APS13295KLHALT

APS13295 Precision Hall-Effect Switch for Consumer and Industrial Applications FEATURES AND BENEFITS DESCRIPTION • • • • • • • • • • • • The APS13295 Hall-effect switch is a three-wire, planar Hall-effect sensor integrated circuit (IC) especially suited for operation over extended temperature ranges (up to 125°C). Unipolar switch points Superior ruggedness and fault tolerance Reverse-polarity and transient protection Operation from –40°C to 175°C junction temperature Output short-circuit and overvoltage protection Superior temperature stability Resistant to physical stress High EMC immunity, ±12 kV HBM ESD Operation from unregulated supplies, 2.8 to 24 V Chopper stabilization Solid-state reliability Industry-standard packages and pinouts PACKAGES: Not to scale 3-pin SIP (suffix UA) This Hall-effect switch IC is ideal for industrial and consumer applications and features performance enhancements permitting high-temperature operation up to 175°C junction temperatures. In addition, the APS13295 includes a number of features designed specifically to maximize system robustness such as reverse-polarity protection, output current limiter, overvoltage, and EMC protection. The single silicon chip includes: a voltage regulator, a Hall plate, small signal amplifier, chopper stabilization, Schmitt trigger, and a short-circuit-protected open-drain output. A south pole of sufficient strength turns the output on. Removal of the magnetic field—or a north pole—turns the output off. The devices include on-board transient protection for all pins, permitting operation directly from unregulated or regulated supplies from 2.8 to 24 V. Two package styles provide a choice of through-hole or surface mounting. Package type LH is a modified SOT23W, surfacemount package, while UA is a three-lead ultra-mini SIP for through-hole mounting. Both packages are lead (Pb) free and RoHs compliant with 100% matte-tin leadframe plating. 3-pin SOT23W (suffix LH) Functional Block Diagram VCC REGULATOR Hall Element DYNAMIC OFFSET CANCELLATION TO ALL SUBCIRCUITS LOW-PASS FILTER HALL AMP. SAMPLE, HOLD & AVERAGING SCHMITT TRIGGER VOUT CONTROL CURRENT LIMIT GND APS13295-DS, Rev. 3 MCO-0000386 October 4, 2021 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 SELECTION GUIDE Part Number Packing [1] Mounting Branding APS13295KLHALX 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A33 APS13295KLHALT [2] 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A33 APS13295KUAA Bulk, 500 pieces/bag 3-pin SIP through hole A34 Ambient Temperature, TA –40°C to 125°C Switch Points (Typ.) BOP BRP 35 G 25 G [1] Contact Allegro [2] Available for additional packing options. through authorized Allegro distributors only. RoHS COMPLIANT VSUPPLY RPULL-UP = 1 kΩ APS13295 1 CBYP = 0.1 µF VCC VOUT 2 VOUT GND 3 Figure 1: Typical Application Circuit Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 2 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 ABSOLUTE MAXIMUM RATINGS Characteristic Voltage [1] Forward Supply Reverse Supply Voltage [1] Output Off Voltage [1] Symbol Notes Rating Units VCC 30 V VRCC –18 V VOUT 30 V Output Current [2] IOUT 60 mA Reverse Output Current IROUT –50 mA Magnetic Flux Density [3] B Unlimited – 165 °C 175 °C Maximum Junction Temperature Storage Temperature TJ(max) For 500 hours Tstg ESD Voltage –65 to 170 °C VESD(HBM) Human Body Model according to AEC-Q100-002 ±12 kV VESD(CDM) Charged Device Model according to AEC-Q100-011 ±1 kV This rating does not apply to extremely short voltage transients such as load dump and/or ESD. Those events have individual ratings, specific to the respective transient voltage event. [2] Through short-circuit current limiting device. [3] Guaranteed by design. [1] GND PINOUT DIAGRAMS AND TERMINAL LIST 3 Terminal List Name 1 VOUT VCC 3-pin SOT23W (suffix LH) 2 3 VOUT 2 GND 1 VCC VCC Description Number LH UA Connects power supply to chip 1 1 VOUT Output from circuit 2 3 GND Ground 3 2 3-pin SIP (suffix UA) Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 3 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 ELECTRICAL CHARACTERISTICS: Valid over full operating voltage, ambient temperature range TA = –40°C to 125°C, and with CBYP = 0.1 µF, unless otherwise specified Characteristics Symbol Test Conditions Min. Typ.