A8904
3-Phase Brushless DC Motor Controller/Driver
with Back EMF Sensing
Features and Benefits
Description
▪ Pin-for-pin replacement for A8902CLBA
▪ Start-up commutation circuitry
▪ Sensorless commutation circuitry
▪ Option of external sector data tachometer signal
▪ Option of external speed control
▪ Oscillator operation up to 20 MHz
▪ Programmable overcurrent limit
▪ Transconductance gain options: 500 mA/V or 250 mA/V
▪ Programmable watchdog timer
▪ Directional control
▪ Serial port interface
▪ TTL-compatible inputs
▪ System diagnostics data-out ported in real time
▪ Dynamic braking through serial port or external terminal
The A8904 is a 3-phase brushless DC motor controller/driver
designed for applications where accurate control of high-speed
motors is required. The three half-bridge outputs are low
on-resistance, N-channel DMOS devices capable of driving up
to 1.2 A. The A8904 provides complete, reliable, self-contained
back EMF sensing, motor start-up, and running algorithms. A
programmable digital frequency-locked loop speed control
circuit together with the linear current control circuitry provides
precise motor speed regulation.
A serial port allows the user to program various features and
modes of operation, such as the speed control parameters,
start-up current limit, sleep mode, direction, and diagnostic
modes.
The A8904 is fabricated in the Allegro® BCD (Bipolar CMOS
DMOS) process, an advanced mixed-signal technology that
combines bipolar, analog, and digital CMOS, with DMOS
power devices.
Packages:
Not to scale
28-pin TSSOP
with exposed thermal pad
(Package LP)
The device is provided in a 24-pin wide-body SOIC package,
with 4 internally-fused leads for enhanced thermal dissipation
(package LB), and a thin ( 100
mA. If the solution experiences ambient temperatures of greater
than 70°C then Cfilter should be rated for 105°C.
All resistors are at least 1/8 W and have a tolerance of ±5%.
In noise-sensitive systems where electromagnetic interference is an issue, or to stabilize the current waveforms with certain motors, it may be necessary to add RC snubbers across the
motor windings as shown in the application circuit on the next
page. The A8904 solution should be relatively noise immune
from the effects of switching voltage spikes etc. if the correct
watchdog capacitor has been selected for optimum blanking and
good layout practices are implemented.
At the range of operating frequencies that the current pulses
are drawn out of the load supply, it is the capacitance reactance
as opposed to the ESR that dominates the overall impedance of
the input filter, Cfilter. Therefore, it is possible to reduce conducted electromagnetic emissions further, by simply increasing the
value of Cfilter. In extremely sensitive systems, it may be necessary to introduce a differential mode inductor in series with the
load supply line.
Layout considerations. The TSSOP part (A8904SLP)
has three separate ground connections, analog, digital, and power that must be connected together externally. A ground plane
should be used to provide heat sinking for the power switches
and the reduction of potential noise pick-up through inductive
loops and radiated emissions. The ground plane should cover the
area beneath the A8904 and extend beyond the outline to form a
plane around all the external components. The exposed thermal
pad of the TSSOP part should be connected to the ground plane.
Filter components, especially Cfilter, timing, and delay
capacitors should be positioned as close as possible to the device
terminals. It is also imperative that the traces to the serial port
and oscillator are as short and as wide as possible to reduce stray
inductance and prevent potential data corruption. In addition,
these traces should be positioned well away from any noisy
signals.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
15
A8904
3-Phase Brushless DC Motor Controller/Driver
with Back EMF Sensing
Typical application
(LB package)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
16
3-Phase Brushless DC Motor Controller/Driver
with Back EMF Sensing
A8904
LB package, 24-pin SOICW
15.40±0.20
4° ±4
24
24
+0.07
0.27 –0.06
10.30±0.33
7.50±0.10
A
1
2.20
9.60
+0.44
0.84 –0.43
2
1
2
0.65
1.27
0.25
24X
SEATING
PLANE
0.10 C
0.41 ±0.10
1.27
C
B PCB Layout Reference View
SEATING PLANE
GAUGE PLANE
2.65 MAX
0.20 ±0.10
For reference only
Pins 6 and 7, and 18 and 19 internally fused
Dimensions in millimeters
(Reference JEDEC MS-013 AD)
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Reference pad layout (reference IPC SOIC127P1030X265-24M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
LP package, 28-pin TSSOP
with exposed thermal pad
0.45
9.70 ±0.10
28
+0.05
0.15 –0.06
0.65
28
4° ±4
1.65
B
3.00
4.40 ±0.10
6.40 ±0.20
3.00
6.10
0.60 ±0.15
A
1
(1.00)
2
5.00
0.25
28X
SEATING
PLANE
0.10 C
+0.05
0.25 –0.06
0.65
C
SEATING PLANE
GAUGE PLANE
1 2
5.00
C
PCB Layout Reference View
1.20 MAX
0.10 MAX
For reference only
(reference JEDEC MO-153 AET)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Exposed thermal pad (bottom surface)
C Reference land pattern layout (reference IPC7351 SOP65P640X120-29CM);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
17
A8904
3-Phase Brushless DC Motor Controller/Driver
with Back EMF Sensing
Copyright ©2003-2008, Allegro MicroSystems, Inc.
The products described here are manufactured under one or more U.S. patents or U.S. patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;
nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
18