ASEK-1334-SUBKIT-T-DK

A1334 Precision Hall-Effect Angle Sensor IC Not for New Design This part is in production but has been determined to be NOT FOR NEW DESIGN. Sale of this part is currently restricted to existing customer programs already using the part. The part should not be purchased for new programs or designed into new applications. Samples are no longer available. Date of status change: December 5, 2016 Recommended Substitutions: A1338 Family For existing customer transition, and for new customers or new applications, contact Allegro Sales. NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative. Allegro MicroSystems, LLC reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use. A1334 Precision Hall-Effect Angle Sensor IC FEATURES AND BENEFITS • Automotive AEC-Q100 qualified • Contactless 0° to 360° angle sensor IC, for angular position, rotational speed, and direction measurement • Available with either a single die or dual independent die housed within a single package • Circular Vertical Hall (CVH) technology provides a single-channel sensor system, with air-gap independence • 12-bit resolution possible in low RPM mode, 10-bit resolution in high RPM mode • Angle Refresh Rate (output rate) configurable between 25 and 3200 µs through EEPROM programming • Capable of sensing magnet rotational speeds in excess of 7600 rpm • SPI interface allows use of multiple independent sensors for applications requiring redundancy • EEPROM programmable angle reference (0°) position and rotation direction (CW or CCW) • Absolute maximum VCC of 26.5 V for automotive battery-powered applications Packages: Not to scale Single SoC 14-pin TSSOP (LE package) As part of its signal processing functions, the A1334 includes automotive-grade temperature compensation to provide accurate output over the full operating temperature and voltage ranges. The A1334 also includes EEPROM technology for end-of-line calibration. The A1334 is available as a single die in a 14-pin TSSOP, or dual die in a 24-pin TSSOP. Both packages are lead (Pb) free with 100% matte-tin leadframe plating. SoC die 1 Multisegment CVH Element Analog Front End Diagnostics BIAS(1) EEPROM Calibration Parameters SPI Interface Control unit Rack Bandpass Filter CS(1) The A1334 supports a Low RPM mode for slower rate appli­ cations and a High RPM mode for high-speed applications. High RPM mode is for applications that require higher refresh rates to minimize error due to latency. Low RPM mode is for applications that require higher resolution operating at lower angular velocities. To all internal circuits ADC MISO(1) The A1334 is a 360° angle sensor IC that provides contactless high-resolution angular position information based on magnetic Circular Vertical Hall (CVH) technology. It has a system-onchip (SoC) architecture that includes: a CVH front end, digital signal processing, and a digital (SPI) output. The A1334 is ideal for automotive applications requiring high-speed 0° to 360° angle measurements, such as electronic power steering (EPS) and throttle systems. Dual Independent SoCs 24-pin TSSOP (LE package) BYP(1) VCC(1) (Programming) DESCRIPTION Steering sensor Digital Processing Data Registers Temperature Compensation Internal Calibration Zero Angle MOSI(1) Motor SCLK(1) GND(1) xxx2 SoC die 2 (optional) Pin number parentheses refer to chip in dual SoC variant A1334 Functional Block Diagram A1334A-DS, Rev. 6 A1334 in Electronic Power Steering (EPS) Application December 5, 2016 A1334 Selection Guide Part Number A1334LLETR-T A1334LLETR-60-T A1334LLETR-30-T A1334LLETR-DD-T A1334LLETR-DD55-T A1334LLETR-DD30-T Precision Hall-Effect Angle Sensor IC System Die Single Single Single Dual Dual Dual Package 14-pin TSSOP 14-pin TSSOP 14-pin TSSOP 24-pin TSSOP 24-pin TSSOP 24-pin TSSOP Packing* 4000 pieces per 13-in. reel 4000 pieces per 13-in. reel 4000 pieces per 13-in. reel 4000 pieces per 13-in. reel 4000 pieces per 13-in. reel 4000 pieces per 13-in. reel Notes Optimized for 900 G Field Optimized for 600 G Field