[1] Max. Unit [2] 2.8 – 24 V 1 2 3 mA ELECTRICAL CHARACTERISTICS Forward Supply Voltage VCC Supply Current ICC Output Leakage Current VOUTOFF = 24 V, B < BRP – – 10 µA Output Saturation Voltage VOUT(SAT) IOUT = 20 mA, B > BOP – 200 500 mV Output Off Voltage VOUTOFF B < BRP – – 24 V VCC ≥ VCC(min), B < BRP(min) – 10 G, B > BOP(max) + 10 G – – 25 µs Power-On Time [3] Power-On State, Output [3] IOUTOFF Operating, TJ < 175°C tON POS Chopping Frequency fC Output Rise Time [4] tr Output Fall Time [4] tf VCC ≥ VCC(min), t < tON Low – – 800 – kHz RPULL-UP = 1 kΩ, CL = 20 pF – 0.2 2 µs RPULL-UP = 1 kΩ, CL = 20 pF – 0.1 2 µs 30 – 60 mA IOUTOFF = 3 mA; TA = 25°C, Output Off 30 – – V VRCC = –18 V, TA = 25°C – – –5 mA ICC = ICC(max) + 3 mA, TA = 25°C 30 – – V TRANSIENT PROTECTION CHARACTERISTICS Output Short-Circuit Current Limit Output Zener Clamp Voltage Reverse Battery Current Supply Zener Clamp Voltage IOM VZoutput IRCC VZ MAGNETIC CHARACTERISTICS Operate Point BOP – 35 50 G Release Point BRP 5 25 – G Hysteresis BHYS 7 10 20 G (BOP – BRP) [1] Typical data are at TA = 25°C and VCC = 12 V. G (gauss) = 0.1 mT (millitesla). [3] Guaranteed by device design and characterization. [4] C = oscilloscope probe capacitance. L [2] 1 Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 4 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information Characteristic Symbol Test Conditions RθJA Package Thermal Resistance Value Units Package LH, 1-layer PCB with copper limited to solder pads 228 °C/W Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias 110 °C/W Package UA, 1-layer PCB with copper limited to solder pads 165 °C/W Power Derating Curve Maximum Allowable VCC (V) TJ(max) = 175°C; ICC = ICC(max), IOUT = 0 mA (Output Off) 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 VCC(max) Package LH, 2-layer PCB (RθJA = 110 °C/W) Package UA, 1-layer PCB (RθJA = 165 °C/W) Package LH, 1-layer PCB (RθJA = 228 °C/W) VCC(min) 25 45 65 85 105 125 145 Temperature (°C) 165 185 TJ(max) Power Dissipation, PD (mW) Power Dissipation versus Ambient Temperature 1900 1800 1700 1600 1500 1400 1300 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 Package LH, 2-layer PCB (RθJA = 110°C/W) Package UA, 1-layer PCB (RθJA = 165°C/W) Package LH, 1-layer PCB (RθJA = 228°C/W) 25 45 65 85 105 125 145 165 185 Temperature (°C) Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 5 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 CHARACTERISTIC PERFORMANCE DATA Average Supply Current versus Supply Voltage Average Supply Current versus Ambient Temperature 4.0 4.0 3.5 3.5 TA (°C) 2.5 -40 2.0 25 1.5 3.0 ICC (mA) ICC (mA) 3.0 125 1.0 12 1.5 24 0.5 2 6 10 14 VCC (V) 18 22 0.0 26 TA (°C) TA (°C) -40 -40 25 25 125 125 6 6 10 10 14 VCC14(V) VCC (V) 18 18 22 22 26 26 VOUT(SAT) VOUT(SAT)(mV) (mV) 500 500 450 450 400 400 350 350 300 300 250 250 200 200 150 150 100 100 50 50 0 0 2 2 -60 -40 -20 0 20 40 TA (°C) 60 80 100 120 140 Average Low Output Voltage versus Ambient Temperature for IOUT = 20 mA Average Low Output Voltage versus Ambient Temperature for IOUT = 20 mA Average Low Output Voltage versus Supply Voltage for IOUT = 20 mA Average Low Output Voltage versus Supply Voltage for IOUT = 20 mA VOUT(SAT) VOUT(SAT)(mV) (mV) 2.8 2.0 1.0 0.5 0.0 VCC (V) 2.5 500 500 450 450 400 400 350 350 300 300 250 250 200 200 150 150 100 100 50 50 0 0 -60 -60 VCC (V) VCC (V) 2.8 2.8 12 12 24 24 -40 -40 -20 -20 0 0 20 20 40 40 T (°C) TAA (°C) 60 60 80 80 100 100 120 120 Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 140 140 6 