND Short fault is removed, but IC cannot restart since it is
still in Latched mode.
E: After PWM=L for 16 ms, IC clears the latched fault internally again
F: At the next PWM =H, IC restarts and detected no faults, so FAULT finally goes High
* Note: Fault conditions may be detected in any state or during any state transition. Most faults are non-latching, meaning the
IC will auto-restart as soon as the fault is removed. Only the following faults are latching: Input Disconnect Overcurrent, SW
Secondary OCP, and SW Secondary OVP.
Latching faults can only be cleared by:
1. Reset the IC by bring VIN below UVLO,
2. Reset the IC by bring EN=L for >16 ms, or
3. EN=H and PWM=L for >16 ms.
The last method has the advantage that it does not interrupt the CLKOUT signal. In case the fault condition (e.g. VOUT
shorted to GND) is still present when the latching fault is cleared by PWM=L for >16 ms, the IC will trip fault once again and
stay latched off.
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Wide
Input
Voltage Range
A80603 and
LED Driver
with
Pre-Emptive
Boost
ALT80600
High
Efficiency
Fault
Tolerant
LED
Driver
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
PACKAGE OUTLINE DRAWING
For Reference Only – Not for Tooling Use
Reference Allegro DWG-2871 (Rev. A) or JEDEC MO-220WGGD.
Dimensions in millimeters – NOT TO SCALE.
Exact case and lead configuration at supplier discretion within limits shown.
0.50
0.30
4.00 ±0.10
24
24
0.95
1
1
2
A
2
2.80 4.10
4.00 ±0.10
DETAIL A
24×
2.80
D
0.08
C
0.75 ±0.05
C
+0.05
0.25
–0.07
4.10
SEATING
PLANE
C
PCB Layout Reference View
0.0-0.05
0.50 BSC
0.14 REF
0.20 REF
0.40 ±0.10
0.10 REF
0.05 REF
0.203 REF
0.05 REF
0.40 ±0.10
B
2.70
Detail A
+0.10
–0.15
2
1
0.20 REF
24
2.70
+0.10
–0.15
A
Terminal #1 mark area
B
Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion)
C
Reference land pattern layout (reference IPC7351 QFN50P400X400X80-25W6M); all pads a minimum of 0.20 mm
from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances;
when mounting on a multilayer PCB, thermal vias at the exposed thermal pad land can improve thermal dissipation
(reference EIA/JEDEC Standard JESD51-5)
D
Coplanarity includes exposed thermal pad and terminals
0.10 REF
Package ES, 24-Contact QFN with Exposed Pad and Wettable Flank
Figure 46: Package ES, 24-Pin 4 mm × 4 mm QFN with Exposed Thermal Pad and Wettable Flank
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115 Northeast Cutoff
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Worcester, Massachusetts 01615-0036 U.S.A.
955 Perimeter Road
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29
A80603 and
LED Driver with Pre-Emptive Boost
A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple
Revision History
Number
Date
Description
–
March 4, 2019
Initial release
Copyright 2019, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.
For the latest version of this document, visit our website:
www.allegromicro.com
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