Optimized for 300 G Field Optimized for 900 G Field Optimized for 550 G Field Optimized for 300 G Field *Contact Allegro™ for additional packing options. SPECIFICATIONS Absolute Maximum Ratings Rating Unit Forward Supply Voltage Characteristic Symbol VCC Not sampling angles 26.5 V Reverse Supply Voltage VRCC Not sampling angles –18 V 5.5 V All Other Pins Forward Voltage VIN All Other Pins Reverse Voltage VR Operating Ambient Temperature TA Maximum Junction Temperature Storage Temperature Notes 0.5 V –40 to 150 ºC TJ(max) 165 ºC Tstg –65 to 170 ºC L range THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information Characteristic Package Thermal Resistance Symbol RθJA Test Conditions* Value Unit LE-14 package 82 ºC/W LE-24 package 117 ºC/W *Additional thermal information available on the Allegro website. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 A1334 Precision Hall-Effect Angle Sensor IC Pin-Out Diagrams and Terminal List Table Terminal List Table DGND 1 BYP 2 14 DGND 13 CS PinName LE-24 4, 7, 9 4, 6 AGND_2 – 16, 18 BYP_1 2 2 External bypass capacitor terminal for internal regulator (die 1) BYP_2 – 14 External bypass capacitor terminal for internal regulator (die 2) CS_1 13 23 SPI Chip Select terminal, active low (die 1) 12 MOSI AGND 4 11 SCLK AGND_1 VCC 5 10 MISO VCC 6 9 AGND 8 BIAS LE-14 Package (Single SoC) DGND_1 1 BYP_1 2 24 DGND_1 23 CS_1 Function LE-14 DGND 3 AGND 7 Pin Number Device analog ground terminal (die 1) Device analog ground terminal (die 2) CS_2 – 11 DGND_1 1, 3, 14 1, 3, 24 Device digital ground terminal (die 1) SPI Chip Select terminal, active low (die 2) DGND_2 – 12, 13, 15 Device digital ground terminal (die 2) MISO_1 10 20 SPI Master Input / Slave Output (die 1) MISO_2 – 8 SPI Master Input / Slave Output (die 2) 20 MISO_1 MOSI_1 12 22 SPI Master Output / Slave Input (die 1) 19 BIAS_1 MOSI_2 – 10 SPI Master Output / Slave Input (die 2) DGND_1 3 22 MOSI_1 AGND_1 4 21 SCLK_1 VCC_1 5 AGND_1 6 BIAS_2 7 18 AGND_2 SCLK_1 11 21 SPI Clock terminal (die 1) MISO_2 8 17 VCC_2 SCLK_2 9 16 AGND_2 SCLK_2 – 9 SPI Clock terminal (die 2) MOSI_2 10 15 DGND_2 VCC_1 5, 6 5 Power supply; also used for EEPROM programming (die 1) 14 BYP_2 VCC_2 – 17 Power supply; also used for EEPROM programming (die 2) BIAS_1 8 19 Bias connection; connect to ground (shown) or pull-up to 3.3 V (die 1) BIAS_2 – 7 Bias connection; connect to ground (shown) or pull-up to 3.3 V (die 2) CS_2 11 DGND_2 12 13 DGND_2 LE-24 Package (Dual SoC) V CC 0.1 µF 0.1 µF 0.1 µF BYP_1 VCC_1 VCC_2 BYP_2 BIAS_1 CS_1 Host Microprocessor SCLK_1 MOSI_1 MISO_1 A1334 Target Magnet BIAS_2 CS_2 SCLK_2 MOSI_2 MISO_2 AGND_1 AGND_2 DGND_1 DGND_2 Typical Application Diagram (Dual Die Version) Either or both internal SoCs can be operated simultaneously. (See page 12 for circuits that require a higher level of EMC immunity.) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 A1334 Precision Hall-Effect Angle Sensor IC OPERATING CHARACTERISTICS: valid over the full operating voltage and ambient temperature ranges, unless otherwise noted Characteristics Symbol Test Conditions Min. Typ.1 Max. Unit2 Electrical Characteristics Supply Voltage VCC Supply Current ICC Undervoltage Lockout Threshold Voltage3 4.5 12 14.5 V Each die, A1334 sampling angles – 7.5 10 mA VUVLOHI Maximum VCC , dV/dt = 1V/ms, TA = 25°C, A1334 sampling enabled – – 4.5 V VUVLOLOW Maximum VCC , dV/dt = 1V/ms, TA = 25°C, A1334 sampling disabled 3.5 – – V 4.35 4.5 4.75 V VCC Low Flag Threshold4,5 VUVLOTH Supply Zener Clamp Voltage VZSUP Reverse-Battery Current Power-On Time6,8 Bypass Pin Output Voltage7 26.5 – – V VRCC = –18 V, TA = 25°C –5 – – mA – 300 – µs VBYP TA = 25°C, CBYP = 0.1 µF 2.45 2.85 3.4 V VIH MOSIx, SCLKx,  ¯C¯ ¯S¯ x pins 2.8 – 3.63 V IRCC ICC = ICC + 3 mA, TA = 25°C tPO SPI Interface Specifications Digital Input High Voltage8 VIL MOSIx, SCLKx,  ¯C¯ ¯S¯ x pins – – 0.5 V SPI Output High Voltage VOH MISOx pins, CL = 50 pF, TA = 25°C 2.81 3.3 3.79 V SPI Output Low Voltage VOL MISOx pins, CL = 50 pF, TA = 25°C – 0.3 0.5 