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 CHARACTERISTIC PERFORMANCE DATA (continued) Average Operate Point versus Ambient Temperature Average Operate Point versus Supply Voltage 60 60 55 55 50 -40 40 35 25 30 25 45 BOP (G) 45 BOP (G) 50 TA (°C) 125 2.8 35 30 12 25 24 20 20 15 15 10 VCC (V) 40 10 2 6 10 14 VCC (V) 18 22 26 -60 50 45 45 -40 30 25 25 BRP (G) BRP (G) 35 20 20 40 TA (°C) 60 80 100 120 140 VCC (V) 35 30 2.8 25 12 20 125 15 24 15 10 10 5 2 6 10 14 VCC (V) 18 22 26 -60 Average Switchpoint Hysteresis versus Supply Voltage -40 -20 0 20 40 TA (°C) 60 80 100 120 140 Average Switchpoint Hysteresis versus Ambient Temperature 25 25 23 23 21 TA (°C) 19 17 -40 15 13 25 11 125 9 VCC (V) 19 BHYS (G) 21 BHYS (G) 0 40 TA (°C) 40 17 2.8 15 12 13 24 11 9 7 7 5 -20 Average Release Point versus Ambient Temperature Average Release Point versus Supply Voltage 50 5 -40 5 2 6 10 14 VCC (V) 18 22 26 -60 -40 -20 0 20 40 TA (°C) 60 80 100 120 Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 140 7 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 FUNCTIONAL DESCRIPTION OPERATION The output of the APS13295 switches low (turns on) when a south-polarity magnetic field perpendicular to the Hall element exceeds the operate point threshold, BOP (see Figure 2). After turn-on, the output voltage is VOUT(SAT). The output transistor is capable of continuously sinking up to 30 mA. When the magnetic field is reduced below the release point, BRP, the device output goes high (turns off) to VOUTOFF. V+ VOUT(OFF) BRP VOUT VOUT 0 Key POS B > BOP B < BRP, BRP < B < BOP V VOUT(SAT) BOP 0 Powering-on the device in the hysteresis range (less than BOP and higher than BRP) will give an output state of VOUTOFF. The correct state is attained after the first excursion beyond BOP or BRP . Switch to Low Switch to High VOUTOFF POWER-ON BEHAVIOR Device power-on occurs once tON has elapsed. During the time prior to tON, and after VCC ≥ VCC(min), the output state is VOUT(SAT). After tON has elapsed, the output will correspond with the applied magnetic field for B > BOP or B < BRP. See Figure 3 for an example. VOUT (SAT) B+ (south) V The difference in the magnetic operate and release points is the hysteresis, BHYS , of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise. VCC On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength. POS t BHYS Figure 2: Device Switching Behavior Output State Undefined for VCC< VCC (min) VCC (min) 0 t ON t Figure 3: Power-On Sequence and Timing Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 8 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 Applications It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall element) between the supply and ground of the device to guarantee correct performance under harsh environmental conditions and to reduce noise from internal circuitry. As is shown in Figure 1: Typical Application Circuit, a 0.1 µF capacitor is required. In applications where maximum robustness is required, additional measures may be taken. In Figure 4: Enhanced Protection Circuit, a resistor in series with the VCC pin and a capacitor on the VOUT pin enhance the EMC immunity of the device. It is up to the user to fully qualify the Allegro sensor IC in their end system to ensure they achieve their system requirements. These devices are sensitive in the direction perpendicular to the branded package face, and may be configured to sense magnetic fields in a variety of orientations, such as the ones shown in Figure 5. VPULL-UP VSUPPLY RPULL-UP = 1 kΩ A RS = 100 Ω CBYP = 0.1 µF A APS13295 1 VCC VOUT VOUT 2 GND 3 A COUT = 4.7 nF RS and C OUT are recommended for maximum robustness in an automotive environment. Figure 4: Enhanced Protection Circuit Extensive applications information for Hall-effect devices is available in: • Hall-Effect IC Applications Guide, AN27701, • Hall-Effect Devices: Guidelines for Designing Subassemblies Using