AA028P2-99

25–31 GHz Amplifier AA028P2-99 Features I 15 dB Gain I +16 dBm Output Power I Rugged, Reliable Package I Single Voltage Operation I 100% RF and DC Testing Description The AA028P2-99 is a broadband millimeterwave amplifier in a rugged package. The amplifier is designed for use in millimeterwave communication and sensor systems as a gain stage in the receiver, transmitter, or local oscillator chain. The robust ceramic and metal package provides excellent electrical performance, excellent thermal performance, and a high degree of environmental protection for long-term reliability. A single supply voltage simplifies bias requirements. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. Amplifier is targeted for millimeterwave point-to-point and point-to-multipoint wireless communications systems. Pin Out N/C VD RF In RF Out N/C PIN 1 INDICATOR N/C Electrical Specifications at 25°C (VD = 5.5 V) RF Parameter Bandwidth Small Signal Gain Input Return Loss Output Return Loss Output Power at 1 dB Gain Compression Temperature Coefficient of Gain Symbol BW G RLI RLO P1 dB dG/dT 14 Min. 25 12.5 Typ. 24—32 15 7 11 16 -0.025 Max. 31 Unit GHz dB dB dB dBm dB/C DC Parameter Drain Current Symbol ID Min. Typ. 70 Max. 110 Unit mA Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 2/00A 1 25–31 GHz Amplifier AA028P2-99 Typical Performance Data 20 0 S22 15 -55˚C 10 +25˚C +85˚C 5 Return Loss (dB) Gain (dB) -5 -10 S11 0 20 25 30 35 -15 20 25 30 35 Frequency (GHz) Frequency (GHz) Gain vs. Frequency 20 18 Return Loss vs. Frequency Absolute Maximum Ratings Characteristic Operating Temperature (TC) Storage Temperature (TST) Bias Voltage (VD1) Power In (PIN) Value -55°C to +90°C -65°C to +150°C 7 VDC 13 dBm P1 dB (dBm) 16 14 12 10 25 27 29 31 Frequency (GHz) Output Power vs. Frequency Outline 0.295 (7.49 mm) 0.225 (5.72 mm) 0.022 (0.56 mm) 0.180 (4.57 mm) 0.090 (2.29 mm) 0.011 (0.28 mm) AA028P2-99 YYWW PIN 1 IDENTIFICATION 0.008 (0.20 mm) 0.028 (0.71 mm) 0.057 (1.45 mm) 2 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 2/00A 25–31 GHz Amplifier AA028P2-99 Typical S-Parameters at 25°C (VD = 5.5 V) Frequency (GHz) 16.0 18.0 19.0 20.0 21.0 22.0 23.0 24.0 24.5 25.0 25.5 26.0 26.5 27.0 27.5 28.0 28.5 29.0 29.5 30.0 30.5 31.0 31.5 32.0 32.5 33.0 34.0 36.0 38.0 40.0 S11 Mag. -4.85 -22.12 -6.24 -9.94 -12.26 -10.95 -7.28 -4.80 -4.09 -3.63 -3.34 -3.68 -4.84 -6.43 -8.29 -10.93 -14.13 -18.80 -21.91 -21.44 -21.35 -23.03 -15.72 -8.48 -5.19 -3.37 -1.37 -1.39 -2.82 -4.29 Ang. 152.7 70.9 78.7 -19.7 -100.9 -129.8 -160.3 167.0 148.3 130.1 109.9 89.4 69.8 50.7 34.2 19.1 7.9 16.5 37.3 46.2 23.6 -38.4 -140.9 167.1 127.6 99.0 52.2 -18.7 -77.9 -123.0 Mag. -25.23 -13.67 -5.74 2.66 8.02 9.36 9.96 11.61 12.40 13.50 14.51 15.41 15.46 15.24 14.76 14.15 13.49 13.32 12.75 13.03 13.57 13.60 13.75 12.55 9.33 4.60 -6.55 -25.55 -36.95 -38.71 S21 Ang. -153.3 123.7 120.8 47.9 -27.2 -103.7 -160.3 147.9 119.7 90.6 59.3 25.1 -10.0 -44.0 -76.6 -106.7 -132.6 -160.2 170.7 141.9 106.6 70.9 29.7 -19.9 -73.4 -112.3 -169.7 111.9 34.4 -98.0 Mag. -63.11 -56.09 -51.64 -44.79 -36.34 -33.60 -32.63 -31.12 -31.48 -31.62 -32.27 -31.92 -32.99 -31.91 -32.44 -31.83 -32.00 -32.53 -32.92 -32.84 -32.41 -32.28 -30.59 -32.45 -34.70 -35.29 -35.54 -32.62 -52.23 -47.21 S12 Ang. 164.5 3.3 -45.9 -43.6 -101.1 178.6 122.6 61.7 29.4 3.6 -18.7 -43.2 -65.3 -96.7 -112.7 -149.7 -165.7 162.0 132.5 107.7 75.0 41.7 -3.3 -54.3 -74.9 -100.0 -139.1 106.3 66.3 147.9 Mag. -1.85 -2.09 -1.95 -1.76 -2.80 -4.86 -6.35 -11.42 -17.03 -25.61 -15.07 -10.85 -8.85 -7.86 -8.01 -8.98 -10.81 -12.53 -13.15 -12.56 -12.21 -13.63 -19.81 -9.85 -5.11 -2.79 -1.15 6.24 2.80 -0.80 S22 Ang. -100.5 -135.0 -151.8 -172.1 162.8 147.3 125.1 97.0 91.7 163.6 -168.1 -179.3 167.5 151.6 136.5 123.5 115.6 116.1 123.2 129.1 122.5 114.3 142.5 -177.8 159.1 140.9 101.2 36.6 -49.7 -94.1 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 2/00A 3 25–31 GHz Amplifier AA028P2-99 Co-Planar Millimeterwave Package Handling and Mounting Millimeterwave amplifiers require careful mounting design to maintain optimal performance. Handling The co-planar millimeterwave package is very rugged. However, due to ceramic’s brittle nature one should exercise care when handling with metal tools. Do not apply heavy pressure to the lid. Vacuum tools may be used to pick and place this part. Only personnel trained in both ESD precautions and handling precautions should be allowed to handle these packages. package to minimize the gap between package and printed circuit board. The gap should be no more than 0.005" (0.127 mm). The base of the package should be mounted directly to a surface which provides a good ground plane for the printed circuit board and provides a good thermal ground. The RF connection on the printed circuit board should include a microstrip line and two grounded pads, one on either side of the microstrip line. The RF connection between the package and the printed circuit board should be accomplished with three ribbon bonds, one connecting the RF lines on package and printed circuit board and two connecting the ground pads on the package and printed circuit board. Mounting the Package Package Construction The co-planar millimeterwave package is constructed from metal and ceramic. The base of the package is gold-plated copper-molybdenum-copper. The lid is unplated alumina. The lid seal is epoxy. The package should be attached to its mounting surface using a silver-filled conductive paste epoxy. Care should be taken to ensure that there are no voids or gaps in the epoxy underfill so that a good ground contact is maintained. Mounting Design The co-planar millimeterwave package is mounted by placing it in a hole cut in a printed circuit board. The RF interface on the package should be in the same plane as the surface of the printed circuit board. The hole should be cut as close as possible to the outer dimensions of the Connecting the Package Thermosonic ribbon attachment with 0.00025" x 0.005" (0.0064 mm x 0.127 mm) gold ribbon is used to make the connections from the RF and DC package interfaces to the printed circuit board. Lengths of ribbons should be minimized. Printed Circuit Board Rogers 4003 0.008" (0.20 mm) Thick Ribbon Bonds RF Out Minimize RF Gap Widths RF In Electrically & Thermally Conductive Ground Plane DC Lines Grounded Pad on Printed Circuit Board Co-Planar Millimeterwave Package Mounting 4 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 2/00A