V fSCLK MISOx pins, CL = 50 pF Digital Input Low SPI Clock Voltage8 Frequency8 0.1 – 10 MHz 5.8 – 588 kHz 50 – – ns Data output valid after SCLKx falling edge – 40 – ns Input setup time before SCLKx rising edge 25 – – ns tHD Input hold time after SCLKx rising edge 50 – – ns tCHD Hold SCLKx high time before ¯C¯ ¯S¯ x rising edge 5 – – ns CL Loading on digital output (MISOx) pin – – 50 pF B Range of input field SPI Frame Rate8 tSPI Chip Select to First SCLK Edge8 tCS Time from ¯C¯ ¯S¯ x going low to SCLKx falling edge Data Output Valid Time8 tDAV MOSI Setup Time8 tSU MOSI Hold Time8 SCLK to CS Hold Time8 Load Capacitance8 Magnetic Characteristics Magnetic Field9,10 Missing Magnet Flag 300 – 1000 G 100 – G – 12 – bit B = 300 G, TA = 25ºC, ORATE = 0 – 10.7 – bits High RPM mode 18 – 25 28.33 µs Low RPM mode, AVG = 011 (varies with AVG mode, refer to the appendix Programming Reference) – 200 – µs High RPM mode (see figure 4) 18 – 60 68 µs MAGM Angle Characteristics Output11 Effective RESANGLE Resolution12 Angle Refresh Rate13,14 Response Time tANG tRESPONSE Continued on the next page… Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 A1334 Precision Hall-Effect Angle Sensor IC OPERATING CHARACTERISTICS (continued): valid over the full operating voltage and ambient temperature ranges, un- less otherwise noted Characteristics Symbol Test Conditions Min. Typ.1 Max. Unit2 TA = 25°C, ideal magnet alignment, B = 300 G, target rpm = 0 – ±0.6 – degrees TA = 150°C, ideal magnet alignment, B = 300 G, target rpm = 0 –1.75 – 1.75 degrees TA = 25°C, B = 300 G, no internal filtering – 0.2 – degrees TA = 150°C, no internal filtering, B = 300 G, target rpm = 0 – 0.27 – degrees TA = -40°C, B = 300 G – ±1.5 – degrees TA = 150°C, B = 300 G –1.5 – –1.5 degrees – ±1.0 – degrees Angle Characteristics (continued) Angle Error15 ERRANG Angle Noise16, 19 NANG Temperature Drift ANGLEDRIFT ANGLEDRIFT- Angle Drift Over Lifetime17 LIFE B = 300 G, typical maximum drift observed after AEC-Q100 qualification testing Typical data is at TA = 25°C and VCC = 5 V, and it is for design estimates only. 1 G (gauss) = 0.1 mT (millitesla). 3 At power-on, a die will not respond to commands until V CC rises above V UVLOHI. After that, the die will perform and respond normally until V CC drops below V UVLOLOW . 4 Characterization data shows negligible accuracy degradation at supply voltages between 4.35 V and 4.50 V. Significant degradation in accuracy may occur below 4.30 V. 5 VCC Low Threshold Flag will be sent via the SPI interface as part of the angle measurement. 6 During the power-on phase, the A1334 SPI transactions are not guaranteed. 7 Each die includes a linear regulator. The output voltage and current specifications are to aid in PCB design. The pin is not intended to drive any external circuitry. 8 Parameter is not guaranteed at final test. Values for this characteristic are determined by design. 9 The A1334 operates in magnetic fields lower than 300 G, but with reduced accuracy and resolution. 10 Contact Allegro for field optimization. In general, operation with larger magnetic field values result in improved performance (see Figures 3 and 4). 11 RES ANGLE represents the number of bits of data available for reading from the die registers. 12 Effective Resolution is calculated using the formula below: 1 2 ( ) 32 log2 (360) - log2  l l=1 where σ is the Standard Deviation based on thirty measurements taken at each of the 32 angular positions, I = 11.25, 22.5, … 360. The rate at which a new angle reading will be ready. To calculate Low RPM mode, time = 25 × 2AVG. Given AVG = 011 = 3 (decimal), so 23 = 8. 15 In general, Allegro’s angle sensor ICs are more accurate when stronger magnetic fields (i.e. 900 G) are used. Please contact Allegro for information regarding how users can realize higher accuracy performance from Allegro’s angle sensor ICs by using stronger magnetic fields. 16 Value reflects 3 standard deviations. 