Hall-Effect Devices AN27703.1 • Soldering Methods for Allegro’s Products – SMD and Through-Hole, AN26009 All are provided on the Allegro website: www.allegromicro.com N S N S B PC Figure 5: Sensing Configurations Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 9 APS13295 Precision Hall-Effect Switch for Consumer and Industrial Applications CHOPPER STABILIZATION A limiting factor for switch point accuracy when using Halleffect technology is the small-signal voltage developed across the Hall plate. This voltage is proportionally small relative to the offset that can be produced at the output of the Hall sensor. This makes it difficult to process the signal and maintain an accurate, reliable output over the specified temperature and voltage range. Chopper stabilization is a proven approach used to minimize Hall offset. The Allegro technique, dynamic quadrature offset cancellation, removes key sources of the output drift induced by temperature and package stress. This offset reduction technique is based on a signal modulation-demodulation process. Figure 6: Model of Chopper Stabilization Circuit (Dynamic Offset Cancellation) illustrates how it is implemented. The undesired offset signal is separated from the magnetically induced signal in the frequency domain through modulation. The subsequent demodulation acts as a modulation process for the offset causing the magnetically induced signal to recover its original spectrum at baseband while the DC offset becomes a high-frequency signal. Then, using a low-pass filter, the signal passes while the modulated DC offset is suppressed. Allegro’s innovative chopper stabilization technique uses a high-frequency clock. The high-frequency operation allows a greater sampling rate that produces higher accuracy, reduced jitter, and faster signal processing. Additionally, filtering is more effective and results in a lower noise analog signal at the sensor output. Devices such as the APS13295 that use this approach have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and have precise recoverability after temperature cycling. This technique is made possible through the use of a BiCMOS process which allows the use of low-offset and low-noise amplifiers in combination with high-density logic and sample-and-hold circuits. Regulator Hall Element Amp Sample and Hold Clock/Logic Low-Pass Filter Figure 6: Model of Chopper Stabilization Circuit (Dynamic Offset Cancellation) Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 10 APS13295 Precision Hall-Effect Switch for Consumer and Industrial Applications POWER DERATING The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems website.) The Package Thermal Resistance, RθJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RθJC, is relatively small component of RθJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The resulting power dissipation capability directly reflects upon the ability of the device to withstand extreme operating conditions. The junction temperature mission profile specified in the Absolute Maximum Ratings table designates a total operating life capability based on qualification for the most extreme conditions, where TJ may reach 175°C. The silicon IC is heated internally when current is flowing into the VCC terminal. When the output is on, current sinking into the VOUT terminal generates additional heat. This may increase the junction temperature, TJ, above the surrounding ambient temperature. The APS13295 is permitted to operate up to TJ = 175°C. As mentioned above, an operating device will increase TJ according to equations 1, 2, and 3 below. This allows an estimation of the maximum ambient operating temperature.  