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CM1440-06CS

CM1440-06CS

  • 厂商:

    ALLEGRO(埃戈罗)

  • 封装:

  • 描述:

    CM1440-06CS - 6 Channel EMI Filter Array with ESD Protection - Allegro MicroSystems

  • 数据手册
  • 价格&库存
CM1440-06CS 数据手册
CM1440 6 Channel EMI Filter Array with ESD Protection Features • • • • • • • Six channels of EMI filtering for data ports Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network ±30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) ±30kV ESD protection on each channel (HBM) Greater than 35dB attenuation (typical) at 1 GHz 15-bump, 0.4mm pitch, 2.360mm x 1.053mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance OptiGuard™ coated for improved reliability at assembly Lead-free version available Product Description The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pistyle filter (30pF-100Ω-30pF) which provides greater than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes connected to the filter ports safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package and easy-to-use pin assignments. In particular, the CM1440 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets. The CM1440 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1440 is available in a space saving, low profile Chip Scale Package with optional lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space savings versus competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball. • • Applications • • • • • • LCD and Camera data lines in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs etc. EMI filtering for data ports in cell phones, PDAs or notebook computers. Wireless handsets Handheld PCs/PDAs LCD and camera modules Electrical Schematic 100Ω FILTERn* (Pins A1-A6) FILTERn* (Pins C1-C6) 30pF 30pF GND (Pins B1-B3) 1 of 6 EMI/RFI + ESD Channels © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 * See Package/Pinout Diagram for expanded pin information. 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1440 PACKAGE / PINOUT DIAGRAMS (Bumps Down View) Orientation Marking (see note 2) TOP VIEW BOTTOM VIEW (Bumps Up View) FILTER3 FILTER4 1 A B C 2 3 4 5 6 FILTER1 FILTER2 FILTER5 FILTER6 C1 GND C2 B1 C3 GND C4 B2 C5 GND C6 B3 N406 Orientation Marking FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 A1 A1 A2 A3 A4 A5 A6 Notes: 15 Bump CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. CM1440-06CS/CP PIN DESCRIPTIONS PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 GND FILTER1 FILTER2 FILTER3 FILTER4 FILTER5 FILTER6 DESCRIPTION Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Device Ground Filter Channel 1 Filter Channel 2 Filter Channel 3 Filter Channel 4 Filter Channel 5 Filter Channel 6 Ordering Information PART NUMBERING INFORMATION Standard Finish Pins 15 Package CSP Ordering Part Number1 CM1440-06CS Part Marking N406 Lead-free Finish2 Ordering Part Number1 CM1440-06CP Part Marking N406 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2005 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1440 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 500 UNITS °C mW mW STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING -40 to +85 UNITS °C ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1) SYMBOL R CTOTAL C VDIODE ILEAK VSIG PARAMETER Resistance Total Channel Capacitance Capacitance C1 Standoff Voltage Diode Leakage Current (reverse bias) Signal Clamp Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω, C=30pF At 2.5VDC Reverse Bias, 1MHz, 30mVAC At 2.5VDC Reverse Bias, 1MHz, 30mVAC IDIODE=10μA VDIODE=+3.3V ILOAD = 10mA 5.6 -1.5 ±30 ±30 2.3 0.9 60 CONDITIONS MIN 80 48 24 TYP 100 60 30 6.0 0.1 6.8 -0.8 1 9.0 -0.4 MAX 120 72 36 UNITS Ω pF pF V μA V V kV kV Ω Ω MHz VESD Notes 2 and 3 RDYN fC Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: These parameters are guaranteed by design and characterization. © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1440 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1) © 2005 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1440 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2) © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1440 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3) © 2005 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11/08/05 CM1440 Performance Information (cont’d) Typical Diode Capacitance vs. Input Voltage Capacitance (Normalized) DC Voltage Figure 7. Filter Capacitance vs. Input Voltage (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1440 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance — Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50μm +20μm 60 seconds 240°C 260°C Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration 250 Temperature (°C) 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 9. Eutectic (SnPb) Solder Ball Reflow Profile © 2005 California Micro Devices Corp. All rights reserved. Figure 10. Lead-free (SnAgCu) Solder Ball Reflow Profile Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● ● ● 11/08/05 CM1440 Mechanical Details CSP Mechanical Specifications CM1440 devices are supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. C1 Mechanical Package Diagrams BOTTOM VIEW A1 B1 C B A B2 B4 B3 OptiGuardTM Coating PACKAGE DIMENSIONS Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 1.008 0.395 0.195 Nom 1.053 0.4000 0.2000 Max 1.098 0.405 0.205 Min 0.911 2.3150 2.3600 2.4050 Custom CSP 15 Inches Nom Max 0.0929 0.0947 A2 C2 1 2 3 4 5 6 D1 D2 0.0397 0.0415 0.0432 0.0156 0.0157 0.0159 0.0076 0.0078 0.0080 0.25 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW DIMENSIONS IN MILLIMETERS 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.3415 0.3465 0.3515 0.0134 0.0136 0.0138 0.130 0.130 0.575 0.368 0.1800 0.1800 0.644 0.419 0.230 0.230 0.714 0.470 0.0051 0.0071 0.0091 0.0051 0.0071 0.0091 0.0226 0.0254 0.0281 0.0145 0.0165 0.0185 Package Dimensions for CM1440 Chip Scale Package # per tape and reel 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CM1440 CHIP SIZE (mm) 2.36 X 1.053X 0.644 POCKET SIZE (mm) B0 X A0 X K0 2.62 X 1.12X 0.76 Po Top Cover Tape TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500 P0 4mm P1 4mm 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 User Direction of Feed Center Lines of Cavity Figure 11. Tape and Reel Mechanical Data © 2005 California Micro Devices Corp. All rights reserved. 11/08/05 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9
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