17 After qualification testing, a typical IC drifted less than 0.5 degrees; however, after certain long duration stresses (for example 1000 cycles of -65 to 175 degree C temperature cycling), a small number of devices drifted by approximately 1.5 degrees. 18 Maximum value based on worst case simulations. 19 One sigma value at 300 G. Operation with a larger magnetic field results in improved noise performance. For 600 G operation noise reduced by 50% vs 300 G. 13 14 Angle (º) Applied Magnetic Field Transducer Output 50 Response Time, tRESPONSE 0 t Definition of Response Time Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 A1334 Precision Hall-Effect Angle Sensor IC FUNCTIONAL DESCRIPTION Operational Modes The A1334 angle sensor device is designed to support a wide variety of automotive applications requiring measuring 0° to 360° angle positions. An option for two electrically-independent die in the same package provides solid-state consistency and reliability. Each die SPI port can be configured in a different RPM mode. The data output selection is controlled by the address request in the SPI Read command. The A1334 has dual identical system-on-chip (SoC) architecture. The output of each die is used by the host microcontroller to provide a single channel of target data. Angle Measurement The A1334 can monitor the angular position of a rotating magnet at speeds ranging from 0 to more than 7600 rpm. At lower rotational speeds, the A1334 provides high-resolution angle measurement accuracy. It can also support higher rates of rotational speeds at reduced levels of angle measurement accuracy. The A1334 can be configured to operate in two angular measurement modes of operation: Low RPM mode, and High RPM mode. For applications that have a speed range from 0 to 500 rpm (can vary with AVG), the Low RPM mode provides increased resolution. For applications above 500 rpm, configuring the A1334 in High RPM mode provides angle measurements with standard resolution. Above 7600 rpm, the A1334 continues to provide angle data; however, the accuracy is proportionally reduced. The actual update rate of Low RPM mode can be changed by setting the AVG bits in the EEPROM. (See the appendix Programming Reference for details.) The selection of Low RPM mode or High RPM mode can be programmed, via the Angle_Meas_Mode bit, for the expected maximum rotational speed of the magnet in operation to provide the highest corresponding level of angle accuracy. However, the A1334 provides valid output data regardless of the selected mode and the application speed. Although the range of the resolution of the measurement data output, RESANGLE, is determined by the selection of either High RPM or Low RPM mode, the measurement is also affected by the intensity (B, in gauss) of the applied magnetic field from the target. At lower intensities, a reduced signal-to-noise ratio will cause one or two LSBs to change state randomly due to noise, and the effective DAC resolution is reduced. These factors work together, so when High RPM mode is selected, the effective range of resolution is 8 to 10 bits (from lower to higher field intensities), and in Low RPM mode, the effective range is 11 to 12 bits, depending on field strength and AVG selection. Regardless of the field intensity and mode selection, the transmission protocol and number formatting remains the same. The MSB is always transmitted first. The entire number should be read. The Output Angle is always calculated at maximum resolution. To be more explicit: AngleOUT = 360 (°) × D[12:0] / (213) (1) This formula is always true, regardless of the applied field intensity. What changes with the field and speed setting is how uniform the LSBs of the measurement data (D 12:x) will be. When using the dual die version of the A1334, it should be noted that the secondary die (E2) is rotated 180° relative to the primary die (E1). This results in a difference in measurement of approximately 180° between the two die, given perfect alignment of each die to the target magnet. This phenomenon can be counteracted by subtracting the offset