For example, given common conditions such as: TA= 25°C, VCC = 12 V, ICC = 2 mA, VOUT = 185 mV, IOUT = 20 mA (output on), and RθJA = 165°C/W, then: PD = (VCC × ICC) + (VOUT × IOUT) = (12 V × 2 mA) + (185 mV × 20 mA) = 24 mW + 3.7 mW = 27.7 mW ΔT = PD × RθJA = 27.7 mW × 165°C/W = 4.6°C TJ = TA + ΔT = 25°C + 4.6°C = 29.6°C A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RθJA. For example, given the conditions RθJA = 228°C/W, TJ(max) = 175°C, VCC(max) = 24 V, ICC(max) = 4 mA, VOUT = 500 mV, and IOUT = 25 mA (output on), the maximum allowable operating ambient temperature can be determined. The power dissipation required for the output is shown below: PD(VOUT) = VOUT × IOUT = 500 mV × 25 mA = 12.5 mW The power dissipation required for the IC supply is shown below: PD(VCC) = VCC × ICC = 24 V × 4 mA = 96 mW Next, by inverting using equation 2: ΔT = PD × RθJA = [PD(VOUT) + PD(VCC)] × 228°C/W = (12.5 mW + 96 mW) × 228°C/W = 108.5 mW × 228°C/W = 24.7°C Finally, by inverting equation 3 with respect to voltage: TA(est) = TJ(max) – ΔT = 175°C – 24.7°C = 150.3°C (1) In the above case, there is sufficient power dissipation capability to operate up to TA(est).The example indicates that TA(max) can ΔT = PD × RθJA (2) be as high as 150.3°C without exceeding TJ(max). However, the TA(max) rating of the device is 125°C; the APS13295 perforTJ = TA + ΔT (3) mance is not guaranteed above TA = 125°C. PD = VIN × IIN Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 11 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 Package LH, 3-Pin (SOT-23W) For Reference Only – Not for Tooling Use (Reference Allegro DWG-0000628, Rev. 1) NOT TO SCALE Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown +0.125 2.975 –0.075 1.49 4°±4° Active Area Depth 0.28 ±0.04 mm 3 Die Rotation Error 4° Max +0.020 0.180–0.053 0.96 +0.10 2.90 –0.20 +0.19 1.91 –0.06 Hall Element (not to scale) 0.25 MIN 0.38 NOM Package Centerline to Die Centerline ±0.20 8× 10° ±5° 0.55 REF 0.25 BSC Seating Plane Gauge Plane 0.95 BSC Lead Foot Centerline To Package Centerline ±0.18 All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances Branded Face 0.41 ±0.04 C 0.95 PCB Layout Reference View 0.57 ±0.04 3× 1.00 Package Centerline to Die Centerline ±0.15 2 1 0.10 2.40 0.70 +0.10 0.05 –0.05 0.40 ±0.10 1.00 ±0.13 SEATING PLANE C A33 1 Standard Branding Reference View Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 12 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 Package UA, 3-Pin SIP For Reference Only – Not For Tooling Use (Reference DWG-0000404, Rev. 1) NOT TO SCALE Dimensions in millimeters Exact case and lead configuration at supplier discretion within limits shown Mold gate and tie bar protrusion zone Ejector pin flash protrusion R0.25 MAX (2×) 5° (2×) 0.56 MAX A34 45° (2×) 0.10 MAX 1.52 ±0.05 1.68 MAX 5° (2×) 1 Standard Branding Reference View +0.08 4.09 –0.05 3.00 ±0.05 2.04 Mold gate and tie bar protrusion zone 0.15 MAX Ejector pin (far side) Including gate and tie bar burrs +0.08 3.02 –0.05 3.10 MAX Sensor element location tolerance Standard ±0.20 +0.05 0.08 –0.00 0.50 ±0.08 Active Area Depth Ejector pin flash protrusion Sensor element location tolerance Standard ±0.20 1.44 Hall Element (not to scale) 45° 10° (3×) 1.02 MAX 0.79 REF 0.51 REF 0.05 NOM 0.05 NOM 14.99 ±0.25 +0.03 0.41 –0.06 0.10 MAX 0.10 MAX Dambar Trim Detail 1.27 NOM (2×) +0.05 0.43 –0.07 (3×) Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 13 Precision Hall-Effect Switch for Consumer and Industrial Applications APS13295 Revision History Number Date Description – February 26, 2018 Initial release 1 May 10, 2018 Corrected part numbers in selection guide (page 2); renamed RLOAD to RPULL-UP (page 2, 4, 9). 2 August 2, 2019 Minor editorial updates 3 October 4, 2021 Updated package drawings (pages 12-13) Copyright 2021, Allegro MicroSystems. Allegro MicroSystems reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro’s product can reasonably be expected to cause bodily harm. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. Copies of this document are considered uncontrolled documents. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com 14