using a microprocessor. Alternatively, the difference between the two die can be compensated for using the EEPROM for setting the Reference Angle. System-Level Timing The A1334 outputs a new angle measurement every tANG µs. In High RPM mode, the A1334 outputs a new angle measurement every tANG µs, with an effective resolution of 10 bits. There is, however, a latency of tLAT , from when the rotating magnet is sampled by the CVH to when the sampled data has been completely transmitted over the SPI interface. Because an SPI interface Read command is not synchronous with the CVH timing, but instead is polled by the external host microcontroller, the latency can vary. For single back-to-back SPI transactions (first transaction is sending the Read register 0x0 command, second is retrieving the angle data) the following scenarios are possible: • Worst case: 2 CVH cycle + 2 SPI cycles • Best case: 1.5 SPI cycles; 2 µs, assuming a 10 MHz SPI clock Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 A1334 Precision Hall-Effect Angle Sensor IC Power-Up Diagnostics Upon applying power to the A1334, the device automatically runs through an initialization routine. The purpose of this initialization is to ensure that the device comes up in the same predictable operating condition every power cycle. This initialization routine takes a finite amount of time to complete, which is referred to as Power-On Time, tPO . The A1334 supports a number of on-chip self-diagnostics to enable the host microcontroller to assess the operational status of each die. For example, the A1334 can detect a low supply voltage and includes an onboard watchdog timer to monitor that internal clocks are running properly. The A1334 wakes up in a default state that sets all SPI registers to their default value. It is important to note that, regardless of the state of the device before a power cycle, the device will re-power with default values. For example, on every power-up, the device will power up in the mode set in the EEPROM bit RPM. The state of the EEPROM is unchanged. Table 1: Diagnostic Capabilities Diagnostic/ Protection Description Output State Reverse VCC Current Limiting (VCCx pin) Output to VCC Current Limiting (MISOx pin) Output to Ground Current Limiting (MISOx pin) Watchdog Monitors digital logic for proper function IERR Error flag is set Missing Magnet Monitors magnet field level in case of mechanical failure MAGM Error flag is set EEPROM Error Detection and Correction Detection and correction of certain EEPROM memory bit errors Error flags set in SPI message when errors are detected or corrected Loss of VCC Determine if battery power was lost BATD Error flag is set Redundancy Dual die version of the A1334 provides redundant sensors in the same package Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 A1334 Precision Hall-Effect Angle Sensor IC Undervoltage Lockout and VCC Low Flag Diagnostic The MISO pin state changes according to the state of the VCC ramp, as shown in Figure 1. VCC (V) 4.5 4.0 3.8 VCC Low Flag Threshold, VUVLOTH Undervoltage Lockout Threshold Voltage (high), VUVLOHI Undervoltage Lockout Threshold Voltage (Low),VUVLOLOW Output accuracy reduced 1.5 MISO Pin State Output accuracy reduced DIGON High Impedance DIGON Ground VCC Low Flag Set Accurate Angle Output VCC Low Flag Set Ground High Impedance t Figure 1: Relationship of VCC and MISO Output Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 A1334 Precision Hall-Effect Angle Sensor IC APPLICATION INFORMATION Calculating Target Zero Degree Angle Bypass Pin Usage When shipped from the factory, the default angle value when orientated as shown in Figure 2, is approximately 40º (220º on secondary die). In some cases, the end user may want to program an angle offset in the A1334 to compensate for variation in magnetic assemblies, or for applications where absolute systemlevel readings are required. The Bypass pin is required for proper device operation and is intended to bypass internal IC nodes of the A1334. A 0.1 µF capacitor must be placed in very close proximity to the Bypass pin. It is not intended to be used to source external components. To assist with PCB layout, please see the Operating Characteristics table for output voltage and current requirements. The internal algorithm for computing the output angle is as follows: Changing Sampling Modes AngleOUT = AngleRAW – Reference Angle The A1334 features a High RPM sampling mode, and a Low RPM sampling mode. The default power-on state of the A1334 is loaded from EEPROM. To configure the A1334 to Low RPM mode, set the Operating mode to Low RPM mode by writing a logic 1 to bit 2 (RPM) of the configuration commands (CTRL) register, via the SPI interface. (2) The procedure to zero out the A1334 is quite simple. During final application calibration and programming, position the magnet above the A1334 in the required zero-degree position, and read the angle from the A1334 using the SPI interface (AngleOUT). From this angle, the Reference Angle required to program the A1334 can be computed as follows: Reference Angle = AngleOUT (3) Target rotation axis Target poles aligned with A1334 elements Target alignment for default angle setting • Target rotation axis intersects primary die • Primary die 40° default point • Secondary die 220° default point (Example shows element E1 as primary die element E2 as secondary die) S S Pin 1 E1 N E1 N E2 E2 Figure 2: Orientation of Magnet Relative to Primary Die and Secondary Die (dual die version used as example) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 A1334 Precision Hall-Effect Angle Sensor IC Magnetic Target Requirements alignment configurations. The A1334 is designed to operate with magnets constructed with a variety of magnetic materials, cylindrical geometries, and field strengths, as shown in Table 2. To reach this end, Allegro offers three different “Field Optimization” or trim levels; 300 G, 550 G and 900 G. Figure 8 demonstrates the typical 25ºC performance for these three trim levels over field strength. In general, higher field strengths result in improved performance in terms of angle error and angle noise (see Figures 3 and 4) To obtain maximum performance, it is important to match the operating field with the field trim level. Contact Allegro for more detailed information on magnet selection and performance. Figure 6 illustrates the behavior of alignment error when using an 8 mm diameter magnet positioned above the branded face of the package. The curve shows the relationship between absolute angle error present on the output of the die versus eccentricity of the die relative to the rotation axis of the magnet. The curve is the same for both dies in the package. Redundant Applications and Alignment Error The A1334 dual die version is designed to be used in redundant applications with a single magnet spinning over the two separate dies that are mounted side-by-side in the same package. One challenge with this configuration is correctly lining up the magnet with the device package, so it is important to be aware of the physical separation of the two dies. Figure 5 depicts two possible The curve provides guidance to determine what the optimal magnet placement should be for a given application. For example, given that the maximum spacing between the two dies is 1 mm, if the center of the magnet rotation is placed at the midpoint between the two dies, each die will have a maximum eccentricity of 0.5 mm. For applications with reduced accuracy requirements, considering one die the primary and the other die the secondary, the magnet axis of rotation could be positioned directly above the primary die, and thus offset 1 mm from the secondary die, yielding zero alignment error on the primary die, and approximately ±1° of absolute error on the secondary die due to geometric mismatch. Table 2: Typical Target Magnet Parameters Thickness (mm) 15 4 10 2.5 8 2.5 6 2.5 Thickness S N 1.5 300 G Trim recommended range Angle Error in Degrees Diameter (mm) 300 G Optimization 550 G Optimization 900 G Optimization 550 G Trim recommended range 900 G Trim recommended range 1 0.5 Diameter *A magnet with 8 mm (or greater) diameter and 2.5 mm thickness is the recommended magnet for redundant applications. 0 300 400 500 600 700 800 900 1000 Field Strength in Gauss Figure 3: Maximum Peak Angle Error Over Field Strength Different Factory Optimizations Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 A1334 Precision Hall-Effect Angle Sensor IC System Timing and Error The A1334 is a digital system, and therefore takes angle samples at a fixed sampling rate. When using a sensing device with a fixed sampling rate to sample a continuously moving target, there will be error introduced that can be simply calculated with the sampling rate of the device and the speed at which the magnetic signal is changing. In the case of the A1334, the input signal is rotating at various speeds, and the sampling rate of the A1334 is fixed at ANG. The calculation would be: ANG (µs) × angular velocity ( ° / µs) . (4) So the faster the magnetic object is spinning, the further behind in angle the output signal will seem for a fixed sampling rate. 0.8 25ºC -40ºC 150ºC 0.7 Noise (Deg) 0.6 0.5 0.4 0.3 0.2 0.1 0 300 400 500 600 700 800 900 1000 Field Strength (G) Figure 4: One Sigma Noise over Field Strength Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 A1334 Precision Hall-Effect Angle Sensor IC dAXIAL1 dAXIAL2 Target rotation axis Example of equal eccentricity: Target rotation axis centered between both dies Target counterclockwise rotation dAXIAL1 = 0 Target clockwise rotation dAXIAL2 Example of unequal eccentricity: Target rotation axis centered over primary die (either die may be used as primary) Eccentricity of secondary die (measured from target rotation axis intersect, to secondary die) Pin 1 Figure 5: Demonstration of Magnet to Sensing Element Eccentricity (dual die version used as example) Angle Error vs Eccentricity 5 Average Peak Angle Error (deg) 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 0.25 0.5 0.75 1 1.25 Eccentricity (mm) 1.5 1.75 2 Figure 6: Characteristic Performance Based on 14 Pieces (900 G Field Strength, 8 mm Diameter Magnet) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12 A1334 Precision Hall-Effect Angle Sensor IC TYPICAL CHARACTERISTICS Angle Error Vs Encoder 1 0.8 0.6 Angle Error 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1 0 50 100 150 200 250 300 350 Encoder Position Figure 7: Typical Angle Error versus Absolute Position (300 G, 25ºC) 2 2 Mean +/- 3 Sigma 1.6 1.6 1.4 1.4 1.2 1.2 1 0.8 0.6 1 0.8 0.6 0.4 0.4 0.2 0.2 0 -40 -20 0 20 40 60 80 100 120 Temperature (C) Figure 8: Angle Error Over Temperature (300 G) 140 Mean +/- 3 Sigma 1.8 Drift in Degrees Angle Error in Degrees 1.8 0 -40 -20 0 20 40 60 80 100 120 140 Temperature (C) Figure 9: Temperature Drift (300 G) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 13 A1334 Precision Hall-Effect Angle Sensor IC 1.0 30 150ºC 25ºC –40ºC 25 Mean +/- 3 Sigma 0.9 A1334 NOISE in Degrees 0.8 Frequency (%) 20 15 10 0.7 0.6 0.5 0.4 0.3 0.2 5 0.1 0 0.2 0 0.6 0.4 0 -50 1.0 0.8 Noise in Degrees 50 100 150 Ambient Temperature in Degrees C Figure 10: Noise Distribution Over Temperature (1σ, 300 G) Figure 11: Noise Performance Over Temperature (1σ, 300 G) 10 10 150ºC 25ºC –40ºC 9 0 Mean +/- 3 Sigma 9.5 8 9 A1334 ICC in mA Frequency (%) 7 6 5 4 8.5 8 7.5 3 7 2 6.5 1 0 6 6.5 7 7.5 8 8.5 9 9.5 ICC in mA Figure 12: ICC Distribution Over Temperature (VCC = 4.5 V) 10 0 -50 0 50 100 150 Ambient Temperature in Degrees C Figure 13: ICC Over Temperature (VCC = 4.5 V) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 14 A1334 Precision Hall-Effect Angle Sensor IC 12 10 150ºC 25ºC –40ºC 10 Mean +/- 3 Sigma 9.5 9 A1334 ICC in mA Frequency (%) 8 6 8.5 8 7.5 4 7 2 0 6.5 6 6.5 7 7.5 8 8.5 9 9.5 ICC in mA Figure 14: ICC Distribution Over Temperature (VCC = 14.5 V) 10 0 -50 0 50 100 150 Ambient Temperature in Degrees C Figure 15: ICC Over Temperature (VCC = 14.5 V) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 15 A1334 Precision Hall-Effect Angle Sensor IC EMC Reduction For applications with stringent EMC requirements, a 100 Ω resistance should be added to the supply for the device in order to suppress noise. A recommended circuit is shown in Figure 16. VCC 0.1 µF 0.1 µF 0.1 µF 100 Ω BYP_1 100 Ω VCC_1 VCC_2 BYP_2 CS_1 SCLK_1 MOSI_1 MISO_1 BIAS_1 A1334 Host Microprocessor Target Magnet (Dual Die Version) CS_2 SCLK_2 MOSI_2 MISO_2 BIAS_2 AGND_1 AGND_2 DGND_1 DGND_2 Figure 16: Typical Application Diagram (dual die version) with EMC Suppression Resistor, RSPLY , on Supply Line 24 14 Hall element location Hall element E1 location 1 Hall element E2 location 1 Figure 17: Hall Element Located Off-Center within the Device Body Refer to the Package Outline Drawing for reference dimensions. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 16 A1334 Precision Hall-Effect Angle Sensor IC PACKAGE OUTLINE DRAWING For Reference Only – Not for Tooling Use (Reference MO-153 AB-1) Dimensions in millimeters – NOT TO SCALE Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown 5.00 ±0.10 0.45 8º 0º D 1.63 0.65 14 14 0.20 0.09 E 2.20 D 4.40 ±0.10 1.70 6.00 6.40 BSC 0.60 +0.15 –0.10 A 1.00 REF 1 2 1 0.25 BSC Branded Face B C 16X 0.10 1.10 MAX C 2 PCB Layout Reference View SEATING PLANE GAUGE PLANE SEATING PLANE 0.30 0.19 0.15 0.00 0.65 BSC A Terminal #1 mark area B Reference land pattern layout (reference IPC7351 TSOP65P640X120-14M); All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances; when mounting on a multilayer PCB, thermal vias at the exposed thermal pad land can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5) C Branding scale and appearance at supplier discretion D Hall element, not to scale E Active Area Depth = 0.36 mm (ref) NNNNNNNNNNNN YYWW LLLLLLLLLLLL 1 C Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number Figure 18: Package LE, 14-Pin TSSOP (Single Die Version) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 17 A1334 Precision Hall-Effect Angle Sensor IC For Reference Only – Not for Tooling Use (Reference MO-153 AD) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown 7.80 ±0.10 E D 3.40 D 1.00 0.65 0.45 8º 0º 24 24 0.20 0.09 E2 D D E1 4.40 ±0.10 6.40 BSC D 2.20 A 1 1.00 REF 1.65 2 0.25 BSC 24X SEATING PLANE 0.10 C 0.30 0.19 6.10 +0.15 0.60 –0.10 0.65 BSC C 1 2 B PCB Layout Reference View SEATING PLANE GAUGE PLANE 1.20 MAX 0.025 0.05 A Terminal #1 mark area B Reference land pattern layout (reference IPC7351 TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances; when mounting on a multilayer PCB, thermal vias can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5) C Branding scale and appearance at supplier discretion D Hall elements (E1, E2), corresponding to respective die; not to scale E Active Area Depth 0.36 mm REF NNNNNNNNNN YYWW LLLLLLLLLL 1 C Standard Branding Reference View N = Device part number = Supplier emblem Y = Last two digits of year of manufacture W = Week of manufacture L = Lot number Figure 19: Package LE, 24-Pin TSSOP (Dual Die Version) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 18 A1334 Precision Hall-Effect Angle Sensor IC Revision History Revision Date – October 23, 2014 Description 1 December 16, 2014 2 February 17, 2015 3 June 2, 2015 Updated Selection Guide, revised EC table, Magnetic Target Requirements section, Figure 3, and added new Figure 4 4 July 27, 2015 Updated Figure 3 on page 10 5 April 15, 2016 Corrected LE-24 Package Outline Drawing dimensions and added AEC-Q100 qualification to Features and Benefits 6 December 5, 2016 Initial Release Revised EC table and Selection Guide to support dual die release; added Typical Chracteristics graphs Revised Title and Terminal List Table, added footnotes to EC table Updated product status to “Not for New Design” Copyright ©2010-2016, Allegro MicroSystems, LLC Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro’s product can reasonably be expected to cause bodily harm. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 19